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JP5628964B1 - Radar equipment - Google Patents

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Publication number
JP5628964B1
JP5628964B1 JP2013096777A JP2013096777A JP5628964B1 JP 5628964 B1 JP5628964 B1 JP 5628964B1 JP 2013096777 A JP2013096777 A JP 2013096777A JP 2013096777 A JP2013096777 A JP 2013096777A JP 5628964 B1 JP5628964 B1 JP 5628964B1
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Prior art keywords
circuit board
printed circuit
housing
conductive
substrate
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JP2014219227A (en
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祐太 小松
祐太 小松
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Priority to JP2013096777A priority Critical patent/JP5628964B1/en
Priority to DE102013220801.4A priority patent/DE102013220801B4/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/027—Constructional details of housings, e.g. form, type, material or ruggedness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
    • G01S13/88—Radar or analogous systems specially adapted for specific applications
    • G01S13/93—Radar or analogous systems specially adapted for specific applications for anti-collision purposes
    • G01S13/931—Radar or analogous systems specially adapted for specific applications for anti-collision purposes of land vehicles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Radar Systems Or Details Thereof (AREA)

Abstract

【課題】電磁波ノイズシールドをより強化したレーダ装置等を提供する。【解決手段】一面が開放面である導電性の筐体１０３と、前記開放面と対向するように前記筐体内に収納されグランドプレーン３０２の層を有するプリント基板１０４と、を備え、前記プリント基板１０４は、基板周囲に沿って延び、基板接地部により前記グランドプレーンに電気的に接続されている導電性の基板周囲部材３０３を有し、前記筐体１０３は、側面部材１０３ｂの内周に沿って延びる段差の付けられた導電性の棚部２０１と、前記棚部の一部に設けられ前記プリント基板の外周を支持する支持面２０３ａを有する導電性の複数の台座部２０３とを有し、前記筐体１０３は、筐体接地部により前記グランドプレーンに電気的に接続され、前記プリント基板１０４が、前記基板周囲部材３０３を前記棚部２０１および前記側面部材１０３ｂの内側に近接させて配置されるレーダ装置にある。【選択図】図３A radar apparatus and the like having a further enhanced electromagnetic wave noise shield. A printed circuit board comprising: a conductive housing having an open surface on one side; and a printed circuit board having a ground plane layer 302 accommodated in the housing so as to face the open surface. Reference numeral 104 denotes a conductive substrate peripheral member 303 that extends along the periphery of the substrate and is electrically connected to the ground plane by a substrate grounding portion. The housing 103 extends along the inner periphery of the side member 103b. And a plurality of conductive pedestals 203 having a support surface 203a that is provided in a part of the shelf and supports the outer periphery of the printed circuit board. The housing 103 is electrically connected to the ground plane by a housing grounding portion, and the printed circuit board 104 connects the substrate peripheral member 303 to the shelf 201 and the side member. In proximity to the inside of 03b in the radar apparatus is arranged. [Selection] Figure 3

Description

この発明は、レーダ装置に係り、特に電磁波ノイズのシールドに関するものである。   The present invention relates to a radar apparatus, and more particularly to a shield against electromagnetic noise.

近年、車両運転時の事故抑制を目的として、車両の周辺に位置する自動車等の障害物との距離や相対速度等を計測するレーダ装置が知られている。   2. Description of the Related Art In recent years, radar devices that measure the distance, relative speed, and the like with an obstacle such as an automobile located in the vicinity of a vehicle are known for the purpose of suppressing accidents during vehicle operation.

このようなレーダ装置では、装置内から装置外への電磁波ノイズの漏洩や、装置外から装置内への電磁波ノイズ侵入、さらには装置を構成するコンポーネント間での電磁波ノイズの回り込みを抑制することを目的の一つとして、プリント基板等のコンポーネントを金属性のカバーでシールドする構造となっている。   In such a radar device, leakage of electromagnetic wave noise from the inside of the device to the outside of the device, intrusion of electromagnetic wave noise from the outside of the device to the inside of the device, and further suppression of wraparound of electromagnetic wave noise between components constituting the device are suppressed. One of the purposes is to shield components such as a printed circuit board with a metallic cover.

例えば、下記特許文献１には、制御回路基板のネジ穴に対向するハウジングに台座を設け、そこに該基板がネジ留めされ、基板の下側は金属性のリアカバーに覆われ、基板の上側はアンテナモジュールを収納するための穴が開いた金属性のフロントカバーに覆われ、該穴部にアンテナモジュールが収納され、アンテナモジュールをレドームが覆う構造を持つレーダ装置について記載されている。   For example, in the following Patent Document 1, a pedestal is provided in a housing facing a screw hole of a control circuit board, and the board is screwed thereto, and the lower side of the board is covered with a metallic rear cover, and the upper side of the board is A radar apparatus is described which is covered with a metallic front cover having a hole for accommodating an antenna module, the antenna module is accommodated in the hole, and the antenna module is covered with a radome.

特許第４２８６８５５号公報Japanese Patent No. 4286855

しかしながら、上記特許文献１に記載されたレーダ装置では、制御回路基板とハウジングとの隙間部分がシールド構造となっておらず、該隙間を介して、装置内から装置外へ電磁波ノイズが漏洩し、周囲の他の電子機器が誤動作したり、最悪の場合、故障させる恐れがある。また、前記隙間を介して、装置外から装置内へ電磁波ノイズが侵入したり、制御回路基板の上側から下側、または下側から上側へ電磁波ノイズが回り込み、レーダ装置自身が誤動作したり、最悪の場合、故障する恐れがあった。   However, in the radar device described in Patent Document 1, the gap between the control circuit board and the housing does not have a shield structure, and electromagnetic noise leaks from the inside of the device to the outside through the gap. Other electronic devices in the vicinity may malfunction or, in the worst case, cause failure. In addition, electromagnetic noise enters from outside the device into the device through the gap, or electromagnetic noise circulates from the upper side to the lower side or from the lower side to the upper side of the control circuit board. In the case of, there was a risk of breakdown.

この発明は、前記のような課題を解決するためになされたものであり、プリント基板と筐体との隙間を介して、装置内から装置外への電磁波ノイズの漏洩、および装置外から装置内への電磁波ノイズの侵入、さらにはプリント基板の上下間の電磁波ノイズの回り込みを抑制することができるレーダ装置を提供することを目的とする。   The present invention has been made to solve the above-described problems, and leakage of electromagnetic wave noise from the inside of the apparatus to the outside of the apparatus and the inside of the apparatus from the outside of the apparatus through the gap between the printed circuit board and the housing. An object of the present invention is to provide a radar apparatus capable of suppressing the invasion of electromagnetic wave noise into the antenna and further the wraparound of electromagnetic wave noise between the upper and lower sides of the printed circuit board.

この発明は、一面が開放面である導電性の筐体と、前記開放面と対向するように前記筐体内に収納されグランドプレーンの層を有するプリント基板と、を備え、前記プリント基板は、基板周囲に沿って延び、基板接地部により前記グランドプレーンに電気的に接続されている導電性の基板周囲部材を有し、前記筐体は、側面部材の内周に沿って延びる段差の付けられた導電性の棚部と、前記棚部の一部に設けられ前記プリント基板の外周を支持する支持面を有する導電性の複数の台座部とを有し、前記筐体は、筐体接地部により前記グランドプレーンに電気的に接続され、前記プリント基板が、前記基板周囲部材を前記棚部および前記側面部材の内側との間に隙間を有するように近接させて配置され、前記プリント基板の基板周囲部材は、前記台座部に対向する位置に導電性のランド部を有し、前記筐体接地部が、前記台座部と、前記ランド部と、前記ランド部および前記グランドプレーンを貫通して前記台座部に挿入される導電性の固定部材と、からなり、前記基板接地部が、前記基板周囲部材と前記グランドプレーンとを電気的に接続させる離散的に設けられた複数のスルーホールからなる、ことを特徴とするレーダ装置にある。 The present invention includes a conductive casing having an open surface on one side, and a printed circuit board having a ground plane layer housed in the casing so as to face the open surface, the printed circuit board being a substrate A conductive substrate peripheral member extending along the periphery and electrically connected to the ground plane by a substrate grounding portion, and the casing is stepped extending along the inner periphery of the side member A conductive shelf, and a plurality of conductive pedestals having a support surface that is provided on a part of the shelf and supports the outer periphery of the printed circuit board; The printed circuit board is electrically connected to the ground plane, and the printed circuit board is disposed so as to have a gap between the shelf and the inner side of the side member, Member is before A conductive land portion is provided at a position facing the pedestal portion, and the housing grounding portion is inserted into the pedestal portion through the pedestal portion, the land portion, the land portion, and the ground plane. And the substrate grounding portion is composed of a plurality of discretely provided through holes that electrically connect the substrate peripheral member and the ground plane. It is in the radar device.

この発明では、電磁波ノイズシールドをより強化したレーダ装置等を提供できる。   According to the present invention, it is possible to provide a radar apparatus or the like having a further enhanced electromagnetic noise shield.

この発明によるレーダ装置の構成の一例を示すブロック図である。It is a block diagram which shows an example of a structure of the radar apparatus by this invention. この発明の実施の形態１に係るレーダ装置の筐体の一例を示す平面図である。It is a top view which shows an example of the housing | casing of the radar apparatus which concerns on Embodiment 1 of this invention. 図２の筐体の部分ａでのＡ−Ａ線に沿った拡大された側面断面図である。FIG. 3 is an enlarged side cross-sectional view taken along the line AA at a part a of the housing in FIG. 2. 図２の筐体の部分ｂでのＢ−Ｂ線に沿った拡大された側面断面図である。FIG. 3 is an enlarged side cross-sectional view taken along line B-B in a portion b of the housing in FIG. 2. この発明の実施の形態１に係るレーダ装置の一例における基板周囲部材、ネジ穴ランド部、スルーホールの関係を示すプリント基板の下方から見た部分平面図である。It is the fragmentary top view seen from the downward direction of the printed circuit board which shows the relationship between a board | substrate surrounding member, a screw hole land part, and a through hole in an example of the radar apparatus which concerns on Embodiment 1 of this invention. この発明の実施の形態１に係るレーダ装置の別の例における基板周囲部材、ネジ穴ランド部、スルーホールの関係を示すプリント基板の下方から見た部分平面図である。It is the fragmentary top view seen from the downward direction of the printed circuit board which shows the relationship between the board | substrate surrounding member, screw hole land part, and through hole in another example of the radar apparatus which concerns on Embodiment 1 of this invention. この発明の実施の形態１に係るレーダ装置の別の例における図２の筐体の部分ａでのＡ−Ａ線に沿った拡大された側面断面図である。FIG. 6 is an enlarged side cross-sectional view taken along the line AA in a portion a of the housing of FIG. 2 in another example of the radar apparatus according to Embodiment 1 of the present invention. この発明の実施の形態２に係るレーダ装置のネジ穴ランド部の半田の配置の一例を示した図である。It is the figure which showed an example of arrangement | positioning of the solder of the screw hole land part of the radar apparatus which concerns on Embodiment 2 of this invention. この発明の実施の形態２に係るレーダ装置のネジ穴ランド部の半田の配置の別の例を示した図である。It is the figure which showed another example of arrangement | positioning of the solder of the screw hole land part of the radar apparatus which concerns on Embodiment 2 of this invention. この発明の実施の形態３に係るレーダ装置の基板周囲部材の半田の配置の一例を示した図である。It is the figure which showed an example of arrangement | positioning of the solder of the board | substrate surrounding member of the radar apparatus which concerns on Embodiment 3 of this invention.

以下、この発明によるレーダ装置を各実施の形態に従って図面を用いて説明する。なお、各実施の形態において、同一もしくは相当部分は同一符号で示し、重複する説明は省略する。   Hereinafter, a radar device according to the present invention will be described with reference to the drawings according to each embodiment. In each embodiment, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted.

実施の形態１．
図１はこの発明によるレーダ装置の構成の一例を示すブロック図である。図示の通り、レーダ装置１０１は概略、一面を開放面または開口(以下開放面とする)１０３ａとする筐体１０３に、プリント基板１０４と、プリント基板１０４に接続された送信アンテナ１０５、受信アンテナ１０６、コネクタ１０８が収納されている。開放面１０３ａはレドーム１０７で覆われている。プリント基板１０４には、送信アンテナ１０５が接続された送信デバイス１０９、受信アンテナ１０６が接続された受信デバイス１１０、受信デバイス１１０に順に接続されたフィルタ１１１とＩＦアンプ(中間周波数増幅器)１１２、そして送信デバイス１０９およびＩＦアンプ(中間周波数増幅器)１１２に接続されたマイクロコンピュータ１１３が実装されている。コネクタ１０８はプリント基板１０４の外部との電気的接続等を行う。 Embodiment 1 FIG.
FIG. 1 is a block diagram showing an example of the configuration of a radar apparatus according to the present invention. As shown in the figure, the radar apparatus 101 is roughly configured to include a printed circuit board 104, a transmission antenna 105 connected to the printed circuit board 104, and a reception antenna 106, with a casing 103 having one surface as an open surface or an opening (hereinafter referred to as an open surface) 103a. The connector 108 is accommodated. The open surface 103 a is covered with a radome 107. The printed circuit board 104 includes a transmission device 109 to which a transmission antenna 105 is connected, a reception device 110 to which a reception antenna 106 is connected, a filter 111 and an IF amplifier (intermediate frequency amplifier) 112 that are sequentially connected to the reception device 110, and transmission. A microcomputer 113 connected to the device 109 and an IF amplifier (intermediate frequency amplifier) 112 is mounted. The connector 108 performs electrical connection with the outside of the printed circuit board 104.

レーダ装置１０１は、送信デバイス１０９で生成した信号を、送信アンテナ１０５により電波に変換し、ターゲット１０２に向けて送信電波を送信する。そして、ターゲット１０２から反射した電波を、受信アンテナ１０６により受信し、その受信電波を受信デバイス１１０により受信信号に変換する。受信信号はフィルタ１１１、ＩＦアンプ１１２を介してマイクロコンピュータ１１３に入力されて信号処理され、所定の範囲内に存在するターゲット１０２までの距離と相対速度と方位とが検出される。マイクロコンピュータ１１３はまた、レーダ装置の各構成部の制御を行う。   The radar apparatus 101 converts the signal generated by the transmission device 109 into a radio wave by the transmission antenna 105 and transmits the transmission radio wave toward the target 102. The radio wave reflected from the target 102 is received by the receiving antenna 106, and the received radio wave is converted into a received signal by the receiving device 110. The received signal is input to the microcomputer 113 through the filter 111 and the IF amplifier 112 and processed, and the distance, the relative speed and the direction to the target 102 existing within a predetermined range are detected. The microcomputer 113 also controls each component of the radar apparatus.

なお、レーダ装置の動作の詳細につきてはこの発明には特に関係しないので、説明は省略する。また、図１は構成要素を説明するためのものであり、以下に説明するレーダ装置の筐体の構造とは直接対応していなし。   The details of the operation of the radar apparatus are not particularly relevant to the present invention, and will not be described here. FIG. 1 is for explaining the components, and does not directly correspond to the structure of the casing of the radar apparatus described below.

図２はこの発明の実施の形態１に係るレーダ装置の筐体の一例を示す平面図である。導電性の筐体１０３は、例えば一面が開放面である中が空洞の立方体からなり、周囲の側面部材と開放面と対向する底面部材からなる。開放面には、例えば図１のレドーム１０７が設けられたり、または開放面がレドーム１０７と対向するように筐体１０３が配置される。図２は開放面側から見た図である。   FIG. 2 is a plan view showing an example of a housing of the radar apparatus according to Embodiment 1 of the present invention. The conductive housing 103 is formed of, for example, a hollow cube whose one surface is an open surface, and includes a peripheral side surface member and a bottom surface member facing the open surface. For example, the radome 107 of FIG. 1 is provided on the open surface, or the housing 103 is disposed so that the open surface faces the radome 107. FIG. 2 is a view as seen from the open surface side.

図２おいて、筐体１０３の周囲の側面部材である壁部２０２は、壁部２０２の内周に沿って段差がつけられている所定の幅の棚部２０１と、棚部２０１の例えば四隅の部分に設けられた台座部２０３を有している(図３，４参照)。輪郭を破線で示したプリント基板１０４は、四隅を台座部２０３の上面である支持面で支持され、台座部２０３にて、ネジ等からなる導電性の固定部材により固定される。また、棚部２０１と壁部２０２とで図３に破線で示すＬ字構造部３０１を構成する。   In FIG. 2, a wall portion 202 that is a side member around the housing 103 includes a shelf portion 201 having a predetermined width along the inner periphery of the wall portion 202 and four corners of the shelf portion 201. The pedestal 203 is provided in the portion (see FIGS. 3 and 4). The printed circuit board 104 whose outline is indicated by a broken line is supported by support surfaces which are the upper surfaces of the pedestal part 203 at the four corners, and is fixed on the pedestal part 203 by a conductive fixing member such as a screw. Further, the shelf portion 201 and the wall portion 202 constitute an L-shaped structure portion 301 indicated by a broken line in FIG.

図３は図２の筐体１０３の部分ａでのＡ−Ａ線に沿った拡大された側面断面図である。１０３ｂで示す部分が筐体１０３の側面部材、１０３ｃが底面部材であり、図３の上側がレドーム(図示省略)に面した開放面となる。プリント基板１０４は、内層に導電性を有するグランドプレーン３０２を有する。さらにプリント基板１０４は、棚部２０１と対向する位置、すなわち基板の周囲に沿って、プリント基板１０４の下側の第１基板周囲部材３０３ａと、上側の第２基板周囲部材３０３ｂを含む導電性の基板周囲部材を有する。そして、グランドプレーン３０２と第１基板周囲部材３０３ａと第２基板周囲部材３０３ｂとは、第１スルーホール３０４により複数の接続点で電気的に接続されている(図５、６参照)。
スルーホール３０４の間隔は、抑制したいノイズ周波数の波長より、例えば、１／４波長以下とする。ここで、波長に関しては、プリント基板１０４の材質に合わせて波長短縮率を考慮する必要がある。 FIG. 3 is an enlarged side cross-sectional view taken along line AA in the portion a of the housing 103 in FIG. 103b is a side member of the housing 103, 103c is a bottom member, and the upper side of FIG. 3 is an open surface facing a radome (not shown). The printed circuit board 104 has a ground plane 302 having conductivity in the inner layer. Furthermore, the printed circuit board 104 includes a conductive substrate including a first substrate peripheral member 303a on the lower side of the printed circuit board 104 and a second substrate peripheral member 303b on the upper side at a position facing the shelf 201, that is, along the periphery of the substrate. A substrate peripheral member is included. The ground plane 302, the first substrate peripheral member 303a, and the second substrate peripheral member 303b are electrically connected at a plurality of connection points by the first through holes 304 (see FIGS. 5 and 6).
The interval between the through holes 304 is, for example, ¼ wavelength or less than the wavelength of the noise frequency to be suppressed. Here, regarding the wavelength, it is necessary to consider the wavelength shortening rate in accordance with the material of the printed circuit board 104.

すなわち、プリント基板１０４の図２に示す棚部２０１に沿った基板周囲部材(３０３ａ，３０３ｂ)には複数の第１スルーホール３０４が設けられ、それぞれが図３に示すようにグランドプレーン３０２と第１基板周囲部材３０３ａと第２基板周囲部材３０３ｂとを電気的に接続している。   That is, a plurality of first through holes 304 are provided in the board peripheral members (303a, 303b) along the shelf 201 shown in FIG. The first substrate peripheral member 303a and the second substrate peripheral member 303b are electrically connected.

また、筐体１０３は、棚部２０１と壁部２０２とでＬ字構造部３０１を形成する。そして、第１基板周囲部材３０３ａがＬ字構造部３０１に近接配置される。
ここで、棚部２０１は、台座部２０３よりも低く設けられており、棚部２０１はプリント基板１０４と接触しない。 In addition, the housing 103 forms an L-shaped structure 301 with the shelf 201 and the wall 202. Then, the first substrate peripheral member 303 a is disposed in proximity to the L-shaped structure portion 301.
Here, the shelf portion 201 is provided lower than the pedestal portion 203, and the shelf portion 201 does not contact the printed circuit board 104.

図４は図２の筐体１０３の部分ｂでのＢ−Ｂ線に沿った拡大された側面断面図である。プリント基板１０４は、台座部２０３の支持面２０３ａに対向する位置に導電性を有する第１ネジ穴ランド部４０２ａを有する。プリント基板１０４は、導電性の固定部材であるネジ４０１により台座部２０３に固定され、台座部２０３はプリント基板１０４の下面側に設けられた第１ネジ穴ランド部４０２ａに電気的に接続されている。そして、プリント基板１０４の第１ネジ穴ランド部４０２ａは、第２スルーホール４０３により、グランドプレーン３０２およびプリント基板１０４の上面側に設けられた導電性を有する第２ネジ穴ランド部４０２ｂと電気的に接続されている。   FIG. 4 is an enlarged side cross-sectional view taken along line B-B in a portion b of the housing 103 in FIG. The printed circuit board 104 has a first screw hole land portion 402 a having conductivity at a position facing the support surface 203 a of the pedestal portion 203. The printed circuit board 104 is fixed to the pedestal portion 203 by a screw 401 that is a conductive fixing member, and the pedestal portion 203 is electrically connected to a first screw hole land portion 402 a provided on the lower surface side of the printed circuit board 104. Yes. The first screw hole land portion 402 a of the printed board 104 is electrically connected to the ground plane 302 and the conductive second screw hole land portion 402 b provided on the upper surface side of the printed board 104 by the second through hole 403. It is connected to the.

図５は、第１および第２基板周囲部材３０３ａ，３０３ｂと第１および第２ネジ穴ランド部４０２ａ，４０２ｂと第１および第２スルーホール３０４，４０３との関係を示すプリント基板１０４の下方から見た部分平面図である。プリント基板１０４の周囲部は上面(おもて面)と下面(裏面)で同様の構造を有する。   FIG. 5 shows the relationship between the first and second board peripheral members 303a and 303b, the first and second screw hole land portions 402a and 402b, and the first and second through holes 304 and 403 from below the printed board 104. FIG. The peripheral portion of the printed circuit board 104 has the same structure on the upper surface (front surface) and the lower surface (back surface).

プリント基板１０４の下面と上面のそれぞれ表層に配置された第１および第２基板周囲部材３０３ａ，３０３ｂは、プリント基板１０４の周囲に沿って設けられた複数の第１スルーホール３０４により、グランドプレーン３０２に電気的に接続されている。また、プリント基板１０４の下面と上面のそれぞれ表層に配置された第１および第２ネジ穴ランド部４０２ａ，４０２ｂに形成されたネジ穴は、第２スルーホール４０３として構成され、グランドプレーン３０２に電気的に接続されている。   The first and second board peripheral members 303a and 303b arranged on the surface layers of the lower surface and the upper surface of the printed circuit board 104 are ground planes 302 by a plurality of first through holes 304 provided along the periphery of the printed circuit board 104. Is electrically connected. The screw holes formed in the first and second screw hole land portions 402a and 402b arranged on the surface layers of the lower surface and the upper surface of the printed circuit board 104 are configured as second through holes 403, and are electrically connected to the ground plane 302. Connected.

このように、筐体１０３とプリント基板１０４との隙間３０５を、同じグランド電位である、Ｌ字構造部３０１(棚部２０１と壁部２０２で構成される)と、Ｌ字構造部３０１と同じグランド電位であり、Ｌ字構造部３０１に対向して近接配置される、第１基板周囲部材３０３ａと、第１スルーホール３０４と、第２基板周囲部材３０３ｂ、とで囲うようにしている。
これにより、プリント基板１０４の上側から隙間３０５を見た場合は、該隙間３０５が台座部２０３と棚部２０１で塞がれる構造となっているためプリント基板１０４の上側からのインピーダンスが高くなる。同様に、プリント基板１０４の下側から隙間３０５を見た場合は、該隙間３０５が壁部２０２で塞がれる構造となっているためプリント基板１０４の下側からのインピーダンスが高くなる。
プリント基板１０４の上側または下側から隙間３０５に到来したノイズが、該隙間３０５で反射され、該隙間３０５を伝搬するノイズが抑制される。すなわち、該隙間３０５に電磁シールド効果をもたらす。
ここで、第１スルーホール３０４は、前述の通り、抑制したいノイズ周波数の波長から算出される間隔毎に設けられるため、該スルーホール３０４間には隙間が開いている。しかしながら、該隙間は、ノイズの波長に対して十分小さいため、ノイズに対しては、該スルーホール３０４は隙間のない遮蔽面として作用する。したがって、該スルーホール３０４により、プリント基板１０４側面を介して、基板上側から下側あるいは基板下側から上側に通過するノイズを抑制することができる。 In this manner, the gap 305 between the housing 103 and the printed circuit board 104 is the same as the L-shaped structure portion 301 (configured by the shelf portion 201 and the wall portion 202) and the L-shaped structure portion 301 having the same ground potential. It is a ground potential, and is surrounded by a first substrate peripheral member 303a, a first through hole 304, and a second substrate peripheral member 303b, which are disposed close to and opposed to the L-shaped structure 301.
Thus, when the gap 305 is viewed from the upper side of the printed circuit board 104, the impedance from the upper side of the printed circuit board 104 is increased because the gap 305 is closed by the pedestal 203 and the shelf 201. Similarly, when the gap 305 is viewed from the lower side of the printed circuit board 104, the impedance from the lower side of the printed circuit board 104 is increased because the gap 305 is closed by the wall portion 202.
Noise that arrives at the gap 305 from the upper side or the lower side of the printed circuit board 104 is reflected by the gap 305, and noise that propagates through the gap 305 is suppressed. In other words, the gap 305 has an electromagnetic shielding effect.
Here, as described above, since the first through holes 304 are provided at intervals calculated from the wavelength of the noise frequency to be suppressed, a gap is opened between the through holes 304. However, since the gap is sufficiently small with respect to the wavelength of noise, the through hole 304 acts as a shielding surface without a gap against noise. Therefore, the through-hole 304 can suppress noise passing through the side surface of the printed circuit board 104 from the upper side of the board to the lower side or from the lower side of the board to the upper side.

なお、図５では第１スルーホール３０４を直線的に並べて配置したが、図６のように、千鳥格子状に配置しても構わない。   In FIG. 5, the first through holes 304 are arranged in a straight line, but may be arranged in a staggered pattern as shown in FIG.

また、図３では、棚部２０１の縦の長さをプリント基板１０４の下面の少し下当たりから筐体１０３の底面部材１０３ｃまで確保しているが、図７に示したようにプリント基板１０４の下面の少し下当たりから所定の長さとし、短くしても構わない。
また、図３、図４では、棚部２０１を台座部２０３よりも低く設けたが、棚部２０１を台座部２０３と同じ高さとしても構わない。 In FIG. 3, the vertical length of the shelf 201 is secured from a little below the bottom surface of the printed circuit board 104 to the bottom surface member 103 c of the housing 103, but as shown in FIG. It may be a predetermined length from slightly below the lower surface, and may be shortened.
3 and 4, the shelf 201 is provided lower than the pedestal 203, but the shelf 201 may be the same height as the pedestal 203.

以上のようにして、実施の形態１に係るレーダ装置では、プリント基板１０４が、基板表面に、複数の第１のスルーホール３０４によりグランドプレーン３０２に電気的に接続された基板周囲に沿って配置される基板周囲部材３０３ａ，３０３ｂを有し、さらに、プリント基板１０４が、基板表面に、第２のスルーホール４０３によりグランドプレーン３０２に電気的に接続されたネジ穴ランド部４０２ａ，４０２ｂを有する。そして、筐体１０３は、プリント基板１０４がネジ４０１により台座部２０３に固定されることによってグランドプレーン３０２に接続される。さらに、筐体１０３は、基板周囲部材３０３ａに対向する棚部２０１を有し、棚部２０１と壁部２０２とで形成されるＬ字構造部３０１が、基板周囲部材３０３ａに近接配置されるため、プリント基板１０４と筐体１０３との隙間３０５を狭くすることが可能となり、Ｌ字構造部３０１と基板周囲部材３０３ａとスルーホール３０４とにより電磁シールドを形成することで、図７のＮで示すような、隙間３０５を介して、装置内から装置外への電磁波ノイズ漏洩、および装置外から装置内への電磁波ノイズ侵入、さらにはプリント基板上側から下側または下側から上側への電磁波ノイズの回り込みを抑制することができる。   As described above, in the radar apparatus according to Embodiment 1, the printed circuit board 104 is arranged on the surface of the board along the periphery of the board electrically connected to the ground plane 302 by the plurality of first through holes 304. The printed circuit board 104 has screw hole land portions 402a and 402b that are electrically connected to the ground plane 302 by the second through holes 403 on the surface of the board. The housing 103 is connected to the ground plane 302 by fixing the printed circuit board 104 to the pedestal portion 203 with screws 401. Further, the housing 103 has a shelf 201 facing the substrate peripheral member 303a, and the L-shaped structure 301 formed by the shelf 201 and the wall 202 is disposed close to the substrate peripheral member 303a. The gap 305 between the printed circuit board 104 and the housing 103 can be narrowed, and an electromagnetic shield is formed by the L-shaped structure portion 301, the substrate peripheral member 303a, and the through hole 304, which is denoted by N in FIG. Leakage of electromagnetic wave noise from the inside of the apparatus to the outside of the apparatus, intrusion of electromagnetic wave noise from the outside of the apparatus to the inside of the apparatus, and electromagnetic wave noise from the upper side to the lower side or from the lower side to the upper side of the printed board. The wraparound can be suppressed.

すなわちこの発明では、一方が開放面の筐体１０３は、底面部材１０３ｃと底面部材１０３ｃの周囲に沿った側面部材１０３ｂからなり、側面部材１０３ｂである壁部２０２には、内周に沿って段差を付けた棚部２０１と台座部２０３が形成されている。プリント基板１０４は外周が台座部２０３の支持面２０３ａで支持されて筐体１０３内に格納される。筐体１０３は、壁部２０２と棚部２０１、さらに四隅の台座部２０３が一般的には同じ材料で一体形成されたもので、導電性を有する。   That is, in this invention, the housing 103 having one open surface is composed of the bottom surface member 103c and the side surface member 103b along the periphery of the bottom surface member 103c, and the wall portion 202 which is the side surface member 103b has a step along the inner periphery. A shelf portion 201 and a pedestal portion 203 are formed. The outer periphery of the printed circuit board 104 is supported by the support surface 203 a of the pedestal portion 203 and stored in the housing 103. The housing 103 has a wall portion 202, a shelf portion 201, and pedestal portions 203 at four corners, which are generally formed of the same material, and have conductivity.

プリント基板１０４は、少なくとも１つの層にグランドプレーン３０２を設け、また基板のおもて面と裏面に基板周囲に沿って延びる導電性の基板周囲部材３０３ａ，３０３ｂを有する。基板周囲部材３０３ａ，３０３ｂは、基板接地部によりグランドプレーン３０２に電気的に接続されている。筐体１０３は、筐体接地部によりグランドプレーン３０２に電気的に接続されている。   The printed circuit board 104 is provided with a ground plane 302 in at least one layer, and has conductive substrate peripheral members 303a and 303b extending along the periphery of the substrate on the front surface and the back surface of the substrate. The board peripheral members 303a and 303b are electrically connected to the ground plane 302 by the board grounding portion. The housing 103 is electrically connected to the ground plane 302 by a housing grounding portion.

そしてプリント基板１０４が、基板周囲部材３０３ａ，３０３ｂを、棚部２０１の上面２０１ａおよび側面部材１０３ｂの内側からなるＬ字構造部３０１に近接させて配置される。なお、棚部２０１の上面２０１ａと側面部材１０３ｂの内側にプリント基板１０４の基板周囲部材３０３ａ，３０３ｂを近接させるために、プリント基板１０４が直方体をしていることから、棚部２０１の上面２０１ａと側面部材１０３ｂ(壁部２０２)の内側はＬ字構造部としているが、プリント基板１０４の端部の形状に合わせた形状の構造にすればよい。   Then, the printed circuit board 104 is arranged with the board peripheral members 303a and 303b in the vicinity of the L-shaped structure 301 formed on the inside of the upper surface 201a of the shelf 201 and the side member 103b. In order to bring the board peripheral members 303a and 303b of the printed circuit board 104 close to the inner surface of the upper surface 201a of the shelf 201 and the side member 103b, the printed circuit board 104 has a rectangular parallelepiped. Although the inside of the side member 103b (wall portion 202) is an L-shaped structure, a structure having a shape matching the shape of the end of the printed circuit board 104 may be used.

また筐体１０３の棚部２０１は、プリント基板１０４を固定するための導電性の台座部２０３を一部に有する。またプリント基板１０４の基板周囲部材３０３は、台座部２０３に対向する位置に導電性のランド部(４０２ａ，４０２ｂ)を有する。そして台座部２０３と、ランド部４０２ａ，４０２ｂとグランドプレーン３０２を貫通して台座部２０３に挿入されるネジ等からなる導電性の固定部材４０１と、により前記筐体接地部を構成する。なお、台座部２０３も支持面２０３ａでプリント基板１０４を支持する。   Further, the shelf 201 of the housing 103 has a conductive pedestal 203 for fixing the printed circuit board 104 in part. The board peripheral member 303 of the printed board 104 has conductive land portions (402a, 402b) at positions facing the pedestal portion 203. Then, the housing grounding portion is configured by the pedestal portion 203, and the conductive fixing members 401 made of screws or the like that are inserted into the pedestal portion 203 through the land portions 402a and 402b and the ground plane 302. The pedestal 203 also supports the printed circuit board 104 with the support surface 203a.

またプリント基板１０４において、基板周囲部材３０３ａ，３０３ｂとグランドプレーン３０２とを電気的に接続させる離散的に設けられた複数のスルーホール３０４により前記基板接地部を構成する。   In the printed circuit board 104, the substrate grounding portion is configured by a plurality of discrete through holes 304 that electrically connect the substrate peripheral members 303a and 303b and the ground plane 302.

実施の形態２．
図８は、この発明の実施の形態２に係るレーダ装置のネジ穴ランド部の半田の配置例を示した図である。ネジ穴ランド部以外の構成は、実施の形態１と同様である。図８に示したように、半田８０１がプリント基板１０４の下面側のネジ穴ランド部４０２ａの四方に設けられている。半田８０１を介して、プリント基板１０４に設けたネジ穴ランド部４０２ａと筐体１０３に設けた台座部２０３の支持面２０３ａとを電気的に導通させることによって、筐体１０３とプリント基板１０４を確実に電気的に導通させる。 Embodiment 2. FIG.
FIG. 8 is a diagram showing an example of solder arrangement in the screw hole land portion of the radar device according to Embodiment 2 of the present invention. The configuration other than the screw hole land is the same as that of the first embodiment. As shown in FIG. 8, solder 801 is provided on four sides of the screw hole land portion 402 a on the lower surface side of the printed circuit board 104. The case 103 and the printed circuit board 104 are securely connected by electrically connecting the screw hole land part 402 a provided in the printed circuit board 104 and the support surface 203 a of the pedestal part 203 provided in the housing 103 through the solder 801. Electrically conducting.

なお、図９はネジ穴ランド部４０２ａの半田８０１の他の配置例を示した図である。このように、ネジ穴ランド部４０２ａの斜め方向に、半田８０１を配置しても構わない。   FIG. 9 is a view showing another arrangement example of the solder 801 of the screw hole land portion 402a. As described above, the solder 801 may be disposed in the oblique direction of the screw hole land portion 402a.

また、図８、図９の例では、台座部２０３とネジ穴ランド部４０２ａとの電気的導通を確保するために半田８０１を用いたが、他の導電体、例えば、導電性ペースト等(これらを全て含めて第１の導電体とする)を用いることができることは言うまでもない。
さらに、半田８０１を離散的に配置する例を示したが、スルーホール４０３を囲うように連続的に配置することも可能である。
なお、半田８０１を下面側のネジ穴ランド部４０２ａ側に設ける例を示したが、半田８０１を上面側のネジ穴ランド部４０２ｂ側にも配置して、ネジ４０１との電気的導通をより確実に確保するようにしてもよい。 In the examples of FIGS. 8 and 9, the solder 801 is used to ensure electrical continuity between the pedestal portion 203 and the screw hole land portion 402a. However, other conductors such as conductive paste (such as these) It is needless to say that the first conductor can be used including all of the above.
Furthermore, although the example in which the solders 801 are discretely arranged has been shown, it is also possible to arrange them continuously so as to surround the through holes 403.
In addition, although the example in which the solder 801 is provided on the screw hole land portion 402a side on the lower surface side is shown, the solder 801 is also disposed on the screw hole land portion 402b side on the upper surface side, thereby ensuring more reliable electrical conduction with the screw 401. You may make it secure to.

以上のようにして、実施の形態２に係るレーダ装置では、半田８０１を介して筐体１０３に設けた台座部２０３とプリント基板１０４に設けたネジ穴ランド部４０２ａとを電気的に導通させることによって、実施の形態１に記載のレーダ装置よりも筐体１０３とプリント基板１０４とを確実に電気的に導通させることができ、プリント基板１０４と筐体１０３との隙間を介しての電磁波ノイズ漏洩、侵入、回り込み抑制の効果を高めることができる。   As described above, in the radar apparatus according to the second embodiment, the pedestal portion 203 provided in the housing 103 and the screw hole land portion 402a provided in the printed circuit board 104 are electrically connected via the solder 801. Thus, the casing 103 and the printed circuit board 104 can be more reliably electrically connected to each other than the radar apparatus described in the first embodiment, and electromagnetic noise leakage can be caused through the gap between the printed circuit board 104 and the casing 103. In addition, the effect of suppressing intrusion and wraparound can be enhanced.

すなわち、筐体接地部は、台座部２０３とランド部(４０２ａ，４０２ｂ)とを電気的に接続させる第１の導電体(８０１)をさらに含む。第１の導電体は半田または導電性ペーストからなる。   That is, the housing grounding part further includes a first conductor (801) that electrically connects the pedestal part 203 and the land parts (402a, 402b). The first conductor is made of solder or conductive paste.

実施の形態３．
図１０は、この発明の実施の形態３に係るレーダ装置の基板周囲部材の半田の配置例を示した図である。基板周囲部材以外の構成は、実施の形態１と同様である。多数の半田１００１が、基板周囲部材３０３ａに離散的に配置される。半田１００１を介して、プリント基板１０４の下面に設けた基板周囲部材３０３ａと筐体１０３に設けたＬ字構造部３０１の棚部２０１の上面２０１ａとを多数の接続点で電気的に導通させることによって、筐体１０３とプリント基板１０４とを低インピーダンスに、なおかつ確実に電気的に導通させる。
半田１００１の間隔は、抑制したいノイズ周波数の波長より、例えば、１／４波長以下とする。 Embodiment 3 FIG.
FIG. 10 is a diagram showing an example of the arrangement of solder on the board peripheral member of the radar apparatus according to Embodiment 3 of the present invention. The configuration other than the substrate peripheral member is the same as that of the first embodiment. A large number of solders 1001 are discretely arranged on the board peripheral member 303a. Via the solder 1001, the board peripheral member 303a provided on the lower surface of the printed circuit board 104 and the upper surface 201a of the shelf 201 of the L-shaped structure 301 provided on the housing 103 are electrically connected at a number of connection points. Thus, the housing 103 and the printed circuit board 104 are electrically connected to each other with low impedance and surely.
The interval of the solder 1001 is set to, for example, ¼ wavelength or less than the wavelength of the noise frequency to be suppressed.

なお、図１０では、半田１００１をスルーホール３０４よりも基板の内側に配置したが、スルーホール３０４よりも外側に配置することも可能である。
また、Ｌ字構造部３０１と基板周囲部材３０３ａとの電気的導通を確保するために半田を用いたが、他の導電体、例えば、導電性ペースト等(これらを全て含めて第２の導電体とする)を用いることができることは言うまでもない。
また、基板周囲部材３０３ａに半田１００１を離散的に配置する例を示したが、半田をはじめとする導電体を連続的に配置してもよい。 In FIG. 10, the solder 1001 is disposed on the inner side of the substrate than the through hole 304, but may be disposed on the outer side of the through hole 304.
In addition, although solder is used to ensure electrical continuity between the L-shaped structure portion 301 and the board peripheral member 303a, other conductors such as a conductive paste (including all of them, the second conductor It goes without saying that can be used.
Further, although the example in which the solder 1001 is discretely arranged on the substrate peripheral member 303a has been shown, a conductor such as solder may be continuously arranged.

以上のようにして、実施の形態３に係るレーダ装置では、半田１００１を介して筐体１０３に設けたＬ字構造部３０１とプリント基板１０４に設けた基板周囲部材３０３とを電気的に導通させることによって、実施の形態１または２に記載のレーダ装置よりも、筐体とプリント基板とを低インピーダンスに、なおかつ確実に電気的に導通させることができ、プリント基板と筐体との隙間を介しての電磁波ノイズ漏洩、侵入、回り込み抑制の効果を高めることができる。   As described above, in the radar apparatus according to Embodiment 3, the L-shaped structure 301 provided in the housing 103 and the board peripheral member 303 provided in the printed board 104 are electrically connected via the solder 1001. Thus, the casing and the printed circuit board can be electrically connected to each other with lower impedance and more reliably than the radar apparatus described in the first or second embodiment, and the gap between the printed circuit board and the casing can be ensured. The effect of suppressing all electromagnetic noise leakage, intrusion and wraparound can be enhanced.

すなわち、筐体接地部は、棚部２０１の上面２０１ａとプリント基板１０４の基板周囲部材３０３ａとを電気的に接続させる第２の導電体(１００１)をさらに含む。第２の導電体は複数の導電部が離散的に配置されており、第２の導電体は半田または導電性ペーストからなる。
またこの場合上述のように、棚部２０１の上面２０１ａの高さを台座部２０３の支持面２０３ａと同じ高さとしてもよい。 That is, the housing grounding part further includes a second conductor (1001) that electrically connects the upper surface 201a of the shelf 201 and the board peripheral member 303a of the printed board 104. The second conductor has a plurality of conductive portions discretely arranged, and the second conductor is made of solder or conductive paste.
In this case, as described above, the height of the upper surface 201a of the shelf 201 may be the same as the height of the support surface 203a of the pedestal 203.

なお、この発明は上記各実施の形態に限定されるものではなく、これらの実施の形態の可能な組み合わせを全て含むことは云うまでもない。   The present invention is not limited to the above-described embodiments, and it is needless to say that all possible combinations of these embodiments are included.

１０１ レーダ装置、１０２ ターゲット、１０３ 筐体、１０３ａ 開放面、１０３ｂ 側面部材、１０３ｃ 底面部材、１０４ プリント基板、１０５ 送信アンテナ、１０６ 受信アンテナ、１０７ レドーム、１０８ コネクタ、１０９ 送信デバイス、１１０ 受信デバイス、１１１ フィルタ、１１２ ＩＦアンプ、１１３ マイクロコンピュータ、２０１ 棚部、２０１ａ 上面、２０２ 壁部(側面部材)、２０３ 台座部、２０３ａ 支持面、３０１ Ｌ字構造部、３０２ グランドプレーン、３０３ａ 第１基板周囲部材、３０３ｂ 第２基板周囲部材、３０４，４０３ スルーホール、３０５ 隙間、４０１ 固定部材(ネジ)、４０２ａ 第１ネジ穴ランド部、４０２ｂ 第２ネジ穴ランド部、８０１，１００１ 半田。   101 Radar device, 102 Target, 103 Housing, 103a Open surface, 103b Side member, 103c Bottom member, 104 Printed circuit board, 105 Transmit antenna, 106 Receive antenna, 107 Radome, 108 connector, 109 Transmit device, 110 Receive device, 111 Filter, 112 IF amplifier, 113 microcomputer, 201 shelf, 201a upper surface, 202 wall (side member), 203 pedestal, 203a support surface, 301 L-shaped structure, 302 ground plane, 303a first substrate surrounding member, 303b Second substrate peripheral member, 304, 403 through hole, 305 gap, 401 fixing member (screw), 402a first screw hole land portion, 402b second screw hole land portion, 801, 1001 solder.

Claims (4)

一面が開放面である導電性の筐体と、
前記開放面と対向するように前記筐体内に収納されグランドプレーンの層を有するプリント基板と、
を備え、
前記プリント基板は、基板周囲に沿って延び、基板接地部により前記グランドプレーンに電気的に接続されている導電性の基板周囲部材を有し、
前記筐体は、側面部材の内周に沿って延びる段差の付けられた導電性の棚部と、前記棚部の一部に設けられ前記プリント基板の外周を支持する支持面を有する導電性の複数の台座部とを有し、
前記筐体は、筐体接地部により前記グランドプレーンに電気的に接続され、
前記プリント基板が、前記基板周囲部材を前記棚部および前記側面部材の内側との間に隙間を有するように近接させて配置され、
前記プリント基板の基板周囲部材は、前記台座部に対向する位置に導電性のランド部を有し、
前記筐体接地部が、前記台座部と、前記ランド部と、前記ランド部および前記グランドプレーンを貫通して前記台座部に挿入される導電性の固定部材と、からなり、
前記基板接地部が、前記基板周囲部材と前記グランドプレーンとを電気的に接続させる離散的に設けられた複数のスルーホールからなる、
ことを特徴とするレーダ装置。 A conductive housing with an open surface on one side;
A printed circuit board having a ground plane layer housed in the housing to face the open surface;
With
The printed circuit board includes a conductive substrate surrounding member that extends along the periphery of the substrate and is electrically connected to the ground plane by a substrate grounding portion;
The casing is a conductive shelf having a stepped conductive shelf extending along the inner periphery of the side member, and a support surface provided on a part of the shelf and supporting the outer periphery of the printed circuit board. A plurality of pedestals,
The case is electrically connected to the ground plane by a case grounding unit,
The printed circuit board is disposed in such a manner that the substrate surrounding member is close to each other so as to have a gap between the shelf and the inside of the side member,
The printed circuit board peripheral member has a conductive land portion at a position facing the pedestal portion,
The housing grounding portion includes the pedestal portion, the land portion, and a conductive fixing member that is inserted into the pedestal portion through the land portion and the ground plane.
The substrate grounding portion is composed of a plurality of discretely provided through holes that electrically connect the substrate peripheral member and the ground plane.
Radar apparatus characterized by the above. 前記筐体接地部が、前記棚部の上面と前記基板周囲部材とを電気的に接続させる導電体を含むことを特徴とする請求項１に記載のレーダ装置。   The radar apparatus according to claim 1, wherein the housing grounding portion includes a conductor that electrically connects an upper surface of the shelf and the substrate peripheral member. 前記導電体は複数の導電部が離散的に配置されていることを特徴とする請求項２に記載のレーダ装置。   The radar apparatus according to claim 2, wherein a plurality of conductive parts are discretely arranged on the conductor. 前記導電体が半田または導電性ペーストであることを特徴とする請求項１または２に記載のレーダ装置。   The radar apparatus according to claim 1, wherein the conductor is solder or a conductive paste.
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