JP5737063B2 - Bus bar module and power conversion device - Google Patents

Description

  The present invention relates to a bus bar module for connecting to a power terminal of a semiconductor module, and a power converter using the bus bar module.

  2. Description of the Related Art Conventionally, a bus bar module including a plurality of bus bars and a sealing member that seals a part of the bus bars is known as a component for electrically connecting a plurality of semiconductor modules used in, for example, a power converter. (See Patent Documents 1 and 2 below).

  FIG. 12 shows an example of a conventional bus bar module 9. The bus bar module 9 is used for an inverter 90 (power converter) having a plurality of semiconductor modules 95. The bus bar module 9 includes a plurality of bus bars 92 and a resin sealing member 93 that seals the plurality of bus bars 92.

  The bus bar 92 includes a sealed portion 922 sealed by the sealing member 93, an exposed portion 920 extending from the sealed portion 922 and exposed from the sealing member 93, and a terminal connection formed on the exposed portion 920. Unit 921 and an external connection unit 923 for connecting to an external device. The terminal connection portion 921 is connected to the power terminal 951 of the semiconductor module 95. The external connection unit 923 is used as an output terminal (U phase, V phase, W phase) of the inverter 90 and is connected to an AC load (not shown).

  The plurality of exposed portions 920 are arranged in parallel to each other. The extending direction (Y direction) of the exposed portion 920 and the longitudinal direction (X direction) of the sealing member 93 are orthogonal to each other.

  The sealed portion 922 is formed by bending. The plurality of bent sealed portions 922 overlap in the Y direction. As described above, by overlapping the plurality of sealed portions 922 in the Y direction, the interval between the sealed portions 922 is narrowed, and the parasitic inductance attached to the sealed portions 922 is reduced.

JP 2010-115061 A JP 2008-259398 A

  However, the conventional bus bar module 92 has a problem that since the plurality of bus bars 92 overlap in the Y direction, the thickness W of the sealing member 93 in the Y direction increases, and the weight of the bus bar module 92 tends to increase. It was. Therefore, a bus bar module that can be reduced in weight has been desired.

  The present invention has been made in view of such a background, and an object of the present invention is to provide a bus bar module that can be further reduced in weight and a power conversion device that uses the bus bar module.

One aspect of the present invention is a bus bar module for electrically connecting to a power terminal of a semiconductor module incorporating a semiconductor element,
The bus bar module includes a plurality of bus bars made of a conductor and a sealing member that seals a part of the bus bar and integrates them.
The bus bar is formed in the sealed portion sealed by the sealing member, an exposed portion extending from the sealed portion and exposed from the sealing member, and formed in the exposed portion and connected to the power terminal A terminal connection portion to be connected, and an external connection portion for connecting to an external device,
Each of the plurality of exposed portions extends in the same direction, and the extending direction of the exposed portions and the longitudinal direction of the sealing member are orthogonal to each other,
The sealed portion is bent, and a part of the sealed portion extends in the longitudinal direction,
The sealing member is a bus bar module configured to seal the plurality of bus bars so that the plurality of sealed portions do not overlap in the extending direction. ).

Another aspect of the present invention is a power converter using the bus bar module,
A laminated body in which a plurality of the semiconductor modules and a plurality of refrigerant flow paths through which a refrigerant for cooling the semiconductor modules flows;
A frame for fixing the laminate to the inside thereof,
The sealing member is fixed to the frame, and is in a power converter (claim 5).

The sealing member of the bus bar module seals the plurality of bus bars so that the plurality of sealed portions do not overlap with the extending direction (extending direction of the exposed portion).
If it does in this way, the length in the above-mentioned extension direction of a sealing member can be shortened. Therefore, the usage amount of the material (resin or the like) constituting the sealing member can be reduced, and the sealing member can be lightened. This makes it possible to reduce the weight of the bus bar module.

  Moreover, since the said power converter device uses the said bus-bar module, the weight of the whole power converter device can be made light. Furthermore, since the said power converter device has fixed the sealing member to the said flame | frame, it can fix a bus-bar module firmly. For this reason, even if vibrations or the like are transmitted from the outside, the bus bar module is less likely to wobble.

  As described above, according to the present invention, it is possible to provide a bus bar module that can be further reduced in weight and a power converter using the bus bar module.

The top view of the bus-bar module in Example 1. FIG. The top view of a laminated body and a frame in Example 1. FIG. The figure which attached the bus-bar module to the laminated body shown in FIG. The figure which attached the high voltage bus bar to the laminated body shown in FIG. The figure which attached the grounding bus bar to the laminated body shown in FIG. CC sectional drawing of FIG. AA sectional drawing of FIG. FIG. FIG. 3 is a perspective view of a sealed portion in the first embodiment. The circuit diagram of the power converter device in Example 1. FIG. The example which integrated the refrigerant | coolant flow path and the semiconductor module in Example 1. FIG. The top view of the bus-bar module in a prior art example.

In the bus bar module, the sealing member is formed with a pair of recesses recessed from opposite sides, a thin portion interposed between the pair of recesses, and side wall portions provided at both ends of the thin portion. Thus, it is preferable that an H-shaped portion having an H-shaped cross-section in a plane orthogonal to the longitudinal direction is formed (claim 2).
In this case, since the said recessed part is formed in the sealing member, the usage-amount of the material which comprises a sealing member can further be reduced, and a sealing member can be reduced in weight. Further, when the H-shaped portion is formed, the rigidity of the sealing member can be maintained at a certain level or more while reducing the amount of material used. That is, since the thin portion and the side wall portion in the H-shaped portion are orthogonal to each other, the side wall portion is difficult to bend in the direction in which the thin wall portion is easily bent (normal direction of the thin wall portion), and the side wall portion is easily bent ( The thin wall portion is less likely to bend in the normal direction of the side wall portion. Thus, since the thin part and the side wall part reinforce the direction in which it is easily bent, the overall rigidity can be increased.

Moreover, it is preferable that a reactor is connected to the said external connection part (Claim 3).
If the plurality of sealed portions are not stacked in the extending direction, the parasitic inductance attached to the sealed portion tends to increase. However, when a reactor is connected to the external connection portion, the inductance of the reactor is more parasitic. Since it is much larger than the inductance, the influence of the parasitic inductance on the electric circuit can be reduced.

In addition, an auxiliary sealing member arranged in parallel with the sealing member is provided, and the auxiliary sealing member is an end of the bus bar opposite to the side where the sealed portion is formed in the extending direction. It is preferable that the sealing member and the auxiliary sealing member are formed separately.
In this case, since the bus bar can be sealed by the sealing member and the auxiliary sealing member, the bus bar can be firmly held. Moreover, since the sealing member and the auxiliary sealing member are formed separately and there is no portion connecting them, the bus bar module can be reduced in weight.

Example 1
The Example which concerns on the said bus-bar module and a power converter device is described using FIGS.
As shown in FIG. 3, the bus bar module 1 of this example is used for electrical connection to a power terminal 51 of a semiconductor module 5 incorporating a semiconductor element. As shown in FIG. 1, the bus bar module 1 includes a plurality of bus bars 2 made of a conductor and a sealing member 3 that seals a part of the plurality of bus bars 2 and integrates them.
The bus bar 2 is formed on the sealed portion 22 sealed by the sealing member 3, the exposed portion 20 extending from the sealed portion 22 and exposed from the sealing member 3, and the exposed portion 20. The terminal connection part 21 connected to (refer FIG. 3) and the external connection part 23 for connecting with an external apparatus are provided.

The plurality of exposed portions 20 each extend in the same direction. The extending direction (Y direction) of the exposed portion 20 and the longitudinal direction (X direction) of the sealing member 3 are orthogonal to each other.
The portion to be sealed 3 is bent, and a portion (second portion 222 described later) of the portion to be sealed 22 extends in the longitudinal direction (X direction).
The sealing member 3 seals the plurality of bus bars 2 so that the plurality of sealed portions 22 do not overlap in the extending direction (Y direction).

  The bus bar module 1 includes an auxiliary sealing member 4 arranged in parallel with the sealing member 3. The auxiliary sealing member 4 seals the end of the bus bar 2 opposite to the side on which the sealed portion 22 is formed in the Y direction. The sealing member 3 and the auxiliary sealing member 4 are each made of an insulating resin.

  The exposed portion 20 has six terminal connection portions 21 (first terminal connection portion 21a to sixth terminal connection portion 21f) for connection to the power terminals 51 of the semiconductor module 5. The exposed portion 20 is plate-shaped, and the terminal connecting portion 21 is erected from the exposed portion 20 in the plate thickness direction (Z direction) of the exposed portion 20.

  Further, six through holes 24 (first through hole 24a to sixth through hole 24f) through which the power terminal 51 passes are formed through the exposed portion 20 in the Z direction. The first through hole 24a and the second through hole 24b are adjacent to each other in the X direction. The fifth through hole 24e and the sixth through hole 24f are also adjacent in the X direction. The second through hole 24b, the third through hole 24c, the fourth through hole 24d, and the sixth through hole 24f are adjacent to each other in the Y direction.

  The bus bar module 1 of this example is used in a power conversion device 10 (DC-DC converter) for mounting on a vehicle such as an electric vehicle or a hybrid vehicle. As shown in FIGS. 2 and 3, the power conversion device 10 includes a stacked body 11 in which a plurality of semiconductor modules 5 and a plurality of cooling pipes 60 are stacked, and a frame 7 that fixes the stacked body 11 to the inside thereof. . In the cooling pipe 60, a refrigerant flow path 6 through which the refrigerant 16 for cooling the semiconductor module 5 flows is formed.

  The sealing member 3 of the bus bar module 1 is formed with a bolt insertion hole 39 penetrating in the Z direction. The frame 7 has a plurality of screw holes 75 (see FIG. 2). The bus bar module 1 is fixed to the frame 7 by inserting a bolt 38 into the bolt insertion hole 39 and screwing it into the screw hole 75. Similarly, the auxiliary sealing member 4 is fixed to the frame 7 by bolts 38.

  As shown in FIGS. 1 and 7, the sealing member 3 and the auxiliary sealing member 4 are formed with a pair of recesses 30 (30a, 30b) that are recessed from opposite sides in the Z direction. An H shape in which the cross-sectional shape in a plane orthogonal to the X direction is H-shaped by the thin portion 31 interposed between the pair of concave portions 30a and 30b and the side wall portions 32 and 33 provided at both ends of the thin portion 31. A portion 34 is formed. The sealing member 3 and the auxiliary sealing member 4 have a plurality of H-shaped portions 34 formed therein.

  In this example, the pair of recesses 30a and 30b is formed so as to be recessed in the Z direction, but may be formed so as to be recessed in the Y direction.

  As shown in FIGS. 8 and 9, the sealed portion 22 includes a first portion 221 that continues to the exposed portion 20 and extends in the Y direction, and is erected from the first portion 221 in the Z direction and extends in the X direction. A second portion 222 and a third portion 223 extending from the second portion 222 in the Y direction are provided. The third portion 223 is connected to the external connection portion 23. The thickness direction of the second portion 222 is parallel to the Y direction. Further, the thickness direction of the third portion 223 is parallel to the X direction.

  The external connection part 23 is connected to the third part 223 and extends in the Y direction, the second extension part 232 extending in the X direction from the first extension part 231, and the second extension part 231. A disk-shaped part 233 attached to the extending part 232 and a cylindrical part 234 provided in the disk-shaped part 233 and projecting in the Y direction toward the sealing member 3 are provided. The cylindrical portion 234 and the disc-shaped portion 233 are formed with connection through holes 235 penetrating in the Y direction. A terminal of an external device (reactor L; see FIG. 10) is inserted into and connected to the through hole 235 for connection.

  Next, the power converter 10 will be described. As described above, the power conversion device 10 includes the stacked body 11 in which a plurality of semiconductor modules 5 (see FIG. 2) and a plurality of cooling pipes 60 are stacked. The power terminal 51 of the semiconductor module 5 includes an external connection terminal 51c connected to an external device (reactor L) via the bus bar 2, a ground terminal 51b grounded, and a high voltage terminal 51a to which a boosted voltage is applied. There is.

  As shown in FIG. 6, the semiconductor module 5 includes a plurality of control terminals 53. The control circuit board 19 is connected to the control terminal 53. The switching operation of the semiconductor module 5 is controlled by the control circuit board 19.

  As shown in FIG. 2, the two cooling pipes 60 adjacent in the X direction are connected by the connecting pipe 12 at both ends in the Y direction. Further, among the plurality of cooling pipes 60, a cooling pipe 60 a positioned at one end in the X direction is provided with an introduction pipe 13 for introducing the refrigerant 16 into the multilayer body 11, and for deriving the refrigerant 16 from the multilayer body 11. A lead-out pipe 14 is attached. When the refrigerant 16 is introduced from the introduction pipe 13, the refrigerant 16 flows through all the cooling pipes 60 through the connecting pipe 12 and is led out from the outlet pipe 14. Thereby, the semiconductor module 5 is cooled.

  Among the pair of wall portions 71 and 72 orthogonal to the X direction of the frame 7, an elastic member 15 (plate spring) is interposed between one wall portion 71 and the laminate 11. By this elastic member 15, the laminate 15 is pressed and fixed toward the other wall portion 72 (the wall portion on the side where the introduction pipe 13 and the outlet pipe 14 are provided).

  In this example, the elastic member 15 is provided between the one wall portion 71 and the laminate 11, but the elastic member 15 may be provided between the other wall portion 72 and the laminate 11. In this case, the laminate 11 is pressed toward the one wall portion 71.

  The semiconductor module 5 includes the upper arm semiconductor module 5a having the above-described high voltage terminal 51a and the lower arm semiconductor module 5b having the ground terminal 51b. As shown in FIG. 3, the three terminal connection portions 21 (first terminal connection portion 21a, second terminal connection portion 21b, and third terminal connection of the bus bar 2 are connected to the external connection terminals 51c of the three upper arm semiconductor modules 5a. Part 21c) is connected. Also, three terminal connection portions 21 (fourth terminal connection portion 21d, fifth terminal connection portion 21e, and sixth terminal connection portion 21f) of the bus bar 2 are connected to the external connection terminals 51c of the three lower arm semiconductor modules 5b. Connected.

  In this example, the main surface of the terminal connection portion 21 and the main surface of the external connection terminal 51c are overlapped with each other, and welding is performed to the end surface 210 (see FIG. 6) of the terminal connection portion 21 and the end surface 510 of the external connection terminal 51c. Thus, the terminal connection part 21 and the external connection terminal 51c are electrically connected.

  As described above, the bus bar 2 is formed with the six through holes 24 of the first through hole 24a to the sixth through hole 24f. As shown in FIG. 3, the two external connection terminals 51c of the upper arm semiconductor module 5a pass through the first through hole 24a and the second through hole 24b. Also, one high voltage terminal 51a of the upper arm semiconductor module 5a passes through the third through hole 24c, and one ground terminal 51b of the lower arm semiconductor module 5b passes through the fourth through hole 24d. . Further, the two external connection terminals 51c of the lower arm semiconductor module 5b pass through the fifth through hole 24e and the sixth through hole 24f.

As shown in FIG. 4, the high voltage bus bar 17 is connected to all the high voltage terminals 51a of the upper arm semiconductor module 5a. The high voltage bus bar 17 includes a plate-like main body 170 and a comb-like portion 171 provided on the plate-like main body 170. The comb-like portion 171 is welded to the high voltage terminal 51a. A plurality of through holes 172 are formed in the plate-like main body 170. The ground terminal 51 b of the lower arm semiconductor module 5 b passes through the through hole 172.
The high voltage bus bar 17 is fixed to the frame 7 via an insulator (not shown). The high voltage bus bar 17 has an output terminal 173 for outputting a boosted voltage.

As shown in FIG. 5, the ground bus bar 18 is connected to all the ground terminals 51b of the lower arm semiconductor module 5b. The ground bus bar 18 includes a plate-like main body portion 180 and a comb-like portion 181 provided on the plate-like main body portion 180. The comb-shaped portion 181 is welded to the ground terminal 51b.
The ground bus bar 18 is fixed to the frame 7 via an insulator (not shown). The ground bus bar 18 has an output terminal 183 for outputting a boosted voltage.

  As shown in FIG. 6, the external connection terminal 51c of the upper arm semiconductor module 5a and the external connection terminal 51c of the lower arm semiconductor module 5b have substantially the same length in the Z direction. The length of the high voltage terminal 51a in the Z direction is longer than the length of the external connection terminal 51c in the Z direction. The length of the ground terminal 51b in the Z direction is longer than the length of the high voltage terminal 51a in the Z direction.

  The high voltage terminal 51 a passes through the third through hole 24 c formed in the bus bar 2 and is connected to the comb-shaped portion 171 of the high voltage bus bar 17. The ground terminal 51 b passes through the fourth through hole 24 d formed in the bus bar 2 and the through hole 172 formed in the high voltage bus bar 17 and is connected to the comb-like portion 181 of the ground bus bar 18.

  Next, the electric circuit of the power converter 10 will be described. As shown in FIG. 10, the power conversion device 10 of this example constitutes a part of a DC-DC converter for boosting the voltage of the DC power supply 80. The power conversion device 10 includes an upper arm semiconductor element 52a sealed in the upper arm semiconductor module 5a and a lower arm semiconductor element 52b sealed in the lower arm semiconductor module 5b. A free wheel diode 59 is connected in reverse parallel to each semiconductor element 52. In this example, a DC-DC converter is configured by connecting external devices (smoothing capacitor C1, filter capacitor C2, reactors L1 to L3) to the upper arm semiconductor element 52a and the lower arm semiconductor element 52b.

  The power conversion device 10 includes nine upper arm semiconductor elements 52a and nine lower arm semiconductor elements 52b. The three upper arm semiconductor elements 52a and the three lower arm semiconductor elements 52b are combined to form one semiconductor element group 55. The semiconductor element group 55 includes a first semiconductor element group 55a connected to the first reactor L1, a second semiconductor element group 55b connected to the second reactor L2, and a third semiconductor connected to the third reactor L3. There is an element group 55c.

  The collector terminal of the upper arm semiconductor element 52a is the high voltage terminal 51a. The high voltage bus bar 17 is connected to the high voltage terminal 51a. The emitter terminal of the upper arm semiconductor element 52a and the collector terminal of the lower arm semiconductor element 52b serve as the external connection terminal 51c. The external connection terminal 51 c is connected to the bus bar 2. The bus bar 2 is connected to one terminal 81 of the reactor L. The emitter terminal of the lower arm semiconductor element 52b is the ground terminal 51b. The ground bus bar 18 is connected to the ground terminal 51b.

  A smoothing reactor C <b> 1 is connected between the high voltage bus bar 17 and the ground bus bar 18. The other terminal 82 of the reactor L is connected to the positive terminal 85 of the DC power supply 80 and one terminal 88 of the filter capacitor C2. The negative terminal 86 of the DC power supply 80 and the other terminal 89 of the filter capacitor C2 are connected to the ground bus bar 18.

  The control circuit board 19 (see FIG. 6) described above is connected to the gate terminal of the semiconductor element 52. The control circuit board 19 turns on and off the lower arm side semiconductor element 52b. As a result, the voltage of the DC power supply 80 is boosted. The boosted voltage is smoothed by the smoothing capacitor C1 and output from the output terminals 173 and 183.

  The control circuit board 19 turns on and off the lower arm side semiconductor elements 52b included in the three semiconductor element groups 55a to 55b, respectively, while shifting the phases. Thereby, the electric current which flows into each reactor L1-L3 can be decreased, and the size of a reactor can be made small.

  In this example, the output terminal 173 of the high voltage bus bar 17 and the output bus bar 183 of the ground bus bar 18 are each connected to an inverter (not shown). The boosted DC voltage is converted into an AC voltage by an inverter, and an AC load such as a three-phase AC motor is driven.

The effect of this example will be described. As shown in FIG. 1, the sealing member 3 of the bus bar module 1 in this example seals the plurality of bus bars 2 so that the plurality of sealed portions 22 do not overlap in the Y direction.
If it does in this way, the length in the Y direction of sealing member 3 can be shortened. Therefore, the amount of resin constituting the sealing member 3 can be reduced, and the sealing member 3 can be lightened. As a result, the bus bar module 1 can be reduced in weight.

  Further, in this example, the sealed portion 22 is bent. If it does in this way, the rigidity of the whole sealing member 3 including the to-be-sealed part 22 can be improved.

  Moreover, as shown in FIG. 7, the H-shaped part 34 is formed in the sealing member 3 of this example. If it does in this way, the quantity of resin which comprises the sealing member 3 can further be reduced by the recessed parts 30a and 30b, and the sealing member 3 can be reduced in weight. In addition, when the H-shaped portion 34 is formed, the rigidity of the sealing member 3 can be maintained at a certain level or more while reducing the amount of resin. That is, since the thin portion 31 and the side wall portions 32 and 33 are orthogonal to each other in the H-shaped portion 34, the side wall portion 32, 33 is difficult to bend, and the thin-walled portion 31 is less likely to bend in the direction in which the side walls 32 and 33 are easily bent (the normal direction of the side wall, that is, the Y direction). Thus, since the thin part 31 and the side wall parts 32 and 33 reinforce the direction which is easy to bend, it becomes possible to improve the whole rigidity.

As shown in FIGS. 1 and 9, the bus bar 2 includes an external connection portion 23. Reactors L <b> 1 to L <b> 3 (see FIG. 10) are connected to this external connection portion 23.
As described above, if the plurality of sealed portions 22 are not stacked in the Y direction, the parasitic inductance attached to the sealed portion 22 tends to increase. However, when a reactor is connected to the external connection portion 23, Since the inductance is much larger than the parasitic inductance, the influence of the parasitic inductance on the electric circuit can be reduced.

Further, as shown in FIG. 1, the bus bar module 1 of this example includes an auxiliary sealing member 4. The sealing member 3 and the auxiliary sealing member 4 are formed separately.
In this way, the bus bar 2 can be sealed by the sealing member 3 and the auxiliary sealing member 4, so that the bus bar 2 can be firmly held. Moreover, since the sealing member 3 and the auxiliary sealing member 4 are formed separately and there is no resin portion connecting them, the bus bar module 1 can be reduced in weight.

  Further, as shown in FIG. 5, the power conversion device 10 of this example uses the bus bar module 1. Therefore, the weight of the entire power conversion device 10 can be reduced. Furthermore, since the power conversion device 10 of this example fixes the sealing member 3 to the frame 7, the bus bar module 1 can be firmly fixed. Therefore, even if vibrations or the like are transmitted from the outside, the bus bar module 1 is less likely to wobble.

  As described above, according to this example, it is possible to provide a bus bar module that can be further reduced in weight and a power conversion device that uses the bus bar module.

  In addition, although the power converter device 1 of this example comprises the DC-DC converter, you may make it comprise the inverter for performing power conversion between DC voltage and AC voltage, for example. In this case, the reactors L1 to L3 are not connected to the external connection portion 23 (see FIG. 1), and an AC load such as a three-phase AC motor is connected.

  Moreover, in this example, although the laminated body 11 was comprised by laminating | stacking the some cooling pipe 60 which has the refrigerant | coolant flow path 6 inside, and the some semiconductor module 5, as shown in FIG. 11, the semiconductor element was incorporated. The semiconductor module 5 and the coolant channel 6 may be stacked by stacking the cooler integrated semiconductor module 500 integrally including the main body 58 and the frame 550 of the semiconductor module 5. The frame portion 550 of the cooler-integrated semiconductor module 500 has a larger width in the X direction than the main body portion 58. A space is provided between the frame portion 550 and the main body portion 58. This space becomes the refrigerant flow path 6.

DESCRIPTION OF SYMBOLS 1 Bus bar module 10 Power converter 2 Bus bar 20 Exposed part 21 Terminal connection part 22 Sealed part 23 External connection part 3 Sealing member 5 Semiconductor module 51 Power terminal

Claims (5)

A bus bar module for electrically connecting to a power terminal of a semiconductor module incorporating a semiconductor element,
The bus bar module includes a plurality of bus bars made of a conductor and a sealing member that seals a part of the bus bar and integrates them.
The bus bar is formed in the sealed portion sealed by the sealing member, an exposed portion extending from the sealed portion and exposed from the sealing member, and formed in the exposed portion and connected to the power terminal A terminal connection portion to be connected, and an external connection portion for connecting to an external device,
Each of the plurality of exposed portions extends in the same direction, and the extending direction of the exposed portions and the longitudinal direction of the sealing member are orthogonal to each other,
The sealed portion is bent, and a part of the sealed portion extends in the longitudinal direction,
The bus bar module, wherein the sealing member is configured to seal the plurality of bus bars so that the plurality of sealed portions do not overlap in the extending direction.   2. The bus bar module according to claim 1, wherein the sealing member is formed with a pair of recesses recessed from opposite sides, a thin portion interposed between the pair of recesses, and provided at both ends of the thin portion. A bus bar module in which an H-shaped portion having a H-shaped cross section in a plane orthogonal to the longitudinal direction is formed by the side wall portion formed.   The bus bar module according to claim 1, wherein a reactor is connected to the external connection portion.   The bus bar module according to any one of claims 1 to 3, further comprising an auxiliary sealing member arranged in parallel to the sealing member, wherein the auxiliary sealing member is in the extending direction of the bus bar. The bus bar module is characterized in that the end opposite to the side on which the sealed portion is formed is sealed, and the sealing member and the auxiliary sealing member are formed separately. . A power conversion device using the bus bar module according to any one of claims 1 to 4,
A laminated body in which a plurality of the semiconductor modules and a plurality of refrigerant flow paths through which a refrigerant for cooling the semiconductor modules flows;
A frame for fixing the laminate to the inside thereof,
The power conversion device, wherein the sealing member is fixed to the frame.

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