JP5379469B2 - Chemical treatment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide removable adhesive tape for masking, which is highly chemical resistant, can show a masking effect in chemical processing, and leaves no adhesive residues on an object which has adhered the tape, after the removal of the tape. <P>SOLUTION: The chemical processing method is to perform chemical processing to a film type laminate by a roll-to-roll method using feeding roll and winding roll, and is characterized by being provided with a process to perform chemical processing on a chemical processing surface in a state where supporting tape is adhered to a surface of the film type laminate including the chemical processing surface opposite the chemical processing surface, and a process to remove the supporting tape after the chemical processing is completed. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to a chemical processing method for performing chemical processing on a film-type laminate.

When manufacturing displays and circuit boards using film-type laminates made by attaching conductive thin films such as metal foils and transparent conductive films on resin films, for circuit formation and insulation layer formation After a resist material is applied onto a film-type laminate and the resist material is exposed, the resist-attached film-type laminate is treated with a chemical solution by roll-to-roll, washed with water and dried (for example, Patent Document 1).
JP 2008-266016 A

  However, as the thickness of the film-type laminate decreases, wrinkles and waviness often occur on the film-type laminate during processing (chemical treatment, water washing / drying), making it difficult to make stable products. I came.

  This invention is made | formed in view of this point, and it aims at providing the chemical | medical solution processing method which does not generate | occur | produce a wrinkle and a wave in a film type laminated body during a process also in a thin film type laminated body.

The chemical treatment method of the present invention is a chemical treatment method for performing chemical treatment on a film-type laminate by a roll-to-roll method using a feed roll and a take-up roll, and is a film-type laminate having a chemical treatment surface. A step of performing a chemical treatment on the chemical treatment surface in a state in which a support tape is adhered and adhered to a surface opposite to the chemical treatment surface; and a step of peeling the support tape after the chemical treatment. The feeding roll feeds out a laminate obtained by sticking the support tape in advance on the surface opposite to the chemical treatment surface of the film-type laminate, and an adhesive used for the adhesive layer of the support tape is used. A bulk material of the rubber material, comprising: (A) a rubber material that is solid at normal temperature; (B) a liquid substance having a crosslinking base at the end; and (C) a curing agent for crosslinking the liquid substance. During ~ , The liquid material after crosslinking, characterized in that the chemical route of entry is partitioned by dispersed in diameter 0.2Myuemu～20myuemu.

  According to this method, chemical treatment is performed on the chemical treatment surface in a state where the support tape is attached to the surface opposite to the chemical treatment surface of the film type laminate having the chemical treatment surface, and the support tape is attached after the chemical treatment. Peel off. For this reason, during the chemical treatment, since the film-type laminate is supported by the support tape, wrinkles and waves are not generated during the chemical treatment even if the thickness of the film laminate is thin. As a result, even in a thin film type laminate, the chemical treatment can be performed without generating wrinkles and undulations in the film type laminate during processing.

The composite of the present invention is a composite that performs chemical treatment on a film-type laminate in a roll-to-roll manner using a delivery roll and a take-up roll, and the film-type laminate having a chemical treatment surface; A support tape adhered in close contact with the surface opposite to the chemical treatment surface, and the pressure-sensitive adhesive used for the pressure-sensitive adhesive layer of the support tape is (A) a rubber material that is solid at room temperature, and (B ) Containing a liquid substance having a crosslinking base at the terminal, and (C) a curing agent for crosslinking the liquid substance, and the liquid substance after crosslinking is 0.2 μm to 20 μm in the bulk material of the rubber material. It is characterized in that the chemical solution intrusion route is divided by being dispersed with a diameter of.

In the chemical treatment method of the present invention, the following embodiments are further desirable.
That is, in the chemical treatment method of the present invention, the support tape is sent out from another delivery roll, and the support tape is attached to the surface opposite to the chemical treatment surface of the film-type laminate before the chemical treatment. Is preferred.

In the chemical processing method of the present invention, the pressure-sensitive adhesive, for dynamic viscoelasticity spectrum measured at a frequency of 1 Hz, the storage modulus at 25 ° C. G 'is ^{4.5 × 10 5 Pa~6.9 × 10 5} Pa , and the loss tangent tanδ is a 0.39 to 0.43, a storage modulus G 90 ° C. 'is ^{7 × 10 4 Pa~9 × 10 4} Pa, a loss tangent tanδ is from 0.70 to 0 .82 is preferred.

  In the chemical treatment method of the present invention, the rubber material is made of chloroprene rubber, chlorosulfonated polyethylene rubber (CSM rubber), ethylene-propylene-diene rubber (EPDM), maleic acid-modified ethylene-propylene-diene rubber, and a mixture thereof. Preferably, the liquid substance is a substance having at least one selected from the group consisting of a polyisoprene skeleton, a polybutadiene skeleton, and a polybutene skeleton.

  In the chemical treatment method of the present invention, the rubber material is a compound having an average molecular weight of 10,000 to 50,000 and containing 2 to 40% by weight of strongly polar atoms in the molecule, It is preferable that the compound has an OH and a molecular weight of 1,000 to 5,000, and the curing agent is an isocyanate crosslinking agent.

  In the chemical treatment method of the present invention, the rubber material is 70% to 99% by weight of the adhesive, the liquid substance is 1% to 30% by weight of the adhesive, and the curing agent is the It is preferably 30% by weight or less of the pressure-sensitive adhesive.

  In the chemical treatment method of the present invention, it is preferable that the adhesive force of the adhesive to the silicon wafer is 0.2 N / 25 mm to 0.5 N / 25 mm.

  In the chemical treatment method of the present invention, it is preferable that the film-type laminate has at least a conductive thin film on a resin film.

  In the chemical treatment method of the present invention, it is preferable to repeatedly use the peeled support tape.

  The chemical treatment of the present invention is a method of performing chemical treatment on a film-type laminate by a roll-to-roll method using a feed roll and a take-up roll, and the chemical treatment of a film-type laminate having a chemical treatment surface With the support tape attached to the surface opposite to the surface, the chemical treatment surface is subjected to a chemical treatment, and the support tape is peeled after the chemical treatment. For this reason, even in a thin film-type laminate, a chemical treatment can be performed without generating wrinkles and undulations in the film-type laminate during processing.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
(Embodiment 1)
In this embodiment, a roll-to-roller using a feed roll and a take-up roll with respect to a laminate formed by pasting a support tape in advance on the surface opposite to the chemical treatment surface of the film-type laminate. A case where chemical treatment is performed by a roll method will be described.

  FIG. 1 is a diagram illustrating a schematic configuration of a roll-to-roll apparatus that performs the chemical solution processing method according to the first embodiment. In FIG. 1, the film-type laminate 2 is wound around a delivery roll 1, and is taken out by a take-up roll 3 after being delivered from the delivery roll 1 and subjected to chemical treatment. Here, the film-type laminate 2 is obtained by pasting a support tape (here, alkali-resistant tape 23) on the surface opposite to the chemical treatment surface, and copper on the polyimide film (PI) 221. A resist layer (resist 22 after development) is formed on a flexible printed wiring board (FPC) 21 formed by sticking a foil 222. The chemical solution treatment is a resist stripping treatment (alkali treatment).

  The film-type laminate 2 delivered from the delivery roll 1 is immersed in a chemical solution (alkaline stripping solution) 41 accommodated in the chemical solution container 4 by the transport roll, and is subjected to chemical treatment in the chemical solution container 4. Then, the film-type laminate 2 after the chemical treatment is removed from the chemical solution 41, and then the alkali-resistant tape 23 is peeled off. That is, the film-type laminate 2 that has come out of the chemical solution 41 is wound around the alkali-resistant tape 23 by the support tape winding roll 5, and the FPC 21 from which the resist 22 has been removed after development is wound up by the winding roll 2. Thus, in order to wind up the alkali-resistant tape 23 by the winding roll 5 different from the winding roll 2, the alkali-resistant tape 23 is inevitably peeled from the film-type laminate 2.

  Thus, in the chemical treatment method according to the present embodiment, the support tape (alkali-resistant tape 23) is attached to the surface opposite to the chemical treatment surface of the film-type laminate 2 having the chemical treatment surface. Then, chemical treatment is performed on the chemical treatment surface, and the alkali-resistant tape 23 is peeled off after the chemical treatment. For this reason, during the chemical treatment, the film-type laminate 2 is supported by the alkali-resistant tape 23 (support tape), so even if the thickness of the film laminate 2 is thin, wrinkles and waves are generated during the chemical treatment. Does not occur. As a result, even in a thin film type laminate, the chemical treatment can be performed without generating wrinkles and undulations in the film type laminate during processing.

  The film-type laminate 2 is not limited to the above example. That is, the film-type laminate 2 only needs to have a form suitable for a chemical treatment of a roll-to-roll method. For example, a resin film (for example, a polyester film (PET), a polyethylene naphthalate film (PEN), Polyimide film) having at least a conductive thin film such as a metal foil (copper foil, aluminum foil, etc.), a transparent conductive film (ITO, ZnO, PEDOT / PSS), a resin film in which conductive particles are dispersed, etc. Can be mentioned. Examples of the base film include a polyester film (PT), a polyethylene naphthalate film (PEN), a polypropylene film, a polyimide film, and the like, and a film that can withstand a chemical used for chemical treatment is appropriately selected. Moreover, the laminated form of the film-type laminated body 2 changes with chemical | medical solution processes.

  Here, examples of the chemical treatment include wet etching immersed in an etching solution, resist development immersed in a resist developer, and the like, in addition to the above resist removal. The present invention can also be applied to a process combining these chemical solution treatments.

  In addition, the sticking surface of the film-type laminate that is the adherend of the support tape may be flat or may be a mat-treated surface. When the adhesive surface of the film-type laminate is a flat surface, the adhesive layer of the support tape maintains a flat surface even after peeling from the film-type laminate, so that the film-type laminate is wound after peeling from the film-type laminate. Can be used repeatedly in the above process.

  The pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer of the support tape includes (A) a rubber material that is solid at room temperature, (B) a liquid substance having a crosslinking base at the terminal, and (C) a curing agent for crosslinking the liquid substance. It is preferable that the liquid material after crosslinking is dispersed in a diameter of 0.2 μm to 20 μm in the bulk material of the rubber material.

Here, the material of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer will be described.
(A) Rubber material A rubber material that is solid at room temperature is used as the rubber material. Further, the rubber material is preferably a rubber material in which strongly polar atoms are bonded in the molecule. Here, nitrogen (N), oxygen (O), chlorine (Cl), sulfur (S), etc. are mentioned as a strongly polar atom. Moreover, it is preferable that a highly polar atom is contained in the rubber material at 2 wt% to 40 wt%.

  The average molecular weight of the rubber material is preferably 10,000 to 50,000 in consideration of flexibility, adhesion to the adherend, and residues on the adherend due to cohesive force.

  Specifically, the rubber material is preferably chloroprene rubber, chlorosulfonated polyethylene rubber (CSM rubber), ethylene-propylene-diene rubber (EPDM), maleic acid-modified ethylene-propylene-diene rubber, or a mixture thereof. .

  The compounding amount of the rubber material is based on the chemical resistance expressed by the strong cohesiveness due to the polarity of the rubber material, ensuring the chemical resistance of the entire adhesive, and the elastic modulus due to the cohesive force of the rubber material. In consideration of securing and the like, it is preferably 70% to 99% by weight of the pressure-sensitive adhesive.

(B) Liquid substance As the liquid substance, a substance having a terminal cross-linking point is used. Examples of the crosslinking base point include an OH group. The number of terminal OH groups is preferably about two. In the liquid substance, the portion other than the terminal is generally made of carbon (C) and hydrogen (H), and the molecule is preferably nonpolar or very small. Due to this feature, it is difficult to mix with a rubber material having a relatively strong polarity, and a liquid substance after crosslinking can be present in the rubber material as a dispersion.

  The liquid substance preferably has a viscosity after crosslinking lower than that of the rubber material. By having such a relationship, the liquid substance after crosslinking is likely to remain as a dispersion in the bulk of the rubber material. The size of the liquid substance (liquid substance after crosslinking) as a dispersion is 0.2 μm in consideration of the residue on the adherend (contamination to the adherend) after tape peeling and the fluidity of the adhesive. A diameter of ˜20 μm is preferable, and a diameter of 0.5 μm to 5 μm is particularly preferable.

  Thus, the liquid material after crosslinking dispersed in the bulk material of the rubber material with a diameter of 0.2 μm to 20 μm divides the liquid material after crosslinking that can serve as an alkali infiltration path. That is, since the viscoelasticity of the entire pressure-sensitive adhesive can be controlled in a continuous state without dividing the bulk body that is originally excellent in chemical resistance, the chemical resistance is improved. Moreover, since the surface layer of the pressure-sensitive adhesive layer is a highly cohesive bulk body, the pressure-sensitive adhesive on the adherend after peeling does not remain. In addition, it can confirm with the scanning electron microscope (SEM) that the liquid substance after bridge | crosslinking is disperse | distributing with the diameter of 0.2 micrometer-20 micrometers in the bulk body of a rubber material.

  The average molecular weight of the liquid substance is 1,000 in consideration of the residue on the adherend after peeling off the tape (contamination to the adherend) and the decrease in adhesion to the adherend due to the decrease in flexibility of the tape. It is preferably ˜5,000.

  Specifically, the liquid substance is preferably a substance having a polyisoprene skeleton, a polybutadiene skeleton, and / or a polybutene skeleton.

  The amount of the liquid substance is such that the liquid substance can be maintained as a dispersion, ensuring a sufficient distance between the dispersions that does not become an alkali infiltration route, and a liquid substance after crosslinking that is likely to cause adherend contamination. In view of reducing the probability of the presence of the pressure-sensitive adhesive on the surface of the pressure-sensitive adhesive, adjustment of viscoelasticity, etc., it is preferably 1% to 30% by weight, preferably 2.5% to 25% by weight . Although the liquid substance is cross-linked by the curing agent, even if it is cross-linked, it functions as a plasticizer for the rubber material, so that the fluidity of the entire pressure-sensitive adhesive can be adjusted by the amount of the liquid substance.

(C) Curing agent The curing agent cures the liquid substance. Specifically, the curing agent is preferably an isocyanate crosslinking agent. Further, the amount of the curing agent is preferably 30% by weight or less of the pressure-sensitive adhesive in consideration of the residue (contamination to the adherend) after the tape peeling. In particular, a ratio of 0.5 to 2 times the theoretical equivalent of the liquid substance is preferable.

Moreover, the adhesive has a storage elastic modulus G ′ at 25 ° C. of 4.5 × 10 ⁵ Pa to 6 in the dynamic viscoelastic spectrum measured at a frequency of 1 Hz in consideration of the anchoring effect on the adherend and stress relaxation. a .9 × ¹⁰ 5 Pa, a loss tangent tanδ is a 0.39 to 0.43, a storage modulus G 'is ^{7 × 10 4 Pa~9 × 10 4} Pa at 90 ° C., the loss tangent tanδ Is preferably 0.70 to 0.82.

  In addition, the pressure-sensitive adhesive contains, if necessary, a tackifier, a pressure-sensitive adhesive preparation agent, a surfactant, etc., or other modifiers and conventional ingredients within the quantitative and qualitative ranges that exert the effects of the present invention. Can be blended.

  As drying conditions in the case of forming a pressure-sensitive adhesive layer by applying a pressure-sensitive adhesive dissolved in a solvent to a substrate film, the temperature is preferably 70 ° C. to 130 ° C. and preferably 1 minute to 10 minutes. Further, the thickness of the pressure-sensitive adhesive layer thus obtained is not particularly limited, but is usually preferably 2 μm to 50 μm.

  As a base film in the peelable pressure-sensitive adhesive tape for masking according to the present invention, polyester, polyethylene, polypropylene, polyethylene naphthalate, or the like can be used.

  In the pressure-sensitive adhesive layer composed of the pressure-sensitive adhesive containing the above (A) to (C), the support tape has a liquid material after crosslinking dispersed in a bulk material of rubber material with a diameter of 0.2 μm to 20 μm. ing. For this reason, the masking effect with respect to a chemical | medical solution process can be exhibited.

  Since the object to be deposited is mainly flat and glossy, it is difficult to obtain the adhesive effect due to the anchoring effect of the adhesive, and therefore it is considered that the surface unevenness is close to the mirror silicon surface. The present inventor measured the adhesive strength with a mirror surface silicon wafer and investigated the appropriate values of adhesiveness and removability on the mirror surface, and the adhesive strength of the adhesive to the mirror surface silicon wafer was 0.2 N / 25 mm to 0. 0.5 N / 25 mm, particularly preferably 0.2 N / 25 mm to 0.3 N / 25 mm.

(Embodiment 2)
In the present embodiment, the support tape is sent out from another delivery roll, and the support tape is attached to the surface opposite to the chemical treatment surface of the film-type laminate before the chemical treatment. A case where chemical treatment is performed by a roll-to-roll method using a feed roll and a take-up roll will be described.

  FIG. 2 is a diagram illustrating a schematic configuration of a roll-to-roll apparatus that performs the chemical solution processing method according to the second embodiment. In FIG. 2, the film-type laminate 2 is wound around a delivery roll 1, and is taken out by a take-up roll 3 after being sent out from the delivery roll 1 and subjected to chemical treatment. Here, in the film-type laminate 2, a resist layer (resist 22 after development) is formed on a flexible printed wiring board (FPC) 21 in which a copper foil 222 is stuck on a polyimide film (PI) 221. The chemical solution treatment is a resist stripping treatment (alkali treatment).

  Alkali-resistant tape 23 fed from the support tape feed roll 6 is attached to the film-type laminate 2 fed from the feed roll 1. That is, before the chemical liquid treatment is performed, the film-type laminate 2 has the alkali resistant tape 23 attached so that the adhesive layer of the alkali resistant tape 23 contacts the surface opposite to the surface on which the chemical liquid treatment is performed. Is done. Thereafter, the film-type laminate 2 to which the alkali-resistant tape 23 is attached is immersed in a chemical solution (alkali stripping solution) 41 accommodated in the chemical solution container 4 by a transport roll, and the chemical solution treatment is performed in the chemical solution container 4. The Then, the film-type laminate 2 after the chemical treatment is removed from the chemical solution 41, and then the alkali-resistant tape 23 is peeled off. That is, the film-type laminate 2 that has come out of the chemical solution 41 is wound around the alkali-resistant tape 23 by the support tape winding roll 5, and the FPC 21 from which the resist 22 has been removed after development is wound up by the winding roll 2. Thus, in order to wind up the alkali-resistant tape 23 by the winding roll 5 different from the winding roll 2, the alkali-resistant tape 23 is inevitably peeled from the film-type laminate 2.

  Thus, also in the chemical treatment method according to the present embodiment, the support tape (alkali-resistant tape 23) is attached to the surface opposite to the chemical treatment surface of the film-type laminate 2 having the chemical treatment surface. Then, chemical treatment is performed on the chemical treatment surface, and the alkali-resistant tape 23 is peeled off after the chemical treatment. For this reason, during the chemical treatment, the film-type laminate 2 is supported by the alkali-resistant tape 23 (support tape), so even if the thickness of the film laminate 2 is thin, wrinkles and waves are generated during the chemical treatment. Does not occur. As a result, even in a thin film type laminate, the chemical treatment can be performed without generating wrinkles and undulations in the film type laminate during processing.

  In Embodiment 2, the description of each member of the film-type laminate and each member of the support tape is the same as that of the embodiment, and the description thereof is omitted.

  The present invention is not limited to the embodiment described above, and can be implemented with various modifications. For example, the apparatus configuration, the thickness of the adhesive layer, the material constituting the adhesive layer, and the blending amount thereof can be set as appropriate without departing from the effects of the present invention. Other modifications may be made as appropriate without departing from the scope of the object of the present invention.

It is a figure which shows schematic structure of the apparatus of the roll-to-roll system which performs the chemical | medical solution processing method which concerns on Embodiment 1. FIG. It is a figure which shows schematic structure of the apparatus of the roll-to-roll system which performs the chemical | medical solution processing method which concerns on Embodiment 2. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sending roll 2 Film type laminated body 3 Winding roll 4 Chemical solution container 5 Tape take-up roll for support 6 Tape feed roll for support 21 Flexible printed wiring board (FPC)
22 Resist after development 23 Alkali-resistant tape 41 Alkaline stripping solution 221 Polyimide film (PI)
222 copper foil

Claims (2)

A chemical processing method for performing chemical treatment on a film-type laminate by a roll-to-roll method using a delivery roll and a take-up roll, the film-type laminate having a chemical treatment surface on the side opposite to the chemical treatment surface A step of performing a chemical treatment on the chemical treatment surface with a support tape attached to the surface, and a step of peeling the support tape after the chemical treatment,
The delivery roll sends out a laminate formed by sticking and sticking the support tape in advance to the surface opposite to the chemical treatment surface of the film-type laminate,
The pressure-sensitive adhesive used for the pressure-sensitive adhesive layer of the support tape includes (A) a rubber material that is solid at room temperature, (B) a liquid material having a crosslinking base at the terminal, and (C) a curing agent for crosslinking the liquid material. And a liquid material after crosslinking is dispersed in a diameter of 0.2 μm to 20 μm in the bulk material of the rubber material, so that a chemical solution intrusion route is interrupted. Processing method. A composite that performs a chemical treatment on a film-type laminate by a roll-to-roll method using a delivery roll and a take-up roll, and a film-type laminate having a chemical treatment surface, and a side opposite to the chemical treatment surface A support tape adhered in close contact with the surface,
The pressure-sensitive adhesive used for the pressure-sensitive adhesive layer of the support tape includes (A) a rubber material that is solid at room temperature, (B) a liquid material having a crosslinking base at the terminal, and (C) a curing agent for crosslinking the liquid material. And a liquid material after crosslinking is dispersed in a diameter of 0.2 μm to 20 μm in the bulk material of the rubber material, and the intrusion path of the chemical solution is divided. body.

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