JP5798835B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and electronic component mounting method for taking out an electronic component from a feeder and mounting the electronic component on a substrate such as a printed circuit board, and in particular, mounting an electronic component having a dual line for flowing the substrate to two production lines. The present invention relates to an apparatus and an electronic component mounting method.

The electronic component mounting apparatus, for example, picks up an electronic component from a feeder and mounts it on a substrate such as a printed circuit board with a mounting head having a plurality of pickup nozzles such as suction nozzles (in the following description, using suction nozzles). Device.
Electronic devices (electronic devices) have become multifunctional, and the number of electronic components that are mounted on a substrate and incorporated in the electronic device has also increased. Accordingly, the number and type of components that can be mounted on the substrate in a certain time greatly affects the cost of the electronic device and is an index of the performance of the electronic component mounting device.

  Therefore, attempts have been made to improve the operating rate. For example, there is a dual line apparatus that can flow a substrate to two production lines in one electronic component mounting apparatus. In the dual-line apparatus shown in Patent Document 1, two modes are provided: an independent mode in which two mounting heads are mounted (mounted) only on a board in charge of each, and an alternating mode in which two mounting heads are alternately mounted with two mounting heads. It is disclosed that there is.

  In Non-Patent Document 1, although it is a single production line, two mounting heads can be sucked freely from component suction areas (component supply areas) provided on both sides of the apparatus, An overdrive motion technique is disclosed in which mounting heads can be mounted simultaneously on the same substrate. This can also be said for an apparatus having only the independent mode described above. In particular, in a system having various modes disclosed in the above prior art, when one production line is in operation in a dual line apparatus, the other production line does not. The line width cannot be changed. When changing the line width of the other production line, the other production line is also stopped and the apparatus is changed to the setup mode.

JP 2009-239257 A

Hitachi review VoL93 No.02 pages 188-192 (February 2011)

  However, as electronic devices (electronic devices) are becoming more multifunctional, the number of production models has been changing, and even with dual line devices, the operation rate in the independent production mode where two production lines can independently produce models is increased. Improvement is desired. One condition for realizing the independent production mode is that during the production operation of one production line, the other production line must be able to change the line width according to the board width, for example, the width of the conveyor that conveys the board. is there.

As a typical typical independent production (mode), there is a completely independent production (mode) in which a dual line apparatus is operated as if it were constituted by two single production lines. Further, there is quasi-independent production (mode) in which the line width can be changed even in the alternating mode shown in Patent Document 1 and the overdrive motion mode shown in Non-Patent Document 1. In addition, it is desirable that the production in the completely independent production mode is performed by a single device. However, in order to improve the operation rate of the dual line device, it is desired that the production can be performed safely and reliably.

  Accordingly, an object of the present invention is to change the line width of the other production line even if one production line is in production operation in an electronic component mounting apparatus that is a dual line device in two production lines. It is to provide an electronic component mounting apparatus and an electronic component mounting method having a high operating rate.

  Note that the model indicates a process given to the substrate and the substrate. Even if the substrate size is the same, the model is different if the mounting pattern is different.

The present invention is characterized in hereinafter in order to achieve the above object.
The present invention provides a first production line and a second production line provided at a central portion, and two mounting heads provided opposite to each other to convey a substrate to the first production line and the first production line. from the feeder provided in the component supply area at each occurrence outside the two production lines removed electronic component, Oite the electronic component mounting how to mount the electronic component on the substrate, said first production line The second production line is provided with four chutes, and the first production line is a non-moving fixed chute provided on one end side of the four chutes and a movable first movable chute adjacent to the fixed chute. The second production line is composed of two other movable second movable chutes and a third movable chute, and the first production line and the second production line are different. Model Line width setup for changing the line width for conveying the board of the other production line while one of the first production line and the second production line is in production operation. A line width setup step, wherein the line width setup step changes the line width of the first production line with the position of the fixed chute as a first reference position, When the predetermined width of the second movable chute adjacent to the first movable chute is changed as the second reference position and the line width is changed in the first production line, the line width is changed to the first production line. the movable chute is returned to a defined home position to the stationary chute side, then moving said first movable chute to a predetermined said line width, and feature that.
Further, the present invention provides a substrate having a first production line and a second production line provided in the central portion, and two mounting heads provided opposite to each other, and the first production line and In the electronic component mounting method of taking out an electronic component from a feeder provided in a component supply area existing outside the second production line and mounting the electronic component on the substrate, the first production line and the The second production line includes four chutes, and the first production line includes a stationary chutes provided on one end side of the four chutes and a movable first movable chutes adjacent to the stationary chutes. The second production line is composed of the other two movable second movable chutes and third movable chutes, and the first production line and the second production line are different. A line width for transferring a substrate of a seed and changing a line width for transferring the substrate of the other production line while one of the first production line and the second production line is in production operation. A line width setup step for setting up, wherein the line width setup step changes the line width of the first production line with the position of the fixed chute as a first reference position, and the second production When the line width of the line is changed with a predetermined position of the second movable chute adjacent to the first movable chute as a second reference position, and the change of the line width is performed in the second production line, The second movable chute and the third movable chute are returned to the origin position defined on the other end side of the four chutes, and then the second movable chute is moved to the second reference position, and the third movable chute is moved to the third reference position. The dynamic chute is moved to a predetermined said line width, and wherein the.
Further, the present invention provides a substrate having a first production line and a second production line provided in the central portion, and two mounting heads provided opposite to each other, and the first production line and In the electronic component mounting method of taking out an electronic component from a feeder provided in a component supply area existing outside the second production line and mounting the electronic component on the substrate, the first production line and the The second production line includes four chutes, and the first production line includes a stationary chutes provided on one end side of the four chutes and a movable first movable chutes adjacent to the stationary chutes. The second production line is composed of the other two movable second movable chutes and third movable chutes, and the first production line and the second production line are different. A line width for transferring a substrate of a seed and changing a line width for transferring the substrate of the other production line while one of the first production line and the second production line is in production operation. A line width setup step for setting up, wherein the line width setup step changes the line width of the first production line with the position of the fixed chute as a first reference position, and the second production When the line width of the line is changed using the predetermined position of the third movable chute provided at the other end of the four chutes as a reference position, and the line width is changed in the first production line Returning the first movable chute to the origin position defined on the fixed chute side, and then moving the first movable chute to a predetermined line width. That.
Further, the present invention provides a substrate having a first production line and a second production line provided in the central portion, and two mounting heads provided opposite to each other, and the first production line and In the electronic component mounting method of taking out an electronic component from a feeder provided in a component supply area existing outside the second production line and mounting the electronic component on the substrate, the first production line and the The second production line includes four chutes, and the first production line includes a stationary chutes provided on one end side of the four chutes and a movable first movable chutes adjacent to the stationary chutes. The second production line is composed of the other two movable second movable chutes and third movable chutes, and the first production line and the second production line are different. A line width for transferring a substrate of a seed and changing a line width for transferring the substrate of the other production line while one of the first production line and the second production line is in production operation. A line width setup step for setting up, wherein the line width setup step changes the line width of the first production line with the position of the fixed chute as a first reference position, and the second production When the line width of the line is changed using the predetermined position of the third movable chute provided on the other end side of the four chutes as a reference position, and the line width is changed on the second production line The second movable chute is returned to the origin position defined on the other end side, and then the second movable chute is moved so as to have a predetermined line width.

The present invention also to have a line width setup possibility determining whether it is possible to change the line width and feature.

The present invention, in the line width setup whether step, except when unable implementing the line width setup by a factor other than the line width setup, the mounting head is the other production line side of said one production line The line width is also increased when the electronic component is taken out from the feeder provided in the component supply area existing in the device, or when mounted on the substrate of the one production line by the mounting head of the other production line. that determined to be the line width setup to change the feature.

Further, the present invention provides a dual mode in which the substrate is transported to the first production line and the second production line, and the electronic component is mounted on each of the substrates, the first production line, It has a single mode for transferring the substrate to one of the second production lines, and the line width setup availability determination step determines that the line width setup for changing the line width is not possible in the single mode. the feature to be.
In addition, the present invention is provided in the center, and is provided outside the first production line and the second production line that convey the respective substrates, and the first production line and the second production line. A component supply area including a feeder for supplying electronic components, two mounting heads that are provided opposite to each other, take out the electronic components from the feeder, and mount the electronic components on the substrate, and control these In the electronic component mounting apparatus having the control device, the first production line and the second production line include four chutes, and the first production line is provided on one end side of the four chutes. The fixed production chute is composed of a stationary chute that does not move and a movable first movable chute adjacent to the fixed chute, and the second production line has two other movable second movable chutes and a third movable chute. The first production line and the second production line convey different types of substrates, and one of the first production line and the second production line is used as the first production line. During production operation, it has a line width setup means for changing the line width for transferring the substrate of the other production line, and the line width setup means has the line width of the first production line. The position of the fixed chute is changed as a first reference position, and the line width of the second production line is changed to a predetermined position of the second movable chute adjacent to the first movable chute as a second reference position. And when changing the line width in the first production line, the first movable chute is returned to the origin position defined on the fixed chute side, and then the first Moving so the movable chute to a predetermined said line width, and wherein the.
In addition, the present invention is provided in the center, and is provided outside the first production line and the second production line that convey the respective substrates, and the first production line and the second production line. A component supply area including a feeder for supplying electronic components, two mounting heads that are provided opposite to each other, take out the electronic components from the feeder, and mount the electronic components on the substrate, and control these In the electronic component mounting apparatus having the control device, the first production line and the second production line include four chutes, and the first production line is provided on one end side of the four chutes. The fixed production chute is composed of a stationary chute that does not move and a movable first movable chute adjacent to the fixed chute, and the second production line has two other movable second movable chutes and a third movable chute. The first production line and the second production line convey different types of substrates, and one of the first production line and the second production line is used as the first production line. During production operation, it has a line width setup means for changing the line width for transferring the substrate of the other production line, and the line width setup means has the line width of the first production line. The position of the fixed chute is changed as a first reference position, and the line width of the second production line is changed to a predetermined position of the second movable chute adjacent to the first movable chute as a second reference position. And when the change in the line width is performed in the second production line, the second movable chute and the third movable chute are defined at the other end of the four chutes. Are restored to location, then the the second said movable chute second reference position, moving the third movable chute to a predetermined said line width, and wherein the.
In addition, the present invention is provided in the center, and is provided outside the first production line and the second production line that convey the respective substrates, and the first production line and the second production line. A component supply area including a feeder for supplying electronic components, two mounting heads that are provided opposite to each other, take out the electronic components from the feeder, and mount the electronic components on the substrate, and control these In the electronic component mounting apparatus having the control device, the first production line and the second production line include four chutes, and the first production line is provided on one end side of the four chutes. The fixed production chute is composed of a stationary chute that does not move and a movable first movable chute adjacent to the fixed chute, and the second production line has two other movable second movable chutes and a third movable chute. The first production line and the second production line convey different types of substrates, and one of the first production line and the second production line is used as the first production line. During production operation, it has a line width setup means for changing the line width for transferring the substrate of the other production line, and the line width setup means has the line width of the first production line. , The position of the fixed chute is changed as a first reference position, and the line width of the second production line is changed to a predetermined position of the third movable chute provided on the other end side of the four chutes. And changing the line width in the first production line, the first movable chute is returned to the origin position defined on the fixed chute side, and then Moving the serial first movable chute to a predetermined said line width, the electronic component mounting apparatus characterized by.
In addition, the present invention is provided in the center, and is provided outside the first production line and the second production line that convey the respective substrates, and the first production line and the second production line. A component supply area including a feeder for supplying electronic components, two mounting heads that are provided opposite to each other, take out the electronic components from the feeder, and mount the electronic components on the substrate, and control these In the electronic component mounting apparatus having the control device, the first production line and the second production line include four chutes, and the first production line is provided on one end side of the four chutes. The fixed production chute is composed of a stationary chute that does not move and a movable first movable chute adjacent to the fixed chute, and the second production line has two other movable second movable chutes and a third movable chute. The first production line and the second production line convey different types of substrates, and one of the first production line and the second production line is used as the first production line. During production operation, it has a line width setup means for changing the line width for transferring the substrate of the other production line, and the line width setup means has the line width of the first production line. , The position of the fixed chute is changed as a first reference position, and the line width of the second production line is changed to a predetermined position of the third movable chute provided on the other end side of the four chutes. When the line width is changed in the second production line, the second movable chute is returned to the origin position defined on the other end side, and then the second movable Moving the chute to a predetermined said line width, and wherein the.
In the electronic component mounting apparatus according to the present invention, the electronic component mounting apparatus further includes a line width setup availability determination unit that determines whether the line width can be changed.

  According to the present invention, in an electronic component mounting apparatus that is a dual line device included in two production lines, even if one production line is in operation, the operation rate that can change the line width of the other production line A high electronic component mounting apparatus and electronic component mounting method can be provided.

It is a top view of the electronic component mounting apparatus which is embodiment of this invention. It is the figure which showed typically the structure of the four chute | shoots 5 shown in FIG. It is a figure for demonstrating independent production (mode). It is a figure which shows the line width setup possibility judgment flow which judges whether line width setup is possible in this embodiment. It is a figure which shows the operation | movement flow of the 1st Example of the line width setup which changes the line width of one production line of the dual line in the independent production mode of this embodiment. It is a figure which shows the operation | movement flow of the 1st Example of the line width setup which changes the line width of the other production line of the dual line in the independent production mode of this embodiment. It is a figure which shows the operation | movement flow of the 2nd Example of the line width setup which changes the line width of one production line of the dual line in the independent production mode of this embodiment. It is a figure which shows the operation | movement flow of the 2nd Example of the line width setup which changes the line width of the other production line of the dual line in the independent production mode of this embodiment.

  Hereinafter, an embodiment of an electronic component mounting apparatus will be described based on the drawings. FIG. 1 is a plan view of the electronic component mounting apparatus 1. The electronic component mounting apparatus 1 is divided into a total of 4 blocks (reference numerals are basically only LU blocks): 2 blocks LU and LD on the upper left and lower sides of the drawing, and 2 blocks RU and RD on the right side of the drawing. Each block is provided with a number of feeders for supplying electronic components, a mounting head 6, a mounting head 6, and a mounting head are fixed, and a mounting head body 11 that moves on a rail 8 for left and right movement constituted by a linear motor. In addition, in order to correct the position of the suction nozzle of each mounting head 6 during mounting on the substrate, a component recognition camera 19 that images the suction holding state of the component of the suction nozzle is provided. The left and right blocks are provided with vertical movement rails 9 formed of linear motors common to the upper and lower blocks on which the mounting head body 11 moves up and down. In the center, there are four chutes 5 for transporting the substrate P, the upper two chutes 5c and 5d are for the upper block production line U, and the lower two chutes 5a and 5b are for the lower block. The production line D is configured. The substrate P is distributed by the delivery unit 7 and carried into the production line U or D. In addition, the electronic component mounting apparatus 1 includes a control device 10 that controls the entire operation such as suction and mounting by the mounting head 6 and movement of the mounting head body 11. The control device 10 in the present embodiment includes a control program that realizes the overdrive motion described in Non-Patent Document 1.

  FIG. 2 is a diagram schematically showing the configuration of the four chutes 5 shown in FIG. 2A is a top view, FIG. 2B is a side view of each chute, and FIG. 2C is an arrow for a substrate positioning portion 5p described later between the movable chutes 5c and 5d in FIG. 2A. It is a simplified view when viewed from the direction of A.

  Each chute 5 includes a substrate supply unit 5s (hereinafter, subscript s indicates the substrate supply unit) into which the substrate P is carried, a substrate positioning unit 5p (hereinafter, the subscript p indicates the substrate positioning unit), and a substrate carry-out. Part 5e (hereinafter, the suffix "e" indicates a part related to the substrate carry-out part). Each part moves each conveyor belt 5vs (hereinafter, suffix “v” indicates a conveyor belt), 5vp, 5ve by 5ms (hereinafter, suffix m indicates a motor), 5mp, 5me attached to each chute. The substrate P is transported from the upstream carry-in port to the downstream carry-out port.

  The board positioning unit 5p includes a board backup unit 20 that supports the board when components are mounted on the board P. The substrate backup unit 20 includes a backup base 21, a backup pin 22, a base lifting mechanism 23, a Z clamp 24, and a Z clamp buffer unit 25. When the electronic component 30 is mounted by the mounting head 6, the backup base 22 is raised by the base lifting mechanism 23 including a motor and a ball screw spline (not shown). Further, the base elevating mechanism 23 operates to raise the Z clamp 24, and the Z clamp 24 pushes up the substrate P. The substrate P is separated from the transport belt 5vp, and is fixed to the chutes 5c and 5d while relaxing the impact on the substrate P by the Z clamp buffer 24. At this time, there is a slight gap between the board P and the backup pin 22, which prevents the board from being bent when components are mounted. The substrate P is supported by the backup pins 21. Instead of the backup pin 21, a block may be installed on the backup base 22 to support the substrate. Two sets of substrate backup units 20 are provided so that each production line can process a maximum of two at a time.

  Next, the configuration of the four chutes in the board positioning portion 5p in the present embodiment and the relationship between the configuration of the four chutes and the component supply area 3 will be described with reference to FIG. In this embodiment, a fixed chute that does not move the chute closest to the component supply area 3D or 3U among the four chutes 5 is moved so that the width of the two production lines can be changed, and the other three chutes are It consists of a moving chute that moves. In this example, the chute 5a close to the component supply area 3D is a fixed chute, and the other three chutes 5b, 5c, and 5d are movable chutes that move on the moving rail 26 shown in FIG. The configuration other than moving / not moving is the same for the four chutes.

  Next, independent production (mode) in the present embodiment will be described with reference to FIG. As described with reference to FIGS. 1 and 2, the electronic component mounting apparatus 1 includes two mounting heads 6U and 6D facing each other, and two component supply areas 3U and 3D provided at positions facing each other. , Two production lines U and D flowing in the center.

The independent production mode includes a completely independent production mode and a quasi-fully independent production mode.
Completely independent production means that different types of substrates PU and PD are transported to two production lines U and D, the mounting head 6U picks up electronic components from the component supply area 3U and mounts them on the substrate PU , and the mounting head 6D An operation mode in which an electronic component is sucked from the component supply area 3D and mounted on the substrate PD for production. That is, it means that two production lines are produced completely independently, as if two devices are produced in parallel. This production mode is called a completely independent production mode.

  On the other hand, the quasi-independent production refers to an operation state in which production is performed using the mounting head or feeder of the other production line when production is performed on one production line. This production mode is called quasi-independent production mode. Since the two mounting heads 6U and 6D can move without interference with the movement of the four chutes, a quasi-independent production mode can be realized structurally. An example of this quasi-independent production will be described by taking as an example the case where the production operation of the production line D is continued and the line width of the production line U is changed.

The first example is a case where the mounting head 6U on the side where the line width is changed is involved in the production of the production line D that continues production. This is because the mounting heads 6U and 6D shown in Patent Document 1 are alternately struck (mode), or the mounting heads 6U and 6D shown in Non-Patent Document 1 are mounted simultaneously on the same substrate (mode) so that the substrate PD is placed. Produce.
In the second example, the component supply areas 3U and 3D shown in Non-Patent Document 1 are made into common component supply areas, and the electronic components in the component supply area 3U on the side where the mounting head 6D changes the line width are also sucked, and the substrate PD To produce.

  In the case of quasi-independent production, when the setup other than the line width is required, the production line D may not be continuously operated. In that case, in the first example, the alternate driving or simultaneous loading is temporarily interrupted. On the other hand, in the second example, in the case of a feeder that supplies an electronic component with a supply tape or the like, the feeder is searched for in the component supply area 3D and the operation is continued.

  FIG. 4 is based on the above-described concept, and when the operator instructs the line width setup to change the conveyor width on the other production line while producing on one production line, the line width setup is A flow for determining whether or not line width can be set up is determined.

  The dual line apparatus includes a dual mode in which substrates are supplied to two production lines and a single mode in which a single large-sized substrate is supplied to one production line. Therefore, first, it is determined whether the mode is the dual mode or the single mode (Step 1). Next, in the case of the dual mode, it is determined whether the mode is the completely independent production mode or the semi-fully independent mode (Step 2). If it is the completely independent production mode, the line width setup of the target production line is performed by the method described later (Step 3). If no other setup is performed, production of the production line is started (Step 4).

  If it is determined that the quasi-completely independent mode is determined in Step 2, as described above, for example, it is necessary to replace the mounting head or set up the backup pin, and determine whether the production can be continued on the continuous production line to be continued. (Step 5). If it can be continued, go to Step 3 to perform line width setup. If the process cannot be continued, in this flow, the production is continued on the continuous production line without performing the line width setup (Step 6).

  Next, if it is determined in Step 1 that the single mode is selected, it is determined whether or not the mode is shifted to the dual mode independent production mode (Step 7). In order to shift to the independent production mode, the single mode production is terminated, the line width setup is performed by the conventional method of performing the line width setup of both production lines (Step 8), the process goes to Step 4, and the production is started. If not shifted, the single mode production is continued (Step 9).

  In the flow for determining whether or not the conveyor width can be set up as described above, if the dual line apparatus is only in the dual mode, the determination in Step 1 is not necessary. Furthermore, if the dual line apparatus has only a completely independent production mode, the determination of Step 2 is also unnecessary, and the line width setup of the other production line can be performed while continuing the production of one production line of Step 3. .

  5 and 6 are diagrams showing an operation flow of the first example of the line width setup for changing the line width of the dual line in the independent production mode of the present embodiment, taking the case of starting the dual line device as an example. . In this embodiment, the line width is changed by changing the conveyor width. 5 and 6, the conveyor width at the time of production is defined with reference to the position of the fixed chute 5a of the production line D and the predetermined position of the movable chute 5c of the production line U as reference positions. The start time is the time when the chute is moved for the first time after the power to the apparatus is turned on.

  FIG. 5 shows an example in which the conveyor width of the production line U is changed from W1 to W2 while the production of the production line D is continued with the conveyor width W1 from the dual production line having the same conveyor width W1 (substrate width). FIG. 6 shows an example in which the conveyor width of the production line D is changed from W1 to W3 while the production of the production line U is continued.

In FIG. 5, S1 shows a state in which production of the board (model) of the production line U among the production lines U and D is finished, the operator is instructed to change the model in the production line U, and the line width setup is started. When the model changes Ru is instructed, is the possibility determination to the independent production shown in FIG. As a result, when it is determined that it is possible, the control device 10 performs the line width setup shown in S2 to S4.

  First, in S2 and S3, at the time of start-up, the current position of the chute is not known, and in order to reliably prevent the chute from interfering with other chute, the movable chute 5c, 5d constituting the production line U is set to the respective origin Move to position. Hereinafter, moving the origin position is referred to as origin return. The origin positions of the movable chutes 5c and 5d are at the component supply area 3 side end existing in the same block in the respective movable ranges. Next, in S4, the movable chute 5c is moved to the reference position while the width between the movable chutes 5c and 5d is moved to W2, and the production line U is positioned.

On the other hand, in FIG. 6 as well as in FIG. 5, it is determined whether or not it is in the independent production mode, and the line width setup is performed. During the movement of the chute, it may be displayed on the monitor of the device that “the production line D is in operation and the production line U is in the process of being set up”, and the operator can check the status of each production line.
First, in S2, the current position of the chute is not known at the time of starting, and the movable chute 5b constituting the production line D is moved to the origin position on the fixed chute 5a side in order to surely avoid the chute from interfering with other chute. Return to origin. The fixed chute 5a is always at the origin position. Next, in S3, the movable chute 5b is moved from the fixed chute 5a which is the reference position so that the conveyor width becomes W3.

  In addition, although the conveyor width in both the production lines in FIG. 5, FIG. 6 was made the same as W1, it may differ.

  Further, in the above embodiment, if W1 is the same as the maximum width that can be set in the production line, the movable chute 5d is already at the origin position, so the origin return operation shown in S2 is unnecessary. Similarly, if the conveyor width W2 at the start of production is the same as the maximum width that can be set in the production line, it is not necessary to move the movable chute 5d in S4.

  According to the first embodiment described above, an electronic component mounting apparatus and an electronic component mounting method with a high operating rate that can change the lane width of the other production line even when one production line is in production operation. Is to provide.

  7 and 8 are diagrams showing an operation flow of the second example of the line width setup for changing the line width in the independent production of this embodiment, taking the case of starting the dual line device as an example. Also in this embodiment, the line width is changed by changing the conveyor width. In the first embodiment, the reference position of the production line U is the predetermined position of the movable chute 5c, but in the second embodiment, the reference position of the production line U is the origin position of the movable chute 5d. In this case, the reference position may slightly deviate from the origin position depending on the position of the backup pin 22 shown in FIG. 2C, but the amount of deviation is not so large.

  In the second embodiment, as shown in FIG. 8, when the conveyor width of the production line D is changed while the production of the production line U is continued, it is the same as the first embodiment shown in FIG. On the other hand, as shown in FIG. 7, when the conveyor width of the production line U is changed while the production of the production line D is continued, it is different from the first embodiment shown in FIG.

In the second embodiment shown in FIG. 7, it is not necessary to return the origin of the movable chute 5d in many cases. Accordingly, only the movable chute 5c is returned to the origin in S2, and only the movable chute 5c is moved in S3 to change the conveyor width. In the first embodiment, it is not necessary to return the origin of the movable chute 5d, and W1 can be set on the production line when the movable chute 5d is not required to move to the conveyor width W6 at the start of production in S3. Only when it is equal to the maximum width.
7 and 8, W4, W5 and W7 indicate the conveyor width of the production line U or D before or after the line width setup.

  Also in the second embodiment described above, there is provided an electronic component mounting apparatus and an electronic component mounting method with a high operating rate that can change the lane width of the other production line even when one production line is in production operation. Is to provide.

  According to the second embodiment described above, in changing the conveyor width of the production line U, only the movable chute 5c can be returned to the origin, and the new conveyor width can be changed by moving only the movable chute 5c. Become.

  In the first and second embodiments described above, the dual line apparatus is activated as an example. When the apparatus is not activated, the origin is not returned. For example, in the example of FIG. 5, only the chute 5d is moved outward from S1 to the state of S4, and in the example of FIG. 6, the chute 5b is performed without performing S1 to S2. May be moved to the outside in the state of S3.

Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

1: Electronic component mounting device 3: Component supply area 5: Chute 5a: Fixed chute 5b, 5c, 5d: Movable chute 6: Mounting head 10: Control device 11: Mounting head body 19: Component recognition camera 26: Movement of movable chute Rail LU, LD, RU, RD: Block name P: Substrate U, D: Production line W1 to W7: Substrate width

Claims (12)

The first production line and the second production line are transported to the first production line and the second production line provided in the central portion, and the two production heads provided opposite to each other. In an electronic component mounting method for taking out an electronic component from a feeder provided in a component supply area that exists on the outside of each and mounting the electronic component on the substrate,
The first production line and the second production line have four chutes, and the first production line is adjacent to the fixed chutes and the fixed chutes provided on one end side of the four chutes. The second production line is composed of two other movable second movable chutes and a third movable chute, and the first production line and the first movable chutes are movable. The two production lines convey different types of substrates, and one of the first production line and the second production line conveys the substrate of the other production line during production operation. have a line width set-up step to the line width setup to change the line width,
In the line width setup step, the line width of the first production line is changed using the position of the fixed chute as a first reference position, and the line width of the second production line is changed to the first movable line. Changing the predetermined position of the second movable chute adjacent to the chute as the second reference position;
When the line width is changed in the first production line, the first movable chute is returned to the origin position defined on the fixed chute side, and then the first movable chute is moved to the predetermined line width. An electronic component mounting method, wherein the electronic component is moved so that The first production line and the second production line are transported to the first production line and the second production line provided in the central portion, and the two production heads provided opposite to each other. In an electronic component mounting method for taking out an electronic component from a feeder provided in a component supply area that exists on the outside of each and mounting the electronic component on the substrate,
The first production line and the second production line have four chutes, and the first production line is adjacent to the fixed chutes and the fixed chutes provided on one end side of the four chutes. The second production line is composed of two other movable second movable chutes and a third movable chute, and the first production line and the first movable chutes are movable. The two production lines convey different types of substrates, and one of the first production line and the second production line conveys the substrate of the other production line during production operation. A line width setup step for line width setup to change the line width;
In the line width setup step, the line width of the first production line is changed using the position of the fixed chute as a first reference position, and the line width of the second production line is changed to the first movable line. Changing the predetermined position of the second movable chute adjacent to the chute as the second reference position;
When changing the line width in the second production line, the second movable chute and the third movable chute are returned to the origin position defined on the other end side of the four chutes, and then The electronic component mounting method, wherein the second movable chute is moved to the second reference position so that the third movable chute has a predetermined line width. The first production line and the second production line are transported to the first production line and the second production line provided in the central portion, and the two production heads provided opposite to each other. In an electronic component mounting method for taking out an electronic component from a feeder provided in a component supply area that exists on the outside of each and mounting the electronic component on the substrate,
The first production line and the second production line have four chutes, and the first production line is adjacent to the fixed chutes and the fixed chutes provided on one end side of the four chutes. The second production line is composed of two other movable second movable chutes and a third movable chute, and the first production line and the first movable chutes are movable. The two production lines convey different types of substrates, and one of the first production line and the second production line conveys the substrate of the other production line during production operation. A line width setup step for line width setup to change the line width;
In the line width setup step, the line width of the first production line is changed with the position of the fixed chute as a first reference position, and the line width of the second production line is the largest of the four lines. A predetermined position of the third movable chute provided on the other end of the chute is changed as a reference position,
When the line width is changed in the first production line, the first movable chute is returned to the origin position defined on the fixed chute side, and then the first movable chute is moved to the predetermined line width. An electronic component mounting method, wherein the electronic component is moved so that The first production line and the second production line are transported to the first production line and the second production line provided in the central portion, and the two production heads provided opposite to each other. In an electronic component mounting method for taking out an electronic component from a feeder provided in a component supply area that exists on the outside of each and mounting the electronic component on the substrate,
The first production line and the second production line have four chutes, and the first production line is adjacent to the fixed chutes and the fixed chutes provided on one end side of the four chutes. The second production line is composed of two other movable second movable chutes and a third movable chute, and the first production line and the first movable chutes are movable. The two production lines convey different types of substrates, and one of the first production line and the second production line conveys the substrate of the other production line during production operation. A line width setup step for line width setup to change the line width;
In the line width setup step, the line width of the first production line is changed with the position of the fixed chute as a first reference position, and the line width of the second production line is the largest of the four lines. A predetermined position of the third movable chute provided on the other end of the chute is changed as a reference position,
When the line width is changed in the second production line, the second movable chute is returned to the origin position defined on the other end side, and then the second movable chute is set to the predetermined line width. An electronic component mounting method, characterized in that the electronic component is moved as follows. Electronic component mounting method according to any one of claims 1 to 4, characterized in that it has a line width setup possibility determining whether it is possible to change the line width. In the line width setup availability step, the component supply in which the mounting head of the one production line exists on the other production line side except when the line width setup cannot be performed due to factors other than the line width setup. The line width setup for changing the line width when taking out the electronic component from the feeder provided in an area, or when mounting the electronic component on the substrate of the one production line with the mounting head of the other production line The electronic component mounting method according to claim 5 , wherein the electronic component mounting method is determined to be possible. A dual mode in which the substrate is transported to the first production line and the second production line and the electronic component is mounted on each of the substrates; and the first production line and the second production line A single mode for transferring the substrate to one of the production lines, and the line width setup enable / disable step determines that the line width setup for changing the line width is not possible in the single mode; The electronic component mounting method according to claim 5 . Provided in the central portion and provided outside the first production line and the second production line that convey the respective substrates, and the first production line and the second production line, and supplies electronic components An electronic device having a component supply area including a feeder, two mounting heads that are provided opposite to each other, take out the electronic component from the feeder, and mount the electronic component on the substrate, and a control device that controls these mounting heads. In component mounting equipment,
With the first production line and said second production line four chutes, the first production line adjacent to the fixed chute and the stationary chute do not move provided on one end of the four chute The second production line is composed of two other movable second movable chutes and a third movable chute, and the first production line and the first movable chutes are movable. The second production line transports different types of substrates, and transports the substrates of the other production line while one of the first production line and the second production line is in production operation. have a line width set-up means that the line width setup to change the line width,
The line width setup means changes the line width of the first production line with the position of the fixed chute as a first reference position, and changes the line width of the second production line to the first movable line. When the predetermined position of the second movable chute adjacent to the chute is changed as the second reference position and the line width is changed on the first production line, the first movable chute is moved to the fixed chute side. An electronic component mounting apparatus, wherein the electronic component mounting apparatus is configured to return to a specified origin position and then move the first movable chute to a predetermined line width . Provided in the central portion and provided outside the first production line and the second production line that convey the respective substrates, and the first production line and the second production line, and supplies electronic components An electronic device having a component supply area including a feeder, two mounting heads that are provided opposite to each other, take out the electronic component from the feeder, and mount the electronic component on the substrate, and a control device that controls these mounting heads. In component mounting equipment,
The first production line and the second production line have four chutes, and the first production line is adjacent to the fixed chutes and the fixed chutes provided on one end side of the four chutes. The second production line is composed of two other movable second movable chutes and a third movable chute, and the first production line and the first movable chutes are movable. The second production line transports different types of substrates, and transports the substrates of the other production line while one of the first production line and the second production line is in production operation. It has line width setup means for line width setup to change the line width,
The line width setup means changes the line width of the first production line with the position of the fixed chute as a first reference position, and changes the line width of the second production line to the first movable line. When changing the predetermined position of the second movable chute adjacent to the chute as the second reference position and changing the line width in the second production line, the second movable chute and the third movable chute To the origin position defined on the other end side of the four chutes, and then the second movable chute is set to the second reference position and the third movable chute is set to the predetermined line width. An electronic component mounting apparatus, wherein the electronic component mounting apparatus is moved . Provided in the central portion and provided outside the first production line and the second production line that convey the respective substrates, and the first production line and the second production line, and supplies electronic components An electronic device having a component supply area including a feeder, two mounting heads that are provided opposite to each other, take out the electronic component from the feeder, and mount the electronic component on the substrate, and a control device that controls these mounting heads. In component mounting equipment,
The first production line and the second production line have four chutes, and the first production line is adjacent to the fixed chutes and the fixed chutes provided on one end side of the four chutes. The second production line is composed of two other movable second movable chutes and a third movable chute, and the first production line and the first movable chutes are movable. The second production line transports different types of substrates, and transports the substrates of the other production line while one of the first production line and the second production line is in production operation. It has line width setup means for line width setup to change the line width,
The line width setup means changes the line width of the first production line with the position of the fixed chute as a first reference position, and sets the line width of the second production line to the maximum of four. When the predetermined position of the third movable chute provided on the other end side of the chute is changed as a reference position and the line width is changed in the first production line, the first movable chute is fixed. An electronic component mounting apparatus, wherein the electronic component mounting device is configured to return to an origin position defined on a chute side and then move the first movable chute so as to have a predetermined line width. Provided in the central portion and provided outside the first production line and the second production line that convey the respective substrates, and the first production line and the second production line, and supplies electronic components An electronic device having a component supply area including a feeder, two mounting heads that are provided opposite to each other, take out the electronic component from the feeder, and mount the electronic component on the substrate, and a control device that controls these mounting heads. In component mounting equipment,
The first production line and the second production line have four chutes, and the first production line is adjacent to the fixed chutes and the fixed chutes provided on one end side of the four chutes. The second production line is composed of two other movable second movable chutes and a third movable chute, and the first production line and the first movable chutes are movable. The second production line transports different types of substrates, and transports the substrates of the other production line while one of the first production line and the second production line is in production operation. It has line width setup means for line width setup to change the line width,
The line width setup means changes the line width of the first production line with the position of the fixed chute as a first reference position, and sets the line width of the second production line to the maximum of four. When the predetermined position of the third movable chute provided on the other end side of the chute is changed as a reference position, and when the line width is changed in the second production line, the second movable chute is changed to the other end. An electronic component mounting apparatus, wherein the second movable chute is moved so as to have a predetermined line width. The electronic component mounting apparatus according to claim 8, further comprising a line width setup permission / rejection unit that determines whether the line width can be changed.

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