JP5627391B2 - Multiple wiring board - Google Patents

Description

  In the present invention, a plurality of wiring board regions serving as wiring boards for mounting electronic components such as semiconductor elements and surface acoustic wave elements are arranged vertically and horizontally on a mother board, and the wiring conductors of each wiring board area are plated. The present invention relates to a multi-piece wiring board in which plating terminals for supplying a current for forming are formed on an exposed surface of a mother board.

  Conventionally, wiring boards used for mounting electronic components such as semiconductor elements and surface acoustic wave elements have a plurality of rectangular plate-like shapes made of ceramic sintered bodies such as glass ceramic sintered bodies and aluminum oxide sintered bodies. It has a mounting portion for mounting electronic components on the upper surface of the insulating base formed by stacking the insulating layers, and is made of a metal material such as tungsten or copper from the mounting portion or its periphery to the side or lower surface of the insulating base. It has a structure in which a plurality of wiring conductors are formed.

  Such a wiring board is generally manufactured in the form of a so-called multi-cavity wiring board in which a plurality of wiring boards are obtained simultaneously from a single large-area mother board. The multi-cavity wiring board has, for example, a structure in which a plurality of wiring board regions serving as wiring boards are arranged vertically and horizontally on a flat mother board.

  In such a multi-piece wiring board, wiring conductors are formed from the upper surface to the lower surface of the wiring board region, and the wiring conductors of the upper and lower insulating layers are electrically connected to each other via through conductors that penetrate the insulating layer in the thickness direction. It is connected to the.

  Further, the multi-piece wiring board is manufactured by laminating and firing a plurality of ceramic green sheets on which a conductor paste serving as a wiring conductor is printed at a predetermined portion. The through conductor is formed by punching the ceramic green sheet in advance to form a through hole, filling the through hole with a conductive paste, and simultaneously firing at the time of firing.

JP 2001-319991 JP 2003-273272 A JP 2007-158183 A

  However, in the above-described prior art multi-cavity wiring board, there is a possibility that there is a stacking misalignment between the stacked upper and lower ceramic green sheets. When stacking deviation occurs, the electrical characteristics fluctuate due to deviation from a predetermined numerical value of the electromagnetic coupling between the upper and lower wiring conductors, and the upper and lower via via conductors that penetrate the insulating layer (ceramic green sheet) in the thickness direction. There is a possibility of causing problems such as disconnection between the via conductor and the wiring conductor when the wiring conductor is electrically connected. In particular, since the frequency of electrical signals transmitted through wiring conductors has been increasing in recent years, the influence on the electrical characteristics of the wiring conductors due to the positional deviation between the upper and lower wiring conductors has increased. For this reason, it is demanded that a multi-piece wiring board easily and reliably detect that such a stacking deviation has not occurred.

The present invention has been completed in view of such conventional problems, and its purpose is to provide a large number of pieces that can easily and reliably detect that a stacking deviation exceeding an allowable range has not occurred. It is to provide a wiring board.

In the multi-cavity wiring board of the present invention, a plurality of wiring board regions are arranged vertically and horizontally on a mother board formed by laminating a plurality of insulating layers made of a ceramic sintered body, and on the exposed surface of the mother board, A multi-piece wiring board in which a plating terminal for supplying a plating current to a wiring conductor in the wiring board region is formed, and a pair electrically connected to the plating terminal between the insulating layers Are formed side by side, and a pair of through conductors whose end faces are connected to the conductor layer are formed side by side from the surface of the mother substrate to the layer where the conductor layer is formed. The pair of through conductors are both located on the edges of the conductor layers adjacent to each other, or are located on the outer edges opposite to the adjacent sides, and in plan view. In the through conductor The sum of the maximum lengths of the portions where the conductor layers are connected to each other in the direction in which the conductor layers are arranged is the amount of stacking deviation allowed in the direction in which the conductor layers are arranged between the upper and lower insulating layers. The midpoint between the pair of conductor layers and the midpoint between the pair of through conductors match when viewed from the direction in which the conductor layer and the through conductor overlap. It is characterized by being.

  In the multi-piece wiring board of the present invention, in the above configuration, a frame-shaped dummy region is provided on the outer peripheral portion of the mother substrate, and the conductor layer and the through conductor are formed in the dummy region. It is characterized by this.

  In the multi-piece wiring board according to the present invention, in the above configuration, a plurality of pairs of the conductor layers and the through conductors are arranged on the mother board so that the respective directions of the rows intersect each other. It is characterized by.

According to the multi-cavity wiring board of the present invention, the above-described configuration is provided, and the pair of through conductors are both located on the edges of the conductor layers adjacent to each other or on the opposite side of the adjacent side. The total length of the portion where the through conductor and conductor layer are connected to each other in the plan view is the sum of the maximum lengths in the direction in which the conductor layers are arranged in the plan view. Matches twice the amount of stacking deviation allowed in the direction in which the conductor layers between the layers are aligned, and when viewed from the direction in which the conductor layer and the through conductor overlap, the midpoint between the pair of conductor layers and the pair of penetrations Since the midpoint between the conductors coincides , when the stacking deviation is within an allowable range, the decrease in the maximum length of the connection to the conductor layer of one through conductor due to the stacking deviation and the other through The increase in the maximum length of the connection to the conductor layer of the conductor and Match, the sum of the maximum length of the connection is maintained constant (twice the acceptable stacking deviation amount), respective end surfaces of the pair of through conductors is connected to the corresponding conductor layer.

  Therefore, when a plating current is supplied to the plating terminal, the plating current is supplied to both of the pair of through conductors via the conductor layer, and the plated layer is exposed on the exposed end face of each through conductor. Is deposited. And by confirming that the plating layer is deposited on the exposed end face of this through conductor, it is easy to confirm that there is no stacking deviation exceeding the allowable range in the multi-piece wiring board, and It can be detected reliably. Therefore, it is possible to provide a multi-piece wiring board capable of easily and reliably detecting that a stacking deviation exceeding an allowable range has not occurred.

  Note that in a multi-piece wiring board in which a stacking deviation has occurred beyond the allowable range, the end surface of the through conductor located on the adjacent side or the outer edge of the conductor layer is on the inner side or on the conductor layer. The plated layer is not deposited on the exposed end face of the through conductor without being shifted to the outside and connected to the conductor layer. Therefore, it is possible to easily identify a multi-piece wiring board in which the stacking deviation occurs.

  Further, the multi-cavity wiring board of the present invention has a frame-shaped dummy region provided on the outer peripheral portion of the mother board in the above configuration, and when the conductor layer and the through conductor are formed in the dummy region, Since there is no need to place an unnecessary conductor layer in the wiring board area, it is easy to reduce the size of the wiring board area (individual wiring board) and increase the density of the wiring conductor, and to ensure that no stacking deviation occurs. A multi-piece wiring board that can be easily confirmed can be provided.

  Further, the multi-cavity wiring board of the present invention, in the above-described configuration, when a plurality of pairs of conductor layers and through conductors are arranged on the mother board so that the respective alignment directions intersect each other, It is also possible to effectively detect stacking deviations in the different directions of the upper and lower insulating layers (that no stacking deviation has occurred). For example, if two pairs of conductor layers and through conductors are arranged so as to be orthogonal to each other, it is possible to effectively detect the presence or absence of stacking misalignment in the so-called XY direction, so that stacking misalignment does not occur. This can be confirmed more reliably.

(A) is a top view which shows the principal part in an example of embodiment of the multi-cavity wiring board of this invention, (b) is sectional drawing in the AA of (a). It is a top view which shows typically the whole multi-piece wiring board shown in FIG. It is a principal part enlarged plan view which expands and shows the principal part of Fig.1 (a) further. (A) is a top view which shows the other example of embodiment of the multi-piece wiring board of this invention, (b) is sectional drawing in the BB line of (a). (A) And (b) is a principal part enlarged plan view which shows the principal part of the multi-piece wiring board of a reference example, respectively. It is a top view which shows the principal part in the other example of embodiment of the multi-cavity wiring board of this invention. It is a top view which shows the principal part in the other example of embodiment of the multi-cavity wiring board of this invention. (A) is a top view which shows the principal part in the other example of embodiment of the multi-cavity wiring board of this invention, (b) is sectional drawing in CC line of (a). It is a top view which shows the other example of embodiment of the multi-piece wiring board of this invention.

  A multi-piece wiring board of the present invention will be described with reference to the accompanying drawings.

  Fig.1 (a) is a top view which shows the principal part in an example of embodiment of the multi-piece wiring board of this invention, FIG.1 (b) is a cross section in the AA line of Fig.1 (a). FIG. 2 is a plan view schematically showing the whole multi-piece wiring board shown in FIG. In FIG. 1A, FIG. 1B, and FIG. 2, 1 is a mother board, 2 is a wiring board region, and 3 is a wiring conductor. A plurality of wiring board regions 9 in which wiring conductors 3 are formed are arranged on the mother board 1 in the vertical and horizontal directions, so that a multi-piece wiring board 9 is basically formed. Further, plating terminals 8 for supplying a plating current to the respective wiring conductors 3 of the plurality of wiring substrate regions 2 formed on the exposed surface such as the outer peripheral side surface of the mother substrate 1 and the outer peripheral portion of the upper surface are formed. Has been.

  The mother substrate 1 is a ceramic sintered body such as a glass ceramic sintered body, an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a silicon nitride sintered body, and a mullite sintered body. A plurality of insulating layers 1a made of

  The plurality of wiring board regions 2 arranged on the mother board 1 are areas that each become an individual wiring board (not shown). By dividing the mother board 1 along the boundary of the wiring board region 2, a plurality of wiring boards are manufactured simultaneously and collectively.

  When an individual wiring board is used as an electronic component mounting board, an electronic component mounting portion (no reference numeral) is provided on the surface such as the central portion of the upper surface of the wiring board region 2. In the example shown in FIG. 1, the central portion of the wiring board region 2 is an electronic component mounting portion, and the wiring conductor 3 is formed from the mounting portion to the outer peripheral portion. In the wiring conductor 3, an electrode of an electronic component is electrically connected to a portion near the mounting portion via a conductive connecting material (not shown) such as a bonding wire or solder.

  Electronic components (not shown) mounted on the mounting unit include semiconductor integrated circuit elements such as IC and LSI, and optical semiconductor elements such as LED (light emitting diode), PD (photodiode), and CCD (charge coupled device). Various electronic devices such as semiconductor devices including surface acoustic wave devices, piezoelectric devices such as surface acoustic wave devices and crystal resonators, capacitive devices, resistors, and micromachines (so-called MEMS devices) in which a minute electromechanical mechanism is formed on the surface of a semiconductor substrate. Parts.

  The electronic component has a resin adhesive such as an epoxy resin, a polyimide resin, an acrylic resin, a silicone resin, a polyether amide resin, Au-Sn, Sn-Ag-Cu, or Sn-Cu on the mounting portion. , Sn-Pb or the like, or a bonding material such as glass.

  The wiring conductor 3 is electrically connected to an electronic component as described above, for example, and serves as a conductive path that electrically connects the electronic component to an external electric circuit. In the example shown in FIG. 1, wiring conductors 3 are arranged above and below with an insulating layer 1a interposed therebetween. The upper and lower wiring conductors 3 have portions that overlap each other, and are set so as to generate a predetermined inductance component and capacitance component by electromagnetic coupling at the overlapping portions. In this case, when a high frequency signal of about several hundred MHz to several tens GHz is transmitted to the wiring conductor 3, the electrical characteristics of the wiring conductor 3 become a predetermined value by electromagnetic coupling between the wiring conductors 3. Adjusted.

  The wiring conductor 3 is made of a metal material such as tungsten, molybdenum, copper-tungsten, manganese, silver, copper, palladium, platinum, or gold. These metal materials are deposited on the surface of the insulating layer 1a as a metallized layer, for example.

  The wiring conductor 3 may include a conductor (so-called via conductor) (not shown) penetrating the insulating layer 1a in the thickness direction. In this case, a via conductor is formed by filling a through-hole (not shown) penetrating the insulating layer 1a in the thickness direction with a metal material such as tungsten similar to the above.

  The plating terminal 8 is formed on an exposed surface such as the outer peripheral side of the rectangular flat plate-shaped mother board 1 or the outer peripheral portion of the upper and lower surfaces, for example, a connection conductor formed on the inner surface or the surface of the mother board 1 (see FIG. (Not shown) and electrically connected to the wiring conductor 3 in the wiring board region 2. The plating terminal 8 is formed, for example, by forming a cutout in the shape of an arc or the like in a plan view on the outer peripheral portion of the mother substrate 1 and depositing the same metal material as the wiring conductor 3 on the inner surface of the cutout. Has been.

  In such a mother substrate 1 having plating terminals 8 in which a plurality of wiring substrate regions 2 each having a wiring conductor 3 are arranged vertically and horizontally, for example, each insulating layer 1a is made of an aluminum oxide sintered body. If so, it can be manufactured as follows.

First, a raw material powder composed mainly of borosilicate glass containing aluminum oxide and silicon dioxide, mixed with magnesium oxide, calcium oxide, etc. is kneaded with an organic solvent and a binder, and a doctor blade method, a lip coater method, etc. A ceramic green sheet is produced by forming into a sheet by a forming method. Next, a metal paste such as tungsten or molybdenum is kneaded with an organic solvent and a binder to produce a metal paste.
Next, a metal paste is printed on a pattern of a predetermined wiring conductor 3 by a printing method such as a screen printing method in each region to be the wiring board region 2. Further, as necessary, a through hole is formed in the ceramic green sheet, and a metal paste serving as a via conductor is filled in the through hole. Then, a plurality of ceramic green sheets are printed with a metal paste serving as the plating terminals 8 in a predetermined pattern, and these are laminated. After the ceramic green sheet laminate is cut into the outer dimensions of the mother board 1, about By firing at a firing temperature of about 1500 to 1600 ° C., the mother board 1 having the plating terminals 8 in which the plurality of wiring board regions 2 each having the wiring conductor 3 are arranged vertically and horizontally can be manufactured. .

  The printing of the metal paste to be the plating terminal 8 may be performed either before or after the ceramic green sheets are stacked. In this case, an arc-like cut or the like may be provided on the outer peripheral portion of the ceramic green sheet or its laminate, and a metal paste that will serve as the plating terminal 8 may be printed on the inner surface of the cutout.

  In the multi-piece wiring board 9 of the present invention, a pair of conductor layers 4 electrically connected to the plating terminals 8 are formed side by side between the insulating layers 1a, and the conductor layers from the surface of the mother board 1 are formed. A pair of through conductors 5 whose end faces are connected to the conductor layer 4 are formed side by side between the layers on which 4 is formed. The pair of through conductors 5 are both biased toward the edges of the conductor layer 4 that are adjacent to each other, or are offset toward the outer edge opposite to the adjacent side. As shown in FIG. 3, in plan view, the total length of the portions where the through conductors 5 and the conductor layers 4 are connected to each other in the direction L in which the conductor layers 4 are arranged is the upper and lower insulations. This corresponds to twice the allowable stacking deviation in the direction in which the conductor layers 4 between the layers 1a are arranged. FIG. 3 is an enlarged plan view showing a main part of the main part of FIG. In FIG. 3, the same parts as those in FIG.

  In the example shown in FIGS. 1 to 3, the pair of penetrating conductors 5 are both biased to the outer edge of the conductor layer 4. Further, in the example shown in FIG. 1, the maximum length in the direction L in which the conductor layers 4 are arranged (hereinafter simply referred to as the maximum) in the portion where the left and right through conductors 5 and the conductor layers 4 are connected to each other in plan view. M (which may be referred to as a length) corresponds to the amount of stacking deviation allowed in the direction L in which the conductor layers 4 between the upper and lower insulating layers 1a are arranged (hereinafter sometimes simply referred to as the allowable deviation amount). If the maximum length M of each connection between the two left and right through conductors 5 and the conductor layer 4 is summed, the allowable stacking deviation amount is doubled.

  According to such a multi-cavity wiring board 9, since the above configuration is provided, when the stacking deviation between the upper and lower insulating layers 1a is within an allowable range, the one through conductor 5 with respect to the conductor layer 4 due to the stacking deviation. The decrease in the maximum connection length M and the increase in the maximum connection length M with respect to the conductor layer 4 of the other through conductor 5 coincide with each other, and the total maximum connection length M is constant (the allowable deviation amount). 2 times), and each end face of the pair of through conductors 5 is connected to the corresponding conductor layer 4.

  Therefore, when a plating current is supplied to the plating terminal 8, the plating current is also supplied to the through conductor 5 through the conductor layer 4, and the exposed end surface of the through conductor 5 (shown in FIG. 1). In the example, a plating layer (not shown) is deposited on the upper end surface. Then, by confirming that the plated layer is deposited on the exposed end face of the through conductor 5, it is easy to confirm that the stacking deviation exceeding the allowable range does not occur in the multi-piece wiring board 9. And can be detected reliably. Therefore, it is possible to provide the multi-piece wiring board 9 that can easily and surely detect that the stacking deviation exceeding the allowable range has not occurred.

  The electrical connection between the conductor layer 4 and the plating terminal 8 is, for example, an internal wiring (not shown) disposed between the insulating layers 1a, a via conductor (not shown) penetrating the insulating layer 1a in the thickness direction, or the like. It can be done through.

  Note that the allowable stacking shift amount is, for example, a shift amount allowed when the electromagnetic coupling between the upper and lower wiring conductors 3 described above is set to a predetermined value. When a laminating deviation occurs between the upper and lower insulating layers 1a exceeding the allowable deviation amount, the electromagnetic coupling amount between the upper and lower wiring conductors 3 deviates from a predetermined value, and the electrical characteristics of the wiring conductor 3 are reduced. It deviates from the predetermined value.

In this case, if the maximum length M of the connection between the pair of conductor layers 4 and the pair of through conductors 5 is equal to twice the allowable deviation amount, the maximum connection between each conductor layer 4 and the through conductors 5 is achieved. The lengths M need not be the same. For example, as shown in FIG. 4, when the actual stacking misalignment amount is the same as the allowable misalignment amount (when the misalignment amount is large), one through conductor 5 is in contact with the outer edge of one conductor layer 4. The other through conductor 5 is located closer to the center side from the outer peripheral portion of the other conductor layer 4. Also in this case, the sum of the maximum lengths M of the connection between the pair of conductor layers 4 and the pair of through conductors 5 is twice the allowable deviation amount. 4A is a plan view showing another example of the embodiment of the multi-cavity wiring board 9 of the present invention, and FIG. 4B is a cross-sectional view taken along line BB in FIG. 4A. It is sectional drawing. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals.

The allowable stacking deviation amount is, for example, in consideration of electromagnetic coupling between the upper and lower wiring conductors 3 as described above, and the insulating layer 1a is made of an aluminum oxide sintered body, and the wiring conductor 3 is made of tungsten. Or when the line width made of molybdenum is about 100 μm,
If the electrical signal transmitted through the wiring conductor 3 is a high-frequency signal of about several hundred MHz, the maximum is about 25 μm.

In this case, each of the pair of through conductors 5 has a circular shape (cylindrical shape) with a diameter of about 100 μm, and each of the pair of conductor layers 4 has a rectangular shape (rectangular shape, etc.) with a width (short side dimension) of about 100 μm. The left and right through conductors 5 are positioned so as to be biased toward the outer edges of the conductor layer 4. Then, as a design setting value, the maximum length M of the connection of the left and right through conductors 5 to the conductor layer 4 may be set to an allowable deviation amount of 25 μm.

  According to such a multi-cavity wiring board 9, if the amount of misalignment between the upper and lower insulating layers 1 a is equal to or less than the allowable amount of deviation, both of the pair of through conductors 5 are connected to the conductor layer 4. And electrically connected to the plating terminal 8. That is, when there is no misalignment (the misalignment amount is 0 μm), each of the left and right through conductors 5 is connected to the conductor layer 4 with a length of about 25 μm, which is the same as the set value. At this time, a portion of each through conductor 5 that is not connected to the conductor layer 4 (a length of about 75 μm in the direction in which the conductor layers 4 are arranged) protrudes outside the outer edge of the conductor layer 4. When the stacking deviation is about the same as the allowable deviation amount, the maximum length M of connection of the through conductor 5 to the conductor layer 4 is about 50 μm in the left and right through conductors 5 and the other through The conductor 5 is close to 0 μm, but the edge portions of each other are in contact with each other and are electrically connected.

The width of the conductor layer 4 is at least twice the diameter (about 50 to 100 μm) of, for example, a circular through conductor 5 as described above in order to ensure electrical connection with the through conductor 5 (100 It is preferably about ~ 200 μm).

  The conductor layer 4 needs to change in connection length with the through conductor 5 according to such a stacking deviation. For this reason, the pair of conductor layers 4 must be such that at least the side to which the through conductor 5 is connected (the side where the conductor layers 4 are adjacent to each other or the outside) are straight sides parallel to each other. Considering the space to be arranged on the substrate 1, productivity, etc., a rectangular shape such as a rectangular shape is preferable.

The allowable stacking deviation amount may be determined by factors other than the electromagnetic coupling between the wiring conductors 3 described above. For example, when a through hole (so-called castellation) (not shown) is provided along the boundary of each wiring board region 2, the end portion of the insulating layer 1a from the inner side surface of this castellation (the inner side surface of the through hole is defined). The allowable protrusion amount of the component) may be used as a reference. When the upper and lower wiring conductors 3 are directly electrically connected via a conductor (via conductor) (not shown) penetrating the insulating layer 1a in the thickness direction, the connection between the via conductor and the wiring conductor 3 is established. The range may be used as a reference.

  Note that in a multi-piece wiring board (not shown) in which the stacking deviation has occurred beyond the allowable range, the end face of the through conductor located on the adjacent side or the outer edge of the conductor layer is the conductor. The plated layer is not deposited on the exposed end face of the through conductor without being connected to the conductor layer by shifting to the inside or outside of the layer. Therefore, it is possible to easily identify a multi-piece wiring board in which the stacking deviation occurs.

  For example, in the example shown in FIG. 5A, the upper insulating layer is displaced in the left direction beyond the allowable deviation amount, and the left through conductor 15 is not electrically connected to the conductor layer 14. Therefore, the exposed end face of the left through conductor 15 is not covered with a plating layer, and it can be easily detected that the multi-piece wiring board 19 has a stacking deviation exceeding an allowable deviation amount.

  In addition, as shown in FIG. 5B, when the through conductor 15 is not biased to the outer edge on the adjacent side of the conductor layer 14 or on the opposite side to the adjacent side, the stacking shift is an allowable shift. Even if the amount is exceeded, the electrical connection between the conductor layer 14 and the through conductor 15 cannot always be reliably cut off. As in the example shown in FIG. 5B, when a conductor layer 14 having a relatively wide width is provided and the through conductor 15 is connected to the conductor layer 14 at a position slightly deviating from the outside to the center side, Even when the allowable deviation amount exceeds the allowable deviation amount, the electrical connection of the through conductor 15 to the conductor layer 14 may be maintained, and it may not be possible to detect that the lamination deviation amount exceeds the allowable deviation amount. The same applies to the case where the through conductor 15 is positioned so as to be biased to the adjacent edge of the conductor layer 14. 5 (a) and 5 (b) are main part enlarged plan views showing the main part of the multi-piece wiring board 19 of the reference example. In FIG. 5, 11 is a mother board and 12 is a wiring board area.

  Therefore, in the multi-piece wiring board 9 of the present invention, the through conductor 5 is biased toward the edge on the adjacent side (or outside) of the conductor layer 4, in other words, the through conductor 5 is, for example, a rectangular conductor layer 4. In plan view, it is necessary to contact the adjacent side (or outside) side of the conductor layer 4 or to be positioned so that a part of the side is exceeded.

  The plating current is supplied to the plating terminal 8 by, for example, pressing a conduction pin of a plating jig (so-called rack or the like) (not shown) against the plating terminal 8 and supplying power from a rectifier or the like through the plating jig. The plating terminal 8 is energized with a predetermined current. In this case, the plating current is supplied from the plating terminal 8 to the conductor layer 4 and also to the wiring conductor 3 in each wiring board region 2 in the plating solution, and nickel, cobalt, copper, gold or A plating layer such as an alloy containing these as main components is applied to the exposed surfaces of the wiring conductor 3 and the through conductor 5. In this case, if the wiring conductor 3 and the conductor layer 4 are electrically connected to each other via the connecting conductor (not shown) disposed between the insulating layers 1a between the wiring board regions 2, Sequentially from the outer peripheral wiring board region 2, a plating current is also supplied to the inner wiring board region 2.

In the multi-piece wiring board 9 of the present invention, it is easy to check that the plating layer is not deposited on the exposed end face of the through conductor 5 as described above so that no stacking deviation occurs. The time required for this detection is, for example, 100 for the wiring board region 2.
If about 400 are arranged, it is within about 10 seconds. On the other hand, in the conventional multi-cavity wiring board (not shown), when an electrical inspection is performed for each wiring board region (not shown) to inspect the presence or absence of misalignment, It takes about 10 minutes using an automatic inspection device.

  Further, as shown in FIG. 6, the multi-piece wiring board 9 of the present invention is provided with a frame-like dummy region 6 on the outer peripheral portion of the mother board 1, and the conductor layer 4 and the through conductor 5 are the dummy region 6. In the case of being formed in this manner, it is not necessary to dispose the unnecessary conductor layer 4 in the wiring board region 2. Therefore, the wiring board region 2 (individual wiring board) can be downsized and the wiring conductor 3 can be increased in density. While being easy, it is possible to provide the multi-piece wiring board 9 that can easily confirm that no stacking deviation has occurred. FIG. 6 is a plan view showing a main part in another example of the embodiment of the multi-piece wiring board 9 of the present invention. 6, parts similar to those in FIGS. 1 and 2 are denoted by the same reference numerals.

  In the example shown in FIG. 6, the dummy region 6 has a rectangular frame shape, and a pair of rectangular conductor layers 4 are arranged along the length direction of the dummy region 6 so that their long sides are adjacent to each other. ing. A pair of circular through conductors 5 are formed side by side along the direction L in which the conductor layers 4 are arranged in a plan view. Also in this example, the maximum length M of the connection between the respective through conductors 5 and the conductor layer 4 is equal to the allowable deviation amount. If the maximum length M of these connections is summed, the allowable amount of Matches twice.

  In the example shown in FIG. 6, two notches are provided in each of two opposing outer peripheral portions of the mother substrate 1, and from the inner surface of the notches to the outer periphery of the upper surface of the mother substrate 1, A metal layer is applied as the plating terminal 8. If the notch is provided with a plating jig pin to hold the mother substrate 1 from above and below, the holding of the mother substrate 1 in the plating solution and the supply of plating current to the plating terminals 8 are performed together. be able to.

  In the multi-piece wiring board 9 of the present invention, in the above configuration, a plurality of pairs of conductor layers 4 and through conductors 5 are arranged on the mother board 1 so that the respective alignment directions L intersect each other. In the case where the upper and lower insulating layers 1a are present, it is also possible to effectively detect the stacking misalignment in the directions different from each other (the absence of stacking misalignment). For example, if two pairs of conductor layers 4 and through conductors 5 are arranged so as to be orthogonal to each other, it is possible to effectively detect the presence of misalignment in the so-called XY direction. Thus, it is possible to provide a multi-piece wiring board 9 that can more reliably confirm that there is no wiring.

  In the example shown in FIG. 7, a rectangular frame-shaped dummy region 6 is provided on the outer peripheral portion of a rectangular plate-shaped mother substrate 1, and a pair of conductor layers 4 and a pair of through conductors 5 are provided on each side of the dummy region 6, respectively. Is forming. The conductor layers 4 and the through conductors 5 of each pair are arranged in two opposite side portions of the dummy region 6 in the same direction L1, and are arranged in the other two opposite side portions. Are arranged in the direction of L2 orthogonal to L1. As a result, the presence or absence of misalignment of the mother board 1 in the XY direction can be reliably detected as described above. FIG. 7 is a plan view showing a main part in another example of the embodiment of the multi-piece wiring board 9 of the present invention. In FIG. 7, the same parts as those in FIGS. 1 and 2 are denoted by the same reference numerals.

  In this case, the plurality of pairs of conductor layers 4 and through conductors 5 do not have to be orthogonal to each other, and appropriately cross each other depending on the shape of the mother board 1 and the direction in which the stacking deviation tends to occur. The matching angle may be adjusted.

In the above description, the pair of through conductors 5 has been described with reference to the example in which the conductor layer 4 is located on the outer edge opposite to the side adjacent to each other. For example, as shown in FIG. The pair of through conductors 5 may be offset from the adjacent edges of the conductor layer 4. In this case, the same effect as described above can be obtained. FIG. 8A is a plan view showing a main part in another example of the embodiment of the multi-piece wiring board 9 of the present invention, and FIG. 8B is a cross-sectional view of FIG. It is sectional drawing in C line.

  For example, when a plurality of pairs of conductor layers 4 and through conductors 5 are formed in the dummy region 6 of the mother board 1, the shape and dimensions of the dummy region 6, and the connection for connecting the wiring conductor 3 and the plating terminal 8 are used. Depending on the convenience of the formation position of the conductor and the like, there are mixed cases where the through conductors 5 are biased toward the edges of the conductor layer 4 adjacent to each other and those that are biased toward the outer edge of the conductor layer 4. It doesn't matter.

  For example, as shown in FIG. 9, the pair of conductor layers 4 and through conductors 5 do not have to be disposed adjacent to the same side portion of the dummy region 6, and are divided into two side portions facing each other. May be arranged so as to be arranged (with the arrangement of the wiring board regions 2 in between). In this case, the space for arranging the conductor layer 4 and the through conductor 5 can be further reduced, which is advantageous for downsizing the multi-piece wiring board 9. FIG. 9 is a plan view showing another example of the embodiment of the multi-piece wiring board 9 of the present invention. 9, parts similar to those in FIG. 1 are denoted by the same reference numerals.

  It should be noted that the present invention is not limited to the above embodiments, and various modifications can be made without departing from the gist of the present invention.

  For example, a recognition pad (not shown) is attached to the exposed end surface (upper end surface) of the through conductor 5 using the same metal material as that of the wiring conductor 3 so that the stacking deviation can be recognized more easily. It may be. In this case, it is possible to more easily and reliably recognize that the plating layer is deposited, that is, no misalignment has occurred, by the recognition pad having a larger area than the end face of the through conductor 5. can do.

DESCRIPTION OF SYMBOLS 1 ... Mother board 1a .... Insulating layer 2 ... Wiring board area | region 3 ... Wiring conductor 4 ... Conductor layer 5 ... Through conductor 6 ... Dummy area 8 ... Terminal 9 for plating ... Multi-cavity wiring boards

Claims (3)

A plurality of wiring board regions are arranged vertically and horizontally on a mother board formed by laminating a plurality of insulating layers made of a ceramic sintered body, and the wiring conductor of the wiring board area is plated on the exposed surface of the mother board. A multi-piece wiring board on which plating terminals for supplying a current are formed, and a pair of conductor layers electrically connected to the plating terminals are arranged side by side between the insulating layers. In addition, a pair of through conductors whose end faces are connected to the conductor layer are formed side by side from the surface of the mother board to the layer where the conductor layer is formed. The conductor layer is biased to be adjacent to the edges on the sides adjacent to each other, or is biased to the outer edge on the opposite side of the adjacent side, and the through conductor and the conductor layer in plan view Are connected to each other Portion have a length which is the sum of the maximum length in a direction in which the conductive layer is lined, it coincides with the double layered shift amount allowed in the direction in which the conductor layers of the upper and lower of said insulating layers are arranged, wherein A multi-piece structure, wherein a midpoint between the pair of conductor layers and a midpoint between the pair of through conductors coincide with each other when viewed from the direction in which the conductor layer and the through conductor overlap. Wiring board.   2. The multi-piece wiring board according to claim 1, wherein a frame-like dummy region is provided on an outer peripheral portion of the mother substrate, and the conductor layer and the through conductor are formed in the dummy region.   3. The multi-piece manufacturing method according to claim 1, wherein a plurality of pairs of the conductor layers and the through conductors are arranged on the mother board such that the respective directions of the crossing intersect each other. Wiring board.

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