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JP5758082B2 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
JP5758082B2
JP5758082B2 JP2010067304A JP2010067304A JP5758082B2 JP 5758082 B2 JP5758082 B2 JP 5758082B2 JP 2010067304 A JP2010067304 A JP 2010067304A JP 2010067304 A JP2010067304 A JP 2010067304A JP 5758082 B2 JP5758082 B2 JP 5758082B2
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light emitting
sealing resin
package body
emitting device
resin
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JP2011199219A (en
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武夫 栗本
武夫 栗本
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Nichia Corp
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Nichia Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item

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Description

本発明は、発光素子が搭載された発光装置に関し、特に、ＬＥＤディスプレイなどの表示装置に用いられる発光装置に関する。   The present invention relates to a light emitting device on which a light emitting element is mounted, and particularly to a light emitting device used for a display device such as an LED display.

今日、ＲＧＢ（赤色、緑色、青色）の各色を発光可能な発光ダイオード（ＬＥＤ）や、白色を高輝度に発光可能なＬＥＤが開発された結果、複数のＬＥＤを配列して構成されるＬＥＤ表示装置が種々の分野に応用されつつある。例えば、ＬＥＤは電球と比較して極めて寿命が長く、高効率、且つ振動にも強いため、これらの特性を活かして、広告、行き先案内や道路情報等の表示用、信号機の光源、小型乃至大型ディスプレイとして用いられてきている。   As a result of the development of light-emitting diodes (LEDs) capable of emitting RGB (red, green, blue) colors and LEDs capable of emitting white light with high brightness, LED displays configured by arranging a plurality of LEDs The device is being applied to various fields. For example, LEDs have an extremely long life compared to light bulbs, are highly efficient, and are resistant to vibration. Utilizing these characteristics, LEDs, advertisements, destination information and road information display, traffic light sources, small to large It has been used as a display.

このようなＬＥＤとしては、表示コントラストの低下を抑制するために、白色樹脂の外面に黒色や紺色等の暗色系の塗装または樹脂層を設けたＬＥＤが知られている（例えば、特許文献１〜３参照）。このようなＬＥＤの一例としては、白色樹脂からなる凹部を有するパッケージ本体と、凹部の底面に実装された半導体発光素子と、凹部内に充填された封止樹脂と、パッケージ本体の上面に形成された暗色系の樹脂層と、を有する発光装置がある。これにより、複数のＬＥＤを並設した場合、消灯中のＬＥＤが外光や点灯中の別のＬＥＤの光を受けて点灯しているように見えることによる表示コントラストの低下を抑制できる。   As such an LED, in order to suppress a decrease in display contrast, an LED in which a dark color paint such as black or amber or a resin layer is provided on the outer surface of a white resin is known (for example, Patent Documents 1 to 3). 3). As an example of such an LED, a package body having a recess made of a white resin, a semiconductor light emitting element mounted on the bottom surface of the recess, a sealing resin filled in the recess, and an upper surface of the package body are formed. And a dark resin layer. Thereby, when a plurality of LEDs are arranged in parallel, it is possible to suppress a decrease in display contrast due to an LED being turned off receiving external light or light of another LED being turned on.

特開平０５−０２９６６４号公報JP 05-029664 A 特開２０００−１８３４０５号公報JP 2000-183405 A 特開２００６−１０８６４０号公報JP 2006-108640 A

現在におけるＬＥＤ或いは複数のＬＥＤを使用したＬＥＤ表示装置においては、その利用分野の拡大或いはより高い表示品位が要求されることに伴い、屋外、屋内を問わず、表示コントラストの低下を軽減することに対して、さらなる改良が求められている。   In an LED display device using an LED or a plurality of LEDs at present, the reduction in display contrast is reduced regardless of whether it is outdoors or indoors, as the application field is expanded or higher display quality is required. On the other hand, further improvement is required.

すなわち、ＬＥＤが点灯している場合、太陽光、照明などの外来光がある角度において当たることにより、主に、ＬＥＤにおける封止樹脂の表面にて光の反射が起こり、表示コントラストが低下するという問題があった。また、ＬＥＤが点灯していない場合においても、視認側となるＬＥＤの上面および側面に外来光が当たることにより、その表面にて光の反射が起こり、所謂ギラつきが発生し、見た目に白っぽく映ってしまう。もちろん、複数のＬＥＤが基板に配置されたＬＥＤ表示装置の場合も、上記した同様の理由で、表示コントラストが低下してしまう。   That is, when the LED is lit, external light such as sunlight or illumination hits at a certain angle, so that light is reflected mainly on the surface of the sealing resin in the LED, and the display contrast is reduced. There was a problem. In addition, even when the LED is not lit, external light hits the upper and side surfaces of the LED on the viewing side, causing reflection of light on the surface, so-called glare, and a whitish appearance. End up. Of course, also in the case of an LED display device in which a plurality of LEDs are arranged on a substrate, the display contrast is lowered for the same reason as described above.

これらの結果、図４に示すように、本来であれば視認側となるＬＥＤの上面が暗色系であることによって表示品位が保たれていたＬＥＤまたはＬＥＤ表示装置が、その表面にて光を反射することにより表示コントラストが低下するばかりでなく、ギラつきや白っぽく映ることにより、ＬＥＤまたはＬＥＤ表示装置としての品質が損なわれるという問題があった。さらに、暗色系の層の上に封止樹脂が這い上がると、封止樹脂表面で光が反射され、表示コントラストが低下する。   As a result, as shown in FIG. 4, the LED or LED display device, which originally maintained the display quality because the upper surface of the LED, which is the viewing side, is a dark color system, reflects light on the surface. As a result, not only the display contrast is lowered, but there is a problem that the quality of the LED or the LED display device is deteriorated due to glare or whitish reflection. Further, when the sealing resin crawls up on the dark color layer, light is reflected on the surface of the sealing resin, and the display contrast is lowered.

図４は、従来の発光装置を示す模式的な断面図である。図４に示す従来の発光装置は、凹部を有するパッケージ本体４１と、パッケージ本体４１に一部が被覆され、一部が露出した第１リード端子４２ａおよび第２リード端子４２ｂと、凹部の底面で露出したリード端子４２ａに実装された半導体発光素子４３と、半導体発光素子４３とリード端子４２ａ、４２ｂを電気的に接続する金属ワイヤ４４と、を有する。さらに、パッケージ本体４１の上面には暗色系の層４６が形成されている。パッケージ本体４１の凹部内には、半導体発光素子４３を被覆する封止樹脂４５が充填されている。封止樹脂４５は暗色系の層４６の形成後に充填されるため、暗色系の層４７の上に封止樹脂４５の一部が這い上がり、封止樹脂４５によって被覆された樹脂被覆部４７が形成される場合がある。暗色系の層４６が露出している部分では光の反射が抑制されるが、樹脂被覆部４７の表面において光が反射されるため、表示コントラストが低下する。   FIG. 4 is a schematic cross-sectional view showing a conventional light emitting device. The conventional light emitting device shown in FIG. 4 includes a package main body 41 having a recess, a first lead terminal 42a and a second lead terminal 42b partially covered by the package main body 41, and a bottom surface of the recess. The semiconductor light emitting element 43 mounted on the exposed lead terminal 42a, and the metal wire 44 that electrically connects the semiconductor light emitting element 43 and the lead terminals 42a and 42b. Further, a dark color layer 46 is formed on the upper surface of the package body 41. A sealing resin 45 covering the semiconductor light emitting element 43 is filled in the recess of the package body 41. Since the sealing resin 45 is filled after the dark color layer 46 is formed, a part of the sealing resin 45 crawls on the dark color layer 47, and the resin coating portion 47 covered with the sealing resin 45 is formed. May be formed. Although light reflection is suppressed in the portion where the dark color layer 46 is exposed, the light is reflected on the surface of the resin coating portion 47, so that the display contrast is lowered.

上記課題を解決するために、発光装置は、凹部を有するパッケージ本体と、前記凹部の底面に実装された半導体発光素子と、前記凹部内に充填された透光性の封止樹脂と、を備え、前記封止樹脂は、前記凹部から前記パッケージ本体の上面にかけて形成されており、前記パッケージ本体の上面に、前記封止樹脂を介して、暗色系の層が形成されたことを特徴とする。   In order to solve the above problems, a light emitting device includes a package body having a recess, a semiconductor light emitting element mounted on the bottom surface of the recess, and a translucent sealing resin filled in the recess. The sealing resin is formed from the recess to the top surface of the package body, and a dark color layer is formed on the top surface of the package body via the sealing resin.

上記の発光装置には以下の構成を組み合わせることができる。
前記上面の一部に、前記封止樹脂から露出した露出部を有し、前記暗色系の層は、前記露出部と前記封止樹脂の境界を少なくとも被覆する。
前記上面は、前記封止樹脂によって被覆された下段部と、前記封止樹脂から露出した上段部と、からなる段差を有する。
前記パッケージ本体は白色樹脂からなり、前記暗色系の層は黒色樹脂からなる。 The following configurations can be combined with the above light-emitting device.
A part of the upper surface has an exposed portion exposed from the sealing resin, and the dark color layer covers at least a boundary between the exposed portion and the sealing resin.
The upper surface has a step composed of a lower step portion covered with the sealing resin and an upper step portion exposed from the sealing resin.
The package body is made of a white resin, and the dark color layer is made of a black resin.

本発明によれば、外来光が照射された際、発光装置の上面における所謂ギラつきを減少させることができ、見る人に不快感を与えず、また表示コントラストの低下を大幅に軽減することができる発光装置を、容易に得ることができる。   According to the present invention, when external light is irradiated, so-called glare on the upper surface of the light emitting device can be reduced, so that the viewer does not feel uncomfortable and the reduction in display contrast can be greatly reduced. A light-emitting device that can be obtained can be easily obtained.

図１は本発明の実施の形態１の発光装置を示す模式的な断面図である。FIG. 1 is a schematic cross-sectional view showing a light-emitting device according to Embodiment 1 of the present invention. 図２は本発明の実施の形態２の発光装置を示す模式的な断面図である。FIG. 2 is a schematic cross-sectional view showing a light emitting device according to Embodiment 2 of the present invention. 図３は本発明の実施の形態３の発光装置を示す模式的な断面図である。FIG. 3 is a schematic cross-sectional view showing a light-emitting device according to Embodiment 3 of the present invention. 図４は従来の発光装置を示す模式的な断面図である。FIG. 4 is a schematic cross-sectional view showing a conventional light emitting device.

本発明を実施するための最良の形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本発明の技術思想を具体化するための半導体装置およびその形成方法を例示するものであって、本発明は、発光装置およびその形成方法を以下に限定するものではない。   The best mode for carrying out the present invention will be described below with reference to the drawings. However, the embodiments described below exemplify a semiconductor device and a method for forming the semiconductor device for embodying the technical idea of the present invention, and the present invention does not limit the light emitting device and the method for forming the same to the following. Absent.

また、本明細書は特許請求の範囲に示される部材を、実施の形態の部材に特定するものでは決してない。実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特に特定的な記載がない限りは、本発明の範囲をそれのみに限定する趣旨ではなく、単なる説明例にすぎない。なお、各図面が示す部材の大きさや位置関係等は、説明を明確にするため誇張していることがある。さらに以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており、詳細な説明を適宜省略する。さらに、本発明を構成する各要素は、複数の要素を同一の部材で構成して一の部材で複数の要素を兼用する態様としてもよいし、逆に一の部材の機能を複数の部材で分担して実現することもできる。   Further, the present specification by no means specifies the members shown in the claims to the members of the embodiments. The dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the description unless otherwise specified. It is just an example. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Further, in the following description, the same name and reference sign indicate the same or the same members, and detailed description will be omitted as appropriate. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing.

［実施の形態１］
図１に、本発明の実施の形態１に係る発光装置の模式的な断面図を示す。発光装置は、凹部を有するパッケージ本体１と、パッケージ本体１に一部が被覆され、一部が露出した第１リード端子２ａ、第２リード端子２ｂと、凹部の底面で露出した第１リード端子２ａに実装された半導体発光素子３と、半導体発光素子３を被覆するように凹部内に充填された封止樹脂４と、を有する。半導体発光素子３とリード端子２ａ、２bとは、金属ワイヤ６によって電気的に接続されている。封止樹脂４の一部はパッケージ本体１の上面１ａにも形成されており、その封止樹脂４の上に暗色系の層５が形成されている。これによって、暗色系の層５への封止樹脂４の這い上がりを防止でき、表示コントラストの低下を抑制できる。 [Embodiment 1]
FIG. 1 shows a schematic cross-sectional view of a light emitting device according to Embodiment 1 of the present invention. The light emitting device includes a package body 1 having a recess, a first lead terminal 2a and a second lead terminal 2b that are partially covered and exposed by the package body 1, and a first lead terminal that is exposed at the bottom of the recess. The semiconductor light emitting element 3 mounted on 2a and the sealing resin 4 filled in the recess so as to cover the semiconductor light emitting element 3 are included. The semiconductor light emitting element 3 and the lead terminals 2 a and 2 b are electrically connected by a metal wire 6. A part of the sealing resin 4 is also formed on the upper surface 1 a of the package body 1, and a dark-colored layer 5 is formed on the sealing resin 4. As a result, creeping of the sealing resin 4 to the dark color layer 5 can be prevented, and a decrease in display contrast can be suppressed.

（パッケージ本体）
パッケージを構成する樹脂の具体的な材料としては絶縁性部材が好ましい。また、半導体発光素子からの光や外光などが透過しにくい部材が好ましい。また、ある程度の強度を有するもので、熱硬化性樹脂、熱可塑性樹脂などを用いることができ、より具体的には、フェノール樹脂、ガラスエポキシ樹脂、ＢＴレジンや、ＰＰＡなどが挙げられる。パッケージ本体は、半導体発光素子を載置可能な凹部を有することが好ましい。この凹部は側面と底面を有しており、底面にはリード端子が露出されており、露出されたリード端子に半導体発光素子が載置される。また、パッケージ本体を白色樹脂で構成することで、凹部の壁面における光の反射率を向上でき、光取り出し効率を向上できる。 (Package body)
As a specific material of the resin constituting the package, an insulating member is preferable. In addition, a member that does not easily transmit light from the semiconductor light emitting element or external light is preferable. Further, it has a certain degree of strength, and a thermosetting resin, a thermoplastic resin, or the like can be used. More specifically, a phenol resin, a glass epoxy resin, a BT resin, PPA, or the like can be given. The package body preferably has a recess in which the semiconductor light emitting element can be placed. The recess has a side surface and a bottom surface. A lead terminal is exposed on the bottom surface, and the semiconductor light emitting element is placed on the exposed lead terminal. Moreover, the reflectance of the light in the wall surface of a recessed part can be improved by comprising a package main body with white resin, and light extraction efficiency can be improved.

（リード端子）
リード端子の形状は、特に限定されるものではない。半導体発光素子と電気的に接続可能で、かつ、一部が基体に内包されるとともに基体の外部から突出するように延設され、この延設部によって外部と電気的な接続がとれるような機能を有していればよい。リード端子の材料としては、熱伝導率の比較的大きな材料を用いることが好ましい。このような材料で形成することにより、半導体素子で発生する熱を効率的に逃すことができる。例えば、２００Ｗ／（ｍ・Ｋ）程度以上の熱伝導率を有しているものが好ましい。さらに、比較的大きい機械的強度を有するもの、あるいは打ち抜きプレス加工又はエッチング加工等が容易な材料が好ましい。具体的には、銅、アルミニウム、金、銀、タングステン、鉄、ニッケル等の金属又は鉄−ニッケル合金、りん青銅、鉄入り銅等が挙げられる。 (Lead terminal)
The shape of the lead terminal is not particularly limited. A function that can be electrically connected to the semiconductor light-emitting element, and is partly embedded in the base and extended so as to protrude from the outside of the base, and the extended portion can be electrically connected to the outside. As long as it has. As a material for the lead terminal, it is preferable to use a material having a relatively large thermal conductivity. By forming with such a material, the heat generated in the semiconductor element can be efficiently released. For example, those having a thermal conductivity of about 200 W / (m · K) or more are preferable. Furthermore, a material having a relatively large mechanical strength or a material that can be easily punched or etched or etched is preferable. Specific examples include metals such as copper, aluminum, gold, silver, tungsten, iron, nickel, iron-nickel alloys, phosphor bronze, iron-containing copper, and the like.

リード端子は第１リード端子と第２リード端子を有する。図１に示すように、第１リード端子２ａに半導体発光素子３を載置し、金属ワイヤ６によって半導体発光素子３と第１リード端子２ａ及び第２リード端子２ｂとを接続する。   The lead terminal has a first lead terminal and a second lead terminal. As shown in FIG. 1, the semiconductor light emitting element 3 is mounted on the first lead terminal 2a, and the semiconductor light emitting element 3 is connected to the first lead terminal 2a and the second lead terminal 2b by a metal wire 6.

（半導体発光素子）
半導体発光素子は、任意の波長のものを選択することができる。例えば、青色、緑色の発光素子としては、ＺｎＳｅや窒化物系半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）を用いたものを用いることができる。また、赤色の発光素子としては、ＧａＡｓ、ＩｎＰなどを用いることができる。さらに、これ以外の材料からなる半導体発光素子を用いることもできる。用いる発光素子の組成や発光色、大きさや、個数などは目的に応じて適宜選択することができる。また、可視光領域の光だけでなく、紫外線や赤外線を出力する発光素子とすることができる。さらには、半導体発光素子とともに、受光素子などを搭載することができる。また、半導体発光素子の周囲に半導体発光素子の発光を波長変換する蛍光体を配置して、任意の発光を得ることができる。例えば、青色発光の半導体発光素子と黄色発光の蛍光体を組み合わせて、白色を得ることができる。 (Semiconductor light emitting device)
A semiconductor light emitting device having an arbitrary wavelength can be selected. For example, as blue and green light emitting elements, those using ZnSe or a nitride semiconductor (In X Al Y Ga 1- XYN, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) are used. it can. As the red light emitting element, GaAs, InP, or the like can be used. Furthermore, a semiconductor light emitting element made of a material other than this can also be used. The composition, emission color, size, number, and the like of the light emitting element to be used can be appropriately selected according to the purpose. Further, a light-emitting element that outputs not only light in the visible light region but also ultraviolet rays and infrared rays can be obtained. Furthermore, a light receiving element or the like can be mounted together with the semiconductor light emitting element. Arbitrary light emission can be obtained by arranging a phosphor that converts the wavelength of light emitted from the semiconductor light emitting element around the semiconductor light emitting element. For example, a white light can be obtained by combining a blue light emitting semiconductor light emitting element and a yellow light emitting phosphor.

（封止樹脂）
半導体発光素子が載置された凹部の内部は、封止樹脂によって封止される。封止樹脂は、パッケージに載置された半導体発光素子や金属ワイヤを、塵芥、水分や外力などから保護する部材であり、半導体発光素子からの光を透過可能な透光性を有する部材が用いられる。具体的な材料としては、シリコーン樹脂やエポキシ樹脂を挙げることができる。封止部材は、半導体発光素子を完全に被覆する量を用いることが好ましい。 (Sealing resin)
The inside of the recess in which the semiconductor light emitting element is placed is sealed with a sealing resin. The sealing resin is a member that protects the semiconductor light emitting element and the metal wire placed on the package from dust, moisture, external force, and the like, and a light-transmitting member that can transmit light from the semiconductor light emitting element is used. It is done. Specific examples of the material include a silicone resin and an epoxy resin. The sealing member is preferably used in an amount that completely covers the semiconductor light emitting element.

封止樹脂には、光散乱剤や蛍光物質等の粒子を含有させることができる。粒子の形状は、球形や破砕状とすることができる。球形の粒子は沈降し易く、封止樹脂表面に粒子の形状に対応した凸部が形成され難い。このため、封止樹脂からの光の取り出し効率を向上できるが、平坦な封止樹脂表面は外来光を反射し易く、所謂ギラツキが発生する。ギラツキを抑制するためには、破砕状の粒子とすることが好ましい。破砕状の粒子とすることで、同程度の大きさの球形の粒子より表面積が大きくでき、粒子の沈降を抑制できるので、封止樹脂の上部に粒子が存在する状態で樹脂硬化させることができる。粒子を封止樹脂の表面近傍に配置することで、粒子の形状に沿った凸部を封止樹脂の表面に分散して配置することができ、外来光の照り返しを抑制してコントラストの低下を低減できる。また、パッケージ本体の上面に粒子を含有する封止樹脂を形成し、その上に暗色系の層を形成することで、暗色系の層表面に粒子の形状に沿った凸部を形成することもできる。これによって、さらに外来光の照り返しを抑制でき、コントラストの低下を低減できる。   The sealing resin can contain particles such as a light scattering agent and a fluorescent material. The shape of the particles can be spherical or crushed. Spherical particles are likely to settle, and it is difficult for convex portions corresponding to the shape of the particles to be formed on the surface of the sealing resin. For this reason, the light extraction efficiency from the sealing resin can be improved, but the flat sealing resin surface easily reflects extraneous light, and so-called glare occurs. In order to suppress glare, it is preferable to use crushed particles. By using crushed particles, the surface area can be made larger than spherical particles of the same size and the sedimentation of the particles can be suppressed, so that the resin can be cured in a state where the particles are present above the sealing resin. . By arranging the particles in the vicinity of the surface of the sealing resin, it is possible to disperse the convex portions along the shape of the particles on the surface of the sealing resin, thereby suppressing the reflection of external light and reducing the contrast. Can be reduced. In addition, by forming a sealing resin containing particles on the upper surface of the package body and forming a dark color layer thereon, convex portions along the shape of the particles can be formed on the dark color layer surface. it can. Thereby, the reflection of external light can be further suppressed, and the reduction in contrast can be reduced.

粒子の濃度は、２０％より大きくすることが好ましく、これにより、封止樹脂の表面近傍に粒子を滞留させ、粒子の形状に沿った凸部を形成することができる。一方、粒子の濃度を大きくすると封止樹脂から光が取り出され難く、光度の低下や配光の偏りが生じるため、粒子の濃度は６０％以下が好ましく、さらに好ましくは４０％以下とし、より好ましくは３０％以下とする。粒子の大きさは、例えば０．５〜１０μｍ程度とすることができる。   The concentration of the particles is preferably greater than 20%, whereby the particles can be retained in the vicinity of the surface of the sealing resin, and convex portions along the shape of the particles can be formed. On the other hand, if the concentration of the particles is increased, it is difficult to extract light from the sealing resin, resulting in a decrease in luminous intensity and uneven light distribution. Therefore, the particle concentration is preferably 60% or less, more preferably 40% or less, and more preferably. Is 30% or less. The size of the particles can be, for example, about 0.5 to 10 μm.

粒子は、特に限定されるものではないが、酸化ケイ素（シリカ）、酸化チタン、チタン酸バリウム、酸化アルミニウムなどの無機部材や、アクリル樹脂、ウレタン樹脂、メラミン樹脂、ＣＴＵグアナミン樹脂、ベンゾグアナミン樹脂などの有機部材を好適に用いることができる。また、顔料や蛍光物質の粉末を用いることもできる。粒子は、光散乱剤として利用できる部材であることが好ましく、このような粒子を封止樹脂中に分散させて半導体発光素子の発光を散乱させることで、発光装置の色むらを改善できる。表示コントラストの低下抑制と光取り出し効率の両立のためには、粒子は、無着色の透光性部材であることが好ましい。   The particles are not particularly limited, but inorganic members such as silicon oxide (silica), titanium oxide, barium titanate, aluminum oxide, acrylic resin, urethane resin, melamine resin, CTU guanamine resin, benzoguanamine resin, etc. An organic member can be suitably used. A pigment or a fluorescent material powder may also be used. The particles are preferably a member that can be used as a light scattering agent, and the color unevenness of the light emitting device can be improved by dispersing such particles in the sealing resin to scatter light emitted from the semiconductor light emitting device. In order to achieve both suppression of a decrease in display contrast and light extraction efficiency, the particles are preferably a non-colored translucent member.

（暗色系の層）
暗色系の層は、例えばフッ素樹脂、アクリル樹脂、シリコーン樹脂、ウレタン樹脂等に暗色系の顔料を含有させることで形成できる。暗色系の顔料としては、例えばカーボンブラックを主成分とする無機顔料を用いることができる。カーボンブラックを主成分とする無機顔料は、染料などの有機顔料に比較して光劣化に対して優れた耐久性を有するため、劣化による色変化を最小限に抑えることができる。パッケージ本体を樹脂で構成する場合は、密着性の点から暗色系の層も樹脂で構成することが好ましく、例えば黒色樹脂を用いる。また、暗色系の層を形成する手段としては、スクリーン印刷など公知の方法を用いることができる。暗色系の層は、少なくともパッケージ本体の上面と封止樹脂を被覆する。パッケージ本体を白色樹脂のような暗色系の層より外来光に対する反射率の高い材料で形成する場合は、暗色系の層によってパッケージ本体の上面を完全に被覆することで、外来光の照り返しを低減できる。製造精度を考慮すると、暗色系の層は、パッケージ本体の上面より内側、つまりパッケージ本体の凹部上に位置する封止樹脂表面まで連続して形成することが好ましい。一方、光取り出し効率向上のためには、図１及び図２に示すように、発光装置の発光面となる凹部上の封止樹脂表面を除いた領域に暗色系の層を形成し、凹部上の封止樹脂表面を暗色系の層から露出させることが好ましい。暗色系の層の膜厚は、例えば１〜１０μｍの膜厚とすることができる。 (Dark color layer)
The dark color layer can be formed, for example, by adding a dark color pigment to a fluororesin, an acrylic resin, a silicone resin, a urethane resin, or the like. As the dark pigment, for example, an inorganic pigment mainly composed of carbon black can be used. An inorganic pigment containing carbon black as a main component has excellent durability against light deterioration as compared with organic pigments such as dyes, so that color change due to deterioration can be minimized. When the package body is made of resin, it is preferable that the dark color layer is also made of resin from the viewpoint of adhesion, for example, black resin is used. As a means for forming a dark color layer, a known method such as screen printing can be used. The dark color layer covers at least the upper surface of the package body and the sealing resin. When the package body is made of a material that has a higher reflectance to external light than a dark color layer such as a white resin, the reflection of external light is reduced by completely covering the upper surface of the package body with the dark color layer. it can. In consideration of manufacturing accuracy, the dark color layer is preferably formed continuously from the top surface of the package body to the inside of the package body, that is, the surface of the sealing resin located on the recess of the package body. On the other hand, in order to improve the light extraction efficiency, as shown in FIG. 1 and FIG. 2, a dark color layer is formed in the region excluding the sealing resin surface on the concave portion that becomes the light emitting surface of the light emitting device. It is preferable to expose the surface of the sealing resin from the dark color layer. The film thickness of the dark color layer can be set to, for example, 1 to 10 μm.

封止樹脂をパッケージ本体の上面にまで形成することで、図１に示すように、封止樹脂の周縁部が盛り上がってしまう。外来光が照射されると、この盛り上がり部周辺が特にギラついて見えるため、暗色系の層は、少なくとも封止樹脂の周縁部の盛り上がり部を含む領域に形成することが好ましい。これにより、発光装置上面のギラつきを効果的に軽減することができる。   By forming the sealing resin up to the upper surface of the package body, as shown in FIG. 1, the peripheral edge of the sealing resin rises. When extraneous light is irradiated, the periphery of the raised portion looks particularly glaring. Therefore, the dark color layer is preferably formed in a region including at least the raised portion of the peripheral portion of the sealing resin. Thereby, the glare on the upper surface of the light emitting device can be effectively reduced.

また、暗色系の層は、封止樹脂とパッケージ本体との境界を覆うように形成することが好ましい。これにより、封止樹脂とパッケージ本体の界面からの水分の浸入を防止でき、防湿性が向上された信頼性の高い発光装置とできる。防湿性をさらに高めるためには、暗色系の層の膜厚を厚くすることが好ましい。暗色系の層の膜厚は、例えば１０〜１００μｍとすることができる。また、パッケージ本体の上面まで封止樹脂が這い上がらない場合であっても、封止樹脂とパッケージ本体との境界を暗色系の層で覆うことで、水分の浸入を防止でき、発光装置の防湿性を向上できる。   The dark color layer is preferably formed so as to cover the boundary between the sealing resin and the package body. Accordingly, moisture can be prevented from entering from the interface between the sealing resin and the package body, and a highly reliable light-emitting device with improved moisture resistance can be obtained. In order to further improve the moisture resistance, it is preferable to increase the thickness of the dark color layer. The film thickness of the dark color layer can be set to 10 to 100 μm, for example. Even when the sealing resin does not crawl up to the top surface of the package body, the boundary between the sealing resin and the package body is covered with a dark color layer, so that moisture can be prevented from entering and the light emitting device can be prevented from moisture. Can be improved.

［実施の形態２］
図２に、本発明の実施の形態２に係る発光装置の模式的な断面図を示す。実施の形態２の発光装置は、パッケージ本体２１の上面２１ａに、下段部２２と上段部２３とを有する段差を備え、凹部から下段部２２にかけて封止樹脂４が形成されたこと以外は、実施の形態１の発光装置と同様である。下段部２２は封止樹脂４によって被覆され、上段部２３は封止樹脂４から露出しており、下段部２２から上段部２３にかけて暗色系の層５が形成されている。 [Embodiment 2]
FIG. 2 shows a schematic cross-sectional view of a light emitting device according to Embodiment 2 of the present invention. The light emitting device of the second embodiment is implemented except that the upper surface 21a of the package body 21 includes a step having a lower step portion 22 and an upper step portion 23, and the sealing resin 4 is formed from the concave portion to the lower step portion 22. This is the same as the light emitting device of the first embodiment. The lower step portion 22 is covered with the sealing resin 4, the upper step portion 23 is exposed from the sealing resin 4, and the dark-colored layer 5 is formed from the lower step portion 22 to the upper step portion 23.

下段部２２と上段部２３を設け、下段部２２内に封止樹脂４を形成することで、封止樹脂４の這い上がりが低減でき、容易に製造でき、歩留まりが向上できる。また、暗色系の層５によって封止樹脂とパッケージ本体の界面を被覆し、水分の浸入を防止することにより、経年劣化でパッケージ本体２１と封止樹脂４の剥離が発生した場合においても湿度が発光装置内に進入することを抑制する効果も期待できる。   By providing the lower step portion 22 and the upper step portion 23 and forming the sealing resin 4 in the lower step portion 22, creeping of the sealing resin 4 can be reduced, manufacturing can be facilitated, and the yield can be improved. Further, by covering the interface between the sealing resin and the package body with the dark color layer 5 and preventing the ingress of moisture, the humidity can be maintained even when the package body 21 and the sealing resin 4 are peeled off due to aging. An effect of suppressing entry into the light emitting device can also be expected.

下段部２２内に入り込んだ光は、暗色系の層５やパッケージ本体２１に吸収される傾向にあり、封止樹脂４の外部へ取り出され難い。このため、光取り出し効率の低下を抑制するためには、下段部２２に形成される封止樹脂４の膜厚は、上述の実施の形態１と同様の範囲とすることが好ましい。   Light that has entered the lower stage portion 22 tends to be absorbed by the dark-colored layer 5 and the package body 21, and is difficult to be taken out of the sealing resin 4. For this reason, in order to suppress a decrease in light extraction efficiency, it is preferable that the thickness of the sealing resin 4 formed in the lower step portion 22 is in the same range as in the first embodiment.

一方、製造精度を考慮すると、下段部２２と上段部２３との段差、下段部２２の深さは０．１〜０．５mｍ程度とすることが好ましい。下段部２２における封止樹脂４の膜厚は、下段部２２の深さの５０〜１００％程度とすることで、暗色系の層５を形成し易く、暗色系の層５との密着力を向上できる。封止樹脂４の這い上がりを防止するためには、封止樹脂４の膜厚を下段部２２の深さの９０％以下とすることが好ましい。   On the other hand, in consideration of manufacturing accuracy, it is preferable that the step between the lower step portion 22 and the upper step portion 23 and the depth of the lower step portion 22 be about 0.1 to 0.5 mm. The film thickness of the sealing resin 4 in the lower step portion 22 is about 50 to 100% of the depth of the lower step portion 22 so that the dark color layer 5 can be easily formed and the adhesion with the dark color layer 5 is improved. It can be improved. In order to prevent the sealing resin 4 from creeping up, the thickness of the sealing resin 4 is preferably 90% or less of the depth of the lower step portion 22.

［実施の形態３］
図３に、本発明の実施の形態３に係る発光装置の模式的な断面図を示す。実施の形態３の発光装置は、パッケージ本体３１の上面３１ａに溝３２を設ける以外は、実施の形態１の発光装置と同様である。 [Embodiment 3]
FIG. 3 shows a schematic cross-sectional view of a light-emitting device according to Embodiment 3 of the present invention. The light emitting device of the third embodiment is the same as the light emitting device of the first embodiment except that the groove 32 is provided on the upper surface 31a of the package body 31.

図３に示すように、パッケージ本体の上面に溝や孔を設けてもよい。上面に単数または複数の溝や孔を設けることで、溝や孔に封止樹脂を浸入させ、上面に封止樹脂を形成することができる。これによって、上面に暗色系の層を形成して封止樹脂とパッケージ本体の界面を被覆でき、水分の浸入を防止できる。また、溝や孔の大きさ、暗色系の層や封止樹脂の厚みを調整することで、暗色系の層の表面に溝や孔の形状に対応した凹凸構造を設けることもできる。   As shown in FIG. 3, grooves and holes may be provided on the upper surface of the package body. By providing one or a plurality of grooves or holes on the upper surface, the sealing resin can be infiltrated into the grooves or holes, and the sealing resin can be formed on the upper surface. As a result, a dark color layer can be formed on the upper surface to cover the interface between the sealing resin and the package body, and moisture can be prevented from entering. In addition, by adjusting the size of the groove or hole, and the thickness of the dark color layer or the sealing resin, it is possible to provide an uneven structure corresponding to the shape of the groove or hole on the surface of the dark color layer.

本発明に係る半導体装置は、広告、行き先案内や道路情報等の表示用、信号機の光源、小型乃至大型ディスプレイなどに用いられる発光装置に利用することができる。   The semiconductor device according to the present invention can be used for light emitting devices used for displaying advertisements, destination guidance, road information, etc., light sources for traffic lights, small to large displays, and the like.

１、２１、３１ パッケージ本体、１ａ、２１ａ、３１ａ パッケージ本体の上面
２ａ 第１リード端子、２ｂ 第２リード端子
３ 半導体発光素子
４ 封止樹脂
５ 暗色系の層
６ 金属ワイヤ
２２ 下段部、２３ 上段部
３２ 溝
４１ パッケージ本体
４２ａ、４２ｂ リード端子
４３ 半導体発光素子
４４ 金属ワイヤ
４５ 封止樹脂
４６ 暗色系の層
４７ 樹脂被覆部 1, 21, 31 Package body, 1a, 21a, 31a Upper surface 2a of package body 1st lead terminal, 2b 2nd lead terminal 3 Semiconductor light emitting element 4 Sealing resin 5 Dark color layer 6 Metal wire 22 Lower part, 23 Upper part Portion 32 Groove 41 Package body 42a, 42b Lead terminal 43 Semiconductor light emitting element 44 Metal wire 45 Sealing resin 46 Dark color layer 47 Resin coating portion

Claims (2)

凹部を有するパッケージ本体と、前記凹部の底面に実装された半導体発光素子と、前記半導体発光素子を被覆するように前記凹部内に充填された透光性の封止樹脂と、前記パッケージ本体の上面を被覆する黒色樹脂層と、を備え、
前記パッケージ本体の上面に溝又は孔を有し、
前記封止樹脂は、前記凹部から前記溝又は前記孔にかけて形成されており、
前記パッケージ本体の上面における前記溝又は前記孔より外側の領域は前記封止樹脂から露出しており、
前記黒色樹脂層は、前記パッケージ本体の上面において、前記溝又は前記孔より外側の領域と、前記封止樹脂とを覆い、かつ、前記凹部上の封止樹脂表面が、前記黒色樹脂層から露出した発光装置。 A package body having a recess; a semiconductor light emitting device mounted on a bottom surface of the recess; a translucent sealing resin filled in the recess so as to cover the semiconductor light emitting element; and an upper surface of the package body A black resin layer covering
A groove or hole on the upper surface of the package body,
The sealing resin is formed from the recess to the groove or the hole ,
The groove or outside of the area than the hole definitive on the upper surface of the package body is exposed from the sealing resin,
The black resin layer covers an area outside the groove or the hole and the sealing resin on the upper surface of the package body, and the sealing resin surface on the recess is exposed from the black resin layer. Light emitting device. 前記黒色樹脂層の膜厚は、１０〜１００μｍである請求項１に記載の発光装置。 The light emitting device according to claim 1 , wherein the black resin layer has a thickness of 10 to 100 μm .
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