JP5543647B2 - Support board for coreless buildup - Google Patents

Description

  The present invention relates to a coreless buildup support substrate used when a multilayer printed wiring board is manufactured by a coreless buildup method.

  In recent years, portable electronic devices are required to have smaller batteries for the purpose of weight reduction. Moreover, even if the battery is downsized, low power consumption is indispensable in order to maintain a conventional battery life in units of equipment. Therefore, it is required for active elements such as LSIs incorporated in electronic devices to ensure operation reliability under a low voltage. As a result of improving the operation reliability under low voltage while satisfying these requirements, the multilayer printed wiring board as an interposer that mounts LSI etc. can reduce the interlayer insulation thickness and further reduce weight An attempt is being made.

  Therefore, a method of using a multilayer flexible printed wiring board obtained by forming a wiring on a flexible copper-clad laminate and then multilayering it as an interposer has been studied. However, in the flexible multilayer printed wiring board, it is difficult to reduce the total thickness of the base film and the adhesive layer to the target minimum required insulating layer thickness. Therefore, a method for manufacturing a multilayer printed wiring board in recent years includes a manufacturing method using a coreless buildup method in which insulating resin layers and conductor layers made of only a polymer material are alternately stacked without using a so-called core substrate. It has been adopted.

  For example, in Patent Document 1, a manufacturing method capable of easily obtaining a wiring substrate that does not have a core substrate and in which dielectric layers and conductor layers made of a polymer material are alternately laminated, and the manufacturing method can be obtained thereby. A wiring board is disclosed. Specifically, a multilayer printed wiring board structure in which a metal foil adhesion body in which two metal foils are separably adhered to each other on a support substrate is laminated, and dielectrics and conductor layers are alternately formed on the exposed metal foil. (Build-up wiring layer) is formed, and finally cut at the position where the two metal foils overlap to be separated between the metal foils to obtain a multilayer printed wiring board. And according to embodiment, the example which uses a glass epoxy board | substrate is described, It is the technique which uses a rigid board | substrate for a support substrate.

  Patent Document 2 discloses a method of manufacturing a wiring board that forms a build-up wiring layer in a state where it can be peeled off from a temporary board, and can be manufactured reliably and at low cost without causing any problems. ing. Specifically, a base layer is arranged in the wiring formation region on the prepreg, a metal foil larger than the base layer is placed so as to be in contact with the outer periphery of the wiring formation region, and the temporary substrate is heated and pressed. Creating. Thereafter, a build-up wiring layer is formed on the metal foil on the temporary substrate, and a peripheral member of the base layer of the structure is cut to obtain a wiring member having the build-up wiring layer formed on the metal foil. Yes. And if the description of Claim 3 of patent document 2 is seen, it can be understood that it is a technique on the assumption that a prepreg obtained by impregnating a resin into a glass nonwoven fabric and a rigid substrate is used as a temporary substrate.

JP 2005-79107 A JP 2007-158174 A

  However, after adopting the manufacturing method using the coreless buildup method disclosed in Patent Document 1 and Patent Document 2, the buildup wiring layer is formed on the support substrate of Patent Document 1 or the temporary substrate of Patent Document 2. Both substrates cannot be taken out as a multilayer printed wiring board manufacturing laminate unless their substrate ends are cut. That is, in the production of printed wiring boards, it is not preferable in view of increasing the board yield efficiency that affects production yield and production efficiency. Further, the end material generated when the end portion of the substrate is cut cannot be recycled and reused, and the manufacturing method simply generates a large amount of waste.

  Here, the manufacturing process of the multilayer printed wiring board using the coreless buildup method described in Patent Document 2 will be described with reference to FIGS. As shown in FIG. 4A, on the surface of the insulating layer constituting material 4, a small copper foil 2S and a large copper foil 2L that is one size larger are arranged so as to cover the small copper foil 2S. And the laminated body shown in FIG.4 (b) is obtained by pressing. And the insulating layer 4 and the multilayer wiring circuit 6 are laminated | stacked on the large sized copper foil 2L by the buildup method, and it is set as the laminated body shown in FIG.5 (c). After that, the end portion is cut at the cutting line Cp shown in FIG. 5C, and the multilayer copper-clad shown in FIG. 5D is peeled off between the small copper foil 2S and the large copper foil 2L. The laminated plate 1 is obtained. Thereafter, the outer layer copper foil portion of the multilayer copper clad laminate 1 is etched to obtain a multilayer printed wiring board.

  As can be understood from the above, in the method of manufacturing a multilayer printed wiring board by the coreless buildup method, there is no need to increase raw material costs, and multilayer copper-clad for manufacturing a multilayer printed wiring board having a stable quality wiring layer is provided. In order to be able to manufacture a laminated board and prevent waste of resources, there has been a demand for a manufacturing method that generates less waste.

  Thus, as a result of earnest research, the inventors of the present invention have conceived that it is possible to produce a multilayer printed wiring board having a wiring layer with a stable and inexpensive quality by using the following coreless buildup support substrate. did.

The support substrate for coreless buildup used when manufacturing a multilayer printed wiring board by the coreless buildup method according to the present application is subjected to organic rust prevention treatment on the surface of the copper foil, and organic rust prevention treatment coating on the surface of the copper foil. A base copper foil comprising a base copper foil is obtained, and a surface of the base copper foil provided with an organic anti-rust treatment film is laminated with a semi-cured insulating layer constituent material, and the base copper foil and the insulating layer are provided. And

  In addition, the coreless buildup support substrate used when manufacturing the multilayer printed wiring board by the coreless buildup method according to the present application forms an inorganic rust prevention treatment layer on the surface of the copper foil, and the inorganic rust prevention of the copper foil. Using a base copper foil provided with an organic anti-rust treatment film on the surface of the treatment layer, a semi-cured insulating layer constituent material is laminated to the surface of the base copper foil provided with the organic anti-rust treatment film, and the copper foil It is characterized by having a layer structure of / inorganic rust preventive treatment layer / organic rust preventive treatment coat / insulating layer.

  The organic rust preventive coating used for the coreless buildup support substrate according to the present application is made of one or more organic rust inhibitors selected from nitrogen-containing organic compounds, sulfur-containing organic compounds, and carboxylic acids. It is preferable that it is formed using.

The organic rust-proofing coating at the support substrate for coreless buildup according to the present application, it is preferable mass conversion thickness is the thickness of ^{1mg / m 2 ~100mg / m 2} .

  In the support substrate for coreless buildup according to the present application, it is preferable that the adhesion strength when the base copper foil is peeled from the insulating layer is 1 gf / cm to 100 gf / cm.

  The coreless buildup support substrate according to the above-mentioned application is laminated with a release film having a size smaller than that of the base copper foil sandwiched between the organic anticorrosive coating and the insulating layer. It is also preferable.

  By using the support substrate for coreless buildup according to the present invention in the manufacture of a multilayer printed wiring board, when manufacturing a multilayer copper clad laminate by the buildup method, the insulating resin layer constituting the support substrate for coreless buildup It is not necessary to cut the edge of the substrate when performing the removal. As a result, when a multilayer copper clad laminate is manufactured by the build-up method using the support substrate for coreless build-up according to the present invention, the plate-making efficiency is increased, the production yield and the production efficiency are improved, and the amount of waste generated is small. Become.

It is a flowchart for demonstrating the process of multilayer printed wiring board manufacture by the coreless buildup method which concerns on this invention. It is a flowchart for demonstrating the process of multilayer printed wiring board manufacture by the coreless buildup method which concerns on this invention. It is a conceptual diagram for demonstrating the form of the support substrate for coreless buildup used in the process of multilayer printed wiring board manufacture by the coreless buildup method which concerns on this invention. It is a flowchart for demonstrating the process of multilayer printed wiring board manufacture by the conventional coreless buildup method. It is a flowchart for demonstrating the process of multilayer printed wiring board manufacture by the conventional coreless buildup method.

  Hereinafter, the form of the support substrate for coreless buildup according to the present invention will be described through a method for manufacturing a multilayer printed wiring board.

Production form of multilayer printed wiring board: The support substrate for coreless buildup according to the present invention is used in the production of a multilayer printed wiring board described below. Hereinafter, each step will be described.

Coreless buildup support substrate creation step: In this coreless buildup support substrate creation step, a base copper foil having an organic rust-proofing coating on the surface of the copper foil and an organic rust-proofing coating on the surface of the copper foil is used. . First, the production of this base copper foil will be described. That is, as shown in FIG. 1 (A), a copper foil 2 is prepared, and the surface of the copper foil 2 is subjected to an organic rust prevention treatment. As shown in FIG. 1 (B), the surface of the copper foil 2 is applied. A base copper foil 2 </ b> B provided with the organic antirust treatment coating 3 is obtained. In FIG. 1 (B), a form in which the organic rust-proofing coating 3 is provided on one side of the copper foil 2 is displayed, but the organic rust-proofing coating 3 is provided on both sides of the copper foil 2. I do not care.

  First, the copper foil referred to here will be described. The copper foil can be either an electrolytic copper foil produced by an electrolytic method or a rolled copper foil produced by a rolling method, and there is no limitation on the production method. Moreover, there is no special limitation regarding the thickness of the copper foil to be used. However, considering the ability to form a circuit when the layer formed of the copper foil is finally completely removed by etching or a fine fine pitch circuit is formed, it is preferable to use a thin copper foil. Further, it does not matter whether or not the surface of the copper foil is roughened, but the surface of the laminated copper foil with the insulating layer constituting material constitutes a coreless buildup support substrate. The adhesion strength at the time of separation at the interface between the resin layer and the copper foil layer is reduced, and separation is facilitated, which is preferable.

  This organic rust preventive coating 3 is formed by mixing one or more selected from nitrogen-containing organic compounds, sulfur-containing organic compounds and carboxylic acids that function as organic rust preventives. It is preferable that Hereinafter, each compound will be described.

  The nitrogen-containing organic compound as the organic rust preventive includes a nitrogen-containing organic compound having a substituent, and is referred to as 1,2,3-benzotriazole (hereinafter referred to as “BTA”) which is a triazole compound having a substituent. ), Carboxybenzotriazole, N ′, N′-bis (benzotriazolylmethyl) urea, 1H-1,2,4-triazole and 3-amino-1H-1,2,4-triazole, imidazole, etc. It is preferable.

  It is preferable to use mercaptobenzothiazole, thiocyanuric acid, 2-benzimidazolethiol and the like as the sulfur-containing organic compound as the organic rust preventive.

  As the carboxylic acid as the organic rust preventive, it is particularly preferable to use a monocarboxylic acid, and it is particularly preferable to use oleic acid, linoleic acid, linolenic acid, or the like.

  Using the organic rust preventive agent described above, an organic rust preventive film is formed on the surface of the copper foil. At this time, the organic rust-proofing film is formed by dissolving the above-mentioned organic rust-preventing agent in a solvent such as water or an organic solvent, and immersing the copper foil therein, or forming the organic rust-proofing film in the solution. Methods such as showering, spraying, and dropping can be used on the surface of the copper foil to be used, and there is no need to consider a particularly limited method as long as the solution and the surface of the copper foil can be sufficiently contacted.

  The concentration of the organic rust inhibitor in the solvent containing the organic rust inhibitor at this time is not particularly limited, and there is no problem even if the concentration is originally high or low. This is because the organic rust preventive agent is adsorbed to the copper oxide on the surface of the copper foil, which is a metal, and from the adsorbed state, the bonds such as oxygen existing on the surface layer are considered, considering the principle of forming the organic rust preventive coating. As a result, the organic rust preventive agent is stably present. That is, it is because it is thought that the monomolecular film of the organic rust preventive agent should cover the copper foil surface as a minimum.

  However, it is natural that the higher the concentration of the organic rust inhibitor in the solvent, the higher the rate at which the organic rust inhibitor is adsorbed on the copper foil surface, and the organic rust treatment film is formed on the copper foil surface here. When considering the speed of the continuous production line (contact time: 5 seconds to 60 seconds), the concentration of the organic rust inhibitor in the solvent is 0.01 g / l to 10 g / l, and the liquid temperature is 20 ° C. to 60 ° C. It is preferable to adopt the range.

  Here, when the organic rust inhibitor concentration is less than 0.01 g / l, it is difficult to adsorb the organic rust inhibitor to the copper foil surface in a short time, and the organic rust preventive coating film to be formed The thickness varies, and the peeling stability at the interface between the insulating layer after pressing (the layer in which the insulating layer constituent material is cured) and the organic anticorrosive coating becomes unstable. On the other hand, even if the organic rust inhibitor concentration exceeds 10 g / l, the adsorption rate of the organic rust inhibitor on the copper foil surface is not particularly increased, which is not preferable from the viewpoint of production cost.

  By using the rust preventive agent described above, it is easy to control the amount of adsorption in the sense of controlling the thickness of the organic rust preventive coating, and the adhesion strength between the insulating layer and the copper foil can be kept within a certain range. It becomes possible. As a result, the separation stability at the interface between the insulating layer (the layer in which the insulating layer constituent material is cured) and the organic rust preventive film is improved.

  Therefore, the thickness of the formed organic rust preventive film, in other words, the amount of the organic rust preventive agent present on the copper foil surface is important. That is, it is preferable that the thickness of the organic antirust treatment film on the surface of the copper foil is in the range of 1 nm to 1 μm. Within the thickness range of the organic rust-proof coating, it is possible to ensure an appropriate peeled state at the interface between the build-up laminated insulating layer (layer in which the insulating layer constituent material is cured) and the organic rust-proof coating. When the thickness of the organic rust preventive film is less than 1 nm, the thickness of the organic rust preventive film made of the organic rust preventive agent on the copper foil surface varies, and a uniform organic rust preventive film cannot be formed. On the other hand, even if the thickness of the organic rust-proof coating exceeds 1 μm, the peeled state at the interface between the insulating layer after build-up lamination (layer in which the insulating layer constituent material is cured) and the organic rust-proof coating It will not be better than that.

The thickness of this organic rust preventive film is very thin at the nm to μm level. Therefore, it is desirable to select and use an appropriate analysis method according to the type of organic rust preventive used for the measurement of the thickness. However, it is preferable to use a transmission electron microscope (TEM) or a chemical quantitative analysis method. In chemical quantitative analysis, the organic rust inhibitor present on the copper foil surface is dissolved in a predetermined solvent selected according to the type of organic rust inhibitor, and the solvent is quantitatively analyzed using liquid chromatography. Etc. It is also possible to convert the film thickness by the calibration curve method by combining the observation using this transmission electron microscope and the chemical quantitative analysis method. For example, when BTA is used as an organic rust preventive agent, the thickness of the organic rust preventive film by TEM observation using a sample prepared by FIB is in the range of 1 nm to 20 nm. mass thickness of the analysis in terms organic rust-proofing coating ^is correlated as in the range of ^{1mg / m 2 ~100mg / m 2} .

  The organic rust preventive film described above is sufficient if it exists on the outermost surface of the copper foil. Therefore, an inorganic rust-proofing layer such as zinc or zinc alloy may be formed on the surface of the copper foil, and an organic rust-proofing film may be provided on the surface. The combined use of an inorganic rust-proofing layer and an organic rust-proofing coating dramatically improves the oxidation resistance performance of the copper foil surface and improves long-term storage performance, while at the same time being resistant to various chemicals used when forming build-up wiring layers. It is preferable because chemical performance is improved.

  Then, as shown in FIG. 1 (C), the coreless buildup support substrate is prepared by laminating the surface of the base copper foil 2B with the organic rust-proofing coating 3 on the insulating layer constituting material 4, and the base copper foil. A support substrate 5 for coreless buildup composed of 2B and the insulating layer 4 is obtained. There is no particular limitation on the bonding here, and it is possible to adopt normal manufacturing conditions for a copper-clad laminate depending on the type of insulating layer constituent material used. In addition, in this specification and drawing, it is the same in drawing, without distinguishing clearly the insulating layer constituent material of a semi-hardened state, and the insulating layer (layer which the insulating layer constituent material hardened | cured) after hardening by heating. (4) is used.

  Moreover, in this FIG.1 (C), the case where the surface provided with the organic rustproofing coating 3 of the base copper foil 2B is stuck on the single side | surface side of the insulating layer structural material 4 is published. However, using two base copper foils 2B, both surfaces of the insulating layer constituting material 4 are bonded to both surfaces of the base copper foil 2B provided with the organic rust-proofing coating 3 to both surfaces of the coreless buildup support substrate 5. It is also possible to manufacture a support substrate with a double-sided buildup wiring layer by providing the base copper foil 2B and forming buildup wiring layers on both sides.

  And in this support substrate preparation process, it bonds together in the state which pinched | released the release film 11 between the surface provided with the organic rust prevention coating 3 of the said base copper foil 2B, and the insulating layer structural material 4, and the said base copper foil 2B It is also preferable to obtain a coreless buildup support substrate 5 ′ composed of: / release film 11 / insulating layer 4. For example, as shown in FIG. 3 (i), a release film 11 having a size slightly smaller than the size of the base copper foil 2B is disposed on the surface of the insulating layer constituting material 4, and insulation is provided thereon. A base copper foil 2B having the same size as that of the layer constituent material 4 is placed on top of each other and pressed to obtain a laminate shown in FIG. 3 (ii). This laminated body is not bonded at all in the central portion where the release film 11 is disposed. However, in the edge part where the release film 11 does not exist, the base copper foil 2B and the insulating layer 4 are temporarily in close contact with each other. The coreless buildup support substrate 5 'shown in FIG. 3 (ii) can also be used in the same manner as the coreless buildup support substrate 5 shown in FIG. 1C. In addition, since the said release film 11 is recyclable, it is preferable also from a viewpoint of effective utilization of resources and environmental protection.

Build-up wiring layer forming step: In this step, build-up wiring in which insulating layers 4 and wiring layers including inner layer circuits 6 are alternately stacked on the surface of the base copper foil 2B of the support substrate 5 for coreless build-up. The layer 10 is formed, and the support substrate 20 with a buildup wiring layer shown in FIG. The build-up method used in the present invention is not particularly limited, but a typical one will be described as an example. For example, a method of providing a layer of the insulating layer constituent material 4 by a method of laminating a resin film on the surface of the base copper foil 2B of the coreless buildup support substrate 5 or a method of applying a resin composition is adopted. I can do it. When a resin film is used as the insulating layer constituting material 4, a metal foil typified by a copper foil is simultaneously bonded to the surface of the resin film by press working, and thereafter, interlayer conduction means 7 such as via holes as necessary. In combination with the formation, the metal foil is etched to form the inner layer circuit 6. Alternatively, only the resin film can be bonded to the surface of the base copper foil 2B of the coreless buildup support substrate 5, and the pattern of the inner circuit 6 can be formed on the surface by a semi-additive method.

  Moreover, when forming the layer of the insulating layer constituting material 4 by a technique of applying a resin composition, the resin composition is applied to the surface of the base copper foil 2B of the support substrate 5 for coreless buildup, dried, After curing and polishing, drilling is performed at a desired position of the cured resin layer in order to form interlayer conduction means 7 such as via holes as necessary. After that, the conductive paste is filled in the hole of the perforated part, the conductor post is inserted and arranged in the hole, and then the circuit shape is formed with the conductive paste on the surface of the cured resin layer, or semi-additive For example, the inner layer circuit 6 may be directly formed by a method.

  By repeating the formation operation of the build-up wiring layer by the method described above as many times as necessary, the support substrate 20 with the build-up wiring layer exemplarily shown in FIG. 2D is obtained. At this stage, a solder resist 9 can be applied to the outer layer surface including the outer layer circuit 8 as necessary.

  In the initial stage of forming the build-up wiring layer, the surface of the base copper foil 2B constituting the coreless build-up support substrate 5 is covered with a plating resist or the like except for the part where the circuit is formed. It is also possible to use an outer layer circuit pattern made of gold, tin, nickel or the like in advance at the site where the circuit is formed. By doing in this way, the support substrate with a build-up wiring layer in which the outer layer circuit shape on the one surface side is already incorporated is obtained.

Support substrate separation step with buildup wiring layer: In this step, the support substrate 20 with buildup wiring layer is separated at the interface between the base copper foil 2B and the insulating layer 4 of the support substrate 5 for coreless buildup, A multilayer copper-clad laminate 1 shown in FIG. In addition, the multilayer copper clad laminated board 1 said here says the laminated body of the state in which the buildup wiring layer 10 and the base copper foil 2B of the support substrate 5 for coreless buildup were closely_contact | adhered. At this time, the separation of the coreless buildup support substrate 5 at the interface between the base copper foil 2B and the insulating layer 4 can be performed by peeling off the base copper foil 2B. This is possible.

  When the coreless buildup support substrate 5 ′ shown in FIG. 3 (ii) is used, the base copper foil 2B and the insulating layer 4 of the coreless buildup support substrate 5 of the support substrate 20 with the buildup wiring layer are provided. Since the separation work at the interface is only in the edge region of the support substrate 20 with the build-up wiring layer, the separation work is facilitated, which is preferable.

  The adhesion strength at the interface between the base copper foil 2B and the insulating layer 4 of the coreless buildup support substrate 5 is a value measured in accordance with JIS C6481 in the range of 1 gf / cm to 100 gf / cm. Preferably there is. The lower the adhesion strength, the easier the separation work. However, during this adhesion strength build-up stacking, there is a case where a deviation due to the press pressure may occur at the interface between the base copper foil 2B and the insulating layer 4 of the support substrate 5 for coreless build-up. It may disappear. On the other hand, when the adhesion strength exceeds 100 gf / cm, when the size of the multilayer copper-clad laminate 1 is increased, the separation at the interface between the base copper foil 2B and the insulating layer 4 of the support substrate 5 for coreless buildup is performed. The work becomes difficult and it is no longer an image that can be easily separated.

Multilayer printed wiring board forming step: This step is performed by using the multilayer copper clad laminate 1 after separation at the interface between the base copper foil 2B and the insulating layer 4 of the support substrate 5 for coreless buildup, and using the multilayer copper clad laminate 1 This is a process for processing a wiring board.

  If an example of the processing method from a multilayer copper clad laminated board to a multilayer printed wiring board said here is given, for example in the case of the multilayer copper clad laminated board 1 shown in FIG.2 (E), the copper foil layer in the outer layer 2 can be etched to form outer layer circuit wiring to obtain a multilayer printed wiring board. In the case of the multilayer copper clad laminate 1 shown in FIG. 2 (E), the copper foil layer 2 on the outer layer can be completely removed by etching and used as it is as a multilayer printed wiring board. . Further, the copper foil layer 2 on the outer layer of the multilayer copper clad laminate 1 shown in FIG. 2 (E) is completely removed by etching, and a circuit shape is formed with a conductive paste on the surface of the exposed resin layer. It is also possible to form a multilayer printed wiring board by directly forming an outer layer circuit by a semi-additive method or the like. Those skilled in the art can easily think about these steps, and thus the description using the drawings is omitted.

  By using the manufacturing method of the multilayer printed wiring board by the coreless buildup method according to the present invention described above, it is not necessary to cut the edge of the substrate after the press working. As a result, the boarding efficiency of the multilayer printed wiring board is increased, the production yield is improved, the production efficiency is improved, and the amount of waste generated is reduced.

Form of multilayer printed wiring board according to the present invention: The multilayer printed wiring board according to the present invention is obtained by using the above-described method for producing a multilayer printed wiring board according to the present invention. The multilayer printed wiring board here is not particularly limited with respect to the thickness of the insulating layer, the thickness of the copper foil used, the number of these layers, and the like. It is naturally possible to provide interlayer conduction means such as via holes in the layers of the multilayer printed wiring board.

  The multilayer printed wiring board according to the present invention is obtained by using a multilayer copper-clad laminate produced by the coreless buildup method described above. This multilayer copper-clad laminate does not require cutting of the substrate end when separating from the coreless buildup support substrate. Therefore, at the stage of processing from this multilayer copper-clad laminate to a multilayer printed wiring board, there is no surface adhesion of foreign matter that obstructs the etching process, such as metal pieces and resin pieces, generated when the substrate edge is cut. As a result, the circuit formability by etching for circuit formation is excellent, the etching yield is improved, and a high quality multilayer printed wiring board can be obtained.

  When the multilayer printed wiring board manufacturing method according to the present invention is used, even if the multilayer printed wiring board is manufactured by the build-up method, the substrate end portion when removing the insulating resin layer constituting the coreless build-up support substrate No need for cutting. As a result, the boarding efficiency of the multilayer printed wiring board is increased, the production yield and the production efficiency are improved, and the amount of waste generated is reduced.

1 multilayer copper clad laminate 2 copper foil 2B base copper foil 2S copper foil (small size)
2L copper foil (large size)
DESCRIPTION OF SYMBOLS 3 Organic rust prevention coating 4 Insulation layer constituent material, insulating layer 5 Coreless buildup support substrate 6 Inner layer circuit 7 Interlayer conduction means 8 Outer layer circuit 9 Solder resist 10 Buildup wiring layer 11 Release film 20 Support with buildup wiring layer Substrate Cp cutting line

Claims (6)

A support substrate used when manufacturing a multilayer printed wiring board by a coreless buildup method,
The support substrate is provided with an organic rust-proofing treatment on the surface of the copper foil, obtaining a base copper foil having an organic rust-proofing coating on the surface of the copper foil, and a surface having the organic rust-proofing coating of the base copper foil On the other hand, a support substrate for coreless buildup, comprising a semi-cured insulating layer constituent material and a base copper foil and an insulating layer. A support substrate used when manufacturing a multilayer printed wiring board by a coreless buildup method,
The support substrate is provided with an inorganic rust-proofing layer on the surface of the copper foil, and a base copper foil provided with an organic rust-proofing film on the surface of the inorganic rust-proofing layer of the copper foil. It is characterized by having a layer structure of copper foil / inorganic rust preventive treatment layer / organic rust preventive treatment coat / insulating layer, in which a semi-cured insulating layer constituent material is bonded to the surface provided with the organic rust preventive treatment coat Support substrate for coreless buildup. The organic rust-preventing treatment film is formed using one or more organic rust preventive agents selected from nitrogen-containing organic compounds, sulfur-containing organic compounds, and carboxylic acids. Item 3. The coreless buildup support substrate according to Item 2. The organic rust-proofing coating, coreless buildup supporting substrate according to any one of claims 1 to 3 mass conversion thickness is the thickness of ^{1mg / m 2 ~100mg / m 2} . The support substrate for coreless buildup according to any one of claims 1 to 4, wherein an adhesion strength when the base copper foil is peeled from the insulating layer is 1 gf / cm to 100 gf / cm. 6. The coreless buildup support substrate, wherein a release film having a size smaller than that of the base copper foil is sandwiched between the organic anticorrosive coating and the insulating layer. The coreless buildup support substrate according to any one of the above.

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