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JP5627784B2 - Electronic component holding structure and electronic device using the same - Google Patents

Electronic component holding structure and electronic device using the same Download PDF

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JP5627784B2
JP5627784B2 JP2013522372A JP2013522372A JP5627784B2 JP 5627784 B2 JP5627784 B2 JP 5627784B2 JP 2013522372 A JP2013522372 A JP 2013522372A JP 2013522372 A JP2013522372 A JP 2013522372A JP 5627784 B2 JP5627784 B2 JP 5627784B2
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electronic component
holder
transistor
hole
holding structure
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JPWO2013005263A1 (en
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涛 于
涛 于
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Mitsubishi Electric Corp
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/12Resilient or clamping means for holding component to structure

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  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Description

この発明は、ホルダに収納されたトランジスタなどの電子部品を基板およびシャーシに保持する電子部品保持構造およびこれを用いた電子機器に関する。   The present invention relates to an electronic component holding structure for holding an electronic component such as a transistor housed in a holder on a substrate and a chassis, and an electronic apparatus using the electronic component holding structure.

従来、パワートランジスタなどのねじ止め用の貫通孔を有する電子部品は、はんだ付けなどによる基板への取り付けと上記貫通孔を介したねじ止めとによって電子機器内に保持される場合がある。このようにねじ止めと合わせて強固に保持することで、トランジスタへ外力が加わって基板に取り付けた端子が変形してショートしたり、端子のはんだ付け部分が破損することを防ぐことができる。
例えば、特許文献1には、基板に実装されたトランジスタを放熱部材に取り付ける方法が開示されている。この方法では、トランジスタ取付用ガイドの凹部にトランジスタ本体を嵌め込んでその動きを規制してから放熱部材にトランジスタをねじ止めする。このようにすることで、放熱部材へのねじ止めの際にトランジスタ本体がともに回転して、端子が変形することを防止している。
Conventionally, an electronic component having a through hole for screwing such as a power transistor may be held in an electronic device by being attached to a substrate by soldering or the like and screwed through the through hole. Thus, by firmly holding together with screwing, it is possible to prevent a terminal attached to the substrate from being deformed and short-circuited due to an external force applied to the transistor and to prevent a soldered portion of the terminal from being damaged.
For example, Patent Document 1 discloses a method of attaching a transistor mounted on a substrate to a heat dissipation member. In this method, the transistor body is fitted into the recess of the transistor mounting guide to restrict its movement, and then the transistor is screwed to the heat dissipation member. By doing so, the transistor body is prevented from rotating together with screws to the heat radiating member and the terminals are prevented from being deformed.

特開平6−177563号公報JP-A-6-177563

ホルダに収納したトランジスタを基板に取り付け、電子機器のシャーシにねじ止めする保持構造とすれば、特許文献1のトランジスタ取付用ガイドは不要である。
しかしながら、従来では、トランジスタ(電子部品)の寸法公差の影響から、トランジスタの貫通孔とホルダのねじ穴とが位置ずれし、ねじ止めの際に、ねじによってトランジスタの貫通孔の開口部分やその内周面が削られるという課題があった。この削れ屑が電子機器内に入り込むと、不具合を起こす要因となる可能性がある。
If the holding structure is such that the transistor housed in the holder is attached to the substrate and is screwed to the chassis of the electronic device, the transistor mounting guide of Patent Document 1 is unnecessary.
However, conventionally, due to the influence of the dimensional tolerance of the transistor (electronic component), the through hole of the transistor and the screw hole of the holder are displaced from each other. There was a problem that the peripheral surface was cut. If the shavings enter the electronic device, there is a possibility of causing a problem.

この発明は、上記のような課題を解決するためになされたもので、ホルダに収納した電子部品の取り付けで電子部品の寸法公差の影響を低減することができる電子部品保持構造およびこれを用いた電子機器を得ることを目的とする。   The present invention has been made to solve the above-described problems, and an electronic component holding structure capable of reducing the influence of the dimensional tolerance of the electronic component by attaching the electronic component housed in the holder and the same are used. The purpose is to obtain electronic equipment.

この発明に係る電子部品保持構造は、ねじ止め用の貫通孔を有した電子部品をホルダに収納し、ホルダに収納した電子部品の端子を基板に取り付け、貫通孔およびホルダに設けた孔部を介して当該電子部品をねじ止めする電子部品保持構造であって、ホルダが、電子部品をホルダに収納する際に当該電子部品の上面部に掛合する掛合部と、収納した電子部品と係合して、当該電子部品の貫通孔の中心から当該電子部品の端子側の面までの寸法で当該ホルダに設けた孔部に対する当該電子部品の貫通孔の位置決めを行う第1の係合部と、収納された電子部品と係合して、当該ホルダ内での当該電子部品の貫通孔の方向の動きを規制する第2の係合部とを備え、ホルダの両側面が電子部品に当接してなる。 In the electronic component holding structure according to the present invention, an electronic component having a through hole for screwing is accommodated in a holder, a terminal of the electronic component accommodated in the holder is attached to a substrate, and a hole provided in the through hole and the holder is provided. the electronic component an electronic component holding structure for screwing through, the holder includes a fitting part which engages on the upper surface of the electronic component when accommodating the electronic component holder, accommodating electronic components engaged A first engaging portion for positioning the through hole of the electronic component with respect to the hole provided in the holder with a dimension from the center of the through hole of the electronic component to the terminal side surface of the electronic component ; A second engagement portion that engages with the electronic component and restricts movement of the electronic component in the direction of the through hole in the holder, and both side surfaces of the holder are in contact with the electronic component .

この発明によれば、ホルダに収納した電子部品の取り付けで電子部品の寸法公差の影響を低減することができるという効果がある。   According to this invention, there is an effect that the influence of the dimensional tolerance of the electronic component can be reduced by attaching the electronic component housed in the holder.

この発明の実施の形態1に係る電子部品保持構造を用いた電子機器を示す図である。It is a figure which shows the electronic device using the electronic component holding structure which concerns on Embodiment 1 of this invention. 従来の電子部品保持構造を示す図である。It is a figure which shows the conventional electronic component holding structure. 従来の電子部品保持構造における課題を説明するための図である。It is a figure for demonstrating the subject in the conventional electronic component holding structure. 実施の形態1に係る電子部品保持構造を示す図である。It is a figure which shows the electronic component holding structure which concerns on Embodiment 1. FIG. 実施の形態1に係るホルダに収納した電子部品を示す側面図である。4 is a side view showing an electronic component housed in a holder according to Embodiment 1. FIG. この発明の実施の形態2に係る電子部品保持構造を示す図である。It is a figure which shows the electronic component holding structure which concerns on Embodiment 2 of this invention. 実施の形態2に係るホルダに収納した電子部品の様子を示す図である。It is a figure which shows the mode of the electronic component accommodated in the holder which concerns on Embodiment 2. FIG. 実施の形態2に係るホルダに収納した電子部品を示す側面図である。6 is a side view showing an electronic component housed in a holder according to Embodiment 2. FIG.

以下、この発明をより詳細に説明するため、この発明を実施するための形態について、添付の図面に従って説明する。
実施の形態1.
図1は、この発明の実施の形態1に係る電子部品保持構造を用いた電子機器を示す図である。図1に示す電子機器1の筐体本体は、少なくとも一方向に開口した箱形状のシャーシ15とその開口を覆うように取り付ける天板16を用いて構成される。筐体本体には、電子部品を実装した基板13が収納される。この発明に係る電子部品保持構造は、実施の形態1に係るホルダ2に収納したトランジスタ(電子部品)10を基板13および電子機器1のシャーシ15に保持する。
Hereinafter, in order to describe the present invention in more detail, modes for carrying out the present invention will be described with reference to the accompanying drawings.
Embodiment 1 FIG.
FIG. 1 is a view showing an electronic apparatus using the electronic component holding structure according to Embodiment 1 of the present invention. The housing main body of the electronic device 1 shown in FIG. 1 is configured using a box-shaped chassis 15 opened in at least one direction and a top plate 16 attached so as to cover the opening. A substrate 13 on which electronic components are mounted is housed in the housing body. The electronic component holding structure according to the present invention holds the transistor (electronic component) 10 housed in the holder 2 according to the first embodiment on the substrate 13 and the chassis 15 of the electronic device 1.

ここで、従来の電子部品保持構造について説明する。
図2は、従来の電子部品保持構造を示す図である。図2(a)に示すように、従来のホルダ100は、係合部101、脚部102,103およびバーリング穴104を有する。また、ホルダ100のバーリング穴104に対向する位置に、ねじ14を通すための孔部が形成する。一方、トランジスタ10には、図2(b)に示すように、ねじ止め用の貫通孔11および端子12が設けられる。端子12は、くさび形状の端子基部12aと先端部12bとから形成される。
従来のホルダ100では、トランジスタ10の貫通孔11の中心位置から端子基部12aの先端部12bとの接続部分までの寸法Hに合わせてバーリング穴104と貫通孔11とが位置決めされる。
Here, a conventional electronic component holding structure will be described.
FIG. 2 is a view showing a conventional electronic component holding structure. As shown in FIG. 2A, the conventional holder 100 has an engaging portion 101, leg portions 102 and 103, and a burring hole 104. In addition, a hole for passing the screw 14 is formed at a position facing the burring hole 104 of the holder 100. On the other hand, the transistor 10 is provided with a through hole 11 and a terminal 12 for screwing, as shown in FIG. The terminal 12 is formed of a wedge-shaped terminal base portion 12a and a tip portion 12b.
In the conventional holder 100, the burring hole 104 and the through hole 11 are positioned according to the dimension H from the center position of the through hole 11 of the transistor 10 to the connection portion with the tip end portion 12b of the terminal base 12a.

ホルダ100に収納したトランジスタ10を、図2(c)に示すように基板13およびシャーシ15に保持する。
まず、ホルダ100の脚部102,103とトランジスタ10の端子12の先端部12bとを基板13の端子穴に挿入し、さらに係合部101をシャーシ15のホルダ取り付け部分に引っ掛ける。このとき、トランジスタ10の端子12は、端子基部12aが基板13の端子穴に引っ掛かるまで、先端部12bが挿入される。
次に、シャーシ15に設けた孔部からホルダ100およびトランジスタ10の孔部を貫通させて、ねじ14をバーリング穴104でねじ止めする。この後、脚部102,103および端子12の先端部12bを基板13にはんだ付け固定する。
The transistor 10 accommodated in the holder 100 is held on the substrate 13 and the chassis 15 as shown in FIG.
First, the leg portions 102 and 103 of the holder 100 and the tip end portion 12 b of the terminal 12 of the transistor 10 are inserted into the terminal holes of the substrate 13, and the engaging portion 101 is hooked on the holder mounting portion of the chassis 15. At this time, the terminal portion 12 b of the transistor 10 is inserted until the terminal base portion 12 a is caught in the terminal hole of the substrate 13.
Next, the holder 14 and the hole of the transistor 10 are passed through the hole provided in the chassis 15, and the screw 14 is screwed with the burring hole 104. Thereafter, the leg portions 102 and 103 and the tip end portion 12b of the terminal 12 are fixed to the substrate 13 by soldering.

図3は、従来の電子部品保持構造における課題を説明するための図である。図2(b)に示す寸法Hで位置決めされているので、トランジスタ10の貫通孔11とホルダ100のバーリング穴104は、図3(a)に示すようにその位置は一致する。
しかし、端子12の寸法にはばらつきがあり、寸法Hの公差は大きい。このため、ホルダ100に収納したトランジスタ10を基板13に取り付ける際、図3(b)に示すように、トランジスタ10の貫通孔11とホルダ100のバーリング穴104との位置がずれる場合がある。
FIG. 3 is a diagram for explaining a problem in the conventional electronic component holding structure. 2B, the through hole 11 of the transistor 10 and the burring hole 104 of the holder 100 coincide with each other as shown in FIG. 3A.
However, the dimensions of the terminal 12 vary and the tolerance of the dimension H is large. For this reason, when the transistor 10 accommodated in the holder 100 is attached to the substrate 13, the positions of the through hole 11 of the transistor 10 and the burring hole 104 of the holder 100 may be displaced as shown in FIG.

図3(b)では、端子基部12a’が短く、基板13に先端部12b’を挿入すると、トランジスタ10が、図3(a)の場合よりも沈んで寸法Hが寸法H’となり、トランジスタ10の貫通孔11とホルダ100のバーリング穴104とがずれhだけずれている。この場合、ねじ14が貫通できる程度の位置ずれであれば、ねじ止めが可能であるが、ねじ止めの際に、ねじ14によって貫通孔11の開口周辺部や内周面が削られる。   In FIG. 3B, when the terminal base 12a ′ is short and the tip 12b ′ is inserted into the substrate 13, the transistor 10 sinks more than in the case of FIG. 3A and the dimension H becomes the dimension H ′. The through hole 11 and the burring hole 104 of the holder 100 are shifted by a shift h. In this case, if the positional deviation is such that the screw 14 can penetrate, screwing is possible. However, when screwing, the peripheral portion of the opening and the inner peripheral surface of the through hole 11 are scraped by the screw 14.

そこで、本発明では、ホルダのバーリング穴とトランジスタ10の貫通孔11の位置決めに寸法Hを用いず、トランジスタ10の貫通孔11の中心からトランジスタ10の本体部の底面(端子12側の面)までの寸法で位置決めを行う。
図4は、実施の形態1に係る電子部品保持構造を示す図である。図4(a)に示すように、実施の形態1に係るホルダ2は、係合部3、脚部4,5、位置決め爪6、およびバーリング穴7を有する。位置決め爪6は、ホルダ2の側面板を切り起こして形成され、ホルダ2に保持したトランジスタ10の底面部8が引っ掛かる。これにより、図4(b)に示すような、トランジスタ10の貫通孔11の中心からトランジスタ10の本体部の底面(端子12を設けた面)までの寸法Haで、バーリング穴7に対する貫通孔11の位置決めが行われる。寸法Haでは、トランジスタ10の本体部の寸法はばらつきが少ないため、その公差は小さい。従って、バーリング穴7に対する貫通孔11の位置ずれを低減することができる。
Therefore, in the present invention, the dimension H is not used for positioning of the burring hole of the holder and the through hole 11 of the transistor 10, and from the center of the through hole 11 of the transistor 10 to the bottom surface of the main body of the transistor 10 (the surface on the terminal 12 side). Position with the dimensions of.
FIG. 4 is a diagram illustrating the electronic component holding structure according to the first embodiment. As shown in FIG. 4A, the holder 2 according to the first embodiment has an engagement portion 3, leg portions 4, 5, a positioning claw 6, and a burring hole 7. The positioning claw 6 is formed by cutting and raising the side plate of the holder 2, and the bottom surface portion 8 of the transistor 10 held by the holder 2 is caught. Accordingly, as shown in FIG. 4B, the through hole 11 with respect to the burring hole 7 has a dimension Ha from the center of the through hole 11 of the transistor 10 to the bottom surface of the main body of the transistor 10 (surface on which the terminal 12 is provided). Positioning is performed. In the dimension Ha, since the dimension of the main body of the transistor 10 has little variation, its tolerance is small. Therefore, the position shift of the through hole 11 with respect to the burring hole 7 can be reduced.

トランジスタ10の電子機器1への保持は、図4(c)に示すように、ホルダ2の脚部4,5とトランジスタ10の端子12の先端部12bとを基板13の端子穴に挿入して取り付け、係合部3をシャーシ15のホルダ取り付け部分に引っ掛ける。次に、シャーシ15に設けた孔部からホルダ2およびトランジスタ10の貫通孔11を貫通させて、ねじ14をバーリング穴7にねじ止めする。このとき、公差の小さい寸法Haで位置決めしていることから、トランジスタ10の貫通孔11とホルダ2のバーリング穴7との位置ずれがなく、ねじ14によるトランジスタ10の貫通孔11の開口周辺部や内周面の削れをなくすことができる。   As shown in FIG. 4C, the transistor 10 is held in the electronic device 1 by inserting the leg portions 4 and 5 of the holder 2 and the tip end portion 12 b of the terminal 12 of the transistor 10 into the terminal hole of the substrate 13. The attaching and engaging portion 3 is hooked on the holder attaching portion of the chassis 15. Next, the holder 14 and the through hole 11 of the transistor 10 are passed through the hole provided in the chassis 15, and the screw 14 is screwed to the burring hole 7. At this time, since the positioning is performed with a small dimension Ha, there is no displacement between the through hole 11 of the transistor 10 and the burring hole 7 of the holder 2, and the peripheral portion of the opening of the through hole 11 of the transistor 10 by the screw 14 The shaving of the inner peripheral surface can be eliminated.

以上のように、この実施の形態1によれば、ホルダ2が、収納したトランジスタ10と係合して、当該トランジスタ10の貫通孔11の中心から当該トランジスタ10の端子12側の面までの寸法Haで、当該ホルダ2に設けたバーリング穴7に対する当該トランジスタ10の貫通孔11の位置決めを行う位置決め爪6を備える。このように構成することで、ホルダ2に収納したトランジスタ10の取り付けで、トランジスタ10の寸法公差の影響を低減することができる。   As described above, according to the first embodiment, the size of the holder 2 from the center of the through hole 11 of the transistor 10 to the surface on the terminal 12 side of the transistor 10 is engaged with the accommodated transistor 10. A positioning claw 6 for positioning the through hole 11 of the transistor 10 with respect to the burring hole 7 provided in the holder 2 is provided. With this configuration, the influence of the dimensional tolerance of the transistor 10 can be reduced by mounting the transistor 10 housed in the holder 2.

実施の形態2.
上記実施の形態1では、ホルダ2に位置決め爪6を設けてトランジスタ10の上下方向の位置決めを寸法Haで行う場合を示した。この実施の形態2では、上下方向の位置決めに加え、ホルダに収納したトランジスタ10の動きを規制して前後方向の位置決めを行う位置決め爪を新たに設けている。
Embodiment 2. FIG.
In the first embodiment, the case where the holder 2 is provided with the positioning claw 6 and the vertical positioning of the transistor 10 is performed with the dimension Ha is shown. In the second embodiment, in addition to the vertical positioning, a positioning claw for regulating the movement of the transistor 10 housed in the holder and positioning in the front-rear direction is newly provided.

図5は、実施の形態1に係るホルダに収納した電子部品を示す側面図である。上記実施の形態1に係るホルダ2は、位置決め爪6のみでトランジスタ10を上下方向に位置決めする。このため、図5に示すようにホルダ2内でトランジスタ10が動いてA方向に端子12が振れることがある。これは、端子12を基板13の端子穴へ挿入する作業の妨げになる。そこで、この実施の形態2では、ホルダに新たな位置決め爪を設けて、ホルダに収納したトランジスタ10の動きを規制することにより、トランジスタ10の前後方向の位置決めを行う。   FIG. 5 is a side view showing the electronic component housed in the holder according to the first embodiment. The holder 2 according to the first embodiment positions the transistor 10 in the vertical direction with only the positioning claws 6. For this reason, as shown in FIG. 5, the transistor 10 may move in the holder 2 and the terminal 12 may swing in the A direction. This hinders the operation of inserting the terminal 12 into the terminal hole of the substrate 13. Therefore, in the second embodiment, the positioning of the transistor 10 in the front-rear direction is performed by providing a new positioning claw in the holder and restricting the movement of the transistor 10 accommodated in the holder.

図6は、この発明の実施の形態2に係る電子部品保持構造を示す図である。図6(a)に示すように、実施の形態2に係るホルダ2Aは、上記実施の形態1の構成に加え、位置決め爪9を有する。位置決め爪9は、ホルダ2Aの側面板を切り起こして形成され、ホルダ2Aに収納したトランジスタ10の前面部分が引っ掛かる。これにより、図5に示したようなトランジスタ10の動き(端子12の振れ)を規制することができる。   FIG. 6 is a diagram showing an electronic component holding structure according to Embodiment 2 of the present invention. As shown in FIG. 6A, the holder 2A according to the second embodiment includes a positioning claw 9 in addition to the configuration of the first embodiment. The positioning claw 9 is formed by cutting and raising the side plate of the holder 2A, and the front portion of the transistor 10 housed in the holder 2A is caught. Accordingly, the movement of the transistor 10 (the swing of the terminal 12) as shown in FIG. 5 can be restricted.

図7は、実施の形態2に係るホルダに収納した電子部品の様子を示す図である。図7(a)に示すように、位置決め爪9にトランジスタ10の前面部分が引っ掛かることで、トランジスタ10が図5のA方向に動くことが規制される。また、図7(b)示すように、位置決め爪6によってトランジスタ10の寸法Haで上下方向の位置決めが行われる。   FIG. 7 is a diagram illustrating a state of the electronic component housed in the holder according to the second embodiment. As shown in FIG. 7A, when the front portion of the transistor 10 is caught by the positioning claw 9, the transistor 10 is restricted from moving in the direction A in FIG. Further, as shown in FIG. 7B, the positioning claw 6 performs vertical positioning with the dimension Ha of the transistor 10.

図8は、実施の形態2に係るホルダに収納した電子部品を示す側面図である。トランジスタ10の後方から位置決め爪9に前面部分が引っ掛かるように押し付けることで、図8に示すように、位置決め爪6で上下の位置決めがなされ、かつ位置決め爪9で前後の位置決めがなされた状態で基板13およびシャーシ15に取り付けることができる。従って、図5のA方向に端子12が振れることがなくなり、トランジスタ10の取り付けの作業性を向上させることができる。   FIG. 8 is a side view showing the electronic component housed in the holder according to the second embodiment. By pressing the front portion of the transistor 10 from behind the transistor 10 so that the front portion is caught, the substrate is positioned up and down with the positioning claw 6 and front and back with the positioning claw 9 as shown in FIG. 13 and chassis 15 can be attached. Therefore, the terminal 12 does not swing in the direction A in FIG. 5, and the workability of attaching the transistor 10 can be improved.

以上のように、この実施の形態2によれば、ホルダ2Aが、収納したトランジスタ10と係合して、当該ホルダ2A内での当該トランジスタ10の動きを規制する位置決め爪9を備える。このように構成することにより、上記実施の形態1と同様の効果が得られるとともに、ホルダ2Aに収納したトランジスタ10を容易に基板13およびシャーシ15に取り付けることが可能である。   As described above, according to the second embodiment, the holder 2A includes the positioning claw 9 that engages with the accommodated transistor 10 and regulates the movement of the transistor 10 in the holder 2A. With this configuration, the same effects as those of the first embodiment can be obtained, and the transistor 10 accommodated in the holder 2A can be easily attached to the substrate 13 and the chassis 15.

上記実施の形態1および上記実施の形態2では、位置決め爪6,9がトランジスタ10に引っ掛かって位置決めを行う場合を示したが、トランジスタ10と係合して位置決めを行う係合部であればよく、爪形状に限定されるものではない。例えば、トランジスタ10を両側から狭持する係合凸部であってもよい。また、トランジスタ10に設けた凸部に嵌合して位置決めする係合凹部であってもよい。   In the first embodiment and the second embodiment, the positioning claws 6 and 9 are caught by the transistor 10 to perform positioning. However, any engaging portion that engages with the transistor 10 to perform positioning may be used. It is not limited to the nail shape. For example, it may be an engaging projection that holds the transistor 10 from both sides. Moreover, the engaging recessed part which fits and positions the convex part provided in the transistor 10 may be sufficient.

なお、本発明はその発明の範囲内において、各実施の形態の自由な組み合わせ、あるいは各実施の形態の任意の構成要素の変形、もしくは各実施の形態において任意の構成要素の省略が可能である。   In the present invention, within the scope of the invention, any combination of each embodiment, any component of each embodiment can be modified, or any component can be omitted in each embodiment. .

1 電子機器、2,2A ホルダ、3 係合部、4,5 脚部、6,9 位置決め爪、7 バーリング穴、8 底面部、10 トランジスタ、11 貫通孔、12 端子、12a 端子基部、12b 先端部、13 基板、14 ねじ、15 シャーシ、16 天板、100 ホルダ、101 係合部、102,103 脚部、104 バーリング穴。   DESCRIPTION OF SYMBOLS 1 Electronic device, 2,2A holder, 3 engaging part, 4,5 leg part, 6,9 positioning claw, 7 burring hole, 8 bottom part, 10 transistor, 11 through-hole, 12 terminal, 12a terminal base, 12b tip Part, 13 substrate, 14 screw, 15 chassis, 16 top plate, 100 holder, 101 engaging part, 102, 103 leg part, 104 burring hole.

Claims (2)

ねじ止め用の貫通孔を有する電子部品をホルダに収納し、当該ホルダに収納した電子部品の端子を基板に取り付け、前記貫通孔および前記ホルダに設けた孔部を介して当該電子部品をねじ止めする電子部品保持構造であって、
前記ホルダは、前記電子部品を前記ホルダに収納する際に当該電子部品の上面部に掛合する掛合部と、前記収納した電子部品と係合して、当該電子部品の貫通孔の中心から当該電子部品の端子側の面までの寸法で当該ホルダに設けた前記孔部に対する当該電子部品の貫通孔の位置決めを行う第1の係合部と、前記収納された電子部品と係合して、当該ホルダ内での当該電子部品の前記貫通孔の方向の動きを規制する第2の係合部とを備え、
前記ホルダの両側面が前記電子部品に当接してなる
ことを特徴とする電子部品保持構造。
An electronic component having a through hole for screwing is stored in a holder, a terminal of the electronic component stored in the holder is attached to a substrate, and the electronic component is screwed through the through hole and the hole provided in the holder. Electronic component holding structure
The holder engages with the hooked portion that is engaged with the upper surface of the electronic component when the electronic component is housed in the holder, and engages the electronic component from the center of the through hole of the electronic component. A first engaging portion for positioning the through hole of the electronic component with respect to the hole provided in the holder in a dimension up to the terminal side surface of the component, and engaging with the stored electronic component; A second engaging part for restricting movement of the electronic component in the holder in the direction of the through hole ,
An electronic component holding structure, wherein both side surfaces of the holder are in contact with the electronic component.
請求項1記載の電子部品保持構造を用いた電子機器。 An electronic apparatus using the electronic component holding structure according to claim 1 Symbol placement.
JP2013522372A 2011-07-07 2011-07-07 Electronic component holding structure and electronic device using the same Expired - Fee Related JP5627784B2 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550795U (en) * 1991-12-09 1993-07-02 株式会社ケンウッド Mounting bracket
JPH0631153U (en) * 1992-09-28 1994-04-22 横河電機株式会社 Electronic component mounting device
JP2002353672A (en) * 2001-05-29 2002-12-06 Kenwood Corp Mounting structure of heat generating electric part on heat radiator

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2568003Y2 (en) * 1991-10-18 1998-04-08 株式会社ケンウッド Radiator
JP2003035439A (en) * 2001-07-24 2003-02-07 Funai Electric Co Ltd Fixing block of heat generating element
JP2003289190A (en) * 2002-03-28 2003-10-10 Keihin Corp Mounting member and mounting method for heat-generating electronic components

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0550795U (en) * 1991-12-09 1993-07-02 株式会社ケンウッド Mounting bracket
JPH0631153U (en) * 1992-09-28 1994-04-22 横河電機株式会社 Electronic component mounting device
JP2002353672A (en) * 2001-05-29 2002-12-06 Kenwood Corp Mounting structure of heat generating electric part on heat radiator

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