JP5498611B2 - LIGHT EMITTING ELEMENT MODULE, ITS MANUFACTURING METHOD, AND BACKLIGHT DEVICE - Google Patents

Description

  The present invention relates to a light emitting element module having a light emitting element mounted thereon, a manufacturing method thereof, and a backlight device used in a liquid crystal display device such as a liquid crystal television and a liquid crystal monitor using the light emitting element module.

  In a liquid crystal display device such as a liquid crystal television or a liquid crystal monitor, since the liquid crystal itself does not emit light, a light source that irradiates from the back surface is required for display. As the light source, a solid light-emitting element such as a fluorescent tube or an LED (Light Emitting Diode) is used. In any case, a device for obtaining uniform light in the display area is required.

  FIG. 6 shows a configuration of a substrate (light emitting element module) on which a conventionally used light emitting element is mounted. As shown in Patent Document 1, the LED 5 is directly provided on the substrate 11, the substrate 11 and the LED 5 are connected by the wire 8, and the lens unit 41 a is connected to protect the LED 5 and the wire 8 on the substrate. The cap 41 formed integrally with the reflector portion 41b is bonded using the adhesive resin 32, and the transparent resin 42 for sealing is injected into the cap 41, followed by thermosetting.

JP 2008-305940 A

  However, in the case of the above-described prior art, when a temperature change occurs, stress is generated in the bonded portion between the cap 41 and the substrate 11 due to a difference in thermal expansion coefficient between the cap and the substrate (due to a difference in the degree of thermal expansion / contraction). In other words, when the temperature change is repeatedly generated, there is a problem that the adhesive resin portion 32 between the substrate 11 and the cap 41 is cracked or peeled off.

  Further, when the cap formed by the lens portion 41a and the reflector portion 41b is integrally molded, there is a problem of the accuracy of the boundary portion of the two-color molding, which affects the yield. Further, the LED 5 is mounted on the substrate, and after being connected by the wire 8, the liquid transparent resin 42 is injected to inject the resin, so that the liquid transparent resin 42 is injected into the cap 41 and thermally cured. At this time, defects such as entrainment of bubbles and foaming occur, and the yield of the light emitting element module is extremely deteriorated.

  The present invention has been made in view of the above-described problems of the prior art, and an object of the present invention is to provide a light-emitting element module having a high yield by suppressing cracks and peeling of the bonded portion between the substrate and the lens due to thermal expansion. .

The light emitting device module according to the present invention for solving the above problems is
A light-emitting element module comprising a light-emitting element component mounted with a light-emitting element and an optical lens for dispersing light from the light-emitting element on a substrate,
The optical lens has three or more struts projecting from the outer periphery toward the substrate,
The optical lens is bonded to the substrate by an adhesive resin having a layer in which air can move between the optical lens and the substrate and having a tensile breaking elongation of 50% or more. Fixed on the board,
The first feature is that at least two of the support portions are fixed on the substrate by the adhesive resin, and at least one of the support portions is not fixed on the substrate.

  Furthermore, in addition to the first feature, the light emitting element module according to the present invention has a second feature that the shape of the support column is a rod shape.

  Furthermore, in addition to the second feature described above, the light emitting element module according to the present invention has a third feature in that a cross-sectional shape in a direction horizontal to the substrate of the support column is a circle or a square.

  Furthermore, the light emitting element module according to the present invention, in addition to any one of the first to third features, applies stress applied to the adhesive resin due to mismatch of thermal expansion coefficients of the substrate and the optical lens. The fourth feature is that the parts are dispersed.

  Further, in the light emitting element module according to the present invention, in addition to any of the first to fourth features, the adhesive resin may be an epoxy thermosetting resin, or a silicone, acrylic modified silicone, or urethane. The fifth characteristic is that it is one of the moisture curable resins of the system.

  In addition to the first to fifth features, the light-emitting element module according to the present invention includes the light-emitting element component in which the light-emitting element is sealed with a transparent resin. Six features.

  A backlight device according to the present invention is a backlight device for a liquid crystal display device using the light emitting element module having any one of the first to sixth characteristics.

A method of manufacturing a light emitting element module according to the present invention is a method of manufacturing a light emitting element module having any one of the first to sixth features,
A step of preparing a light emitting element component in which the light emitting element is sealed with a transparent resin;
Preparing the substrate on which a land for installing wiring and the light emitting element component is formed on the substrate;
Preparing an optical lens having three or more struts projecting from the outer periphery toward the substrate;
Installing the light emitting element component on the land of the substrate;
A lens fixing step of bonding the bottom surface of the support column of the optical lens to the substrate for each light emitting element component using an adhesive resin having a tensile elongation at break of 50% or more, and fixing the optical lens on the substrate. Inclusion is a first feature.

  In addition to the first feature, the method for manufacturing a light-emitting element module according to the present invention uses the thermosetting adhesive resin having a curing temperature of 90 ° C. or lower in the lens fixing step. The second feature is to perform fixing.

  In addition to the first feature, the method for manufacturing a light-emitting element module according to the present invention includes the step of fixing the optical lens using the humidity-curable adhesive resin in the lens fixing step. Three features.

  In the present invention, in a light-emitting element module in which a light-emitting element component on which a light-emitting element is mounted and an optical lens that disperses light from the light-emitting element are arranged on a substrate, the optical lens is fixed to the substrate and the elongation at break is pulled. By using 50% or more of the adhesive resin, the stress caused by the mismatch of the thermal expansion coefficient between the substrate and the optical lens is absorbed in the bonded portion between the substrate and the optical lens, and cracks in the bonded portion between the substrate and the optical lens Peeling can be prevented. Accordingly, a light-emitting element module with a high yield can be provided.

  As the adhesive resin having tensile elongation at break, for example, an epoxy thermosetting resin, or a silicone, acrylic modified silicone, or urethane humidity curable resin can be used. Among these, when using a thermosetting adhesive resin, curing at a lower temperature is preferable because the stress applied after cooling after thermosetting can be further reduced. In particular, when an acrylic resin is used as the material of the optical lens, heat treatment at 90 ° C. or higher is not desirable because the optical lens may be deformed by heat, and a thermosetting resin having a curing temperature of 90 ° C. or lower is used. Thus, it is desirable to fix the substrate and the lens by heating at 90 ° C. or lower. On the other hand, when a humidity curable adhesive resin is used, it can be cured at a low temperature of 40 ° C. to 60 ° C., or at room temperature when a long-time curing treatment is allowed, and is further added to the adhesive resin. Stress can be reduced.

  Furthermore, since the optical lens has a structure having a plurality of support portions, and the optical lens is fixed on the substrate through the support portions, the stress applied to the bonding portion between the substrate and the optical lens can be dispersed. In addition, when the substrate and the optical lens are bonded at the support column, and the light-emitting element component is sealed as in the prior art by having a layer that can move the air by the height of the support column between the substrate and the optical lens The heat dissipation can be improved. Thereby, the temperature change of the light emitting element module accompanying ON / OFF of the light emitting element by normal use can be suppressed, and generation | occurrence | production of stress can be suppressed.

  In addition, by adopting a configuration in which the light emitting element is sealed with a transparent resin and mounted on the light emitting element component, a non-defective light emitting element component can be selected and mounted on the substrate, and the yield reduction of the light emitting element module is suppressed. can do.

  Therefore, according to the present invention, it is possible to provide a light-emitting element module with a high yield in which cracks and peeling of the bonded portion between the substrate and the optical lens due to thermal expansion are suppressed. The light emitting element module can be used as a backlight device for generating a backlight of a liquid crystal display device such as a liquid crystal television or a liquid crystal monitor.

Sectional drawing of the light emitting element module which concerns on this invention. The figure which shows the shape of the optical lens installed in the light emitting element module which concerns on this invention. The figure which shows the test result about the adhesive reliability of adhesive resin. The figure which shows the manufacturing process of the light emitting element module which concerns on this invention. The figure which shows the manufacturing process of the light emitting element module which concerns on this invention. Sectional drawing of the light emitting element module in a prior art.

<First Embodiment>
FIG. 1 shows a configuration example of a light emitting element module 1 according to an embodiment of the present invention. FIG. 1 is a vertical sectional view of a substrate of a light emitting element module 1 to which the exemplary embodiment is applied. On the substrate 11, a plurality of light emitting element components 2 each having an LED mounted as a light emitting element are mounted in one or a plurality of rows, respectively. In FIG. Yes. In the drawings shown below, the main parts are appropriately emphasized as appropriate, and the dimensional ratios of the constituent parts on the drawings do not necessarily match the actual dimensional ratios.

  The light-emitting element component 2 includes one or more LED chips (not shown) mounted on a component substrate 3 such as ceramic, and is electrically connected to the component substrate 3 by wires (not shown). The wire is sealed with a sealing resin 6. The light emitting element component 2 is connected to the substrate 11 via the component terminal 4 by a conductive material 7 such as solder on the land portion 13a of the substrate 11, and the center of the optical lens 21 is substantially the same as the center of the light emitting element component 2. It is installed so that it may overlap. A transparent resin such as silicone is used for the sealing resin 6, and a phosphor or the like is added as necessary. Thus, the yield of the light emitting element module 1 which mounts many LED by producing the light emitting element component 2 which sealed LED chip previously with transparent resin, and mounting the non-defective light emitting element component 2 on the board | substrate 11 is carried out. The decrease can be suppressed.

  The substrate 11 is produced by performing a wiring process on a base material 12 formed by impregnating a resin (epoxy resin, cyanate resin or the like) with, for example, cloth-like or non-woven-like glass fiber or organic fiber. . Copper is used for the wiring 13 (13a, 13b). The outermost surface of the wiring may be plated with gold. In addition, since the light emitting element component 2 generates a relatively large amount of heat, wiring is preferably provided on both surfaces of the substrate 11. Land portions 13 a are arranged in accordance with the terminal arrangement of the component terminals 4 at the place where the light emitting element component 2 is mounted. A white insulating material (white resist or the like) 14 is formed on the outermost surface of the substrate so as to cover the wiring portion 13b. By covering the outermost surface of the substrate 11 with the white insulating material 14, in addition to protecting the wiring, the reflectance of light from the light emitting element can be increased, and the amount of light irradiated into the display area can be increased. In addition, when a reflective sheet is separately provided on the substrate surface, a normal solder resist may be used.

On the substrate 11, openings 15 a and 15 b that are not covered with the insulating material 14 are provided. In the opening 15 a, the light emitting element component 2 is connected to the land portion 13 a on the substrate 11. The lens 21 and the base material 12 on the substrate 11 are fixed by an adhesive resin 31. Here, the adhesive resin 31 is an adhesive resin having a good elongation rate with a tensile breaking elongation of 50% or more. The size of the opening 15b is preferably the same as or slightly larger than the size of the bottom surface of the support 23 of the optical lens. As described above, by providing the insulating material with an opening having the same size as or slightly larger than the bottom surface size of the support portion 23, the positioning of the adhesive resin 31 is facilitated, and the management of the resin amount is also facilitated. The thermal expansion coefficient of the substrate 11 is about 1 × 10 ⁻⁵ / ° C. to 3 × 10 ⁻⁵ / ° C. for the resin substrate 11 and about 5 × 10 ⁻⁶ / ° C. for the ceramic substrate.

The optical lens 21 can be made of acrylic, polycarbonate, methacryl having excellent transparency, or styrene or epoxy resin. These materials have a thermal expansion coefficient of about 6 × 10 ⁻⁵ / ° C. to about 8 × 10 ⁻⁵ / ° C. The shape of the optical lens 21 is shown in FIG. FIG. 2A shows a side view, and FIG. 2B shows a view from above. As shown in FIGS. 2A and 2B, the optical lens 21 includes a lens portion 22, a support portion 23, a recess portion 24, and a mark portion 25, and injection molding is performed using a mold. It is molded and manufactured as a single piece.

  The lens part 22 is designed and formed in an aspherical shape so that light can be diffused by simulation or the like in advance.

  The column part 23 includes a plurality of columns provided to fix the optical lens 21 to the substrate 11 using the adhesive resin 31. It is desirable to provide three or more support columns because it is easy to attach the support columns horizontally to the substrate 11. Further, all the columns of the column part 23 may be fixed to the substrate 11 with the adhesive resin 31, but it is desirable because the optical lens 21 does not rotate by fixing at least two columns.

  Here, the column portion 23 has a role of dispersing stress applied to the bonded portion due to mismatch of thermal expansion coefficients between the substrate 11 and the optical lens 21. The stress is a temperature change after the optical lens 21 is bonded to the substrate 11 (cooling after the heat treatment when the adhesive resin 31 is cured, or ON / OFF of the display device, and the light emitting element component 2 and other components repeatedly generate heat. This occurs when the dimensions (distance between the columns of the column part 23) change depending on the temperature change due to cooling. Therefore, the stress to the bonded portion can be dispersed as the column height of the column part 23 is higher.

  Further, the substrate 11 and the optical lens 21 are bonded by the support portion 23, thereby having a layer between the substrate 11 and the optical lens 21 in which air corresponding to the height of the support column can move. Heat dissipation can be improved.

  In the horizontal direction with respect to the upper surface of the substrate 11, various shapes such as a circle, an ellipse, a triangle, a square, a rectangle, and a polygon can be considered as the cross-sectional shape of the column 23, but the center of the optical lens 21 and the column The width of the cross section in the direction connecting the centers of the portions 23 (that is, the radial direction of the lens) is preferably about 0.5 to 5 mm. This is because, in the direction connecting the center of the optical lens 21 and the center of the column part 23, if the width of the column part 23 is too wide, an optical influence occurs, and conversely, if it is too narrow, the strength becomes weak. On the other hand, in the direction perpendicular to the line connecting the center of the optical lens 21 and the center of the column 23 (that is, the outer peripheral direction of the lens), the width can be relatively widened, and the width of the cross section is about 0.5 to 10 mm. Is desirable. In the direction perpendicular to the line connecting the center of the optical lens 21 and the center of the column part 23, there is little optical influence. However, if the cross-sectional width of the column part is too wide, air movement is hindered and heat dissipation is affected. . However, even when the cross-sectional width exceeds 10 mm, the heat dissipation is improved by having a layer through which air can move as compared with the case where the light emitting element component 2 is sealed.

  Although the height of the column of the column 23 is preferably as high as possible in the sense of reducing the stress applied to the adhesive resin 31, the thickness of the display device on which the light emitting element module 1 is mounted, the mounting height of the light emitting element, and the like. And about 0.1 to 5 mm is appropriate. Moreover, since the stress applied to the adhesive resin 31 increases as the distance between the individual columns of the column portion 23 fixed by the adhesive resin 31 increases, the distance between the columns is preferably 20 mm or less.

  In the central portion of the optical lens 21, a recess 24 for accommodating a part of the light emitting element component 2 is formed. The light emitting element component 2 is not sealed, and air is interposed between the light emitting element component 2 and the recess 24. Therefore, the heat radiation performance of the light emitting element component 2 and the light emitting element module 1 as a whole is improved.

  The mark portion 25 is used as an alignment mark when the optical lens 21 is mounted on the substrate 11. The mark portion 25 has a structure that protrudes outward from the outer periphery of the optical lens 21, and is provided outside the support column portion 23 on extension lines that pass from the center of the optical lens 21 through the centers of the three support columns. The shape of the mark portion 25 may be a shape such as a triangle or a rectangle as viewed from the front of the optical lens 21 and may be any shape that can be distinguished from the shape of the gate cutting portion (not shown) after the optical lens molding. In this embodiment, since the shape of the gate cutting part is a rectangle, the shape of the mark part 25 is a triangle.

FIG. 3 shows an experimental result regarding the adhesion reliability of the adhesive resin 31. 3 shows an acrylic resin optical lens 21 (thermal expansion coefficient 6.0 × 10) on a composite substrate (thermal expansion coefficient 2.5 × 10 ⁻⁵ / ° C.) formed by impregnating glass fiber with an epoxy resin. ⁻⁵ / ° C.) is bonded and fixed via the support column 23, and the result of inspecting the peeling of each adhesive resin 31 after the temperature cycle test (−40 ° C./85° C., 20 minutes / times, 300 times) is performed. Indicates. There are six types of adhesive resins 31 shown in FIGS. 3A to 3F, and are selected from adhesive resins that can be cured at 90 ° C. or lower. The experiment was conducted with the number of support columns 23 fixed by the adhesive resin 31 with respect to the optical lens 21 with the center distance between the support columns 23 being 9 mm, 13 mm, and 15 mm. However, the optical lens 21 is provided with at least three columns in the column 23 so as to be parallel to the upper surface of the substrate 11.

  It should be noted that in the materials B to F having a tensile breaking elongation of 50% or more, the adhesive resin 31 was not peeled even when the distance between the columns was 15 mm. In the materials C to F having a tensile elongation at break of 175% or more, the distance between the support columns was 15 mm, and peeling did not occur even when the temperature change cycle was performed 1000 times or more. Furthermore, since the materials C to F are cured by humidity, they can be cured at a low temperature of 40 ° C. to 60 ° C., and are further cured at room temperature when long-term treatment of 8 hours or more may be required. be able to.

Second Embodiment
Next, a manufacturing method of the light emitting element module 1 will be described. 4-5 is a figure which shows the manufacturing process of the light emitting element module 1 shown by FIG.

  First, the light emitting element component 2, the substrate 11, and the optical lens 21 are prepared. Here, the substrate 11 is, for example, a resin substrate in which epoxy and glass fiber are combined, and FIG. 4 shows a cross-sectional view of the substrate 11. Wirings 13 are formed on both surfaces of the substrate 11. The wiring 13 can be formed of a material such as copper, nickel, or gold. Of the wiring 13, a land portion 13a for mounting the light emitting element component 2 is formed on one surface of the substrate 11, and a wiring portion 13b is formed on both surfaces. In addition, on the other surface where the light emitting element component 2 is not mounted, the wiring portion 13b is provided on the entire surface, so that the heat dissipation of the substrate 11 is improved. The solder resist 14 covers the entire surface of the wiring 13b formed on both surfaces and protects the wiring portion 13b, and at the positions where the land portion 13a and the column portion 23 of the optical lens 21 are installed, the openings 15a, 15b is provided.

  In the light emitting element component 2, one or a plurality of LED chips (not shown) are mounted on a component substrate 3 made of ceramic, and are electrically connected by a wire (not shown) or the like. It is formed by being sealed with a sealing resin 6.

  As for the optical lens 21, the lens part 22, the support | pillar part 23, the hollow part 24, and the mark part 25 are integrally shape | molded by injection molding etc. using the metal mold | die. The support column 23 and the mark unit 25 may be attached later, but since only one type of material is required, it is desirable to perform integral molding that is easy in the process. When satin or the like is put on the bottom surface of the lens portion 22, the discreteness and the light diffusing property can be enhanced.

  Next, the light emitting element component 2 is installed on the substrate 11. FIG. 5 shows a cross-sectional view of the substrate 11 on which the light emitting element component 2 is installed. A component terminal 4 made of copper, silver, nickel, gold, or the like is provided on the mounting surface of the component substrate 3 of the light emitting element component 2, and the land portion 13a of the substrate 11 is formed by a conductive material 7 such as solder or a conductive adhesive. Implemented. The conductive material 7 may be provided on either or both of the component terminal 4 and the land portion 13a. These conductive materials are heat-treated by reflow or oven, and the light emitting element component 2 is fixed on the substrate 11.

  Next, the optical lens 21 is fixed on the substrate 11 using an adhesive resin 31. As described above, the adhesive resin 31 is an adhesive resin having a good elongation rate at which the tensile elongation at break after bonding is 50% or more.

  An appropriate amount of the adhesive resin 31 is supplied onto the opening 15b on the substrate 11 in FIG. 5 and bonded to the bottom surface of the support column 23 of the optical lens 21. The supply of the adhesive resin 31 to the optical lens bonding position on the substrate 11 can be performed by a dispensing method, a printing method, or the like when the adhesive resin 31 is liquid. In the case of a sheet form or tape, provisional pressure bonding is performed before supply. In production, a method of applying the liquid adhesive resin 31 by a dispensing method is simple and desirable.

  Since the adhesive resin 31 is supplied only to the bonding location (the bottom of all the columns of the column 23 or at least two of them), the amount of use is smaller than when the entire lens periphery is bonded as in the prior art. It is possible to reduce.

  Next, the optical lens 21 is fixed to the substrate 11 using a general mounting machine such as a die bonder or a mounter. The mark portion 25 is used as an alignment mark at that time.

  When an epoxy-based thermosetting adhesive resin (B in FIG. 3) is used as the adhesive resin 31, after the lens 21 is mounted, it can be cured by a heat treatment at 80 ° C., which is 90 ° C. or less, for 5 minutes. . Accordingly, the stress applied after cooling after thermosetting can be reduced as compared with a general adhesive resin that is thermoset at a high temperature of 150 ° C. or higher. Moreover, since it takes only a short time of about 5 minutes, it can be cured not only by an oven but also by a hot plate or a reflow furnace.

  Moreover, when using humidity hardening type adhesive resins (CF of FIG. 3), such as a silicone type and a polyurethane, as the adhesive resin 31, it can be hardened at 40-60 degreeC which is a lower temperature. Furthermore, when a long-time curing process of about 8 hours is allowed, it can be cured at room temperature, so that the stress applied to the adhesive resin 31 can be further reduced.

  By the above process, the optical lens 21 is bonded onto the substrate 11 via the support column 23, and the center of the optical lens 21 is fixed on the substrate 11 so as to substantially overlap the center of the light emitting element component 2. The light emitting element module 1 in which the light emitting element component 2 and the optical lens 21 are installed on the substrate 11 shown in FIG. 1 is manufactured. The light emitting element module 1 is fixed to a chassis of a liquid crystal display device such as a liquid crystal television or a liquid crystal monitor with a rivet or the like, and can be used as a backlight unit.

  The above-described embodiment is an example of a preferred embodiment of the present invention. The embodiment of the present invention is not limited to this, and various modifications can be made without departing from the gist of the present invention.

<Another embodiment>
Another embodiment will be described below.

  <1> In the first and second embodiments, the optical lens 21 includes the base 12 of the substrate 11 and the support 23 of the optical lens 21 in the opening 15b opened on the insulating material (solder resist) 14. Although it is fixed on the substrate 11 by being bonded by the adhesive resin 31, the insulating material (solder resist) 14 and the column portion 23 of the optical lens 21 are fixed by the adhesive resin 31 without providing the opening 15 b. good. In that case, if marking is performed on the region where the support column 23 is arranged, it becomes easy to position the bonding portion and manage the resin supply amount when the adhesive resin 31 is supplied. However, since the adhesion between the insulating material 14 and the base material 12 may not be so good, it is desirable to provide an opening on the insulating material 14 in that case.

  <2> The light emitting element module 1 may have all the light emitting element components 2 corresponding to the entire display screen mounted on one module. In this case, however, the light emitting element module 1 has a size corresponding to the display screen size. The substrate 11 is required, and it is necessary to change the substrate 11 for each screen size. Therefore, by preparing a plurality of types and a plurality of basic light emitting element modules on which several to several tens of light emitting element components 2 are mounted, by using a combination of a plurality of basic light emitting element modules according to the screen size, It is desirable to configure the light emitting element module 1 for a desired display screen size. For example, by preparing three types of basic light-emitting element modules on which five, six, and eight light-emitting element parts 2 are mounted, various display screen sizes can be supported. Thereby, since the size of each module can be reduced and the number of light emitting element components 2 mounted on each module can be reduced, the light emitting element module 1 can be manufactured without reducing the yield. The light emitting element modules 1 are configured by connecting the basic light emitting element modules with jumpers or connectors. About the structure of the light emitting element component 2 and the optical lens 21 in the said basic light emitting element module, and the fixing method to a board | substrate, it is the same as that of the light emitting element module 1 in the said 1st and 2nd embodiment, Description is abbreviate | omitted.

  The present invention can be used for a light emitting element module including a light emitting element, and in particular, can be used for a backlight device for a liquid crystal display device such as a liquid crystal television or a liquid crystal monitor.

1: Light emitting device module 2 according to the present invention: Light emitting device component (LED component)
3: Component board 4: Component terminal 5: LED
6: Sealing resin 7: Conductive material (solder, conductive adhesive, etc.)
8: Wire 11: Substrate 12: Base material 13: Wiring 13a: Land portion 13b: Wiring portion 14: Insulating material (solder resist, etc.)
15a, 15b: Opening 21: Optical lens 22: Lens part 23: Supporting part 24: Recessed part 25: Mark part 31: Adhesive resin 32: Adhesive resin 41 (of the prior art) 41: Cap 41a: Lens part 41b: Reflector part 42: Sealing resin

Claims (10)

A light-emitting element module comprising a light-emitting element component mounted with a light-emitting element and an optical lens for dispersing light from the light-emitting element on a substrate,
The optical lens has three or more struts projecting from the outer periphery toward the substrate,
The optical lens is bonded to the substrate by an adhesive resin having a layer in which air can move between the optical lens and the substrate and having a tensile breaking elongation of 50% or more. Fixed on the board,
At least two of the support portions are fixed on the substrate by the adhesive resin, and at least one of the support portions is not fixed on the substrate.   The light emitting element module according to claim 1, wherein a shape of the support column is a rod shape.   The light emitting element module according to claim 2, wherein a cross-sectional shape in a direction horizontal to the substrate of the support column is a circle or a square.   The light emitting element module according to any one of claims 1 to 3, wherein the support portion disperses stress applied to the adhesive resin due to mismatch of thermal expansion coefficients between the substrate and the optical lens.   5. The adhesive resin according to claim 1, wherein the adhesive resin is an epoxy thermosetting resin, or a silicone, acrylic modified silicone, or urethane humidity curable resin. The light emitting device module according to item.   The light emitting element module according to claim 1, wherein the light emitting element component is configured by sealing the light emitting element with a transparent resin.   7. A backlight device for a liquid crystal display device, wherein the light emitting element module according to claim 1 is used. A method for producing the light-emitting element module according to claim 1,
A step of preparing a light emitting element component in which the light emitting element is sealed with a transparent resin;
Preparing the substrate on which a land for installing wiring and the light emitting element component is formed on the substrate;
Preparing an optical lens having three or more struts projecting from the outer periphery toward the substrate;
Installing the light emitting element component on the land of the substrate;
A lens fixing step of bonding the bottom surface of the support column of the optical lens to the substrate for each light emitting element component using an adhesive resin having a tensile elongation at break of 50% or more, and fixing the optical lens on the substrate. A method for manufacturing a light emitting element module, comprising:   The method for manufacturing a light emitting element module according to claim 8, wherein, in the lens fixing step, the optical lens is fixed using the thermosetting adhesive resin having a curing temperature of 90 ° C or lower. 9. The method of manufacturing a light emitting element module according to claim 8, wherein, in the lens fixing step, the optical lens is fixed using the humidity curable adhesive resin.