JP5777979B2 - Solder alloy - Google Patents
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- JP5777979B2 JP5777979B2 JP2011187975A JP2011187975A JP5777979B2 JP 5777979 B2 JP5777979 B2 JP 5777979B2 JP 2011187975 A JP2011187975 A JP 2011187975A JP 2011187975 A JP2011187975 A JP 2011187975A JP 5777979 B2 JP5777979 B2 JP 5777979B2
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- 229910000679 solder Inorganic materials 0.000 title claims description 62
- 229910045601 alloy Inorganic materials 0.000 title claims description 53
- 239000000956 alloy Substances 0.000 title claims description 53
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 20
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 20
- 229910052727 yttrium Inorganic materials 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 229910052804 chromium Inorganic materials 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 229910052748 manganese Inorganic materials 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 239000012535 impurity Substances 0.000 claims description 8
- 239000010949 copper Substances 0.000 description 18
- 229910052718 tin Inorganic materials 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 5
- 229910017944 Ag—Cu Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910000765 intermetallic Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000012790 confirmation Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- WNEODWDFDXWOLU-QHCPKHFHSA-N 3-[3-(hydroxymethyl)-4-[1-methyl-5-[[5-[(2s)-2-methyl-4-(oxetan-3-yl)piperazin-1-yl]pyridin-2-yl]amino]-6-oxopyridin-3-yl]pyridin-2-yl]-7,7-dimethyl-1,2,6,8-tetrahydrocyclopenta[3,4]pyrrolo[3,5-b]pyrazin-4-one Chemical compound C([C@@H](N(CC1)C=2C=NC(NC=3C(N(C)C=C(C=3)C=3C(=C(N4C(C5=CC=6CC(C)(C)CC=6N5CC4)=O)N=CC=3)CO)=O)=CC=2)C)N1C1COC1 WNEODWDFDXWOLU-QHCPKHFHSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
本発明は、Ａｇ含有率が低いはんだ合金でありながら、強度を向上させたはんだ合金を提供する。 The present invention provides a solder alloy having improved strength while being a solder alloy having a low Ag content.
従来、Ｐｂをほとんど含まない、いわゆる鉛フリーはんだ合金として、特許文献１により提案されたＳｎ−Ａｇ−Ｃｕはんだ合金が広く用いられている。
また、非特許文献１により、近年ではＡｇの価格高騰を受け、Ａｇ含有率を低減させたＳｎ−Ａｇ−Ｃｕはんだ合金も提案されていることが報告されている。
In addition, Non-Patent Document 1 reports that Sn-Ag-Cu solder alloys with a reduced Ag content have been proposed in recent years due to the rising price of Ag.
近年のＡｇ価格高騰を受け、Ａｇ含有率が低いＳｎ−Ａｇ−Ｃｕはんだ合金が提案されているが、安価であるものの、強度が低い課題があった。
そこで、本発明は、Ａｇ含有率が低いはんだ合金でありながら、強度を向上させた鉛フリーはんだ合金を提供することを目的とする。
In response to the recent increase in Ag prices, Sn-Ag-Cu solder alloys with a low Ag content have been proposed, but there is a problem of low strength but low strength.
Accordingly, an object of the present invention is to provide a lead-free solder alloy having improved strength while being a solder alloy having a low Ag content.
また、上記目的を達成するために、本発明のはんだ合金は、Ａｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素を０．００５〜０．１重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とする。 In order to achieve the above object, the solder alloy of the present invention is composed of Ag of 0.1 to 1.0% by weight, Cu of 0.5 to 3.0% by weight, Y, Gd and Dy. One selected element is 0.005 to 0.1% by weight, and the balance consists of Sn and inevitable impurities.
また、鉛フリーはんだ合金の主成分であるＳｎにＡｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素を０．００５〜０．１重量％同時に添加することで、Ａｇ含有率が低いはんだ合金でありながら、強度を向上させることが可能となる。 One type selected from the group consisting of Sn, which is the main component of the lead-free solder alloy, 0.1 to 1.0% by weight of Ag, 0.5 to 3.0% by weight of Cu, Y, Gd, and Dy By simultaneously adding 0.005 to 0.1% by weight of the above element, the strength can be improved while the solder alloy has a low Ag content.
上記の如く、本発明の鉛フリーはんだ合金は、その組成中に０．００５〜０．１重量％のＹ、ＧｄおよびＤｙを含有している点に大きな特徴を有している。上記添加元素がはんだ合金中のＳｎと金属間化合物を作り、はんだ合金中に点在することで、ＳｎとＡｇの金属間化合物およびＳｎとＣｕの金属間化合物の結晶が粗大化するのを抑制する。これら金属間化合物の結晶が微細なままとどまることにより、機械的強度が向上し、接合強度が向上する。 As described above, the lead-free solder alloy of the present invention has a great feature in that it contains 0.005 to 0.1% by weight of Y, Gd and Dy in its composition . Suppressing coarsening of Sn and Ag intermetallic compounds and Sn and Cu intermetallic compounds by forming the intermetallic compound with Sn in the solder alloy and interspersed in the solder alloy. To do. When the crystals of these intermetallic compounds remain fine, the mechanical strength is improved and the bonding strength is improved.
上記組成を採用することで、本発明の鉛フリーはんだ合金は、安価であるものの強度が低いというＡｇ含有率が低いＳｎ−Ａｇ−Ｃｕはんだ合金の弱点を克服し、安定した接合強度を保持できるものとなっている。 By adopting the above composition, the lead-free solder alloy of the present invention can overcome the weak point of the Sn-Ag-Cu solder alloy having a low Ag content, which is inexpensive but has low strength, and can maintain stable joint strength. It has become a thing.
上記Ｙ、ＧｄおよびＤｙの合計量がはんだ全量の０．００５重量％未満である場合、はんだ合金の強度向上は少なく効果が不十分である。また、０．１重量％を超えて添加すると、液相線温度の上昇および酸化によるドロスの発生量を増加させるため、はんだ付け性を低下させることとなり、結果的に接合強度を低下させることとなる。その上、Ｙ、ＧｄおよびＤｙは希少金属であり、Ａｇ同様に近年価格が高騰しているため、多量に含有させることは好ましくない。 When the total amount of Y, Gd, and Dy is less than 0.005% by weight of the total amount of solder, the strength of the solder alloy is hardly improved and the effect is insufficient. Also, if added over 0.1% by weight, the liquidus temperature rises and the amount of dross generated due to oxidation increases, so solderability is reduced, resulting in reduced joint strength. Become. In addition, Y, Gd, and Dy are rare metals and, like Ag, the price has recently increased so that it is not preferable to contain a large amount.
Ｃｒ、Ｍｎ、Ｆｅ、ＣｏおよびＮｉは、はんだ合金の凝固組織の結晶を微細化し、機械的な強度を向上させる。Ｃｒ、Ｍｎ、Ｆｅ、ＣｏおよびＮｉはごく微量の添加であっても効果が期待できるが、これらの合計量がはんだ全量の０．５重量％以上になると、液相線温度の上昇および酸化によるドロスの発生量を増加させるため、はんだ付け性を低下させることとなり、結果的に接合強度を低下させることとなる。 Cr, Mn, Fe, Co and Ni refine the crystal of the solidified structure of the solder alloy and improve the mechanical strength. Cr, Mn, Fe, Co, and Ni can be expected to be effective even with a very small amount of addition. In order to increase the amount of dross generated, the solderability is reduced, and as a result, the bonding strength is reduced.
Ｐ、ＧａおよびＧｅは非常に酸化しやすい元素である。そのため、Ｙ、Ｇｄ、ＤｙおよびＣｒ、Ｍｎ、Ｆｅ、Ｃｏ、Ｎｉが酸化し、ドロスと呼ばれる酸化物になるのを抑制する代替酸化元素としての効果がある。これにより、Ｙ、Ｇｄ、ＤｙおよびＣｒ、Ｍｎ、Ｆｅ、Ｃｏ、Ｎｉをはんだ合金中に安定してとどめることが可能である。 P, Ga and Ge are elements that are very easily oxidized. Therefore, Y, Gd, Dy, and Cr, Mn, Fe, Co, and Ni are oxidized, and there is an effect as an alternative oxidation element that suppresses the formation of an oxide called dross. Thereby, Y , Gd, Dy and Cr, Mn, Fe, Co, Ni can be stably kept in the solder alloy.
上記Ｐ、ＧａおよびＧｅからなる群から選んだ１種または２種以上の元素の合計量がはんだ全量の０．００１重量％未満である場合、代替酸化元素としての効果が少なく不十分である。また、０．１重量％を超えて添加すると、液相線温度の上昇または展性が減少し脆くなるため、はんだ付け性を低下させる。 When the total amount of one or more elements selected from the group consisting of P, Ga and Ge is less than 0.001% by weight of the total amount of solder, the effect as an alternative oxidation element is small and insufficient. On the other hand, if it exceeds 0.1% by weight, the liquidus temperature rises or malleability decreases and becomes brittle, so that solderability is lowered.
このため、本発明は、Ａｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素を０．００５〜０．１重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とするはんだ合金であり、このはんだ合金は、高価なＡｇを多量に含有せず、Ａｇ含有率が低いはんだ合金でありながら、接合強度に優れている。 Therefore, the present invention provides 0.005% of one element selected from the group consisting of Ag of 0.1 to 1.0% by weight, Cu of 0.5 to 3.0% by weight, Y, Gd and Dy. A solder alloy characterized by 0.1 wt% and the balance consisting of Sn and inevitable impurities. This solder alloy does not contain a large amount of expensive Ag and has a low Ag content. However, it has excellent bonding strength.
また、Ａｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素を０．００５〜０．１重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とするはんだ合金に、Ｃｒ、Ｍｎ、Ｆｅ、ＣｏおよびＮｉからなる群から選んだ１種の元素を０．５重量％以下含有させることで、上記はんだ合金の接合強度をさらに向上させることができる。 Further, 0.005 to 0.1% by weight of one element selected from the group consisting of 0.1 to 1.0% by weight of Ag, 0.5 to 3.0% by weight of Cu, Y, Gd and Dy % And a solder alloy characterized in that the balance is composed of Sn and inevitable impurities, and containing 0.5% by weight or less of one element selected from the group consisting of Cr, Mn, Fe, Co and Ni The bonding strength of the solder alloy can be further improved.
また、Ａｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素を０．００５〜０．１重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とするはんだ合金、又は上記はんだ合金にＣｒ、Ｍｎ、Ｆｅ、ＣｏおよびＮｉからなる群から選んだ１種の元素を０．５重量％以下含有させたはんだ合金に、Ｐ、ＧａおよびＧｅからなる群から選んだ１種または２種以上の元素を合計で０．００１〜０．１重量％含有させることで、上記はんだ合金中の添加元素をはんだ合金中に安定してとどめることが可能である。 Further, 0.005 to 0.1% by weight of one element selected from the group consisting of 0.1 to 1.0% by weight of Ag, 0.5 to 3.0% by weight of Cu, Y, Gd and Dy %, And the balance consisting of Sn and inevitable impurities, or 0.5% by weight or less of one element selected from the group consisting of Cr, Mn, Fe, Co and Ni in the solder alloy By adding 0.001 to 0.1% by weight in total of one or more elements selected from the group consisting of P, Ga and Ge to the contained solder alloy, the additive element in the solder alloy Can be stably retained in the solder alloy.
以下、本発明をその実施例に基づいて説明する。
ＳｎにＡｇ、ＣｕおよびＹ、Ｇｄ、Ｄｙからなる群から選んだ１種の元素を同時に添加したはんだ合金を用いて、プッシュプル試験を実施した。
また、ＳｎにＡｇ、ＣｕおよびＹ、Ｇｄ、Ｄｙからなる群から選んだ１種の元素およびＣｒ、Ｍｎ、Ｆｅ、ＣｏおよびＮｉからなる群から選んだ１種の元素を同時に添加したはんだ合金を用いて、プッシュプル試験を実施した。
Hereinafter, the present invention will be described based on examples thereof.
A push-pull test was performed using a solder alloy in which one kind of element selected from the group consisting of Ag, Cu and Y 2 , Gd, and Dy was simultaneously added to Sn.
Also, a solder alloy in which one element selected from the group consisting of Ag, Cu and Y 2 , Gd, Dy and one element selected from the group consisting of Cr, Mn, Fe, Co, and Ni are simultaneously added to Sn. Used to perform a push-pull test.
また、ＳｎにＡｇ、Ｃｕ、およびＹ、Ｇｄ、Ｄｙからなる群から選んだ１種の元素およびＰ、ＧａおよびＧｅからなる群から選んだ１種の元素を同時に添加したはんだ合金を用いて、ドロスの発生量を確認した。 Also, using a solder alloy in which Sn, Ag, Cu, and one element selected from the group consisting of Y 2 , Gd, and Dy and one element selected from the group consisting of P, Ga, and Ge are simultaneously added, The amount of dross generated was confirmed.
プッシュプル試験は、チップ部品搭載用プリント基板にフラックスを塗布し、チップ部品を搭載する銅ランド上に、あらかじめ実施例および比較例のはんだ合金を予備はんだ付けしておいた。その後、あらかじめ予備はんだ付けしておいたはんだ合金の上に３２１６型チップ部品を搭載し、熱板にてはんだを再溶融させてはんだ付を行った。はんだ付後、プッシュプル試験機により、１ｍｍ／分の速度でプリント基板と平行方向にチップ部品を押し込んだ。試験結果を表１に示す。 In the push-pull test, a flux was applied to a printed circuit board for chip component mounting, and the solder alloys of the examples and comparative examples were pre-soldered in advance on the copper lands on which the chip components were mounted. Thereafter, a 3216 type chip component was mounted on a solder alloy that had been pre-soldered in advance, and soldering was performed by remelting the solder with a hot plate. After soldering, the chip component was pushed in parallel to the printed circuit board at a speed of 1 mm / min by a push-pull tester. The test results are shown in Table 1.
ドロス発生量確認試験は、噴流はんだ槽を用いて、はんだ合金を連続的に噴流させ、1時間おきに発生したドロスを全て回収した。回収したドロスの重量を測定し、各はんだ合金のドロス発生量を確認した。これを６時間繰り返し行った。実施例および比較例のはんだ合金組成を表２に示す。試験結果を表３に示す。 In the dross generation amount confirmation test, a solder alloy was continuously jetted using a jet solder bath, and all dross generated every hour was collected. The weight of the collected dross was measured, and the dross generation amount of each solder alloy was confirmed. This was repeated for 6 hours. Table 2 shows the solder alloy compositions of Examples and Comparative Examples. The test results are shown in Table 3.
（表１） 各はんだ合金におけるプッシュプル試験結果
（表２） ドロス量確認試験のはんだ合金組成
（表３） ドロス量確認試験結果
ＳｎにＡｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％を添加したはんだ合金の接合強度は４．８〜６．４ｋｇｆであった。 The joining strength of the solder alloy in which 0.1 to 1.0% by weight of Ag and 0.5 to 3.0% by weight of Cu were added to Sn was 4.8 to 6.4 kgf .
また、ＳｎにＡｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素を０．００５〜０．１重量％添加したはんだ合金の接合強度は５．１〜７．７ｋｇｆであり、いずれの配合比率においても接合強度が向上していることが確認された。 One element selected from the group consisting of 0.1 to 1.0% by weight of Ag, 0.5 to 3.0% by weight of Cu, and Y, Gd, and Dy is added to 0.005 to 0.005%. The joining strength of the solder alloy added with 1 wt% was 5.1 to 7.7 kgf, and it was confirmed that the joining strength was improved at any mixing ratio.
この結果、Ａｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素を０．００５〜０．１重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とするはんだ合金は、接合強度が向上していることが明らかとなった。 As a result, one element selected from the group consisting of 0.1 to 1.0% by weight of Ag, 0.5 to 3.0% by weight of Cu, Y, Gd and Dy is added to 0.005 to 0.1%. It has been clarified that the bonding strength of the solder alloy characterized by the weight percent and the balance consisting of Sn and inevitable impurities is improved.
また、Ａｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素を０．００５〜０．１重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とするはんだ合金に、Ｃｒ、Ｍｎ、Ｆｅ、ＣｏおよびＮｉからなる群から選んだ１種の元素を０．５重量％以下含有するはんだ合金は、接合強度が向上していることが明らかとなった。 Further, 0.005 to 0.1% by weight of one element selected from the group consisting of 0.1 to 1.0% by weight of Ag, 0.5 to 3.0% by weight of Cu, Y, Gd and Dy %, And the balance of 0.5% by weight of one element selected from the group consisting of Cr, Mn, Fe, Co and Ni It was revealed that the bonding strength was improved.
また、ＳｎにＡｇを１．０重量％、Ｃｕを３．０重量％、Ｃｅを０．５重量％添加したはんだ合金（比較例６）のドロス発生量の平均は２６．３７ｇ／時間であった。 In addition, the average dross generation amount of the solder alloy (Comparative Example 6) in which 1.0% by weight of Ag, 3.0% by weight of Cu and 0.5% by weight of Ce are added to Sn is 26.37 g / hour. It was.
また、ＳｎにＡｇを１．０重量％、Ｃｕを３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素を０．１重量％、Ｐ、ＧａおよびＧｅからなる群から選んだ１種または２種以上の元素を合計で０．００１〜０．１重量％添加したはんだ合金のドロス発生量の平均は１０．０５（実施例２４１）〜１５．５９（実施例１３０）ｇ／時間であり、ドロスの発生量が抑制されていることが確認された。 In addition, Sn is 1.0% by weight, Cu is 3.0% by weight, one element selected from the group consisting of Y, Gd and Dy is 0.1% by weight, and the group is made of P, Ga and Ge The average dross generation amount of the solder alloy to which 0.001 to 0.1% by weight in total of one or more elements selected from 1 is added is 10.05 (Example 241) to 15.59 (Example 130) ) G / hour, and it was confirmed that the amount of dross generated was suppressed.
また、Ａｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素が０．００５〜０．１重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とするはんだ合金にＰ、ＧａおよびＧｅからなる群から選んだ１種または２種以上の元素を合計で０．００１〜０．１重量％含有させたはんだ合金は、ドロスの発生量が抑制されていることが明らかとなった。 Further, one element selected from the group consisting of 0.1 to 1.0% by weight of Ag, 0.5 to 3.0% by weight of Cu, Y, Gd and Dy is 0.005 to 0.1% by weight. %, And a balance of 0.001 to 0.1% by weight of one or more elements selected from the group consisting of P, Ga and Ge in a solder alloy characterized in that the balance consists of Sn and inevitable impurities It was revealed that the amount of dross generated in the contained solder alloy was suppressed.
また、Ａｇが０．１〜１．０重量％、Ｃｕが０．５〜３．０重量％、Ｙ、ＧｄおよびＤｙからなる群から選んだ１種の元素が０．００５〜０．１重量％、および残部がＳｎおよび不可避不純物よりなることを特徴とするはんだ合金、および上記はんだ合金にＣｒ、Ｍｎ、Ｆｅ、ＣｏおよびＮｉからなる群から選んだ１種の元素を０．５重量％以下含有させたはんだ合金に、Ｐ、ＧａおよびＧｅからなる群から選んだ１種または２種以上の元素を合計で０．００１〜０．１重量％含有させたはんだ合金は、ドロスの発生量が抑制されていることが明らかとなった。 Further, one element selected from the group consisting of 0.1 to 1.0% by weight of Ag, 0.5 to 3.0% by weight of Cu, Y, Gd and Dy is 0.005 to 0.1% by weight. %, And the balance consisting of Sn and inevitable impurities, and 0.5% by weight or less of one element selected from the group consisting of Cr, Mn, Fe, Co and Ni in the solder alloy A solder alloy containing 0.001 to 0.1% by weight in total of one or more elements selected from the group consisting of P, Ga and Ge in the contained solder alloy has a dross generation amount. It became clear that it was suppressed.
本発明は、Ａｇ含有率が低いはんだ合金でありながら、接合強度を向上させたはんだ合金であり、やに入りはんだ、ソルダペースト、棒はんだ、および線状はんだとして使用される。
The present invention is a solder alloy having improved bonding strength while being a solder alloy having a low Ag content, and is used as a core solder, a solder paste, a bar solder, and a linear solder.
Claims (3)
3. The solder alloy according to claim 1, comprising a total of 0.001 to 0.1 wt% of one or more elements selected from the group consisting of P, Ga, and Ge.
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| CN104289824B (en) * | 2014-09-30 | 2017-05-24 | 济南无线电十厂有限责任公司 | Stannum, argentum and copper lead-free solder and production method thereof |
| CN106607650A (en) * | 2015-10-23 | 2017-05-03 | 东莞市天铖锡业有限公司 | Rare earth cerium solder alloy soldering paste |
| CN106435325B (en) * | 2016-10-10 | 2018-06-08 | 无锡日月合金材料有限公司 | A kind of multicomponent alloy seal, sealing materials and preparation method thereof |
| CN110952017B (en) * | 2019-12-27 | 2020-10-09 | 华北水利水电大学 | A kind of high entropy super silver solder alloy and preparation method thereof |
| CN113182727A (en) * | 2021-04-08 | 2021-07-30 | 北京科技大学 | Chlorine ion corrosion resistant Sn-Ag-Cu-Nd lead-free solder alloy and preparation method thereof |
| CN114807677B (en) * | 2021-05-19 | 2023-08-08 | 苏州优诺电子材料科技有限公司 | Tin alloy and preparation method thereof |
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