JP5685924B2 - Photoelectric composite substrate manufacturing method and optoelectric composite module manufacturing method - Google Patents

Description

  The present invention relates to a photoelectric composite substrate, a method for manufacturing a photoelectric composite module, and a photoelectric composite substrate and a photoelectric composite module obtained thereby.

  With the increase in information capacity, development of an optical interconnection technology that uses optical signals not only for communication fields such as trunk lines and access systems but also for information processing in routers and servers is underway. Specifically, in order to use light for short-distance signal transmission between boards in a router or a server device or in a board, an opto-electric composite board in which an optical transmission path is combined with an electric wiring board has been developed. As the optical transmission line, it is desirable to use an optical waveguide that has a higher degree of freedom of wiring and can be densified than an optical fiber, and among them, an optical waveguide that uses a polymer material that is excellent in processability and economy. Promising.

In the manufacture of this optoelectric composite substrate, it is necessary that the relationship between the position of the optical transmission path and the mounting position of the optical element is highly accurate. As such a technique, for example, Patent Document 1 discloses: A technique for forming a mounting groove pattern of an optical element and an electrode pattern or alignment marker that serves as a mark when mounting the optical element with the same photomask is disclosed. However, this method controls the positional relationship between the optical fiber and the optical element, and is not applicable to alignment between the position of the optical waveguide composed of the core and the clad and the mounting position of the optical element.
Patent Document 2 discloses a method of forming a core portion of an optical waveguide and a marker used as a reference point for positioning an optical element using the same mask. However, in this method, the alignment marker formed on the substrate may be displaced due to thermal history or the like due to various subsequent processes.
Further, Patent Document 3 discloses a method for measuring the amount of positional deviation of an optical waveguide from the positional relationship between a reference mark formed with the same mask as the electrode and a measurement reference mark formed with the same mask as the optical waveguide. Has been.

JP-A-10-170773 Japanese Patent Laid-Open No. 11-190811 JP2002-22414

  The present invention provides a method for manufacturing an opto-electric composite substrate and an opto-electric composite module including an inspection process capable of measuring the position of the optical waveguide with higher accuracy and efficiency than the manufacturing method described in Patent Document 3, and thereby An object is to provide a photoelectric composite substrate and a photoelectric composite module to be obtained.

As a result of intensive studies, the present inventors have a step of patterning the dummy core together with the core pattern, and a step of patterning the light shielding pattern in the vicinity of the projection area where the reflected light of the dummy core is projected together with the electrode pattern. The present inventors have found that the above problems can be solved by a manufacturing method, and have completed the present invention.
That is, the present invention
1. On the one surface of the substrate on which the lower clad is formed, a step (A) of patterning the dummy core together with the core pattern, a step (B) of forming a reflection mirror on the core pattern and the dummy core, and on the other surface of the substrate In addition to the electrode pattern, the step (C) of patterning the light shielding pattern in the vicinity of the projection area where the reflected light of the dummy core is projected by the reflecting mirror, and the core pattern based on the total luminance of the reflected light of the dummy core that has passed without being shielded And (D) a step of measuring the amount of positional deviation between the electrode pattern and the electrode pattern,
2. In the step (A), at least a dummy core a and a dummy core b are formed, and in the step (C), the projection area a on which the reflected light of the dummy core a is projected is in an arbitrary xy orthogonal coordinate system parallel to the substrate. In the step (D), the light shielding pattern a is formed on the positive direction side on the x axis, and the light shielding pattern b is formed on the negative direction side on the x axis of the projection region b where the reflected light of the dummy core b is projected. The method for producing an optoelectric composite substrate according to 1 above, wherein the amount of positional deviation in the x-axis direction is measured by comparing a difference in total luminance of reflected light of the dummy core a and the dummy core b that has passed without being shielded;
3. 3. The light according to 2 above, wherein in the step (C), the light shielding pattern a is provided so as to cover a part of the projection area a, and the light shielding pattern b is provided so as to cover a part of the projection area b. Electric composite substrate manufacturing method,
4). In the step (A), at least the dummy core c and the dummy core d are formed, and in the step (C), the positive direction on the y axis in the xy orthogonal coordinate system of the projection region c on which the reflected light of the dummy core c is projected The light shielding pattern c is formed on the side, and the light shielding pattern d is formed on the negative direction side on the y-axis of the projection area d on which the reflected light of the dummy core d is projected. The method for manufacturing an optoelectric composite substrate according to 2 or 3 above, wherein the amount of positional deviation in the y-axis direction is measured by comparing the difference in total luminance of reflected light between the dummy core c and the dummy core d,
5. In the step (A), at least a dummy core c is formed, and in the step (C), the projection area c on which the reflected light of the dummy core c is projected is on the y axis in an arbitrary xy orthogonal coordinate system parallel to the substrate. The light shielding pattern c-1 and the light shielding pattern c-2 are formed on the positive direction side and the negative direction side on the y axis, respectively, and the reflected light of the dummy core c that has passed without being shielded in the step (D). And the manufacturing method of the photoelectric composite substrate according to any one of the above 1 to 3, wherein the amount of positional deviation in the x-axis direction is measured by comparing a difference in total luminance of reflected light of the core pattern and / or dummy core,
6). 6. The method for producing an optoelectric composite substrate according to 5 above, wherein in the step (C), the light shielding pattern c-1 and the light shielding pattern c-2 are provided so as to be in contact with the projection region c,
7). In the step (D), the method for producing an optoelectric composite substrate according to any one of the above 1 to 6, wherein the displacement direction between the core pattern and the electrode pattern is also determined.
8). Furthermore, based on the measurement result of the said process (D), the manufacturing method of the photoelectric composite board | substrate in any one of said 1-7 also including the process (E) which sort | selects a photoelectric composite board | substrate,
9. Based on the measurement result of the positional deviation amount obtained in the step (D), the positional deviation amount is determined in advance in the step (E) of the photoelectric composite substrate manufactured by any one of the manufacturing methods 1 to 8 above. A method of manufacturing a photoelectric composite module, characterized in that a product larger than the above quantity is a defective product, and an optical element is mounted on the remaining photoelectric composite substrate,
10. 10. The photoelectric composite according to 9 above, wherein the mounting position of the optical element on the photoelectric composite substrate selected in the step (E) is corrected based on the positional deviation amount and the positional deviation direction obtained in the step (D). Module manufacturing method,
11. On one surface of the substrate on which the lower clad is formed, a dummy core is provided together with the core pattern, and on the other surface of the substrate, together with the electrode pattern, is in contact with the projection area where the reflected light of the dummy core is projected by the reflection mirror. Or a photoelectric composite substrate characterized by having a light-shielding pattern provided so as to cover a part of the projection region,
12 12. A photoelectric composite module obtained by mounting an optical element on the photoelectric composite substrate described in 11 above, and 13. The photoelectric composite module according to 12 above, which does not have an optical element on a projection region where the reflected light of the dummy core is projected.
Is to provide.

  According to the method for manufacturing an optoelectric composite substrate of the present invention, the position of the optical waveguide can be measured with high accuracy and efficiency.

It is a perspective view which shows an example of the photoelectric composite board | substrate manufactured by the manufacturing method of the optical waveguide of this invention. It is sectional drawing which shows the process (A) of the manufacturing method of the optical waveguide of this invention. It is sectional drawing which shows the process (B) of the manufacturing method of the optical waveguide of this invention. It is sectional drawing which shows the process (C) of the manufacturing method of the optical waveguide of this invention. It is sectional drawing which shows the process (D) of the manufacturing method of the optical waveguide of this invention. It is a top view which shows the state which provided the light-shielding pattern so that the one side of a projection area | region might be touched. It is a top view which shows the state in which the light shielding pattern was provided so that a part of projection area might be covered.

  The method for manufacturing an optoelectric composite substrate of the present invention includes a step (A) of patterning a dummy core together with a core pattern on one surface of a substrate on which a lower clad is formed, and a step of forming a reflection mirror on the core pattern and the dummy core. (B) and a step (C) of patterning a light-shielding pattern in the vicinity of the projection area where the reflected light of the dummy core is projected by the reflecting mirror together with the electrode pattern on the other surface of the substrate, and passed without being shielded And a step (D) of measuring a positional deviation amount between the core pattern and the electrode pattern based on the total luminance of the reflected light of the dummy core.

As shown in FIG. 1, an optoelectric composite substrate 20 manufactured according to the present invention has a dummy core 4 together with a core pattern 3 on one surface of a substrate 1 on which a lower cladding 2 is formed. In addition to the electrode pattern 5, a light shielding pattern 8 is provided in the vicinity of the projection area 7 where the reflected light of the dummy core is projected by the reflecting mirror 6. The light shielding pattern 8 is preferably provided so as to be in contact with the projection region 7 or to cover a part of the projection region 7.
The photoelectric composite substrate 20 may further have an upper clad 9 or the like as necessary, and may have an adhesive layer 10 between the substrate 1 and the lower clad 2.
Further, the optoelectric composite substrate 20 can be an optoelectric composite module by mounting an optical element. Since the dummy core is used to measure the amount of misalignment between the core pattern and the electrode pattern, it is preferable not to mount an optical element.

<Process (A)>
In the step (A), the dummy core 4 is patterned together with the core pattern 3 on one surface of the substrate 1 on which the lower cladding 2 is formed (see FIG. 2).
The formation method of the lower clad 2 is not particularly limited, and may be a known method. For example, a material for forming the lower clad 2 is applied onto the substrate 1 by spin coating, prebaked, and then irradiated with ultraviolet rays. It can be formed by curing the thin film. Also, the method for forming the core pattern 3 is not particularly limited. For example, the core pattern 3 having a higher refractive index than the lower clad 2 may be formed on the lower clad 2 and the core pattern 3 may be formed by etching.
An upper clad 9 may be provided on the core pattern 3 as necessary. However, the method of forming the upper clad 9 is not particularly limited, and may be formed by the same method as the lower clad 2, for example.
From the viewpoint of adhesion to the core pattern 3, the lower clad 2 is preferably flat without a step on the surface on the core pattern 3 lamination side. Moreover, the surface flatness of the lower clad 2 is securable by using the resin film for clad formation.
Further, when the adhesive force between the substrate 1 and the lower cladding 2 is insufficient, an adhesive layer 10 may be sandwiched between the substrate 1 and the lower cladding 2.

(substrate)
The substrate 1 used in the present invention is not particularly limited, and various substrates used for photoelectric composite substrates can be used. For example, a glass epoxy resin substrate, a ceramic substrate, a glass substrate, a silicon substrate, Examples thereof include a plastic substrate, a metal substrate, a substrate with a resin layer, a substrate with a metal layer, a plastic film, a plastic film with a resin layer, and a plastic film with a metal layer.
The substrate 1 may be a flexible optical fiber connector by using a base material having flexibility and toughness, for example, a carrier film of a clad forming resin film and a core layer forming resin film, which will be described later, as the substrate.

(Lower cladding and upper cladding)
Hereinafter, the lower clad 2 and the upper clad 9 (hereinafter sometimes abbreviated as “clad layer”) in the present invention will be described. For forming the cladding layer, a cladding layer forming resin or a cladding layer forming resin film can be used.

  The clad layer forming resin used in the present invention may be a resin composition that has a lower refractive index than the core pattern 3 and the dummy core 4 (hereinafter sometimes abbreviated as “core layer”) and is cured by light or heat. If it is not specifically limited, a thermosetting resin composition and a photosensitive resin composition can be used conveniently. More preferably, the clad layer forming resin is preferably composed of a resin composition containing (A) a base polymer, (B) a photopolymerizable compound, and (C) a photopolymerization initiator. The resin composition used for the clad forming resin may have the same or different components contained in the resin composition in the lower clad 2 and the upper clad 9, and the refractive index of the resin composition may be different. They may be the same or different.

  The (A) base polymer used here is for forming a clad and ensuring the strength of the clad, and is not particularly limited as long as the object can be achieved. Phenoxy resin, epoxy resin, (meta ) Acrylic resin, polycarbonate resin, polyarylate resin, polyether amide, polyether imide, polyether sulfone, etc., or derivatives thereof. These base polymers may be used alone or in combination of two or more. Of the base polymers exemplified above, from the viewpoint of high heat resistance, the main chain preferably has an aromatic skeleton, and particularly preferably a phenoxy resin. From the viewpoint of three-dimensional crosslinking and improving heat resistance, an epoxy resin, particularly an epoxy resin that is solid at room temperature is preferable. Further, compatibility with the photopolymerizable compound (B) described in detail later is important for ensuring the transparency of the resin for forming the cladding layer. From this point, the phenoxy resin and the (meth) acrylic resin are used. Is preferred. Here, (meth) acrylic resin means acrylic resin and methacrylic resin.

  Among phenoxy resins, those containing bisphenol A, bisphenol A type epoxy compounds or derivatives thereof, and bisphenol F, bisphenol F type epoxy compounds or derivatives thereof as a constituent unit of the copolymer component are heat resistant, adhesive and soluble. It is preferable because of its excellent properties. Preferred examples of the bisphenol A or bisphenol A type epoxy compound include tetrabromobisphenol A and tetrabromobisphenol A type epoxy compounds. Moreover, as a derivative of bisphenol F or a bisphenol F-type epoxy compound, tetrabromobisphenol F, a tetrabromobisphenol F-type epoxy compound, etc. are mentioned suitably. Specific examples of the bisphenol A / bisphenol F copolymer type phenoxy resin include “Phenotote YP-70” (trade name) manufactured by Toto Kasei Co., Ltd.

  Examples of the epoxy resin that is solid at room temperature include, for example, “Epototo YD-7020, Epototo YD-7019, Epototo YD-7007” (all trade names) manufactured by Toto Chemical Co., Ltd., and “Epicoat 1010” manufactured by Japan Epoxy Resins Co., Ltd. Bisphenol A type epoxy resin such as “Epicoat 1009, Epicoat 1008” (both trade names).

Next, (B) the photopolymerizable compound is not particularly limited as long as it is polymerized by irradiation with light such as ultraviolet rays, and the compound having an ethylenically unsaturated group in the molecule or two or more in the molecule. Examples thereof include compounds having an epoxy group.
Examples of the compound having an ethylenically unsaturated group in the molecule include (meth) acrylate, vinylidene halide, vinyl ether, vinyl pyridine, vinyl phenol, etc., among these, from the viewpoint of transparency and heat resistance, (Meth) acrylate is preferred.
As the (meth) acrylate, any of monofunctional, bifunctional, trifunctional or higher polyfunctional ones can be used. Here, (meth) acrylate means acrylate and methacrylate.
Examples of the compound having two or more epoxy groups in the molecule include bifunctional or polyfunctional aromatic glycidyl ethers such as bisphenol A type epoxy resins, bifunctional or polyfunctional aliphatic glycidyl ethers such as polyethylene glycol type epoxy resins, and water. Bifunctional alicyclic glycidyl ether such as bisphenol A type epoxy resin, bifunctional aromatic glycidyl ester such as diglycidyl phthalate, bifunctional alicyclic glycidyl ester such as tetrahydrophthalic acid diglycidyl ester, N, N- Bifunctional or polyfunctional aromatic glycidylamine such as diglycidylaniline, bifunctional alicyclic epoxy resin such as alicyclic diepoxycarboxylate, bifunctional heterocyclic epoxy resin, polyfunctional heterocyclic epoxy resin, bifunctional Or polyfunctional silicon-containing epoxy resin It is. These (B) photopolymerizable compounds can be used alone or in combination of two or more.

  Next, the photopolymerization initiator of component (C) is not particularly limited. For example, as an initiator when an epoxy compound is used as component (B), aryldiazonium salt, diaryliodonium salt, triarylsulfonium salt, triallyl Examples include selenonium salts, dialkylphenazylsulfonium salts, dialkyl-4-hydroxyphenylsulfonium salts, and sulfonate esters. When a luminescent photopolymerization initiator is used, a luminescent cladding layer can be obtained.

Moreover, as an initiator in the case of using a compound having an ethylenically unsaturated group in the molecule as the component (B), aromatic ketones such as benzophenone, quinones such as 2-ethylanthraquinone, benzoin ethers such as benzoin methyl ether Compounds, benzoin compounds such as benzoin, benzyl derivatives such as benzyldimethyl ketal, 2,4,5-triarylimidazole dimers such as 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- Benzimidazoles such as mercaptobenzimidazole, phosphine oxides such as bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, acridine derivatives such as 9-phenylacridine, N-phenylglycine, N-phenylglycine derivatives , Coumarin compound And the like. Moreover, you may combine a thioxanthone type compound and a tertiary amine compound like the combination of diethyl thioxanthone and dimethylaminobenzoic acid. Of the above compounds, aromatic ketones and phosphine oxides are preferable from the viewpoint of improving the transparency of the cladding layer.
These (C) photopolymerization initiators can be used alone or in combination of two or more.

(A) It is preferable that the compounding quantity of a base polymer shall be 5-80 mass% with respect to the total amount of (A) component and (B) component. Moreover, it is preferable that the compounding quantity of (B) photopolymerizable compound shall be 95-20 mass% with respect to the total amount of (A) and (B) component.
As a blending amount of the component (A) and the component (B), when the component (A) is 5% by mass or more and the component (B) is 95% by mass or less, the resin composition is easily formed into a film. Can do. On the other hand, when the (A) component is 80% by mass or less and the (B) component is 20% by mass or more, the (A) base polymer can be easily entangled and cured, and the core layer is formed. The pattern forming property is improved and the photocuring reaction proceeds sufficiently. From the above viewpoint, the blending amount of the component (A) and the component (B) is more preferably 10 to 85% by mass of the component (A) and 90 to 15% by mass of the component (B), and 20 to 70 of the component (A). More preferably, the content is 80% by mass and the component (B) is 80 to 30% by mass.
(C) It is preferable that the compounding quantity of a photoinitiator shall be 0.1-10 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component. When the blending amount is 0.1 parts by mass or more, the photosensitivity is sufficient, while when it is 10 parts by mass or less, the absorption in the surface layer of the photosensitive resin composition does not increase during exposure, and the internal Is sufficiently cured. Furthermore, when used as a core layer to be described later, it is preferable that the light propagation loss does not increase due to the light absorption effect of the polymerization initiator itself. From the above viewpoint, the blending amount of the (C) photopolymerization initiator is more preferably 0.2 to 5 parts by mass.
In addition, if necessary, in the cladding layer forming resin, an antioxidant, an anti-yellowing agent, an ultraviolet absorber, a visible light absorber, a colorant, a plasticizer, a stabilizer, a filler, etc. You may add what is called an additive in the ratio which does not have a bad influence on the effect of this invention. Further, if the additive has luminescent properties, a luminescent cladding layer can also be obtained.

In the present invention, the method for forming the clad layer is not particularly limited. For example, the clad layer may be formed by applying a clad layer forming resin or laminating a clad layer forming resin film.
In the case of application, the method is not limited. For example, the resin composition containing the components (A) to (C) may be applied by a conventional method.
Moreover, the resin film for clad layer formation used for a lamination can be easily manufactured by melt | dissolving the said resin composition in a solvent, apply | coating to a carrier film, and removing a solvent, for example.

The carrier film used in the production process of the resin film for forming the clad layer is not particularly limited in terms of material, but for example, an FR-4 substrate, a polyimide substrate, a semiconductor substrate, a silicon substrate, a glass substrate, or the like is used. It may be a flexible material with flexibility or a non-flexible hard material.
Further, by using a flexible material for the carrier film, flexibility can be imparted to the photoelectric composite substrate 20. The material of the material having flexibility is not particularly limited, but from the viewpoint of having flexibility and toughness, polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyethylene, polypropylene, polyamide, polycarbonate, Preferable examples include polyphenylene ether, polyether sulfide, polyarylate, liquid crystal polymer, polysulfone, polyether sulfone, polyether ether ketone, polyether imide, polyamide imide, and polyimide.
The thickness of the carrier film may be appropriately changed depending on the intended flexibility, but is preferably 5 to 250 μm. If it is 5 μm or more, there is an advantage that toughness is easily obtained, and if it is 250 μm or less, sufficient flexibility can be obtained.
The solvent used here is not particularly limited as long as it can dissolve the resin composition. For example, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylacetamide, propylene glycol monomethyl ether, A solvent such as propylene glycol monomethyl ether acetate, cyclohexanone, N-methyl-2-pyrrolidone, or a mixed solvent thereof can be used. The solid content concentration in the resin solution is preferably about 30 to 80% by mass.

  Regarding the thickness of the cladding layer, the thickness after drying is preferably in the range of 5 to 500 μm. When the thickness is 5 μm or more, a thickness necessary for light confinement can be secured, and when the thickness is 500 μm or less, the film thickness can be easily controlled uniformly. From the above viewpoint, the thickness of the cladding layer is more preferably in the range of 10 to 100 μm.

  The thickness of the clad layer may be the same or different in the lower clad 2 formed first and the upper clad 9 for embedding the core layer. The thickness 9 is preferably larger than the thickness of the core layer.

(Core pattern and dummy core)
In the present invention, the method for forming the core layer laminated on the lower clad 2 is not particularly limited. For example, the core layer may be formed by coating a core layer forming resin or laminating a core layer forming resin film. The core pattern 3 and the dummy core 4 are formed with the same mask.
As the resin for forming the core layer, a resin composition that is designed so that the core layer has a higher refractive index than that of the clad layer, and can form the core layer with actinic rays, and the emission wavelength from the lower clad 2 can be used. A resin for core layer formation containing a photopolymerization initiator that initiates polymerization with a light emission wavelength from the lower clad 2 or a photosensitive resin composition that is cured by the above is suitable. Specifically, it is preferable to use the same resin composition as that used in the clad layer forming resin.
In the case of application, the method is not limited, and the resin composition may be applied by a conventional method.

Hereinafter, the resin film for core formation used for lamination will be described in detail.
The resin film for forming a core layer can be easily produced by dissolving the resin composition in a solvent, applying the resin composition on a carrier film, and removing the solvent. The solvent used here is not particularly limited as long as it can dissolve the resin composition. For example, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, N, N-dimethyl A solvent such as acetamide, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, cyclohexanone, N-methyl-2-pyrrolidone, or a mixed solvent thereof can be used. It is preferable that the solid content concentration in the resin solution is usually 30 to 80% by mass.

  The thickness of the resin film for forming the core layer is not particularly limited, and the thickness of the core layer after drying is usually adjusted to be 10 to 100 μm. If the thickness of the film is 10 μm or more, there is an advantage that the alignment tolerance can be increased in the coupling with the light emitting / receiving element or the optical fiber after the optical waveguide is formed. In coupling with an element or an optical fiber, there is an advantage that coupling efficiency is improved. From the above viewpoint, the thickness of the film is preferably in the range of 30 to 70 μm.

The carrier film used in the production process of the core layer forming resin is a carrier film that supports the core layer forming resin, and the material thereof is not particularly limited, but the film material described above in the item of (carrier film) is preferable. It is mentioned in. Moreover, polyesters, such as a polyethylene terephthalate, a polypropylene, polyethylene, etc. are mentioned suitably from the viewpoint that it is easy to peel resin for core layer formation, and has heat resistance and solvent resistance.
The thickness of the carrier film is preferably 5 to 50 μm. When it is 5 μm or more, there is an advantage that the strength as a carrier film is easily obtained, and when it is 50 μm or less, there is an advantage that a gap with the mask at the time of pattern formation becomes small and a finer pattern can be formed. From the above viewpoint, the thickness of the carrier film is more preferably in the range of 10 to 40 μm, and particularly preferably 15 to 30 μm.

  In the manufacturing method of the present invention, a photoelectric composite substrate having a multilayer structure may be manufactured by laminating a plurality of core layers and cladding layers.

(Adhesive layer)
As described above, in the manufacturing method according to the present invention, the adhesive layer 10 can be provided as necessary. For example, in order to ensure the adhesive force between the substrate 1 and the lower cladding 2, the substrate 1 and the lower cladding are used. 2 can be introduced. Although it does not specifically limit as a kind of adhesive layer 10, Various adhesives used for a double-sided tape, UV or a thermosetting adhesive, a prepreg, a buildup material, and an electrical wiring board manufacture use are mentioned suitably.
In addition, an adhesive or adhesive film having a high transmittance is required for adhesion of a portion through which an optical signal is transmitted, and the material of the adhesive or adhesive film is not particularly limited. It is more preferable to use a resin material for layer formation or an adhesive film described in (PCT / JP2008 / 05465).
Although the method for forming the adhesive layer 10 is not particularly limited, a resin for forming the adhesive layer 10 may be applied to the substrate 1 or the optical waveguide by spin coating or the like, and the adhesive layer 10 processed into a film shape in advance. May be bonded with a laminator or the like.
Although the thickness of the contact bonding layer 10 is not specifically limited, It is preferable that they are 0.1 micrometer-3.0 mm, and it is more preferable that they are 1 micrometer-100 micrometers. This is because a sufficient adhesive force between the substrate 1 and the lower clad 2 or the optical waveguide can be expected when the thickness is 1 μm or more, and a thin photoelectric composite substrate 20 can be obtained when the thickness is 100 μm or less.

<Process (B)>
In the step (B), the reflection mirror 6 is formed on the core pattern 3 and the dummy core 4 (see FIG. 3).
The reflection mirror 6 reaches the core layer and can be formed by providing a notch having a hypotenuse. The formation method of a notch part is not specifically limited, For example, the method of forming using a dicing saw should just be used.
Further, from the viewpoint of use as an optical path conversion mirror, the angle of the hypotenuse of the reflection mirror 6 formed by the notch is preferably about 45 degrees. Further, a total reflection metal layer such as gold, silver, or copper may be provided on the mirror reflection portion. In this case, it is better to fill the notch with resin or metal.

<Process (C)>
In the step (C), a light shielding pattern is formed in the vicinity of the projection area 7 where the reflected light of the dummy core 4 is projected together with the electrode pattern 5 on the surface of the substrate 1 where the lower clad 2 is not formed. 8 is patterned (see FIG. 4). This step (C) may be performed after the above steps (A) and (B), but may be performed before these steps.
As a method for forming the electrode pattern 5 and the light shielding pattern 8, the copper layer laminated on the substrate 1 can be formed by an ordinary method such as etching, and the formation method is not limited. These thicknesses are preferably 5 to 25 μm, and more preferably 5 to 12 μm.

(Shading pattern)
The light-shielding pattern 8 is formed with the same mask as the electrode pattern 5 and is provided in the vicinity of the projection area 7 on which the reflected light of the dummy core 4 is projected by the reflection mirror 6, preferably so as to be in contact with the projection area 7 or The projection area 7 may be partially covered. Further, when a plurality of dummy cores 4 are provided, the light shielding pattern 8 may be provided in the vicinity of any one or more of the plurality of projection regions 7 corresponding thereto, and in the vicinity of each projection region 7, respectively. One by one may be provided.
The shape of the light shielding pattern 8 is the brightness of the reflected light of the dummy core 4 in accordance with the amount of positional deviation between the core layer, the electrode pattern 5 and the light shielding pattern 8 (hereinafter sometimes abbreviated as “electrode / light shielding pattern”). The shape is not particularly limited as long as the total amount changes, but at least the projection region side is preferably a substantially straight shape, more preferably a substantially rectangular shape.

<Process (D)>
In step (D), the amount of misalignment between the core pattern 3 and the electrode pattern 5 is measured based on the total amount of reflected light of the dummy core 4 that has passed without being shielded (see FIG. 5).
The method of measuring the total luminance in this step is not particularly limited, but can be performed as follows, for example.
(Measurement method of total luminance)
When the maximum sensitivity of a CCD (Charge Coupled Device Image Sensor) is 850 nm, the transmission wavelength of the optical waveguide is preferably 850 nm. The luminance value of each pixel obtained from the CCD is output as a current value, and is generally represented by 0 to 255 for 8-bit decomposition. In determining the zero point, by attaching a cap to the tip of the magnifying lens attached to the CCD, measuring the dark current value and resetting it to zero, the dynamic range is expanded and the luminance sensitivity is increased. With respect to the luminance value of each pixel obtained in this way, a threshold value is set to determine transmission / light shielding, and the total number of pixels determined to be transmission is set as the total luminance.

Hereinafter, the method for providing the light shielding pattern 8 in the step (C) and the method for obtaining the positional deviation amount (and the positional deviation direction) in the step (D) will be described in detail with specific examples.
As the simplest mode of providing the light shielding pattern 8, there is a method of providing one light shielding pattern a so as to be in contact with one dummy core a (see FIG. 6). For example, when the cross section of the dummy core a is a square of 50 μm × 50 μm, the projected area a of the reflected light is also a square of 50 μm × 50 μm, but one side of the square (assuming any arbitrary parallel to the substrate 1) The photoelectric composite substrate 20 is continuously produced by providing the light shielding pattern a so as to be in contact with the side in the positive direction on the x axis in the xy orthogonal coordinate system. Of the photoelectric composite substrate 20 continuously produced in this way, for example, the one in which the core layer is displaced with a width of 10 μm relative to the positive direction of x with respect to the electrode / light-shielding pattern is the projection region. The positive direction side on the x axis of a is covered with the light shielding pattern a with a width of 10 μm, and the reflected light corresponding to 20% of the projection area a is shielded by the light shielding pattern a, so that the total luminance of the reflected light becomes 80%. Decrease. On the other hand, when the cross section of any core (reference core) of the core pattern 3 is 50 μm × 50 μm, the total luminance of the reflected light is the total luminance (100%) of the reflected light of the dummy core a before being shielded. Equivalent to. Therefore, when the total luminance of the reflected light of the dummy core a is 80% of the total luminance of the reflected light of the reference core, it can be said that the core layer is shifted by 10 μm on the positive direction side on the x axis. In this way, by comparing the total luminance of the reflected light of the dummy core a and the reference core that passed without being shielded, the positive values on the x-axis of the core layer (that is, the core pattern 3 and the electrode pattern 5) are positive. A relative displacement amount in the direction can be measured.

Further, in addition to the dummy core a, a dummy core b may be provided in the same manner, and the light shielding pattern b may be provided so as to be in contact with the negative side on the x axis of the projection region b. In this aspect, when the core layer and the electrode / light-shielding pattern are not displaced in the x-axis direction, the total amount of reflected light from the dummy core a and the total amount of reflected light from the dummy core b are the same. When the core layer is shifted by 10 μm in the positive direction on the x-axis, the total amount of reflected light from the dummy core a is 80% as described above, but the total amount of reflected light from the dummy core b is 100%. Since the total brightness of the reflected light of the dummy core a and the dummy core b that has passed without being shielded is compared with each other, the relative positional deviation amount in the positive direction on the x-axis of the core layer can be obtained. it can. Further, when the core layer is shifted to the negative direction side on the x-axis, contrary to the above, the total amount of reflected light of the dummy core b that passes without being shielded decreases, so that the core layer does not move on the x-axis. Even when the position is displaced in the direction, the amount of displacement and the direction of displacement can be measured simultaneously.
In this case, the comparison with the total luminance of the reflected light of the reference core is not always necessary.

Further, the dummy core c and the dummy core d are provided in the same manner as the dummy core a and the dummy core b, and the projection area c on which the reflected light of the dummy core c is projected is on the y axis in the xy orthogonal coordinate system. The light shielding pattern c is formed on the positive direction side, and the light shielding pattern d is formed on the negative direction side on the y axis of the projection area d where the reflected light of the dummy core d is projected. It is also possible to measure the amount of positional deviation in the y-axis direction by comparing the difference in the total amount of reflected light of d.
Also, a dummy core c is provided, and the light shielding pattern c-1 is brought into contact with the positive side on the y axis of the projection region c, and the light shielding pattern c-2 is brought into contact with the negative side on the y axis. , Each can also be formed. In this aspect, when the core layer and the electrode / light-shielding pattern are not misaligned in the y-axis direction, the total amount of reflected light of the dummy core c and the dummy core a and the dummy core b are not shielded. When the total luminance of reflected light or the total luminance of reflected light of the reference core is the same, but the core layer is shifted by 10 μm in the positive or negative direction on the y-axis, the same as above The total luminance of the reflected light of the dummy core c is 80%, but the luminance of the reflected light of the dummy core a and the dummy core b that is not shielded or the reflected light of the reference core remains 100%. By comparing the total brightness of the reflected light of the dummy core c that has passed without being reflected and the reflected light of the dummy core a, the dummy core b, or the reference core, the relative positional shift of the core layer on the y-axis It can be obtained in the absolute value.
In this case, the total amount of reflected light of the dummy core c may be compared with the total amount of reflected light of either the dummy core 4 or the reference core.

As described above, the light-shielding pattern 8 can be provided so as to be in contact with the projection region 7. However, as shown in FIG. Therefore, it is preferable.
For example, in the aspect in which the dummy core a and the dummy core b are provided as described above, and the light shielding pattern a and the light shielding pattern b are provided so as to cover the projection area a and the projection area b with a width of 15 μm, respectively, the core layer is on the x axis. When shifted by 10 μm in the forward direction, the projection area a is covered by the light shielding pattern a with a width of 25 μm, and 50% of the reflected light of the projection area a is shielded by the light shielding pattern a and passes without being shielded. The total luminance of the reflected light is 50% of the total luminance before being blocked. On the other hand, the reflected light of the dummy core b has a total luminance of 90% before being shielded because the projection region b is covered with the light shielding pattern b in the width of 5 μm out of the width of 50 μm. When these reflected lights are compared with each other, the total luminance of the reflected light of the dummy core b is 1.8 times that of the total luminance of the reflected light of the dummy core a. On the other hand, as described above, when the light shielding pattern a and the light shielding pattern b are provided so as to be in contact with the projection area a and the projection area b, the total luminance of the reflected light of the dummy core a becomes 80%, and the luminance of the reflected light of the dummy core b. Since the total amount is 100%, the ratio is 1.25 times. Therefore, it is obvious that the positional deviation amount can be easily measured by providing the light shielding pattern 8 so as to cover a part of the projection region 7. is there.
In this case, when a positional deviation exceeding 15 μm width occurs, it is difficult to obtain the positional deviation amount by a simple comparison between the total luminance of reflected light of the dummy core a and the total luminance of reflected light of the dummy core b. It is preferable that the overlap width 11 between the light shielding pattern 8 and the projection region 7 surely exceeds the allowable deviation width. On the other hand, if the overlap width 11 is too large, most of the reflected light of each dummy core is shielded, making it difficult to measure the total luminance. From the above situation, the overlap width 11 is preferably 0.10 D to 0.75 D (D: core diameter), and more preferably 0.20 D to 0.50 D.

<Process (E)>
In addition to the steps (A) to (D), the method for producing a photoelectric composite substrate according to the present invention further includes a step (E) of selecting the photoelectric composite substrate based on the measurement result of the step (D). Also good.
In the step (E), as a method of selecting the photoelectric composite substrate 20 based on the positional deviation amount and the positional deviation direction information obtained as described above, a method in which the positional deviation amount is larger than a predetermined amount is as follows. A method of classifying as an inferior product and mounting an optical element on the remaining photoelectric composite substrate may be mentioned.
In addition, in the step (E), by classifying the positional deviation amount within a certain range for each positional deviation amount and direction, it becomes possible to correct the mounting position of the optical element for each classification. Since it is possible to mount optical elements in a part of the range originally classified as defective products, the yield of opto-electric composite boards is improved, and the yield of opto-electric composite modules mounted with optical elements is also improved. To do.

Next, although the manufacturing method of the photoelectric composite board | substrate of this invention is demonstrated in detail by an Example, this invention is not limited at all by these examples.
Example 1
[Preparation of resin film for forming clad layer]
(A) As a base polymer, 48 parts by mass of phenoxy resin (trade name: Phenototo YP-70, manufactured by Toto Kasei Co., Ltd.), (B) As a photopolymerizable compound, alicyclic diepoxycarboxylate (trade name: KRM) -2110, molecular weight: 252, Asahi Denka Kogyo Co., Ltd.) 50 parts by mass, (C) As a photopolymerization initiator, triphenylsulfonium hexafluoroantimonate salt (trade name: SP-170, Asahi Denka Kogyo Co., Ltd.) 2 parts by mass, 40 parts by mass of propylene glycol monomethyl ether acetate as an organic solvent are weighed in a wide-mouthed plastic bottle, and stirred for 6 hours under the conditions of a temperature of 25 ° C. and a rotation speed of 400 rpm using a mechanical stirrer, shaft and propeller. A clad layer forming resin varnish A was prepared. After that, using a polyflon filter (trade name: PF020, manufactured by Advantech Toyo Co., Ltd.) with a pore diameter of 2 μm, the mixture is filtered under pressure at a temperature of 25 ° C. and a pressure of 0.4 MPa, and further the degree of vacuum using a vacuum pump and a bell jar Degassed under reduced pressure for 15 minutes under the condition of 50 mmHg.
The resin varnish A for forming a clad layer obtained above is coated on a corona-treated surface of a polyamide film (trade name “Mictron”, thickness 12 μm, manufactured by Toray Industries, Inc.) as a carrier film (Multicoater TM- MC, manufactured by Hirano Tech Seed Co., Ltd., dried at 80 ° C. for 10 minutes, then at 100 ° C. for 10 minutes, and then released as a protective film release PET film (trade name: Purex A31, Teijin DuPont Film Co., Ltd.) Company, thickness: 25 μm) was attached so that the release surface was on the resin side, and a resin film for forming a clad layer was obtained.

[Preparation of resin film for core layer formation]
(A) As a base polymer, 26 parts by mass of phenoxy resin (trade name: Phenototo YP-70, manufactured by Toto Kasei Co., Ltd.), (B) 9,9-bis [4- (2-acryloyl) as a photopolymerizable compound Oxyethoxy) phenyl] fluorene (trade name: A-BPEF, Shin-Nakamura Chemical Co., Ltd.) 36 parts by mass, and bisphenol A type epoxy acrylate (trade name: EA-1020, Shin-Nakamura Chemical Co., Ltd.) 36 mass Parts, (C) 1 part by mass of bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide (trade name: Irgacure 819, manufactured by Ciba Specialty Chemicals) as a photopolymerization initiator, and 1- [4 -(2-Hydroxyethoxy) phenyl] -2-hydroxy-2-methyl-1-propan-1-one (trade name: yl Cure 2959, manufactured by Ciba Specialty Chemicals) 1 part by weight, and using resin varnish B for forming a core layer under the same method and conditions as in the above production example, except that 40 parts by weight of propylene glycol monomethyl ether acetate was used as the organic solvent Prepared. Thereafter, pressure filtration and degassing under reduced pressure were performed under the same method and conditions as in the above production example.
The core layer-forming resin varnish B obtained above is applied to the non-treated surface of a PET film (trade name: Cosmo Shine A1517, manufactured by Toyobo Co., Ltd., thickness: 16 μm) in the same manner as in the above production example. After coating and drying, a release PET film (trade name: PUREX A31, Teijin DuPont Films Co., Ltd., thickness: 25 μm) is applied as a protective film so that the release surface is on the resin side, and a core layer forming resin A film was obtained.

[Fabrication of flexible optical waveguide]
The release PET film (Purex A31), which is a protective film for the resin film for forming the lower clad layer obtained above, is peeled off, and the resin side (base) is obtained with an ultraviolet exposure machine (EXM-1172, manufactured by Oak Manufacturing Co., Ltd.). An ultraviolet ray (wavelength 365 nm) was irradiated from the opposite side of the material film at 1 J / cm ² , and then heat-treated at 80 ° C. for 10 minutes to form a lower cladding layer having a thickness of 15 μm.
Next, the core layer is formed on the lower clad layer using a roll laminator (HLM-1500, manufactured by Hitachi Chemical Technoplant Co., Ltd.) under conditions of a pressure of 0.4 MPa, a temperature of 50 ° C., and a laminating speed of 0.2 m / min. After laminating the forming resin film, and then vacuuming to 500 Pa or less using a vacuum pressure laminator (MVLP-500, manufactured by Meiki Seisakusho Co., Ltd.) as a flat plate laminator, pressure 0.4 MPa, temperature 50 ° C. The core layer having a thickness of 50 μm was formed by thermocompression bonding under a pressure time of 30 seconds.
Next, ultraviolet rays (wavelength 365 nm) were irradiated with 0.6 J / cm ² with a UV photomask through a negative photomask having a width of 50 μm, followed by heating at 80 ° C. for 5 minutes. Thereafter, the PET film as the support film is peeled off, and using a developer (propylene glycol monomethyl ether acetate / N, N-dimethylacetamide = 8/2, mass ratio), a core pattern and a dummy core having a square cross section a to d (core diameter: 50 μm) was developed. Then, it wash | cleaned using the washing | cleaning liquid (isopropanol), and heat-dried at 100 degreeC for 10 minute (s).
Subsequently, the resin film for forming a clad layer was laminated as an upper clad layer under the same laminating conditions as described above. Further, a flexible optical waveguide in which an upper clad layer having a thickness of 20 μm is formed and a base film is disposed on the outer side by performing a heat treatment at 160 ° C. for 1 hour after irradiation with an ultraviolet wavelength of 365 nm on both surfaces in total of 25 J / cm ² Was made. Furthermore, in order to peel the polyamide film, the flexible optical waveguide was treated under high temperature and high humidity conditions of 85 ° C./85% for 24 hours to produce a flexible optical waveguide from which the base film was removed.
Moreover, as a result of measuring the tensile elasticity modulus and tensile strength of the obtained flexible optical waveguide by the above method, the tensile elasticity modulus was 2,000 MPa, and the tensile strength was 70 MPa.

[Production of sheet adhesive]
HTR-860P-3 (made by Teikoku Chemical Industry Co., Ltd., trade name, glycidyl group-containing acrylic rubber, molecular weight 1 million, Tg-7 ° C.) 100 parts by mass, YDCN-703 (made by Toto Kasei Co., Ltd., trade name, o- Cresol novolac type epoxy resin, epoxy equivalent 210) 5.4 parts by mass, YDCN-8170C (manufactured by Tohto Kasei Co., Ltd., trade name, bisphenol F type epoxy resin, epoxy equivalent 157) 16.2 parts by mass, Plyofen LF2882 (large Nippon Ink Chemical Co., Ltd., trade name, bisphenol A novolak resin) 15.3 parts by mass, NUCA-189 (Nippon Unicar Co., Ltd., trade name, γ-mercaptopropyltrimethoxysilane) 0.1 part by mass, NUCA -1160 (made by Nippon Unicar Co., Ltd., trade name, γ-ureidopropyltriet 0.3 parts by mass of xylsilane), 30 parts by mass of A-DPH (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name, dipentaerythritol hexaacrylate), Irgacure 369 (trade name, 2-benzyl, manufactured by Ciba Specialty Chemicals) 2-Dimethylamino-1- (4-morpholinophenyl) -butanone-1-one: I-369) 1.5 parts by mass, cyclohexanone was added, mixed by stirring, and vacuum degassed. This adhesive varnish was applied onto a 75 μm-thick surface release-treated polyethylene terephthalate (manufactured by Teijin Ltd., Teijin Tetron film: A-31) and dried by heating at 80 ° C. for 30 minutes to obtain an adhesive sheet. . The adhesive sheet is laminated together with a light-transmitting support substrate having a thickness of 80 μm (manufactured by Thermo Co., Ltd., low density polyethylene terephthalate / vinyl acetate / low density polyethylene terephthalate three-layer film: FHF-100). Thus, a sheet-like adhesive composed of a protective film (surface release-treated polyethylene terephthalate), an adhesive layer, and a light-transmitting support substrate was produced. The thickness of the adhesive layer was 10 μm.
Moreover, as a result of measuring the tensile elastic modulus of the obtained sheet-like adhesive by the above method, the tensile elastic modulus was 350 MPa.

[Production of optoelectric composite substrate]
Sheet-shaped adhesive with a protective film peeled off on a flexible optical waveguide using a roll laminator (HLM-1500, manufactured by Hitachi Chemical Technoplant Co., Ltd.) under the conditions of pressure 0.4 MPa, temperature 50 ° C., laminating speed 0.2 m / min. The agent was laminated. Subsequently, a 45 ° cutout was formed using a dicing saw (DAD-341, manufactured by DISCO Corporation) to obtain a reflection mirror. The reflection mirror has a hypotenuse of 45 degrees. Subsequently, the reflecting mirror was coated with gold.
Next, the flexible optical waveguide is processed into a strip shape (120 mm in length and 2 mm in width), and ultraviolet light (365 nm) is irradiated from the support substrate side at 250 mJ / cm ² , and adhesion between the adhesive layer and the support substrate interface is performed. The force was reduced and the supporting substrate was peeled off to obtain an optical waveguide with an adhesive.
Next, a flexible base material having a modulus of elasticity of 7400 Mpa and a thickness of 12 μm made of polyimide with a single-sided copper foil (Upilex VT [trade name] manufactured by Ube Nitto Kasei Co., Ltd.) is applied and etched to form an electrode with a thickness of 9 μm. The light shielding patterns a to d were formed in the vicinity of the projection areas where the reflected light of the dummy cores a to d was projected by the reflection mirror together with the pattern, thereby obtaining a flexible printed wiring board.
Here, the light-shielding pattern a is on the positive direction side on the x-axis in the xy orthogonal coordinate system parallel to the substrate in the projection area a on which the reflected light of the dummy core a is projected, and the light-shielding pattern b is the reflected light of the dummy core b. The light shielding pattern c is on the negative direction side on the x-axis of the projection area b where is projected, and the light shielding pattern d is on the positive direction side on the y-axis of the projection area c where the reflected light of the dummy core c is projected. The projection areas corresponding to the projection areas d on which the reflected light of the dummy core d is projected are provided on the negative direction side on the y axis so as to cover the corresponding projection areas with a width of 15 μm when no positional deviation occurs.
Further, an optical waveguide with an adhesive is positioned at the above-mentioned predetermined location using a mask aligner mechanism attached to an ultraviolet exposure machine (manufactured by Dainippon Screen Co., Ltd., MAP-1200-L), and the pressure is zero using the roll laminator. After temporary pressure bonding under the conditions of 4 MPa, temperature of 80 ° C. and laminating speed of 0.2 m / min, the flexible optical waveguide and the electric wiring board are bonded by heating in a clean oven at 160 ° C. for 1 hour, Obtained.

With respect to 100 samples of the photoelectric composite substrate obtained as described above, the amount of displacement of the core layer in the positive direction on the x-axis and y-axis was measured as follows.
[Measurement method of misalignment]
First, light having the same total luminance was input to each of the dummy cores a to d. The reflected light of the dummy cores a to d is partially shielded by the light shielding patterns a to d, respectively, but a CCD camera is provided to measure the total luminance of each reflected light that has passed without being shielded. The current value of each pixel obtained from the CCD camera was decomposed into 8 bits and output as an integer from 0 to 255.
Here, for example, when the core layer and the electrode / light-shielding pattern have a positional deviation of 10 μm in the positive direction on the x-axis, the projection region a (50 μm × 50 μm) is shielded with a width of 25 μm. The total luminance (I _a ) of the reflected light of the dummy core a is 50% before being shielded from light. On the other hand, since the projection region b (50 μm × 50 μm) is shielded from light with a width of 5 μm, the total luminance (I _b ) of the reflected light of the dummy core b is 90% before being shielded. Therefore, when (I _b / I _a ) is 1.8, the core layer and the electrode / light-shielding pattern have a positional deviation of 10 μm in the positive direction on the x-axis.
That is, the positional deviation amount (ΔX) in the positive direction on the x-axis of the core layer with reference to the electrode / light-shielding pattern was obtained by the following formula (I).
ΔX (μm) = 35− [70 / (I _b / I _a +1)] (I)
Similarly, the positional deviation amount (ΔY) in the positive direction on the y-axis of the core layer with reference to the electrode / light-shielding pattern was obtained by the following formula (II).
ΔY (μm) = 35− [70 / (I _d / I _c +1)] (II)
Table 1 shows the amount of positional deviation in the positive direction on the first 10 x-axes and the amount of positional deviation in the positive direction on the y-axis among the 100 samples.

Based on the amount of displacement measured as described above, the photoelectric composite substrates were classified according to the following criteria.
Non-defective product: ΔX and ΔY are each within 10 μm.
Defective product: At least one of ΔX and ΔY exceeds 10 μm.

[Measurement result of optical transmission availability]
A pseudo-light having a 10 Gbps waveform is formed using a pulse generator MP1800A manufactured by Anritsu Co., Ltd., and then incident on the waveguide end face via the fiber GI50, and a fiber GI50 is formed at a predetermined position of the light receiving element on the output mirror surface. An optical oscilloscope 86100C manufactured by Agilent Technologies Inc. was installed on the fiber exit side, and an optical pattern of light transmission was measured at a transmission speed of 10 Gbps.
When the eye pattern was open, it was determined that light transmission was possible, and when it was not open, light transmission was not possible.
The photoelectric composite substrate performance measured as described above is shown in Table 1.

  From Table 1, it became clear that the measurement result of the amount of misalignment in the manufacturing method of the present invention and the performance of the photoelectric composite substrate manufactured thereby matched with high accuracy.

  Furthermore, the time required for measuring ΔX and ΔY of 10 samples, 50 samples, and 100 samples was measured as described above. The results are shown in Table 3.

Comparative Example 1
A photoelectric composite substrate was produced in the same manner as in Example 1 except that the steps were changed as follows.
In the production of the flexible optical waveguide, the core layer reference marks a and b were formed instead of forming the dummy cores a to d.
In the production of the photoelectric composite substrate, the electrode pattern reference marks a and b were formed instead of forming the light shielding patterns a to d. The electrode pattern reference marks a and b were formed at predetermined distances in the x-axis and y-axis directions with respect to the core reference marks a and b, respectively, when no positional deviation occurred.
In the measurement of ΔX and ΔY, ΔX is obtained from the distance (number of pixels) on the x-axis between the electrode pattern reference mark a and the core reference mark a in the image taken by the CCD camera, and the electrode pattern reference mark b ΔY was determined from the distance (number of pixels) on the y-axis with respect to the core reference mark b. The results are shown in Table 2.
In addition, the time required for measuring 10 samples, 50 samples, and 100 samples ΔX and ΔY was measured. The results are shown in Table 3.

  From Table 3, it became clear that according to the manufacturing method of the present invention, the displacement of the optical waveguide can be measured very efficiently.

Example 2
A photoelectric composite substrate was produced in the same manner as in Example 1 except that the steps were changed as follows.
In the production of the flexible optical waveguide, dummy cores a ′ to c ′ are formed, and in the production of the optoelectric composite substrate, the light shielding pattern a ′ is parallel to the substrate in the projection region a ′ where the reflected light of the dummy core a ′ is projected. In the xy orthogonal coordinate system, the light shielding pattern b ′ is projected in the positive direction on the x-axis, and the projection area corresponding to the projection region b ′ in which the reflected light of the dummy core b ′ is projected in the negative direction on the x-axis. When there is no positional deviation, a 15 μm width is provided so that the light shielding pattern c-1 is shielded in the positive direction on the y axis of the projection area c ′ on which the reflected light of the dummy core c ′ is projected. The pattern c-2 is provided in the negative direction on the y-axis so as to be in contact with the projection region c ′ when no positional deviation occurs.
The total luminance (I _{a ′} ) of the reflected light from the dummy core a ′ and the total luminance (I _{b ′} ) of the reflected light from the dummy core b ′ were measured in the same manner as in Example 1, and the same as in the formula (I). ΔX was determined.
Further, the total luminance (I _{c ′} ) of the reflected light of the dummy core c ′ is measured, and the absolute value (| ΔY |) of the positional deviation amount on the y-axis of the core layer with reference to the electrode / light-shielding pattern is expressed by the following equation: Obtained by (III).
| ΔY | (μm) = 50 [1-7I _{c ′} / 5 (I _{a ′} + I _{b ′} )] (III)
Table 4 shows ΔX and | ΔY | for the first 10 of the 100 samples.
Table 4 also shows the results of measuring the photoelectric composite substrate performance in the same manner as in Example 1.

Further, as described above, the time required to measure ΔX and | ΔY | of 10 samples, 50 samples, and 100 samples was measured. The results are shown in Table 5.

  The photoelectric composite substrate and the photoelectric composite module obtained by the manufacturing method of the present invention can be applied to various fields such as various optical devices and optical interconnections.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Lower clad 3 Core pattern 4 Dummy core 5 Electrode pattern 6 Reflective mirror 7 Projection area 8 Light shielding pattern 9 Upper clad 10 Adhesive layer 11 Overlap width 20 Photoelectric composite substrate

Claims (10)

  On the one surface of the substrate on which the lower clad is formed, a step (A) of patterning the dummy core together with the core pattern, a step (B) of forming a reflection mirror on the core pattern and the dummy core, and on the other surface of the substrate In addition to the electrode pattern, the step (C) of patterning the light shielding pattern in the vicinity of the projection area where the reflected light of the dummy core is projected by the reflecting mirror, and the core pattern based on the total luminance of the reflected light of the dummy core that has passed without being shielded And a step (D) of measuring the amount of positional deviation between the electrode pattern and the electrode pattern.   In the step (A), at least a dummy core a and a dummy core b are formed, and in the step (C), the projection area a on which the reflected light of the dummy core a is projected is in an arbitrary xy orthogonal coordinate system parallel to the substrate. In the step (D), the light shielding pattern a is formed on the positive direction side on the x axis, and the light shielding pattern b is formed on the negative direction side on the x axis of the projection region b where the reflected light of the dummy core b is projected. 2. The method of manufacturing an optoelectronic composite substrate according to claim 1, wherein the amount of positional deviation in the x-axis direction is measured by comparing a difference in total luminance of reflected light of the dummy core a and the dummy core b that has passed without being shielded.   The said process (C) WHEREIN: The said light shielding pattern a is provided so that a part of said projection area | region a may be covered, and the said light shielding pattern b is provided so that a part of said projection area | region b may be covered. A method for manufacturing a photoelectric composite substrate.   In the step (A), at least the dummy core c and the dummy core d are formed, and in the step (C), the positive direction on the y axis in the xy orthogonal coordinate system of the projection region c on which the reflected light of the dummy core c is projected The light shielding pattern c is formed on the side, and the light shielding pattern d is formed on the negative direction side on the y-axis of the projection area d on which the reflected light of the dummy core d is projected. The method of manufacturing an optoelectric composite substrate according to claim 2 or 3, wherein the amount of positional deviation in the y-axis direction is measured by comparing a difference in total luminance of reflected light between the dummy core c and the dummy core d. In the step (A), at least a dummy core c is formed, and in the step (C), the projection area c on which the reflected light of the dummy core c is projected is on the y axis in an arbitrary xy orthogonal coordinate system parallel to the substrate. The light shielding pattern c-1 and the light shielding pattern c-2 are formed on the positive direction side and the negative direction side on the y axis, respectively, and the reflected light of the dummy core c that has passed without being shielded in the step (D). When the core pattern, of one of the dummy core a and dummy cores b, according to claim 2 or 3 for measuring the positional deviation amount in the y-axis direction by comparing the difference in brightness total no light-shielding pattern reflected light Manufacturing method of the photoelectric composite substrate.   6. The method of manufacturing an optoelectric composite substrate according to claim 5, wherein, in the step (C), the light shielding pattern c-1 and the light shielding pattern c-2 are provided so as to be in contact with the projection region c.   The method for producing an optoelectric composite substrate according to any one of claims 1 to 6, wherein in the step (D), a positional deviation direction between the core pattern and the electrode pattern is also obtained.   Furthermore, the manufacturing method of the photoelectric composite board | substrate in any one of Claims 1-7 which also includes the process (E) which sorts an optoelectronic composite board | substrate based on the measurement result of the said process (D).   Based on the measurement result of the positional deviation amount obtained in the step (D), the positional deviation amount in the step (E) is determined in advance for the photoelectric composite substrate manufactured by the manufacturing method according to claim 1. A method for producing an optoelectronic composite module, wherein a product larger than a predetermined amount is regarded as a defective product, and an optical element is mounted on the remaining optoelectronic composite substrate.   10. The photoelectric device according to claim 9, wherein the mounting position of the optical element on the photoelectric composite substrate selected in the step (E) is corrected based on the positional deviation amount and the positional deviation direction information obtained in the step (D). A method of manufacturing a composite module.

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