JP5621679B2 - Cable end mold structure - Google Patents

Description

  The present invention relates to a cable end mold structure.

  For the purpose of insulating and protecting the cable connection part, the cable connection part is set in the mold, and the molten resin is injected from the injection molding machine into the mold to seal the cable connection part with the mold resin. It is generally done.

  As an example of a mold structure of this type of cable connection portion, a structure of a cable lead-out portion that is arranged inside a sensor main body in which an end portion of a cable is resin-molded has been proposed (for example, see Patent Document 1). ).

  As another example of this mold structure, a cable connection part mold case for molding a mold resin covering the cable connection part has been proposed (see, for example, Patent Document 2).

  As yet another example of this mold structure, a cable branch part mold structure in which a connection part in which a conductor of a branch cable is connected to a conductor of a trunk cable is sealed by an inner / outer double structure of an inner mold resin and an outer mold resin ( For example, see Patent Document 3).

  As an example of the electric wire insulation structure, there has been proposed an electric wire connection portion insulation structure (see, for example, Patent Document 4) in which a plurality of electric wire connection portions are covered with an insulator and inserted into an insulation sleeve.

JP 2001-37058 A Japanese Patent Laid-Open No. 3-22373 JP 2001-229995 A Japanese Patent Laid-Open No. 2004-3294

  However, in the structure of the conventional cable lead-out portion described in Patent Document 1, outgas may be generated from the cable sheath in contact with the high-temperature molten resin when the molten resin is injection-molded. If the outgas from the cable sheath stays between the cable sheath and the mold resin, it will cause a decrease in the adhesion between the mold resin and the cable sheath, and it will be difficult to form a cable connection portion with excellent airtightness. . Such countermeasures for outgassing are not taken even in the conventional techniques described in Patent Documents 2 to 4.

  Accordingly, an object of the present invention is to provide a cable end mold structure that can suppress a decrease in adhesion between a cable sheath and a mold resin portion due to outgassing.

The object of the present invention can be achieved by the inventions described in the following [1] to [ 3 ].

[1] The present invention provides a cable end part mold structure including a mold resin part molded by resin molding to cover an end part of a cable having a cable sheath, and the cable sheath and the mold are provided in the mold resin part. A portion that does not come into contact with the resin portion, and a gas concentration portion is formed in which at least a part of the gas generated in the cable sheath is concentrated when the mold resin portion is molded by resin molding , and the gas concentration portion is The cable end mold structure is a gas storage part for storing gas .

[ 2 ] The gas storage section described in [ 1 ] above is formed by a recess formed in an inner peripheral portion of an insert part provided on the outer periphery of the cable sheath.

[ 3 ] The insert part according to [ 2 ] is characterized in that it is formed of the same material as that of the mold resin portion.

  According to the present invention, it is possible to suppress a decrease in adhesion between the cable sheath and the mold resin portion due to outgas.

It is a figure which shows typically the cable end part mold structure which is typical 1st Embodiment of this invention. It is a perspective view of insert parts which constitute a part of mold structure. (A) is the IIIA-IIIA arrow cross-sectional enlarged view of FIG. 1, (b) is the arrow cross-sectional enlarged view of the IIIB-IIIB line of FIG. (A)-(f) is a figure which shows typically the process of manufacturing the mold structure of FIG. It is a figure for demonstrating the function of the mold structure of FIG. It is a figure which shows typically the cable end part mold structure which is 2nd Embodiment. FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 6. (A)-(e) is a figure which shows typically the process of manufacturing the mold structure of FIG. It is a figure for demonstrating the function of the mold structure of FIG.

[Summary of embodiment]
A cable end mold structure according to an embodiment of the present invention is a cable end mold structure including a mold resin portion molded by resin molding to cover an end portion of a cable having a cable sheath. Is a portion where the cable sheath and the mold resin portion are not in contact with each other, and a gas concentration portion is formed in which at least a part of the gas generated in the cable sheath is concentrated when the mold resin portion is molded by resin molding. It is what.

  In the present embodiment, the mold resin portion is a “contact portion” that is a portion in which a predetermined strength is maintained by being in close contact with the outer peripheral surface of the end portion of the cable sheath by resin molding. And a “non-contact portion” that is a portion that does not contact the outer peripheral surface of the end portion of the cable sheath. A “gas concentration part” is formed in the mold resin part. The “gas concentration part” is a part where the cable sheath and the mold resin part do not contact each other, and is, for example, a gas storage part or a gas exhaust path described later. At least part of the gas generated in the cable sheath at the time of resin molding is concentrated on the gas concentration portion. Thereby, it becomes possible to reduce a possibility that the gas may enter the interface of the contact portion.

  Preferred embodiments of the present invention will be specifically described below with reference to the accompanying drawings.

[First Embodiment]
(Configuration of resin mold structure)
FIG. 1 illustrates a resin mold structure 1 as an example of a structure formed by coating an end portion of a cable 2 and various electronic components 3 with a mold resin. The resin mold structure 1 uses the cable end resin mold structure according to the present invention. The resin mold structure 1 includes a mold resin portion 6 that is resin-molded so as to cover the electronic component 3 together with the end portion of the cable 2.

  The electronic component 3 of the resin mold structure 1 includes, for example, an electric cable such as a cable (not shown) of the counterpart of the cable 2, a circuit board 4 connecting the conductor 2 a of the cable 2, a sensor 5 mounted on the circuit board 4, and a terminal (not shown). It consists of various parts that require mechanical joining.

  As shown in FIG. 1, the cable 2 includes a conductor 2a, an insulating layer (not shown) provided around the conductor 2a, and the cable sheath 2b provided around the insulating layer. The cross-sectional shape of the cable 2 is formed in various shapes such as a concentric circle shape or a rectangular shape. The cable 2 may use a single electric wire, a plurality of electric wires, or may be used as a cable harness composed of a plurality of electric wires.

  As the material of the insulating layer covering the conductor 2a, all the insulating materials conventionally used as the cable 2 can be applied. In consideration of the case where the cable end mold structure according to the present invention is used also in a place where the temperature is high such as around the vehicle engine, the resin material for the cable sheath 2b is a fluorine-based resin, for example, a material containing fluorine. More preferably, the resin is blended with 80% wt. As an example thereof, for example, Frontrex (registered trademark) and the like can be mentioned. By using this resin material, the heat resistant temperature of the resin mold structure 1 can be set to about 200 ° C.

  As shown in FIG. 1, the conductor 2a is directly connected to the electrode of the circuit board 4 by soldering. The conductor 2a may be configured to use a single copper or copper alloy wire, or may be formed by twisting a plurality of copper wires or a plurality of copper alloy wires. The conductor 2a may be used as a power supply line or a signal line, or may be used as a ground line by grounding the terminal. The conductor 2a may be made of a metal other than copper, such as aluminum or iron.

  As shown in FIG. 1, the circuit board 4 may be a rigid board having no flexibility, a flexible board having flexibility, or a rigid flexible board in which a rigid board and a flexible board are formed in a plurality of layers. Good. Examples of the rigid substrate material include hard materials such as glass epoxy resin. On the other hand, examples of the material for the flexible substrate include polymer resins.

  The resin mold structure 1 is suitably used for, for example, an in-vehicle sensor used in an external impact or a high temperature and high humidity environment. As shown in FIG. 1, the sensor 5 is mounted on the circuit board 4 by soldering. Examples of the sensor 5 include a magnetic sensor, a temperature sensor, a pressure sensor, a photo interrupter, or a chemical sensor.

(Configuration of mold resin part)
As shown in FIG. 1, the mold resin portion 6 is resin-molded so as to cover the conductor 2 a, the cable sheath 2 b, the circuit board 4, and the sensor 5. The material of the mold resin portion 6 is preferably the same resin as that of the cable sheath 2b. However, the mold resin portion 6 has various thermoplastic resins that are compatible with the synthetic resin material that forms the cable sheath 2b. Can be used. The outer surface shape of the mold resin portion 6 may be various shapes such as a rectangular shape, a cubic shape, and a cylindrical shape.

  In the first embodiment, the resin mold structure 1 is a portion where the cable sheath 2b and the mold resin portion 6 are not in contact with each other in the mold resin portion 6, as shown in FIGS. A gas storage portion 10a is formed as a gas concentration portion where at least a part of the gas generated in the cable sheath 2b concentrates when the mold resin portion 6 is molded by resin molding. This gas storage part 10a is a main characteristic part of the present embodiment, and stores the gas (outgas) generated in the cable sheath 2b during resin molding so that the cable sheath 2b and the mold resin part are stored. 6 has a function of suppressing a decrease in adhesiveness. In this Embodiment, the gas storage part 10a is formed of the recessed parts 11a and 12a formed in the inner peripheral part of the insert component 10 provided in the outer periphery of the cable sheath 2b.

  As shown in FIGS. 1 to 3, the insert part 10 has a two-part structure in contact with a part of the outer surface of the cable sheath 2 b of the cable 2, and the outer surface shape excluding the concave portion has a substantially rectangular parallelepiped shape. 11 and the second case body 12. Concave portions 11a and 12a are formed in the insides of the opposing surfaces of the first case body 11 and the second case body 12, respectively. In the illustrated example, the first case body 11 and the second case body 12 are made of substantially the same material, shape, and structure, and are halved, but are not limited thereto. In the present invention, a divided structure other than a half may be used.

  As shown in FIG. 2 to FIG. 3B, the rectangular frame-shaped dividing surfaces 11 b and 12 b of the half portions facing each other of the first and second case bodies 11 and 12 are respectively arranged on the outer surface of the cable sheath 2 b. Cutout recesses 11c and 12c having a matching arcuate surface shape are formed. The notch recesses 11c and 12c are disposed in an intermediate portion excluding the corners of the dividing surfaces 11b and 12b.

  As shown in FIG. 3B, circular holding holes for holding the cable 2 on a pair of opposing side surfaces by overlapping the dividing surfaces 11b, 12b of the first and second case bodies 11, 12 A substantially rectangular parallelepiped insert part 10 having 10b is formed. The recesses 11a and 12a of the insert part 10 are arranged in a non-contact state with respect to the cable sheath 2b. In the present embodiment, the diameters of the cutout recesses 11c and 12c and the holding hole 10b formed thereby are the same as the outer diameter of the cable 2, but may be smaller than the outer diameter of the cable 2. Good. At this time, the first case body 11 and the second case body 12 are overlapped while the cable sheath 2b of the cable 2 is cut out and elastically deformed by the recesses 11c and 12c. By doing so, it becomes possible to eliminate the gap between the holding hole 10b and the cable 2 more reliably, and the mold resin flows into the recesses 11a and 12a through the holding hole 10b during resin molding. Can be prevented.

  By using this insert part 10, it occurs during resin molding, in the mold resin portion 6, more specifically, between the recesses 11 a and 12 a of the first and second case bodies 11 and 12 and the cable sheath 2 b. A gas storage portion 10a for storing outgas from the cable sheath 2b is formed.

  In addition, the structure divided into the some recessed part may be sufficient by forming a partition wall inside each recessed part 11a of the 1st case body 11 and the 2nd case body 12, and 12a. Moreover, although the mold resin part 6 which coat | covered the cable 2 and the electronic component 3 with the mold resin is illustrated, it is not limited to this, For example, it covers at least the edge part of the cable 2 with the mold resin part 6 The resin mold may be used.

  Furthermore, the divided surface convex portion 11d is formed on one of the divided surfaces 11b and 12b of the first case body 11 and the second case body 12, and the divided surface concave portion 12d is fitted to the divided surface convex portion 11d on the other side. May be provided. By doing so, the first case body 11 and the second case body 12 are misaligned when molten mold resin is poured into the cavity of the mold 100 (see FIG. 4) during resin molding, which will be described later. Can be reduced, and mold resin can be prevented from flowing into the recesses 11a and 12a. The fixing means that can be fitted and removed by the male and female members is not limited to the illustrated example, and various fixing means that can prevent the mold resin from flowing into the recesses 11a and 12a can be used. It is.

  As a material of the insert part 10, various resins having good compatibility with the mold resin portion 6 can be used, but it is preferable to use the same material as that of the mold resin portion 6. Thereby, adhesiveness can be improved in the interface of the insert component 10 and the mold resin part 6. FIG. In addition, as a material of the insert component 10, it is not limited to the same material as the mold resin part 6, For example, a metal material, an insulating rubber material, or a fiber material etc. can be used.

  Even if it is in the outer surface shape of this insert part 10, it is not limited to a substantially rectangular parallelepiped shape, and may be an outer surface shape such as a columnar shape, a dome (arc surface) shape, or a pyramid shape, for example. It is needless to say that various shapes that allow the resin portion 6 to be in close contact can be used.

  Even if it exists in the arrangement number and arrangement position of the insert component 10 used, it is not limited to the example of illustration. As an example thereof, for example, one of the first and second case bodies 11 and 12 of the insert part 10 can be disposed on the outer surface of the cable sheath 2b. As another example, for example, two or more insert parts 10 can be appropriately arranged on the outer surface of the cable sheath 2b in the longitudinal direction. By adopting this configuration, it is possible to store more outgas generated from the cable sheath 2b during resin molding, or to efficiently store outgas generated from several places.

(Production method of resin mold structure)
Below, an example of the manufacturing method of a cable end part mold structure is demonstrated, referring Fig.4 (a)-FIG.4 (f).

  In manufacturing the resin mold structure 1, first, a cable 2 having a diameter φ of 5 mm shown in FIG. 4A is prepared. Next, as shown in FIG. 4B, the cable sheath 2b is peeled off from the end face of the cable 2 at a portion of 5 mm to 30 mm, and the conductor 2a having a diameter of 3 mm is exposed by about 5 mm to 30 mm. Next, as shown in FIG. 4C, the exposed conductor 2a is solder-connected to the circuit board 4 (10 × 10 × 1 mm) on which the sensor 5 having an external dimension of 5 × 5 × 2 mm is mounted.

  Next, as shown in FIG. 4 (d), the divided surfaces 11b and 12b of the first and second case bodies 11 and 12 which are the insert parts 10 having a structure with an outer dimension of 4.5 × 4.5 × 4.5 mm are formed. By overlapping, the cable 2 is held by the holding hole 10b formed by the notch recesses 11c and 12c. Thereby, the assembly of the cable 2 and the electronic component 3 is obtained.

  Next, as shown in FIG. 4 (e), the insert part 10 having an external dimension of 4.5 × 4.5 × 4.5 mm and the assembly of the cable 2 and the electronic part 3 are supported according to a conventional method. Therefore, the assembly of the cable 2 and the electronic component 3 is set in the cavity of the mold 100 by using insert support pins, insertion frames, etc. (not shown) that constitute the cavity of the mold 100.

  Next, molten mold resin is poured into the cavity of the mold 100 through the injection port 101, and the end portion of the cable 2 and the electronic component 3 are covered with the mold resin. And the mold resin part 6 of the structure of the external dimensions 30x40x15mm which sealed the edge part and the electronic component 3 of the cable 2 is released. By the above operation, a resin mold structure 1 is obtained as shown in FIG.

(Effects of the first embodiment)
In the cable end mold structure according to the first embodiment, as shown in FIG. 5, a gas storage portion 10 a is formed in the mold resin portion 6 using the insert component 10. According to this configuration, the outgas 200 generated from the cable sheath 2b during resin molding is concentrated and stored in the gas storage part 10a, and the adhesion between the cable sheath 2b and the mold resin part 6 due to the outgas 200 is stored. Can be suppressed.

[Second Embodiment]
Even in the second embodiment, as shown in FIGS. 6 to 9, there is no difference in the basic configuration from the cable end mold structure according to the first embodiment.

  In these drawings, the main difference from the first embodiment is that, in the first embodiment, the gas concentrating portion is the gas storage portion 10a, but this second embodiment is different from the first embodiment. In this case, the gas concentration portion serves as a gas exhaust path 20 for exhausting the outgas 200 generated from the cable sheath 2b to the outside of the mold resin portion 6 during resin molding. 6 to 9, substantially the same members as those in the first embodiment are denoted by the same member names and reference numerals. Therefore, the detailed description regarding these members is omitted.

(Configuration of mold resin part)
As shown in FIGS. 6 and 7, the resin mold structure 1 is formed so as to penetrate a part of the cable 2 in the longitudinal direction from the outer peripheral surface of the cable sheath 2 b toward the outer peripheral surface of the mold resin portion 6. Two gas exhaust passages 20 are formed. The gas exhaust path 20 is formed in the radial direction with respect to the axial direction of the cable 2. The hole shape of the gas exhaust passage 20 is circular. According to the illustrated example, the pair of gas exhaust passages 20 are formed at the same angle in opposite directions with a 180 ° phase difference in the mold resin portion 6.

  The shape, number of formation, formation position and structure of the gas exhaust path 20 are not limited to the illustrated example. Needless to say, the hole shape of the exhaust passage 20 may be, for example, a polygonal shape such as a triangular shape or a quadrangular shape, or a polygonal pyramid shape such as a triangular pyramid shape or a quadrangular pyramid shape.

  As the number of gas exhaust passages 20 to be formed and the formation position, for example, one gas exhaust passage 20 can be appropriately formed inside the mold resin portion 6 corresponding to the end portion of the cable sheath 2b. Three or more gas exhaust passages 20 may be appropriately formed inside the mold resin portion 6 corresponding to the end portions in the longitudinal direction and the circumferential direction of the cable sheath 2b. By increasing the capacity of the gas exhaust passage 20 formed at a part of the end of the cable 2, more outgas generated from the cable sheath 2b during resin molding can be discharged or from several places. The generated outgas can be discharged efficiently.

  Although not shown, an exhaust port can be formed in the insert part 10 and a gas exhaust path 20 can be formed in the mold resin portion 6 so as to communicate with the exhaust port. The gas exhaust passage 20 has a large-diameter gas reservoir at the bottom, and a small-diameter gas exhaust passage is formed in the gas reservoir so that the outgas from the cable sheath 2b generated during resin molding can be removed from the gas exhaust passage. It can also be stored at the bottom of 20 and discharged to the outside through the discharge port.

(Production method of resin mold structure)
Below, the manufacturing method of a cable end part mold structure is demonstrated, referring Fig.8 (a)-FIG.8 (e).

  In manufacturing the resin mold structure 1, first, a cable 2 having a diameter of 5 mm is prepared as shown in FIG. Next, as shown in FIG. 8 (b), the cable sheath 2b is peeled off from the end face of the cable 2 at a portion of 5 mm to 30 mm, and the conductor 2a having a diameter of 3 mm is exposed by about 5 mm to 30 mm. Next, as shown in FIG. 8C, the exposed conductor 2a is solder-connected to the circuit board 4 (10 × 10 × 1 mm) on which the sensor 5 having a structure with an outer dimension of 5 × 5 × 2 mm is mounted. Thereby, the assembly of the cable 2 and the electronic component 3 is obtained.

  Next, as shown in FIG. 8 (d), the molding member 102 of the exhaust path 20 formed in the cavity of the mold is brought into contact with the cable sheath 2 b of the cable 2 and the cable 2 and the electronic component 3 according to a conventional method. In order to support this assembly, the assembly of the cable 2 and the electronic component 3 is set in the cavity of the mold 100 by using insert support pins, insertion frames, etc. (not shown) that constitute the cavity of the mold 100.

  Next, molten mold resin is poured into the cavity of the mold 100 through the injection port 101, and the end portion of the cable 2 and the electronic component 3 are covered with the mold resin. And the mold resin part 6 of the structure of the external dimensions 30x40x15mm which sealed the edge part and the electronic component 3 of the cable 2 is released. By the above operation, the resin mold structure 1 is obtained as shown in FIG.

(Effect of the second embodiment)
Even in the second embodiment, as shown in FIG. 9, the outgas 200 generated from the cable sheath 2 b during resin molding is concentrated in the gas exhaust path 20, and the outgas 200 becomes the mold resin portion 6. It will be exhausted outside, and the fall of the adhesiveness of the cable sheath 2b and the mold resin part 6 by the outgas 200 can be suppressed.

  In each of the above embodiments, the structure in which the connection portion between the cable and the electronic component is molded with the mold resin is exemplified. However, the present invention is not limited to this. For example, the connection portion in which the conductors of the cable are connected is molded. Even a structure sealed with a resin can be used effectively.

  As is clear from the above description, all the combinations of features described in the above embodiments, modifications, and illustrated examples are not necessarily essential to the means for solving the problems of the present invention. It should be noted that there is no point, and it goes without saying that various configurations are possible within the scope of the technical idea of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Resin mold structure, 2 ... Cable, 2a ... Conductor, 2b ... Cable sheath, 3 ... Electronic component, 4 ... Circuit board, 5 ... Sensor, 6 ... Mold resin part, 10 ... Insert part, 10a ... Gas storage part DESCRIPTION OF SYMBOLS 10b ... Holding hole, 11 ... 1st case body, 12 ... 2nd case body, 11a, 12a ... Recessed part, 11b, 12b ... Dividing surface, 11c, 12c ... Notch recessed part, 11d ... Dividing surface convex part, 12d ... Dividing surface recess, 20 ... gas exhaust passage, 100 ... mold, 101 ... inlet, 102 ... molding member, 200 ... outgas

Claims (3)

In the cable end mold structure including a mold resin portion that is resin molded to cover the end of the cable having a cable sheath,
A gas in which the cable sheath and the mold resin portion do not come into contact with each other in the mold resin portion, and at least a part of the gas generated in the cable sheath when the mold resin portion is resin-molded is concentrated. A concentrated part is formed ,
The cable end mold structure , wherein the gas concentration part is a gas storage part for storing the gas . 2. The cable end mold structure according to claim 1 , wherein the gas storage portion is formed by a concave portion formed in an inner peripheral portion of an insert part provided on an outer periphery of the cable sheath. The cable end mold structure according to claim 2 , wherein the insert part is formed of the same material as the mold resin part.

Images