JP5540971B2 - Contact, connecting jig, and method of manufacturing contact - Google Patents

Description

  The present invention relates to a contactor having an insulating coating used for a connecting jig for electrically connecting a target point set in advance to an object and an inspection device, and a method for manufacturing the contactor.

  The connection jig includes a contact (probe, probe, contact pin, etc.), and supplies a current or an electric signal from an inspection device or the like to a target point set in advance on the target via them. At the same time, by detecting an electrical signal from the target point, an electrical characteristic between the target points is detected, and a continuity test, a leak test, an operation test and the like are performed.

  Examples of such objects include printed wiring boards, flexible boards, ceramic multilayer wiring boards, electrode boards for liquid crystal displays and plasma displays, package boards for semiconductor packages and film carriers, semiconductor wafers and semiconductor chips. And semiconductor devices such as LSI (Large Scale Integration) such as CSP (chip size package). In addition, this contactor can also aim at electrically connecting said target object and apparatus, and also as a connection jig which connects an electrode end and an electrode end like an interposer and a connector. Can also be adopted.

  In the present specification, the above-described objects are collectively referred to as “objects”, and a portion that is set as an object and is brought into a conductive state upon contact with a contactor is simply referred to as “object point”. Note that the portion sandwiched between the target points is set as “between target points”.

  When the object is an LSI, an electronic circuit formed on the LSI is a target portion, and each surface pad of the electronic circuit is a target point. In this case, in order to ensure that the electronic circuit formed in the LSI has the desired electrical characteristics, the electrical characteristics between the target points are measured to judge the quality of the electronic circuit. .

  Further, when the object is a substrate on which electric / electronic components are mounted, the wiring formed on the substrate is the target portion, and both ends of the wiring are the target points. In this case, in order to ensure that the wiring as the target part can accurately transmit the electrical signal to them, between the predetermined target points on the wiring formed on the wiring board before mounting the electric / electronic component. The electrical characteristics such as resistance value and leakage current are measured to judge the quality of the wiring.

  Specifically, the judgment of the quality of the wiring is made by measuring the current supply contact point to the target point by bringing the tip of the current supply contact point and / or the voltage measurement contact point into contact with each target point. Measure the voltage generated in the wiring between the tips of the voltage measurement contacts that supply current and contact the target point, and determine the resistance of the wiring between the predetermined target points based on the supply current and the measured voltage. This is done by calculating the value.

  For example, when any of the above-described substrates is inspected using a substrate inspection apparatus, the substrate connecting jig inspection contact is moved to the target point of the substrate to be inspected by the jig moving means. When the inspection is completed, the jig is moved from the target point to the standby position by the jig moving means.

2004-115838 2008-25833 2009-160722

  In Patent Document 1, after forming a gold plating layer on the outer peripheral surface of a linear material and further forming a nickel plating layer thereon, the linear material is removed by pulling the linear material to reduce the cross-sectional area of the linear material. A method of manufacturing a nickel electroformed pipe is disclosed.

  In Patent Document 2, an insulating coating is formed on the outer peripheral surface of the SUS wire, and a spiral groove is formed on the outer surface of the SUS wire to expose the outer peripheral surface of the SUS wire, and a nickel coating having the same thickness as the insulating coating is formed there. Then, a method of manufacturing a nickel electroformed pipe having a coil spring structure in part by removing the insulation coating and pulling off the SUS wire is disclosed.

  Patent Document 3 separately manufactures a micropipe, forms a resist film on the outer peripheral surface of the micropipe, forms a helical space pattern on the resist film by, for example, developing a helical portion by dissolving the photosensitive portion in a spiral shape, Disclosed is a method of simultaneously forming a plurality of microcoils separated by a space pattern by forming a space pattern that circulates around a micropipe at predetermined intervals and etching it.

  In recent years, LSI formation processes have been improved, LSI miniaturization has been promoted, and LSI inspection pads have become narrower and more numerous, resulting in more complex and finer LSIs to be inspected and substrates on which they are mounted. Since the target point set as the inspection target is narrower or smaller, the contact is formed thinner. For this reason, it is required to manufacture a large number of fine contacts more efficiently. It is preferable to form an insulating film on the contact surface in order to prevent adjacent contacts from contacting each other and short-circuiting the contacts, but the smaller the contacts, the more this insulation becomes. It is also very difficult to form a film.

  Patent Documents 1 and 2 disclose a method of manufacturing a nickel electroformed pipe partially including a fine nickel electroformed pipe or a coiled spring structure at the stage where a linear material or SUS wire is removed. However, in order to manufacture a contact that can be attached to a connecting jig from the manufactured nickel electroformed pipe, the pipe is further cut to a length suitable for the contact or locked with the connecting jig. An additional process such as forming a part is required.

  Patent Document 3 discloses a method of manufacturing a microcoil through an additional process after manufacturing a micropipe according to Patent Document 1. In order to manufacture the contact attached to the connecting jig from the microcoil, an additional process as described above in connection with Patent Documents 1 and 2 is further required.

  Then, this invention aims at providing the contactor attached to the connection jig | tool which has an insulating film manufactured without requiring an additional process in the step which removed the linear material and the SUS wire. .

  Another object of the present invention is to provide a method of manufacturing a contact having an insulating film that is attached to a connecting jig without requiring an additional process at the stage where a linear material or SUS wire is removed.

  Furthermore, the present invention provides a manufacturing method having high mass productivity of a contact having an insulating film attached to a connecting jig without requiring an additional process at the stage of removing a linear material or SUS wire. With the goal.

The invention according to claim 1 is a contactor incorporated in a connection jig electrically connected to a target point provided on an object, comprising a cylindrical tube made of a plating layer of a conductive material, the cylinder A spring part having a helical tube wall surface in the long axis direction formed between the tip part and the rear end part of the tip part and the rear end part extending in a predetermined length in a direction in which the shape tube faces from both ends And the spring part has an insulating layer formed along the helical wall surface, and a boundary surface between the plating layer and the insulating layer formed on the spring part is formed without a step, and the spring part has The formed insulating layer has an end surface formed on the boundary surface, and has a tapered shape spreading outward in the minor axis direction of the cylindrical tube.
According to a second aspect of the present invention, there is provided the contact according to the first aspect, wherein an insulating layer formed on the spring portion is overhanging with respect to an end face of the plating layer.
The invention according to claim 3 provides the contactor according to claim 1 or 2, wherein the contactor has an outer diameter of 30 to 100 μm.
According to a fourth aspect of the present invention, there is provided the contact according to the first aspect, wherein the plating layer has a laminated structure of a gold plating layer and a nickel plating layer.
Invention of Claim 5 is a jig | tool electrically connected to the object point provided in a target object, Comprising: The some contactor in any one of Claims 1 thru | or 4, The said some contactor A head plate having a hole through which the front end portion is inserted, and a head plate having a hole through which the rear end portion of the plurality of contacts is inserted, and electrically connected to the rear end portion of the plurality of contacts. A connection jig including a base plate including electrodes is provided.
The invention according to claim 6 is a method for manufacturing a contactor incorporated in a connecting jig that is electrically connected to an object part of an object, wherein a nonconductive layer of a nonconductive material is provided around a core material. And a step of removing a part of the non-conductive layer to form a circumferential protrusion that circulates and forming a helical spiral protrusion between adjacent circumferential protrusions And a step of forming a plating layer of a conductive material on the core material on which the circumferential protrusion and the spiral protrusion are formed, and an insulating film on the plating layer of the conductive material of the core material A step of forming, a step of removing the circumferential projection and the spiral projection, and removing the insulating film over a predetermined distance from an end surface of the circumferential projection to expose a plating layer of a conductive material Provided is a method for manufacturing a contactor including a step and a step of removing the core material.
According to a seventh aspect of the present invention, a part of the non-conductive layer is removed to form a circumferential projection that circulates, and a spiral projection is formed between adjacent circumferential projections. The method of manufacturing the contact according to claim 6, wherein in the step of performing, the part of the non-conductive layer is removed using a laser to form the circumferential protrusion and the spiral protrusion. I will provide a.
According to an eighth aspect of the present invention, in the step of removing the insulating film over a predetermined distance from the end face of the circumferential protrusion to expose the plating layer of the conductive material, the insulating film is removed using a laser. A method for producing a contact according to claim 6 is provided.
A ninth aspect of the invention provides a method for manufacturing a contact according to the sixth aspect, wherein a plurality of the contacts are manufactured when the step of removing the core material is completed.
A tenth aspect of the present invention provides the method of manufacturing the contact according to the sixth aspect, wherein the end face of the spiral insulating film and the end face of the plating layer are formed without a step.
The invention described in claim 11 provides the method of manufacturing the contact according to claim 6, wherein the outer diameter of the contact is 30 to 100 μm.

According to the present invention, when the linear material and the SUS wire are removed, the spring is manufactured without an additional process, has an insulating coating, and is attached to the connecting jig, thereby increasing the magnitude of the spring load. A contact can be provided.
According to the present invention, it is possible to provide a contact having an engaging portion for being held by the connecting jig at the stage where the linear material and the SUS wire are removed, and having an increased spring load.
In addition, according to the present invention, when the linear material or SUS wire is removed, it can be attached to the connecting jig without the need for an additional process, has an insulating coating, and increases the load of the spring. The manufacturing method of the contactor made can be provided.
Furthermore, according to the present invention, when the linear material or the SUS wire is removed, it can be attached to the connecting jig without requiring an additional process, has an insulating coating, and increases the load of the spring. The manufacturing method which has high mass productivity of the made contactor can be provided.

It is sectional drawing which shows one Example of the process of forming the gold plating layer in the step which manufactures the contactor which concerns on this invention. It is sectional drawing which shows one Example of the process of forming the nonelectroconductive layer in the step which manufactures the contactor which concerns on this invention. It is sectional drawing which shows one Example of the process of removing a part of nonelectroconductive layer in the step which manufactures the contactor which concerns on this invention. It is sectional drawing which shows one Example of the process of forming the nickel plating layer in the step which manufactures the contactor which concerns on this invention. It is sectional drawing which shows one Example of the process of forming the insulating film in the step which manufactures the contactor which concerns on this invention. It is sectional drawing which shows one Example of the process of removing a nonelectroconductive layer in the step which manufactures the contactor which concerns on this invention. It is sectional drawing which shows one Example of the process of removing a part of insulating film in the step which manufactures the contactor which concerns on this invention. It is sectional drawing which shows one Example of the process of removing a part of gold plating layer in the step which manufactures the contactor which concerns on this invention. It is sectional drawing which shows one Example of the extending process of the core material in the step which manufactures the contactor which concerns on this invention. It is sectional drawing which shows one Example of the drawing process of the core material in the step which manufactures the contactor which concerns on this invention. (A) is a front view which shows one Embodiment of the contactor which concerns on this invention, (B) is a front view which shows other embodiment of the contactor which concerns on this invention. It is a schematic block diagram for demonstrating the state which attached the contact of one Embodiment which concerns on this invention to the connecting jig of one Embodiment. It is a schematic block diagram for demonstrating the state which attached the contact of one Embodiment which concerns on this invention shown to FIG. 2 (B) to the connection jig which concerns on other embodiment. It is a schematic block diagram for demonstrating the state which attached the contact of one Embodiment which concerns on this invention shown to FIG. 2 (B) to the connection jig which concerns on other embodiment.

  1A to 1J are cross-sectional views showing an example of each process for manufacturing a contact according to an embodiment of the present invention. In all the drawings, the thickness, length, shape, spacing between members, gaps, and the like of each member are appropriately enlarged, reduced, deformed, simplified, etc. for easy understanding. In the description of the drawing, the vertical and horizontal expressions represent directions along the plane of the drawing in the state of facing the drawing.

FIG. 1A shows a cross-sectional view of a wire manufactured by forming a gold plating layer 12 on the outer peripheral surface of a core material 10. For example, a metal wire or a resin wire having an outer diameter of 5 μm to 300 μm can be used for the core material 10. As the metal wire, for example, a SUS wire can be used, and as the resin wire, a synthetic resin wire such as nylon resin or polyethylene resin can be used.
The gold plating layer 12 is formed on the outer peripheral surface of the core material 10, and by forming the gold plating layer 12, the core material 10 can be easily extracted in the final process. The gold plating layer 12 facilitates extraction of the core material 10, but is not particularly required when the core material 10 can be easily extracted. The thickness of the gold plating layer 12 is formed from 0.1 μm to 1 μm.

  The length of the wires (core material 10 and gold plating layer 12) is preferably 50 cm or less from the viewpoint of ease of carrying work, etc., but is not limited thereto, and is manufactured continuously without being cut. Also good.

FIG. 1B shows a non-conductive layer 14 formed on the outer peripheral surface of the gold plating layer 12 of the wire shown in FIG. 1A. The non-conductive layer 14 determines the position of the conductive material plating layer 16 when forming a conductive material plating layer 16 (to be described later) (a nickel plating layer 16 to be described later). The conductive material plating layer 16 does not exist in the portion where the non-conductive layer 14 exists, and the conductive material plating layer 16 exists in the portion where the non-conductive layer 14 does not exist. .
The non-conductive layer 14 is preferably made of a material that can be patterned by exposure and development by laser irradiation so that the non-conductive layer 14 has a desired shape in a process that will be described later. Alternatively, a material that can form a pattern may be used.
The thickness of the non-conductive layer 14 is appropriately adjusted according to the thicknesses of the plating layer 16 and the insulating film 18 of the conductive material, but is formed from 7 μm to 100 μm.

FIG. 1C is a cross-sectional view illustrating an example of a process of removing a part of the non-conductive layer 14. In the step shown in FIG. 1C, a part of the non-conductive layer 14 is removed to form a circumferential protrusion 14a that circulates at equal intervals, and a spiral shape is formed between adjacent circumferential protrusions 14a. A helical projection 14b is formed.
In the embodiment shown in FIG. 1C, the circumferential projection 14a, the spiral projection 14b, the circumferential projection 14a, the spiral projection 14b, and the circumferential projection 14a are arranged in this order from the left toward the paper surface. Is formed. In this embodiment, the circumferential protrusion 14a is formed leaving the non-conductive layer 14 so that the non-conductive layer 14 remains with a predetermined width, for example, with an interval of 3 mm to 30 mm.

  The non-conductive layer 14 is removed from the spiral protrusion 14b so that the non-conductive layer 14 has a spiral shape between the peripheral protrusion 14a and the peripheral protrusion 14a. In addition, when the circumferential projection 14a and the spiral projection 14b are actually formed on the non-conductive layer 14, the order in which the wires (core material 10 and the gold plating layer 12) are formed (for example, FIG. If it is 1C, it is formed along the order from the left). Note that the gold plating layer 12 is exposed at a portion where the non-conductive layer 14 is removed (a portion other than the circumferential protrusion 14a and the spiral protrusion 14b).

  The circumferential protrusion 14a and the spiral protrusion 14b can employ a method of irradiating a wire having the nonconductive layer 14 with a laser beam to remove the unnecessary nonconductive layer 14. In this case, while rotating the core material 10 in the circumferential direction, a laser beam is directly irradiated to an unnecessary position of the nonconductive layer 14, and the nonconductive layer 14 is removed by the irradiation. The output of the laser beam used in this method is adjusted so that only the non-conductive layer 14 can be removed and the gold plating layer 12 is not damaged.

  FIG. 1D is a cross-sectional view illustrating an example of a process for forming a nickel plating layer. In the process of FIG. 1D, the nickel plating layer 16 is formed on the outer periphery of the wire formed in FIG. 1C. In the nickel plating layer 16, the nickel plating layer 16 is formed in a portion where the non-conductive layer 14 of the wire is not formed, that is, in a portion where the gold plating layer 12 appears on the surface. The thickness of the nickel plating layer 16 is 5 μm to 50 μm.

  FIG. 1E is a cross-sectional view illustrating an example of a process for forming an insulating film. In the step of FIG. 1E, an insulating film 18 is formed on the outer periphery of the wire having the nickel plating layer 16 formed in FIG. 1D. The insulating film 18 is formed in a portion where the non-conductive layer 14 of the wire is not formed, that is, a portion where the nickel plating layer 16 appears on the surface. A method for forming the insulating film 18 is not particularly limited, but can be formed by an electrodeposition method. As described above, by using the electrodeposition method, the insulating film 18 can be formed only on the surface of the nickel plating layer 16, and the insulating film 18 is not formed on the non-conductive layer 14. The insulating film 18 is formed to have a thickness of 2 μm to 50 μm.

  The thickness of the insulating film 18 is formed in the above range, but the surface of the nonconductive layer 14 that forms the circumferential protrusion 14a and the spiral protrusion 14b when laminated with the nickel plating layer 16 is formed. Can be made slightly higher or lower. When the insulating film 18 is formed higher than the nonconductive layer 14, the insulating film 18 runs on the surface of the nonconductive layer 14. When the insulating film 18 is formed lower than the nonconductive layer 14, it is formed so as to stick to the side surface of the nonconductive layer 14.

FIG. 1F is a cross-sectional view showing an example of a step of removing the non-conductive layer. In the step of FIG. 1F, the non-conductive layer 14 of the wire having the insulating film 18 formed in FIG. 1E is removed. In this step, only the non-conductive layer 14 is removed using, for example, an organic solvent.
By removing the non-conductive layer 14 in this manner, the gold plating layer 12 is exposed at the portions of the circumferential protrusion 14a and the spiral protrusion 14b of the wire. For this reason, the circumferential groove 14a is formed in the circumferential protrusion 14a, and the spiral groove 22b is formed in the spiral protrusion 14b.
In addition, in the part of the helical groove | channel 22b, it forms in the shape of a spiral (spring part mentioned later) by the nickel plating layer 16 and the insulating film 18. FIG.

  The heights of the non-conductive layer 14 and the insulating film 18 in the thickness direction are formed as follows. When the insulating film 18 is formed higher than the nonconductive layer 14, the insulating film 18 is formed overhanging the nickel plating layer 16 in the portion of the spiral groove 22 b. On the other hand, when the insulating film 18 is formed lower than the non-conductive layer 14, the side surfaces of the insulating film 18 and the nickel plating layer 16 are formed flush with each other at the portion of the spiral groove 22b. Further, in this case, since the insulating film 18 is formed to have a curved surface (a shape like a raised state) that extends outward along the side surface of the non-conductive layer 14, the spiral groove 22b Then, the insulating film 18 has a curved surface that spreads outward.

  FIG. 1G is a cross-sectional view illustrating an example of a process for removing a portion of the insulating film. In the process of FIG. 1G, the nickel plating layer 16 is exposed by irradiating a laser beam to remove a predetermined length from the end face of the insulating film 18 forming the circumferential groove 22a. When the exposed nickel plating layer 16 is formed on the contact for the connection jig, it is used as a front end part that contacts the inspection target part or a rear end part that contacts the electrode of the connection jig connected to the inspection apparatus. They become functional parts, and their required lengths are determined according to the structure of the connecting jig. Therefore, the length from which the insulating film 18 is removed is determined in consideration of them.

  FIG. 1H is a cross-sectional view showing an example of a step of removing a part of the gold plating layer. In the process of FIG. 1H, ultrasonic cleaning is performed in the state of FIG. 1G to remove the gold plating layer 12 exposed in the circumferential groove 22a and the spiral groove 22b as shown in FIG. 1H.

  FIG. 1I is a cross-sectional view showing an embodiment of a core stretching process. The core material 10 is pulled in a direction away from both ends of the core material 10 as indicated by the white arrows, and is deformed so that the cross-sectional area becomes small. One end may be fixed and only the other end may be pulled. When the core material 10 is stretched and its cross-sectional area is reduced, the gold plating layer 12 covering the outer peripheral surface of the core material 10 is peeled off from the outer peripheral surface, and between the core material 10 and the gold plating layer 12. A space will be formed.

  FIG. 1J is a cross-sectional view showing an embodiment of the core material drawing process. In the process of FIG. 1J, when the core material 10 is extracted, the adjacent portions are separated by the circumferential grooves 22a, and the contact 26 and the contact 28 are formed separately. As shown in FIG. 1J, when the core material 10 is extracted, a contact having an insulating film can be completed without requiring another additional process. 1A to 1J show only a part of the electroformed pipe in a simplified manner. In the process of FIG. 1J, only two contacts are manufactured. By using a cast pipe, a large number of contacts can be manufactured at once.

  As shown in FIG. 1J, each of the contacts 26 and 28 includes a cylindrical nickel plating layer 16 made of a conductive material, and a front end portion and a rear end portion where the nickel plating layer 16 is exposed are formed on both ends thereof. In addition, a spring portion having a helical wall surface in the major axis direction is formed between the front end portion and the rear end portion, and an insulating layer 18 is formed along the helical wall surface. Yes.

  The contact according to the present invention can be manufactured under the conditions of the above dimensions. In particular, when the outer diameter is 30 to 100 μm, the inner diameter is 20 to 90 μm, and the thickness of the insulating film is 2 to 15 μm. Can be suitably used as a connection terminal used in a connection jig.

  FIG. 2A discloses a contact 21 according to an embodiment of a cylindrical contact manufactured using the steps of FIGS. 1A to 1J described above. The contactor 21 includes a front end portion 21a, a cylindrical spring portion 21c, and a rear end portion 21b. The rear end 21b is shorter than the front end 21a. 2B shows a contact 20 according to another embodiment of the cylindrical contact manufactured by the steps of FIGS. 1A to 1H described above, similarly to the contact 21 of FIG. 2A. Disclose. However, the order of the manufacturing process of the contact of FIG. 2A and the contact of FIG. 2B is the same, but in the process of FIG. 1E in the manufacturing stage of the contact of FIG. Since the width of the insulating layer 18 to be removed is different in the two grooves 22a and 22b that match, the contact 21 in FIG. On the other hand, the length of the both ends 20a of the contact 20 of FIG. 2 (B) is the same.

  2A has an outer diameter of about 50 μm, an inner diameter of about 35 μm, an overall length of about 5 mm, and an end portion 21a having a length of about 1.5 mm. It is not limited.

  The tip 21a of the contact 21 in FIG. 2A is in contact with the inspection target portion of the object, and the rear end 21b is connected to an electrode of a connection jig connected to the inspection apparatus. The spring portion 21c is formed with a spring portion in which a spiral gap (the above-described spiral groove) is formed, and exerts an elastic force. Therefore, the spring portion 21c can expand and contract, and the spring load is determined in proportion to the magnitude of the expanding and contracting displacement. The spiral spring portions 21c and 20c shown in FIGS. 2 (A) and 2 (B) are merely examples, and the spiral portions are formed for the purpose of exerting a predetermined spring load without being limited thereto. The width, pitch, thickness, number of turns of the spring portion, the formation position of the spring portion, and the number of spring portions can be changed.

  The contact 20 of FIG. 2 (B) includes a central spring portion 20c and two end portions 20a having the same length located on both sides thereof. That is, the contact 20 is vertically symmetric. Therefore, when one of the end portions 20a of the contact 20 is used as a tip portion that contacts the inspection target portion of the object, the other becomes a rear end portion connected to the electrode of the connecting jig connected to the inspection apparatus. .

  The lengths of the front end portion 21a and the rear end portion 21b of the contactor 21 in FIG. 2A and the lengths of the two end portions 20a of the contactor 20 in FIG. It is determined by the length of the exposed nickel plating that removes 18 from the end face.

  When a contact having two end portions 20a having the same length is used like the contact 20 of FIG. 2B, the two end portions have the same shape, the function is not specified, and the front end portion or the rear end Since it can be used for either of the parts, it is not necessary to certify the upper and lower sides when assembling into the connection jig, and assembly is facilitated.

  FIG. 3A is a partial cross-sectional view showing only a part of the connection jig in order to explain the state of the contact 21 attached to the connection jig 32 according to one embodiment. In this embodiment, a head plate 38, a support plate 36, and a base plate 35 are provided to hold the plurality of contacts 21. These plates are held at a predetermined distance apart by a support portion (not shown) in the form of a rod or a frame. For this reason, in this embodiment, a space is formed between the head plate 38 and the support plate 36.

A through hole 38h is formed in the head plate 38, and the distal end portion 21a of each contactor 21 is penetrated and guided to the inspection point. The inner diameter of the through hole 38h is larger than the outer diameter of the tip portion 21a and smaller than the outer diameter of the insulating film 16. Therefore, the portion of the insulating film 16 is locked to the head plate 38, and the contact 21 does not come out of the through hole 38h. The plurality of through-holes 38h are formed close to each other so as to have a high density so as to correspond to the positions where the target points are formed, but it is necessary to set a distance so that adjacent contactors 21 do not contact each other. . A through hole 36 h is formed in the support plate 36, and the rear end portion 21 b of each contactor 21 is inserted through the support plate 36, and the rear end portion 21 b is guided to the electrode 40. The inner diameter of the through hole 36h is slightly larger than the outer diameter of the insulating film 16 of the contactor 21. The through hole 36h of the support plate 36 preferably has a length that does not accommodate the spring portion 20c therein. This is to prevent the contact 21 from being damaged by contacting the support plate 36 forming the through hole 36h during the contraction movement of the spring portion 20c. The support plate 36 is disposed so as to contact the base plate 35.
Here, since the insulating film is formed on the outer periphery of the contact according to the present invention, a plurality of through holes can be formed close to each other so as to attach the contact at a considerably high density.
As shown in FIG. 3A, the electrode 40 is fixed to the base plate 35 at a position facing the through hole 38h of the head plate 38. If the base plate 35 is not provided, the contactor 21 is set to a natural length so that the rear end 21b protrudes slightly from the position where the base plate 35 is fixed. In the state shown in FIG. 2, the rear end portion 21b collides with the electrode 40, and the spring portion 21c is contracted slightly to exert a biasing force that pushes the electrode. Therefore, the state which the electrode 40 and the contactor 21 contact reliably is hold | maintained. Further, since the lower end portion of the insulating film 16 is locked to the head plate 38 around the through hole 38h, the contactor 21 does not change the protruding amount of the distal end portion 21a, and the pressing force to the target point is not changed. Can be kept constant.

  FIG. 3B is a partial cross-sectional view showing only a part of the connection jig in order to explain the state of the contact 20 attached to the connection jig 30 according to one embodiment. The connection jig 30 includes a support plate 36 and a head plate 38. They are made of insulating materials such as resin materials and ceramics. The support plate 36 holds the head plate 38 at a predetermined distance from the base plate 35.

  A through hole 38h is formed in the head plate 38, and the tip 20a of the contact 20 is inserted therethrough. At that time, the inner diameter of the through hole 38h is larger than the outer diameter of the nickel plating layer 16 (see FIG. 1J) covering the outer periphery of the tip portion 20a, but smaller than the outer diameter of the insulating film 18.

Further, a through hole 36 h is formed in the support plate 36, and the through hole 36 h has an inner diameter slightly larger than the outer diameter of the insulating film 18, and holds the contact 20 through.
As a result of the inner diameter of the through hole 38h being smaller than the outer diameter of the insulating film 18 of the contact 20, the portion of the insulating film 18 is locked to the head plate 38, so that the contact 20 does not come out of the through hole 38h.

  As shown in FIG. 3B, the base plate 35 holding the electrode 40 is fixed so as to face the opening of the through hole 36h of the support plate 36. If the base plate 35 is not provided, the contact 20 has a natural length and the rear end 20a is set to a length that slightly protrudes from the opening above the through hole 36h of the support plate 36. In the state shown in FIG. 3B, the rear end portion 20a collides with the electrode 40, and the spring portion 20c is contracted a little to exert a biasing force that pushes the electrode. Therefore, the state which the electrode 40 and the contactor 20 contact reliably is maintained. Further, since the lower end portion of the insulating film 16 is locked to the head plate 38 around the through hole 38h, the contact 20 does not change the protruding amount of the distal end portion 20a, and the pressing force against the inspection target is not changed. Can be kept constant.

  FIG. 3C is a partial cross-sectional view illustrating only a part of the connection jig in order to explain a state in which the contact 20 is attached to the connection jig 31 according to another embodiment. The connection jig 31 is different from the connection jig 30 in that a portion corresponding to the support plate 36 of the connection jig 30 includes two support plates 36a and 36b. In the support plate 36 b, a tapered inclined surface 34 i is formed in the through hole 36 h, and the inner diameter of the opening portion toward the electrode 40 of the base plate 35 is smaller than the outer diameter of the insulating film 18 of the contact 20.

  When assembling the contact 20 into the connection jig 31, the head plate 38 is attached to the support plate 36a, and the head 20 is connected to the head 20 from above through the through hole 36h of the support plate 36a. 38 is inserted into the through hole 38h. The inserted tip 20a enters the through hole 38h along the support plate 36a. However, since the outer diameter of the insulating film 18 of the spring part 20c is larger than the inner diameter of the through hole 38h, the lower end of the insulating film 18 is The contact 20 is held by the head plate 38 by being locked to the head plate 38 around the through hole 38h.

  Next, after the contactor 20 is held on the head plate 38, the support plate 36b and the base plate 35 are placed on the upper end of the support plate 36a with the wide opening portion facing downward in order to attach the support plate 36b and the base plate 35 to the connection jig 31. Place it on the club. At that time, the rear end portion 20a is positioned and inserted into a wide opening portion of the through hole 36h of the support plate 36b. Since the through hole 36h of the support plate 36b is gradually narrowed along the inclined surface 34i, the rear end portion 20a is guided to the inclined surface 34i and guided to the upper narrow opening. As described above, since the through hole 36h is formed to have the inclined surface 34i that leads from the wide opening portion to the narrow opening portion, the support plate in which the end surface of the rear end portion 20a of the contact 20 forms the through hole 36h. 36b, the rear end 20a of the contact 20 can be easily inserted into the through hole 36h of the support plate 36b, and the rear end of the contact 20 is surely provided along the inclined surface 34i. The portion 20a can be guided to the narrow opening portion of the through hole 36h, and the rear end portion 20a of the contact 20 and the electrode 40 can be positioned and fixed with high accuracy.

  When the rear end 20a of the contact 20 reaches a narrow opening, the contact 20 comes into contact with the electrode 40 electrically connected to the inspection apparatus. If the electrode 40 is not provided, the contact 20 has a natural length, and the rear end 20a is set to a length that slightly protrudes from the narrow opening of the through hole 36h of the support plate 36b. In FIG. 3C, the rear end portion 20 a collides with the electrode 40, and the spring portion 20 c is slightly contracted to exert an urging force that pushes the electrode 40. Therefore, similarly to the connection jig 30 shown in FIG. 3B, the connection jig 31 can maintain a reliable contact state between the electrode 40 and the contact 20. Further, since the lower end portion of the insulating film 16 is locked to the head plate 38 around the through hole 38h, the contact 20 does not change the protruding amount of the distal end portion 20a, and the pressing force against the inspection target is not changed. Can be kept constant.

  For example, when inspecting a substrate or the like, the tip surface of the tip portion 20a of the contact 20 is brought into contact with the target point. Since the tip portion 20a is retracted by the drag force caused by the pressing force, the spring portion of the spring portion 20c contracts accordingly, and the tip portion of the tip portion 20a is retracted by the force of returning the spring portion. And contact with the object to be inspected. In this state, the resistance value to be inspected can be detected and the presence or absence of conduction can be determined. In addition, by having the spring part 20c in this way, even when the length of the contactor 20 and the height of the object vary, the spring part 20c contracts appropriately when pressed against the target point. And the edge part 20a of the contact 20 can be press-contacted to an object point, and it can prevent that an object point is damaged.

  As described above, some embodiments of the contact for a connecting jig according to the present invention have been described, but the present invention is not limited to those embodiments, and additions, deletions, and the like that can be easily made by those skilled in the art. It should be understood that modifications and the like are included in the present invention, and that the technical scope of the present invention is defined by the description of the appended claims.

DESCRIPTION OF SYMBOLS 10 ... Core material 12 ... Gold plating layer 14 ... Nonelectroconductive layer 14a ... Circumferential protrusion 14b ... Spiral protrusion 16 ... Nickel plating layer 18 ... Insulating film 20, 21 ... Contacts 20a, 21a, 21b ... Ends 20c, 21c ... Spring part 22a ... Surround groove 22b ... Helix groove 30 ... Connection jig

Claims (11)

A contactor incorporated in a connecting jig electrically connected to a target point provided on the object,
Provided with a cylindrical tube made of a conductive material plating layer,
The cylindrical tube is
A front end and a rear end extending over a predetermined length in opposite directions from both ends;
A spring portion formed between the front end portion and the rear end portion and having a helical wall surface in the long axis direction;
The spring portion has an insulating layer formed along the spiral wall surface;
A boundary surface between the plating layer formed on the spring portion and the insulating layer is formed without a step,
An insulating layer formed on the spring portion has a tapered shape in which an end surface is formed on the boundary surface and extends outward in the minor axis direction of the cylindrical tube.   The contact according to claim 1, wherein the insulating layer formed on the spring portion is overhanging with respect to an end face of the plating layer.   The contactor according to claim 1, wherein the contactor has an outer diameter of 30 to 100 μm.   The contact according to claim 1, wherein the plating layer has a laminated structure of a gold plating layer and a nickel plating layer.   A jig that is electrically connected to a target point provided on an object,
  A plurality of contacts according to any one of claims 1 to 4,
  A head plate having a hole through which the front end portions of the plurality of contacts are inserted, and a hole through which the rear end portions of the plurality of contacts are inserted;
  A connection jig comprising a base plate including an electrode for electrically connecting to the rear end portions of the plurality of contacts.   A method of manufacturing a contact incorporated in a connection jig that is electrically connected to a target portion of an object,
  Forming a non-conductive layer of non-conductive material around the core material;
  Removing a part of the non-conductive layer, forming a circumferential protrusion that circulates, and forming a helical protrusion between adjacent circumferential protrusions;
  A step of forming a plating layer of a conductive material on the core member on which the circumferential protrusion and the spiral protrusion are formed;
  Forming an insulating film on the plating layer of the conductive material of the core material;
  Removing the circumferential protrusion and the helical protrusion;
  Removing the insulating film over a predetermined distance from an end face of the circumferential protrusion to expose a plating layer of a conductive material;
  And a step of removing the core material.   In the step of removing a part of the non-conductive layer to form a circumferential protrusion that circulates, and forming a helical spiral protrusion between adjacent circumferential protrusions, a laser is used. The method of manufacturing a contact according to claim 6, wherein a part of the non-conductive layer is removed to form the circumferential protrusion and the spiral protrusion.   7. The step of removing the insulating film over a predetermined distance from the end face of the circumferential protrusion to expose the plating layer of a conductive material, wherein the insulating film is removed using a laser. Of manufacturing a contactor.   The method of manufacturing a contact according to claim 6, wherein a plurality of the contacts are manufactured when the step of removing the core material is completed.   The method of manufacturing a contact according to claim 6, wherein an end face of the spiral insulating film and an end face of the plating layer are formed without a step.   The method of manufacturing a contact according to claim 6, wherein an outer diameter of the contact is 30 to 100 μm.

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