JP5464901B2 - インクジェット記録ヘッドおよびその製造方法 - Google Patents
インクジェット記録ヘッドおよびその製造方法 Download PDFInfo
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- JP5464901B2 JP5464901B2 JP2009113565A JP2009113565A JP5464901B2 JP 5464901 B2 JP5464901 B2 JP 5464901B2 JP 2009113565 A JP2009113565 A JP 2009113565A JP 2009113565 A JP2009113565 A JP 2009113565A JP 5464901 B2 JP5464901 B2 JP 5464901B2
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- element substrate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
- B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1406—Ultraviolet [UV] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1412—Infrared [IR] radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
- B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
- B29C65/4835—Heat curing adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/50—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like
- B29C65/5057—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding using adhesive tape, e.g. thermoplastic tape; using threads or the like positioned between the surfaces to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
- B29C66/53461—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat joining substantially flat covers and/or substantially flat bottoms to open ends of container bodies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/96—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process
- B29C66/967—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving special data inputs or special data outputs, e.g. for monitoring purposes
- B29C66/9672—Measuring or controlling the joining process characterised by the method for implementing the controlling of the joining process involving special data inputs or special data outputs, e.g. for monitoring purposes involving special data inputs, e.g. involving barcodes, RFID tags
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/767—Printing equipment or accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14362—Assembling elements of heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/22—Manufacturing print heads
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49083—Heater type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Description
該記録素子基板を配設するための配設面と、該配設面の前記記録素子基板の長手方向の両端部に対応する位置に設けられ先端が平面である凸部と、前記記録素子基板にインクを供給する供給路と、を含むモールド成型から成る配設部材とを備えたインクジェット記録ヘッドの製造方法であって、前記配設面と前記平面とに接着剤を設ける工程と、前記記録素子基板の接着がなされる面に前記平面が沿うように、前記記録素子基板を前記接着剤に当接させる工程と、前記平面に塗布された前記接着剤を前記配設面に塗布された前記接着剤よりも早期に硬化させる硬化工程とを有し、前記平面と前記記録素子基板の前記接着がなされる面との間に存在する前記接着剤の厚さは、前記平面以外の前記配設面と前記記録素子基板の前記接着がなされる面との間に存在する前記接着剤の厚さよりも薄いことを特徴とする。
以下に、本実施形態の記録ヘッドおよびその製造方法を詳しく説明する。
図6は、本実施例のインクジェット記録ヘッドにおける配設部材120と記録素子基板110の接着状態を説明するための断面図である。また、Fig.7は接着前の配設部材120の配設面121近傍の概略を説明するための上面図である。本実施例では、接続位置123の略中央に2つの凸平面部126が形成されている。このような位置に凸平面部を設けることにより、記録素子基板110と配設面121の間の熱硬化接着剤125の厚みを部分的に薄くした接着部分を設けることが出来る。
110 記録素子基板
112 インク供給口
113 電気熱変換素子
116 インク流路
117 吐出口
111 Siウェハー
120 配設部材
121 配設面
122 インク供給路
123 接着位置
124 凸平面部
125 熱硬化接着剤
126 凸平面部
130 電気配線基板
500 型
510 外側駒
520 平面部駒
521 凸部予定箇所
530 内側駒
600 供給フィンガー
601 ヒータ
620 光照射機
Claims (6)
- インクを吐出するためのエネルギを発生する記録素子を備えた記録素子基板と、
該記録素子基板を配設するための配設面と前記記録素子基板にインクを供給する供給路とを備えたモールド成型から成る配設部材と、
前記記録素子基板の接着がなされる面と前記配設面との間に介在することにより、前記記録素子基板と前記配設部材とを接着するための接着剤と
を備えたインクジェット記録ヘッドであって、
前記配設面には、先端が前記接着がなされる面に沿った平面である凸部が前記記録素子基板の長手方向の両端部に対応する位置に設けられ、前記接着剤は前記接着がなされる面と前記平面との間にも介在し、前記平面と前記記録素子基板の前記接着がなされる面との間に存在する前記接着剤の厚さは、前記平面以外の前記配設面と前記記録素子基板の前記接着がなされる面との間に存在する前記接着剤の厚さよりも薄いことを特徴とするインクジェット記録ヘッド。 - インクを吐出するためのエネルギを発生する記録素子を備えた記録素子基板と、
該記録素子基板を配設するための配設面と、該配設面の前記記録素子基板の長手方向の両端部に対応する位置に設けられ先端が平面である凸部と、前記記録素子基板にインクを供給する供給路と、を含むモールド成型から成る配設部材と
を備えたインクジェット記録ヘッドの製造方法であって、
前記配設面と前記平面とに接着剤を設ける工程と、
前記記録素子基板の接着がなされる面に前記平面が沿うように、前記記録素子基板を前記接着剤に当接させる工程と、
前記平面に塗布された前記接着剤を前記配設面に塗布された前記接着剤よりも早期に硬化させる硬化工程と
を有し、
前記平面と前記記録素子基板の前記接着がなされる面との間に存在する前記接着剤の厚さは、前記平面以外の前記配設面と前記記録素子基板の前記接着がなされる面との間に存在する前記接着剤の厚さよりも薄いことを特徴とするインクジェット記録ヘッドの製造方法。 - 前記硬化工程では、前記記録素子基板に光を照射することによって前記記録素子基板を昇温させることを特徴とする請求項2に記載のインクジェット記録ヘッドの製造方法。
- 前記硬化工程では、ヒータを用いて加熱することによって前記記録素子基板を昇温させることを特徴とする請求項2に記載のインクジェット記録ヘッドの製造方法。
- 前記記録素子基板を前記接着剤に当接させる前に、過熱された治具により前記記録素子基板を吸着し保持させることを特徴とする請求項2乃至4のいずれかに記載のインクジェット記録ヘッドの製造方法。
- 前記平面は前記治具と前記記録素子基板との吸着領域に対応する部位に形成されていることを特徴とする請求項5に記載のインクジェット記録ヘッドの製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009113565A JP5464901B2 (ja) | 2008-06-06 | 2009-05-08 | インクジェット記録ヘッドおよびその製造方法 |
US12/472,889 US8272130B2 (en) | 2008-06-06 | 2009-05-27 | Method of manufacturing an ink jet print head |
CN2009101473035A CN101607477B (zh) | 2008-06-06 | 2009-06-05 | 喷墨打印头和喷墨打印头的制造方法 |
US13/556,389 US9802410B2 (en) | 2008-06-06 | 2012-07-24 | Ink jet print head |
Applications Claiming Priority (3)
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JP2008149376 | 2008-06-06 | ||
JP2008149376 | 2008-06-06 | ||
JP2009113565A JP5464901B2 (ja) | 2008-06-06 | 2009-05-08 | インクジェット記録ヘッドおよびその製造方法 |
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JP2010012774A JP2010012774A (ja) | 2010-01-21 |
JP5464901B2 true JP5464901B2 (ja) | 2014-04-09 |
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US (2) | US8272130B2 (ja) |
JP (1) | JP5464901B2 (ja) |
CN (1) | CN101607477B (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5738018B2 (ja) * | 2011-03-10 | 2015-06-17 | キヤノン株式会社 | インクジェット記録ヘッドとその製造方法 |
JP5828682B2 (ja) * | 2011-06-06 | 2015-12-09 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
KR101940945B1 (ko) | 2013-02-28 | 2019-01-21 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 구조체, 프린트 헤드 및 잉크젯 펜 |
US10632752B2 (en) | 2013-02-28 | 2020-04-28 | Hewlett-Packard Development Company, L.P. | Printed circuit board fluid flow structure and method for making a printed circuit board fluid flow structure |
US10029467B2 (en) | 2013-02-28 | 2018-07-24 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US11426900B2 (en) | 2013-02-28 | 2022-08-30 | Hewlett-Packard Development Company, L.P. | Molding a fluid flow structure |
US9539814B2 (en) | 2013-02-28 | 2017-01-10 | Hewlett-Packard Development Company, L.P. | Molded printhead |
US10821729B2 (en) | 2013-02-28 | 2020-11-03 | Hewlett-Packard Development Company, L.P. | Transfer molded fluid flow structure |
CN108058485B (zh) | 2013-02-28 | 2019-10-22 | 惠普发展公司,有限责任合伙企业 | 模制的流体流动结构 |
US9724920B2 (en) | 2013-03-20 | 2017-08-08 | Hewlett-Packard Development Company, L.P. | Molded die slivers with exposed front and back surfaces |
JP6137918B2 (ja) * | 2013-04-12 | 2017-05-31 | キヤノン株式会社 | インクジェット記録ヘッドおよびインクジェット記録装置 |
JP2014240136A (ja) * | 2013-06-11 | 2014-12-25 | キヤノン株式会社 | 液体吐出ヘッドの製造方法および液体吐出ヘッド |
JP6433263B2 (ja) * | 2014-01-14 | 2018-12-05 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
JP6719911B2 (ja) | 2016-01-19 | 2020-07-08 | キヤノン株式会社 | 液体吐出ヘッドの製造方法 |
US20210316553A1 (en) * | 2018-11-21 | 2021-10-14 | Hewlett-Packard Development Company, L.P. | Curved fluid ejection modules |
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JPH04345858A (ja) * | 1991-05-23 | 1992-12-01 | Seiko Epson Corp | インクジェットヘッド |
US5852460A (en) * | 1995-03-06 | 1998-12-22 | Hewlett-Packard Company | Inkjet print cartridge design to decrease deformation of the printhead when adhesively sealing the printhead to the print cartridge |
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US6241335B1 (en) * | 1997-12-24 | 2001-06-05 | Canon Kabushiki Kaisha | Method of producing ink jet recording head and ink jet recording head produced by the method |
DE19856333A1 (de) * | 1998-12-07 | 2000-06-08 | Bosch Gmbh Robert | Klebeverfahren |
US6652702B2 (en) * | 2000-09-06 | 2003-11-25 | Canon Kabushiki Kaisha | Ink jet recording head and method for manufacturing ink jet recording head |
JP4780875B2 (ja) | 2000-09-06 | 2011-09-28 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
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JP2005138306A (ja) * | 2003-11-04 | 2005-06-02 | Canon Inc | インクジェットヘッド |
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JP4137088B2 (ja) * | 2004-06-02 | 2008-08-20 | キヤノン株式会社 | ヘッド基板、記録ヘッド、ヘッドカートリッジ、記録装置、及び情報入出力方法 |
JP2006003563A (ja) * | 2004-06-16 | 2006-01-05 | Ricoh Co Ltd | アライメント接合方法、アライメント接合装置 |
JP2007290243A (ja) * | 2006-04-25 | 2007-11-08 | Canon Inc | インクジェット記録ヘッドおよびインクジェット記録ヘッドの製造方法 |
JP5322719B2 (ja) * | 2008-03-24 | 2013-10-23 | キヤノン株式会社 | インクジェット記録ヘッド |
-
2009
- 2009-05-08 JP JP2009113565A patent/JP5464901B2/ja active Active
- 2009-05-27 US US12/472,889 patent/US8272130B2/en not_active Expired - Fee Related
- 2009-06-05 CN CN2009101473035A patent/CN101607477B/zh active Active
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US9802410B2 (en) | 2017-10-31 |
CN101607477A (zh) | 2009-12-23 |
CN101607477B (zh) | 2011-10-05 |
JP2010012774A (ja) | 2010-01-21 |
US8272130B2 (en) | 2012-09-25 |
US20120287205A1 (en) | 2012-11-15 |
US20090303278A1 (en) | 2009-12-10 |
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