JP5646533B2 - Substrate support apparatus comprising a Z stage having a dynamically driven stage mirror and chuck assembly - Google Patents

Description

  The present invention relates to substrate processing. More particularly, the present invention relates to substrate support in substrate processing.

  In modern semiconductor systems, it is often important to accurately measure the position of the semiconductor substrate. An example of an apparatus generally used in measurement and inspection of a semiconductor wafer is an electron microscope. FIG. 1 shows an electron beam microscope system 100 according to the prior art. The electron optical column 102 concentrates the electron beam 101 on the surface of the wafer 104. The electrons scattered by the wafer 104 are collected to form an image. In order to locate defects in various portions of the wafer 104, the wafer 104 is typically moved between the chuck 106 and XY while the chuck (and wafer) translates in the X and Y directions approximately parallel to the plane of the wafer 104. Processing is performed on a support unit 105 having a stage 108. Since the electron beam microscope 100 needs to operate in the vacuum chamber 103, the chuck 106 is typically a high voltage electrostatic chuck. Changes in the position of the wafer 104 can be measured using the interferometer system 112. Interferometer system 112 measures stage mirror 110. Stage mirror 110 includes a highly polished surface 114 that is oriented perpendicular to one or both of the X and Y axes. In interferometer 112, light beam 116 (eg, by a laser) is split by beam splitter 118. Part of the light (sometimes referred to as a reference beam) is reflected by the fixed mirror 120 and returned to the beam splitter 118. Another portion of the light (sometimes referred to as the measurement beam) is reflected by the highly polished surface 114 and returned to the beam splitter 118. The beam splitter 118 combines both parts, and the combined optical signal is directed to the photodetector 119. As a result of the movement of the stage mirror 110, the interference signal from the photodetector 119 changes predictably.

  When the wafer 104 moves in the X and Y directions, the depth of focus of the electron beam 101 may change as a result of the undulation or tilt of the surface of the wafer 104. The support unit 105 may be provided with a Z stage 122 in order to adjust in accordance with changes in the undulations on the wafer surface. The Z stage 122 includes a stage plate 124 and one or more piezoelectric actuators 126. Wafer chuck 106 is attached to Z stage plate 124 by a compliant mount 128. The high voltage disconnector 130 electrically insulates between the chuck 106 and the Z stage plate 124. The stage mirror 110 is attached to the Z stage plate 124 by a kinematic mount 132, such as one or more of a sphere and V-groove type, a sphere and cone type, and a sphere and plane type. In many prior art systems, once the wafer surface is analyzed to determine the gradient, the Z stage 122 is then moved up and down to statically level the wafer. In such a system, it is impossible to dynamically adjust the height of the wafer 104 in response to changes in wafer undulations.

Further, the Z stage 122 including the wafer chuck 106 is mechanically separated from the stage mirror 110 that is normally rigidly coupled to the XY stage 108. As a result of this attachment, there is a long mechanical path as indicated by the dashed line 134 (sometimes referred to as a measurement loop) between the polishing surface 114 on the stage mirror 110 and the wafer chuck 106. Due to this long path, static and dynamic XY position errors due to relative motion between the wafer chuck 106 and the stage mirror 110 are not properly tracked by the electron beam 101. Instead, these errors are tracked by computer image alignment over a relatively slow bandwidth. These errors include inter-scan errors, intra-scan errors, and high frequency (inter-kernel) errors. In a system such as that shown in FIG. 1, for example, a position sensor 136 located adjacent to the wafer chuck 106, such as a capacitor gauge, measures them by measuring the relative displacement ΔX between the chuck 106 and the stage mirror 110. Can be used to identify errors.

  In an alternative prior art design, for example, Mebes Exara, designed by Etec systems, the substrate (eg, mask) may be coupled to the stage mirror 110, but in the X and Y directions It is pre-aligned before scanning the mask and is not dynamically adjusted in the Z direction during scanning. In this design, static pre-alignment of the substrate is assigned prior to scanning and is not dynamically adjusted to the optical focal plane during scanning. For this reason, it is necessary to compensate for the change in height by some other means.

  In the prior art, attempts have been made to deal with tracking errors due to relative motion between the substrate chuck 106 and the stage mirror 110, but this is limited by the bandwidth of the deflection system, the data rate of the interferometer and the degradation of the data. ing. These errors may be large enough to cause false defect detection or loss of inspection sensitivity.

  Accordingly, there is a need in the art for a substrate support system that overcomes these drawbacks.

  In order to solve the above-mentioned problems, the invention described in claim 1 includes a substrate chuck, a Z stage coupled to the substrate chuck, a stage mirror attached to the Z stage, and a base for the stage mirror. One or more relative position sensors configured to sense material chuck displacement, and the one or more relative position sensors dynamically compensate for substrate chuck movement relative to the stage mirror in one or more feedback loops. It is combined with one or more dynamic compensation means for the purpose.

  The invention according to claim 2 is characterized in that, in the apparatus according to claim 1, the dynamic compensation means includes one or more actuators configured to provide movement to the Z stage.

  The invention according to claim 3 is the apparatus according to claim 2, wherein the one or more actuators include one or more Z stage actuators configured to move the substrate chuck and the stage mirror in the Z direction. Inclusion is included.

  The invention according to claim 4 is the apparatus according to claim 2, wherein the XY stage coupled to the Z stage and the one or more actuators move the Z stage in a plane substantially perpendicular to the Z direction. Including at least one configured XY stage actuator.

  The invention according to claim 5 is the apparatus according to claim 4, and includes one or more additional relative position sensors incorporated in one or both of the Z stage actuator and the XY stage actuator. And

The gist of the invention described in claim 6 is that the apparatus according to claim 1 includes an interferometer coupled to the stage mirror.
The gist of the invention described in claim 7 is the apparatus according to claim 1, wherein the substrate chuck is an electrostatic chuck.

  The invention according to claim 8 is the apparatus according to claim 1, characterized in that it includes a vacuum chamber, and the substrate chuck, the stage mirror, and the Z stage are arranged in the vacuum chamber. .

  According to a ninth aspect of the present invention, in the apparatus of the first aspect, the one or more relative position sensors include a capacitance sensor, an induction sensor, or an optical sensor attached to a stage mirror adjacent to the substrate chuck. Inclusion is included.

  According to a tenth aspect of the present invention, in the apparatus according to the first aspect, the coupling between the Z stage and the XY stage is a high rigidity in restraining rotation about the XY plane and the Z axis, and the Z stage along the Z axis. The gist of this is free movement.

  According to an eleventh aspect of the present invention, in the apparatus according to the first aspect, the base material chuck is capable of moving along the Z axis while the base material chuck is constrained to rotate around the XY plane and the Z axis. The main point is high rigidity related to motion.

  The invention according to claim 12 is characterized in that, in the apparatus according to claim 1, the base material chuck is attached to the Z stage by restriction on the six degrees of freedom of movement of the base material chuck.

  An invention according to claim 13 is the apparatus of claim 1, wherein the energy beam column and the dynamic compensation means are coupled to one or more relative position sensors in a feedback loop, the XY beam deflection of the energy beam column. Including a mechanism.

The invention according to claim 14 is the apparatus according to claim 13, wherein the energy beam column is an electro-optic column.
The invention according to claim 15 is characterized in that, in the apparatus according to claim 13, the one or more relative position sensors include an interferometer.

  The invention according to claim 16 includes a Z stage coupled to a substrate chuck, a stage mirror attached to the Z stage, an XY stage coupled to the Z stage, and the Z stage comprising a substrate chuck and Including one or more Z stage actuators configured to move the stage mirror in the Z direction, and the XY stage is configured to move the Z stage in a plane substantially perpendicular to the Z direction. In a substrate support apparatus of the type having a substrate chuck comprising the above XY stage actuator, a method for dynamically compensating for the movement of the substrate chuck relative to the stage mirror, the method comprising: Detecting displacement of material chuck, Z stage actuator and XY stage actuator A signal proportional to the displacement in one or more feedback loops, such as one or both of the Z stage actuator and the XY stage actuator, so that one or both of the sensors dynamically compensate for the motion of the substrate chuck relative to the stage mirror. The gist of the invention is that it comprises a step of combining with both.

  The invention of claim 17 corrects the position of the energy beam column in the method of claim 16 by coupling the XY beam deflection mechanism of the energy beam column in the feedback loop to one or more relative position sensors. The gist is to include a process.

According to an eighteenth aspect of the present invention, there is provided a Z stage plate, a stage mirror, one or more actuators attached to the Z stage plate, and the one or more actuators, wherein the Z stage plate is a plane perpendicular to the Z direction. A substrate that is configured to move the Z stage in the Z direction when scanned in one or more directions and that is attached to the stage mirror by constraints on the six degrees of freedom of movement of the substrate chuck The gist consists of a chuck.

The gist of the invention according to claim 19 is the apparatus according to claim 18, wherein the substrate chuck is kinematically attached to the stage mirror.
The invention according to claim 20 is the gist of the apparatus according to claim 18, wherein the substrate chuck is incorporated in the stage mirror.

The gist of the invention according to claim 21 is that, in the apparatus according to claim 18, the stage mirror is incorporated in the substrate chuck.
The invention according to claim 22 is the gist of the apparatus according to claim 18, wherein the one or more actuators include one or more piezoelectric actuators coupled between the Z stage plate and the stage mirror. To do.

  According to a twenty-third aspect of the present invention, in the apparatus of the twenty-second aspect, the constraint coupled between the Z stage plate and one or both of the substrate chuck and the stage mirror, and the constraint is in the Z direction. And configured to limit movement of one or both of the stage mirror and chuck in one or more vertical directions.

The invention according to claim 24 is the gist of the apparatus according to claim 18, wherein the one or more actuators include one or more load bends.
According to a twenty-fifth aspect of the present invention, in the apparatus of the twenty-fourth aspect, each load bending portion includes a base portion attached to the Z stage plate, a cantilever portion extending laterally from the base portion, and a cantilever portion comprising: Including a parallelogram bend coupled between the base and the free end of the cantilever portion.

The invention according to claim 26 is the gist of the apparatus according to claim 25, wherein the base portion and the cantilever portion are integrally formed from a single block of material.
The gist of a twenty-seventh aspect of the present invention is the apparatus according to the twenty-fifth aspect, wherein the base portion and the cantilever portion are made of titanium.

  According to a twenty-eighth aspect of the present invention, in the device of the twenty-fifth aspect, the parallelogram bend includes an upper arm that is separated from the lower arm along the Z direction, and the upper arm has a first elasticity. Connected to base by hinge, connected to free end by second elastic hinge, and lower arm connected to base by third elastic hinge, connected to free end by fourth elastic hinge It is a summary to include.

  The invention according to claim 29 is the apparatus according to claim 28, wherein the parallelogram bend includes a lever block positioned between the upper arm and the lower arm, and the lever block is a first elastic hinge. And the second elastic hinge and being attached to the upper arm.

  The invention according to claim 30 is operable in the apparatus according to claim 29 between the base and the lever block so that the free end is moved in the Z direction by a lateral load applied to the lever block by the actuator. The main point is to include an actuator coupled to the actuator.

The invention according to claim 31 is the gist of the apparatus according to claim 30, wherein the actuator is a piezoelectric actuator.
According to a thirty-second aspect of the present invention, in the apparatus according to the thirty-first aspect, the piezoelectric actuator includes a joint with a curved surface, and the joint is located at an end of the piezoelectric actuator so that the curved surface contacts the lever block. It is a summary to include.

  According to a thirty-third aspect of the invention, in the apparatus of the eighteenth aspect, an XY stage coupled to the Z stage, and the XY stage is configured to move the Z stage plate in a plane substantially perpendicular to the Z direction. Including one or more XY stage actuators.

The invention described in claim 34 is the apparatus described in claim 18, characterized in that it includes an interferometer coupled to the stage mirror.
The invention according to claim 35 is the gist of the apparatus according to claim 18, wherein the substrate chuck is an electrostatic chuck.

  A thirty-sixth aspect of the present invention is the apparatus of the eighteenth aspect, comprising: a vacuum chamber; and the substrate chuck, the stage mirror, and the Z stage plate are disposed in the vacuum chamber. To do.

  The invention according to claim 37 is the apparatus according to claim 18, characterized in that the energy beam column includes an XY beam deflection mechanism coupled to one or more relative position sensors in a feedback loop.

The invention according to claim 38 is the apparatus according to claim 37, wherein the energy beam column is an electron optical column.
The gist of the invention according to claim 39 is the apparatus according to claim 37, wherein the one or more relative position sensors include an interferometer.

1 is a schematic cross-sectional side view of a substrate support system used with a prior art electron microscope. 1 is a schematic cross-sectional side view of a substrate support system according to an embodiment of the present invention. FIG. 6 is a schematic cross-sectional side view of a substrate support system according to an alternative embodiment of the invention. FIG. 4A is a three-dimensional view of a load bending portion that can be used by the substrate support system of FIG. 3, and FIG. 4B is a side cross-sectional view of the load bending portion of FIG. 4A obtained along the line B-B ′. (A) A schematic cross-sectional side view of a substrate support system according to an alternative embodiment of the present invention, (B) a plan view of the substrate support system of FIG.

  In the first embodiment of the present invention, the feedback signal from the chuck position sensor is coupled to one or both of a closed loop drive that moves an energy beam (for example, the electron beam 101) in the XY directions and an actuator of the Z stage. Thus, by compensating for the movement of the chuck 106 relative to the stage mirror 110, a conventional substrate support system of the type shown in FIG. As shown in FIG. 2, the substrate support system 200 may include many of the features described above with respect to FIG. Features common to the support system 100 of FIG. 1 are identified by the same reference numerals as shown in FIG. The substrate support system 200 includes a Z stage 122 having a Z stage plate 124 and a Z actuator 126. The substrate support chuck 106 is, for example, an electrostatic chuck, and is compliantly connected to the Z stage plate 124 by, for example, a bent portion 128. Preferably, the flexure 128 is characterized by high stiffness with respect to movement in the constraint of rotation about the XY plane and the Z axis while allowing the chuck 106 to move along the Z axis.

  The Z stage 122 is attached to an XY stage 140 having an X stage 142 and a Y stage 144. Preferably, the coupling between the Z stage 122 and the XY stage 140 allows the Z stage to move along the Z axis while providing high stiffness for movement in the constraint of rotation about the XY plane and the Z axis. Features. The X stage 142 includes an X actuator 146 that provides an operating load in the X direction. The Y stage 144 includes, for example, a Y actuator 148 that provides an operating load in the Y direction perpendicular to the X direction. The stage mirror 110 is kinematically attached to the Z stage plate 124 by, for example, three ball and groove type mounts 132. Stage mirror 110 may include a polished surface 114 that may be used as a reflective surface for interferometer 112. A Z actuator 126 (eg, a piezoelectric actuator) provides an operational load that moves the chuck 106 relative to the Z stage plate along a Z direction perpendicular (ie, perpendicular) to the X and Y directions. The substrate chuck 106, the stage mirror 110, and the Z stage 122 may be disposed in the vacuum chamber 103.

The one or more relative position sensors 136 are configured to sense displacement of the substrate chuck 106 relative to the stage mirror 110 with respect to one or more of the X, Y, and Z directions. As an example, the chuck 106 by an amount _{X 1} moving in the X direction, when the stage mirror 110 moves by a different amount _{X 2,} sensor 136 senses the relative displacement [Delta] X ₌ X 1 -X _2. The sensor 136 may be any suitable motion sensor such as, for example, a capacitive sensor, an inductive sensor, or an optical sensor. As an example, if the position sensor 136 is a capacitive sensor attached to the stage mirror 110 adjacent to the substrate chuck 106, the capacitive sensor may be determined in a deterministic manner by the chuck 106 and the stage mirror 110. Different signals are generated according to the relative displacement ΔX between the two. The interferometer 112 can be regarded as a form of an optical relative position sensor. One or both of the relative position sensor 136 and the photodetector 119 of the interferometer 112 may be 1 so that the actuator can dynamically compensate for the movement of the substrate chuck 106 relative to the stage mirror 110. One or more outer feedback loops 150 may be coupled to one or more of the actuators 126, 146, 148. In certain embodiments of the present invention, it is desirable to have one sensor adjacent to the measurement loop 134 described above with respect to FIG. 1 and one or more sensors in the same position as the actuator. One or both of the Z actuator 126 and the XY stage actuators 146, 148 incorporate one or more additional relative position sensors.

  In order to accurately correct the position of the electron beam 101, an XY beam deflection mechanism 107 (eg, an electrostatic beam deflection plate or beam deflection electromagnet) in the electron optical column 102 is coupled to the photodetector of the interferometer 112 via an internal feedback loop 152. 119 and one or both of position sensors 136 are coupled. The internal feedback loop 152 enables precise XY correction of the position of the electron beam 101 with respect to the wafer 104. The same concept may be applied to beam position correction of other energy beams, such as ion beams (eg, using beam deflection by electrostatic or electromagnetic), laser beams (eg, using a beam steering mirror as correction mechanism 107), etc. Will be recognized by those skilled in the art.

In some applications, such as when the system 200 is used to support a substrate with an electron beam, for example, the stage control loop (eg, the external feedback loop 150) and the actuators 146, 148 may cause large tracking errors (eg, about 100 nm to About 2 micrometers). If the system requires an image that is aligned to about 1/10 of the pixels, two more control mechanisms are used. That is, the beam deflection according to the stage mirror position signal from one or both of the interferometer 112 and the additional chuck position sensor 136 and the image computer (not shown) to the extent that other mechanisms leave a residual,
Dynamic image alignment is performed. The computer can correct position errors from a range of about 250 nanometers (nm) to a range of about 2.5 nm. The position signal from the interferometer 112 may be fed back to the stage control actuators 146, 148, in which case the position adjustment order can be reduced from a few hundred millimeters to about 2 micrometers. A stage control actuator may leave a residual of a few micrometers. If the stage feedback loop is relatively slow (eg, several tens of Hz), the external feedback loop 150 and stage actuators 146 and 148 are sufficient to correct image jitter on the order of 250 nm to 2 micrometers due to roller vibration and other causes. Not fast. This gap can be filled by electron beam correction. The electron beam correction is sufficiently fast, for example, about 10 kHz, and has an accuracy of several nanometers or better. The accuracy of currently available interferometers can be about 0.1 nm, but this accuracy can be about 2 nm due to mechanical and electrical noise.

  In other embodiments of the present invention, the measurement loop may be shortened, and the relative displacement between the substrate chuck 106 and the stage mirror 110 can be significantly reduced by attaching the chuck directly to the stage mirror. This is not done in systems that can scan in the Z direction. This is mainly because the mass of the substrate chuck is relatively large. A Z stage having a sufficiently strong actuator and a sufficiently rigid bent portion has not been developed so far. In general, it is desirable to use a piezoelectric actuator for supporting a substrate in an electron beam system. Voice coil actuators are typically not used because they generate a magnetic field that can interfere with the electron beam. The voice coil actuator can be used when it is magnetically well shielded, located far from the electron beam, or both. Direct Z actuation with a piezoelectric stack requires a relatively long piezoelectric actuator and a relatively long flexible bend to produce the desired Z displacement. As a result, the stage mirror and chuck tend to swing in the XY plane.

  FIG. 3 illustrates a substrate support apparatus 300 according to an alternative embodiment of the present invention. In general, the apparatus 300 includes a Z stage plate 322, a stage mirror 310, and a substrate chuck 306. The Z stage plate 322 is attached to an XY stage 308 capable of scanning the Z stage plate 322, the stage mirror 310, and the substrate chuck 306 in the XY plane. For example, the chuck 306, stage mirror 310, Z stage plate 322, and XY stage 308 may be located in the vacuum chamber 303 so that the apparatus 300 can be used with an electron beam or ion beam system.

  The energy beam column 302 generates an energy beam 301 that is directed to the substrate 304 on the substrate chuck 306. The XY beam deflection mechanism 307 operates the energy beam 301 in the XY plane (that is, the plane of the base material 304). As an example, when the energy beam column 302 is an electron beam column, the energy beam 301 is an electron beam. Alternatively, the energy beam column 302 may be an ion optical column or optical column that generates some form of energy electromagnetic radiation, such as infrared, visible or ultraviolet light, for example. In the case of an electron or ion optical column, the XY beam deflection mechanism 307 may include an electrostatic deflection plate or an electromagnet, or some combination of both. In the case of an infrared, visible or ultraviolet optical column (eg, based on a laser as a source of electromagnetic radiation), the XY beam deflection mechanism 307 may include a beam steering mirror.

For example, one or more sensors 336, such as a capacitance sensor, may be positioned adjacent to the substrate chuck 306 to measure relative motion between the chuck 306 and the stage mirror 310. One or both of sensor 336 and interferometer photodetector 319 may be coupled to actuator 346 on the XY stage in outer feedback loop 350 as described above. Similarly, one or both of the photodetector 319 and sensor 336 may be coupled to the beam deflection mechanism 307 by an internal feedback loop 352 as described above.

  The chuck 306 may be a bipolar or unipolar electrostatic chuck. The stage mirror 310 may be manufactured from an electrically insulating material such as alumina. Instead, a conductive material or a semiconductor material such as silicon carbide may be used. Stage mirror 310 includes a highly polished surface 314 that is oriented perpendicular to one or both of the X and Y axes. The highly polished surface 314 serves as a reflective surface for an interferometer 312 having a beam splitter 318, a fixed mirror 320, and a photodetector 319. Beam splitter 318 splits light beam 316 (eg, by a laser). A portion of the light 316 is reflected by the fixed mirror 320 and returned to the beam splitter 318. Another portion of the light is reflected by the highly polished surface 314 and returned to the beam splitter 318. Beam splitter 318 combines both portions and the combined optical signal is directed to photodetector 319. As a result of the movement of the stage mirror 310, the interference signal from the photodetector 319 changes predictably.

  The substrate chuck 306 is attached to the stage mirror 310 and has constraints on the six degrees of freedom of movement of the substrate chuck 306 relative to the stage mirror 310. By way of example, the chuck 306 is kinematically attached to the stage mirror 310 by a sphere and cone mount, a sphere and groove mount, and a sphere and plane mount. A kinematic mounting is generally a mount that provides independent (ie, non-redundant) restraints for six degrees of freedom (translation along the X, Y, and Z directions and rotation about the X, Y, and Z axes). Point to. In one example of a kinematic attachment, the stage mirror 310 is attached to the Z stage plate 322 by a sphere and V-groove type mount, a cone and sphere type mount, and a sphere and plane type mount. The constraint on the chuck 306 need not be strictly kinematic. For example, the chuck 306 is attached by three spheres and a groove mount in which the grooves are aligned at an angle of 120 ° relative to each other. The sphere may be a support portion, and the V-shaped groove may be formed on the back surface of the chuck 306. A system in which three V-shaped grooves support a chuck having three spheres is completely kinematic like a system in which a chuck having three spheres is supported by a cone (or a trihedral hole), a V-shape, and a plane. It is. These two methods are equalization, but the balance between load and motion is different. The three V-groove scheme is better balanced due to symmetry. Alternatively, the chuck 306 may be rigidly attached to the stage mirror 310 by, for example, bolts or screws, and the chuck 306 may be incorporated into the stage mirror 310. Alternatively, the stage mirror 310 may be incorporated into the chuck 306. Preferably, the bend 400 is characterized by high stiffness with respect to movement in the constraint of rotation about the XY plane and the Z axis while allowing the stage mirror 310 to move along the Z axis.

  One or more load bends 400 couple stage mirror 310 to Z stage plate 322. The load bending portion 400 includes an actuator configured to move the stage mirror 310 and the substrate chuck 306 in the Z direction when the Z stage plate 322 is scanned in the XY plane perpendicular to the Z direction. When two or more load bending portions 400 are used, the tilt of the stage mirror 310 and the substrate chuck 306 is controlled by independently adjusting the Z deflection of each load bending portion 400.

As shown in FIG. 4, each load bend 400 includes a base 402 and a cantilever portion 404. Base 402 is secured to Z stage plate 322 by suitable means such as bolts or screws. The cantilever portion 404 extends laterally (eg, in the X or Y direction) from the base 402. The cantilever portion 404 includes a parallelogram bend 403 that is coupled between the base 402 and the free end 406 of the cantilever portion 404. Base 402 and cantilever portion 404 (including parallelogram bend 403) may be integrally formed from a single block of material. Preferably, the material is a material that provides high strength, high electrical resistance, and relatively high stiffness with respect to mass. It is also desirable for the material to have a high ratio of Young's modulus to yield stress. An example of a suitable material is titanium.

  The parallelogram bend 403 includes an upper arm 408 and a lower arm 410. The upper arm 408 and the lower arm 410 are substantially parallel to each other. The upper arm is separated from the lower arm 410 by a distance c along the Z direction. The lever block 412 is lowered from the upper arm 408. The lever block is separated from the base 402, the free end 406 and the lower arm 410 by the groove 414. The first elastic hinge 416 connects the upper arm 408 to the base 402. A second elastic hinge 418 connects the upper arm 408 to the free end 406. The third elastic hinge 420 connects the lower arm 410 to the base 402. The fourth elastic hinge 422 connects the lower arm 410 to the free end 406. The first and second hinges 416 and 418 are laterally separated by a distance b. Similarly, the third and fourth hinges 420, 422 are separated from each other laterally by an approximately equal distance b. The hinges 416, 418, 420, 422 may be formed of any suitable material, such as a material at the junction between the upper and lower arms 408, 410 and one or more of the base and free end 406. A disconnect 405 made from an electrically insulating material may connect the free end 406 to the stage mirror 310.

  As a result of the arm and hinge configuration of the cantilever portion 404, the free end 406 is moved in the Z direction by a lateral load F acting on the lever block 412. Such a side load F may be controllably provided by a piezoelectric actuator 424 located in the bore 426 of the base 402 and secured in place by a screw cap 428. The piezoelectric actuator 424 can be expanded laterally with respect to the lever block 412. The piezoelectric actuator 424 may include a joint end with a curved surface (eg, a spherical surface) 430 that contacts the lever block 412. The end surface 430 contacts the lever block 412 at a point located a distance a from the upper arm 408. It is desirable that the curved surface 430 at the joint end prevents the piezoelectric actuator from bending. The lever ratio and rigidity of the parallelogram bend 403 are determined by the ratio b / a.

  The parallelogram bend 403 and the lever block 412 allow the lateral load F to be converted into a vertical motion of the free end 406 of the cantilever 404. Therefore, a relatively long piezoelectric actuator 424 can be used in the load bending portion 400 with a limited height. This combination makes the load bend relatively rigid and robust. A typical piezoelectric stack can extend approximately 1 micrometer laterally for every millimeter of stack length. Thus, in the case of a 100 millimeter piezoelectric actuator 424, it can extend to about 100 micrometers. By appropriate selection of b and a, the load bend 400 can translate the 100 micrometer expansion of the piezoelectric actuator into a movement of the free end 406 of about 300 micrometers. The design of the load bending portion 400 provides a high lateral rigidity, and the high rigidity allows the stage mirror 310 to be well coupled to the XY stage 308. Moreover, the high-band control of the movement in the Z direction is possible by the Z rigidity of the load bending portion 400.

  Other types of piezoelectric actuators are also suitable as an alternative to the piezoelectric actuator 424 as long as they meet the dynamic and magnetic requirements. For example, a voice coil type actuator may be used instead of the piezoelectric actuator. In electron beam applications, it may be necessary to magnetically shield the voice coil type actuator in order not to disturb the electron beam.

The base material support apparatus of the type shown in FIG. 3 using the load bending portion of the type shown in FIG. 4 has a considerably improved performance compared to the base material support of the prior art type shown in FIG. The untracked error in the prior art system of the type shown in FIG. 1 is on the order of about 100 nm, as measured. In contrast, with a substrate support of the type shown in FIG. 3, the tracking error due to the small dynamic parasitic motion of the wafer chuck 306 relative to the stage mirror 310 is measured to a standard deviation on the order of 0.1 nm, approximately 3 The digits have been improved. Two types of substrate support were also tested to compare interscan error, intrascan error, and interkernel error. The results of these tests are summarized in Table 1 below.

  Inter-scan errors include wafer and chuck displacement due to the end of one cycle of cutting width acceleration and deceleration. Interscan error is the average untracked error between the wafer and the interferometer mirror.

The in-scan error is measured as a displacement between the chuck and the stage mirror when the stage is scanned at a constant speed. The chuck only receives vibrations from the stage bearing.
Image correction is based on a small piece of cut width called the kernel. In this case, the kernel includes 48 vertical scan lines, each acquired every 12 microseconds. Therefore, the line frequency is 83.3 kHz and the kernel frequency is 1736 Hz. Since the image is realigned at the kernel frequency, the inter-kernel error is a residual error that the image computer registration system needs to handle.

Note that all errors in the type of apparatus of FIG. 1 varied from test to test. Furthermore, the value of the interscan error in the type of device of FIG. 3 only occurred when the device swung beyond an acceleration of about 5 m / s ² (about half of the acceleration due to gravity). Embodiments of the present invention may include alternative actuators and bends as shown in FIGS. For example, as shown in FIG. 5, the substrate support apparatus 500 may have a stage mirror 510 coupled to a Z stage plate 522 having a vertical piezoelectric actuator 526. Stage mirror 510 may include a highly polished surface 514 that may be used as a reflective surface of an interferometer. The chuck 506 may be rigidly or kinematically attached to the stage mirror 510 as described above. The Z stage plate 522 may be attached to the XY stage 508. One or more actuators 526 may be directly coupled between the Z stage plate 522 and the stage mirror 510. As an example, the actuator 526 can be a piezoelectric actuator that expands in the Z direction. One or more constraints 525 may be connected between the Z stage plate 522 and one or both of the chuck and stage mirror 510. The constraint 531 is configured to limit the movement of one or both of the stage mirror 510 and the chuck 506 in one or more directions perpendicular to the Z direction. As an example, the constraint 531 may each include a V-shaped groove 533 parallel to the Z direction. The ball bearing 535 is disposed between the V-shaped groove 533 and the recess 537 of the stage mirror 510.

  The energy beam column 502 generates an energy beam 501 that is directed to the substrate 504 on the substrate chuck 506. The XY beam deflection mechanism 507 operates the energy beam 501 in the XY plane (that is, the plane of the substrate 504). By way of example, energy beam column 502 may be an electron beam column, ion optical column, or optical column that generates some form of energy electromagnetic radiation, such as, for example, infrared, visible, or ultraviolet light.

  For example, one or more sensors 536, such as a capacitance sensor, may be positioned adjacent to the substrate chuck 506 to measure relative motion between the chuck 506 and the stage mirror 510. One or both of sensor 536 and photodetector 519 of interferometer 512 may be coupled to an actuator on the XY stage in outer feedback loop 546 as described above. Similarly, one or both of the photodetector 519 and sensor 536 may be coupled to the beam deflection mechanism 507 of the energy beam column 502 by an internal feedback loop 550 as described above.

  As seen in Table 1 above, the embodiment of the present invention reduces inter-scan error, intra-scan error, and inter-kernel error as compared to prior art substrate support devices. Embodiments of the present invention are particularly suited for applications that are sensitive to substrate motion in a direction perpendicular to the plane of the substrate. Examples of such applications include, but are not limited to, wafer inspection, reticle inspection, lithography or reticle printing. The embodiments are particularly suitable for use in vacuum, including electron microscopy, ion beam processing, electron beam processing, and the like.

  DESCRIPTION OF SYMBOLS 102 ... Electro-optical column, 103,303 ... Vacuum chamber, 106,306,506 ... Base material chuck, 107,307,507 ... XY beam deflection mechanism, 108,140,308,508 ... XY stage, 110,310,510 ... stage mirror, 112, 312, 512 ... interferometer, 122 ... Z stage, 124,322,522 ... Z stage plate, 126,146,148,346,526,546 ... actuator, 424 ... piezoelectric actuator, 128 ... bending , 136 ... Relative position sensor, 300, 500 ... Base material support device, 302, 502 ... Energy beam column, 307, 507 ... Beam deflection mechanism, 400 ... Load bending part, 402 ... Base part, 403 ... Parallelogram bending part 404: Cantilever part, 406 ... Free end, 408 ... Upper arm , 410 ... lower arm, 412 ... lever block, 416 ... first elastic hinge, 418 ... second elastic hinge, 420 ... third elastic hinge, 422 ... fourth elastic hinge, 430 ... curved surface, 525, 531: Restraint.

Claims (13)

A substrate chuck;
A Z stage coupled to a substrate chuck;
A stage mirror attached to the Z stage;
An XY stage coupled to the Z stage;
One or more relative position sensors configured to sense displacements in the X, Y, and Z directions of the substrate chuck relative to the stage mirror;
A substrate support device comprising:
The one or more relative position sensors are coupled with dynamic compensation means for dynamically compensating for movement of the substrate chuck in the X, Y, and Z directions relative to the stage mirror in one or more feedback loops. And
The dynamic compensation means includes one or more actuators configured to impart motion to the XY stage or the Z stage, and the one or more relative position sensors are configured to communicate with the one or more actuators. A substrate support apparatus comprising one or more relative position sensors in the same position . The one or more actuators comprise one or more of the Z stage actuator configured substrate chuck and the stage mirror so as to exercise the Z direction, The apparatus of claim 1. Before SL one or more actuators may comprise one or more of the XY stage actuator configured to move the Z stage in a plane generally perpendicular to the Z-direction, The apparatus of claim 2.   The apparatus of claim 1, further comprising an interferometer coupled to the stage mirror.   The apparatus of claim 1, wherein the substrate chuck is an electrostatic chuck.   The apparatus of claim 1, further comprising a vacuum chamber, wherein the substrate chuck, the stage mirror, and the Z stage are disposed in the vacuum chamber.   The apparatus of claim 1, wherein the one or more relative position sensors include a capacitive sensor, an inductive sensor or an optical sensor attached to a stage mirror adjacent to the substrate chuck. Coupling between the Z stage and the XY stage has a high stiffness in restraint of XY flat Men及 beauty Z-axis rotation, and a feature that allows free movement of the Z stage along the Z axis The apparatus of claim 1. Substrate chuck is coupled to the Z stage by one or more bent portions, the bent portion, to characterized in that it has a high rigidity and regarding the restriction of movement and of rotation about the Z axis in the XY plane that, according to claim 1. The apparatus according to claim 1, wherein the substrate chuck is attached to the Z stage so as to constrain the six degrees of freedom of movement of the substrate chuck. Further comprising an energy beam column, dynamic compensation means comprises an XY beam deflection mechanism of the energy beam column, the XY beam deflection mechanism is that is coupled to said one or more relative position sensors in internal feedback loop, wherein Item 2. The apparatus according to Item 1. The apparatus of claim 11 , wherein the energy beam column is an electro-optic column. The apparatus of claim 11 , wherein the one or more relative position sensors include an interferometer.

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