JP5567989B2 - Control device for vehicle alternator - Google Patents

Description

  The present invention relates to a control device for an AC generator for a vehicle, and more particularly to a control device for an AC generator for a vehicle suitable for a device having a power semiconductor device.

Conventionally, as means for mounting a power semiconductor component and a small signal semiconductor on the same substrate, a circuit diagram of FIG. 17 and a mounting example of FIG. 18 will be described.
FIG. 17 is a control circuit diagram showing a charging system of a conventional automobile generator. FIG. 18 is a structural diagram of a mounting example of a conventional automotive generator. 18A is a plan view, and FIG. 18B is a front view.

  In FIG. 17, the field winding 13 rotates in synchronization with the rotation of the engine to generate a rotating magnetic field. A flywheel diode 142b connected in parallel to the field winding 13 is connected to absorb switching noise. The armature winding 11 outputs a voltage having an AC waveform according to the magnitude of the rotating magnetic field generated by the field winding 13. The AC output is full-wave rectified by rectifying power Zener diodes 121, 122, 123, 124, 125, 126 that constitute the three-phase full-wave rectifier 12.

The current flowing through the field winding 13 is controlled by the voltage control IC regulator 30b, thereby controlling the generator output voltage to a constant voltage. The voltage control IC regulator 30b includes a voltage control unit 1450b, a power transistor 141b that mainly generates heat to control the field current, and a flywheel diode 142b.
The controlled output is charged to the battery 16. At the same time, the output of the three-phase full-wave rectifier 12 is supplied to an electric load 18 such as a lamp via a load switch 17.

  The ECU 60, which is a control unit on the vehicle side, detects the state of the vehicle, transmits an optimal adjustment voltage command value from the COM terminal to the voltage control IC regulator 30b, and the adjustment voltage value is changed. The voltage control IC regulator 30b changes the magnitude of the rotating magnetic field by controlling the power transistor 141b and changing the field current conduction rate to the field winding 13, and as a result, the adjustment voltage value is It is controlled to an adjustment voltage value commanded by the ECU unit 60 which is a control unit on the vehicle side.

  In the control operation as described above, the power transistor 141b that controls the field current is the semiconductor component that generates the most heat, and has a structure as shown in FIG.

  That is, as shown in FIG. 18, heat generated by the power transistor 141 b in the heat sink 143 is transmitted from the ceramic substrate 144 to the heat radiating plate 50 through the adhesive 51, and cooling air hits the radiating fins 53 of the heat radiating plate 50. This is a structure that releases heat.

  In the voltage control IC regulator 30b, the voltage control unit 1450b that does not generate much heat is mounted on the same substrate, and the voltage control IC regulator 30b is mounted on the ceramic substrate 144 in order to withstand severe thermal stress in the engine room of the automobile. It is configured by solder mounting on the surface, and by reducing the difference in coefficient of linear expansion, the thermal fatigue life accompanying temperature change is improved. Therefore, as a material for the heat sink 143 that dissipates the heat of the power transistor 141b, the linear expansion coefficient is silicon (the linear expansion coefficient of silicon is about 3.5 ppm) or a ceramic material (the linear expansion coefficient of the ceramic substrate is about 6.5 ppm). It is necessary to use an expensive molybdenum material (the linear expansion coefficient of molybdenum material is about 4.9 ppm) or an expensive tungsten material (a substrate having a linear expansion coefficient of tungsten material of about 4.5 ppm).

  The above structure is an “air-cooling” method based on the premise that heat is released from the heat dissipating fins 53 with air in the engine room of the automobile, but in recent years, due to the higher density inside the engine room, the temperature inside the engine room is The structure has a high temperature and the cooling air is difficult to flow. For this reason, cooling capacity may be insufficient in air cooling. As a countermeasure, a “water cooling” method for cooling the automobile generator itself by using the cooling water circulating in the engine inside the engine has been devised and put into practical use.

  This water cooling system enables stable operation of the voltage control IC regulator 30b within a range that does not exceed the semiconductor junction temperature even when the temperature inside the engine room is abnormally high. As an automotive generator that is directly mounted, thermal stress is severe, and the thermal fatigue life needs to be almost the same as that of the conventional “air cooling” method.

  Here, conventional methods for mounting power semiconductor components and small signal semiconductors are to reduce the amount of heat generated by the heat generating component itself and regulate the positional relationship between the heat generating component and a component that generates little heat, thereby generating heat. It is known that a heat sink made of an expensive molybdenum material, which has been conventionally required, is eliminated by dispersing the heat sink (see, for example, Patent Document 1).

  As a method for cooling the power semiconductor component and the small signal semiconductor, a water cooling method using engine cooling water is known to cool the heat generating power semiconductor component (for example, Patent Document 2). reference). For this reason, it is not necessary to increase the number of heat dissipating fins or increase the size of the heat dissipating fins in order to increase the surface area of the heat dissipating fins in order to air-cool with the high-temperature air inside the engine room.

Japanese Patent No. 3552296 Japanese Patent No. 4023489

  However, in the case of the prior art AC generator, an expensive heat sink material such as molybdenum material is used to improve the thermal fatigue life of the power semiconductor component, or it is between a heat generating component and a component that generates little heat. It is necessary to arrange them at a certain distance or more, which becomes an obstacle to reduction in the number of parts, miniaturization, and cost reduction.

  Also, when cooling directly by eliminating the fins and circulating engine cooling water inside the generator bracket, the ceramic substrate is easy to break and the degree of freedom of processing is limited. Since a cooling method that directly contacts the bracket for radiating heat is difficult, after all, a heat radiating plate from which heat radiating fins are removed is required.

  Also, the ceramic substrate is structurally difficult to transmit heat in the lateral direction, and in order to cool the power semiconductor component mounted on the ceramic substrate more efficiently, the ceramic substrate is placed directly under the power semiconductor component mounted on the ceramic substrate. It is necessary to cool directly, and the shape of the support column provided in the bracket and the degree of freedom of arrangement are limited.

  In addition, in order to obtain the flexibility of the shape and arrangement of the support pillars provided on the bracket, it is necessary to improve the lateral heat propagation by making the heat dissipation plate thicker than necessary. And the problem of causing the cost increase of material cost arises.

  An object of the present invention is to provide a control device for an automotive alternator that can be connected to a water cooling bracket while reducing the number of parts and reducing the size.

(1) In order to achieve the above object, the present invention holds a rotor around which a field winding is wound, a stator around which an armature winding is wound, and the rotor and the stator. A vehicle AC comprising: a bracket made of a thermally conductive member, and a coolant flow path provided inside the bracket for flowing a coolant and transmitting heat generated by the armature winding to the outside A voltage control IC regulator unit that is used in a generator and controls a voltage induced in the armature winding by adjusting a current flowing in the field winding, and thermally controls the voltage control IC regulator unit. A control device for a vehicle alternator, wherein the voltage control IC regulator unit is a field current flowing in the field winding. Control power semiconductor part and voltage A one-chip IC regulator in which a small signal semiconductor portion is formed of a single semiconductor, and the one-chip IC regulator is formed of a resin-sealed package bonded to a metal heat sink and sealed with a resin The one-chip type IC regulator constituted by the package is bonded to the metal substrate provided with an electric wiring part through an insulating layer, and heat generated in the voltage control IC regulator part is transferred from the metal substrate to the bracket. The voltage control IC regulator section, the metal heat sink for heat dissipation, and the metal substrate are stacked in this order on the bracket provided with the coolant flow path . Is.
With this configuration, the number of parts can be reduced and the size can be reduced, and connection to the water cooling bracket is possible.

  (2) In the above (1), preferably, a support column provided on the end surface of the bracket is provided, the support column is formed in a convex shape from the end surface of the bracket, and the metal substrate is provided on the support column. The metal substrate is fixed in a contacted state, and the metal substrate is made of a highly heat conductive metal material.

  (3) In the above (2), preferably, the metal substrate has a positioning hole for fixing to the support column.

  (4) In the above (2), preferably, the voltage control IC regulator unit is attached to an IC case connected to an external power source and the field winding, and is relayed to the voltage control IC regulator unit. The lead is connected to the metal substrate via a welding pad made of nickel or nickel-iron alloy, and the IC case and the metal substrate are integrally fixed to the support column by the fastening member. .

  (5) In the above (1), preferably, a capacitance or a Zener diode for noise absorption is connected on the metal substrate, and the capacitance or the Zener diode is the IC regulator for voltage control. It is made to be connected between a terminal for transmitting / receiving an electric signal to / from the vehicle control device and GND.

  According to the present invention, the number of parts can be reduced and the size can be reduced, and connection to a water cooling bracket directly or via a support column is possible.

It is a control circuit diagram of the charging system in the alternating current generator for vehicles by one Embodiment of this invention. It is a control circuit diagram of the charging system in the alternating current generator for vehicles by one Embodiment of this invention. 1 is a longitudinal sectional view of a vehicle AC generator according to an embodiment of the present invention. 1 is a structural diagram in a state in which a rear cover of a vehicle AC generator according to an embodiment of the present invention is removed. FIG. It is explanatory drawing of the flow direction of the cooling water of the alternating current generator for vehicles by one Embodiment of this invention. It is a top view which shows the mounting structure of the IC regulator for voltage control used for the alternating current generator for vehicles by one Embodiment of this invention. It is VV sectional drawing of FIG. It is a perspective view which shows the mounting structure of the IC regulator for voltage control used for the alternating current generator for vehicles by one Embodiment of this invention. It is a perspective view which shows the mounting structure of the IC regulator for voltage control used for the alternating current generator for vehicles by one Embodiment of this invention. It is explanatory drawing about the thermal resistance measurement result in the control apparatus of the alternating current generator for vehicles by one Embodiment of this invention. It is a circuit diagram which shows the modification of the control apparatus of the alternating current generator for vehicles by one Embodiment of this invention. It is a circuit diagram which shows the modification of the control apparatus of the alternating current generator for vehicles by one Embodiment of this invention. It is a perspective view which shows the modification of the mounting structure of the control apparatus of the alternating current generator for vehicles by one Embodiment of this invention. It is a perspective view which shows the modification of the mounting structure of the control apparatus of the alternating current generator for vehicles by one Embodiment of this invention. It is a perspective view which shows the modification of the package of the control apparatus of the alternating current generator for vehicles by one Embodiment of this invention. It is a perspective view which shows the modification of the package of the control apparatus of the alternating current generator for vehicles by one Embodiment of this invention. It is a control circuit diagram which shows the charge system of the conventional automotive generator. It is a structural diagram of a mounting example of a conventional automotive generator.

Hereinafter, the configuration of a control device for an automotive alternator according to an embodiment of the present invention will be described with reference to FIGS.
First, the configuration of the control circuit of the charging system in the vehicle alternator according to the present embodiment will be described with reference to FIGS. 1 and 2.
1 and 2 are control circuit diagrams of a charging system in an automotive alternator according to an embodiment of the present invention.

  In FIG. 1, the three-phase armature windings 11 are delta-connected. The armature winding 11 is connected to a full-wave rectifying diode 12. The full-wave rectifying diode 12 is composed of six power Zener diodes 121, 122, 123, 124, 125, 126 connected as shown. The generated power generated in the armature winding 11 is full-wave rectified by the full-wave rectifying diode 12.

  The rectified generated power is stored in the battery 16. The voltage of the battery 16 is supplied to the electric load 18 on the vehicle side via the load switch 17.

  The voltage control IC regulator 30 has a one-chip IC regulator 14. As illustrated in FIG. 2, the one-chip IC regulator 14 includes a power MOS transistor 141, a flywheel diode 142, and a voltage control unit 1450. Since the one-chip IC regulator 14 is composed of a dielectric isolation type semiconductor, the power element unit and the control unit are mounted on one semiconductor substrate. The voltage control IC regulator 30 controls the current flowing through the field winding 13. By controlling the current flowing through the field winding 13, the generated power generated in the armature winding 11 can be varied. The voltage control IC regulator 30 controls the current flowing through the field winding 13 in accordance with a control command from the vehicle-side control device (ECU unit) 60.

  As the one-chip IC regulator 14, in addition to the dielectric isolation type semiconductor, a bipolar + C-MOS + D-MOS integrated integrated circuit can be used.

  In FIG. 1, reference numeral 19 denotes a noise prevention film capacitor.

Next, the configuration of the vehicle alternator according to the present embodiment will be described with reference to FIGS.
FIG. 3 is a vertical cross-sectional view of a vehicle AC generator according to an embodiment of the present invention. FIG. 4 is a structural diagram of the vehicle alternator according to the embodiment of the present invention with the rear cover removed. FIG. 5 is an explanatory diagram of the flow direction of the cooling water of the vehicle alternator according to the embodiment of the present invention.

  As shown in FIG. 3, a rotor core 13a is fixed to the shaft SF. The rotor core 13a is composed of a pair of claw-shaped magnetic poles. The claw portions are arranged so as to face each other and be arranged alternately. A field winding 13 is wound around the rotor core 13a. The rotor iron core 13a and the field winding 13 constitute a rotor. The rotor is rotatably supported by the center bracket 72 and the front bracket 74 by bearings. The center bracket 72 and the front bracket 74 are manufactured by aluminum die casting.

  A stator core 11 a is fixed to the inner peripheral side of the center bracket 72. An armature winding 11 is wound around the stator core 11a. The inner peripheral side of the stator core 11a is opposed to the outer peripheral side of the rotor through a slight gap.

  A passage (pocket) 72 a is formed in the center bracket 72. The end of the passage 72a is sealed by the rear bracket 71, and forms a passage for cooling water. FIG. 5 shows a path through which the cooling water sealed inside the center bracket 72 with the rear bracket flows.

  A brush is held in the IC case 52. Further, as will be described later with reference to FIG. 9, the voltage control IC regulator 30 shown in FIG. 1 is attached and fixed to the IC case 52. The substrate of this voltage control IC regulator is connected to the rear bracket 71 via a support column 70. The rear bracket 71 is made of aluminum die cast and is made of a heat conductive member. The support column 70 is formed integrally with the rear bracket 71 by aluminum die casting. The support column 70 supports the substrate of the voltage control IC regulator and radiates heat generated by the voltage control IC regulator to the cooling water flowing through the center bracket 72 via the support column 70 and the rear bracket 71. The outside of the IC case 52 is covered with a rear cover 75. The rear cover 75 is attached to the rear bracket 71. In addition to the brush, the full-wave rectifying diode 12 shown in FIG. 1 is also arranged in the space between the rear cover 75 and the rear bracket 71, so that water droplets and the like are not attached to these elements by the rear cover 75. It is waterproof.

  As shown in FIG. 4, a rear bracket 71 is attached to the center bracket 72. An IC case 52 is attached to the rear bracket 71. Further, the full-wave rectifying diode 12 shown in FIG. 1 is also attached to the rear bracket 71.

  The center bracket 72 is provided with pipes serving as cooling water inlets and outlets. Then, as shown in FIG. 5, the cooling water flows into the center bracket 72 from the inlet pipe and flows out from the outlet pipe.

  Next, the operation of the vehicle alternator and the vehicle alternator control device of the present embodiment described with reference to FIGS. 1 to 5 will be described.

  As shown in FIG. 3, the field winding 13 is mounted on the rotor 13a and rotates in synchronization with the rotation of the engine to generate a rotating magnetic field. The flywheel diode 142 shown in FIG. 2 is connected in parallel to the field winding 13 and is connected to absorb switching noise.

  The armature winding 11 wound around the fixed iron core 11a facing the rotor with a gap shown in FIG. 3 has an AC waveform according to the magnitude of the rotating magnetic field generated by the field winding 13. Output voltage. This AC output is full-wave rectified by rectifying power Zener diodes 121, 122, 123, 124, 125, 126 constituting the three-phase full-wave rectifier 12.

  The current flowing through the field winding 13 is controlled by the voltage control IC regulator 30 to control the generator output voltage to a constant voltage. The voltage control IC regulator 30 has a one-chip IC regulator 14. The one-chip IC regulator 14 has a configuration as shown in FIG. 2, and the voltage control unit 1450 of the one-chip IC regulator 14 controls the power MOS transistor 141 that performs voltage control.

  The battery 16 is charged with the output voltage controlled by the voltage control IC regulator 30. At the same time, the output of the three-phase full-wave rectifier 12 is supplied to an electric load 18 such as a lamp via a load switch 17.

  The ECU 60, which is a control unit on the vehicle side, detects the state of the vehicle, transmits an optimal adjustment voltage command value to the one-chip IC regulator 14, and the adjustment voltage value is changed. The one-chip IC regulator 14 controls the power MOS transistor 141 to change the field current conduction ratio to the field winding 13 to change the magnitude of the rotating magnetic field. As a result, the adjustment voltage value is It is controlled to an adjustment voltage value commanded by the ECU unit 60 which is a control unit on the vehicle side.

Next, the mounting structure of the voltage control IC regulator used in the vehicle alternator according to the present embodiment will be described with reference to FIGS.
FIG. 6 is a plan view showing a mounting structure of the voltage control IC regulator used in the vehicle alternator according to the embodiment of the present invention. 7 is a cross-sectional view taken along the line VV in FIG. 8 and 9 are perspective views showing the mounting structure of the voltage control IC regulator used in the vehicle alternator according to the embodiment of the present invention.

  The one-chip IC regulator 14 shown in FIG. 6 is obtained by mounting a power element unit and a control unit, which is a small signal system, on a single semiconductor substrate using a dielectric isolation type semiconductor. As shown in FIG. 7, the one-chip IC regulator 14 is fixed to a heat sink 146 using copper, which is an inexpensive material, with high-temperature solder 160. An electrically conductive adhesive such as silver paste can be used instead of the high temperature solder.

  As shown in FIG. 7, the one-chip IC regulator 14 and the heat sink 146 are sealed with a resin sealing package 147. The heat sink 146 has a structure that protrudes and is exposed on the bottom surface of the resin-sealed package 147.

  The resin-encapsulated package 147 is a semiconductor device of a dual in-line method (surface mounting structure in which lead frames 154 are arranged in two opposite directions). That is, a plurality of lead frames (lead terminals) 154 are molded and protruded from opposite surfaces of the resin-sealed package 147. The lead frame 154 is connected to the one-chip IC regulator 14 by a bonding wire 152 inside the resin-sealed package 147. The lead frame 154 is made of a copper material, and the surface of the lead frame 154 is plated in consideration of solderability, and the material of the plating process is Sn plating or Sn plating alloy (including Bi or the like). ) Or solder plating is used. The lead frame 154 corresponds to the terminals COM, F, B, and P (FIG. 1) of the one-chip IC regulator 14 for all or a part thereof.

  The heat sink 146 and the lead frame 154 are fixed to the surface of the metal substrate 148 made of an aluminum material by a low temperature solder 162. In addition, as shown in FIG. 6, the metal substrate 148 is previously provided with two fixing holes 148A and 148B that are both positioned and fixed by pressing.

  Note that the heat sink 146 and the lead frame 154 are joined to the metal substrate 148 with the low temperature solder 162, so that the high temperature solder 160 having a higher melting point is not adversely affected by the heat in the joining process.

  In order to form a circuit on the surface of the insulating layer 172, the metal substrate 148 is formed by attaching an epoxy resin or a polyimide resin as the insulating layer 172 to the surface of the base aluminum plate 170 (thickness: 1 mm to 5 mm). A copper foil 174 is attached. Heat generated from the one-chip IC regulator 14 is conducted to the metal substrate 148 through the heat sink 146. Here, as described above, the metal substrate 148 has a structure in which the aluminum plate 170, the insulating layer 172, and the copper foil 174 are laminated. However, since the insulating layer 172 is thin, the heat from the heat sink 146 is reduced to copper. It is conducted to the aluminum plate 170 through the foil 174 and the insulating layer 172.

  Each lead frame 154 of the resin-encapsulated package 147 is bonded to a predetermined position in the pattern of the copper foil 174 by the low temperature solder 162.

  In this embodiment, an aluminum material is used as a base material, but a copper material or an iron material can be applied to the structure.

  As described above, the voltage control IC regulator 30 has a configuration in which the one-chip IC regulator 14 sealed with resin is bonded to the metal substrate.

  As shown in FIG. 6, a plurality of welding pads 149 are fixed to the surface of the metal substrate 148 with low-temperature solder 162. As shown in FIG. 8, each welding pad 149 is connected to a plurality of formed nickel wires 54 by welding. Each nickel wire 54 is electrically connected to the IC case 52. The IC case 52 is integrally formed with a brush holder BH for holding the noise preventing film capacitor 19 shown in FIG. 1 and holding the brush BS. The IC case 52 is also provided with a connector CT for electrically connecting to the outside.

  Further, as shown in FIG. 9, the IC case 52 and the voltage control IC regulator 30 are combined with each nickel wire 54, and are fixed to a support column 70 provided integrally with the rear bracket 71 by a fastening member 73. The fastening member 73 is, for example, a bolt, and a female screw is formed inside the support column 70. As the cooling water circulates between the rear bracket 71 and the center bracket 72, the heat generated by the voltage control IC regulator 30 is dissipated into the cooling water via the support column 70.

  Further, as shown in FIG. 6, the ESD noise removing capacitor 20 described in FIG. 11 or the Zener diode 22 described in FIG. 12 is mounted on the surface of the metal substrate 148.

  A water-cooled AC generator is an AC generator itself that is cooled by cooling water even when the cooling air has exceeded the limit value inside the engine room, which has been heated up due to high density inside the engine room. Cool down. However, the temperature of the cooling water is usually around 90 ° C, but if the pressure inside the radiator rises, it may become 110-120 ° C. Therefore, the thermal resistance Rth needs to be lowered by improving the mounting structure.

Next, the thermal resistance measurement result in the vehicle alternator control apparatus according to the present embodiment will be described with reference to FIG.
FIG. 10 is an explanatory diagram of the thermal resistance measurement result in the control device for the vehicle alternator according to the embodiment of the present invention.

  In FIG. 10, the thermal resistance measurement result in the case where the heat generated by the voltage control IC regulator 30 is diffused into the cooling water via the support column 70 is shown in comparison with the conventional structure. As a measurement condition, in the conventional structure, the heat resistance saturation point when the power consumption of 6.5 W is consumed for each of the ceramic substrates 144 using the heat dissipation plate 53 shown in FIG. 18 is measured. ing.

Here, the thermal resistance Rth is a function of power consumption and temperature when a certain amount of power is consumed in the power MOS transistor 141, which is a heating element, and is usually expressed by the following equation (1).

Junction temperature Tj = Ta (° C.) + Rth (° C./W)×P (W) (1)

Here, Ta: ambient temperature, Rth: thermal resistance, P: power consumption.

  Usually, it is necessary to use the semiconductor at an allowable operating temperature of 150 ° C. or lower. On the other hand, in the measurement results shown in FIG. 10, the thermal resistance of the conventional structure is 2.5 ° C./W in the case of this embodiment with respect to 4.6 ° C./W, and the thermal resistance is reduced by about 45%. I was able to.

  This means that, assuming that the voltage control IC regulator 30 consumes 5 W, the maximum junction temperature of the semiconductor can be kept as low as 2.1 × 5 = 10.5 ° C. compared to the conventional structure. However, the structure of this embodiment makes it possible to radiate the heat generated from the semiconductor more efficiently.

  For this reason, in this embodiment, since the copper material having good thermal conductivity is inexpensive, it can be used in a larger area as the heat sink 146, and the heat of the heat sink 146 has excellent thermal conductivity. Since heat is radiated to the metal substrate 148, the thermal resistance can be reduced to about half that of the conventional product.

  In this embodiment, in order to ensure the reliability with respect to the temperature change, the linear expansion coefficient of each component is as follows. That is, the linear expansion coefficient of silicon as the material of the one-chip IC regulator 14 is about 3.5 ppm, whereas the linear expansion coefficient of the copper material that is the material of the heat sink 146 is 17 ppm. In addition, a resin-sealed package 147 that is sealed with a resin having a linear expansion coefficient of about 11 ppm is employed.

  This resin-encapsulated package 147 is a dual in-line type package, and since the electrical connection terminal is made of copper, the linear expansion coefficient of the aluminum material that is the base material of the metal substrate 148 is 23 ppm and the linear expansion difference is different. With the structure of this embodiment, the structure of this embodiment can withstand the mounting in the engine room, which is an environment where the temperature changes rapidly, while using a copper material as the material of the heat sink 146.

Next, a modified example of the control device for the vehicle alternator according to the present embodiment will be described with reference to FIGS. 11 and 12.
FIGS. 11 and 12 are circuit diagrams showing modifications of the control device for the vehicle alternator according to the embodiment of the present invention. The same reference numerals as those in FIG. 1 indicate the same parts.

  In this embodiment, by using the metal substrate 148, it is not easy to mount on the one-chip IC regulator 14, and a capacitance for EMI countermeasure or a Zener diode for surge absorption is mounted on the metal substrate. Is possible.

  FIG. 11 is an example in which a capacitor 20 for removing ESD noise due to static electricity or the like is mounted between a Com terminal that transmits and receives a signal to and from the ECU unit 60 that is a control unit on the vehicle side, and GND.

  FIG. 12 similarly shows an example in which a Zener diode 22 is mounted in order to protect the terminal of the Com terminal portion from a positive surge or a negative surge from the outside.

  In this way, for the products that reduce the number of parts and reduce the size by integrating the power system and the small signal semiconductor with one semiconductor, which is a characteristic of the one-chip IC regulator, it is inevitably more environmental. It has the advantage that it can meet various customer needs such as when you want to use it in a severe vehicle.

Next, a modified example of the mounting structure of the control device for a vehicle alternator according to the present embodiment will be described with reference to FIGS. 13 and 14.
FIGS. 13 and 14 are perspective views showing modifications of the mounting structure of the control device for a vehicle alternator according to the embodiment of the present invention. The same reference numerals as those in FIGS. 8 and 9 indicate the same parts.

  In this embodiment, the conventional IC case 52 is a mounting structure that can be diverted. The reason will be described below.

  First, an assembling method with the conventional IC case 52 will be described with reference to FIGS. In the case of a water-cooled AC generator with a conventional structure, the structure is such that the heat dissipating fins 53 in the structure of FIG. 18 are deleted. That is, as shown in FIG. 14, the IC regulator 30 b, the IC case 52, and the heat radiating plate 50 are combined, fixed to the support pillar 70 provided on the rear bracket 71, and radiated from the support pillar 70.

  As shown in FIG. 13, the electrical connection with the IC case 52 is made by arranging welding pads for welding joining on both sides of the ceramic substrate, and the welding pads are fixed to the ceramic substrate by soldering. The formed nickel wire 54 is welded, then the other end of the nickel wire 54 is set on each terminal portion on the IC case 52, and each terminal of the IC case 52 and the nickel wire 54 are welded and joined. The In order to make the material of this welding pad close to the linear expansion coefficient (about 6.5 ppm) of the ceramic substrate 144, 42 alloy material which is an iron-nickel alloy was used (the linear expansion coefficient of 42 alloy was about 5 ppm). .

  In the conventional assembly structure, the heat radiating plate 50, the IC regulator 30b, and the IC case 52 are fixed by a heat conductive adhesive (not shown), and heat generated from the IC regulator 30b is transferred from the heat radiating plate 50 to the support pillar 70. Since it is the structure which transmits to the cooling water which circulates in the inside of the center bracket 72 via, the operation | work which apply | coats a heat conductive adhesive, and the process of heat-hardening were required.

  Next, the case of this embodiment will be described. In the present embodiment, the metal substrate 148 is used instead of the ceramic substrate 144, and the pattern formed on the insulating layer of the metal substrate 148 is a copper foil. Therefore, the material of the welding pad 149 in FIG. By using a material (linear expansion coefficient of about 13 ppm) or a nickel and iron alloy cypro nickel material (linear expansion coefficient of about 13 ppm), the difference in coefficient of linear expansion from copper foil is reduced and thermal cycle performance is improved. Therefore, it is not necessary to use the ceramic substrate 144 having the conventional structure.

  Further, as shown in FIG. 8, since the metal substrate 148 has the function of the heat radiating plate 50, not only the heat conductive adhesive is unnecessary, but also the heat resistance can be reduced, and further, the metal substrate 148 can be pressed. By providing two positioning holes, positioning with the IC case 52 is facilitated. In order to facilitate the positioning work, after the formed nickel wire 54 is welded to each welding pad 149, the other end of each nickel wire 54 is welded to each terminal portion on the IC case 52 to improve the positional accuracy. Workability is improved.

  As shown in FIG. 9, the voltage control IC regulator 30 provided with mounting holes in the IC case 52 and the metal substrate 148 is fixed to the support pillars 70 by the respective fastening members 73, thereby generating heat from the one-chip IC regulator 14. Heat can be efficiently radiated to the cooling water from the support column 70 via the rear bracket 71 via the metal substrate 148.

Next, a modification of the package of the control device for a vehicle alternator according to the present embodiment will be described with reference to FIGS. 15 and 16.
FIG.15 and FIG.16 is a perspective view which shows the modification of the package of the control apparatus of the alternating current generator for vehicles by one Embodiment of this invention. The same reference numerals as those in FIG. 6 denote the same parts.

  In the present embodiment, an example in which a dual inline type package is used as the resin sealed package 147 has been described. However, not only the dual inline type shown in FIG. 13 but also a single inline type resin sealed package has the same effect. Can be obtained.

  FIG. 15 is an example of mounting in the case of a single-in-line type 8-pin voltage control IC regulator 30A, and FIG. 16 is an example of mounting in the case of a single-line type 5-pin voltage control IC regulator 30B. Application is possible only by changing the layout of the electrical wiring of the metal substrate 148.

  As described above, in this embodiment, the power system and the small signal semiconductor have a single-chip semiconductor configuration, and are mounted on a highly versatile resin-sealed power package. By soldering to the board, the thermal expansion difference between each member can be relaxed, and the structure that is fixed to the water cooling bracket via the support pillar can efficiently cool the heat generated by the 1-chip IC regulator. As an AC generator for a vehicle, a highly reliable product that is resistant to temperature changes in the engine room of the vehicle can be configured with a small number of parts and at a low cost. In addition, the shape of the external appearance of the metal substrate can be freely determined by pressing, and the positioning shape is simple and can be manufactured at low cost. As a result, a highly reliable product that is resistant to temperature changes in the engine room of the vehicle can be constructed at low cost as an AC generator for a vehicle.

  In addition, by mounting on a metal substrate, an electrostatic component for EMI countermeasures or an inductor or surge absorbing Zener diode, which is an electronic component that is considered inappropriate to be mounted inside a one-chip IC, etc. It can be mounted on a metal substrate.

  In addition, because the current IC case can be diverted, there is no need for a mold fee for creating a new IC case, and because it can be installed in the same way as the current product, it is easy to obtain mass production effects and AC power generation for vehicles The machine can be configured at low cost while improving safety and reliability.

DESCRIPTION OF SYMBOLS 11 ... Armature winding 12 ... Rectifier 13 ... Field winding 14 ... 1-chip IC regulator 16 ... Main battery 30 ... Voltage regulator IC regulator 50 ... Radiation plate 52 ... IC case 53 ... Radiation fin 54 ... Nickel wire 70 ... Support pillar 71 ... Rear bracket 72 ... Center bracket 73 ... Fastening member 74 ... Front bracket 141 ... Power MOS transistor 146 ... Heat sink 147 ... Resin sealing package 148 ... Metal substrate 149 ... Welding pad

Claims (5)

A rotor having a field winding wound thereon, a stator having an armature winding wound thereon, a bracket composed of the rotor and a heat conductive member holding the stator, and the bracket Used in an AC generator for a vehicle having a coolant flow path provided inside and having a coolant flow path for flowing the coolant and transmitting heat generated by the armature winding to the outside;
A voltage control IC regulator unit that controls a voltage induced in the armature winding by adjusting a current flowing in the field winding, and a metal substrate that is in thermal contact with the voltage control IC regulator unit A control device for an AC generator for a vehicle configured and having the metal substrate fixed to the bracket,
The voltage control IC regulator unit is a one-chip IC regulator in which a power semiconductor part for controlling a field current flowing in the field winding and a small signal semiconductor part for controlling a voltage are formed of one semiconductor,
The one-chip IC regulator is composed of a resin-sealed package bonded to a metal heat sink and sealed with resin,
The one-chip IC regulator constituted by the package is bonded to the metal substrate provided with an electric wiring part through an insulating layer, and heat generated in the voltage control IC regulator part is radiated from the metal substrate to the bracket. It is what
The vehicle AC generator, wherein the voltage control IC regulator section, the metal heat dissipation heat sink, and the metal substrate are stacked in this order on the bracket provided with the coolant flow path. Control device. The control apparatus for an AC generator for a vehicle according to claim 1,
Comprising a support post provided on the end face of the bracket;
The support column is configured with a convex shape from an end surface of the bracket,
The metal substrate is fixed in contact with the support pillar,
The control apparatus for an AC generator for a vehicle, wherein the metal substrate is made of a heat-conductive metal material. The control device for an AC generator for a vehicle according to claim 2,
The control apparatus for an AC generator for vehicles, wherein the metal substrate has a positioning hole for fixing to the support pillar. The control device for an AC generator for a vehicle according to claim 2,
The voltage control IC regulator unit is attached to an IC case connected to an external power source and the field winding,
The relay lead of the voltage control IC regulator part is connected to the metal substrate via a nickel or nickel-iron alloy welding pad,
A control apparatus for an AC generator for vehicles, wherein the IC case and the metal substrate are integrally fixed to the support column by the fastening member. The control apparatus for an AC generator for a vehicle according to claim 1,
On the metal substrate, a capacitance for absorbing noise or a Zener diode is connected,
The control device for an AC generator for vehicles, wherein the capacitance or the Zener diode is connected between a terminal for transmitting and receiving an electric signal with the vehicle control device of the voltage control IC regulator section and GND. .

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