JP5500276B2 - Substrate with character symbol - Google Patents

Description

The present invention relates to a phase shift mask for manufacturing semiconductors, a mask for processing optical products, and other optical products, and in particular, a slit-like or lattice-like pattern composed of a concave groove formed by engraving a substrate on one side of the substrate, characters and / or provided at a predetermined region tailored to the symbol shape of only about the substrate that have a character symbol section that is a character symbol section.

In recent years, there has been a strong demand for higher density and miniaturization of semiconductor chip circuits. As a photomask for transferring a finer circuit pattern to a resist on a wafer, a circuit pattern is formed with a conventional light-shielding part and transparent part. Binary masks that are being used have reached their limits.
In response to these demands, the progress of optical lithography technology is remarkable. Recently, as a technique for improving the resolution of a projection exposure apparatus, the phases of light transmitted through two adjacent transparent portions on a photomask are changed, A phase shift method for increasing the pattern resolution is employed.
In addition, various phase shift masks used for this phase shift method have been developed and used according to the purpose, respectively. Many have come to be used.
Further, although not mainly for semiconductor manufacturing, a substrate-engraved chromeless phase shift mask has also been used for optical fiber processing and the like as a mask for processing optical products.
In addition, since the light shielding layer used for various phase shift masks is a chromium-based metal layer such as a chromium layer, a chromium oxide layer, a chromium oxynitride layer, etc. A phase shift mask in which a concave groove is formed and used as a shifter portion is called a substrate-engraved chromeless phase shift mask.

In the transfer photomask, it is also required to arrange characters and symbols on the mask, and in order to form the characters and symbols on the mask along with the production of the circuit pattern of the mask portion, the work It is becoming increasingly complex.
Since it is required to form characters and symbols in the photomask manufacturing process as much as possible, conventionally, for example, a substrate-engraved chromeless phase shift mask is shown in FIG. The character “2” in the B1 part is formed by opening a light shielding film as shown in FIG. 3B, and an enlarged schematic plan view of the B2 part is as shown in FIG. 3C. The cross-sectional view taken along B3-B4 in FIG. 3C was formed as shown in FIG.
The manufacture of the conventional substrate-engraved chromeless phase shift mask is performed by forming the character / symbol portion simultaneously with the process of forming the pattern.
However, in the method of manufacturing the substrate-engraved chromeless phase shift mask, following the character and symbol forming step, there is a step of wet etching part or all of the light-shielding film. The characters sometimes disappeared as shown in FIGS. 3 (c1) and 3 (d1).
For this reason, a method of covering characters and symbols with a wet etching-resistant protective film and performing wet etching to prevent the disappearance of patterned characters and symbols was also adopted. There existed problems, such as remaining in the vicinity, the process of apply | coating a protective film increased, and working efficiency worsened.
FIG. 3A is a schematic plan view in the middle of processing of a conventional engraved chromeless phase shift mask having characters and symbols, and FIG. 3B is a diagram of characters B1 in FIG. 3C is an enlarged schematic view, FIG. 3C is an enlarged view of a portion B2 in FIG. 3B, FIG. 3D is a cross-sectional view taken along B3-B4 in FIG. (C1) and FIG. 3 (d1) are the states after processing corresponding to FIG. 3 (c) and FIG. 3 (d), respectively.
In FIG. 3, reference numeral 200 denotes a phase shift mask, 210 denotes a transparent substrate, 220 denotes a main pattern portion, 230 denotes a character symbol portion, 231 denotes a light shielding film, 232 denotes an opening (of the light shielding film), and 215 denotes a concave groove portion. is there.

Japanese Patent Laid-Open No. 11-204419

As described above, conventionally, in the production of the phase shift mask chromeless substrate engraving type, without problems in quality, the working efficiency, a character, a symbol can disposed shall had sought Me.
An object of the present invention is to provide a substrate having a character / symbol part on which characters and symbols can be arranged with no problem in quality and with high work efficiency.

A substrate having a character symbol section of the present invention, on one surface of a transparent substrate for semiconductor manufacturing, a substrate is disposed and a character symbol unit composed of a circuit pattern and the character and / or symbol, and the circuit pattern The character symbol part is a pattern composed of a concave groove engraved with the transparent substrate, and is formed on the same surface of the transparent substrate, and the character symbol part includes the transparent substrate. It has a slit-like or lattice-like pattern composed of engraved concave grooves in a predetermined region that matches the shape of characters and / or symbols , and the transparent substrate is a glass substrate, and the glass substrate is used as an original plate. It is a substrate for producing a mold having concavities and convexities reversed .
And it is a board | substrate which has said character symbol part, Comprising: The width | variety of the groove part and the width | variety of the space between groove parts are comprised by the slit shape or a grid | lattice-like pattern, It is characterized by the above-mentioned. It is.
And it is a board | substrate which has a character symbol part of any one of the above-mentioned, Comprising: A character symbol part is an alignment mark, an area code, and a barcode, It is characterized by the above-mentioned.

A processing method of a character symbol portion in a substrate having a character symbol portion according to the present invention is a substrate in which a character symbol portion composed of characters and / or symbols is disposed on one surface of a transparent resin substrate, and the character symbol portion is When producing a photomask having a character symbol portion in which a slit-like or lattice-like pattern made of a concave groove engraved with the transparent resin substrate is provided only in a predetermined region matching the shape of the character and / or symbol The processing for forming the character symbol portion is as follows: (a) an electron is formed on the light shielding film of a transparent glass substrate provided with a light shielding film in at least the character symbol portion forming region on one side thereof; A resist disposing step of disposing a photosensitive resist on the line; and (b) selectively exposing the resist with an exposure apparatus such as an electron beam exposure apparatus, further developing the resist, and A resist image forming step for forming a resist image in which a portion for forming a toroidal pattern or a lattice pattern is opened; and (c) a portion for forming a pattern made of a groove by etching the light shielding film exposed from the opening of the resist image. An etching process for forming a light shielding film having openings, (d) a substrate engraving process for etching the transparent substrate portion exposed from the openings of the resist and the light shielding film, and (e) a process for removing the resist and the light shielding film. After manufacturing a substrate having a character and symbol part by a processing method having the above, a substrate having the opposite surface to the uneven surface is made using the formed substrate as a master, and a replica having the uneven surface is further made from the base material using a resin. Thus, this is characterized in that the transparent substrate is a substrate having a character symbol portion made of a resin substrate.

(Function)
The substrate having the character symbol part according to the present invention has such a configuration, and thus it is possible to provide a substrate having a character symbol part capable of recognizing characters and symbols simply by forming a concave groove on a transparent substrate. Yes.
In particular, it is possible to provide a substrate having a character symbol portion that can adopt a manufacturing method in which characters and symbols can be arranged with no problem in quality and with high work efficiency.
Specifically, on one surface of a transparent substrate for semiconductor manufacturing, a substrate is disposed and a character symbol unit composed of a circuit pattern and the character and / or symbol, and the circuit pattern and the character symbol section , A pattern composed of a concave groove engraved with the transparent substrate, which is formed on the same surface of the transparent substrate, and the character symbol portion is composed of a concave groove engraved with the transparent substrate. A slit-like or lattice-like pattern is provided in a predetermined region that matches the shape of characters and / or symbols , and the transparent substrate is a glass substrate, and the glass substrate is used as an original plate and the concaves and convexes are reversed. This is achieved by being a substrate for manufacturing .
Specifically, since the pattern composed of the concave grooves is provided only in a predetermined region matching the shape of the characters and / or symbols, the characters and symbols can be identified by reflected light. In addition, by creating the character symbol part with a mirror image pattern, it can be confirmed even when viewed from the back side.

And as a pattern which consists of a ditch | groove, the pattern which consists of a ditch | groove is a slit pattern or a lattice-like pattern, and it is practical.
When the pattern formed by the concave grooves is a slit-like or lattice-like pattern and the width of the groove portions and the width of the space between the groove portions are 1: 1, it is preferable in terms of visibility.
The width of the groove and the pitch of the space between the grooves are generally 0.2 μm to 10 μm.
The character symbol part may be an alignment mark, an area code, or a bar code necessary for drawing a photomask or wafer, and may be provided according to the purpose.
The characters may be alphabets, numbers, hiragana, katakana and other characters.
Examples of such a substrate having a character symbol portion include a photomask. In particular, when the photomask is a substrate-engraved phase shift mask, it is effective as described above.
When the substrate having the character symbol portion is a semiconductor manufacturing mask, it can be used to confirm the mask type name and other information when the mask is mounted on a drawing apparatus or the like.

Character processing method of the character symbol section of a substrate having a character symbol section according to the present onset Ming, by adopting such a configuration, which can be arranged in particular, no problem in quality, the working efficiency, a character, a symbol A substrate having a symbol portion can be provided.
In the case of manufacturing the engraving type chromeless phase shift mask, the character and symbol portion is formed on the same surface as the main pattern (circuit pattern) of the photomask, so that as shown in FIG. In order to obtain a simple character and symbol part, the process that has been performed by two-time plate making can also be produced by one plate making because the present pattern and the character and symbol part can be simultaneously produced in the same process.
Further, it is possible to manufacture a mask having a character symbol portion that can be identified by reflected light to the substrate without leaving a light shielding film in the vicinity of the character symbol portion.

As described above, the present invention makes it possible to provide a substrate having a character symbol portion that can recognize characters and symbols simply by forming a concave groove on a transparent substrate.
In particular, when the substrate substrate having the character symbol part is a photomask, the character and the symbol can be recognized even if the character symbol part is not formed by patterning the light shielding film. As a result, it is possible to arrange characters and symbols with good work efficiency without any problem in the quality of the character symbol portion.

FIG. 1A is a schematic plan view of a phase shift mask which is an example of an embodiment of a substrate having a character symbol portion of the present invention, and FIG. 1B shows characters in the A1 portion of FIG. FIG. 1 (c) is an enlarged view of a portion A2 in FIG. 1 (b), and FIG. 1 (d) is a cross-sectional view taken along A3-A4 in FIG. 1 (c). FIG. 2 is a process chart of the character symbol portion shown in FIG. FIG. 3 (a) is a schematic plan view in the middle of processing a conventional chromeless phase shift mask of a substrate engraving type having characters and symbols, and FIG. 3 (b) is an enlarged view of the characters at B1 in FIG. 3 (a). 3 (c) is an enlarged view of a portion B2 in FIG. 3 (b), FIG. 3 (d) is a sectional view taken along B3-B4 in FIG. 3 (c), and FIG. ) And FIG. 3 (d1) are states after processing corresponding to FIG. 3 (c) and FIG. 3 (d), respectively.

Embodiments of the present invention will be described with reference to the drawings.
FIG. 1A is a schematic plan view of a phase shift mask which is an example of an embodiment of a substrate having a character symbol portion of the present invention, and FIG. 1B shows characters in the A1 portion of FIG. 1 (c) is an enlarged view of a portion A2 in FIG. 1 (b), FIG. 1 (d) is a cross-sectional view taken along A3-A4 in FIG. 1 (c), and FIG. FIG. 2 is a process diagram of a character symbol portion shown in FIG. 1.
1 and 2, 100 is a substrate having a character symbol portion (also referred to as a phase shift mask or simply a substrate), 110 is a transparent glass substrate (Qz substrate), 112 is a main pattern portion, 113 is a character symbol portion, 115 Is a groove, 120 is a light shielding film, 125 is an opening (of the light shielding film), 130 is a resist layer (also simply referred to as resist), 130A is a resist image (also simply referred to as resist), and 135 is an opening in the resist layer.

An embodiment of a substrate having a character symbol portion according to the present invention will be described with reference to FIG.
The substrate 100 having the character symbol portion of the embodiment shown in FIG. 1A is a substrate engraved chromeless phase shift mask in which the character symbol portion 113 is arranged in a region different from the pattern 112. As shown in FIGS. 1 (c) and 1 (d), the character symbol portion 113 is formed into a character and / or symbol shape by changing a slit-like pattern made of a concave groove 115 in which a transparent glass substrate 110 is engraved. It is provided only in a predetermined area.
The slit pattern composed of the concave grooves 115 is configured such that the width of the groove and the width of the space between the grooves are 1: 1.
Regarding the width of the concave groove 115 and the pitch of the space between the concave grooves 115, the minimum size that can be produced at present is about 0.2 μm, and it is preferable that it is 10 μm or less from the viewpoint of visibility.
As the transparent glass substrate 110 for the phase shift mask, a quartz substrate (also simply referred to as Qz or quartz glass) is generally used.

As a modified example of this example, there is an example in which the concave groove 115 of the character symbol portion 113 is formed in a non-slit pattern such as a lattice shape.
As another modified example, a character symbol portion provided with an alignment mark, an area code, and a bar code according to the purpose can be cited.

Next, processing of the character symbol portion in the substrate having the character symbol portion of this example will be briefly described with reference to FIG.
A light shielding film 120 is formed on the entire surface of the transparent glass substrate 110, and a resist layer 130 is formed on the entire surface of the light shielding film 120. (Fig. 2 (a))
As the light shielding film, a chromium-based metal film such as chromium, chromium oxide, chromium oxynitride, or the like is usually used, but is not limited thereto.
The light shielding film 120 is formed by means such as sputtering or vapor deposition.
A resist layer having a desired resolution and good processability is used, and the resist layer is usually formed by spin coating.
Next, it is selectively exposed by an exposure apparatus such as an electron beam drawing apparatus, and the resist is further developed to open the slit-shaped groove forming part of the character symbol part forming area and the shifter forming part of this pattern. A resist image 130A is formed. (Fig. 2 (b))
Next, the light shielding film 120 exposed from the opening 135 of the resist image 130A is etched (FIG. 2C), and the transparent substrate portion exposed from the opening of the resist image 130A and the light shielding film 120 is further etched. (Fig. 2 (d))
The light shielding film 120 is etched by using the resist image 130A as an etching resistant mask, and when the light shielding film is a chromium-based metal film, wet etching using a ceric ammonium nitrate aqueous solution or dry etching using a chlorine-based gas. At.
Etching of the transparent glass substrate (Qz substrate) 110 simultaneously forms the shifter portion and the slit-like concave groove 115 of the character / symbol portion. Therefore, the etching is performed in accordance with the formation of the shifter portion. Performed by dry etching using
Next, after the etching process is completed, the resist 130A is peeled off (FIG. 2E), and the light shielding film 120 is further removed by wet etching. (Fig. 2 (f))
In this manner, the character symbol portion can be formed simultaneously with the formation of this pattern.

A substrate having 100 character symbols (also called a phase shift mask or simply a substrate)
110 Transparent glass substrate (Qz substrate)
112 pattern portion 113 character symbol portion 115 concave groove 120 light shielding film 125 (light shielding film) opening 130 resist layer (also simply referred to as resist)
130A resist image (also simply called resist)
135 resist layer opening 200 phase shift mask 210 transparent substrate 220 main pattern part 230 character symbol part 231 light shielding film 232 (light shielding film) opening part 215 concave groove part

Claims (3)

On one surface of a transparent substrate for semiconductor manufacturing, a substrate is disposed and a character symbol unit composed of a circuit pattern and the character and / or symbol, and the circuit pattern and the character symbol section, said transparent substrate Is formed on the same surface of the transparent substrate, and the character symbol portion is a slit shape or a lattice shape formed of a concave groove engraved with the transparent substrate. substrate pattern having a predetermined area according to the shape of the characters and / or symbols, and the transparent substrate is the glass substrate, for irregularities of the glass substrate as an original to produce a reverse mold a substrate having a character symbol section, characterized in that it. The substrate having the character symbol portion according to claim 1, wherein the slit-like or lattice-like pattern is configured such that the width of the groove portion and the width of the space between the groove portions are 1: 1. A substrate having a character symbol portion to be used. 3. A substrate having a character symbol portion according to claim 1, wherein the character symbol portion is an alignment mark, an area code, or a bar code.

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