JP5651361B2 - Expanding apparatus and expanding method - Google Patents

Description

  The present invention relates to an expanding apparatus and an expanding method.

  Conventionally, in a semiconductor manufacturing process, a semiconductor wafer (hereinafter, sometimes simply referred to as a wafer) having an adhesive sheet attached to the entire back surface is cut into a predetermined shape and a predetermined size and separated into semiconductor chips (dicing process). Then, after the interval between the separated chips is expanded (expanding process), each chip is picked up and bonded to the substrate (bonding process). Among these processes, an expanding apparatus that expands a diced chip has been proposed (see, for example, Patent Documents 1 and 2). The expanding apparatus described in Patent Documents 1 and 2 supports a wafer whose entire back surface is integrated with a ring frame via an adhesive sheet from the adhesive sheet side, and extends the adhesive sheet to the outside to extend the chip. The structure which expands a space | interval is taken.

  On the other hand, in the dicing process in the semiconductor manufacturing process, the back surface of the wafer is ground to reduce the thickness of the semiconductor chip. In this grinding process, the inside of the wafer is ground deeper than the outer edge portion. Thus, a semiconductor wafer is known in which the inner side is formed thinner than the outer edge, that is, the outer edge has an annular convex portion protruding in the thickness direction and the bottom surface is surrounded by the convex portion (for example, And Patent Document 3).

JP 2005-57158 A JP-A-9-190988 JP 2007-19461 A

  By the way, in the case of a wafer as described in Patent Document 3, an adhesive sheet is attached to the entire back surface of the wafer including the protrusions, and is separated into semiconductor chips in a dicing process. At this time, since the wafer is cut C according to the thickness of the bottom wall portion, the convex portion is not separated into pieces by the cut C (see FIG. 1). That is, the convex part remains in an annularly continuous state. For this reason, even if an adhesive sheet is extended outside in an expanding process, there exists a problem that a convex part gets in the way and cannot be expanded. Also, when the adhesive sheet is stretched outward in the expanding process, the convex part may crack and expand, but the convex part cannot be expected to crack evenly, and it will be unevenly cracked. Further, there is a problem in that the distance between the expanded chips varies, and the pickup cannot be accurately picked up, resulting in a hindrance to bonding.

  An object of the present invention is to provide an expanding device and an expanding method capable of accurately expanding a chip even in a semiconductor wafer having a convex portion at an outer edge portion.

In order to achieve the above object, the expanding device of the present invention is formed on a semiconductor wafer having an annular convex portion protruding in one direction in the thickness direction at an outer edge portion and a bottom surface on the inner side surrounded by the convex portion. An expanding apparatus for widening the interval between the chips, wherein the semiconductor wafer has an adhesive sheet affixed on one side thereof, holding means for holding the convex portion of the semiconductor wafer via the adhesive sheet, and the semiconductor wafer. separating means for separating the wafer or al the protrusion, and removing means for removing by peeling the convex portion is separated from the semiconductor wafer from the adhesive sheet, pulling on the adhesive sheet outwardly in the plane direction of the semiconductor wafer in a pulling means increase the distance of the respective chips, the separating means includes: a bottom holding means for holding the bottom surface of the semiconductor wafer via the adhesive sheet, Serial holding means and with said bottom holding means are relatively moved in a direction perpendicular to the bottom surface, by dividing a boundary between the bottom surface and the convex portion, and a moving means for separating the projections from the semiconductor wafer Is adopted.

In this case, in the expanding apparatus of the present invention, it is preferable that the separating unit includes a pressing unit that presses the semiconductor wafer from the opposite side of the bottom surface holding unit .

In addition, the expanding method of the present invention has an annular convex portion protruding in one direction in the thickness direction at the outer edge portion, and an interval between chips formed on a semiconductor wafer having a bottom surface on the inner side surrounded by the convex portion. In which the convex portion and the bottom surface are relatively moved in a direction perpendicular to the bottom surface, with the adhesive sheet attached to one side of the semiconductor wafer, and the convex portion and the bottom surface by dividing the boundaries, the semiconductor separating said semiconductor web Ha or al the protrusion, and removing by peeling the convex portion is separated from the semiconductor wafer from the adhesive sheet, the adhesive sheet And a step of widening the interval between the chips formed on the semiconductor wafer by pulling the wafer outward in the surface direction.

According to the invention as described above, since the convex portion can be removed prior to the expanding step, the convex portion does not get in the way when the adhesive sheet is stretched in the expanding step, and the chip is properly disposed. Can be expanded at short intervals.
Moreover, by having the removal means which removes the separated convex part, the convex part which becomes obstructive at the time of the said expansion can be removed prior to an expanding process, and a chip can be expanded reliably.
Furthermore, when the adhesive sheet is an energy ray curable sheet, the adhesive sheet on the surface of the convex portion is cured by irradiating the adhesive sheet attached to the surface of the convex portion with the energy ray irradiating means to cure the convex portion surface Can be easily peeled off, and the convex portion can be easily and reliably removed.

The fragmentary sectional view of the expanding device concerning the embodiment of the present invention. (A), (B) is operation | movement explanatory drawing of the expanding apparatus of embodiment. The fragmentary sectional view of the expanding apparatus which concerns on a modification.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In FIG. 1, an expanding apparatus 1 is an apparatus that first removes a convex portion WA formed on an outer edge portion of a wafer W and then forms an appropriate interval between chips WE. For example, as described in Patent Document 3, the target wafer W has an annular shape that protrudes in the thickness direction (back surface side) by thinly grinding the inner peripheral portion with respect to the outer edge portion. The convex portion WA is formed on the outer edge portion, the inner side surrounded by the convex portion WA is the bottom surface WB, and a circuit is formed on the surface (the opposite surface of the grinding surface, the upper surface in FIG. 1) WD. ing. Further, in the dicing process, the wafer W is provided with lattice-shaped cuts C by a dicing blade and separated into chips WE having a predetermined shape, or the streets are fragilely modified by a laser and the wafers W are separated into chips WE. It can be separated. The convex portion WA is an inner peripheral surface WA1 orthogonal to the bottom surface WB, a convex top surface WA2 orthogonal to the inner peripheral surface WA1, an outer peripheral surface WA3 of the wafer W, and an outer peripheral side region of the surface WD. It consists of a convex back surface WA4 facing away from the top surface WA2. The wafer W has an adhesive sheet S such as a mounting tape attached to the entire back surface, that is, the entire convex top surface WA2, inner peripheral surface WA1, and bottom surface WB, and the ring frame RF is connected to the wafer W via the adhesive sheet S. It is integrated. For the adhesive sheet S, an energy ray curable adhesive that is cured by energy rays such as ultraviolet rays and whose adhesive strength is reduced is employed.

  The expanding apparatus 1 includes a holding unit 2 that holds the wafer W via the adhesive sheet S, a separating unit 4 that separates the convex portion WA from the wafer W and the adhesive sheet S, and the adhesive sheet S on the outer side in the surface direction of the wafer W. It comprises pulling means 7 that expands the interval between the chips WE by pulling.

  The holding means 2 includes a side wall portion 22 and a bottom wall portion 23 and includes a cylindrical central concave portion 21 opened upward. The side wall portion 22 is provided with a concave groove portion 24 opened upward along the outer periphery. In addition, a transparent member made of a glass plate or the like that faces the lower portion of the top surface WA2 of the convex portion and is capable of transmitting energy rays such as ultraviolet rays while being flat with the upper surface of the side wall portion 22 in the opening of the concave groove portion 24. 25 is provided. The upper surface of the side wall portion 22 and the upper surface of the transmissive member 25 constitute a convex portion abutting portion 26 on which the adhesive sheet S affixed to the convex portion top surface WA2 abuts. In addition, an ultraviolet lamp 27 as an energy beam irradiation means is built in the concave groove portion 24. Further, a flange portion 28 protruding in a hook shape is provided at the lower end of the side wall portion 22.

The separating means 4 protrudes from the wafer W by relatively moving the bottom face holding means 40 holding the bottom face WB via the adhesive sheet S, and the bottom face holding means 40 and the convex portion abutting portion 26 in the vertical direction in the figure. The moving means 50 for separating the part WA, the pressing means 60 for pressing the surface WD of the wafer W, and the removing means 8 for peeling and removing the separated convex part WA from the adhesive sheet S are provided.
The bottom surface holding means 40 is formed in substantially the same planar shape as the entire area of the bottom surface WB. A plurality of suction ports 41 for adsorbing and holding the bottom surface WB are formed on the top surface of the bottom surface holding means 40 via a bottom surface pasting portion S1 that is a portion pasted on the bottom surface WB of the adhesive sheet S. The mouth 41 is connected to a suction device such as a suction pump (not shown) via a chamber 42 formed in the bottom surface holding means 40.

The moving means 50 includes a linear motion motor 51 as a drive device, the motor main body 52 is fixed to the bottom wall portion 23, and the output shaft 53 is connected to the lower surface of the bottom surface holding means 40 in FIG. Accordingly, the convex portion WA can be separated from the wafer W by relatively moving the holding unit 2 and the bottom surface holding unit 40 in a direction orthogonal to the bottom surface WB of the wafer W.
The holding means 60 has a support 61 formed in a disc shape in accordance with the planar shape of the bottom surface WB of the wafer W, and is formed in an annular shape along the outer peripheral edge of the lower surface in FIG. A contact member 62 that can contact the WD, and a linear motion motor 63 that is supported by a frame (not shown) and moves the support 61 up and down in FIG. By operating in synchronization with the motor 51, the convex portion WA can be separated from the wafer W. A plurality of holes or annular holes are formed on the outer peripheral side of the contact member 62 in the support body 61 and connected to a suction source (not shown) to suck and remove dust such as dust and debris of the wafer W. A suction hole 61A as a dust removing means is provided. The dust removing means is not limited as long as the dust is removed. For example, the dust removing means may be removed by adhering the dust with an adhesive tape, or a gas such as air or nitrogen is blown to the wafer W side. It may be configured to remove dust. Further, not only the outer peripheral side of the contact member 62 but also the inner side of the contact member 62 may be provided. Although the contact member 62 is not particularly limited, the contact member 62 is configured by an elastic member such as rubber or resin, and is located inside the boundary region with the convex back surface WA4 on the surface WD of the wafer W, and is supported by the bottom surface. A bottom WB region is provided between the means 40 and the means 40 so as to be sandwiched therebetween. The contact member 62 may be formed in a disc shape (solid shape) in accordance with the planar shape of the bottom surface WB other than the annular shape. Further, the abutting member 62 may be configured by an inelastic member such as a metal.

  The removing means 8 is a bracket 80A provided on the upper surface of the support 61 in FIG. 1, and a shaft that is slidable in the vertical direction in FIG. 1 with respect to the bracket 80A and that prevents the bracket 80A from falling off. A shaft 80C having an end 80B, an urging means 80D configured by a spring for urging the shaft 80C downward in FIG. 1, and a suction means such as a suction pump (not shown) are connected to the shaft 80C. 1, a suction pad 80 </ b> E attached to the lower side.

  The pulling means 7 includes an outer table 75 that supports the ring frame RF from below in FIG. 1, a driving means 70 that moves the outer table 75 in the vertical direction in the figure, and at least both left and right sides of the outer peripheral surface of the outer table 75 in the figure. And a frame holding means 90 having a substantially L shape in cross section provided at the upper end of the surface. The drive means 70 includes a linear motion motor 72 as a drive device that is provided above the collar portion 28 in FIG. 1 and whose output shaft 73 is connected to the outer table 75. Further, the frame holding means 90 is rotatably provided by a driving device such as a motor (not shown), and is provided on the outer table 75 so that the ring frame RF can be fixed. Further, the outer table 75 is formed in an annular shape that can be fitted to the side wall portion 22, and an initial position where the upper surface thereof is flush with the convex portion abutting portion 26 by the linear motion motor 71, and this initial position. By being able to move up and down between lower positions, it is possible to pull the adhesive sheet S outward in the surface direction of the wafer W and widen the interval between the chips WE.

  In the expanding apparatus 1 described above, the procedure for expanding the chip WE is as follows. First, the wafer W integrated with the ring frame RF is conveyed by the conveying means (not shown) via the adhesive sheet S, and the bottom surface is held on the bottom surface holding means 40. When the WC is positioned, the convex top surface WA2 is positioned on the convex contact portion 26 and the ring frame RF is positioned on the outer table 75, and is supported on the holding means 2. Next, the holding unit 2 drives a suction device (not shown) to suck air from the suction port 41 and holds the bottom surface WB by suction using the bottom surface holding unit 40 via the adhesive sheet S. Then, the frame holding means 90 is rotated from the position indicated by the two-dot chain line in FIG. 1 to the position indicated by the solid line, and the ring frame RF is held by the outer table 75. Next, the ultraviolet lamp 27 emits light, thereby curing the adhesive of the adhesive sheet S portion attached to the top surface WA2 of the convex portion and reducing the adhesive force.

  Next, as shown in FIG. 2A, the linear motion motor 63 is driven to bring the contact member 62 and the suction pad 80E into contact with the surface WD of the wafer W. Thereafter, the linear motion motor 51 and the linear motion motor 63 are driven synchronously while the bottom surface WB is sucked and held by the suction port 41, and the contact member 62 and the bottom surface holding means 40 are moved to the convex contact portion 26. By lowering, the boundary between the front surface WD of the wafer W and the convex back surface WA4 is broken, and the convex portion WA is separated from the wafer W. At this time, the wafer W may be broken and dust may be generated. However, since the dust can be sucked and removed by the suction hole 61A, the inconvenience of dust adhering to the surface WD of the wafer W is avoided. be able to. The suction pad 80E is pushed upward in the figure against the biasing force of the biasing means 80D, and at the same time, a suction force is applied by a suction means (not shown) to suck and hold the convex portion WA. Next, when the linear motion motor 63 is driven, the contact member 62 and the suction pad 80E are separated from the surface WD of the wafer W in a state where the convex portion WA is sucked and held. At this time, since the ultraviolet ray is irradiated to the adhesive sheet S portion attached to the convex portion top surface WA2, the convex portion WA can be easily peeled off from the adhesive sheet S and removed.

  Thereafter, the suction of the suction port 41 is stopped, and the outer table 75 is lowered from the initial position to the lowered position by the linear motion motor 72, whereby the wafer W ′ from which the convex portion WA is removed and left on the bottom surface holding means 40 is removed. As shown in FIG. 2B, the adhesive sheet S is pulled outward in the surface direction of the wafer W, and the spaces between the chips WE are widened at the notch C portion to be expanded. In the case of a wafer W whose streets are weakly modified by a laser, the adhesive sheet S is pulled outward in the surface direction of the wafer W, so that the weak streets are cracked, and the intervals between the chips WE are expanded and expanded. Is done. When it is detected by a sensor or the like (not shown) that the interval between the chips WE has become a predetermined interval, the descent of the linear motion motor 72 is stopped, and each chip WE is picked up by an appropriate bonding apparatus and is then mounted on the substrate. Will be bonded.

  According to the embodiment as described above, since the convex portion WA can be removed at the stage before the expanding process, the convex portion WA does not get in the way in the expanding process, and each chip WE is arranged at an appropriate interval. The chip WE expanded at a predetermined position can be surely picked up and bonding can be performed efficiently.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

For example, in the above embodiment, the bottom surface WB of the wafer W is lowered to separate the convex portion WA and the bottom surface WB. However, as shown in FIG. 3 may be configured to be movable up and down in FIG. 3 so that the convex portion WA is raised and the convex portion WA and the bottom surface WB are separated without lowering the bottom surface WB. Further, the bottom surface WB may be lowered, and the convex portion WA may be raised to separate the convex portion WA and the bottom surface WB.
In the above-described embodiment, the adhesive sheet S is stretched outward in the surface direction of the wafer W by lowering the ring frame RF. However, the adhesive sheet S is moved outward in the surface direction of the wafer W without lowering the adhesive sheet S. The distance between the chips WE may be widened by pulling to.
Furthermore, the energy beam irradiation means (ultraviolet lamp 27) in the embodiment is not an essential requirement of the present invention and can be omitted.

In the above embodiment, the holding means 2 is configured to hold the wafer W by suction. However, in the present invention, the means for holding the wafer W is not limited to suction holding, and for example, holding using a chuck means, etc. Other suitable holding means can be used. Similarly, as the supporting means other than the suction holding, the removing means 8 can also be applied with an appropriate convexity such as attaching another adhesive sheet or the like to the convex portion and pulling it, or engaging and pulling the convex portion with the engaging means. Part support means are available.
Further, in the above-described embodiment, the ring frame RF is held by the outer holding means 90 rotatably provided on the outer table 75. However, the ring frame RF may be held by suction.
Moreover, in the said embodiment, you may expand by raising the bottom face holding | maintenance means 40 rather than the position shown in FIG.
Further, the wafer W may be a silicon semiconductor wafer or a compound semiconductor wafer.

Moreover, in the said embodiment, although the removal means 8 was set as the structure attached to the press means 60, the removal means 8 may be isolate | separated from the press means 60, and you may comprise independently.
Furthermore, the upper surface of the bottom surface holding means 40 may be configured to transmit energy rays, and the energy beam irradiation means similar to that of the above embodiment may be disposed in the chamber 42. Thereby, each chip WE can be easily picked up from the adhesive sheet S.
Further, the energy beam irradiation means is not limited to the device that irradiates ultraviolet rays, and any device that irradiates an appropriate energy beam such as an electron beam to cure the adhesive sheet may be used.
Furthermore, for wafers that cannot be separated into a plurality of chips WE in advance, after removing the convex portion WA from the wafer W, the wafer W can be separated into a plurality of chips WE by a dicing blade, a laser, or the like. Good.
In addition, the driving device in the embodiment employs electric devices such as a rotation motor, a linear motion motor, a single axis robot, and an articulated robot, actuators such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. (Some overlap with those exemplified in the embodiment).

DESCRIPTION OF SYMBOLS 1 ... Expand apparatus 2 ... Holding means 4 ... Separation means 7 ... Tensioning means 8 ... Removal means 27 ... Ultraviolet lamp (energy ray irradiation means)
S ... Adhesive sheet W ... Semiconductor wafer WA ... Convex part WB ... Bottom

Claims (3)

An expanding device that has an annular convex portion protruding in one of the thickness directions at the outer edge portion, and widens the interval between chips formed on a semiconductor wafer having a bottom surface on the inner side surrounded by the convex portion,
The semiconductor wafer has an adhesive sheet attached to one side,
Holding means for holding the convex portion of the semiconductor wafer via the adhesive sheet;
Separating means for separating the semiconductor web Ha or al the convex portion,
Removing means for separating and removing the protrusions separated from the semiconductor wafer from the adhesive sheet;
A tension means that widens the interval between the chips by pulling the adhesive sheet outward in the surface direction of the semiconductor wafer ;
The separating means relatively moves the bottom surface holding means for holding the bottom surface of the semiconductor wafer via the adhesive sheet, the holding means and the bottom surface holding means in a direction perpendicular to the bottom surface, and the convex portion. An expanding apparatus comprising: moving means for separating the convex portion from the semiconductor wafer by dividing a boundary with the bottom surface . 2. The expanding apparatus according to claim 1, wherein the separating unit includes a pressing unit that presses the semiconductor wafer from the opposite side of the bottom surface holding unit. An expanding method that has an annular convex portion protruding in one of the thickness directions at the outer edge portion and widens the interval between chips formed on a semiconductor wafer having a bottom surface on the inner side surrounded by the convex portion,
With the adhesive sheet attached to one side of the semiconductor wafer, the convex portion and the bottom surface are relatively moved in a direction orthogonal to the bottom surface, and the boundary between the convex portion and the bottom surface is divided, and separating the semiconductor web Ha or al the convex portion,
Peeling and removing the convex portions separated from the semiconductor wafer from the adhesive sheet;
Expanding method characterized by a step of widening the interval of each chip formed on the semiconductor wafer by pulling the adhesive sheet outwardly in the plane direction of the semiconductor wafer.

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