JP5531650B2 - Optical receiver device - Google Patents

Description

  The present invention relates to an optical receiving device used for optical communication.

  There are two known modulation schemes in optical communication: intensity modulation and phase modulation. As the phase modulation method, there are known a method of modulating the signal itself by interference and a method of modulating the local light and the signal by causing interference. For example, DPSK (Differential Phase Shift Keying) that performs binary modulation and DQPSK (Differential Quadrature Phase Shift Keying) that performs quaternary modulation are available as methods for causing the signal itself to interfere. As a method for causing the local light and the signal to interfere, there is DP-QPSK (Dual Polarization-Quadrature Phase Shift Keying) that performs 8-level modulation.

  Conventionally, the following techniques are known as wire bonding methods for semiconductor chips. In a multi-chip semiconductor device containing a plurality of semiconductor chips, a bonding pad is provided in the vicinity of one side of a second semiconductor chip mounted on the first semiconductor chip, and the bonding pads of these semiconductor chips are directly connected by wires. The connection is described. As a result, the number of bonding pads on the substrate on which the semiconductor chip is mounted can be reduced, so that the package size can be reduced (for example, cited reference 1).

  In an integrated circuit chip in which output pads to which wires are connected are arranged at positions other than the periphery of the upper surface, a wire bonding adapter having bonding pads along two edges is arranged on the upper surface of the integrated circuit chip. Has been. Then, the output pad at the center of the integrated circuit chip and the bonding pad at one edge of the wire bonding adapter are connected by a wire. Next, the bonding pads on the other edge of the wire bonding adapter and the pads on the substrate are connected by wires. As a result, even when another integrated circuit chip is placed over the integrated circuit chip, wire bonding is possible (for example, cited document 2).

  In a semiconductor integrated circuit device having a structure in which a built-in semiconductor chip and a lead are connected by wire bonding, the semiconductor chip is mounted on a wiring board having a signal line for changing a connection path of a connection pad of the semiconductor chip. It is described. This makes it possible to connect an arbitrary connection pad of the semiconductor chip and an arbitrary lead (for example, Patent Document 3).

  By the way, in an optical receiving device that receives an optical signal, as a method of transmitting a high-speed signal, a method of performing binary modulation using a high-speed optical element and a high-speed amplifier, and a low-speed optical element and a low-speed amplifier are used. A method of performing multilevel modulation is known.

  FIG. 1 is a diagram schematically showing the structure of the optical receiving device 10. The base member 11 is equipped with a light receiving element 12 and an amplifier 13 for amplifying the output signal. The optical receiving device 10 is housed in a case, and power terminal portions 14 and 15 are provided on the left and right sides (as viewed from the front of FIG. 1) of the case.

As shown by an arrow in FIG. 1, light is input to the light receiving element 12 from the front side of FIG. 1, and after the optical signal is converted into an electrical signal, it is amplified by the amplifier 13 and output to the back side.
A plurality of terminals for power supply connection are provided on both sides of the amplifier 13, and these power supply terminals and power supply terminal portions 14 and 15 connected to an external power supply are connected by wires. In this case, since the power supply terminal portions 14 and 15 are provided on the left and right sides of the case, wires can be connected to the power supply terminal portions 14 and 15 from the terminals on both sides of the amplifier 13, respectively.

FIG. 2 is a diagram schematically showing the structure of the optical receiving device 21 that houses two optical receiving devices 10a and 10b in one case.
The optical receiving device 10a includes a light receiving element 12a and an amplifier 13a. The signal amplified by the amplifier 13a is output to the high frequency substrate 16 and then output to an external terminal (not shown).

The optical receiving device 10b also includes a light receiving element 12b and an amplifier 13b. The signal amplified by the amplifier 13b is output to the high frequency substrate 17 and then output to an external terminal (not shown).
Terminals for power connection are provided on both sides of the amplifiers 13a and 13b. Therefore, it is necessary to wire the wire connecting the power supply terminal on the left side of the amplifier 13a and the power supply terminal portion 14 across the amplifier 13a. Similarly, the wire connecting the power supply terminal on the right side of the amplifier 13b and the power supply terminal portion 15 needs to be wired across the amplifier 13b.

  When wire wiring as described above is performed, the wire length becomes long, and the inductance of the power supply line increases. The internal noise generated in the amplifier is a noise having substantially the same frequency as the main signal (for example, a signal having a frequency of 40 Gbps or more). When the inductance of the power supply line increases, the internal noise is reflected and returns to the amplifier to affect the main signal. . For this reason, it is desirable that the power supply wire has a short wire length.

  Further, when the wire wiring is concentrated on one side of the amplifier 13, the distance between the wires is shortened, the stray capacitance is increased, and there is a problem that signal crosstalk occurs.

JP-A-8-288453 JP-A-8-274128 Japanese Patent Laid-Open No. 4-127545

  This is to shorten the wiring length of the wire wiring inside the optical receiving device.

  The disclosed optical receiving device includes: a light receiving element mounted on a base member; an amplifier for amplifying the output of the light receiving element; and a plurality of power supply connection terminals disposed on both sides of an input or output signal transmission path of the light receiving element. And a connection member for electrically connecting the plurality of first bonding pads and the plurality of second bonding pads at a lower portion of the component mounting surface of the base member.

  Another optical receiving device includes: a light receiving element mounted on a base member; an amplifier that amplifies the output of the light receiving element; and a transmission path of an input or output signal of the light receiving element on a component mounting surface of the base member. A first wiring board disposed on one of the sides, on which a plurality of first bonding pads for power connection are formed; and an input or output signal of the light receiving element on a component mounting surface of the base member A second wiring board disposed on the other side across the transmission path, on which a plurality of second bonding pads for power connection are formed, and the first bonding pads on the first wiring board; And a connecting member for electrically connecting the plurality of second bonding pads of the second wiring board.

  According to the disclosed optical receiving device, the wiring length of the internal wire wiring can be shortened. Thereby, distortion of the signal waveform can be reduced.

It is a figure which shows the structure of an optical receiver device. It is a figure which shows the wiring state of the power wire in the case of having two optical receiving devices. It is a figure which shows the structure of the optical receiving device of 1st Embodiment. It is a figure which shows the structure of the optical receiving device of 2nd Embodiment. It is a figure which shows the wiring state of the power wire of the optical receiving device of 3rd Embodiment. It is a figure which shows the inside of the case of the optical receiving device of 3rd Embodiment. It is a figure which shows an example of the structure of an optical receiving device. It is a figure which shows the structure of the optical receiving device of an end surface incident type and a surface incidence type. It is a figure which shows the other structure of an optical receiver device. It is a figure which shows the structure of the optical receiving device of 4th Embodiment. It is a figure which shows the structure of the optical receiving device of 5th Embodiment.

  FIG. 3 is a diagram schematically illustrating the structure of the optical receiving device 31 according to the first embodiment. For example, one or a plurality of the optical receiving devices 31 are accommodated in a case, wire-bonded to a power supply terminal of the case, and then sealed and used as an optical receiving device (optical receiving module).

  The light receiving element 33 and the semiconductor chip of the amplifier 34 are mounted on the upper surface (component mounting surface) 32 c of the base member 32. The base member 32 is used for heat dissipation of the light receiving element 33 and the amplifier 34. For the base member 32, for example, a metal material having good thermal conductivity such as Kovar can be used. The base member 32 may be other than metal as long as it has a good thermal conductivity.

  The light receiving element 33 is, for example, an end face incident type light receiving element, and converts light incident from the near side when viewed from the front of FIG. 3 into an electric signal and outputs the electric signal to the amplifier 34. The amplifier 34 amplifies the output signal of the light receiving element 33. Two dotted lines 35 that are input to the light receiving element 33 from the front side and output from the amplifier 34 when viewed from the front in FIG. 3 indicate a transmission path of the main signal (an optical signal or an output signal input to the light receiving element 33). ing. The optical signal is, for example, light of 40 Gbps or higher.

  The base member 32 has an upper surface and a part of the side surface cut in a U-shaped cross section. A plurality of sheets 36a to 36e (sheet members, for example, green sheets) are stacked and inserted into the U-shaped notch 32a. The reason why the base member 32 is cut in a U-shape is to provide a convex portion 32 b below the light receiving element 33 so that the light receiving element 33 can sufficiently dissipate heat.

  The sheets 36a to 36e are sheets of insulating members such as thin ceramics, and conductor patterns 37a to 37d are formed on one surface of each of the sheets 36a to 36d. The sheets 36a to 36e are, for example, a material having thermal conductivity and insulating properties such as alumina. As a method of forming the conductor patterns 37a to 37d, there are methods such as application / baking of conductive paste, vapor deposition, and plating. In FIG. 3, the thicknesses of the sheets 36a to 36e are shown differently, but in actuality, they have the same thickness.

  On both sides of the transmission path 35 through which the main signal is transmitted, bonding pads 38a to 38d and bonding pads 39a to 39d for power supply connection are provided. Bonding pads 38a to 38d for power supply (for example, corresponding to the first bonding pads) are electrically connected to the conductor patterns 37a to 37d, respectively. Bonding pads 39a to 39d (for example, corresponding to the second bonding pads) are also electrically connected to the conductor patterns 37a to 37d. That is, the bonding pads 38a to 38d and the bonding pads 39a to 39d are electrically connected to each other by the conductor patterns 37a to 37d of the sheets 36a to 36d below the component mounting surface.

  For example, when the bonding pads 38a to 38d and 39a to 39d are provided on both ends of the sheets 36a to 36d, the bonding pads 38a to 38d, 39a to 39d are electrically connected to the ends of the conductor patterns 37a to 37d. To do. Alternatively, through holes are formed in the sheets 36a to 36d, and the bonding pads 38a to 38d, 39a to 39d and the conductor patterns 37a to 37d are electrically connected. Other connection methods may be used.

  Accordingly, the right bonding pads 39a to 39d and the left bonding pads 38a to 39d as viewed from the front of FIG. 3 are electrically connected by the conductor patterns 37a to 37d formed on the sheets 36a to 36d.

  Therefore, the connection between the power supply terminals (not shown) on the left and right sides of the amplifier 34 (left and right sides with respect to the main signal transmission path 35 as the center) and the power supply terminals on the right side of the case are connected to the bonding pads 38a to 38b. 38d, 39a to 39d can be used. This eliminates the need for wire wiring across the amplifier 34, so that the wiring length of the power supply line (power supply wire wiring) of the amplifier 34 can be shortened. Therefore, since the inductance of the power supply line can be reduced, the distortion of the signal waveform can be reduced. The wiring of the power supply line will be described in detail later.

Next, FIGS. 4A and 4B are diagrams schematically illustrating the structure of the optical receiving device 41 according to the second embodiment.
4A shows the overall structure of the optical receiving device 41, and FIG. 4B shows the connection structure of the bonding pads for power supply connection and the conductor pattern formed on the sheet.

  The structure of the optical receiving device 41 of the second embodiment is basically the same as the structure of the optical receiving device 31 of FIG. The difference from FIG. 3 is that a conductive pattern for connecting to a plurality of bonding pads is formed on one sheet and connected by through holes. Hereinafter, in FIG. 4, the same parts as those in FIG.

  Four conductor patterns 42a to 42d for connecting the four sets of power supply connection bonding pads 38a to 38d and the bonding pads 39a to 39d are formed on the lowermost sheet 36a. Through holes 43a to 43d and 44a to 44d are formed at desired positions of the sheets 36a to 36d. Thereafter, bonding pads 39a to 39d and 38a to 38d for connecting power are formed on the uppermost sheet 36d (or insulating layer), and are electrically connected to the through holes 43a to 43d and 44a to 44d. Accordingly, the conductive patterns 42a to 42d corresponding to the bonding pads 39a to 39d and 38a to 38d can be electrically connected.

  By forming through holes 43a to 43d and 44a to 44d in the stacked sheets 36a to 36d, the right side power supply bonding pads 39a to 39d and the left side corresponding bonding pads 38a to 38d in FIG. Can be electrically connected.

  In the above example, the four conductor patterns 42a to 42d are formed on one sheet 36a, but a part of the conductor patterns 42a to 42d may be divided and formed on two or more sheets. Or you may form a conductor pattern in each sheet | seat 36a-36d, respectively. In this case, a through hole for connecting a bonding pad corresponding to the conductor pattern of each layer may be formed.

  Next, FIG. 5 is a diagram schematically showing the wiring state of the power supply line (wire wiring of the power supply) of the optical receiving device 51 of the third embodiment, and FIG. 6 is a case 59 of the optical receiving device 51. It is a figure which shows the inside.

  This optical receiving device 51 is configured by housing two optical receiving devices 31-1 and 31-2 in one case 59. The structures of the optical receiving devices 31-1 and 31-2 are the same as the optical receiving device 31 of FIG. In the following, the same parts as those in FIG.

  The right optical receiving device 31-1 as viewed from the front of FIG. 5 has bonding pads 38 a to 38 d for power connection and power supplies on both sides of the transmission path of the main signal, for example, left and right positions sandwiching the light receiving element 33-1. Connection bonding pads 39a to 39d are provided. The bonding pads 38a to 38d and the bonding pads 39a to 39d are electrically connected by conductor patterns 37a to 37d formed on the sheets 36a to 36d, respectively. Specifically, the right outermost bonding pad 39a and the left outermost bonding pad 38a are connected by a conductor pattern 37a. Similarly, the second bonding pad 39b on the right side and the second bonding pad 38b on the left side are connected by the conductor pattern 37b. Similarly, other bonding pads are similarly connected by corresponding conductor patterns.

  In addition, in FIG. 5, when connecting with a conductor pattern using a through hole, the part shown as the conductor patterns 37a-37d extended in the perpendicular downward direction from each bonding pad 38a-38d and 39a-39d corresponds to a through hole. To do. The lower horizontal line corresponds to the conductor pattern.

Here, the wiring of the power supply lines of the optical receiving devices 31-1 and 31-2 will be described with reference to FIGS.
As described above, the bonding pads 38a to 38d of the optical receiving device 31-1 are electrically connected to the corresponding bonding pads 39a to 39d by the conductor patterns 37a to 37d formed on one surface of the sheets 36a to 36d, respectively. Has been.

  The power supply connection bonding pads 39a to 39d are wire-bonded to the power supply terminal portion 52 of the case connected to a plurality of external power supplies. In FIG. 5, the power supply terminal portion 52 is shown as one member, but in actuality, as shown in FIG. 6, the left and right power supply terminal portions 52 and 56 of the case 59 are each independently connected to n pieces. Pads 53-1 to 53-n and 57-1 to 57-n are provided. The connection terminals 54-1 to 54-n and 58-1 to 58-n are exposed to the outside of the case 59 from the pads 53-1 to 53-n and 57-1 to 57-n.

  A plurality of power supply terminals (not shown) are provided on the left and right sides (as viewed from the front of FIG. 5) of the upper surface of the amplifier 34-1 of the optical receiving device 31-1. The plurality of power supply terminals on the right side of the amplifier 34-1 are wire-bonded to the power supply terminal portion 52.

  Three power supply terminals (not shown) on the left side of the amplifier 34-1 and three bonding pads 38a to 38c for power supply connection are respectively wire-bonded. The power supply terminal of the light receiving element 33-1 and the bonding pad 38d for power supply connection are also wire-bonded.

  For example, the uppermost power supply terminal on the left side of the amplifier 34-1 is connected to the bonding pad 38a by the power supply line 55a. The second power supply terminal on the left side of the amplifier 34-1 is connected to the bonding pad 38b by the power supply line 55b. Further, the third power supply terminal on the left side of the amplifier 34-1 is connected to the bonding pad 38c by the power supply line 55c.

  That is, by providing bonding pads 38a to 38d and 39a to 39d for connecting power to the left and right of the main signal transmission path, wire wiring between the power supply terminal on the left side of the amplifier 34-1 and the power supply terminal on the right side of the case Can be performed without crossing over the amplifier 34-1. Thereby, the wiring length of a power supply line can be shortened.

  The same applies to the left optical receiving device 31-2. The bonding pads 38a to 38d of the optical receiving device 31-2 are electrically connected to the corresponding bonding pads 39a to 39d by conductor patterns 37a to 37d formed on one surface of the sheets 36a to 36d, respectively.

  The bonding pads 39a to 39d for power connection are wire-bonded to a power terminal portion 56 to which a different power voltage is supplied from the outside. In practice, the power supply terminal portion 56 of FIG. 5 is provided with n independent connection pads 57-1 to 57-n as shown in FIG.

  A plurality of power supply terminals (not shown) are provided on the left and right sides (as viewed from the front of FIG. 5) of the upper surface of the amplifier 34-2 of the optical receiving device 31-2. The plurality of power supply terminals on the left side of the amplifier 34-2 are wire-bonded to the power supply terminal portion 56 on the left side of the case.

  Three power terminals (not shown) on the right side of the amplifier 34-2 and three bonding pads 39a to 39c for power connection are respectively wire-bonded. The power supply terminal of the light receiving element 33-2 and the bonding pad 39d for power connection are also wire-bonded.

  That is, by providing the bonding pads 38a to 38d and 39a to 39d for power supply connection, the power supply terminal on the right side of the amplifier 34-2 can be wire-bonded to the bonding pads 39a to 39d. Accordingly, when the power supply terminal on the right side of the amplifier 34-2 is connected to the power supply terminal portion 56 on the left side of the case by a wire, wiring of the power supply line is performed without crossing over the amplifier 34-2. Can do.

  According to the above-described third embodiment, the wirings of the power lines of the amplifiers 34-1 and 34-2 mounted on the two optical receiving devices 31-1 and 31-2 are bonded to the bonding pads 38a to 38d. By using it, the wiring length of the power supply line can be shortened. Thereby, since the inductance of the power supply line can be reduced, reflection of internal noise of the amplifiers 34-1 and 34-2 on the power supply line can be reduced, distortion of the waveform of the main signal can be reduced, and noise resistance can be improved. . Further, since there is no need to wire across the amplifiers 34-1 and 34-2, the number of power supply lines passing through one side of the amplifiers 34-1 and 34-2 can be reduced, and the distance between the power supply lines is reduced. Can be secured sufficiently. As a result, the stray capacitance of the power supply line can be reduced, and signal crosstalk can also be reduced.

  7A and 7B are diagrams illustrating an example of the structure of the optical receiving device. FIG. 7A shows an example in which one optical receiving device 31 is housed in a case. FIG. 7B shows an example in which two optical receiving devices are housed in a case.

  Sheets 36a to 36d each having a conductor pattern formed on one side and a conductor pattern are formed in the hatched portion 61 of the optical receiving device 31 (or 31-1, 31-2) shown in FIGS. 7A and 7B. Sheets 36e not being stacked are stacked and stored. In other drawings described below, the entire stacked sheets 36a to 36e are represented by hatched portions 61.

  The base member 32 is cut in a U shape in cross section so that the lower part of the light receiving element 33 is convex. Therefore, the sheets 36a to 36e (hereinafter, referred to as the sheet 36) are stored so as to bypass the convex portion 32b of the base member 32.

  On both sides of the light receiving element 33 on the upper surface of the base member 32, a plurality of bonding pads 38 for power connection and a plurality of bonding pads 39 are provided. Hereinafter, the entire bonding pads 38 a to 38 d in FIG. 3 are called bonding pads 38, and the entire bonding pads 39 a to 39 d are called bonding pads 39. The bonding pad 39 and the bonding pad 38 are electrically connected by the sheet 36.

FIGS. 8A and 8B are diagrams showing the structures of an end-face incident type and a front-side incident type optical receiving device.
FIG. 8A shows the structure of an optical receiving device 31 having an end face incident type light receiving element. The structure of the edge-receiving optical receiver 31 is the same as that shown in FIG.

FIG. 8B shows the structure of an optical receiving device 62 having a front-illuminated light receiving element 63. The light receiving element 63 is a type of light receiving element in which light enters from a direction vertically above the base member 32.
Also in this case, the structure of the bonding pads 38 and 39 for power supply connection and the sheet 36 for electrically connecting these bonding pads is the same as that in FIG.

  FIGS. 9A and 9B are diagrams showing another structure of the optical receiving device. FIG. 9A shows the structure of an optical receiving device 64 in which two light receiving elements 33-1 and 33-2 and two amplifiers 34-1 and 34-2 are mounted on the same base member. .

  The optical receiving device 64 of FIG. 9A has two light receiving elements 33-1 and 33-2 and two amplifiers 34-1 and 34-2 mounted on the upper surface of the same base member 65. Yes. The cross-sectional shape is an E-shaped cutout (hatched in FIG. 9A) so that the heat radiation convex portions 65-1 and 65-2 remain below the light receiving elements 33-1 and 33-2. (Shown part) 66 is formed. Although not shown in FIG. 9A, one or two sets of a plurality of stacked sheets 36a and 36b are inserted into the notch 66.

  On the upper surface (or insulating layer) of the sheet 36a or 36b, bonding pads 38-1a to 38-1b and 39-1a to 39-1b for connecting power sources and bonding pads 38-2a to 38-2b and 39-2a are connected. To 39-2b are provided. Note that although two bonding pads 38-1a and 38-1b are shown in FIG. 9A for ease of explanation, three or more bonding pads may be provided.

  For example, when a set of sheets 36a and 36b is inserted into the E-shaped cutout portion 66, a plurality of conductor patterns are formed on one or more sheets of the set of sheets 36a to 36b. And a through hole is formed in the position corresponding to the bonding pad of sheet | seat 36a, 36b. The pair of bonding pads 38-1a to 38-1b and bonding pads 39-1a to 39-1b on the right side (viewed from the front of FIG. 9A) are electrically connected by the through holes and the conductor pattern. To do. Similarly, the left side bonding pads 38-2a to 38-2b and the bonding pads 39-2a to 39-2b are connected by the above-described through hole and conductor pattern. In this case, two sets of bonding pads are electrically connected by one set of sheets 36a to 36b.

  When two sets of the first and second sheets 36a and 36b are inserted into the E-shaped cutout portion 66, through holes are respectively formed in the two sets of sheets. Then, the right side bonding pads 38-1a to 38-1b and the bonding pads 39-1a to 39-1b are electrically connected by the through holes and the conductor pattern of the first sheet. Further, the left side bonding pads 38-2a to 38-2b and the bonding pads 39-2a to 39-2b are connected by the through hole and the conductor pattern of the second sheet. In this case, the conductor pattern and the bonding pad can be connected not at the through hole but at the end portions of the first and second sheets.

  The optical receiving device 64 having the above structure can obtain the same effect as the optical receiving device 51 in which the two optical receiving devices 31-1 and 31-2 shown in FIG. 6 are housed. That is, the wire length of the power supply line can be shortened by wire bonding the power supply terminal on the left side of the amplifier 34-1 and the bonding pads 38-1a and 38-1b. Similarly, the wire length of the power supply line can be shortened by wire bonding the power supply terminal on the right side of the amplifier 34-2 and the bonding pads 39-2a and 39-2b. Thereby, the distortion of the signal waveform due to the inductance of the power supply line can be reduced. Further, since it is not necessary to wire power supply lines across the amplifiers 34-1 and 34-2, the number of power supply lines concentrated on one side of the amplifiers 34-1 and 34-2 can be reduced. A sufficient distance can be secured. As a result, the stray capacitance of the power supply line can be reduced and signal crosstalk can be reduced.

  Furthermore, since two sets of light receiving elements 33-1 and 33-2 and an amplifier 34-134-2 are mounted on the same base member 65, the size of the case of the optical receiving device can be reduced, and the cost can be reduced.

FIG. 9B shows an internal structure when two optical receiving devices 64 of FIG. 9A are housed in one case.
The optical receiving device 67 includes two optical receiving devices 64-1 and 64 in which two light receiving elements 33-1 and 33-2 and two amplifiers 34-1 and 34-2 are mounted on the same base member. -2.

  This optical receiving device 67 can obtain the same effect as the optical receiving device 64 shown in FIG. That is, since the wiring length of the power supply line connected to the power supply terminals of the amplifiers 34-1 and 34-2 can be shortened, distortion of the signal waveform due to the inductance of the power supply line can be reduced. Further, since it is not necessary to wire the power supply line across the amplifiers 34-1 and 34-2, the number of wirings concentrated on one side of the amplifiers 34-1 and 34-2 is reduced, and the power supply line line is reduced. A sufficient distance can be secured. As a result, the stray capacitance of the power supply line can be reduced and signal crosstalk can be reduced.

  FIG. 10 is a diagram schematically illustrating the structure of the optical receiving device 71 according to the fourth embodiment. One or a plurality of the optical receiving devices 71 are housed in a case, wire-bonded to a power supply terminal of the case, and then sealed and used as an optical receiving device.

The semiconductor chips of the light receiving element 33 and the amplifier 34 shown in FIG. 10 are the same as those in FIG. In the following, the same parts as those in FIG.
In the fourth embodiment, the base member 72 is not cut, and the bonding pads 38a to 38d for power connection and the bonding pads 39a to 39d are electrically connected using the flexible cable 77.

  The base member 72 corresponds to the base member 32 of FIG. 3, and for example, a metal material such as Kovar is used. On both sides of the main signal transmission path 35 of the component mounting surface 72a on the upper surface of the base member 72, a wiring board 73 and a wiring board 74 are attached by bonding or the like. The wiring boards 73 and 74 are insulating boards made of, for example, heat-resistant resin or ceramic.

  On the upper surface of the wiring substrate 73, bonding pads 38a to 38d for power connection are formed. The wiring board 73 is provided with a connector 75 for connecting a flexible cable 77. In addition, a wiring pattern for connecting the bonding pads 38 a to 38 d and the electrode of the connector 75 is formed on the wiring board 73. Alternatively, the bonding pads 38a to 38d and the electrode of the connector 75 may be directly connected. The bonding pads 38a to 38d are formed on the wiring board 73 by, for example, printing, plating, vapor deposition, or the like.

  On the upper surface of the wiring board 74, bonding pads 39a to 39d for power connection are formed. The wiring board 74 is provided with a connector 76 for connecting a flexible cable 77. A wiring pattern for connecting the bonding pads 39 a to 39 d and the electrode of the connector 76 is formed on the wiring board 74.

  The flexible cable (flexible wiring board) 77 is a flexible heat-resistant resin film, a ceramic film, or the like, and is formed with four conductor patterns 78a to 78d. The conductor patterns 78 a to 78 d are formed up to both ends of the flexible cable 77.

  By inserting both ends of the flexible cable 77 into the connectors 75 and 76 of the wiring boards 73 and 74, the bonding pads 38a to 38d and the bonding pads 39a to 39d can be electrically connected by the conductor patterns 78a to 78d. That is, the flexible cable 77 connects the bonding pads 38a to 38d and the bonding pads 39a to 39d on the side surface of the base member 72, that is, other than the component mounting surface 72a of the base member 72.

  According to the fourth embodiment described above, for example, when the power supply terminals provided on one side of the case and the power supply terminals provided on both sides of the amplifier 34 are wired, the following An effect is obtained. Wire wiring between the power supply terminal of the case and the power supply terminal on one side of the amplifier 34 (the side opposite to the side where the power supply terminal of the case is provided) is performed using the bonding pads 38a to 38d or 39a to 39d. be able to. This eliminates the need for wiring of the power supply line (wire) across the amplifier 34, thereby shortening the wiring length of the power supply line. The inductance can be reduced by shortening the wiring length of the power supply line. Therefore, the distortion of the main signal waveform due to reflection of internal noise of the amplifier 34 on the power supply line or the like can be reduced, and noise resistance can be improved. In addition, since it is not necessary to wire the amplifier 34 across, it is possible to reduce the number of power supply lines passing through the other side of the amplifier 34 (the same side as the side where the power supply terminal of the case is provided). A sufficient distance between the lines can be secured. As a result, the stray capacitance of the power supply line can be reduced, and signal crosstalk can also be reduced.

Furthermore, since the bonding pads 38a to 38d and the bonding pads 39a to 39d are electrically connected by the flexible cable 77, it is not necessary to cut the lower part of the component mounting surface 72a of the base member 32. Thereby, the process of cutting the base member 72 becomes unnecessary.
The connection member that connects the wiring board 73 and the wiring board 74 is not limited to the flexible cable 77, and may be another connection member.

  Next, FIG. 11 is a diagram schematically illustrating the structure of the optical receiving device 81 according to the fifth embodiment. In the fifth embodiment, a wiring board 82 having a conductor pattern formed on the side surface of a base member 72 is attached, and the left and right bonding pads 38a to 38d and bonding pads 39a to 39d are electrically connected by the conductor pattern of the wiring board 82. Connected to. Hereinafter, the same members as those in FIGS. 3 and 10 are denoted by the same reference numerals, and the description thereof is omitted.

In FIG. 11, a wiring substrate 82 is attached to the side surface of the base member 72 on the side where the optical signal is input (front side as viewed from the front of FIG. 11) by bonding or the like.
Connectors 85 and 86 for connecting flexible cables 83 and 84 are attached to the wiring board 82. The wiring board 82 is formed with four conductor patterns 87a to 87d. One end of each of the conductor patterns 87a to 87d is connected to an electrode (not shown) of the connector 85, and the other end of each of the conductor patterns 87a to 87d is connected to an electrode inside the connector 86.

  The flexible cable 83 is formed with a wiring pattern, and is inserted into the connector 75 of the wiring board 73 and the connector 85 of the wiring board 82 to electrically connect the connectors. The flexible cable 84 is similarly formed with a wiring pattern, and is inserted into the connector 76 of the wiring board 74 and the connector 86 of the wiring board 82 to electrically connect the connectors. As a result, the bonding pads 38 a to 38 d and the bonding pads 39 a to 39 d are electrically connected to the flexible cables 83 and 84 by the conductor patterns 87 a to 87 d of the wiring board 82.

  The connection between the wiring boards 73 and 74 and the side wiring board 82 is not limited to the method using the flexible cables 83 and 84, and other connection methods may be used. For example, the connector 85 of the wiring board 82 and the connector 75 of the wiring board 73 may be directly connected.

  According to the fifth embodiment described above, the same effects as in the fourth embodiment can be obtained. That is, it is possible to reduce the inductance by shortening the wiring length of the power supply line. Thereby, distortion of the waveform of the main signal can be reduced and noise resistance can be improved. Further, since it is not necessary to perform wire wiring across the amplifier 34, a sufficient distance between the power supply lines can be ensured. As a result, the stray capacitance of the power supply line can be reduced, and signal crosstalk can also be reduced.

  Further, since the bonding pads 38a to 38d and the bonding pads 39a to 39d can be electrically connected by the flexible cables 83 and 84 and the wiring board 82, it is necessary to cut the lower part of the component mounting surface of the base member 72. Disappear. Thereby, the process of cutting a part of base member 72 becomes unnecessary.

The structures of the fourth and fifth embodiments described above can also be applied to an optical receiving device 64 (FIG. 9A) in which two or more light receiving elements 33 and amplifiers 34 are mounted on the same base member 65.
When two or more light receiving elements 33 and amplifiers 34 are mounted on the same base member 72, two sets of bonding pads 38a to 38d and 39a to 39d provided on both sides of the light receiving element 33 are shown in FIG. Are connected by one or two flexible cables 77 shown in FIG. Alternatively, the wiring board 82 and the flexible cables 83 and 84 shown in FIG.

  In the first to third embodiments described above, the power supply connection bonding pads 38a to 38d and the bonding pads 39a to 39d are arranged on both sides of the light receiving element 33, and a part of the base member 32 is cut. Although the case has been described, it is not limited to such a structure. For example, when the light receiving element 33 is not provided between the bonding pads 38a to 38d for power supply connection and the bonding pads 39a to 39d, it is not necessary to provide the convex portion 32b for heat dissipation. 32a may be a rectangular parallelepiped shape. The optical receiving device is not limited to one equipped with one or a plurality of light receiving elements 33 and an amplifier 34, but can be applied to a device equipped with another semiconductor chip.

With respect to the embodiments including the first to fifth embodiments, the following additional notes are disclosed.
(Appendix 1)
A light receiving element mounted on the base member and an amplifier for amplifying the output of the light receiving element;
A plurality of first and second bonding pads for power connection disposed on both sides of the transmission path of the input or output signal of the light receiving element;
An optical receiving device having a plurality of first bonding pads and a connecting member for electrically connecting the plurality of second bonding pads, other than the component mounting surface of the base member.
(Appendix 2)
The connection member has a plurality of sheets which are insulating members, a conductor pattern is formed on one surface of the plurality of sheets, the plurality of sheets are stacked and inserted into a notch portion of the base member, The optical receiving device according to appendix 1, wherein the plurality of first bonding pads and the plurality of second bonding pads are electrically connected by the conductor patterns of a plurality of sheets.
(Appendix 3)
The connecting member has a plurality of sheets which are insulating members, a conductor pattern is formed on at least one of the plurality of sheets, and the plurality of sheets are stacked on a notch portion of the base member. The optical receiving device according to claim 1, wherein the optical receiving device is inserted and through holes are formed in the plurality of sheets to electrically connect the conductor pattern, the plurality of first bonding pads, and the plurality of second bonding pads.
(Appendix 4)
The connecting member has a plurality of sheets which are insulating members, and a conductor pattern is formed on two or more of the plurality of sheets, and the plurality of sheets are stacked and inserted into the notch portion of the base member. The supplementary note 1 wherein a through hole is formed in an arbitrary sheet of the plurality of sheets to electrically connect the conductor pattern, the plurality of first bonding pads, and the plurality of second bonding pads. Optical receiver device.
(Appendix 5)
A heat radiating convex portion is formed below the light receiving element, and the plurality of first and second bonding pads are disposed on both sides of the light receiving element so that the connecting member bypasses the convex portion. The optical receiving device according to Supplementary Note 1, 2, 3, or 4 to be disposed.
(Appendix 6)
A light receiving element mounted on the base member and an amplifier for amplifying the output of the light receiving element;
A first wiring which is disposed on one side of the base member on the component mounting surface across the transmission path of the input or output signal of the light receiving element and has a plurality of first bonding pads for power connection A substrate,
The second member is disposed on the other side of the base member on the component mounting surface across the transmission path of the input or output signal of the light receiving element, and a plurality of second bonding pads for power connection are formed. A wiring board;
An optical receiving device comprising: a connection member that electrically connects the plurality of first bonding pads of the first wiring board and the plurality of second bonding pads of the second wiring board.
(Appendix 7)
The connection member has a flexible wiring board formed with a conductor pattern, and electrically connects the plurality of first bonding pads and the plurality of second bonding pads by the conductor pattern of the flexible wiring board. The optical receiving device according to appendix 6.
(Appendix 8)
A light receiving element mounted on the base member and an amplifier for amplifying the output of the light receiving element;
A first wiring which is disposed on one side of the base member on the component mounting surface across the transmission path of the input or output signal of the light receiving element and has a plurality of first bonding pads for power connection A substrate,
The second member is disposed on the other side of the base member on the component mounting surface across the transmission path of the input or output signal of the light receiving element, and a plurality of second bonding pads for power connection are formed. A wiring board;
A conductor pattern attached to the side surface of the base member and electrically connecting the plurality of first bonding pads of the first wiring board and the plurality of second bonding pads of the second wiring board. And a third wiring board on which is formed.
(Appendix 9)
The optical receiving device according to appendix 8, further comprising a flexible wiring board that connects the third substrate, the first substrate, and the second substrate.
(Appendix 10)
One of the plurality of first bonding pads and the plurality of second bonding pads is wire-bonded to a power supply terminal of the case, and the other is wire-bonded to a power supply terminal provided on one side of the amplifier. 10. The optical receiving device according to any one of 9 above.
(Appendix 11)
First and second light receiving elements mounted on the same base member, and first and second amplifiers for amplifying outputs of the first and second light receiving elements, respectively;
A plurality of first and second bonding pads for power connection disposed on both sides of an input or output signal transmission path of the first light receiving element;
A plurality of third and fourth bonding pads for power connection disposed on both sides of an input or output signal transmission path of the second light receiving element;
The plurality of first bonding pads and the plurality of second bonding pads are electrically connected to other than the component mounting surface of the base member, and the plurality of third bonding pads and the plurality of fourth bonding pads are electrically connected. An optical receiving device comprising: a connection member that electrically connects the bonding pads.
(Appendix 12)
The connection member includes a plurality of first and second sheets that are insulating members and are stacked and inserted into a notch portion of the base member, and one of the first and second sheets A conductor pattern is formed on each of the surfaces, and the plurality of first bonding pads and the plurality of second bonding pads are electrically connected by the conductor pattern of the first plurality of sheets, and the second The optical receiving device according to appendix 11, wherein the plurality of third bonding pads and the plurality of fourth bonding pads are electrically connected by the conductor patterns of a plurality of sheets.
(Appendix 13)
The connection member has a plurality of sheets which are insulating members and are stacked and inserted into the cutout portion of the base member, and forms a conductor pattern on one or more of the plurality of sheets. Forming a through hole in an arbitrary sheet to electrically connect the conductor pattern of the plurality of sheets, the plurality of first bonding pads, and the plurality of second bonding pads, and the through holes The optical receiving device according to appendix 11, wherein the conductor pattern of the plurality of sheets, the plurality of third bonding pads, and the plurality of fourth bonding pads are electrically connected.
(Appendix 14)
The plurality of first and second bonding pads are formed on a first wiring board disposed on a component mounting surface of the base member,
The plurality of third and fourth bonding pads are formed on a second wiring board disposed on the component mounting surface,
The connection member includes a flexible wiring board on which a conductor pattern is formed, and the plurality of first bonding pads and the plurality of second bonding pads are electrically connected by the conductor pattern of the flexible wiring board. The optical receiving device according to appendix 11, wherein the plurality of third bonding pads and the plurality of fourth bonding pads are electrically connected while being connected.
(Appendix 15)
The connection member is attached to a side surface of the base member, and includes a third substrate on which a conductor pattern is formed, and a flexible wiring board that connects the third substrate, the first substrate, and the second substrate. The optical receiving device according to appendix 11.
(Appendix 16)
A first light receiving element mounted on a first base member and a first amplifier for amplifying an output of the first light receiving element;
A plurality of first and second bonding pads for power connection disposed on both sides of an input or output signal transmission path of the first light receiving element;
A first optical receiving device having a first connection member that electrically connects the plurality of first bonding pads and the plurality of second bonding pads, other than the component mounting surface of the first base member. When,
A second light receiving element mounted on the second base member and a second amplifier for amplifying the output of the second light receiving element;
A plurality of third and fourth bonding pads for power connection disposed on both sides of an input or output signal transmission path of the second light receiving element;
A second optical receiving device having a second connection member for electrically connecting the plurality of third bonding pads and the plurality of fourth bonding pads, other than the component mounting surface of the second base member. And
An optical receiving device in which the first optical receiving device and the second optical receiving device are enclosed in one case.
(Appendix 17)
The first and second connection members have a plurality of first and second sheets, which are insulating members, which are stacked and inserted into the notch portions of the base member, and the first and second sheets Conductive patterns are respectively formed on one surface of the plurality of sheets, and the conductive patterns of the first plurality of sheets, the plurality of first bonding pads, and the plurality of second bonding pads are electrically connected. The optical receiving device according to appendix 16, wherein the conductor pattern, the plurality of third bonding pads, and the plurality of fourth bonding pads of the second plurality of sheets are electrically connected.
(Appendix 18)
The first and second connection members have a plurality of sheets which are insulating members and are stacked and inserted into the notch portions of the base member, and one or more sheets among the plurality of sheets Forming a conductor pattern on the sheet, forming a through hole in an arbitrary sheet, electrically connecting the conductor pattern, the plurality of first bonding pads, and the plurality of second bonding pads through the through holes; The optical receiving device according to claim 16, wherein the conductor pattern, the plurality of third bonding pads, and the plurality of fourth bonding pads are electrically connected.

31, 41, 51 Optical receiving device 32 Base member 33 Light receiving element 34 Amplifier 35 Transmission paths 36a-36d Sheets 37a-37d Conductive patterns 38a-38d Bonding pads 39a-39d Bonding pads 42a-42d Conductive patterns 43a-43d Through holes 44a- 44d Through hole 55a, 55b, 55c Power supply line 52, 56 Power supply terminal

Claims (10)

A light receiving element mounted on the base member and an amplifier for amplifying the output of the light receiving element;
A plurality of first and second bonding pads for power connection disposed on both sides of the transmission path of the input or output signal of the light receiving element;
Wherein the bottom of the component mounting surface of the base member, have a connection member for electrically connecting the plurality of first bonding pads and said plurality of second bonding pads,
The connection member is inserted into a notch portion having a U-shaped cross-section of the base member.
Optical receiver device.   The connecting member has a plurality of sheets that are insulating members, and a conductor pattern is formed on one surface of each of the plurality of sheets, and the plurality of sheets are stacked and inserted into a notch portion of the base member, 2. The optical receiving device according to claim 1, wherein the conductor pattern of the plurality of sheets, the plurality of first bonding pads, and the plurality of second bonding pads are electrically connected.   The connecting member has a plurality of sheets which are insulating members, a conductor pattern is formed on at least one of the plurality of sheets, and the plurality of sheets are stacked on a notch portion of the base member. 2. The optical receiving device according to claim 1, wherein the optical receiving device is inserted and through holes are formed in the plurality of sheets to electrically connect the conductor pattern, the plurality of first bonding pads, and the plurality of second bonding pads.   The connecting member has a plurality of sheets which are insulating members, and a conductor pattern is formed on two or more of the plurality of sheets, and the plurality of sheets are stacked and inserted into the notch portion of the base member. 2. A through hole is formed in an arbitrary sheet of the plurality of sheets to electrically connect the conductor pattern, the plurality of first bonding pads, and the plurality of second bonding pads. Optical receiving device. A light receiving element mounted on the base member and an amplifier for amplifying the output of the light receiving element;
A first wiring which is disposed on one side of the base member on the component mounting surface across the transmission path of the input or output signal of the light receiving element and has a plurality of first bonding pads for power connection A substrate,
A second wiring arranged on the other side of the light receiving element on the component mounting surface of the base member with the transmission path of the input or output signal interposed therebetween, and formed with a plurality of second bonding pads for power connection A substrate,
An optical receiving device comprising: a connection member that electrically connects the plurality of first bonding pads of the first wiring board and the plurality of second bonding pads of the second wiring board. A light receiving element mounted on the base member and an amplifier for amplifying the output of the light receiving element;
A first wiring which is disposed on one side of the base member on the component mounting surface across the transmission path of the input or output signal of the light receiving element and has a plurality of first bonding pads for power connection A substrate,
A second wiring arranged on the other side of the light receiving element on the component mounting surface of the base member with the transmission path of the input or output signal interposed therebetween, and formed with a plurality of second bonding pads for power connection A substrate,
A third surface that is attached to a side surface of the base member and electrically connects the plurality of first bonding pads of the first wiring board and the plurality of second bonding pads of the second wiring board. An optical receiving device comprising a wiring board. First and second light receiving elements mounted on the same base member, and first and second amplifiers for amplifying outputs of the first and second light receiving elements, respectively;
A plurality of first and second bonding pads for power connection disposed on both sides of an input or output signal transmission path of the first light receiving element;
A plurality of third and fourth bonding pads for power connection disposed on both sides of an input or output signal transmission path of the second light receiving element;
The plurality of first bonding pads and the plurality of second bonding pads are electrically connected to other than the component mounting surface of the base member, and the plurality of third bonding pads and the plurality of fourth bonding pads are electrically connected. An optical receiving device comprising: a connection member that electrically connects the bonding pads.   The connection member has a plurality of sheets which are insulating members and are stacked and inserted into the cutout portion of the base member, and forms a conductor pattern on one or more of the plurality of sheets. A through hole is formed in an arbitrary sheet to electrically connect the conductor pattern, the plurality of first bonding pads and the plurality of second bonding pads, and the conductor pattern and the plurality of second bonding pads by the through hole. The optical receiving device according to claim 7, wherein a plurality of third bonding pads and the plurality of fourth bonding pads are electrically connected. The plurality of first and second bonding pads are formed on a first wiring board disposed on a component mounting surface of the base member,
The plurality of third and fourth bonding pads are formed on a second wiring board disposed on the component mounting surface,
The connection member has a flexible wiring board formed with a conductor pattern, and electrically connects the plurality of first bonding pads and the plurality of second bonding pads by the conductor pattern of the flexible wiring board. The optical receiving device according to claim 7, wherein the plurality of third bonding pads and the plurality of fourth bonding pads are electrically connected. A first light receiving element mounted on a first base member and a first amplifier for amplifying the output of the first light receiving element;
A plurality of first and second bonding pads for power connection disposed on both sides of an input or output signal transmission path of the first light receiving element;
A first optical receiving device having a first connection member that electrically connects the plurality of first bonding pads and the plurality of second bonding pads, other than the component mounting surface of the first base member. When,
A second light receiving element mounted on the second base member and a second amplifier for amplifying the output of the second light receiving element;
A plurality of third and fourth bonding pads for power connection disposed on both sides of an input or output signal transmission path of the second light receiving element;
A second optical receiving device having a second connection member for electrically connecting the plurality of third bonding pads and the plurality of fourth bonding pads, other than the component mounting surface of the second base member. And
Enclosing the first optical receiving device and the second optical receiving device in one case ;
The first connecting member is inserted into a first cutout portion having a U-shaped cross-section of the first base member, and the second connecting member has a cross-sectional shape of the second base member that is Inserted into the second cutout
Optical receiver device.