JP5434795B2 - Thermally conductive silicone grease composition - Google Patents

Description

  The present invention relates to a thermally conductive silicone grease composition for heat dissipation that does not generate a shift even when placed vertically when sandwiched between substrates, and also has excellent reworkability and is capable of suppressing the shift and reworking at the same time. .

  Electronic parts such as LSIs are widely known to generate heat during use and to deteriorate performance, and various heat dissipation techniques are used as means for solving this. As a general method, a cooling member is disposed in the vicinity of the heat generating portion, and heat is radiated by efficiently removing heat from the cooling member. At this time, if there is a gap between the heat generating member and the cooling member, the heat conduction becomes inefficient due to the presence of air, and the temperature of the heat generating member cannot be sufficiently lowered. In order to prevent such a phenomenon, a heat radiating material, a heat radiating sheet, or a heat radiating grease having good thermal conductivity and following the surface of the member is used for the purpose of preventing such a phenomenon (Japanese Patent No. 2938428, Patent No. No. 2938429, Japanese Patent No. 3952184: Patent Literatures 1 to 3).

  At present, there are cases where the contact surfaces of the heat generating member and the cooling member are arranged in a direction perpendicular to the ground due to structural restrictions such as space saving. In such a case, the heat dissipation material is sandwiched between the two. Since the heat dissipating sheet is a molded product, it is possible to maintain the shape even by such a method of use. However, with the heat dissipating grease, there is a problem that the material itself cannot maintain the shape and shift occurs. If the heat dissipating grease is deviated, air is interposed between the heat generating member and the cooling member, and cooling efficiency is lowered. Grease that reacts with heat and moisture to adhere to the base material is used for this problem, but if the reaction proceeds sufficiently, it will adhere to the base material, causing problems. Even if it is attempted to disassemble the structure at this time, it is difficult to peel off the material without destroying the element, which is not preferable from the viewpoint of reworkability.

  In addition to the above patent documents, the prior art related to the present invention is as follows.

Japanese Patent No. 2938428 Japanese Patent No. 2938429 Japanese Patent No. 3952184 Japanese Patent Laying-Open No. 2005-32211 JP 2008-031450 A Japanese Patent Application Laid-Open No. 07-242827

  The present invention has been made in view of the above circumstances, and provides a thermally conductive silicone grease composition that is less prone to misalignment than the prior art and is excellent in reworkability, and thus achieves both suppression of misalignment and reworkability. The purpose is to do.

As a result of intensive investigations to achieve the above object, the present inventors have found that a thermally conductive silicone grease composition containing the following components (A) to (F) as essential components in the amounts shown below suppresses displacement. The present inventors have found that compatibility with reworkability is possible, and have made the present invention.
Accordingly, the present invention provides the following thermally conductive silicone grease composition.
Claim 1:
A thermally conductive silicone grease composition having a viscosity at 25 ° C. of 300 Pa · s or less containing the following components (A) to (F):
Ingredient (A)
Organopolysiloxane having a kinematic viscosity at 25 ° C. of 10 to 100,000 mm ² / s having at least two alkenyl groups in one molecule: 100 parts by mass
Ingredient (B)
Thermally conductive filler having a thermal conductivity of 10 W / m ° C. or higher: 500 to 1,500 parts by mass,
Ingredient (C)
Organohydrogenpolysiloxane containing hydrogen atoms directly bonded to at least two silicon atoms in one molecule:
{Number of Si-H groups} / {Number of alkenyl groups of component (A)}
Is a blending amount of 0.4 to 1.0,
Ingredient (D)
Crosslinking aid having a triazine ring and at least one alkenyl group in one molecule:
2-4 parts by mass,
Ingredient (E)
A catalyst selected from the group consisting of platinum and platinum compounds:
Compounding amount of 0.1 to 500 ppm of component (A) as platinum atom,
Ingredient (F)
A control agent selected from acetylene compounds, various nitrogen compounds, organic phosphorus compounds, oxime compounds, and organic chloro compounds for the purpose of suppressing the catalytic activity of component (E):
0.25 to 0.565 parts by mass.
Claim 2:
Further, as the component (G), the kinematic viscosity at 25 ° C. is 10 to 100,000 mm ² / s, and the organopolysiloxane other than the above components (A) and (C) is 0 with respect to 100 parts by mass of the component (A). The thermally conductive silicone grease composition according to claim 1, comprising 1 to 20 parts by mass.
Claim 3:
Component (G) is a dimethylpolysiloxane having one end blocked with a trialkylsilyl group and the other end blocked with a trialkoxysilyl group, or both ends blocked with a trialkylsilyl group or a trialkoxysilyl group. Item 3. A thermally conductive silicone grease composition according to Item 2.
Claim 4:
Further, as the component (H), the following general formula R ¹ _a R ² _b Si (OR ³ ) _4-ab
(Wherein R ¹ is an alkyl group having 9 to 15 carbon atoms, R ² is a monovalent hydrocarbon group having 1 to 8 carbon atoms, R ³ is an alkyl group having 1 to 6 carbon atoms, and a is an integer of 1 to 3) B is an integer of 0 to 2, and a + b is an integer of 1 to 3.)
The heat conductive silicone grease composition of any one of Claims 1 thru | or 3 which contain 0.1-10 mass parts with respect to 100 mass parts of components (A).

  According to the present invention, it is possible to improve misalignment resistance while maintaining good reworkability as compared with the prior art.

The thermally conductive silicone grease composition of the present invention comprises:
(A) an alkenyl group-containing organopolysiloxane,
(B) a thermally conductive filler,
(C) organohydrogenpolysiloxane,
(D) a triazine ring and alkenyl group-containing crosslinking aid,
(E) a platinum-based catalyst,
(F) An addition reaction control agent as an essential component, and (G) an organopolysiloxane other than the above components (A) and (C), if necessary,
(H) contains an organosilane.

The organopolysiloxane of component (A) constituting the present invention has at least two alkenyl groups directly bonded to silicon atoms in one molecule, and may be linear or branched, and these two or more types are different. It may be a mixture of viscosities. Examples of the alkenyl group include a vinyl group, an allyl group, a 1-butenyl group, and a 1-hexenyl group, but a vinyl group is preferable from the viewpoint of ease of synthesis and cost. Examples of the remaining organic group bonded to the silicon atom include an alkyl group such as methyl group, ethyl group, propyl group, butyl group, hexyl group, and dodecyl group, aryl group such as phenyl group, 2-phenylethyl group, 2-phenylpropylene. An aralkyl group such as a sulfur group is exemplified, and a substituted hydrocarbon group such as a chloromethyl group and a 3,3,3-trifluoropropyl group is also exemplified. Of these, a methyl group is preferred from the viewpoint of ease of synthesis and cost. The alkenyl group bonded to the silicon atom may be present at any end of the molecular chain of the organopolysiloxane, but is preferably present at least at the end. When the kinematic viscosity at 25 ° C. is lower than 10 mm ² / s, the storage stability of the composition is deteriorated, and when it is higher than 100,000 mm ² / s, the progress of the resulting composition is deteriorated. range of ² / s, preferably from 100~50,000mm ² / s.

  The kinematic viscosity is a value measured with an Ubbelohde Ostwald viscometer. The component (B) is a thermally conductive filler having a thermal conductivity of 10 W / m ° C. or higher, and an inorganic compound powder is used as the component (B).

  The inorganic compound powder used in component (B) is aluminum powder, zinc oxide powder, titanium oxide powder, alumina powder, boron nitride powder, aluminum nitride powder, diamond powder, gold powder, silver powder, copper powder, carbon powder, nickel One or more selected from among powder, indium powder, gallium powder, metal silicon powder, and silica can be used. In the present invention, the thermal conductivity is a value measured by Kyoto Electronics Industry Co., Ltd. QTM-500.

  Even if the average particle size of the inorganic compound powder of the component (B) is smaller than 0.5 μm or larger than 100 μm, the filling rate of the obtained grease composition cannot be increased. Is preferably 1 to 50 μm. When the inorganic compound powder is less than 500 parts by mass with respect to 100 parts by mass of the component (A), the thermal conductivity of the composition is lowered, and when it is more than 1,500 parts by mass, the workability deteriorates due to an increase in the viscosity of the composition. Therefore, the range of 500 to 1,500 parts by mass, more preferably 500 to 1,000 parts by mass is preferable. In the present invention, the average particle diameter is a volume-based volume average diameter [MV] that can be measured by Nikkiso Co., Ltd. Microtrac MT330OEX.

  Further, the inorganic compound powder used in the present invention may be subjected to a hydrophobic treatment with an organosilane, an organosilazane, an organopolysiloxane, an organic fluorine compound, or the like, if necessary. For example, inorganic compound powder and organosilane or its partial hydrolyzate are trimix, twin mix, planetary mixer (all are registered trademarks of mixer manufactured by Inoue Seisakusho Co., Ltd.), ultra mixer (manufactured by Mizuho Industry Co., Ltd.) Mixing is performed using a mixer such as a registered trademark of a mixer, Hibis Disper Mix (registered trademark of a mixer manufactured by Tokushu Kaika Co., Ltd.) If necessary, you may heat to 50-100 degreeC. For mixing, a solvent such as toluene, xylene, petroleum ether, mineral spirit, isoparaffin, isopropyl alcohol, ethanol or the like may be used. In that case, it is preferable to remove the solvent using a vacuum apparatus or the like after mixing.

Moreover, it is also possible to use the organopolysiloxane of the component (A) which is a liquid component of the present invention as a diluting solvent.
Compositions made by this method are also within the scope of the present invention.

  The organohydrogenpolysiloxane having Si—H groups as component (C) needs to have at least two, preferably three or more, Si—H groups in one molecule in order to network the composition by crosslinking. is there. Examples of the remaining organic group bonded to the silicon atom include an alkyl group such as a methyl group, an ethyl group, a pullyl group, a butyl group, a hexyl group, and a dodecyl group, an aryl group such as a phenyl group, a 2-phenylethyl group, and a 2-phenylpropylene group. An aralkyl group such as an alkyl group, a halogen atom-substituted hydrocarbon group such as a chloromethyl group or a 3,3,3-trifluoropropyl group, a 2-glycidoxyethyl group, a 3-glycidoxypropyl group, a 4-glycidyl group An epoxy ring-containing organic group (glycidyl group or glycidyloxy group-substituted alkyl group) such as a cidoxybutyl group is also exemplified. Such organohydrogenpolysiloxane having a Si—H group may be linear, branched or cyclic, or a mixture thereof.

  The amount of component (C) is based on the number of alkenyl groups in component (A), that is, the number of Si—H groups in component (C), that is, {number of Si—H groups} / {component (A). If the number of alkenyl groups is less than 0.4, a sufficient network structure cannot be obtained, resulting in poor adhesion to the substrate after reaction, and if greater than 1.0, the cured material becomes hard and reworked. Since the properties deteriorate, the range of 0.4 to 1.0 is good, preferably 0.4 to 0.8.

  The crosslinking aid of component (D) has a triazine ring in one molecule and has at least one alkenyl group, and at the same time imparts adhesion performance to the composition and at the same time serves as an inhibitor of the hydrosilylation reaction. To provide reworkability. The alkenyl group contained in the component (D) may be linear or branched, and examples thereof include a vinyl group, an allyl group, a 1-butenyl group, a 1-hexenyl group, and a 2-methylpropenyl group. To allyl groups are preferred. As specific examples of component (D), alkoxysilyl groups such as 1-2 trimethoxysilyl groups were added to 1-2 allyl groups of triallyl isocyanurate, trimethacryl isocyanurate, triallyl isocyanurate. Examples include alkoxysilyl-substituted triallyl isocyanurate and siloxane-modified products (derivatives) that are hydrolyzed condensates thereof.

  If the component (D) is less than 2 parts by mass with respect to 100 parts by mass of the component (A), the progress of the hydrosilylation reaction cannot be sufficiently suppressed, the cured material becomes hard, and the reworkability is deteriorated. When the amount is more than 4 parts by mass, the hydrosilylation reaction does not proceed sufficiently, the adhesive performance cannot be exhibited, and the grease is displaced. Therefore, the range of 2 to 4 parts by mass is preferable.

  The catalyst selected from platinum of component (E) and a platinum compound is a component for promoting the addition reaction between the alkenyl group of component (A) and the Si—H group of component (C). Examples of this component (E) include platinum alone, chloroplatinic acid, platinum-olefin complexes, platinum-alcohol complexes, platinum coordination compounds, and the like. The compounding amount of the component (E) is not economical even if the platinum atom is less than 0.1 ppm as the platinum atom, and if it exceeds 500 ppm, the effect does not increase, which is uneconomical. Therefore, the range of 0.1 to 500 ppm is preferable.

The component (F) control agent suppresses the progress of the hydrosilylation reaction and improves the reworkability. As the reaction control agent, known ones can be used, and acetylene compounds, various nitrogen compounds, organic phosphorus compounds, oxime compounds, organic chloro compounds and the like can be used. The amount of component (F), compared component (A) 100 parts by mass of less a not good reworking property can not be sufficiently suppressed is obtained the reaction, the reaction of a multi contemplated composition is not sufficiently proceed, Since deviation occurs, a range of 0.25 to 0.565 parts by mass is preferable. These may be used after diluted with toluene or the like in order to improve dispersibility in the silicone resin.

The organopolysiloxane of the component (G) is a polysiloxane other than the component (A) and the component (C), and the organic group bonded to the silicon atom preferably has 1 to 12 carbon atoms, particularly 1 to 3 carbon atoms. And alkyl groups such as methyl group, ethyl group, propyl group, butyl group, hexyl group and dodecyl group, aryl groups such as phenyl group, aralkyl groups such as 2-phenylethyl group and 2-phenylpropyl group, and the like. Examples thereof include substituted hydrocarbon groups such as chloromethyl group and 3,3,3-trifluoropropyl group. Moreover, an alkoxy group, an alkenyl group, an acyl group, etc. are mentioned as an example. If the kinematic viscosity at 25 ° C. measured by an Ostwald viscometer is lower than 10 mm ² / s, the storage stability of the composition deteriorates, and if it exceeds 100,000 mm ² / s, the progress of the resulting composition deteriorates. range 10~100,000mm ² / s, preferably from 100~50,000mm ² / s.

  Specific examples of the component (G) include trimethylsilyl-blocked dimethylpolysiloxane at both ends. In this case, the triorganosilyl group includes trimethylsilyl group, trimethoxysilyl group, dimethoxymethylsilyl group, methoxydimethylsilyl group. Among them, dimethylpolysiloxane blocked at one end with a trimethylsilyl group and the other end blocked with a trimethoxysilyl group, and trimethylsilyl groups at both ends and dimethylpolysiloxane blocked at both ends with trimethoxysilyl groups are preferred.

More specifically, the following can be mentioned.
(CH ₃ ) ₃ SiO ((CH ₃ ) ₂ SiO) ₉ Si (OCH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO ((CH ₃ ) ₂ SiO) ₃₀ Si (OCH ₃ ) ₃ ,
(CH ₃ ) ₃ SiO ((CH ₃ ) ₂ SiO) ₁₂₀ Si (OCH ₃ ) ₃ ,
(OCH ₃ ) ₃ SiO ((CH ₃ ) ₂ SiO) ₉ Si (OCH ₃ ) ₃ ,
(OCH ₃ ) ₃ SiO ((CH ₃ ) ₂ SiO) ₃₀ Si (OCH ₃ ) ₃ ,
(OCH ₃ ) ₃ SiO ((CH ₃ ) ₂ SiO) ₁₂₀ Si (OCH ₃ ) ₃ ,
The kinematic viscosities of ((CH ₃ ) ₃ SiO _1/2 ) units and ((CH ₃ ) ₂ SiO) units are 50 mm ² / s, 100 mm ² / s, 500 mm ² / s, 1,000 mm ² / s, 5 1,000 mm ² / s organopolysiloxane.

  It is preferable that the addition amount of the organopolysiloxane of a component (G) is 0.1-20 mass parts with respect to 100 mass parts of component (A). Since deviation may occur when the ratio of this component increases, it is more preferably 1 to 15 parts by mass.

The organosilane component (H) is represented by the formula R ¹ _a R ² _b Si (OR ³ ) _4-ab and is used as a wetter. Here, R ¹ is an alkyl group having 9 to 15 carbon atoms, R ² is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms, and R ³ is an alkyl group having 1 to 6 carbon atoms. A is an integer of 1 to 3, b is an integer of 0 to 2, and a + b is an integer of 1 to 3.

Specific examples of R ^{1 in} the above general formula of the organosilane used as a wetter include nonyl group, decyl group, dodecyl group, tetradecyl group and the like. If the carbon number is less than 9, the wettability with the filler is not sufficient, and if it is more than 15, the organosilane is solidified at room temperature, which is inconvenient to handle and lowers the low temperature characteristics of the obtained composition. Further, a is 1, 2 or 3, but 1 is particularly preferable.

R ² in the above formula is a substituted or unsubstituted monovalent hydrocarbon group having 1 to 8 carbon atoms. Examples of such a group include an alkyl group, a cycloalkyl group, an alkenyl group, an aryl group, and an aralkyl group. Groups and the like. For example, alkyl groups such as methyl group, ethyl group, propyl group, hexyl group and octyl group, cycloalkyl groups such as cyclopentyl group and cyclohexyl group, alkenyl groups such as vinyl group and allyl group, aryl groups such as phenyl group and tolyl group Aralkyl groups such as 2-phenylethyl group and 2-methyl-2-phenylethyl group, 3,3,3-trifluoropropyl group, 2- (perfluorobutyl) ethyl group, 2- (perfluorooctyl) ethyl And halogenated hydrocarbon groups such as a p-chlorophenyl group, among which a methyl group and an ethyl group are particularly preferable.

R ³ is one or more alkyl groups having 1 to 6 carbon atoms such as a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group, and a methyl group and an ethyl group are particularly preferable.

Specific examples of the organosilane represented by the general formula include the following.
C ₁₀ H ₂₁ Si (OCH ₃ ) ₃ , C ₁₂ H ₂₅ Si (OCH ₃ ) ₃ ,
C ₁₂ H ₂₅ Si (OC ₂ H ₅ ) ₃ , C ₁₀ H ₂₁ Si (CH ₃ ) (OCH ₃ ) ₂ ,
_{C 10 H 21 Si (C 6} H 6) (OCH 3) 2, C 10 H 21 Si (CH 3) (OC 2 H 5) 2,
C ₁₀ H ₂₁ Si (CH═CH ₂ ) (OCH ₃ ) ₂ ,
_{C 10 H 21 Si (CH 2} CH 2 CF 3) (OCH 3) 2.

  When this organosilane is added, the effect is not increased even if the amount is more than 10 parts by mass with respect to 100 parts by mass of the component (A), and it is uneconomical. A range is good, More preferably, it is 0.1-5 mass parts.

  In addition to the above-described components, the present invention may contain an antioxidant, a heat resistance improver, etc. as necessary to prevent deterioration.

  In order to produce the grease composition of the present invention, component (A) to component (H) are trimix, twin mix, planetary mixer (all are registered trademarks of mixer manufactured by Inoue Seisakusho Co., Ltd.), ultramixer (Mizuho) Mixing is carried out using a mixer such as Kogyo Co., Ltd. (registered trademark of the mixer), Hibis Disper Mix (registered trademark of Koki Kogyo Co., Ltd.).

  The heat conductive silicone grease composition according to the present invention is preferably 300 Pa · s or less, more preferably 250 Pa · s or less, because workability deteriorates when the viscosity is high. The lower limit is not particularly limited, but is usually 100 Pa · s or more, particularly 150 Pa · s or more. Such viscosity can be achieved by controlling the components of the silicone grease composition as described above. The viscosity is a value at 25 ° C. measured with a Malcolm viscometer (10 rpm with rotor A, shear rate 6 [1 / s]).

The thermally conductive silicone grease composition of the present invention is suitably used for interposing between an electronic component such as an LSI or other heat generating member and a cooling member to transfer heat from the heat generating member to the cooling member and dissipate it. And can be used in the same manner as conventional thermally conductive silicone grease compositions.
In this case, the heat conductive silicone grease composition of the present invention has a consistency after storage at 90 ° C. of less than 120 hours, and it is difficult to peel off from the device and the reworkability becomes poor. Is 120 or more, more preferably 150 or more. In addition, as a means to achieve such consistency, it is adjusting in the composition range of this invention.

  EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example. In addition, the test regarding the effect concerning this invention was done as follows.

〔viscosity〕
The viscosity of the composition was measured using a Malcolm viscometer (type PC-1T).

[Consistency]
The consistency of the grease composition was measured using a penetration tester using a 1/4 cone according to the method described in JIS-K2220.

〔Thermal conductivity〕
Each composition was poured into a 3 cm thick mold, covered with a kitchen wrap, and measured with Model QTM-500 manufactured by Kyoto Electronics Industry Co., Ltd.

[Reworkability evaluation]
200 g of the composition was taken in a 100 cc glass beaker and stored at 90 ° C. for 1,000 hours, and the consistency was measured.
(Evaluation results)
○: Consistency of 120 or more (good reworkability)
X: Consistency less than 120 (poor reworkability)

[Evaluation of displacement resistance]
A 1 mm thick spacer was sandwiched between two glass plates, and 0.1 mg of grease was sandwiched between them to prepare a test piece. The test piece was placed in a heat cycle tester as a vertical placement, and subjected to 1,000 cycles of aging by alternately exposing to −40 ° C. and 90 ° C. for 30 minutes each. The shift resistance was evaluated by observing the appearance of the grease after aging.
(Evaluation results)
○: No grease displacement was observed.
×: Grease shift was observed.

The following components for forming the composition of the present invention were prepared.
Ingredient (A)
A-1: Dimethylpolysiloxane having both ends blocked with dimethylvinylsilyl groups and a kinematic viscosity at 25 ° C. of 600 mm ² / s A-2: Both ends blocked with dimethylvinylsilyl groups and having a kinematic viscosity at 25 ° C. 10,000 mm ² / s dimethylpolysiloxane

Ingredient (B)
B-1: The following aluminum powder and zinc oxide powder were mixed at room temperature for 15 minutes at a mixing ratio shown in Table 1 below using a 5-liter planetary mixer (manufactured by Inoue Seisakusho Co., Ltd.) to obtain B-1. It was.
Aluminum powder with an average particle size of 2.0 μm Aluminum powder with an average particle size of 10.0 μm Zinc oxide powder with an average particle size of 1.0 μm

Ingredient (C)
C-1: Organohydrogenpolysiloxane represented by the following formula

C-2: Organohydrogenpolysiloxane represented by the following formula

Ingredient (D)
D-1:

D-2:

D-3: (Comparative example)

D-4: (Comparative example)

Ingredient (E)
E-1: A-1 solution of platinum-divinyltetramethyldisiloxane complex, containing 1% by mass as platinum atom (F)
F-1: 1-ethynyl-1-cyclohexanol 50 mass% toluene solution component (G)
G-1: ((CH ₃ ) ₃ SiO _1/2 ) ((CH ₃ ) ₂ SiO) ₃₀ ((OCH ₃ ) ₃ SiO _1/2 )
Ingredient (H)
H-1: Organosilane represented by C ₁₀ H ₂₁ Si (OCH ₃ ) ₃

[Examples 1-8, Comparative Examples 1-8]
The respective components were mixed as shown in Tables 2 and 3 to obtain the grease compositions of Examples 1 to 8 and Comparative Examples 1 to 8, and their properties were evaluated.

  The present invention is a heat dissipating grease composition having both good reworkability and good misalignment resistance. When using conventional techniques other than the present invention, if the resistance to misalignment is improved, the reworkability will deteriorate, and if the reworkability is improved, the misalignment will occur, that is, both reworkability and good resistance to misalignment will be achieved. It was difficult.

Claims (4)

A thermally conductive silicone grease composition having a viscosity at 25 ° C. of 300 Pa · s or less containing the following components (A) to (F):
Ingredient (A)
Organopolysiloxane having a kinematic viscosity at 25 ° C. of 10 to 100,000 mm ² / s having at least two alkenyl groups in one molecule: 100 parts by mass
Ingredient (B)
Thermally conductive filler having a thermal conductivity of 10 W / m ° C. or higher: 500 to 1,500 parts by mass,
Ingredient (C)
Organohydrogenpolysiloxane containing hydrogen atoms directly bonded to at least two silicon atoms in one molecule:
{Number of Si-H groups} / {Number of alkenyl groups of component (A)}
Is a blending amount of 0.4 to 1.0,
Ingredient (D)
Crosslinking aid having a triazine ring and at least one alkenyl group in one molecule:
2-4 parts by mass,
Ingredient (E)
A catalyst selected from the group consisting of platinum and platinum compounds:
Compounding amount of 0.1 to 500 ppm of component (A) as platinum atom,
Ingredient (F)
A control agent selected from acetylene compounds, various nitrogen compounds, organic phosphorus compounds, oxime compounds, and organic chloro compounds for the purpose of suppressing the catalytic activity of component (E):
0.25 to 0.565 parts by mass. Further, as the component (G), the kinematic viscosity at 25 ° C. is 10 to 100,000 mm ² / s, and the organopolysiloxane other than the above components (A) and (C) is 0 with respect to 100 parts by mass of the component (A). The thermally conductive silicone grease composition according to claim 1, comprising 1 to 20 parts by mass.   Component (G) is a dimethylpolysiloxane having one end blocked with a trialkylsilyl group and the other end blocked with a trialkoxysilyl group, or both ends blocked with a trialkylsilyl group or a trialkoxysilyl group. Item 3. A thermally conductive silicone grease composition according to Item 2. Further, as the component (H), the following general formula R ¹ _a R ² _b Si (OR ³ ) _4-ab
(Wherein R ¹ is an alkyl group having 9 to 15 carbon atoms, R ² is a monovalent hydrocarbon group having 1 to 8 carbon atoms, R ³ is an alkyl group having 1 to 6 carbon atoms, and a is an integer of 1 to 3) B is an integer of 0 to 2, and a + b is an integer of 1 to 3.)
The heat conductive silicone grease composition of any one of Claims 1 thru | or 3 which contain 0.1-10 mass parts with respect to 100 mass parts of components (A).