JP5516572B2 - Electronic component and electronic device - Google Patents

Description

  The present invention relates to an electronic component and an electronic device, and more particularly to an electronic component and an electronic device including a coil and a capacitor.

  As a conventional electronic component, for example, an LC resonant component described in Patent Document 1 is known. FIG. 7A is a cross-sectional structure diagram of the LC resonant component 110 described in Patent Document 1. FIG. FIG. 7B is a diagram in which the LC resonant component 110 is mounted on the circuit board 120.

  As shown in FIG. 7A, the LC resonant component 110 includes a multilayer body 112, external electrodes 114a and 114b, internal conductors 116a to 116e, and via-hole conductors B1 to B5. The stacked body 112 is configured by stacking a plurality of rectangular insulating layers. The external electrodes 114a and 114b are provided on the side surface of the stacked body 112 and face each other. The external electrodes 114a and 114b are connected to the ground.

  The inner conductors 116a to 116c are provided in parallel to each other and connect the outer electrodes 114a and 114b. The inner conductors 116d and 116e are provided below the inner conductors 116a to 116c in the stacking direction, and constitute a capacitor by facing each other. The internal conductor 116d is connected to two external electrodes (not shown) through which signals are input and output. The inner conductor 116e is connected to the outer electrodes 114a and 114b.

  The via-hole conductors B1, B2, B4, and B5 extend in the stacking direction, connect the internal conductors 116a to 116c, and function as coils. The via-hole conductor B3 extends in the stacking direction, connects the internal conductors 116a to 116d, and functions as a coil. According to the LC resonant component 110 as described above, a resonant circuit is formed in which a coil and a capacitor are connected in parallel between two external electrodes (not shown) for inputting and outputting signals.

  The LC resonant component 110 is mounted on a circuit board 120 and used as shown in FIG. At this time, the LC resonant component 110 is covered with the metal case 122. Thereby, it is suppressed that the noise from the outside penetrates into the LC resonance component 110 and other mounting components.

  However, in the LC resonant component 110, noise may still enter. More specifically, as shown in FIG. 7B, the LC resonant component 110 may be disposed in the vicinity of the metal case 122. In this case, the external electrode 114 b of the LC resonant component 110 faces the metal case 122. As a result, the external electrode 114b and the metal case 122 are magnetically coupled and capacitively coupled. As shown in FIG. 7A, the external electrode 114b is connected to the via-hole conductors B1 to B5 through the internal conductors 116a to 116c. A signal flows through the via-hole conductors B1 to B5. Therefore, when the external electrode 114b and the metal case 122 are magnetically coupled and capacitively coupled, the noise absorbed by the metal case 122 enters the signal flowing through the via-hole conductors B1 to B5 via the external electrode 114b and the internal conductors 116a to 116c. Resulting in.

  In the LC resonant component 110, the internal conductor 116a to which the via-hole conductors B1 to B5 through which signals flow is connected is provided in the vicinity of the upper surface of the multilayer body 112. Therefore, the inner conductor 116a and the metal case 122 are magnetically coupled and capacitively coupled. As a result, the noise absorbed by the metal case 122 enters the signal flowing through the via-hole conductors B1 to B5 via the internal conductor 116a.

Japanese Patent Laid-Open No. 9-186049

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component and an electronic device that can prevent noise from entering through a metal case provided on a substrate.

An electronic device according to a first aspect of the present invention includes a substrate, an electronic component mounted on the substrate, and a metal case, and the electronic component is a stacked layer in which a plurality of insulator layers are stacked. A plurality of internal conductors constituting a coil and a capacitor built in the multilayer body, a first ground external electrode provided on a side surface of the multilayer body, and a side surface of the multilayer body And a second ground external electrode facing the first ground external electrode, wherein the metal case faces the second ground external electrode, The first ground external electrode does not face the metal case when mounted, and the second ground external electrode faces the metal case when mounted , and covers the electronic component. Constituting the internal guide , The is connected to the first external electrode for grounding, and that is not connected to the second external electrode for grounding, characterized by.

An electronic component according to the second embodiment of the present invention includes a laminate in which a plurality of insulator layers are laminated, and a plurality of internal conductors constituting coils and capacitors built in the laminate. The inner conductor constituting the coil is provided on the upper side in the stacking direction than the inner conductor constituting the capacitor, and the inner conductor provided on the uppermost side in the stacking direction. The dielectric layer provided on the upper side in the stacking direction is lower in relative dielectric constant than the insulator layer provided on the lower side in the stacking direction than the inner conductor provided on the uppermost side in the stacking direction. It is characterized by having a rate.

An electronic device according to a third aspect of the present invention includes a substrate, the electronic component according to the second embodiment mounted on the substrate, and a metal case covering the electronic component. It is characterized by this.

  According to the present invention, it is possible to suppress noise from entering through the metal case provided on the substrate.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on 1st Embodiment. FIG. 3 is a perspective view of an electronic device in which the electronic component of FIG. 2 is mounted on a circuit board. FIG. 3 is an equivalent circuit diagram of the electronic component of FIG. 2. It is a disassembled perspective view of the laminated body of the electronic component which concerns on 2nd Embodiment. FIG. 6 is a perspective view of an electronic device in which the electronic component of FIG. 5 is mounted on a circuit board. FIG. 7A is a cross-sectional structure diagram of the LC resonant component described in Patent Document 1. FIG. FIG. 7B is a diagram in which the LC resonant component is mounted on a substrate.

  Hereinafter, an electronic component and an electronic device according to an embodiment of the present invention will be described.

(First embodiment)
(Configuration of electronic parts)
Hereinafter, the configuration of the electronic component according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of electronic components 10a and 10b according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the multilayer body 12a of the electronic component 10a. FIG. 3 is a perspective view of an electronic device 50 a in which the electronic component 10 a is mounted on the circuit board 30. FIG. 4 is an equivalent circuit diagram of the electronic component 10a. Hereinafter, the stacking direction of the electronic component 10a is defined as the z-axis direction, the direction along the long side of the electronic component 10a is defined as the x-axis direction, and the direction along the short side of the electronic component 10a is defined as the y-axis direction. To do. The origin in the x-axis direction, y-axis direction, and z-axis direction is the center of the electronic component 10a.

  As shown in FIGS. 1 and 2, the electronic component 10a includes a laminated body 12a, external electrodes 14 (14a to 14d), a recognition mark 15, internal conductors 18 (18a to 18h), and via-hole conductors b (b1, b2). I have.

  As shown in FIG. 2, the multilayer body 12a is formed by laminating a plurality of rectangular dielectric layers 16 (16a to 16g) in this order, and has a rectangular parallelepiped shape. As shown in FIG. 1, the external electrode 14a is provided on the side surface on the negative direction side in the x-axis direction of the multilayer body 12a and is used as a signal input terminal. As shown in FIG. 1, the external electrode 14b is provided on the side surface on the positive side in the x-axis direction of the multilayer body 12a, and is used as a signal output terminal. The external electrode 14c is provided on the side surface on the negative side in the y-axis direction of the multilayer body 12a and is used as a ground terminal. The external electrode 14d is provided on the side surface on the positive side in the y-axis direction of the multilayer body 12a and is used as a ground terminal. The external electrode 14d is opposed to the external electrode 14c.

  The recognition mark 15 is provided on the upper surface of the laminated body 12a on the positive side in the z-axis direction, and is used for identifying the direction of the electronic component 10a during mounting.

  The dielectric layer 16 is a rectangular insulating layer made of, for example, a Ba—Al—Si based dielectric ceramic. The inner conductor 18 is made of a conductive material mainly composed of Cu, and constitutes coils L1 and L2 and capacitors C1 to C3 built in the multilayer body 12a. More specifically, each of the inner conductors 18a and 18b extends from the negative side in the y-axis direction toward the positive direction in the y-axis direction on the main surface of the dielectric layer 16b. Part of the coils L1 and L2 is configured. However, the inner conductors 18a and 18b are not drawn out to the side on the positive direction side in the y-axis direction. Therefore, the internal conductors 18a and 18b are connected to the external electrode 14c but are not connected to the external electrode 14d.

  The internal conductors 18c and 18d are provided on the main surface of the dielectric layer 16c so as to overlap with the internal conductors 18a and 18b and the dielectric layer 16b when viewed in plan from the z-axis direction. The internal conductor 18c is connected to the external electrode 14a by being drawn out to the side on the negative side in the x-axis direction in the dielectric layer 16c. Similarly, the internal conductor 18d is connected to the external electrode 14b by being drawn out to the side on the positive direction side in the x-axis direction in the dielectric layer 16c.

  The via-hole conductor b1 passes through the dielectric layer 16b in the z-axis direction, and connects the internal conductor 18a and the internal conductor 18c. The via-hole conductor b2 penetrates the dielectric layer 16b in the z-axis direction, and connects the internal conductor 18b and the internal conductor 18d. Via-hole conductors b1 and b2 constitute part of coils L1 and L2, respectively. The inner conductor 18a and the via hole conductor b1 constitute the coil L1 in FIG. The internal conductor 18b and the via-hole conductor b2 constitute the coil L2 in FIG. The via-hole conductor b is made of, for example, a conductive material whose main component is copper.

  The inner conductor 18e is provided on the dielectric layer 16d so as to face the inner conductors 18c and 18d with the dielectric layer 16c interposed therebetween when viewed in plan from the z-axis direction. Thus, the inner conductors 18c and 18e constitute the capacitor C1 in FIG. The internal conductors 18d and 18e also constitute the capacitor C1 in FIG. As shown in FIG. 2, the inner conductor 18 e is provided at the center of the dielectric layer 16 d and is not connected to any of the outer electrodes 14.

  Each of the internal conductors 18f and 18g is provided on the main surface of the dielectric layer 16e so as to overlap with the internal conductor 18e and the dielectric layer 16d when viewed in plan from the z-axis direction. Thereby, the internal conductors 18e and 18f constitute the capacitor C1 of FIG. Further, the inner conductors 18e and 18g also constitute the capacitor C1 in FIG. The internal conductor 18f is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 16e. Similarly, the internal conductor 18g is connected to the external electrode 14b by being drawn out to the side on the positive direction side in the x-axis direction in the dielectric layer 16e.

  The inner conductor 18h is provided on the dielectric layer 16f so as to face the inner conductors 18f and 18g with the dielectric layer 16e interposed therebetween when viewed in plan from the z-axis direction. Thereby, the inner conductors 18f and 18h constitute the capacitor C2 in FIG. 4, and the inner conductors 18g and 18h constitute the capacitor C3 in FIG. As shown in FIG. 2, the internal conductor 18h is connected to the external electrodes 14c and 14d by being drawn out to the positive side and the negative side in the y-axis direction in the dielectric layer 16f. Has been.

  By laminating the dielectric layers 16a to 16g as described above, the internal conductors 18a and 18b and the via-hole conductors b1 and b2 constituting the coils L1 and L2 are the internal conductors constituting the capacitors C1 to C3. It is provided on the positive direction side in the z-axis direction from 18c to 18h.

  By the way, the electronic component 10a is mounted on the circuit board 30 as shown in FIG. A metal case 32 is provided so as to cover the main surface of the circuit board 30. The metal case 32 has a side surface portion 32a and an upper surface portion 32b, and plays a role of suppressing external noise from entering the electronic component 10a and the like. The side surface portion 32a is attached perpendicular to the circuit board 30 and faces the external electrode 14d. The upper surface portion 32 b is connected to the side surface portion 32 a and covers the main surface of the circuit board 30 with a predetermined distance from the main surface of the circuit board 30. Thereby, the electronic component 10 a is covered with the metal case 32. However, the metal case 32 does not face the external electrode 14c.

(effect)
According to the electronic component 10a and the electronic device 50a configured as described above, it is possible to suppress noise from entering the electronic component 10a through the metal case 32 as described below. More specifically, in the LC resonant component 110 shown in FIG. 7, the external electrode 114b and the metal case 122 face each other, and the external electrode 114b and the internal conductors 116a to 116c are connected. Therefore, the noise absorbed by the metal case 122 has entered the via-hole conductors B1 to B5 constituting the coil via the external electrode 114b and the internal conductors 116a to 116c.

  Therefore, in the electronic component 10a, the inner conductors 18a and 18b constituting the coils L1 and L2 are not connected to the outer electrode 14d facing the metal case 32. Therefore, the noise absorbed by the metal case 32 does not enter the laminated body 12a from the internal electrodes 18a and 18b from the external electrode 14b. Therefore, in the electronic component 10a and the electronic device 50a, it is possible to prevent noise from entering the electronic component 10a through the metal case 32.

  In particular, in the electronic component 10a, the inner conductors 18a and 18b constituting the coils L1 and L2 are provided above the inner conductors 18c to 18h constituting the capacitors C1 to C3 in the z-axis direction. Furthermore, in the electronic component 10a, the inner conductors 18a and 18b are provided on the uppermost side in the z-axis direction. Therefore, the inner conductors 18a and 18b are easily affected by noise from the metal case 32 because the distance between the inner conductors 18a and 18b is shorter than the inner conductors 18c to 18h. Therefore, by not connecting the internal conductors 18a and 18b to the external electrode 14d, it is possible to effectively suppress noise from entering the internal conductors 18a and 18b from the metal case 32.

  In the electronic component 10a, as shown in FIGS. 2 and 3, the internal conductors 18a and 18b are provided only between the via-hole conductors b1 and b2 and the external electrode 14c, respectively. Therefore, the internal conductors 18a and 18b are not provided on the external electrode 14d side than the via-hole conductors b1 and b2. Therefore, the size of the area where the inner conductors 18a, 18b and the metal case 32 face each other is reduced. As a result, magnetic coupling and capacitive coupling between the inner conductors 18a and 18b and the metal case 32 are reduced. Therefore, it is possible to prevent noise from entering the inner conductors 18a and 18b from the metal case 32.

  In the electronic component 10a, a plurality (two) of internal conductors 18a and 18b constituting the coils L1 and L2 are provided on the same dielectric layer 16b. Furthermore, a plurality (two) of via-hole conductors b1 and b2 are provided so as to be connected to the internal conductors 18a and 18b, respectively. Thereby, the coil L1 and the coil L2 come close to each other. As a result, the magnetic coupling between the coil L1 and the coil L2 can be strengthened.

(Second Embodiment)
(Configuration of electronic parts)
The configuration of the electronic component according to the second embodiment of the present invention will be described below with reference to the drawings. FIG. 5 is an exploded perspective view of the multilayer body 12b of the electronic component 10b. FIG. 6 is a perspective view of an electronic device 50 b in which the electronic component 10 b is mounted on the circuit board 30. Hereinafter, the stacking direction of the electronic component 10b is defined as the z-axis direction, the direction along the long side of the electronic component 10b is defined as the x-axis direction, and the direction along the short side of the electronic component 10b is defined as the y-axis direction. To do. The origin in the x-axis direction, y-axis direction, and z-axis direction is the center of the electronic component 10b. 1 and 4 are used for an external perspective view and an equivalent circuit diagram of the electronic component 10b.

  As shown in FIGS. 1 and 5, the electronic component 10b includes a laminated body 12b, external electrodes 14 (14a to 14d), a recognition mark 15, internal conductors 68 (68a to 68h), and via-hole conductors b (b11 and b12). I have.

  As shown in FIG. 5, the multilayer body 12 b is configured by laminating a plurality of rectangular dielectric layers 65 (65 a) and 66 (66 b to 66 g) in this order, and forms a rectangular parallelepiped shape. Yes. As shown in FIG. 1, the external electrode 14a is provided on the side surface on the negative direction side in the x-axis direction of the multilayer body 12b, and is used as a signal input terminal. As shown in FIG. 1, the external electrode 14 b is provided on the side surface on the positive side in the x-axis direction of the multilayer body 12 b and is used as a signal output terminal. The external electrode 14c is provided on the side surface on the negative direction side in the y-axis direction of the multilayer body 12b and is used as a ground terminal. The external electrode 14d is provided on the side surface on the positive side in the y-axis direction of the multilayer body 12b and is used as a ground terminal. The external electrode 14c is opposed to the external electrode 14d.

  The recognition mark 15 is provided on the upper surface of the laminated body 12b on the positive side in the z-axis direction, and is used for identifying the direction of the electronic component 10b during mounting.

  The dielectric layers 65 and 66 are rectangular insulating layers made of, for example, a Ba—Al—Si based dielectric ceramic. The inner conductor 68 is made of a conductive material containing Cu as a main component, and constitutes coils L1 and L2 and capacitors C1 to C3 built in the multilayer body 12b. More specifically, the inner conductors 68a and 68b extend from the negative side in the y-axis direction to the positive side in the y-axis direction on the main surface of the dielectric layer 66b, and the coil L1. , L2 are part of the configuration. Thereby, the inner conductors 68a and 68b are connected to the outer electrodes 14c and 14d.

  The internal conductors 68c and 68d are provided on the main surface of the dielectric layer 66c so as to overlap with the internal conductors 68a and 68b and the dielectric layer 66b when viewed in plan from the z-axis direction. The internal conductor 68c is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 66c. Similarly, the internal conductor 68d is connected to the external electrode 14b by being drawn out to the side on the positive side in the x-axis direction in the dielectric layer 66c.

  The via-hole conductor b11 passes through the dielectric layer 66b in the z-axis direction, and connects the internal conductor 68a and the internal conductor 68c. The via-hole conductor b12 passes through the dielectric layer 66b in the z-axis direction, and connects the internal conductor 68b and the internal conductor 68d. The via-hole conductors b11 and b12 constitute part of the coils L1 and L2, respectively. The internal conductor 68a and the via hole conductor b11 constitute the coil L1 in FIG. The inner conductor 68b and the via-hole conductor b12 constitute the coil L2 in FIG. The via-hole conductor b is made of, for example, a conductive material whose main component is copper.

  The internal conductor 68e is provided on the dielectric layer 66d so as to face the internal conductors 68c and 68d with the dielectric layer 66c interposed therebetween when viewed in plan from the z-axis direction. As a result, the internal conductors 68c and 68e constitute the capacitor C1 of FIG. The internal conductors 68d and 68e also constitute the capacitor C1 in FIG. As shown in FIG. 5, the inner conductor 68 e is provided in the center of the dielectric layer 66 d and is not connected to any of the outer electrodes 14.

  Each of the internal conductors 68f and 68g is provided on the main surface of the dielectric layer 66e so as to overlap with the internal conductor 68e and the dielectric layer 66d when viewed in plan from the z-axis direction. Thus, the inner conductors 68e and 68f constitute the capacitor C1 in FIG. The internal conductors 68e and 68g also constitute the capacitor C1 in FIG. The internal conductor 68f is connected to the external electrode 14a by being drawn out to the side on the negative direction side in the x-axis direction in the dielectric layer 66e. Similarly, the internal conductor 68g is connected to the external electrode 14b by being drawn out to the side on the positive side in the x-axis direction in the dielectric layer 66e.

  The internal conductor 68h is provided on the dielectric layer 66f so as to face the internal conductors 68f and 68g with the dielectric layer 66e interposed therebetween when viewed in plan from the z-axis direction. Thereby, the inner conductors 68f and 68h constitute the capacitor C2 of FIG. 4, and the inner conductors 68g and 68h constitute the capacitor C3 of FIG. As shown in FIG. 5, the inner conductor 68h is connected to the outer electrodes 14c and 14d by being drawn out to the positive side and the negative side in the dielectric layer 66f. Has been.

  By laminating the dielectric layers 65a, 66b to 66g as described above, the internal conductors 68a and 68b and the via-hole conductors b11 and b12 constituting the coils L1 and L2 constitute the capacitors C1 to C3. The internal conductors 68c to 68h are provided on the positive direction side in the z-axis direction.

  Further, the dielectric layer 65a is provided on the positive side in the z-axis direction with respect to the inner conductors 68a and 68b provided on the most positive side in the z-axis direction, and z is located on the z-direction with respect to the inner conductors 68a and 68b. The dielectric constant is lower than that of the dielectric layer 66 provided on the negative side in the axial direction.

  By the way, the electronic component 10b is mounted on the circuit board 30 as shown in FIG. A metal case 32 is provided so as to cover the main surface of the circuit board 30. The metal case 32 has a side surface portion 32a and an upper surface portion 32b, and plays a role of suppressing external noise from entering the electronic component 10b and the like. The side surface portion 32a is attached perpendicular to the circuit board 30 and faces the external electrode 14d. The upper surface portion 32 b is connected to the side surface portion 32 a and covers the main surface of the circuit board 30 with a predetermined distance from the main surface of the circuit board 30. Thereby, the electronic component 10 b is covered with the metal case 32. However, the metal case 32 does not face the external electrode 14c.

(effect)
According to the electronic component 10b and the electronic device 50b configured as described above, it is possible to suppress noise from entering the electronic component 10b through the metal case 32 as described below. More specifically, in the LC resonant component 110 shown in FIG. 7, the inner conductor 116 a faces the metal case 122 and is capacitively coupled to the metal case 122. Therefore, the noise absorbed by the metal case 122 may enter the LC resonant component 110 through the internal conductor 116a.

  Therefore, in the electronic component 10b, the dielectric layer 65a provided on the positive side in the z-axis direction relative to the internal conductors 68a and 68b provided on the most positive direction side in the z-axis direction includes the internal conductor 68a, It has a relative dielectric constant lower than that of the dielectric layer 66 provided on the negative side in the z-axis direction from 68b. Thereby, stray capacitance generated between the inner conductors 68a and 68b and the upper surface portion 32b of the metal case 32 is reduced. As a result, according to the electronic component 10b, it is possible to prevent noise from entering the electronic component 10b via the metal case 32.

  In particular, in the electronic component 10b, the inner conductors 68a and 68b constitute coils L1 and L2. Therefore, a signal flows through the internal conductors 68a and 68b. Therefore, by reducing the stray capacitance between the inner conductors 68a and 68b and the metal case 32, it is possible to more effectively suppress noise from entering the signal in the electronic component 10b.

(Method for manufacturing electronic parts)
Below, the manufacturing method of the electronic component 10a is demonstrated, referring FIG.1 and FIG.2. Note that the manufacturing method of the electronic component 10b is basically the same as the manufacturing method of the electronic component 10a, and thus description thereof is omitted.

First, a ceramic green sheet to be the dielectric layer 16 is prepared. Specifically, each material obtained by weighing barium oxide (BaO), aluminum oxide (Al ₂ O ₃ ), and silicon oxide (SiO ₂ ) at a predetermined ratio is put into a ball mill as a raw material, and wet blending is performed. The obtained mixture is dried and pulverized, and the obtained powder is calcined. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a dielectric ceramic powder.

  A binder, a plasticizer, a wetting material, and a dispersing agent are added to the dielectric ceramic powder, mixed by a ball mill, and then defoamed by decompression. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the dielectric layer 16.

  Next, via-hole conductors b1 and b2 are formed in each ceramic green sheet to be the dielectric layer 16b. Specifically, a via hole is formed by irradiating a ceramic green sheet to be the dielectric layer 16b with a laser beam. Next, the via hole is filled with a conductive paste such as Ag, Pd, Cu, Au or an alloy thereof by a method such as printing.

  Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied on the ceramic green sheets to be the dielectric layers 16b to 16f by a method such as a screen printing method or a photolithography method. By applying, the inner conductors 18a to 18h are formed. The step of forming the inner conductors 18a to 18h and the step of filling the via hole with the conductive paste may be performed in the same step.

  Next, each ceramic green sheet is laminated. Specifically, a ceramic green sheet to be the dielectric layer 16g is disposed. The carrier film of the ceramic green sheet to be the dielectric layer 16g is peeled off, and the ceramic green sheet to be the dielectric layer 16f is disposed on the ceramic green sheet to be the dielectric layer 16g. Thereafter, the ceramic green sheet to be the dielectric layer 16f is pressure-bonded to the ceramic green sheet to be the dielectric layer 16g. The discharge method of the carrier film is discharge by suction and grabbing discharge by a chuck. Thereafter, the ceramic green sheets to be the dielectric layers 16e, 16d, 16c, 16b, and 16a are similarly laminated and pressure-bonded in this order. Thereby, a mother laminated body is formed. The mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like.

  Next, the mother laminated body is cut into a laminated body 12a having a predetermined size with a cutting blade. Thereby, the unsintered laminated body 12a is obtained. This unfired laminate 12a is subjected to binder removal processing and firing.

  The fired laminated body 12a is obtained through the above steps. The laminated body 12a is barrel-processed and chamfered. Thereafter, a copper electrode to be the external electrodes 14a to 14d is formed on the surface of the laminate 12a by applying and baking an electrode paste whose main component is copper by a method such as an immersion method.

  Finally, external electrodes 14a to 14d are formed by performing Ni plating / Sn plating on the surface of the copper electrode. Through the above steps, an electronic component 10a as shown in FIG. 1 is completed.

(Other embodiments)
The electronic component and the electronic device according to the present invention are not limited to the electronic components 10a and 10b and the electronic devices 50a and 50b shown in the above-described embodiment, and can be changed within the scope of the gist thereof.

  The internal conductors 18a and 18b of the electronic component 10a and the magnetic layer 65a of the electronic component 10b may be combined. By combining these, it is possible to more effectively suppress noise from entering the electronic components 10a and 10b. A resin may be used as the dielectric layer.

  The present invention is useful for electronic components and electronic devices, and is particularly excellent in that noise can be prevented from entering through a metal case provided on a substrate.

C1 to C3 Capacitors L1, L2 Coils b1, b2, b11, b12 Via-hole conductors 10a, 10b Electronic parts 12a, 12b Laminated bodies 14a-14d External electrodes 16a-16g, 65a, 66b-66g Dielectric layers 18a-18h, 68a- 68h Inner conductor 30 Circuit board 32 Metal case 32a Side surface portion 32b Upper surface portion 50a, 50b Electronic device

Claims (7)

A substrate,
Electronic components mounted on the substrate;
A metal case,
With
The electronic component is
A laminate formed by laminating a plurality of insulator layers;
A plurality of internal conductors constituting a coil and a capacitor built in the laminate; and
A first ground external electrode provided on a side surface of the laminate;
A second ground external electrode provided on a side surface of the multilayer body and facing the first ground external electrode;
With
The metal case covers the electronic component in a state facing the second ground external electrode;
The first ground external electrode does not face the metal case when mounted,
The second ground external electrode faces the metal case at the time of mounting,
The internal conductor constituting the coil is connected to the first ground external electrode and not connected to the second ground external electrode;
An electronic device characterized by the above. The inner conductor constituting the coil is provided above the inner conductor constituting the capacitor in the stacking direction;
The electronic device according to claim 1. A via-hole conductor constituting a part of the coil,
In addition,
One end of the internal conductor constituting the coil is connected to the first ground external electrode,
The other end of the inner conductor constituting the coil is connected to the via-hole conductor;
The electronic device according to claim 2. A plurality of the inner conductors constituting the coil are provided on the same insulator layer,
A plurality of the via-hole conductors are provided so as to be connected to each of the plurality of inner conductors provided on the same insulator layer;
The electronic device according to claim 3. The insulator layer provided above the inner conductor provided in the uppermost layer in the stacking direction is lower than the inner conductor provided in the uppermost layer in the stacking direction. Having a dielectric constant lower than that of the insulator layer provided in
The electronic device according to any one of claims 1 to 4, wherein A laminate formed by laminating a plurality of insulator layers;
A plurality of internal conductors constituting a coil and a capacitor built in the laminate; and
With
The inner conductor constituting the coil is provided above the inner conductor constituting the capacitor in the stacking direction,
The insulator layer provided above the inner conductor provided in the uppermost layer in the stacking direction is lower than the inner conductor provided in the uppermost layer in the stacking direction. Having a dielectric constant lower than that of the insulator layer provided in
Electronic parts characterized by A substrate,
The electronic component according to claim 6 mounted on the substrate;
A metal case covering the electronic component;
Having
An electronic device characterized by the above.

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