JP5710463B2 - Device for peeling mounted parts - Google Patents

Description

  The present invention relates to a mounting component peeling device, and more particularly to a mounting component peeling device for separating a mounting component mounted on a waste printed circuit board from a waste printed circuit board.

It is said that what is important in recycling the waste printed circuit board is separation (including removal of mounted parts) and separation.
However, waste printed circuit boards composed of metals, inorganic substances, synthetic resins, etc. are difficult to separate and separate, and so far, there are many methods such as a heat-melting method, a fine pulverizing method, and a method combining heating and pulverization. Has been proposed (see, for example, Patent Documents 1 to 6).

JP-A-2-88725 JP-A-6-228667 JP-A-6-256863 JP-A-6-296957 JP 7-75711 A Japanese Patent Laid-Open No. 11-76980

  The conventional method for treating a waste printed circuit board has a problem in that a lot of energy is used for the separation and a labor is required for the separation.

  In view of the problems of the above-described conventional waste printed circuit board processing method, the present invention can efficiently remove the mounting components mounted on the waste printed circuit board from the waste printed circuit board, It is an object of the present invention to provide a mounting component peeling apparatus that can efficiently separate mounted components.

In order to achieve the above object, a mounting component peeling apparatus according to the present invention is a mounting component peeling device for releasing a mounting component mounted on a waste printed circuit board from a waste printed circuit board. A rotary blade formed with a plurality of blade portions protruding to the surface, and at least a part of the peripheral surface of the rotary blade, and a hole diameter or a mesh width through which a mounting component does not pass, which forms an input port and a discharge port of a waste printed circuit board A casing made of a punching metal or grid screen , and a fixed blade arranged on the inner peripheral surface of the casing so as to protrude from the input port to the discharge port with a space therebetween.

  In this case, the blade portion of the rotary blade can be formed with different phases in the axial direction of the rotary blade.

  Further, the fixed blade can be arranged so that the protruding dimension of the fixed blade can be adjusted.

According to the mounting component peeling apparatus of the present invention, the waste printed circuit board loaded from the loading port moves between the rotating blade and the casing and is discharged from the discharge port when the rotating blade rotates. In addition, the mounting part mounted on the waste printed circuit board can be peeled off and removed from the waste printed circuit board by the blade portion formed on the rotary blade and the fixed blade provided on the casing.
In this case, since it is not necessary to perform the process under heating, the mounting component mounted on the waste printed circuit board can be separated from the waste printed circuit board with energy efficiency and the shape of the mounting component is maintained. Therefore, it is possible to efficiently separate the separated mounted parts.
The casing is made of a punched metal or grid screen having a hole diameter or mesh width through which the mounted component does not pass, so that the waste printed circuit board thrown from the slot can be rotated without being caught by the fixed blade. With a smooth and appropriate friction force applied to the gap between the casing and the casing, the mounting parts mounted on the waste printed circuit board can be peeled off and removed from the waste printed circuit board. It is possible to prevent the mounted component from being pulverized by smoothly discharging the detached mounted component.

  In addition, by forming the blade portion of the rotary blade with a different phase in the axial direction of the rotary blade, it is possible to make the peeling resistance uniform when scraping the mounted component, and it is mounted on the waste printed circuit board. It is possible to reduce the probability that the mounted component is discharged without being detached.

  In addition, by disposing the fixed blade so that the protruding dimension of the fixed blade can be adjusted, the waste printed circuit board thrown in from the insertion port is placed in the gap between the rotary blade and the casing without being caught by the fixed blade. Pulling in while applying a smooth and appropriate frictional force, it can be peeled off to ensure that the mounting components mounted on the waste printed circuit board are scraped off and removed from the waste printed circuit board. By adjusting the moving speed, it is possible to reduce the probability that the mounting component mounted on the waste printed circuit board is discharged without being detached.

It is explanatory drawing which shows one Example of the peeling apparatus of the mounting components of this invention. It is explanatory drawing of the rotary blade of the peeling apparatus of the same mounting component.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a mounting component peeling apparatus according to the present invention will be described below with reference to the drawings.

1 to 2 show an embodiment of a mounting component peeling apparatus of the present invention.
The mounting component peeling device is a mounting component peeling device for separating the mounting component W1 mounted on the waste printed circuit board W from the waste printed circuit board W, and includes a plurality of blades protruding on the peripheral surface. A rotary blade 1 in which the portion 11 is formed, a casing 2 that covers at least a part of the peripheral surface of the rotary blade 1 and that forms an inlet 21 and an outlet 22 of the waste printed circuit board W, and an inner peripheral surface of the casing 2 And a fixed blade 3 arranged so as to protrude from the insertion port 21 to the discharge port 22 with a gap therebetween.

In this case, the rotary blade 1 has a plurality of (six in this embodiment) disk-shaped blade bodies in which the blade portions 11 are formed at a plurality of locations (three in this embodiment at intervals of 120 °). 10, the phase of the blade part 11 of the adjacent blade body 10 is varied so that the phase of the blade part 11 changes in the axial direction of the rotary blade 1 (in this embodiment, the blade body 10 is moved by 15 °. It is configured to be fixed to the rotary shaft 12 so as to be integrated.
In this case, the blade body 10 may be configured integrally with the rotary blade 1, or may adopt a known blade body structure such as a chip-shaped blade body 10 configured to be detachable from the rotary blade 1.
Further, the width W0 of the blade body 10 can be set to about 1/10 to 1/3 (about 50 mm in this embodiment) of the width (about 50 to 400 mm) of the waste printed circuit board W to be inserted. preferable.
Further, the diameter of the blade body 10 is about 1/2 to 3 times (about 1000 mm in this embodiment) of the length (about 100 to 1000 mm) of the waste printed circuit board W to be inserted. The length in the axial direction is preferably set to about 1.1 to 3 times the width of the waste printed circuit board W to be introduced (in the present embodiment, about 1000 mm).
It should be noted that the number of blades 10, the location where the blades 11 are formed, and how to change the phase of the blades 11 (the angle at which the blades 10 are shifted, and the adjacent blades 10 are sequentially arranged at appropriate angles as in this embodiment. It is not limited to that of this embodiment.

In addition, the fixed blade 3 is continuously arranged along the axial direction of the rotary blade 1 so as to face the blade portion 11 of the rotary blade 1 (divided in the same manner as the rotary blade 1 and stepped. Can also be deployed.)
In this case, the interval L for disposing the fixed blade 3 is about 1/2 to 1/5 (about 400 mm in this embodiment) of the length (about 100 to 1000 mm) of the waste printed circuit board W to be inserted. It is preferable to set.
Further, the fixed blade 3 is attached to an appropriate location such as the casing 2 or the apparatus main body via an attachment (not shown) so that the protruding dimension H of the fixed blade 3 from the inner peripheral surface of the casing 2 can be adjusted. It is preferable to do.
In this case, the protruding dimension H of the fixed blade 3 is smaller than the thickness t (about 1 to 3 mm) of the waste printed circuit board W on which the mounting component W1 is mounted, and the blade portion 11 of the rotary blade 1 and the fixed blade 3 The gap c is preferably set to be slightly larger than the thickness t (in this embodiment, about 2 mm).

In the present embodiment, the casing 2 is composed of an inner casing 20a made of a screen (a punching metal having a hole diameter of about φ5 to 10 mm) and an outer casing 20b covering the outer periphery of the inner casing 20a.
In addition, the casing 2 can also be comprised by the grid-shaped screen of a vertical direction other than punching metal.
In this case, it is preferable to set the hole diameter and the mesh width of the screen constituting the inner casing 20a to such a size that the mounting component W1 mounted on the waste printed circuit board W does not pass through.

This mounted component peeling apparatus is configured such that the rotating blade 1 rotates the waste printed circuit board W input from the input port 21, whereby the clearance between the rotating blade 1 and the inner casing 20 a (and the fixed blade 3) of the casing 2. (The same applies hereinafter), the waste printed circuit board W is deformed into an arc shape along the inner wall of the inner casing 20a while being supported by the tip of the fixed blade 3, and the rotary blade 1 and the casing 2 are deformed. (At this time, the frictional resistance causes a relative speed difference between the rotational speed of the rotary blade 1 and the moving speed of the waste printed circuit board W. The magnitude of the frictional resistance is provided with the fixed blade 3. The distance L, the number of fixed blades 3 and the protruding dimension H, and the surface shape and curvature of the casing 2 can be adjusted.) While being discharged from the discharge port 22, the blade portion 11 formed on the rotary blade 1 and Arranged in casing 2 The fixed blade 3 that can be peeled off so as to scrape the mounting component W1 mounted on the waste printed circuit board W to be detached from the waste printed circuit board W.
In this case, since it is not necessary to perform the process under heating, the mounting component W1 mounted on the waste printed circuit board W can be separated from the waste printed circuit board W with high energy efficiency, and the mounting component W1 is shaped. Can be separated while holding, so that the separated mounted component W1 can be efficiently separated.

  Further, by forming the blade portion 11 of the rotary blade 1 with a phase different in the axial direction of the rotary blade 1, it is possible to equalize the peeling resistance when scraping the mounted component W <b> 1, and the waste printed circuit board The probability that the mounting component W1 mounted on W is discharged without being detached can be reduced.

  In addition, by disposing the fixed blade 3 so that the protruding dimension H of the fixed blade 3 can be adjusted, the waste printed circuit board W loaded from the loading port 21 is not caught by the fixed blade 3 and the rotary blade 1 is not caught. And pulling in the gap between the casing 2 and the casing 2 while applying a smooth and appropriate frictional force, and peeling off the mounting component W1 mounted on the waste printed circuit board W so as to surely scrape it away from the waste printed circuit board W. In addition, by adjusting the moving speed of the waste printed circuit board W, it is smoothly drawn into the gap between the rotary blade 1 and the casing 2 without being caught by the fixed blade 3, and is mounted on the waste printed circuit board W. W1 can be peeled off to ensure that it can be removed from the waste printed circuit board W, and the mounted component W1 mounted on the waste printed circuit board W is detached. It is possible to reduce the probability of being discharged without.

  Further, by forming the inner casing 20 a of the casing 2 from a screen, the waste printed circuit board W introduced from the insertion port 21 can be smoothly and appropriately placed in the gap between the rotary blade 1 and the casing 2 without being caught by the fixed blade 3. While pulling in while applying a frictional force, the mounting component W1 mounted on the waste printed circuit board W can be peeled off so as to be surely scraped off and separated from the waste printed circuit board W. It is possible to prevent the mounted component W1 from being crushed by being smoothly discharged.

More specifically, this mounting component peeling apparatus is used for the purpose of separating the mounting component W1 such as LSI, IC, tantalum capacitor, etc. mounted on the waste printed circuit board W from the waste printed circuit board W. In this case, it is used as follows.
The waste printed circuit boards W are normally loaded one by one so that the surface on which the mounting component W1 is mounted faces the rotary blade 1 from the loading slot 21.
In the case of this mounting component peeling device, the waste printed circuit board W is thrown in the reverse direction, or once it is passed through this mounting component peeling device, it is damaged or finely divided and the directionality is not fixed. The waste printed circuit board W can also be targeted. Even in this case, the mounted component can be peeled off without any trouble.

More specifically, the mounting component peeling apparatus has the following operations and effects.
1. The waste printed circuit board W is not pulverized to a small size, and the mounting component W1 such as an LSI, IC, or tantalum capacitor can be separated as a single component without being pulverized.
2. Since the waste printed circuit board W is small and not pulverized, the wear of the rotary blade 1 and the fixed blade 3 can be reduced.
3. Since the waste printed circuit board W is collected by itself, it is not necessary to separate the waste printed circuit board W, and can be easily recycled (mainly copper) at a low cost and at a high collection rate.
4). Since the mounted component W1 is detached and recovered as a single component (original shape and dimensions), it can be easily separated into groups by a vibration sieve or a specific gravity classifier, and it is easy, low cost, and has a high recovery rate. Can be recycled.

  The mounting component peeling apparatus according to the present invention has been described based on the embodiments thereof. However, the present invention is not limited to the configurations described in the above embodiments, and the configurations are appropriately set within the scope of the invention. Can be changed.

  The mounting component peeling apparatus of the present invention can efficiently separate the mounted components mounted on the waste printed circuit board from the waste printed circuit board, and can efficiently separate the separated mounted components. Since it can do, it can be used suitably for the use of the recycling of a waste printed circuit board.

DESCRIPTION OF SYMBOLS 1 Rotating blade 10 Blade 11 Blade part 12 Rotating shaft 2 Casing 20a Inner casing (screen)
20b Outer casing 21 Input port 22 Discharge port 3 Fixed blade W Waste printed circuit board W1 Mounted parts

Claims (3)

A mounting component peeling apparatus for separating a mounting component mounted on a waste printed circuit board from a waste printed circuit board, wherein the rotating blade has a plurality of blade portions protruding on a peripheral surface, and the rotating blade A casing made of a punched metal or grid screen having a hole diameter or a mesh width through which a mounting component does not pass, and which covers at least a part of the peripheral surface of the printed circuit board and forms an inlet and an outlet of a waste printed circuit board; A mounting component peeling apparatus comprising: a fixed blade provided on a peripheral surface so as to protrude from the input port to the discharge port with a gap therebetween.   2. The apparatus for peeling a mounted component according to claim 1, wherein the blade portion of the rotary blade is formed with a phase different in the axial direction of the rotary blade.   3. The mounting component peeling apparatus according to claim 1, wherein the fixed blade is arranged so that a protruding dimension of the fixed blade can be adjusted.

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