JP5617787B2 - Chip pickup method, chip mounting method, and chip mounting apparatus - Google Patents

Description

  The present invention relates to a chip pickup method for picking up a chip from a wafer on which a plurality of chips are arranged, a chip mounting method for mounting the picked-up chip on a substrate, and a chip mounting apparatus.

  In a component mounting process in which chips such as semiconductor elements and LED elements are mounted on a substrate, a pick-up process is performed in which individual chips are taken out from a wafer on which a plurality of chips are formed at once (see, for example, Patent Document 1). ). In the prior art described in this patent document, the wafer area and pick-up order are set so that a plurality of chips (pellets) existing within a certain area on the wafer are picked up sequentially as the same group. An example is shown. Thereby, the effect that the characteristic of the chip picked up in series can be made the same characteristic as much as possible is obtained.

Japanese Patent Laid-Open No. 61-292933

  By the way, LED elements used as light sources of various illumination devices are LED elements that are divided into individual pieces from the wafer state due to various error factors in the manufacturing process, such as non-uniform composition during film formation on the wafer. Therefore, it is inevitable that the light emission characteristics vary. For this reason, in order to pick up LED elements having the same characteristics from the wafer, map data combining characteristic information obtained by measuring the characteristics of a plurality of LED elements in advance and position information on the wafer is prepared in advance. In addition, a method of determining the pickup order while referring to the map data in the pickup process is used.

  However, since the light emission characteristics of LED elements tend to be deflected depending on the area on the wafer, a method of simply searching for LED elements having a desired light emission characteristic according to a predetermined pick-up sequence with reference to map data does not necessarily have high work efficiency. Cannot pick up. For example, in the case where LED elements having the same characteristics are unevenly distributed on the outer peripheral portion of the wafer, searching in the pick-up order set in a lattice shape causes the pick-up operation to move the pick-up head relative to the wafer. Relative movement from end to end is repeatedly executed, and wasteful operation time occurs, resulting in a significant reduction in work efficiency. As described above, the conventional chip pickup has a problem that it is difficult to improve the working efficiency.

  Therefore, an object of the present invention is to provide a chip pickup method, a chip mounting method, and a chip mounting apparatus that can improve work efficiency.

The chip pick-up method of the present invention is a chip pick-up method for picking up a chip from a wafer on which a plurality of chips are arranged, and the area in each area set by dividing the wafer into a plurality of areas. A map data storage step for storing map data in which position information indicating chip arrangement positions, characteristic information indicating the characteristics of the chip, and area proximity information indicating the degree of proximity between the area and other areas are stored; A pickup chip determining step of determining a chip to be picked up next based on the characteristic information after picking up the chip from one area, and a chip determined in the pickup chip determining step based on the position information A pickup execution step of picking up the In the up-chip determination step, a qualified chip having a qualification as a chip to be picked up next is searched with reference to the map data, and the qualified chip existing in the same area is preferentially picked up next. If it is determined as a chip to be processed and the eligible chip does not exist in the area, the proximity degree to the area is determined based on the area proximity information, and the area having the highest proximity degree to the area is determined. The eligible chip present is determined as the next chip to be picked up.

The chip mounting method of the present invention is a chip mounting method for picking up a chip from a wafer on which a plurality of chips are arranged and mounting the chip on a substrate, and for each area set by dividing the wafer into a plurality of areas. A map data storage step for storing map data in which position information indicating the arrangement position of the chips, characteristic information indicating the characteristics of the chip, and area proximity information indicating the degree of proximity between the area and other areas are stored; After picking up one of the chips from one of the areas, a pick-up chip determining step of determining a chip to be picked up next based on the characteristic information, and a chip determined in the pick-up chip determining step as the position information Pickup execution process for picking up based on the chip picked up A chip mounting step of mounting on the substrate, and in the pickup chip determination step, a qualified chip having a qualification as a chip to be picked up next is searched with reference to the map data, and the same area is searched. If the eligible chip is preferentially picked up as the next chip to be picked up, and the qualified chip does not exist in the area, the degree of proximity to the area is determined based on the area proximity information. The qualified chip existing in the area having the highest degree of proximity to the area is determined as the chip to be picked up next.

A chip mounting apparatus according to the present invention is a chip mounting apparatus that picks up a chip from a wafer on which a plurality of chips are arranged and mounts the chip on a substrate, and a wafer holding unit that holds the wafer in a horizontal position, and positions the substrate A substrate holding unit for holding the chip, a chip mounting mechanism for picking up the chip from the wafer and transferring and mounting it on the substrate held by the substrate holding unit, and for each area set by dividing the wafer into a plurality Map data storage for storing map data in which position information indicating the arrangement position of the chip in the area, characteristic information indicating the characteristics of the chip, and area proximity information indicating the degree of proximity between the area and other areas are stored And after picking up one chip from one area, the next chip to be picked up is the characteristic information. A pickup chip determination processing unit determined based on the chip mounting mechanism, and a mounting control unit for controlling the chip mounting mechanism to pick up the chip determined by the pickup chip determination processing unit based on the position information and mounting the chip on the substrate The pick-up chip determination processing unit searches for a qualified chip having a qualification as a chip to be picked up next with reference to the map data, and finds the qualified chip existing in the same area. If the chip to be picked up next is preferentially determined and the eligible chip does not exist in the area, the degree of proximity to the area is determined based on the area proximity information, and the degree of proximity to the area The eligible chip in the area with the highest A constant.

According to the present invention, after one chip is picked up from one area, the chip to be picked up next is determined based on the characteristic information, and the chip is qualified as the next chip to be picked up. A qualified chip is searched with reference to the map data, and a qualified chip existing in the same area is determined as a chip to be preferentially picked up next. If there is no qualified chip in the area , the area is Based on the proximity information, the degree of proximity to the area is determined, and the qualified chip existing in the area having the highest degree of proximity to the area is determined as the chip to be picked up next, so that the pickup head is attached to the wafer. In the pick-up operation to move relative to the wafer, relative movement from end to end of the wafer And reduce unnecessary operating time of iteration, it is possible to improve the work efficiency of the pickup of the chip.

1 is an overall perspective view of a chip mounting apparatus according to an embodiment of the present invention. The fragmentary perspective view of the chip mounting apparatus of one embodiment of this invention 1 is a front view of a chip mounting apparatus according to an embodiment of the present invention. The block diagram which shows the structure of the control system of the chip | tip mounting apparatus of one embodiment of this invention Explanatory drawing of the wafer used as the taking-out object of the chip | tip by the chip | tip mounting apparatus of one embodiment of this invention Explanatory drawing of the map data in the chip | tip mounting method of one embodiment of this invention Explanatory drawing of the chip mounting data in the chip mounting method of one embodiment of this invention Explanatory drawing of the chip mounting pattern in the chip mounting method of one embodiment of this invention The flowchart which shows the chip | tip mounting method of one embodiment of this invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the overall configuration of the chip mounting apparatus 1 will be described with reference to FIG. The chip mounting apparatus 1 has a function of picking up a chip from a wafer on which a plurality of chips are arranged and mounting the chip on a substrate. In the present embodiment, an LED element as a chip is picked up from the LED wafer, Each of them is mounted on a substrate 7 (see FIGS. 2 and 8) divided into a plurality of unit mounting sections 7a corresponding to one LED unit.

  In FIG. 1, a component supply stage 3, a unit assembly stage 4, and a substrate holding stage 5 are arranged on the base 2 in the Y direction. The wafer holding table 3a provided in the component supply stage 3 has an LED wafer (hereinafter referred to as a wafer) that is a wafer-like assembly in which a plurality of LED elements to be mounted (hereinafter abbreviated as chips 6a) are fabricated. 6 is abbreviated as 6). The component supply stage 3 holding the chip 6a is a wafer holding unit that holds the wafer 6 in a horizontal posture. In the chip mounting operation for manufacturing the LED unit, the chip 6a is supplied by the wafer 6 to a chip mounting mechanism having a configuration described below.

  The unit assembly stage 4 includes a tool stocker 15, a component collection unit 16, and a calibration reference mark 17, which will be described later, on a moving table 4 a that reciprocates in the X direction by a linear motion mechanism (see the X-axis moving mechanism 40 shown in FIGS. , The relay stage 18, the component recognition camera 23, and other functional units are collectively arranged. The substrate holding stage 5 is configured to horizontally drive the substrate holding table 5a holding the substrate 7 on which the chip 6a is mounted by means of an XY table mechanism 53 (see FIG. 3), and functions to position and hold the substrate 7 have.

  Above the component supply stage 3, the unit assembly stage 4, and the substrate holding stage 5, the Y-axis frame 8 is positioned at the end of the base 2 in the X direction, and both ends are supported by the support posts 8a in the Y direction. It is built in. A mounting head moving mechanism 9 is incorporated on the front surface of the Y-axis frame 8 to guide and drive a mounting head 11 described below in the Y direction by linear motor driving. A mounting unit 19 having a function of holding the chip 6 a and mounting it on the substrate 7 is mounted on the mounting head 11. A first camera 21 and a second camera 22 are disposed above the component supply stage 3 and the substrate holding stage 5 for position recognition. The first camera 21 images the chip 6 a to be taken out at the component supply stage 3. The second camera 22 images the substrate 7 held on the substrate holding stage 5 and recognizes the chip mounting position. The component recognition camera 23 disposed on the unit assembly stage 4 images the chip 6 a taken out from the component supply stage 3 and held on the mounting head 11 from below.

  Next, the structure of each part will be described with reference to FIGS. The component supply stage 3 includes an XY table mechanism 31, and a plurality of support members 33 are erected on a horizontal moving plate 32 mounted on the upper surface of the XY table mechanism 31. The support member 33 supports the wafer holding table 3a on which the wafer 6 is mounted and held on the upper surface. The wafer 6 has a configuration in which a plurality of chips 6a are bonded to a wafer sheet 6b in a predetermined arrangement. On the wafer sheet 6b, a plurality of chips 6a in a state of being divided into pieces in a face-up posture with the active surface facing upward are adhered and held (see also FIG. 5).

  In the component supply stage 3, a pick-up work position [P1] for picking up the chip 6a from the wafer 6 is set. The position of the first camera 21 corresponds to the pickup work position [P1], and the position of the chip 6a to be picked up is detected by recognizing the imaging result obtained by imaging the LED wafer 6 by the first camera 21. . An ejector mechanism 34 is disposed at a position corresponding to the pickup work position [P1] inside the wafer holding table 3a. The ejector mechanism 34 has a function of promoting peeling of the chip 6a from the wafer sheet 6b by pushing up the chip 6a with a pin from the lower surface side of the wafer sheet 6b. When the chip 6a is taken out, the ejector mechanism 34 is moved up and down and brought into contact with the lower surface of the wafer sheet 6b, so that the pickup head 14 described later can easily take out the chip 6a from the wafer sheet 6b.

  In the component take-out operation, the XY table mechanism 31 is driven to move the wafer sheet 6b horizontally in the XY direction (arrow a), so that a plurality of chips 6a attached to the wafer sheet 6b are taken out. A desired chip 6a is positioned at the pick-up work position [P1]. Here, an example is shown in which a wafer table of a system for supplying wafer-state components attached to the wafer sheet 6b is used as the component supply stage 3, but a component tray that supplies a plurality of components in a predetermined planar arrangement. May be arranged on the component supply stage 3 so as to be exchangeable with the wafer table.

  Above the component supply stage 3, a pickup head 14 including a pickup nozzle 14a that sucks and holds the chip 6a is disposed. The pickup head 14 is held by a pickup arm 13a. The pickup arm 13a extends from the pickup head moving mechanism 13 suspended from the lower surface of the Y-axis frame 8 and extends above the component supply stage 3. It has been. By driving the pickup head moving mechanism 13, the pickup arm 13a moves in the XYZ directions (arrow b) and rotates around the X direction axis (arrow c).

  As a result, the pickup head 14 moves in the Y direction between the upper part of the component supply stage 3 and the upper part of the unit assembly stage 4 and advances and retreats in the X direction. By this operation, the pickup head 14 performs an operation of picking up the chip 6 a from the component supply stage 3 and transferring it to the relay stage 18 provided in the unit assembly stage 4. It moves to the component delivery position [P2] delivered to the mounting unit 19 of the mounting head 11. At this time, by rotating the pickup arm 13a and reversing the pickup head 14, the posture of the chip 6a held by the pickup nozzle 14a can be reversed (see FIG. 3).

  In this embodiment, an example is shown in which the wafer 6 is moved relative to the pickup head 14 by driving the XY table mechanism 31 and horizontally moving the wafer sheet 6b in the XY direction. The wafer 6 may be moved relative to the pickup head 14 by driving the mechanism 13 and horizontally moving the pickup head 14 in the XY directions.

  As shown in FIG. 3, the unit assembly stage 4 and the substrate holding stage 5 are provided on the upper surface of the base plate 52, and the base plate 52 is supported from below by a plurality of support posts 51 erected on the upper surface of the base 2. Has been. Here, the detailed structure of the unit assembly stage 4 will be described. The X-axis moving mechanism 40 has a function of moving the moving table 4a in the X direction, and is configured by disposing a mechanism element described below on the base 41. A guide rail 42a is disposed on the upper surface of the base portion 41 in the X direction, and a slider 42b slidably fitted to the guide rail 42a is fixed to the lower surface of the moving table 4a.

  As shown in FIG. 2, a feed screw 44 that is rotationally driven by a motor (not shown) is pivotally supported on a bracket 43 erected on an end portion of the base portion 41. The feed screw 44 is screwed into a nut member (not shown) coupled to the lower surface of the moving table 4a, and the moving table 4a reciprocates in the X direction when the feed screw 44 rotates in the forward and reverse directions ( Arrow g). As a result, the following functional units arranged on the moving table 4a can be integrally moved in the X direction, and these functional units can be positioned in an area accessible by the mounting head 11. Yes.

  A tool stocker 15, a component collection unit 16, a calibration reference mark 17, a relay stage 18, and a component recognition camera 23 are collectively arranged on the moving table 4a. In the tool stocker 15, a plurality of work tools, such as a component holding nozzle 19 a mounted on the mounting unit 19, exchanged according to the component type are stored for each component type. The work tools housed individually include the pick-up nozzle 14a attached to the pick-up head 14 and the tool stocker 15 in a state where the pick-up head 11 and pick-up head 14 are accessible to the mounting head 11, pick-up head. By moving 14 to the unit assembly stage 4, the component holding nozzle 19 a mounted on the mounting unit 19 and the pickup nozzle 14 a mounted on the pickup head 14 can be replaced with ones corresponding to the target component type. It can be done.

  The component collection unit 16 has a function of discarding and collecting components that are determined to be unsuitable for mounting on the substrate 7 such as defective components or mixed different components after being taken out from the component supply stage 3. The calibration reference mark 17 is provided for imaging and calibrating a mechanical position error caused by thermal expansion and contraction when the X-axis moving mechanism 40 is continuously driven by the second camera 22 disposed above. The reference mark. The chip 6a taken out from the component supply stage 3 by the pickup head 14 is placed on the relay stage 18 as necessary. The component recognition camera 23 is disposed with its imaging surface adjacent to the relay stage 18. Similarly, by driving the X-axis moving mechanism 40, the imaging surface of the component recognition camera 23 is positioned at the component delivery position [P2]. be able to. The component recognition camera 23 is used when the chip 6a picked up by the pickup head 14 from the component supply stage 3 and delivered to the mounting head 11 is recognized from below.

  The substrate holding stage 5 has a configuration in which a substrate holding table 5 a for holding the substrate 7 is provided on the XY table mechanism 53. The substrate 7 is divided into a plurality of unit mounting sections 7a each corresponding to one LED unit. A mounting work position [P3] for mounting the chip 6a on the substrate 7 held on the substrate holding table 5a is set on the substrate holding stage 5, and the second camera 22 corresponds to the mounting work position [P3]. Are arranged. By imaging the substrate 7 with the second camera 22, the chip mounting position set in the unit mounting section 7 a of the substrate 7 is detected. Then, by driving the XY table mechanism 53, the substrate holding table 5a moves horizontally in the XY direction together with the substrate 7 (arrow f), and an arbitrary chip mounting position set on the substrate 7 is positioned at the mounting work position [P3]. Can be made.

  Next, the mounting head 11 will be described. In FIG. 2, two guide rails 9a for guiding the mounting head 11 and the mounting head 11 in the Y direction are provided on the front surface of the mounting head moving mechanism 9 provided on the Y-axis frame 8. These guide rails 9a A stator 9b that constitutes a linear motor for driving the mounting head 11 and the mounting head 11 described below in the Y direction is disposed between them. A slider (not shown) is slidably fitted in the Y direction in the guide rail 9a, and this slider is fixed to the back surface of the vertical moving plate 11a.

  On the back surface of the moving plate 11a, a mover (not shown) that constitutes a linear motor is disposed facing the stator 9b. By driving these linear motors, the mounting head 11 is guided by the guide rail 9a and moves in the Y direction (arrow d). An elevating mechanism 11b is disposed on the front surface of the moving plate 11a, and an elevating plate 11c is disposed on the front surface of the elevating mechanism 11b so as to be slidable in the vertical direction. By driving the lifting mechanism 11b, the lifting plate 11c moves up and down (arrow e). A mounting unit 19 having a component holding nozzle 19a at the bottom is detachably mounted on the elevating plate 11c.

  The mounting unit 19 has a function of holding the chip 6a to be mounted by the component holding nozzle 19a. When the mounting head 11 is moved horizontally in the Y direction and the lifting plate 11c is moved up and down, the mounting unit 19 is operated as a component. The chip 6 a supplied from the supply stage 3 is mounted on the substrate 7 held on the substrate holding stage 5. Here, as a mounting form by the mounting head 11 to which the mounting unit 19 is mounted, the chip 6 a taken out from the component supply stage 3 by the pickup head 14 and placed on the relay stage 18 is held by the mounting unit 19 and is mounted on the substrate 7. And a face-down mounting configuration in which the chip 6 a taken out from the component supply stage 3 by the pickup head 14 and held on the pickup head 14 in a reverse state is held by the mounting unit 19 and mounted on the substrate 7. And can be selectively executed.

  In the present embodiment, the mounting head 11 to which the mounting unit 19 is mounted has the chip 6a supplied from the component supply stage 3 and picked up by the pickup head 14 and turned upside down at the component delivery position [P2]. It is received and mounted on the substrate 7 held on the substrate holding stage 5. In the above-described configuration, the mounting head 11 including the mounting head moving mechanism 9 and the mounting unit 19, the pickup head moving mechanism 13, and the pickup head 14 serve as a substrate holding unit by picking up the chip 6 a as a chip from the component supply stage 3. A chip mounting mechanism for transferring and mounting the substrate 7 held on the substrate holding stage 5 is configured.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 4, the control unit 60 includes a chip mounting data creation processing unit 60a, a pickup chip determination processing unit 60b, and a mounting control unit 60c as control processing functions, and a storage unit 61 is used for various chip mounting operations. In addition to the operation program and data, a map data storage unit 61a and a chip mounting data storage unit 61b are provided. By controlling each unit described below while referring to various programs and data stored in the storage unit 61 by the control unit 60, a plurality of chips 6a taken out from the component supply stage 3 are mounted on the substrate 7, An operation for manufacturing the LED unit is performed.

  First, the map data 66 (see FIG. 6) stored in the map data storage unit 61a will be described. The map data 66 is data in which position information indicating the arrangement of the chips 6a on the wafer 6 is associated with characteristic information indicating the light emission characteristics of the individual chips 6a. In the present embodiment, as shown in FIG. 5, the wafer 6 is divided into a plurality of areas A1 to A16 by a grid-like dividing line. Note that the area numbers are assigned in these areas in the order of starting from the upper left end (area A1) in one direction (initially in the right direction) and then moving downward in the opposite direction. A zigzag area number assigning method that repeats this is adopted.

  Then, for each area A1 to A16, an area-specific coordinate origin (O1 to O16) indicating the coordinate origin in the area is set, and the coordinate origin O16 of the area A16 in the final area matches the coordinate origin O of the entire wafer 6. To do. Here, since the circular wafer 6 is divided into lattices, a regular area of a square lattice is formed inside the wafer 6, but the area shape is irregular at the outer edge of the wafer 6. The arrangement of the chips 6a in the area is also partly irregularly arranged stepwise.

  In order to specify an arbitrary chip 6a in the wafer 6, matrix coordinates (X, Y) in which X-direction cell numbers and Y-direction cell numbers in a matrix that divides the wafer 6 into a lattice pattern for each chip 6a are used. It is done. Here, the entire matrix coordinates based on the coordinate origin O of the entire wafer 6 may be used, and the area number Ai to which the chip 6a belongs is first identified, and the individual coordinate origin Oi of the area Ai is used as a reference. Local matrix coordinates may be used. In the present embodiment, an example is shown in which individual chips 6a are specified using local matrix coordinates based on individual coordinate origins Oi.

  Next, the data configuration of the map data 66 created for the wafer 6 having the above-described configuration and stored in the map data storage unit 61a will be described with reference to FIG. FIG. 6A illustrates a part of the map data 66 created for the areas A1 and A2 shown in FIG. 6B among the areas shown in FIG. In FIG. 6A, an area 66a indicates individual areas (area A1 to area A16) obtained by dividing the wafer 6 into a plurality of pieces, and the chip 6a in each area is specified as the chip 6a belonging to each area. In-area chip No. 66b is given. The position information 66c includes the in-area chip No. The position of the chip 6a specified by 66b in the area is represented by using local matrix coordinates based on the coordinate origin Oi of the area Ai.

  For example, the chip No. in area A1. In (1), since the X-direction cell number is 5 and the Y-direction cell number is 3 in the area A1, (x5, y3) matrix coordinates are attached as the position information 66c. Similarly, the chip No. In (1), since the X-direction cell number is 5 and the Y-direction cell number is 6 in the area A2, matrix coordinates (x5, y6) are attached as the position information 66c.

  The characteristic information 66d includes the in-area chip No. The characteristic information of the chip 6a specified by 66b, that is, the light emission characteristic rank of the LED element is shown in the present embodiment. Here, the light emission characteristic rank is determined by dividing each of the chips 6a into a plurality of distributions of light emission characteristics (here, light emission wavelengths) obtained by actual measurement by a pre-process device for a plurality of chips 6a to be mounted. Indicates which rank belongs to. In the example shown in this embodiment, the distribution of the emission wavelength is ranked into two, high / low, and the higher emission wavelength is ranked A and the lower is rank B.

  In the example shown in FIG. 6A, the chip No. in area A1. For (1), the chip No. in rank A and area A2. (1) is classified into rank B. In the example shown here, as an example of division, an example in which ranks are divided into two categories is shown. However, ranks may be classified into more categories as necessary. This map data 66 is created based on the inspection result obtained by inspecting the light emission characteristics in advance for the wafer 6 in the pre-process apparatus, and is recorded via a communication means such as a LAN line or on a storage medium such as a CD-ROM. It is provided to the chip mounting apparatus 1 in the form and is written in the map data storage unit 61a.

  That is, for each area set by dividing the wafer 6 into a plurality of areas, the storage unit 61 associates position information indicating the arrangement position of the chips 6a in the area with characteristic information indicating the characteristics of the chip 6a. Remember. As shown in FIG. 6, by referring to the map data 66, the characteristic information of the individual chips 6a among the plurality of chips 6a of the wafer 6 can be individually determined. In the present embodiment, the chip 6a is an LED element, and the characteristic information is light emission characteristic information obtained by individually ranking the light emission characteristics of the LED elements. Here, as described above, since the wafer 6 is divided into areas, individual chips 6a can be specified through the area to which the chips 6a belong.

  Furthermore, the map data 66 shown in the present embodiment includes area proximity information 66e indicating the degree of proximity between one area and a plurality of other areas. That is, as shown in FIG. 6A, each area 66a corresponds to area proximity information 66e indicating the degree of proximity to the area by a combination of the proximity rank 66f and the area 66g, and one area Is designated, it is possible to rank the areas in the order of positional proximity from the area.

That is, in the example of area A1, the closest proximity ranking 1 lists up and down adjacent areas A2 and A8, and the next closest proximity ranking 2 lists diagonally downward adjacent area A7. Yes. Also, in the example of area A2, areas A1, A3, and A7 that are adjacent to each other in the closest proximity rank 1 are listed, and the next closest proximity rank 2 is diagonally below. Areas A8 and A6 are listed. The significance of the area proximity information 66e shown here is to make the relative movement of the pickup head 14 relative to the wafer 6 as efficient as possible in the pickup operation of the chip 6a, so the definition of the proximity order needs to be set strictly. Alternatively, the degree of proximity may be defined by rough wrapping.

  The chip mounting data storage unit 61b includes chip mounting data 67 (see FIG. 7), that is, mounting position information indicating individual mounting positions of the chip 6a on the substrate 7, and characteristic information (light emission) of the chip 6a to be mounted at each mounting position. The chip mounting data 67 associated with the characteristic rank is stored. A detailed configuration of the chip mounting data 67 will be described with reference to FIGS. The chip mounting data 67 shown in FIG. 7 is mounting data prepared for each substrate 7 to be produced. Refer to the map data 66 of the wafer 6 used for chip mounting work for the substrate 7 in advance. It is created by the chip mounting data creation processing unit 60a and written to the chip mounting data storage unit 61b.

  As shown in FIGS. 8A and 8B, the substrate 7 is divided into a plurality of unit mounting sections 7a corresponding to one LED unit, and a plurality of (here, four) chips are provided in each unit mounting section 7a. By mounting 6a, one LED unit 70 is formed for each unit mounting section 7a. Then, after the mounting operation is completed, the substrate 7 is divided into the unit mounting sections 7a, whereby the individual LED unit 70 as a product is obtained.

  As shown in FIGS. 7A and 7B, each LED unit 70 has a unit number 67b ((1) (2) (3) (4)... According to the arrangement of the unit mounting sections 7a on the substrate 7. ) And the unit number 67b is specified, whereby the combination of the four chips 6a mounted on the unit mounting section 7a of the substrate 7 is specified. These chips 6a are assigned with a series of mounting numbers 67a corresponding to the order of the unit numbers 67b. In the element mounting work for chip mounting, the elements are mounted in order according to the mounting number 67a. As a result, the LED units 70 (1), (2), (3), (4), etc. shown in FIG. 8 are sequentially formed in each unit mounting section 7 a of the substrate 7.

  7 and 8 show examples of chip mounting data 67 having two patterns according to the combination of the light emission characteristic ranks in the chip 6a constituting one LED unit 70. FIG. That is, in the chip mounting data 67 of pattern 1 shown in FIG. 7A, an example is shown in which one LED unit 70 is completed by combining only the chips 6a having the same light emission characteristics (here, rank A). . By applying the chip mounting data 67 in such a form, as shown in FIG. 8A, the chips 6a having the same light emission rank A are mounted in each unit mounting section 7a.

  On the other hand, in the chip mounting data 67 of the pattern 2 shown in FIG. 7B, two ranks having different light emission characteristics, that is, rank A chips 6a and rank B chips 6a are combined in the same number. The example which completes one LED unit 70 is shown. By applying the chip mounting data 67 in such a form, as shown in FIG. 8B, each unit mounting section 7a includes two chips 6a of the light emission rank A and two chips 6a of the light emission rank B. Implemented one by one.

  That is, the chip mounting data creation processing unit 60a creates chip mounting data 67 in which mounting position information indicating individual mounting positions of the chip 6a on the substrate 7 is associated with characteristic information of the chip 6a to be mounted at each mounting position. Perform the process. Then, the mounting control unit 60c controls the chip mounting mechanism configured as described above based on the map data 66 and the chip mounting data 67, thereby mounting the plurality of chips 6a taken out from the component supply stage 3 on the substrate 7. Execute the mounting operation.

  In this chip mounting operation, every time the pickup head 14 performs a pickup operation to take out the chip 6a from the wafer 6 held on the component supply stage 3, the process for specifying the next chip 6a to be picked up is the pickup chip determination process. This is executed by the unit 60b. As described above, the distribution of the characteristics of the chips 6a on the wafer 6 varies, and the characteristics of the chips 6a mounted on the unit mounting sections 7a of the substrate 7 are specified in advance. For this reason, in the chip pickup operation, the next chip 6a to be picked up is the chip 6a having the characteristics defined by the chip mounting data 67, in other words, is the qualified chip having the eligibility to be picked up in the pickup operation. It is necessary to repeatedly execute the chip mounting operation while determining whether or not.

  Therefore, in the present embodiment, the function of the pickup chip determination processing unit 60b determines the eligible chip to be picked up next for each pickup operation based on the characteristic information 66d of the map data 66, and determines the position thereof. The information 66c is specified. Here, the pick-up chip is determined while assuming a pick-up order that has characteristics defined by the chip mounting data 67 and that realizes improvement in the operation efficiency of the pick-up operation by the pick-up head 14.

  That is, the pick-up chip determination processing unit 60b first determines the map data 66 as to whether or not there is an eligible chip to be picked up next in the same area that was picked up by the chip 6a in the operation executed immediately before. Judgment is made by searching. If there is a qualified chip in the same area, the qualified chip is preferentially determined as the next chip 6a to be picked up. If there is no qualified chip in the area, the qualified chip present in the area having the highest degree of proximity to the area is determined as the chip 6a to be picked up next. At this time, the area proximity information 66e included in the map data 66 is referred to in order to determine the degree of proximity to the area. The chip 6a thus determined to be picked up next is picked up by the pick-up head 14 from the component supply stage 3 and transferred to the mounting unit 19, and then the substrate 7 indicated by the mounting position information 67c. Mounted at the mounting position.

  The mechanism driving unit 62 is controlled by the control unit 60 to be a component supply stage 3, a unit assembly stage 4, a substrate holding stage 5, a mounting head moving mechanism 9, a mounting head 11, a pickup head moving mechanism 13, and a pickup head 14. Drive. The recognition processing unit 63 performs recognition processing on the imaging results obtained by the first camera 21, the second camera 22, and the component recognition camera 23. As a result, chip position recognition when the chip 6 a is taken out by the pickup head 14 in the component supply stage 3, substrate position recognition when the chip 6 a is mounted on the substrate 7 held on the substrate holding stage 5, and held by the mounting head 11. In this state, the position of the chip 6a is recognized. The operation / input unit 64 is an input device such as a touch panel or a keyboard, and inputs operation commands and various data for operating the chip mounting apparatus 1. The display unit 65 is a display device such as a liquid crystal panel, and displays a guidance screen and various notification screens during an input operation by the operation / input unit 64.

  The chip mounting apparatus 1 is configured as described above. Hereinafter, a chip mounting method by the chip mounting apparatus 1, that is, picking up and taking out the chip 6a from the wafer 6 on which a plurality of chips 6a are arranged, and unit mounting of the substrate 7 is performed. A chip mounting method to be mounted on the section 7a will be described in accordance with the flow of FIG. Here, the wafer 6 held on the component supply stage 3 is an LED wafer in which LED elements as a plurality of chips 6a are formed in a lump, and the arrangement order of the LED elements on the LED wafer is not changed at all. No operation has been performed. Therefore, the characteristics of the chip 6a on the wafer 6 are often unevenly distributed depending on the region of the wafer 6.

  First, the wafer 6 is subjected to a characteristic inspection before being carried into the chip mounting apparatus 1, and the map data 66 shown in FIG. 6, that is, the areas A1 to A16 set by dividing the wafer 6 into a plurality of regions. Map data 66 in which position information 66c indicating the arrangement position of the chips 6a in the area and characteristic information 66d indicating the characteristics of the chip 6a are associated is created in advance. The created map data 66 is stored in the map data storage unit 61a of the storage unit 61 (ST1) (map data storage step). As a result, the chip pick-up operation for picking up the chip 6a from the wafer 6 held on the component supply stage 3 and mounting it on the substrate 7 can be executed, and the picked-up chips 6a are sequentially mounted on the unit mounting section 7a of the substrate 7. Chip mounting operation is executed.

  In the process of repeatedly executing this chip execution operation, the process of determining the chip 6a to be picked up is executed by the pickup chip determination processing unit 60b. That is, after one chip 6a is picked up from one area in one chip pickup operation, the next chip 6a to be picked up is determined based on the characteristic information 66d defined in the map data 66 (ST2) (Pickup chip) Decision process). In the present embodiment, the chip 6a is an LED element, and in the pickup chip determination step, the LED element specified based on the ranking of the light emission characteristics indicated in the characteristic information 66d is determined as a qualified chip. .

  In the pick-up chip determination step, map data is obtained from the qualified chip having the qualification as the next chip 6a to be picked up, that is, the chip 6a corresponding to the characteristic (light emission characteristic rank) specified by the characteristic information 67d of the chip mounting data 67. Search with reference to 66. At this time, in order to improve the working efficiency of the pick-up operation for moving the pick-up head 14 relative to the wafer 6 as much as possible, the purpose is to reduce useless operation time for repeatedly executing the relative movement from end to end of the wafer 6. Then, the chip 6a to be picked up next is determined by the following method.

  First, it is determined whether or not a qualified chip exists in the same area (ST3). Here, if YES, that is, if there is a qualified chip in the same area, the qualified chip is determined as the chip 6a to be picked up next (ST4). If NO, that is, if there is no qualified chip in the same area, the qualified chip existing in the area having the highest degree of proximity to the area is determined as the next chip 6a to be picked up (ST5). . Here, the determination of the proximity degree is performed based on the area proximity information 66e included in the map data 66. That is, referring to the area proximity information 66e, the chip 6a in the area is searched in descending order of the proximity rank 66f, and a qualified chip existing in the area having the highest degree of proximity to the area is found from these.

  Next, the qualified chip determined in the above-described pickup chip determination step is picked up based on the position information 66c (ST6) (pickup execution step). That is, the chip 6a is picked up by the pickup head 14 from the wafer 6 held on the component supply stage 3, and the pickup head 14 is moved up and down to the component delivery position [P2], and the chip 6a held here is mounted. Delivered to the mounting unit 19 of the head 11.

  The picked-up chip 6a is mounted on the substrate 7 (ST7). That is, by moving the mounting head 11 to the mounting work position [P3] and lowering the mounting unit 19, the unit mounting section specified by the unit number 67b indicated by the chip mounting data 67 on the substrate 7 is held on the substrate 7. 7a is mounted at the chip mounting position. Then, the chip mounting operation for one substrate 7 is completed by repeatedly executing this chip mounting operation for all the unit mounting sections 7 a on the substrate 7.

  As described above, in the chip pickup operation in the chip mounting shown in the present embodiment, first, the chip 6a in the area is set for each area set by dividing the wafer 6 held on the component supply stage 3 into a plurality of areas. The map data 66 in which the position information indicating the array position and the characteristic information 66d indicating the characteristics of the chip 6a are associated with each other is stored.

  In the execution process of the chip pick-up operation, after picking up one chip 6a from one area, the next chip to be picked up in the pick-up chip determination step of determining the next chip 6a to be picked up based on the characteristic information 66d. The qualified chip having the qualification as 6a is searched with reference to the map data 66, and the qualified chip existing in the same area is preferentially determined as the next chip to be picked up. In the case where no is present, a qualified chip existing in an area having the highest degree of proximity to the area is determined as a chip to be picked up next.

  Thus, in the pick-up operation in which the pick-up head 14 is moved relative to the wafer 6 in a wasteful time that occurs when a search is performed according to a predetermined search path in the prior art, that is, from the end of the wafer 6 to the end. Thus, it is possible to reduce the useless operation time for repeatedly executing the relative movement until the work efficiency of the pickup operation of the chip 6a is improved. In general, since the chips 6a having the same characteristics in the wafer 6 tend to be unevenly distributed in specific areas close to each other, the chips 6a having the same characteristics are continuously connected, particularly as in the pattern 1 of the chip mounting data 67 shown in FIG. In the case of picking up, the effect of improving the working efficiency is remarkable.

  In the above-described embodiment, the example in which the chip 6a is an LED element and the characteristic information is the light emission characteristic rank of the LED element is shown. However, the present invention is not limited to such an example, and a plurality of chips 6a is used. The present invention can be applied as long as the chips 6a are sequentially picked up from the wafer 6 formed in a regular arrangement based on the characteristic information. For example, the present invention is also applicable to a case where semiconductor elements are picked up sequentially from a semiconductor wafer in which a plurality of semiconductor elements are built based on the quality determination information of the semiconductor elements as characteristic information.

  INDUSTRIAL APPLICABILITY The chip pickup method, the chip mounting method, and the chip mounting apparatus according to the present invention have an effect of improving work efficiency, and can be used in the field of taking chips such as LED elements from a wafer and mounting them on a substrate. It is.

DESCRIPTION OF SYMBOLS 1 Chip mounting apparatus 3 Component supply stage 4 Unit assembly stage 5 Substrate holding stage 6 Wafer 6a Chip 7 Substrate 7a Unit mounting section 9 Mounting head moving mechanism 11 Mounting head 13 Pickup head moving mechanism 14 Pickup head [P1] Pickup work position [P2 ] Parts delivery position [P3] Mounting work position

Claims (4)

A chip pickup method for picking up a chip from a wafer on which a plurality of chips are arranged,
For each area set by dividing the wafer into a plurality of areas, position information indicating the arrangement position of the chips in the area, characteristic information indicating the characteristics of the chip, and the degree of proximity between the area and other areas A map data storage step for storing map data associated with area proximity information indicating :
A pickup chip determination step of determining a chip to be picked up next based on the characteristic information after picking up one chip from the one area;
A pickup execution step of picking up the chip determined in the pickup chip determination step based on the position information,
In the pickup chip determination step, a qualified chip having a qualification as a chip to be picked up next is searched with reference to the map data,
Determining the eligible chips present in the same area preferentially as the next chip to be picked up;
When the qualified chip does not exist in the area, the proximity degree to the area is determined based on the area proximity information, and the qualified chip is present in the area having the highest proximity degree to the area. A chip pick-up method characterized in that it is determined as a chip to be picked up next. The chip is an LED element, and the characteristic information is light emission characteristic information obtained by individually ranking the light emission characteristics of the LED elements,
In the pickup chip determination step, according to claim 1 Symbol placement of the chip pickup method and determining the LED element specified based on the ranking as the qualifying chips. A chip mounting method for picking up a chip from a wafer on which a plurality of chips are arranged and mounting the chip on a substrate,
For each area set by dividing the wafer into a plurality of areas, the position information indicating the arrangement position of the chips in the area, the characteristic information indicating the characteristics of the chip, and the degree of proximity between the area and other areas A map data storage step for storing map data associated with area proximity information ;
A pickup chip determination step of determining a chip to be picked up next based on the characteristic information after picking up one chip from the one area;
A pickup execution step of picking up the chip determined in the pickup chip determination step based on the position information;
A chip mounting step of mounting the picked-up chip on the substrate,
In the pickup chip determination step, a qualified chip having a qualification as a chip to be picked up next is searched with reference to the map data,
Determining the eligible chips present in the same area preferentially as the next chip to be picked up;
When the qualified chip does not exist in the area, the proximity degree to the area is determined based on the area proximity information, and the qualified chip is present in the area having the highest proximity degree to the area. Next, the chip mounting method is characterized in that it is determined as a chip to be picked up. A chip mounting apparatus for picking up a chip from a wafer on which a plurality of chips are arranged and mounting the chip on a substrate,
A wafer holding unit for holding the wafer in a horizontal posture;
A substrate holder for positioning and holding the substrate;
A chip mounting mechanism for picking up the chip from the wafer and transferring and mounting it on the substrate held by the substrate holding unit;
For each area set by dividing the wafer into a plurality of areas, the position information indicating the arrangement position of the chips in the area, the characteristic information indicating the characteristics of the chip, and the degree of proximity between the area and other areas A map data storage unit for storing map data associated with area proximity information ;
A pickup chip determination processing unit for determining a chip to be picked up next based on the characteristic information after picking up one chip from the one area;
By controlling the chip mounting mechanism, a mounting control unit that picks up the chip determined by the pickup chip determination processing unit based on the position information and mounts it on the substrate, and
The pickup chip determination processing unit searches for qualified chips having eligibility as chips to be picked up next with reference to the map data,
Determining the eligible chips present in the same area preferentially as the next chip to be picked up;
When the qualified chip does not exist in the area, the proximity degree to the area is determined based on the area proximity information, and the qualified chip is present in the area having the highest proximity degree to the area. A chip mounting apparatus characterized in that it is determined as a chip to be picked up next.

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