JP5381447B2 - Electro-optic device - Google Patents

Description

  The present invention relates to an electro-optical device.

2. Description of the Related Art Thin display devices (FPD = flat panel display) such as organic EL display devices are increasingly used for display screens of electro-optical devices such as thin televisions and mobile phones. In recent years, an electro-optical device having two display screens has been proposed (Patent Document 1).
In addition, as one of problems when using the FPD for the display screen, heat generation of the FPD itself can be cited. In the case of a current-driven display device such as an organic EL (electroluminescence) device or a plasma display, the electro-optic element is driven by passing a current, so that heat generated by these currents becomes significant. In order to deal with such heat generation, for example, as shown in Patent Document 2, a heat transfer body is disposed between the FPD constituting the electro-optical device and the housing, and the heat generation of the FPD is transmitted through the heat transfer body through the housing. A structure for radiating heat to the body has been proposed. For example, as shown in Patent Document 3, a configuration is proposed in which a cooling member is disposed on one of a pair of substrates constituting an FPD.

JP 2005-156574 A JP 2005-265877 A JP 2008-58488 A

  However, the configuration shown in Patent Document 1 requires a rigid housing, and there is a problem that it is difficult to obtain a flexible electro-optical device using a thinned FPD. Further, the configuration shown in Patent Document 1 or Patent Document 2 has a problem that a temperature difference is likely to occur between the two FPDs in an electro-optical device configured using two FPDs. Such a temperature difference is not preferable because it causes a difference in display characteristics between the two FPDs and feels uncomfortable when the electro-optical device is picked up.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] Between a first film having flexibility, at least two display devices arranged so as to be spaced apart from each other on the first surface side of the first film, and the adjacent display devices An electro-optical device comprising: a flexible circuit board straddling the substrate.

  With such a configuration, an electro-optical device that includes two display screens and can be bent at the boundary between the display screens can be obtained. In particular, in the case where the display device has flexibility due to thinning, it is possible to form one electro-optical device by connecting the display devices without impairing the flexibility.

  Application Example 2 In the electro-optical device described above, the first film is a film having thermal conductivity.

  With such a configuration, even when the calorific values between the adjacent display devices are greatly different, the temperature difference can be reduced, and the uncomfortable feeling during holding can be reduced.

  [Application Example 3] A flexible first film, at least two display devices arranged on the first surface side of the first film so as to be spaced from each other, and a flexible circuit An electro-optical device comprising: a substrate; wherein the first film is a film having thermal conductivity.

  With such a configuration, in an electro-optical device having two display screens, the temperature difference can be reduced even when the calorific values between adjacent display devices are greatly different, and the uncomfortable feeling during holding can be reduced.

  Application Example 4 In the electro-optical device described above, the circuit board is provided so as to straddle between the adjacent display devices.

  With such a configuration, the electro-optical device includes two display screens, and even when separate display is performed on adjacent display screens, there is no sense of incongruity during holding, and the display screen is bent at the boundary between the display screens. Is possible.

  Application Example 5 In the electro-optical device described above, the display device is disposed on the first surface side of the first film via a first adhesive layer. Optical device.

  With such a configuration, the display devices can be reliably arranged on the first fill with a space therebetween, and reliability and the like can be improved.

  Application Example 6 In the electro-optical device described above, the first adhesive layer is also filled between the circuit board and the first film.

  With such a configuration, it is possible to reduce stress concentration on the circuit board when the electro-optical device is bent between the display devices, and the durability of the electro-optical device can be improved.

  Application Example 7 In the electro-optical device described above, a second adhesive layer different from the first adhesive layer is filled between the circuit board and the first film. An electro-optical device.

  If it is such a structure, the said 2nd adhesive bond layer can select a material focusing on the durability with respect to the bending stress added repeatedly. Therefore, the durability of the electro-optical device can be further improved.

  Application Example 8 The electro-optical device according to the above-described electro-optical device, wherein the second film having transparency is disposed so as to cover the display device.

  With such a configuration, since the display device can be protected from both sides, the durability of the electro-optical device can be improved.

  Application Example 9 In the electro-optical device described above, a housing having a bent portion is disposed on the second surface of the first film facing the first surface, and the housing Is arranged in a region overlapping with the region having the interval between the adjacent display devices in a plane.

  With such a configuration, the durability of the electro-optical device can be improved.

  Application Example 10 The electro-optical device described above, wherein the display device is an organic EL display device.

  Since the organic EL display device is driven by current, the amount of generated heat is drastically changed. With such a configuration, a bendable electro-optical device with reduced discomfort during holding despite the heat generation is obtained. be able to.

1 is a perspective view illustrating an outline of an electro-optical device according to a first embodiment. FIG. The schematic cross section of the edge part by the side of the flexible circuit board of an organic electroluminescent apparatus. 1 is a schematic cross-sectional view of an electro-optical device according to a first embodiment. The figure which shows the outline | summary in the planar view of an electro-optical apparatus. The figure which shows the state which bent the electro-optical apparatus. FIG. 6 is a schematic cross-sectional view of an electro-optical device according to a second embodiment. FIG. 10 is a schematic cross-sectional view of an electro-optical device according to a third embodiment. FIG. 10 is a schematic cross-sectional view of an electro-optical device according to a fourth embodiment. FIG. 10 is a schematic cross-sectional view of an electro-optical device according to a fifth embodiment. FIG. 10 is a schematic cross-sectional view of an electro-optical device according to a sixth embodiment. FIG. 10 is a schematic cross-sectional view of an electro-optical device according to a seventh embodiment. FIG. 10 is a schematic cross-sectional view of an electro-optical device according to Modification 2.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, the scale of each layer and each part is different from the actual scale so that each layer and each part can be recognized on the drawing.

(First embodiment)
FIG. 1 is a perspective view illustrating an outline of an electro-optical device 31 according to the first embodiment. The electro-optical device 31 includes a flexible first film 61 and an upward direction (Z-axis (−) direction) of the flexible film via the first adhesive layer 41 and spaced apart from each other. A set of arranged organic EL devices 25 as two display devices, and a flexible circuit board that electrically connects the two display devices (hereinafter referred to as “flexible circuit board”). 50). The upper surface is the first surface.

  In the organic EL device 25, a light emitting functional layer including at least an organic EL layer is sandwiched between the element substrate 1 and the color filter substrate 16 that are disposed to face each other. As will be described later, the organic EL device 25 has a plurality of regularly arranged pixels, and the light emitting function layer controls the light emission intensity and the like for each pixel. As a result, an image is formed in the display area 26 (see FIG. 2), which is an area where the pixels are arranged. The configuration of the organic EL device 25 will be described later.

  As shown in the figure, the element substrate 1 and the color filter substrate 16 are rectangular. The element substrate 1 has a dimension in the Y direction larger than that of the color filter substrate 16. Therefore, the element substrate 1 has an overhanging portion 28 that protrudes to the outside of the color filter substrate 16 in a plan view in a state in which both the substrates are opposed to each other. A connection wiring 47 is formed on the overhang portion 28. The flexible circuit board 50 connects the connection wirings of both element substrates 1.

  Next, the configuration of the organic EL device 25 will be described. FIG. 2 is a cross-sectional view schematically showing a state in which the end of the organic EL device 25 on the flexible circuit board 50 (see FIG. 1) side is cut by a line in the Y direction. The organic EL device 25 is a top emission type, and includes an element substrate 1, an element layer 2, a planarization layer 4, a pixel electrode 6, a partition wall 7, a light emitting functional layer 8, a common electrode 9, an electrode protective layer 10, a buffer layer 11, The gas barrier layer 12, the filler 13, the color filter layer 14, the color filter substrate 16 and the like are included.

  The element substrate 1 and the color filter substrate 16 are made of a transparent inorganic glass or the like, and are arranged to face each other with a predetermined interval by a sealing material 15. In addition, since the organic EL device 25 of the present embodiment is a top emission type, the transparency is not essential in the element substrate 1.

  In the element layer 2, a pixel circuit for actively driving each pixel 17 is formed. The pixel circuit includes a driving TFT (thin film transistor) 3, a switching TFT (not shown), a storage capacitor, and the like. A region where the pixels 17 are regularly arranged is a display region 26. Although not shown, a scanning line driving circuit, a data line driving circuit, and the like are formed in a region surrounding the display region 26 in plan view of the element layer 2.

  In the upper direction (Z-axis (−) direction) of the element layer 2, for example, a planarizing layer 4 that is an insulating layer made of an acrylic resin or the like is formed. In addition, an external wiring 46 is formed on the overhanging portion 28 where one side of the element substrate 1 extends from the color filter substrate 16. The external wiring 46 is electrically connected to the above-described scanning line driving circuit and the like through a contact hole (not shown) formed in the planarizing layer 4 and is flexible through an IC chip 53 (see FIG. 3) described later. The circuit board 50 is electrically connected.

  The reflective layer 5 and the pixel electrode 6 are laminated in this order on the flattening layer 4 so as to be divided for each pixel 17. The reflective layer 5 is made of, for example, aluminum and reflects light traveling from the light emitting functional layer 8 toward the element substrate 1 to make light contributing to display. The pixel electrode 6 is composed of a transparent electrode such as ITO (indium oxide alloy) or ZnO, and is connected to the drain terminal of the driving TFT 3 of the element layer 2 and the contact hole penetrating the planarizing layer 4 for each pixel. Has been.

  The partition wall 7 is made of a photocurable black resin or the like, and partitions each pixel region in a lattice shape in plan view. Note that the pixel region is a region where light is emitted in a plan view, that is, a planar concept, and the pixel 17 is a functional concept indicating an aggregate of pixel circuits and pixel electrodes. Further, the pixel circuit including the driving TFT 3 in the element layer 2 is disposed so as to overlap the partition wall 7 in a plan view in order to prevent malfunction due to light.

  The light emitting functional layer 8 is formed so as to cover the pixel electrode 6 and the partition wall 7. Further, the light emitting functional layer 8 has a single layer structure in FIG. 2, but in actuality, each of the light emitting functional layer 8 includes a hole transport layer, an organic EL layer, an electron injection layer, and the like made of an organic thin film. 6 are stacked in this order. The hole transport layer is composed of a material having sublimation properties such as aromatic diamine (TPAB2Me-TPD, α-NPD). The organic EL layer is composed of an organic material thin film that emits white light. The electron injection layer is made of LiF (lithium fluoride) or the like. The common electrode 9 is a metal thin film layer in which a metal such as MgAg is formed very thin so as to transmit light.

The electrode protective layer 10 is made of a transparent material such as SiO ₂ or Si ₃ N ₄ and having a function of blocking moisture. The buffer layer 11 is a transparent organic buffer layer such as a thermosetting epoxy resin. The gas barrier layer 12 is a sealing layer that is transparent and has a function of blocking moisture, such as SiO ₂ and Si ₃ N ₄ , and has a function of preventing moisture from entering the light emitting functional layer 8. Yes. The filler 13 is a transparent adhesive layer made of, for example, a thermosetting epoxy resin, and is filled in the uneven surface between the gas barrier layer 12 and the color filter layer 14 and adheres both. Further, it also functions to prevent moisture from entering the light emitting functional layer 8 from the outside.

  A color filter layer 14 is formed on the light emitting functional layer 8 side (Z-axis (+) side) of the color filter substrate 16. In the color filter layer 14, a red color filter 14 r, a green color filter 14 g, and a blue color filter 14 b are arranged for each pixel region in a plan view, that is, for each region partitioned by the partition walls 7. Between each color filter, a light shielding layer (black matrix) 14bm is formed in a lattice shape so as to overlap the partition wall 7 in a plan view, thereby suppressing color mixture between the pixel regions.

  With this configuration, white light generated when the light emitting functional layer 8 is energized in each pixel is emitted from the pixel region as one of red light, green light, and blue light. In the display area 26, a color image is formed by display light emitted from a plurality of regularly arranged pixels.

  In this figure, the scale of each layer sandwiched between the element substrate 1 and the color filter substrate 16 is enlarged as compared with the above-described pair of substrates in order to clarify the stacking relationship between the components. . However, in practice, the distance between the pair of substrates described above is smaller than the thickness of the substrate. Specifically, the above-mentioned distance is about several μm to 10 μm. Among these, the buffer layer 11 occupies more than half the thickness. Incidentally, the thickness of the light emitting functional layer 8 composed of a plurality of thin films (such as organic EL layers) having a thickness of the order of nm is less than 1 μm. On the other hand, the thickness of the element substrate 1 and the color filter substrate 16 is approximately 40 μm. Therefore, the total thickness of the organic EL device 25 is about 90 μm. By forming it to such a thickness, the organic EL device 25 is flexible without losing its strength. As described above, in the electro-optical device 31 according to the present embodiment, the two organic EL devices 25 are connected by the first film 61 and the flexible circuit board 50. Therefore, the electro-optical device 31 retains flexibility as a whole.

  In addition, the element substrate 1 and the color filter substrate 16 are thinned by polishing or etching each having a thickness of about 0.3 to 0.7 mm in the initial stage. Such thinning is preferably performed by etching using hydrofluoric acid (hydrofluoric acid) as an etching solution (aqueous solution) after forming the organic EL device 25 in which the front and back glass substrates are thick.

  Returning to the description of the electro-optical device 31. FIG. 3 is a cross-sectional view schematically showing a state where the electro-optical device 31 according to the first embodiment is cut along a line in the Y direction. As shown in the drawing, the electro-optical device 31 includes two organic EL devices 25 arranged at a predetermined interval, a flexible circuit board 50 that connects the organic EL devices, and the like. The organic EL device 25 includes the element substrate 1, the color filter substrate 16, and each element sandwiched between the pair of substrates. A connection wiring 47 is formed on the outer periphery of the element substrate 1. The connection wiring is electrically connected to the external wiring similarly formed on the element substrate 1 by the IC chip 53. It should be noted that a configuration in which the IC chip 53 is not used is possible by forming a circuit group corresponding to the IC chip 53 on the element substrate 1.

  A wiring layer 51 is formed on one surface of the flexible circuit board 50, and the one surface is disposed so as to face the connection wiring 47 of each of the two organic EL devices 25 described above. Therefore, the two organic EL devices 25 described above can be simultaneously supplied with video signals and the like from an external circuit (not shown) via the wiring layer 51. It should be noted that wiring is provided on at least a part of a region on one side of the flexible circuit board 50 facing the pair of substrates, that is, a region other than the region where the connection wiring 47 and the flexible circuit board 50 are facing each other. A solder resist 52 for protecting the layer 51 is formed.

  As described above, the set (two) of organic EL devices 25 are attached to the first film 61 via the first adhesive layer 41. Further, on the color filter substrate 16 side of the organic EL device 25, a transparent film 62 as a second film having transparency for protecting the organic EL device 25 by the third adhesive layer 43 is provided for each organic EL. Each is affixed to the device 25. Accordingly, a set of (two) organic EL devices 25 is a pair of films of a first film 61 common to each organic EL device 25 and a transmissive film 62 disposed in each organic EL device 25. It will be pinched by.

  Any of the first film 61 and the transmissive film 62 can be applied as long as the film has flexibility, and the transmissive film 62 can be any film as long as it has translucency. PET (polyethylene terephthalate) is used. Further, for example, PEN (polyethylene naphthalate), TAC (triacetyl cellulose), COP (cyclic olefin polymer) or the like may be used.

  Various treatments may be applied to the surfaces of the first film 61 and the transmissive film 62. For example, a hard coat process for improving wear resistance by forming a hard coat layer such as PMMA, an antireflection process for forming a low antireflective layer (LR) made of a low refractive index fluororesin, and providing irregularities on the surface Surface treatments such as anti-glare treatment, antistatic treatment for preventing dust adhesion by forming an antistatic layer, and oil repellent treatment for forming an oil repellent layer to which sebum hardly adheres may be performed.

  As the first adhesive layer 41 and the third adhesive layer 43, any material having adhesiveness can be applied. However, as a suitable example of this embodiment, water resistance (low water absorption), A polyethylene-based resin having insulating properties, flexibility, transparency, and low-temperature weldability is preferred. Specifically, ethylene-vinyl acetate copolymer (EVA), ethylene-methyl methacrylate copolymer (EMMA), or the like may be used as the polyethylene copolymer. In addition, the first adhesive layer 41 and the third adhesive layer 43 may be made of an adhesive material with reduced adhesiveness. For example, Gelpoly (registered trademark), which is a material in which the adhesiveness of an acrylic resin is lowered, may be used. The first film 61 or the transmissive film 62 is reattached or repositioned by using the adhesive material with reduced adhesiveness as the first adhesive layer 41 and the third adhesive layer 43. Can be manufactured easily.

  The transmissive film 62 is a flexible film similar to the first film 61, and when the organic EL device 25 is flexible by thinning, the organic EL device is not impaired. Can protect the device. With the above configuration, the electro-optical device 31 functions as a foldable two-screen display device.

  4 and 5 show an electro-optical device 31 as a two-screen display device. FIG. 4 is a diagram illustrating an outline of the electro-optical device 31 in plan view, and FIG. 5 is a diagram illustrating a state where the electro-optical device 31 is bent. In FIG. 4, the adhesive layer is not shown, and the positions thereof are slightly shifted in order to clarify the positional relationship of the constituent elements.

  As shown in FIG. 4, the electro-optical device 31 includes a flexible circuit board 50 and a pair of organic EL devices 25 that are connected to each other at a predetermined interval around the long axis of the flexible circuit board. Yes. The surface of the organic EL device 25 on the flexible circuit board 50 side is protected by a flexible film including the display area 26 and the IC chip 53. Therefore, as shown in FIG. 5, the electro-optical device 31 can be bent so that each of the pair of organic EL devices 25 is a left and right page with the major axis direction of the flexible circuit board 50 as the center. When the organic EL device 25 itself is thinned by etching the element substrate 1 and the color filter substrate 16 as described above, the left and right organic EL devices themselves can also be bent. Therefore, the electro-optical device 31 can be handled like a book.

(Second Embodiment)
Next, a second embodiment of the present invention will be described. FIG. 6 is a schematic cross-sectional view of an electro-optical device 32 according to the second embodiment of the present invention, which corresponds to FIG. 3 in the first embodiment described above. The electro-optical device 32 according to the present embodiment has a configuration similar to that of the electro-optical device 31 of the first embodiment, and only the nature of the first film is different. Therefore, in the description of the present embodiment, the drawings corresponding to FIGS. 1 and 2 described above are omitted. In addition, the same reference numerals are given to components common to the components of the electro-optical device 31, and a part of the description is omitted.

  The electro-optical device 32 according to the present embodiment is characterized in that the first film holding a pair of (two) organic EL devices 25 via the first adhesive layer 41 is higher than glass. It is a point which is the heat conductive film 63 which has heat conductivity. Any material can be applied to the first film as long as it has heat dissipation. However, as a suitable example of this embodiment, a PGS graphite sheet manufactured by Panasonic Corporation having flexibility (flexibility) and high thermal conductivity. (Product name) is used. Further, a rubber-like or gel-like one obtained by kneading powders of acrylic resin, silicone resin, epoxy resin, aluminum oxide, aluminum nitride, carbon, etc. into a sheet or film may be used. Furthermore, a metal foil made of a metal such as copper or aluminum or an alloy thereof, or sheet-like graphite may be used.

  Similar to the electro-optical device 31 of the first embodiment, the electro-optical device 32 according to the present embodiment displays different images on a set of (two) organic EL devices 25, like a book. Can function.

  By the way, in the case of a current drive type display device such as an organic EL device, the energization amount varies greatly depending on the image to be formed, and the heat generation amount varies greatly in proportion to the energization amount. Accordingly, in such a case, when the electro-optical device 32 is held with both hands like a book, uncomfortable feeling or uncomfortable feeling is generated.

  The electro-optical device 32 of the present embodiment suppresses such a phenomenon by using the heat conductive film 63 as the first film. That is, the heat generated in the organic EL device 25 on the side where the amount of current is supplied is transmitted to the other organic EL device 25 side using the heat conductive film 63, so that the temperature between the organic EL devices 25, particularly the element substrate 1 side. The temperature is equalized. As a result, different images are displayed between the organic EL devices 25, and comfortable holding is possible even when the difference in energization amount is large.

(Third embodiment)
Next, a third embodiment of the present invention will be described. FIG. 7 is a schematic cross-sectional view of an electro-optical device 33 according to the third embodiment of the present invention, and corresponds to FIG. 3 in the first embodiment described above.

  The electro-optical device 33 according to the present embodiment has a configuration similar to that of the electro-optical device 32 of the second embodiment, and only the aspect of the first adhesive layer 41 is different. Therefore, in the description of the present embodiment, the drawings corresponding to the above-described FIGS. 1 and 2 are omitted as in the description of the second embodiment. In addition, the same reference numerals are given to components common to the components of the electro-optical device 32, and a part of the description is omitted.

  The electro-optical device 33 according to the present embodiment is characterized in that the first adhesive layer 41 is also filled between the flexible circuit board 50 and the heat conductive film 63 as the first film. That is, the first adhesive layer 41 is completely adhered to the wiring layer 51 formed on the flexible circuit board 50 or the solder resist 52 covering the wiring layer. With this structure, when the electro-optical device 33 is used as a book by bending the long axis direction of the flexible circuit board 50 as a center, it is possible to prevent stress from being concentrated on one place of the flexible circuit board. Accordingly, the electro-optical device 33 according to the present embodiment has improved durability and can withstand use such as repeated bending.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described. FIG. 8 is a schematic cross-sectional view of an electro-optical device 34 according to the fourth embodiment of the present invention, and corresponds to FIG. 3 in the first embodiment described above.

  The electro-optical device 34 according to the present embodiment has a configuration similar to that of the electro-optical device 33 according to the third embodiment, and is an adhesive filled between the flexible circuit board 50 and the heat conductive film 63. Only the aspect of the layer is different. Therefore, in the description of the present embodiment, the drawings corresponding to FIGS. 1 and 2 described above are omitted as in the description of the third embodiment. In addition, the same reference numerals are given to components common to the components of the electro-optical device 33, and a part of the description is omitted.

  In the electro-optical device 34 according to the present embodiment, the adhesive that is also filled between the flexible circuit board 50 and the heat conductive film 63 as the first film is bonded to the first adhesive layer 41 and the second adhesive. It is characterized by being composed of two layers with the agent layer 42. More specifically, a second adhesive layer 42 is formed so as to cover the periphery of the solder resist 52, and the first adhesive layer 41 and the first adhesive layer 41 are interposed between the solder resist 52 and the heat conductive film 63. Two adhesive layers with two adhesive layers 42 are formed. Therefore, the organic EL device 25 and the heat conductive film 63 are bonded to each other by the first adhesive layer 41 as in the electro-optical devices of the above-described embodiments, and the second adhesive layer 42 is a flexible circuit board. 50 function is protected. For this reason, the material of the second adhesive layer 42 is selected with emphasis on not only adhesiveness but also durability during bending. Therefore, in the electro-optical device 34 according to the present embodiment, the flexible circuit board 50 is further protected, and the durability is further improved.

(Fifth embodiment)
Next, a fifth embodiment of the present invention will be described. FIG. 9 is a schematic cross-sectional view of an electro-optical device 35 according to the fifth embodiment of the present invention, which corresponds to FIG. 3 in the first embodiment described above.

  The electro-optical device 35 according to the present embodiment has a configuration similar to that of the electro-optical device 34 according to the fourth embodiment, and only the aspect of the transmissive film 62 is different. Therefore, in the description of the present embodiment, the drawings corresponding to FIGS. 1 and 2 described above are omitted as in the description of the fourth embodiment. In addition, the same reference numerals are given to components common to the components of the electro-optical device 34, and a part of the description is omitted.

  The electro-optical device 35 according to this embodiment is characterized in that the transmissive film 62 covers the entire surface of the electro-optical device on the color filter substrate 16 side. That is, the flexible circuit board 50 is sandwiched between the second adhesive layer 42 and the transmissive film 62, and the surface is not exposed. With this configuration, in the electro-optical device 35 according to the present embodiment, the flexible circuit board is further protected, and the durability is further improved.

(Sixth embodiment)
Next, a sixth embodiment of the present invention will be described. FIG. 10 is a schematic cross-sectional view of an electro-optical device 36 according to the sixth embodiment of the present invention, which corresponds to FIG. 3 in the first embodiment described above. The electro-optical device 36 according to the present embodiment is obtained by adding a case 57 and the like to be described later to the electro-optical device 35 according to the fifth embodiment. Therefore, the same reference numerals are given to components common to the components of the electro-optical device 35 according to the fifth embodiment, and a part of the description is omitted. Similarly to the description of the second to fifth embodiments, the drawings corresponding to the above-described FIGS. 1 and 2 are omitted.

  The electro-optical device 36 according to this embodiment is characterized in that a housing 57 is disposed on the surface of the heat conducting film 63 opposite to the element substrate 1 side. The heat conductive film 63 is attached to the element substrate 1 with the first adhesive layer 41, and the back surface of the heat conductive film, that is, the surface opposite to the element substrate 1 side is provided with a fourth adhesive layer 44. 57 is adhered.

  The casing 57 is a rigid plate-like member, and has a bent portion 58 having a central axis that overlaps the long axis of the flexible circuit board 50 in plan view. Therefore, the electro-optical device 36 according to the present embodiment can be bent around the major axis direction of the flexible circuit board 50, similarly to the electro-optical device according to the other embodiments described above.

  On the other hand, since the housing 57 has rigidity, a portion where the electro-optical device 36 is bent is limited. That is, since bending is performed only at the portion of the flexible circuit board 50, the two organic EL devices 25 included in the electro-optical device 36 are suppressed from being bent. Therefore, even when the bending operation is repeated, the organic EL device 25 is prevented from being damaged and the durability is further improved.

  In FIG. 10, the casing 57 is shown as being disposed on the entire surface of the element substrate 1. However, the region in which the casing 57 is disposed, that is, the planar shape of the casing 57 is not limited to such a mode. It is also possible to form only in a region overlapping the flexible circuit board 50 in a plan view, or only in a region that is slightly enlarged in the Y direction (see FIG. 1). When the electro-optical device is folded and used like a book, the folded region is limited. The flexible circuit board 50 can hardly be bent at a portion greatly deviating from the central axis (long axis). On the other hand, when the element substrate 1 and the color filter substrate 16 are thinned to make the organic EL device 25 flexible, if the rigid casing 57 is disposed on the entire surface of the element substrate 1 side, This flexibility will be impaired. By limiting the region in which the housing 57 is disposed as described above, it is possible to improve the durability of the entire electro-optical device while maintaining the flexibility in the region outside the bent portion.

(Seventh embodiment)
Next, a seventh embodiment of the present invention will be described. FIG. 11 is a schematic sectional view of an electro-optical device 37 according to the seventh embodiment of the present invention, and corresponds to FIG. 3 in the first embodiment described above.

  The electro-optical device 37 according to the present embodiment is obtained by adding a sheet-like secondary battery to the electro-optical device 36 according to the above-described sixth embodiment. Therefore, the same reference numerals are given to components common to the components of the electro-optical device 36 according to the sixth embodiment, and a part of the description is omitted. Similarly to the description of the second to sixth embodiments, the drawings corresponding to FIGS. 1 and 2 are omitted.

  The electro-optical device 37 according to this embodiment is characterized in that a sheet-like secondary battery 59 is disposed between the surface of the housing 57 on the element substrate 1 side, that is, between the housing 57 and the heat conductive film 63. It is. As described above, since the organic EL device 25 is a top emission type, no light is emitted to the element substrate 1 side. Therefore, it is possible to arrange other components between the housing 57 and the heat conductive film 63 without degrading the display quality. Moreover, the housing | casing 57 has the bending part 58, and thickness is increasing in the part of this bending part. Therefore, the fourth adhesive layer 44 has a sufficient layer thickness, and the secondary battery 59 can be disposed without impairing the adhesiveness. With this configuration, the electro-optical device according to the present embodiment can be carried and the practicality is improved.

  Embodiments of the present invention are not limited to the above-described embodiments, and can be implemented as modified examples with various modifications and improvements. A modification will be described below.

(Modification 1)
In the electro-optical device of each of the embodiments described above, an organic EL device is used as a display device. However, the embodiment of the present invention is not limited to such an aspect. An inorganic EL device, an electrophoretic display device, or a powder display device can also be used as the display device.

(Modification 2)
All the electro-optical devices of the above-described embodiments each include two organic EL devices as display devices. However, the embodiment of the present invention is not limited to such an aspect. FIG. 12 shows an example of an electro-optical device provided with four organic EL devices as display devices. In FIG. 12, the adhesive layer is not shown, and the layers are slightly shifted as in FIG.

  As shown in the drawing, the electro-optical device according to the present modification includes four organic EL devices 25 arranged on a heat conductive film 63, and a flexible circuit between the organic EL devices 25 is the same as in the organic EL devices of the above-described embodiments. The substrates 50 are connected. Each organic EL device 25 includes an IC chip 53 outside the display area 26 and is covered with a transmissive film 62. It can be folded at the positions of the three flexible circuit boards 50 and folded to the same size as the electro-optical device of each of the above-described embodiments.

(Modification 3)
All the electro-optical devices of the above-described embodiments each include two organic EL devices 25. However, a heat radiating plate having substantially the same size can be arranged instead of the one organic EL device 25. According to such a configuration, the heat generated in the organic EL device 25 can be conducted to the heat radiating plate via the heat conducting film and radiated from the display surface side. Therefore, the heat generated in the organic EL device 25 can be easily released. Further, in the case of an electro-optical device having three or more surfaces on which the organic EL device 25 can be disposed, such as the electro-optical device of the above-described modification 2, one of the two surfaces is used for heat dissipation and the other two or more. The display quality of the organic EL device 25 can be stabilized.

(Modification 4)
In the electro-optical device according to the seventh embodiment described above, the sheet-like secondary battery 59 is disposed between the casing 57 and the heat conductive film 63. However, the element disposed in the above-described place is not limited to the secondary battery 59, and a sheet-like solar cell, a sheet-like circuit board, or the like can be arranged. Further, the above-described elements can be combined and arranged. With the electro-optical device of this aspect, it is even easier to use when carrying it. In addition, the function of the IC chip 53 can be given to the sheet-like circuit board.

  DESCRIPTION OF SYMBOLS 1 ... Element substrate, 2 ... Element layer, 3 ... Driving TFT, 4 ... Planarization layer, 5 ... Reflection layer, 6 ... Pixel electrode, 7 ... Partition, 8 ... Light emission functional layer, 9 ... Common electrode, 10 ... Electrode Protective layer, 11 ... buffer layer, 12 ... gas barrier layer, 13 ... filler, 14 ... color filter layer, 14b ... blue color filter, 14bm ... light shielding layer (black matrix), 14g ... green color filter, 14r ... red color filter 15 ... Sealing material, 16 ... Color filter substrate, 17 ... Pixel, 25 ... Organic EL device, 26 ... Display area, 28 ... Overhang part, 31 ... Electro-optical device of the first embodiment, 32 ... Second implementation Electro-optical device according to the third embodiment, 33 ... Electro-optical device according to the third embodiment, 34 ... Electro-optical device according to the fourth embodiment, 35 ... Electro-optical device according to the fifth embodiment, 36 ... According to the sixth embodiment. Electro-optic 37 ... Electro-optical device of the seventh embodiment, 41 ... First adhesive layer, 42 ... Second adhesive layer, 43 ... Third adhesive layer, 44 ... Fourth adhesive layer, 46 DESCRIPTION OF SYMBOLS ... External wiring, 47 ... Connection wiring, 50 ... Flexible circuit board, 51 ... Wiring layer, 52 ... Solder resist, 53 ... IC chip, 57 ... Housing | casing, 58 ... Bending part, 59 ... Sheet-like secondary battery, 61 ... 1st film, 62 ... Translucent film as 2nd film, 63 ... Thermal conductive film (film having thermal conductivity).

Claims (12)

A flexible first film;
At least two display devices arranged on the first surface side of the first film so as to be spaced apart from each other;
A flexible circuit board straddling between the adjacent display devices;
Equipped with a,
The first film is an electro-optical device according to claim Rukoto that have a higher thermal conductivity than the element substrate of the display device. A flexible first film;
At least two display devices arranged on the first surface side of the first film so as to be spaced apart from each other;
An electro-optical device comprising a circuit board having flexibility,
The electro-optical device, wherein the first film is a film having higher thermal conductivity than an element substrate of the display device. The electro-optical device according to claim 2 ,
The electro-optical device, wherein the circuit board is provided so as to straddle between the adjacent display devices. The electro-optical device according to any one of claims 1 to 3,
Each of the display devices has a display area in which a plurality of pixels are arranged,
The electro-optical device, wherein the first film covers the entire display area. The electro-optical device according to any one of claims 1 to 4,
The electro-optical device, wherein the display device is disposed on the first surface side of the first film via a first adhesive layer. The electro-optical device according to claim 5,
The electro-optical device, wherein the first adhesive layer is also filled between the circuit board and the first film. The electro-optical device according to claim 5,
2. An electro-optical device, wherein a second adhesive layer different from the first adhesive layer is filled between the circuit board and the first film. The electro-optical device according to claim 1,
An electro-optical device, wherein a second film having transparency is disposed so as to cover the display device. The electro-optical device according to any one of claims 1 to 8,
On the second surface facing the first surface of the first film, a housing having a bent portion is disposed,
The electro-optical device, wherein the casing is arranged in a region overlapping with the region having the space between the adjacent display devices in a plane. The electro-optical device according to claim 9,
An electro-optical device, wherein a battery is disposed between the first film and the housing, and the battery overlaps at least a part of the display area. The electro-optical device according to claim 1,
An electro-optical device, further comprising a heat radiating plate disposed on the first surface side of the first film so as to be spaced from the display device. The electro-optical device according to any one of claims 1 to 11 ,
The electro-optical device, wherein the display device is an organic EL display device.

Images