JP5397242B2 - Laminated polyphenylene sulfide film. - Google Patents
Laminated polyphenylene sulfide film. Download PDFInfo
- Publication number
- JP5397242B2 JP5397242B2 JP2010016344A JP2010016344A JP5397242B2 JP 5397242 B2 JP5397242 B2 JP 5397242B2 JP 2010016344 A JP2010016344 A JP 2010016344A JP 2010016344 A JP2010016344 A JP 2010016344A JP 5397242 B2 JP5397242 B2 JP 5397242B2
- Authority
- JP
- Japan
- Prior art keywords
- laminated
- film
- polyphenylene sulfide
- primer layer
- sulfide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004734 Polyphenylene sulfide Substances 0.000 title claims description 14
- 229920000069 polyphenylene sulfide Polymers 0.000 title claims description 14
- 229920005989 resin Polymers 0.000 claims description 58
- 239000011347 resin Substances 0.000 claims description 58
- 238000003851 corona treatment Methods 0.000 claims description 14
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- 229920001225 polyester resin Polymers 0.000 claims description 11
- 239000004645 polyester resin Substances 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 6
- 125000000217 alkyl group Chemical group 0.000 claims description 5
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 229920006269 PPS film Polymers 0.000 description 56
- 229920005575 poly(amic acid) Polymers 0.000 description 25
- 238000000576 coating method Methods 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 13
- -1 polyethylene terephthalate Polymers 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 12
- 239000003431 cross linking reagent Substances 0.000 description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 8
- 239000005020 polyethylene terephthalate Substances 0.000 description 8
- 230000009477 glass transition Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2,5-dimethyl-1h-imidazole Chemical compound CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
- DIZBQMTZXOUFTD-UHFFFAOYSA-N 2-(furan-2-yl)-3h-benzimidazole-5-carboxylic acid Chemical compound N1C2=CC(C(=O)O)=CC=C2N=C1C1=CC=CO1 DIZBQMTZXOUFTD-UHFFFAOYSA-N 0.000 description 2
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 2
- DNUYOWCKBJFOGS-UHFFFAOYSA-N 2-[[10-(2,2-dicarboxyethyl)anthracen-9-yl]methyl]propanedioic acid Chemical compound C1=CC=C2C(CC(C(=O)O)C(O)=O)=C(C=CC=C3)C3=C(CC(C(O)=O)C(O)=O)C2=C1 DNUYOWCKBJFOGS-UHFFFAOYSA-N 0.000 description 2
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- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- GCNTZFIIOFTKIY-UHFFFAOYSA-N 4-hydroxypyridine Chemical compound OC1=CC=NC=C1 GCNTZFIIOFTKIY-UHFFFAOYSA-N 0.000 description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 2
- DHLUJPLHLZJUBW-UHFFFAOYSA-N 6-methylpyridin-3-ol Chemical compound CC1=CC=C(O)C=N1 DHLUJPLHLZJUBW-UHFFFAOYSA-N 0.000 description 2
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- 229920002799 BoPET Polymers 0.000 description 2
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- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical class O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
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- 239000002216 antistatic agent Substances 0.000 description 2
- 150000001541 aziridines Chemical class 0.000 description 2
- 238000007611 bar coating method Methods 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
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- 125000002485 formyl group Chemical group [H]C(*)=O 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
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- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 125000005462 imide group Chemical group 0.000 description 2
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- IJFXRHURBJZNAO-UHFFFAOYSA-N meta--hydroxybenzoic acid Natural products OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 description 2
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- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
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- WEQSMXWTBRYPDN-UHFFFAOYSA-N 1,2,5-trimethylimidazole Chemical compound CC1=CN=C(C)N1C WEQSMXWTBRYPDN-UHFFFAOYSA-N 0.000 description 1
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- 125000004966 cyanoalkyl group Chemical group 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
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- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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- 238000010030 laminating Methods 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Chemical class 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical class [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
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- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 description 1
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- WLFXSECCHULRRO-UHFFFAOYSA-N pyridine-2,6-diol Chemical compound OC1=CC=CC(O)=N1 WLFXSECCHULRRO-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
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- 229920002050 silicone resin Polymers 0.000 description 1
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- 229910001220 stainless steel Inorganic materials 0.000 description 1
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- 238000003756 stirring Methods 0.000 description 1
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- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
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- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
Description
本発明は耐熱性、加工性、周波数特性に優れた積層ポリフェニレンサルファイドフィルム及びそれを使用した各種音響機器すなわちスピーカーを構成する音響機器振動板用フィルムまたは音響機器振動板に関するものである。 The present invention relates to a laminated polyphenylene sulfide film excellent in heat resistance, workability, and frequency characteristics, and various acoustic devices using the film, that is, a film for an acoustic device diaphragm or an acoustic device diaphragm constituting a speaker.
従来、ポリフェニレンサルファイドフィルムはその耐熱特性、電気的特性、難燃特性などから電気絶縁材料、コンデンサ用材料、建築材料として使用されている。また、音響機器振動板としても高い周波数特性を示すことから好ましく使用されている。
一般的にプラスチックから成る音響機器振動板としてはポリエチレンテレフタレート(以下PETと略す)フィルムが使用されている。その他、PETの両面に芳香族ポリイミドを含む樹脂層が積層された積層フィルム(以下ZVフィルムと略す)が開示されている。
Conventionally, polyphenylene sulfide films have been used as electrical insulating materials, capacitor materials, and building materials because of their heat resistance, electrical characteristics, and flame retardancy. Also, it is preferably used as an acoustic device diaphragm because it exhibits high frequency characteristics.
In general, a polyethylene terephthalate (hereinafter abbreviated as PET) film is used as an acoustic device diaphragm made of plastic. In addition, a laminated film (hereinafter abbreviated as ZV film) in which resin layers containing aromatic polyimide are laminated on both sides of PET is disclosed.
PETを用いた音響機器振動板は、小口径のスピーカー、例えば小型ラジオ用スピーカヘッドホン用スピーカーなどに使用した場合、65℃以上の雰囲気下で熱変形を生じ易く、このため異常音を発生することがあるという耐熱性に関して根本的な問題があった。また、PETは、弾性率が比較的高いが内部損失が小さいため、低域再生が不十分でまた音響周波数特性上にピーク,ディップが生じやすいという問題があり、フィルムの膜厚を薄くしてスティフネスを小さくすると分割共振が生じやすく、再生時歪の発生原因となり易いという問題もあった。 When used for small-diameter speakers, such as small radio speakers, headphones speakers, etc., acoustic device diaphragms using PET are susceptible to thermal deformation in an atmosphere of 65 ° C or higher, and thus generate abnormal sounds. There was a fundamental problem with regard to heat resistance. In addition, PET has a relatively high elastic modulus but low internal loss, so there is a problem that low-frequency reproduction is insufficient and peaks and dips are likely to occur in the acoustic frequency characteristics. When the stiffness is reduced, there is a problem that division resonance is likely to occur, and distortion during reproduction is likely to occur.
ZVフィルムは、PET製の振動板よりも耐熱性に優れているが、PETと同様に、低音域再生が不十分でまた音響周波数特性上にピーク,ディップが生じやすいという問題とフィルムの膜厚を薄くしてスティフネスを小さくすると分割共振が生じやすく、再生時歪の発生原因となり易いという問題も解決できていない。 ZV film has better heat resistance than PET diaphragm, but, like PET, the low frequency reproduction is insufficient and the peak and dip are likely to occur in the acoustic frequency characteristics and the film thickness. If the thickness is reduced and the stiffness is reduced, the split resonance is likely to occur, and the problem that distortion during reproduction is likely to occur cannot be solved.
一方、PPSフィルムの音響機器振動板は、PET製の振動板よりも、耐熱性や周波数特性に優れているが、スピーカー振動板に成形加工する際に裂けたり、割れるなどの問題が度々あり、成形性、歩留まり・コストの点で必ずしも満足のいくものではなかった。 On the other hand, PPS film acoustic equipment diaphragms are superior to PET diaphragms in heat resistance and frequency characteristics, but they often have problems such as tearing and cracking when molded into speaker diaphragms. In terms of formability, yield and cost, it was not always satisfactory.
また、耐熱性と成形性を兼ね備えた音響機器振動板として、例えばPPSフィルムの両面に芳香族ポリイミドを含む樹脂層が積層させた積層フィルムなどが検討されていたが、PPSフィルムと該樹脂層の密着性が悪く、成形加工中にPPSフィルムから該樹脂層が剥離するなどの問題があった。 Further, as an acoustic device diaphragm having both heat resistance and moldability, for example, a laminated film in which a resin layer containing an aromatic polyimide is laminated on both sides of a PPS film has been studied. There were problems such as poor adhesion and peeling of the resin layer from the PPS film during molding.
そこで、本発明は上記の課題を解決するために、以下の構成を有する。
PPSフィルムの少なくとも片面に下記化学構造(1)式を有するシランカップリング剤を1.0質量%以上含有するポリエステル樹脂からなるプライマー層が積層され、該プライマー層のPPS面の反対面に芳香族ポリイミドを含む樹脂層が積層された積層PPSフィルムである。
Therefore, the present invention has the following configuration in order to solve the above problems.
A silane coupling agent having at least one surface by the following chemical structure (1) of the PPS film 1. It is a laminated PPS film in which a primer layer made of a polyester resin containing 0 % by mass or more is laminated, and a resin layer containing an aromatic polyimide is laminated on the opposite side of the PPS surface of the primer layer.
Xはメルカプト基を示し、R1、R2は同一でも異なっていてもよく、炭素数1〜4のアルキル基を示す。また、nは1以上の整数を、mは0〜3の整数を示す。 X represents a mercapto group, and R 1 and R 2 may be the same or different and each represents an alkyl group having 1 to 4 carbon atoms. N represents an integer of 1 or more, and m represents an integer of 0 to 3.
本発明によれば、PPSフィルムの少なくとも片面に易接着効果を付与する表面処理を行い、該処理面に芳香族ポリイミドを含む樹脂層を積層することで耐熱性、周波数特性及び成形性に優れた積層PPSフィルムを提供することができる。 According to the present invention, surface treatment that imparts an easy-adhesion effect to at least one surface of the PPS film is performed, and the resin layer containing an aromatic polyimide is laminated on the treated surface, which is excellent in heat resistance, frequency characteristics, and moldability. A laminated PPS film can be provided.
本発明は、PPSフィルムの少なくとも片面に下記化学構造(1)式を有するシランカップリング剤を1.0質量%以上含有するポリエステル樹脂からなるプライマー層が積層され、該プライマー層のPPS面の反対面に芳香族ポリイミドを含む樹脂層が積層された積層PPSフィルムである。 The present invention is a silane coupling agent having at least one surface by the following chemical structure (1) of the PPS film 1. It is a laminated PPS film in which a primer layer made of a polyester resin containing 0 % by mass or more is laminated, and a resin layer containing an aromatic polyimide is laminated on the opposite side of the PPS surface of the primer layer.
以下、さらに詳しく本発明の積層PPSフィルムについて、説明する。
本発明において、PPSとは、繰り返し単位の80モル%以上(好ましくは90モル%以上)が次式(I)で示される構成単位からなる重合体をいう。
Hereinafter, the laminated PPS film of the present invention will be described in more detail.
In the present invention, PPS refers to a polymer in which 80 mol% or more (preferably 90 mol% or more) of repeating units are composed of structural units represented by the following formula (I).
かかる成分が80モル%未満ではポリマーの結晶性、軟化点等が低くなり、得られるフィルムの耐熱性、寸法安定性および機械的特性などを損なう。繰り返し単位の20モル%未満(好ましくは10モル%未満)であれば、共重合可能なスルフィド結合を含有する単位が含まれていても差し支えない。該重合体の共重合の仕方はランダム、ブロックを問わない。 If this component is less than 80 mol%, the crystallinity, softening point and the like of the polymer are lowered, and the heat resistance, dimensional stability and mechanical properties of the resulting film are impaired. As long as it is less than 20 mol% (preferably less than 10 mol%) of the repeating unit, a unit containing a copolymerizable sulfide bond may be contained. The copolymerization method of the polymer may be random or block.
本発明においてPPS樹脂組成物とは、上記PPS(好ましくはポリ−p−フェニレンサルファイド)を90質量%以上含む樹脂組成物をいう。樹脂組成物中の残りの10質量%未満は、PPS以外のポリマーおよび/または充填剤、滑剤、着色剤、紫外線吸収剤、帯電防止剤、酸化防止剤等の添加剤であってもかまわない。 In the present invention, the PPS resin composition refers to a resin composition containing 90% by mass or more of the PPS (preferably poly-p-phenylene sulfide). The remaining less than 10% by mass in the resin composition may be a polymer other than PPS and / or an additive such as a filler, a lubricant, a colorant, an ultraviolet absorber, an antistatic agent and an antioxidant.
また、本発明のPPS樹脂組成物の溶融粘度は温度300℃、せん断速度200sec-1 のもとで100〜50000ポイズ、さらには500〜12000ポイズの範囲が製膜性の面で好ましい。また、本発明のPPSフィルムとは、上記のPPS樹脂組成物を溶融成形した二軸延伸フィルムである。 Further, the melt viscosity of the PPS resin composition of the present invention is preferably in the range of 100 to 50000 poises, more preferably 500 to 12000 poises at a temperature of 300 ° C. and a shear rate of 200 sec −1 in terms of film forming property. The PPS film of the present invention is a biaxially stretched film obtained by melt-molding the above PPS resin composition.
本発明において、該PPSフィルムの表面粗度を変更させるために、該PPS樹脂組成物に粒子を混入させてもかまわない。粒子とは、有機物であるか、無機物であるかは問わず、例えばシリカ、アルミナ、炭酸カルシウム、酸化マグネシウム、酸化チタン、珪酸アルミニウム、硫酸バリウムなどの鉱物類、金属、金属酸化物、金属塩類、高融点ポリマー、架橋ポリマー等の微粒子であればよい。粒子の混入量や平均粒径は目的にあわせて適宜変更してかまわない。 In the present invention, particles may be mixed into the PPS resin composition in order to change the surface roughness of the PPS film. Regardless of whether the particles are organic or inorganic, for example, minerals such as silica, alumina, calcium carbonate, magnesium oxide, titanium oxide, aluminum silicate, barium sulfate, metals, metal oxides, metal salts, What is necessary is just fine particles, such as a high melting point polymer and a crosslinked polymer. The mixing amount of particles and the average particle diameter may be appropriately changed according to the purpose.
本発明の該PPSフィルムの表面は易接着効果を有することが好ましく、コロナ処理がされてなることが好ましい。コロナ処理の処理量は、600〜12000J/m2(10〜200W・分/m2)以上、好ましくは1,200〜9000J/m2(20〜180W・分/m2)以上である。コロナ処理量が600J/m2(10W・分/m2)未満では、コロナ処理による密着効果が不十分で、その後にプライマー層及び樹脂層を積層された積層PPSフィルムを加工中に積層されている樹脂層などが剥離しやすい傾向がある。またコロナ処理量が12000J/m2(200W・分/m2)以上になると、コロナ処理による密着効果が頭打ちになるため、12000J/m2(200W・分/m2)以下で十分である。 The surface of the PPS film of the present invention preferably has an easy adhesion effect, and is preferably subjected to corona treatment. The amount of corona treatment is 600 to 12000 J / m 2 (10 to 200 W · min / m 2 ) or more, preferably 1,200 to 9000 J / m 2 (20 to 180 W · min / m 2 ) or more. When the amount of corona treatment is less than 600 J / m 2 (10 W · min / m 2 ), the adhesion effect due to corona treatment is insufficient, and then a laminated PPS film laminated with a primer layer and a resin layer is laminated during processing. There is a tendency that the resin layer etc. which peel are easy to peel. When the corona treatment amount is 12000 J / m 2 (200 W · min / m 2 ) or more, the adhesion effect due to the corona treatment reaches a peak, and 12000 J / m 2 (200 W · min / m 2 ) or less is sufficient.
本発明においては、PPSフィルムと樹脂層との間にプライマー層が積層されていることが好ましい。ここで、プライマー層とは、PPSフィルムと樹脂層との密着性を高める効果を有する層である。PPSフィルムと樹脂層との密着性が高いと、積層PPSフィルムを加工する加工工程において、樹脂層がはがれる等の不都合を生じにくい。 In the present invention, a primer layer is preferably laminated between the PPS film and the resin layer. Here, the primer layer is a layer having an effect of improving the adhesion between the PPS film and the resin layer. When the adhesiveness between the PPS film and the resin layer is high, inconveniences such as peeling of the resin layer are unlikely to occur in the processing step of processing the laminated PPS film.
プライマー層の積層方法は特に限定されず、例えば、PPSフィルムとの共押出によって設ける方法、PPSフィルムおよび/または樹脂層にプライマー層形成成分を溶解した溶液を塗布後、乾燥する方法など任意である。プライマー層の塗布方法は特に限定されず、公知の各種塗布方法、例えば、リバースコート法、グラビアコート法、ロッドコート法、バーコート法、マイヤーバーコート法、ダイコート法、スプレーコート法などを用いることができる。 The method for laminating the primer layer is not particularly limited, and may be any method such as a method of providing by coextrusion with a PPS film, a method of applying a solution in which a primer layer forming component is dissolved in a PPS film and / or a resin layer, and drying. . The primer layer coating method is not particularly limited, and various known coating methods such as reverse coating, gravure coating, rod coating, bar coating, Mayer bar coating, die coating, and spray coating may be used. Can do.
プライマー層の材料としては、ウレタン樹脂、ポリエステル樹脂、アクリル樹脂などを用いることができ、好ましくはポリエステル樹脂である。ポリエステル樹脂は変性体であってもよく共重合体であってもよい。また、プライマー層には、架橋剤を含むことが好ましい。架橋剤としては、例えば、メラミン化合物、オキサゾリン系架橋剤、イソシアネート化合物、アジリジン化合物、エポキシ樹脂、メチロール化あるいはアルキロール化した尿素系架橋剤、アクリルアミド系架橋剤、ポリアミド系樹脂、アミドエポキシ化合物などを用いることができる。 As a material for the primer layer, urethane resin, polyester resin, acrylic resin, and the like can be used, and polyester resin is preferable. The polyester resin may be a modified product or a copolymer. The primer layer preferably contains a cross-linking agent. Examples of the crosslinking agent include melamine compounds, oxazoline-based crosslinking agents, isocyanate compounds, aziridine compounds, epoxy resins, methylolized or alkylolized urea-based crosslinking agents, acrylamide-based crosslinking agents, polyamide-based resins, amide-epoxy compounds, and the like. Can be used.
本発明では、上記プライマー層に以下の化学構造(1)のシランカップリング剤を添加させることで、PPSフィルムと樹脂層の密着力をさらに向上させている。 In the present invention, the adhesion between the PPS film and the resin layer is further improved by adding a silane coupling agent having the following chemical structure (1) to the primer layer.
化学構造(1)は上記のとおりであり、Xはメルカプト基を示し、R1、R2は同一でも異なっていてもよく、炭素数1〜4のアルキル基を示す。また、nは1以上の整数を、mは0〜3の整数を示す。メルカプト基とは(−SH)で示される官能基であり、アルキル基とは(CnH2n+1):nは1以上の整数で示される官能基である。メルカプト基を含まないシランカップリング剤を添加した場合、プライマー層及び樹脂層を積層した積層PPSフィルムの加工中に積層されている樹脂層などが剥離しやすいという傾向がある。 The chemical structure (1) is as described above, X represents a mercapto group, R 1 and R 2 may be the same or different, and represent an alkyl group having 1 to 4 carbon atoms. N represents an integer of 1 or more, and m represents an integer of 0 to 3. The mercapto group is a functional group represented by (—SH), and the alkyl group is (C n H 2n + 1 ): n is a functional group represented by an integer of 1 or more. When a silane coupling agent that does not contain a mercapto group is added, there is a tendency that the resin layer and the like laminated during the processing of the laminated PPS film in which the primer layer and the resin layer are laminated are easily peeled off.
本発明の該シランカップリング剤の添加量は高分子プライマーに1質量%以上添加させることが好ましく、5質量%以上添加させることがより好ましい。添加量が1質量%以下であると、加工中に積層されている樹脂層などが剥離しやすいという傾向がある。 The addition amount of the silane coupling agent of the present invention is preferably 1% by mass or more, more preferably 5% by mass or more, to the polymer primer. When the addition amount is 1% by mass or less, there is a tendency that a resin layer or the like laminated during processing is easily peeled off.
本発明の高プライマー層の厚みは0.1μm以上であることが好ましく、より好ましくは0.3μm以上である。該プライマー層の厚みが0.1μm未満になると、プライマー層による密着効果が薄れその後に樹脂層が積層された積層PPSフィルムを加工中に積層された樹脂層が剥離しやすい傾向がある。 The thickness of the high primer layer of the present invention is preferably 0.1 μm or more, more preferably 0.3 μm or more. When the thickness of the primer layer is less than 0.1 μm, the adhesion effect by the primer layer is reduced, and the laminated PPS film having the resin layer laminated thereon tends to peel off during the processing of the laminated PPS film.
本発明の樹脂層に用いられるポリイミドは、ポリアミド酸のイミド化率が50%以上であることが好ましい。イミド化率が50%未満であると、耐熱性の機能を十分に発現することができないことがあり好ましくない。イミド化率は、より好ましくは75%以上であり、さらに好ましくは90%以上である。 The polyimide used for the resin layer of the present invention preferably has an imidization ratio of polyamic acid of 50% or more. If the imidation rate is less than 50%, the heat-resistant function may not be sufficiently exhibited, which is not preferable. The imidation ratio is more preferably 75% or more, and further preferably 90% or more.
ここで言うイミド化率とは、ポリアミド酸中のアミド基とカルボキシル基の間で脱水閉環反応が起こり、イミド基となっている割合のことである。このイミド化率を測定する方法としては特に限定されないが、本発明では、樹脂層の赤外吸収スペクトルを、赤外分光光度計を用いてATR法によって測定し、そのとき1400cm−1から1300cm−1に現れるイミド基の特性吸収の強度から求める方法を用いて計算した値である。 The imidation rate referred to here is the ratio of dehydration ring closure reaction between the amide group and the carboxyl group in the polyamic acid to form an imide group. Although it does not specifically limit as a method to measure this imidation rate, In this invention, the infrared absorption spectrum of a resin layer is measured by an ATR method using an infrared spectrophotometer, At that time, 1400cm < -1 > to 1300cm < - > 1 is a value calculated using a method obtained from the strength of characteristic absorption of the imide group appearing in 1 .
本発明の樹脂層に使用されるポリイミドの種類は特に限定されないが、耐熱性などの点から、ポリアミド酸としては、下記式(II)および/または(III)で表される構造単位が全構造単位中の70モル%以上であることが好ましく、より好ましくは90モル%以上含まれるのが好ましい。 Although the kind of polyimide used for the resin layer of the present invention is not particularly limited, from the viewpoint of heat resistance, as the polyamic acid, the structural unit represented by the following formula (II) and / or (III) has an entire structure. It is preferably 70 mol% or more in the unit, more preferably 90 mol% or more.
式(II)、(III)中のRは下記式(IV) の中から選ばれる少なくとも1種の基であり、ここで、式(IV)中のX、Yは、O,CH2,CO,SO2,S,C(CH2)2の中から選ばれる少なくとも1種の基である。 R in the formulas (II) and (III) is at least one group selected from the following formula (IV): wherein X and Y in the formula (IV) are O, CH 2 , CO , SO 2 , S, C (CH 2 ) 2 .
ポリアミド酸の全構造単位中の30モル%を越える部分が上記式(II)および/または(III)で表される構造単位でない場合には、耐熱性、難燃性の効果がなかったり、積層厚みを厚くしなければ耐熱性、難燃性の効果が得られないことがあり、生産性やコスト面で優位性のないものとなる可能性がある。 When the portion exceeding 30 mol% of the total structural units of the polyamic acid is not the structural unit represented by the above formula (II) and / or (III), there is no effect of heat resistance and flame retardancy, If the thickness is not increased, the effects of heat resistance and flame retardancy may not be obtained, and there may be no advantage in productivity and cost.
また、上記式(II)および/または(III)で表される構造単位以外の構造を単位30モル%より多く有するポリアミド酸は、これを合成するときの原料コストが高くなるため、面状発熱体のコストが高くなるなどの問題が生じる場合がある。本発明におけるポリアミド酸は、より好ましくは下記式(V)で表される構造単位を70モル%以上有するポリアミド酸であり、特に好ましくは下記式(V)で表される構造単位を90モル%以上有するポリアミド酸である。 In addition, the polyamic acid having a structure other than the structural unit represented by the above formula (II) and / or (III) in an amount of more than 30 mol% increases the raw material cost when synthesizing the polyamic acid, and thus the sheet heat generation Problems such as increased body costs may occur. The polyamic acid in the present invention is more preferably a polyamic acid having 70 mol% or more of a structural unit represented by the following formula (V), particularly preferably 90 mol% of a structural unit represented by the following formula (V). It is a polyamic acid having the above.
これらのポリアミド酸樹脂の溶剤としては、特に限定されないが、N−メチル−2−ピロリドン、N,N−ジメチルホルムアミド、N,N−ジメチルアセトアミド、N,N,N’,N’−テトラメチル尿素、N,N−ジメチルイミダゾリジノン、ヘキサメチルホスフォルアミド等のアミド系溶媒、γ−ブチロラクタム等のラクタム系溶媒などが用いられる。 Solvents for these polyamic acid resins are not particularly limited, but N-methyl-2-pyrrolidone, N, N-dimethylformamide, N, N-dimethylacetamide, N, N, N ′, N′-tetramethylurea Amide solvents such as N, N-dimethylimidazolidinone and hexamethylphosformamide, and lactam solvents such as γ-butyrolactam are used.
本発明の樹脂層としてポリアミド酸溶液を塗布して形成する場合、該溶液中には、下記式(VI)で示されるヒドロキシピリジン系化合物、下記式(VI)で示されるイミダゾ−ル系化合物、m−ヒドロキシ安息香酸、p−ヒドロキシフェニル酢酸、p−フェノールスルホン酸から選ばれる少なくとも1種の化合物が、ポリアミド酸の繰り返し単位に対して1モル%以上含まれていることが好ましい。 When the polyamic acid solution is applied and formed as the resin layer of the present invention, in the solution, a hydroxypyridine compound represented by the following formula (VI), an imidazole compound represented by the following formula (VI), It is preferable that at least one compound selected from m-hydroxybenzoic acid, p-hydroxyphenylacetic acid, and p-phenolsulfonic acid is contained in an amount of 1 mol% or more based on the repeating unit of the polyamic acid.
式中、R1、R2、R3、R4およびR5のうち少なくとも1つは水酸基を示し、その他は、それぞれ水素原子、脂肪族基、芳香族基、シクロアルキル基、アラルキル基、ホルミル基のいずれかを示す。
In the formula, at least one of R 1,
式中、R1、R2、R3およびR4は、それぞれ、水素原子、脂肪族基、芳香族基、シクロアルキル基、アラルキル基、ホルミル基のいずれかを示す。R1、R2、R3およびR4としては、例えば、脂肪族基の場合は炭素数1〜17のアルキル基、ビニル基、ヒドロキシアルキル基、シアノアルキル基が好ましく、芳香族基の場合はフェニル基が好ましく、アラルキル基の場合はベンジル基が好ましい。 In the formula, each of R1, R2, R3, and R4 represents a hydrogen atom, an aliphatic group, an aromatic group, a cycloalkyl group, an aralkyl group, or a formyl group. As R1, R2, R3 and R4, for example, an aliphatic group is preferably an alkyl group having 1 to 17 carbon atoms, a vinyl group, a hydroxyalkyl group or a cyanoalkyl group, and in the case of an aromatic group, a phenyl group is preferred. In the case of an aralkyl group, a benzyl group is preferred.
上記式(VI)で示されるヒドロキシピリジン系化合物、式(VII)で示されるイミダゾ−ル系化合物、m−ヒドロキシ安息香酸、p−ヒドロキシフェニル酢酸、p−フェノールスルホン酸には、アミド酸成分の脱水閉環促進効果があることから、これらの化合物から選ばれる少なくとも1種の化合物が添加されていると、添加しない場合よりも低温、短時間の熱処理でイミド化率を上げることができるので、生産効率が良くなり好ましい。 The hydroxypyridine compound represented by the above formula (VI), the imidazole compound represented by the formula (VII), m-hydroxybenzoic acid, p-hydroxyphenylacetic acid, and p-phenolsulfonic acid include an amide acid component. Since at least one compound selected from these compounds is added due to the effect of promoting dehydration and cyclization, the imidization rate can be increased by a heat treatment at a lower temperature and in a shorter time than when not added. It is preferable because efficiency is improved.
式(VI)のヒドロキシピリジン系化合物の具体例としては、2−ヒドロキシピリジン、3−ヒドロキシピリジン、4−ヒドロキシピリジン、2,6−ジヒドロキシピリジン、3−ヒドロキシ−6−メチルピリジン、3−ヒドロキシ−2−メチルピリジンなどが挙げられる。 Specific examples of the hydroxypyridine compound of the formula (VI) include 2-hydroxypyridine, 3-hydroxypyridine, 4-hydroxypyridine, 2,6-dihydroxypyridine, 3-hydroxy-6-methylpyridine, 3-hydroxy- Examples include 2-methylpyridine.
式(VII)のイミダゾール系化合物の具体例としては、1−メチルイミダゾール、1−エチルイミダゾール、1−プロピルイミダゾール、1−フェニルイミダゾール、1−ベンジルイミダゾール、1−ビニルイミダゾール、1−ヒドロキシエチルイミダゾール、2−メチルイミダゾール、2−エチルイミダゾール、2−プロピルイミダゾール、2−イソプロピルイミダゾール、2−ブチルイミダゾール、2−ウンデシルイミダゾール、2−ヘプタデシルイミダゾール、2−フェニルイミダゾール、2−ベンジルイミダゾール、4−メチルイミダゾール、4−フェニルイミダゾール、4−ベンジルイミダゾール、1,2−ジメチルイミダゾール、1,4−ジメチルイミダゾール、1,5−ジメチルイミダゾール、1−エチル−2−メチルイミダゾール、1−ビニル−2−メチルイミダゾール、2,4−ジメチルイミダゾール、2−エチル−4−メチルイミダゾール、2−フェニル−4−メチルイミダゾール、2−ブチル−4−ヒドロキシメチルイミダゾール、2−ブチル−4−ホルミルイミダゾール、2,4−ジフェニルイミダゾール、4,5−ジメチルイミダゾール、4,5−ジフェニルイミダゾール、1−ベンジル−2−メチルイミダゾール、1−ベンジル−2−フェニルイミダゾール、1,2,5−トリメチルイミダゾール、1,4,5−トリメチルイミダゾール、1−メチル−4,5−ジフェニルイミダゾール、2−メチル−4,5−ジフェニルイミダゾール、2,4,5−トリメチルイミダゾール、2,4,5−トリフェニルイミダゾール、1−シアノエチル−2−メチルイミダゾール、1−シアノエチル−2−エチル−4−メチルイミダゾール、1−シアノエチル−2−ウンデシルイミダゾール、1−シアノエチル−2−フェニルイミダゾールなどが挙げられる。 Specific examples of the imidazole compound of the formula (VII) include 1-methylimidazole, 1-ethylimidazole, 1-propylimidazole, 1-phenylimidazole, 1-benzylimidazole, 1-vinylimidazole, 1-hydroxyethylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-propylimidazole, 2-isopropylimidazole, 2-butylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 2-benzylimidazole, 4-methyl Imidazole, 4-phenylimidazole, 4-benzylimidazole, 1,2-dimethylimidazole, 1,4-dimethylimidazole, 1,5-dimethylimidazole, 1-ethyl-2-methylimidazo 1-vinyl-2-methylimidazole, 2,4-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenyl-4-methylimidazole, 2-butyl-4-hydroxymethylimidazole, 2-butyl- 4-formylimidazole, 2,4-diphenylimidazole, 4,5-dimethylimidazole, 4,5-diphenylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2,5- Trimethylimidazole, 1,4,5-trimethylimidazole, 1-methyl-4,5-diphenylimidazole, 2-methyl-4,5-diphenylimidazole, 2,4,5-trimethylimidazole, 2,4,5-tri Phenylimidazole, 1-cyanoethyl-2-methyl Imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecyl imidazole, 1-cyanoethyl-2-phenylimidazole and the like.
これらの化合物の添加量は、より好ましくはポリアミド酸の繰り返し単位に対して10モル%以上であり、さらに好ましくは50モル%以上である。添加量がポリアミド酸の繰り返し単位に対して1モル%未満であると低温、短時間でイミド化率を上げる効果が得られにくい。添加量の上限は特に規定されないが、ポリアミド酸の繰り返し単位に対して300モル%以下であることが好ましい。300モル%を越えて添加しても効果を著しく向上させるものではなく、逆に使用量が多くなることによりコスト面で不利益になることがある。 The amount of these compounds added is more preferably 10 mol% or more, and still more preferably 50 mol% or more, based on the repeating unit of the polyamic acid. When the addition amount is less than 1 mol% with respect to the repeating unit of the polyamic acid, it is difficult to obtain the effect of increasing the imidization rate at a low temperature in a short time. The upper limit of the amount added is not particularly limited, but is preferably 300 mol% or less with respect to the repeating unit of the polyamic acid. Even if it exceeds 300 mol%, the effect is not remarkably improved, and conversely, the use amount increases, which may be disadvantageous in terms of cost.
本発明の樹脂層には、ポリイミド樹脂成分以外の樹脂や有機化合物等が、共重合や混合により含有されていてもよい。ポリイミド樹脂成分以外の樹脂や有機化合物としては、例えば、酸化防止剤、耐熱安定剤、紫外線吸収剤、有機粒子、顔料、染料、帯電防止剤、各種難燃剤、アクリル樹脂、ポリエステル樹脂、ウレタン樹脂、ポリオレフィン樹脂、ポリカーボネート樹脂、アルキッド樹脂、エポキシ樹脂、尿素樹脂、フェノール樹脂、シリコーン樹脂、ゴム系樹脂、ワックス組成物、メラミン化合物、オキサゾリン系架橋剤、メチロール化、アルキロール化された尿素系架橋剤、アクリルアミド樹脂、ポリアミド樹脂、イソシアネート化合物、アジリジン化合物、各種シランカップリング剤、各種チタネート系カップリング剤などを用いることができる。特に、火災時に有毒ガスの発生もなく、環境にも優しい材料として、非ハロゲン及び非リン化合物であることがより好ましい。また、これらの材料としては、絶縁性材料がより好ましい。 The resin layer of the present invention may contain a resin or an organic compound other than the polyimide resin component by copolymerization or mixing. As resins and organic compounds other than polyimide resin components, for example, antioxidants, heat stabilizers, ultraviolet absorbers, organic particles, pigments, dyes, antistatic agents, various flame retardants, acrylic resins, polyester resins, urethane resins, Polyolefin resin, polycarbonate resin, alkyd resin, epoxy resin, urea resin, phenol resin, silicone resin, rubber resin, wax composition, melamine compound, oxazoline crosslinking agent, methylolated, alkylolized urea crosslinking agent, Acrylamide resins, polyamide resins, isocyanate compounds, aziridine compounds, various silane coupling agents, various titanate coupling agents, and the like can be used. In particular, non-halogen and non-phosphorus compounds are more preferable as environmentally friendly materials that do not generate toxic gases during a fire. Moreover, as these materials, an insulating material is more preferable.
しかし、ポリイミド樹脂成分以外の樹脂や有機化合物等が過度に含有される場合は耐熱性の低下などを招くことがあり、かかる理由から、本発明におけるポリイミド含む樹脂層とは、好ましくは、樹脂層中におけるイミド化率50%以上のポリアミド酸樹脂の含有量が樹脂層中70質量%以上である。より好ましくは80質量%以上、さらに好ましくは90質量%以上である。 However, if the resin or organic compound other than the polyimide resin component is excessively contained, the heat resistance may be lowered. For this reason, the resin layer containing polyimide in the present invention is preferably a resin layer. The content of the polyamic acid resin having an imidization ratio of 50% or more in the resin layer is 70% by mass or more in the resin layer. More preferably, it is 80 mass% or more, More preferably, it is 90 mass% or more.
一方、本発明の樹脂層の中には、本発明の効果が阻害されない範囲内で、各種の無機系添加剤を添加してもよい。特に、絶縁性材料が好ましい。例えばシリカ、コロイダルシリカ、アルミナ、アルミナゾル、カオリン、タルク、マイカ、炭酸カルシウム、硫酸バリウム、ゼオライト、酸化チタンや、水酸化アルミニウム、酸化アンチモン、水酸化マグネシウム、硼酸亜鉛、錫酸亜鉛、ジルコニウム系難燃剤、モリブデン系難燃剤などを添加した場合には、易滑性、耐傷性、耐熱性、難燃性などが向上するので好ましい。無機粒子の平均粒子径は0.005μm〜5μmが好ましく、より好ましくは0.05〜1μmである。また、その添加量は、樹脂層に対して0.05〜60質量%が好ましく、より好ましくは0.1〜40質量%、さらに好ましくは0.5〜20質量%である。 On the other hand, various inorganic additives may be added to the resin layer of the present invention as long as the effects of the present invention are not inhibited. In particular, an insulating material is preferable. For example, silica, colloidal silica, alumina, alumina sol, kaolin, talc, mica, calcium carbonate, barium sulfate, zeolite, titanium oxide, aluminum hydroxide, antimony oxide, magnesium hydroxide, zinc borate, zinc stannate, zirconium flame retardant The addition of a molybdenum-based flame retardant is preferable because it improves slipperiness, scratch resistance, heat resistance, flame retardancy, and the like. The average particle diameter of the inorganic particles is preferably 0.005 μm to 5 μm, more preferably 0.05 to 1 μm. Moreover, 0.05-60 mass% is preferable with respect to the resin layer, as for the addition amount, More preferably, it is 0.1-40 mass%, More preferably, it is 0.5-20 mass%.
本発明において、ポリアミド酸溶液の塗布方法は特に限定されず、公知の各種塗布方法、例えば、リバースコート法、グラビアコート法、ロッドコート法、バーコート法、マイヤーバーコート法、ダイコート法、スプレーコート法などを用いることができる。 In the present invention, the coating method of the polyamic acid solution is not particularly limited, and various known coating methods such as reverse coating method, gravure coating method, rod coating method, bar coating method, Mayer bar coating method, die coating method, spray coating, etc. The method etc. can be used.
ポリアミド酸溶液の塗布後、熱処理によりポリアミド酸中のアミド基とカルボキシル基を脱水閉環させ、イミド化する。熱処理方法は特に限定されないが、通常150℃以上の熱風または遠赤外線等により脱水閉環させる方法が好適に用いられる。より好ましくは180℃以上、さらに好ましくは200℃以上である。熱処理時間は、1秒から120秒が好ましく、より好ましくは5秒から60秒、さらに好ましくは10秒から30秒である。これより温度が低かったり、熱処理時間が短いとイミド化率が低くなり、好ましくない。また、熱処理時間がこれより長くなると生産性が悪くなり、好ましくない。 After application of the polyamic acid solution, the amide group and carboxyl group in the polyamic acid are dehydrated and closed by heat treatment to imidize. The heat treatment method is not particularly limited, but usually a method of dehydrating and cyclizing with hot air of 150 ° C. or higher or far infrared rays is preferably used. More preferably, it is 180 degreeC or more, More preferably, it is 200 degreeC or more. The heat treatment time is preferably 1 second to 120 seconds, more preferably 5 seconds to 60 seconds, and still more preferably 10 seconds to 30 seconds. If the temperature is lower than this, or if the heat treatment time is short, the imidization rate is lowered, which is not preferable. Further, if the heat treatment time is longer than this, the productivity is deteriorated, which is not preferable.
以上の方法以外にも、ポリイミド樹脂からなるフィルムをPPSフィルム上に貼り合わせて、樹脂層を積層させても良いが、良好な接着性が得にくく、また生産効率も悪いものとなることがある。 In addition to the above methods, a film made of polyimide resin may be laminated on the PPS film and the resin layer may be laminated. However, it is difficult to obtain good adhesiveness, and the production efficiency may be deteriorated. .
本発明において、積層PPSフィルム全体厚みに対する樹脂層厚みの割合は、0.25〜15%であることが好ましい。樹脂層厚みの割合は、より好ましくは0.5〜5%、さらに好ましくは0.5〜2.5%である。ここで、樹脂層厚みは、片面の樹脂層の厚みである。積層PPSフィルム全体厚みに対する樹脂層厚みの割合が、かかる範囲であると、耐熱性の効果が十分に発揮され、また、生産性が良好である。このとき、樹脂層の厚みは、片面当たり0.05〜10μm程度が好ましく、より好ましくは0.1〜5μm、さらに好ましくは0.1〜2.5μm程度である。樹脂層厚みの割合が大きい、および/または、樹脂層の厚みが厚い場合には、プライマー層を付与したPPSフィルムと樹脂層との接着性が低下する場合がある。また樹脂層の厚みの割合が小さい、および/または、樹脂層の厚みが薄い場合には積層PPSフィルムを加工する際に裂けたり割れたりする問題が発生しやすくなる。 In the present invention, the ratio of the resin layer thickness to the total thickness of the laminated PPS film is preferably 0.25 to 15%. The ratio of the resin layer thickness is more preferably 0.5 to 5%, and still more preferably 0.5 to 2.5%. Here, the resin layer thickness is the thickness of the resin layer on one side. When the ratio of the resin layer thickness to the total thickness of the laminated PPS film is within such a range, the effect of heat resistance is sufficiently exhibited and the productivity is good. At this time, the thickness of the resin layer is preferably about 0.05 to 10 μm per side, more preferably 0.1 to 5 μm, and still more preferably about 0.1 to 2.5 μm. When the ratio of the resin layer thickness is large and / or the resin layer is thick, the adhesion between the PPS film provided with the primer layer and the resin layer may be lowered. Further, when the ratio of the thickness of the resin layer is small and / or when the thickness of the resin layer is small, a problem of tearing or breaking when the laminated PPS film is processed is likely to occur.
本発明の積層PPSフィルムの厚みは適用する音響機器に応じて適宜決定できるが、3μm〜250μmが好ましく、さらには25〜100μmの範囲が最も好ましい。厚みが3μm以下になるとフィルムを成形加工する際に裂けたり割れたりする問題が発生しやすくなり、加工性が悪くなる。また、250μm以上の厚みになると、フィルムの剛性が大きくなることでフィルムの柔軟性がなくなり、振動板としての周波数特性が悪くなる。 The thickness of the laminated PPS film of the present invention can be determined as appropriate according to the acoustic device to be applied, but is preferably 3 μm to 250 μm, and more preferably 25 to 100 μm. When the thickness is 3 μm or less, a problem of tearing or breaking when forming the film is likely to occur, and the workability is deteriorated. On the other hand, when the thickness is 250 μm or more, the rigidity of the film is increased, so that the flexibility of the film is lost, and the frequency characteristics as the diaphragm are deteriorated.
本発明の積層PPSフィルムの弾性率は、フィルムの長手方向、幅方向共に3.5GPa以上、8GPa以下であることが好ましく、4.0GPa以上、6GPa以下がさらに好ましい。弾性率がかかる好ましい範囲であると、音響機器振動板として使用した時に十分な周波数特性が得られ、また成形性が悪化して音響機器振動板に成形しにくくなることもない。 The elastic modulus of the laminated PPS film of the present invention is preferably 3.5 GPa or more and 8 GPa or less, and more preferably 4.0 GPa or more and 6 GPa or less in both the longitudinal direction and the width direction of the film. When the elastic modulus is within such a preferable range, sufficient frequency characteristics can be obtained when used as an acoustic device diaphragm, and the moldability is not deteriorated and the acoustic device diaphragm is not easily molded.
また積層PPSフィルムの長手方向の100℃の熱収縮率は、1.0%未満、−0.5%以上であることが好ましく、0%以上、0.5%未満がより好ましい。熱収縮率がかかる好ましい範囲であると、音響機器振動板としての成形性、耐熱性が十分である。 The thermal shrinkage at 100 ° C. in the longitudinal direction of the laminated PPS film is preferably less than 1.0% and −0.5% or more, and more preferably 0% or more and less than 0.5%. When the heat shrinkage is within such a preferable range, the moldability and heat resistance as an acoustic device diaphragm are sufficient.
本発明の積層PPSフィルムのガラス転移温度は150℃以上、好ましくは200℃以上とするものであり、350℃以下、さらには300℃以下であることが好ましい。ガラス転移温度が150℃未満では、該フィルムから構成される音響機器振動板の耐熱性が不十分となることがある。 The laminated PPS film of the present invention has a glass transition temperature of 150 ° C. or higher, preferably 200 ° C. or higher, preferably 350 ° C. or lower, more preferably 300 ° C. or lower. When the glass transition temperature is less than 150 ° C., the heat resistance of the acoustic device diaphragm composed of the film may be insufficient.
〔評価方法〕
各実施例および比較例で作成した積層PPSフィルムについて、以下(1)〜(5)の測定を行った。
〔Evaluation method〕
The following measurements (1) to (5) were performed on the laminated PPS films prepared in each Example and Comparative Example.
(1)フィルム厚み
積層PPSフィルムの断面を切り出しその断面を(株)日立製作所製の透過型電子顕微鏡HU-12型で観察し、一方の面のプライマー層の厚み(t1)および積層PPSフィルム全体の厚み(t2)を測定した。
(1) Film thickness A cross section of a laminated PPS film is cut out and the cross section is observed with a transmission electron microscope HU-12 manufactured by Hitachi, Ltd. The primer layer thickness (t1) on one side and the entire laminated PPS film The thickness (t2) of was measured.
(2)成形性
フィルムを150℃の温度雰囲気中で加熱し、40℃程度に加温された金型にて成形プレスして、図1に示す構成のスピーカーで使用する音響機器振動板8を作製する。この時、100個のスピーカーを作製し、下記の基準で成形性を判断した。
○:全く問題なく、所望の形状に成形できる。
△:1〜3個は、熱収縮歪みによるシワが発生する。
×:3個以上が、熱収縮歪みによるシワが発生したり、加工時に裂けて、所望の形状の振動板が得られない。
(2) The moldable film is heated in a temperature atmosphere of 150 ° C. and molded and pressed with a mold heated to about 40 ° C., so that the acoustic device diaphragm 8 used in the speaker having the configuration shown in FIG. Make it. At this time, 100 speakers were produced, and the moldability was judged according to the following criteria.
○: Can be formed into a desired shape without any problem.
Δ: 1 to 3 wrinkles due to heat shrinkage strain.
X: Three or more wrinkles are generated due to heat shrinkage distortion or tearing during processing, and a diaphragm having a desired shape cannot be obtained.
(3)動的弾性率
セイコーインスツルメント製非共振強制伸張振動型装置DMS6100を用いて、下記の条件で測定した。測定方向は、フィルムの長手方向である。測定を10回実施し、25℃の測定値の平均値を求めた。
周波数 : 10Hz 振動変位 : 25μm 初荷重 : 200mN 昇温速度 : 2℃/分 試料寸法 : 35mm(チャック間隔)×10mm(幅)測定雰囲気 : 窒素ガス気流中 測定室雰囲気 : 23℃、60%RH
(4)ガラス転移温度(Tg)
下記装置および条件で比熱測定を行い、JIS K 7121に従って決定した。
装 置 :TA Instrument社製温度変調DSC 測定温度 :270〜570K(RCS冷却法) 温度校正 :高純度インジウムおよびスズの融点 温度変調振幅:±1K 温度変調周期:60秒 昇温ステップ:5K 試料質量 :5mg 試料容器 :アルミニウム製開放型容器(22mg) 参照容器 :アルミニウム製開放型容器(18mg)
なお、ガラス転移温度は下記式により算出した。
ガラス転移温度=(補外ガラス転移開始温度+補外ガラス転移終了温度)/2
(5)樹脂層の密着性
積層PPSフィルムの樹脂層に1mm2のクロスカットを100個入れ、ニチバン(株)製セロハンテープをクロスカットを入れた面上に貼り付け、ゴムローラーを用いて、荷重19.6Nで3往復させ、押し付けた後、90度方向に剥離した。残存した樹脂層の個数により、2段階評価(○:100、×:0〜99)した。○が合格である。
(3) Dynamic elastic modulus Measured under the following conditions using a non-resonant forced stretching vibration type device DMS6100 manufactured by Seiko Instruments. The measurement direction is the longitudinal direction of the film. The measurement was carried out 10 times, and the average value of the measured values at 25 ° C. was obtained.
Frequency: 10 Hz Vibration displacement: 25 μm Initial load: 200 mN Temperature increase rate: 2 ° C./min Sample size: 35 mm (chuck interval) × 10 mm (width) Measurement atmosphere: in nitrogen gas flow Measurement chamber atmosphere: 23 ° C., 60% RH
(4) Glass transition temperature (Tg)
Specific heat was measured with the following equipment and conditions, and determined according to JIS K7121.
Apparatus: Temperature modulation DSC manufactured by TA Instrument Measurement temperature: 270-570K (RCS cooling method) Temperature calibration: Melting point of high purity indium and tin Temperature modulation amplitude: ± 1K Temperature modulation period: 60 seconds Temperature increase step: 5K Sample mass : 5 mg Sample container: Aluminum open container (22 mg) Reference container: Aluminum open container (18 mg)
The glass transition temperature was calculated by the following formula.
Glass transition temperature = (extrapolated glass transition start temperature + extrapolated glass transition end temperature) / 2
(5) Adhesiveness of resin layer 100 pieces of 1 mm 2 crosscuts are put in the resin layer of the laminated PPS film, and cellophane tape manufactured by Nichiban Co., Ltd. is attached on the surface on which the crosscuts are put, and a rubber roller is used. After reciprocating 3 times with a load of 19.6 N, it was peeled in the direction of 90 degrees. Two-stage evaluation (◯: 100, x: 0 to 99) was performed according to the number of remaining resin layers. ○ is a pass.
〔実施例1〕
フィルム基材として厚さ50μmのPPSフィルム(東レ(株)製トレリナ(登録商標)#50 3000)を使用し、その両面にコロナ処理を施した。コロナ放電処理機は春日電気(株)製コロナ放電処理機HFS400Fを用い、アルミ電極、トリータロールにはシリコーン被覆ロールを用い、電極とロールとのギャップを2mmとし、ライン速度約30m/分、印加エネルギー密度100W・分/m2にて処理を行った。
[Example 1]
A PPS film having a thickness of 50 μm (Torelina (registered trademark) # 50 3000 manufactured by Toray Industries, Inc.) was used as a film substrate, and corona treatment was performed on both sides thereof. The corona discharge treatment machine uses a Kasuga Electric Co., Ltd. corona discharge treatment machine HFS400F, the aluminum electrode and the treater roll use a silicone-coated roll, the gap between the electrode and the roll is 2 mm, the line speed is about 30 m / min, the applied energy Processing was performed at a density of 100 W · min / m 2 .
次に下記のポリエステル樹脂1に対して、架橋剤として下記のメラミン化合物1を、固形分質量比で85/15となるように混合し、イソプロピルアルコールと水との混合溶媒(10/90(質量比))を用いて、固形分濃度を3質量%となるように希釈したものをプライマー層形成用の塗布液1とした。 Next, the following melamine compound 1 as a crosslinking agent is mixed with the following polyester resin 1 so as to have a solid content mass ratio of 85/15, and a mixed solvent of isopropyl alcohol and water (10/90 (mass) The composition diluted to have a solid content concentration of 3% by mass was used as a coating solution 1 for forming a primer layer.
・ポリエステル樹脂1:
・酸成分
テレフタル酸 60モル%
イソフタル酸 14モル%
トリメリット酸 20モル%
セバチン酸 6モル%。
・ Polyester resin 1:
・ 60 mol% of acid component terephthalic acid
Isophthalic acid 14 mol%
Trimellitic acid 20 mol%
Sebacic acid 6 mol%.
・ジオール成分
エチレングリコール 28モル%
ネオペンチルグリコール 38モル%
1,4−ブタンジオール 34モル%。
・ Diol component ethylene glycol 28mol%
Neopentyl glycol 38 mol%
1,4-butanediol 34 mol%.
上記ポリエステル樹脂1(Tg:20℃)をアンモニア水で水性化した水分散体とした。 The polyester resin 1 (Tg: 20 ° C.) was made into an aqueous dispersion obtained by making it aqueous with ammonia water.
・メラミン化合物1:
ハイソリッド型アミノ樹脂であるサイテック社製“サイメル(登録商標)”325(イミノ基型メチル化メラミン)を、メラミン化合物1とした。
Melamine compound 1:
“Cymel (registered trademark)” 325 (imino group-type methylated melamine) manufactured by Cytec Co., which is a high solid type amino resin, was used as melamine compound 1.
上記塗布液1に以下の東レダウコーニング社製シランカップリング剤Z-6062を10質量%添加させグラビアコーターでPPSフィルムの全面に塗布し、105℃の加熱ゾーンで乾燥させ、220℃で熱処理を施し、プライマー層を0.3μm形成した。 10% by mass of the following silane coupling agent Z-6062 manufactured by Toray Dow Corning Co., Ltd. is added to the coating solution 1 and applied to the entire surface of the PPS film with a gravure coater, dried in a heating zone at 105 ° C., and heat-treated at 220 ° C. And a primer layer of 0.3 μm was formed.
次に、ステンレス製の重合釜に、秤量した4,4’−ジアミノジフェニルエーテルをN−メチル−2−ピロリドンとともに加え、撹拌して溶解した。次に、この溶液にピロメリット酸二無水物を4,4’−ジアミノジフェニルエーテル100molに対して100mol、反応温度が60℃以下になるように添加した。その後、粘度が一定になったところで重合を終了し、ポリアミド酸の重合溶液を得た。これに、水酸化アルミニウム(昭和電工(株)製、”ハジライト”H−42M)を固形分質量比で、ポリアミド酸/水酸化アルミニウム=70/30となるように添加し、分散させた。樹脂層の厚みに応じた所望濃度となるように、この溶液をN−メチル−2−ピロリドンで適宜希釈して、さらに塗布前に4−ヒドロキシピリジンをポリアミド酸の繰り返し単位に対して100モル%添加し、これをポリアミド酸溶液とした。なお、このポリアミド酸は、下記式(VIII)における2種の構造単位の両方が混在したものであった。 Next, 4,4'-diaminodiphenyl ether weighed together with N-methyl-2-pyrrolidone was added to a stainless steel polymerization kettle and dissolved by stirring. Next, pyromellitic dianhydride was added to this solution so that the reaction temperature was 100 ° C. or less with respect to 100 mol of 4,4′-diaminodiphenyl ether. Thereafter, when the viscosity became constant, the polymerization was terminated to obtain a polyamic acid polymerization solution. To this, aluminum hydroxide (“Hagilite” H-42M, manufactured by Showa Denko KK) was added and dispersed in a solid mass ratio such that polyamic acid / aluminum hydroxide = 70/30. This solution is appropriately diluted with N-methyl-2-pyrrolidone so as to have a desired concentration according to the thickness of the resin layer, and 4-hydroxypyridine is added at 100 mol% with respect to the repeating unit of polyamic acid before coating. This was added to obtain a polyamic acid solution. This polyamic acid was a mixture of both two structural units in the following formula (VIII).
上記プライマー層を積層されたPPSフィルムのプライマー層面に上記ポリアミド酸をグラビアコーターで全面に塗布し、130℃で乾燥し、200℃で熱処理して、樹脂層を1.5μm形成しトータル厚み51.8μmの積層PPSフィルムを得た。 The polyamic acid is applied to the entire surface of the primer layer of the PPS film on which the primer layer is laminated with a gravure coater, dried at 130 ° C., and heat-treated at 200 ° C. to form a resin layer having a total thickness of 51 μm. An 8 μm laminated PPS film was obtained.
〔実施例2〕
フィルム基材の片面にコロナ処理を実施し、そのコロナ処理面側にプライマー層を積層させ、そのプライマー層面側に樹脂層を積層させた以外は実施例1と同様に積層PPSフィルムを得た。
[Example 2]
A laminated PPS film was obtained in the same manner as in Example 1 except that one side of the film substrate was subjected to corona treatment, a primer layer was laminated on the corona treatment side, and a resin layer was laminated on the primer layer side.
〔実施例3〕
フィルム基材として厚さ2.5μmのPPSフィルム(東レ(株)製トレリナ(登録商標)1X00)を使用し、その両面にコロナ処理を実施し、その両面にプライマー層を0.1μm積層させ、その両面に樹脂層を0.3μm積層させた以外は実施例1と同様に積層PPSフィルムを得た。
Example 3
Using a PPS film having a thickness of 2.5 μm (Torelina (registered trademark) 1X00 manufactured by Toray Industries, Inc.) as the film substrate, corona treatment was performed on both sides thereof, and a primer layer was laminated on both sides by 0.1 μm, A laminated PPS film was obtained in the same manner as in Example 1 except that a resin layer was laminated on both sides by 0.3 μm.
〔実施例4〕
フィルム基材として厚さ175μmのPPSフィルム(東レ(株)製トレリナ(登録商標)5000)を使用し、その両面にコロナ処理を実施し、その両面にプライマー層を0.3μm積層させ、その両面に樹脂層を2.5μm積層させた以外は実施例1と同様に積層PPSフィルムを得た。
Example 4
A PPS film (Torelina (registered trademark) 5000 manufactured by Toray Industries, Inc.) having a thickness of 175 μm was used as a film base, and corona treatment was performed on both sides thereof, and a primer layer was laminated on both sides by 0.3 μm. A laminated PPS film was obtained in the same manner as in Example 1 except that the resin layer was laminated to 2.5 μm.
〔比較例1〕
フィルム基材として厚さ50μmのPPSフィルムの換わりに、厚さ50μmのPETフィルム(東レ(株)製ルミラー(登録商標)#50 S10)を使用した以外は実施例1と同様に積層PETフィルムを得た。
[Comparative Example 1]
A laminated PET film was used in the same manner as in Example 1 except that a 50 μm thick PET film (Lumirror (registered trademark) # 50 S10 manufactured by Toray Industries, Inc.) was used in place of the 50 μm thick PPS film as the film substrate. Obtained.
〔比較例2〕
フィルム基材として厚さ50μmのPPSフィルムの換わりに、厚さ50μmのポリプロピレンフィルム(東レ(株)製トレファン(登録商標)#50 BO)を使用した以外は実施例1と同様に積層ポリプロピレンフィルムを得た。
[Comparative Example 2]
A laminated polypropylene film as in Example 1 except that a polypropylene film having a thickness of 50 μm (Torephane (registered trademark) # 50 BO manufactured by Toray Industries, Inc.) was used instead of the PPS film having a thickness of 50 μm as the film substrate. Got.
〔比較例3〕
プライマー層を構成する塗布液1にシランカップリング剤を添加させない以外は実施例1と同様に積層PPSフィルムを得た。
[Comparative Example 3]
A laminated PPS film was obtained in the same manner as in Example 1 except that the silane coupling agent was not added to the coating solution 1 constituting the primer layer.
〔比較例4〕
プライマー層を構成する塗布液1に東レダウコーニング社製シランカップリング剤Z-6062を0.5質量%添加させた以外は実施例1と同様に積層PPSフィルムを得た。
[Comparative Example 4]
A laminated PPS film was obtained in the same manner as in Example 1 except that 0.5% by mass of the silane coupling agent Z-6062 manufactured by Toray Dow Corning Co., Ltd. was added to the coating solution 1 constituting the primer layer.
〔比較例5〕
PPSフィルムにプライマー層を積層しない以外は実施例1と同様に積層PPSフィルムを得た。
[Comparative Example 5]
A laminated PPS film was obtained in the same manner as in Example 1 except that the primer layer was not laminated on the PPS film.
〔比較例6〕
プライマー層を構成する塗布液1にアミノ基を含む東レダウコーニング社製シランカップリング剤Z-6020を10質量%添加させた以外は実施例1と同様に積層PPSフィルムを得た。
[Comparative Example 6]
A laminated PPS film was obtained in the same manner as in Example 1 except that 10% by mass of a silane coupling agent Z-6020 manufactured by Toray Dow Corning Co., Ltd. containing an amino group was added to the coating solution 1 constituting the primer layer.
〔比較例7〕
プライマー層を構成する塗布液1にエポキシ基を含む東レダウコーニング社製シランカップリング剤Z-6040を10質量%添加させた以外は実施例1と同様に積層PPSフィルムを得た。
[Comparative Example 7]
A laminated PPS film was obtained in the same manner as in Example 1 except that 10% by mass of Toray Dow Corning silane coupling agent Z-6040 containing epoxy group was added to the coating liquid 1 constituting the primer layer.
〔比較例8〕
プライマー層を構成する塗布液1をウレタン樹脂であるサンユレック社製SU3802に変更した以外は実施例1と同様に積層PPSフィルムを得た。
[Comparative Example 8]
A laminated PPS film was obtained in the same manner as in Example 1 except that the coating liquid 1 constituting the primer layer was changed to SU3802 manufactured by San Yulec Co., which is a urethane resin.
〔比較例9〕
プライマー層を構成する塗布液1をエポキシ樹脂であるサンユレック社製NBP-800以外は実施例1と同様に積層PPSフィルムを得た。
[Comparative Example 9]
A laminated PPS film was obtained in the same manner as in Example 1 except that the coating liquid 1 constituting the primer layer was an epoxy resin except for NBP-800 manufactured by Sanyu Rec.
実施例1〜4、比較例1〜9の特性評価結果を表1に示す。実施例1〜4は全ての項目で良好であったが、比較例1〜9はいずれかの項目で不良な点があった。 Table 1 shows the characteristic evaluation results of Examples 1 to 4 and Comparative Examples 1 to 9. Although Examples 1-4 were favorable in all the items, Comparative Examples 1-9 had a bad point in any item.
本発明は耐熱性、加工性、周波数特性に優れた積層ポリフェニレンサルファイドフィルム及びそれを使用した各種音響機器すなわちスピーカーを構成する音響機器振動板用フィルムまたは音響機器振動板に関するものである。 The present invention relates to a laminated polyphenylene sulfide film excellent in heat resistance, workability, and frequency characteristics, and various acoustic devices using the film, that is, a film for an acoustic device diaphragm or an acoustic device diaphragm constituting a speaker.
1 磁気回路
2 マグネット
3 プレート
4 ヨーク
5 ボイスコイル
6 フレーム
7 ガスケット
8 音響機器振動板
9 磁気ギャップ
DESCRIPTION OF SYMBOLS 1
Claims (5)
該プライマー層のポリフェニレンサルファイド面の反対面に芳香族ポリイミドを含む樹脂層が積層された積層ポリフェニレンサルファイドフィルム。
A laminated polyphenylene sulfide film in which a resin layer containing an aromatic polyimide is laminated on the surface opposite to the polyphenylene sulfide surface of the primer layer.
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JP2010016344A JP5397242B2 (en) | 2010-01-28 | 2010-01-28 | Laminated polyphenylene sulfide film. |
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JP2010016344A JP5397242B2 (en) | 2010-01-28 | 2010-01-28 | Laminated polyphenylene sulfide film. |
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JP5397242B2 true JP5397242B2 (en) | 2014-01-22 |
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JP2014136769A (en) * | 2013-01-17 | 2014-07-28 | Seiko Instruments Inc | Primer for polyphenylene sulfide adhesion |
JP6240893B2 (en) * | 2013-11-12 | 2017-12-06 | パナソニックIpマネジメント株式会社 | Diaphragm and loudspeaker using the same |
Family Cites Families (12)
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JPS62238739A (en) * | 1986-04-10 | 1987-10-19 | 住友ベークライト株式会社 | Heat-resistant composite film |
JPS62250037A (en) * | 1986-04-22 | 1987-10-30 | Toray Ind Inc | Composite material of engineering plastic |
JPH0197638A (en) * | 1987-05-29 | 1989-04-17 | Takiron Co Ltd | Heat resistant film or its analog and its manufacture |
JPH0651849B2 (en) * | 1988-02-09 | 1994-07-06 | 信越化学工業株式会社 | Primer composition |
JP3005099B2 (en) * | 1991-12-10 | 2000-01-31 | フオスター電機株式会社 | Electroacoustic transducer |
JPH0726207A (en) * | 1993-07-07 | 1995-01-27 | Mitsui Toatsu Chem Inc | Primer composition, cured layer thereof, and its use for clear plastic molding |
JP3145298B2 (en) * | 1995-04-21 | 2001-03-12 | 松下電工株式会社 | Resin composition for coating, resin coating, and method for producing them |
JPH1148426A (en) * | 1997-08-06 | 1999-02-23 | P I Gijutsu Kenkyusho:Kk | Composite film |
JPH11342534A (en) * | 1998-05-29 | 1999-12-14 | Oji Yuka Synthetic Paper Co Ltd | Surface treatment method for thermoplastic resin film |
JP3608944B2 (en) * | 1998-06-16 | 2005-01-12 | 株式会社ユポ・コーポレーション | Surface treatment method for thermoplastic resin film |
JP2000063750A (en) * | 1998-08-20 | 2000-02-29 | Jsr Corp | Coating composition and coating film |
JP2000226536A (en) * | 1999-02-04 | 2000-08-15 | Toagosei Co Ltd | Primer for polyphenylene sulfide and bonding |
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