JP5375630B2 - Lead frame with resin and manufacturing method thereof, and LED element package and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lead frame with a resin and a method for manufacturing the same capable of reducing the thickness of an LED element package and improving the light emitting efficiency of the LED element package, and to provide the LED element package and a method for manufacturing the same. <P>SOLUTION: The lead frame 20 with a resin includes a die pad 21 for placing an LED element 11 and a wiring conductor 30 provided around the die pad 21. A reflecting resin 23 for reflecting light from the LED element 11 is formed around at least the die pad 21, and a support substrate 40 is formed on the rear surfaces of the die pad 21, the wiring conductor 30, and the reflecting resin 23. The die pad 21 and the wiring conductor 30 are formed by plating using a plating forming resist on the supporting substrate 40, and the reflecting resin 23 is formed of the plating forming resist. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a lead frame with a resin and a method for manufacturing the same, and an LED element package and a method for manufacturing the same, and in particular, a lead frame with a resin capable of improving the light emission efficiency of the LED element package, a method for manufacturing the resin, and a light emission efficiency. The present invention relates to an LED element package and a manufacturing method thereof.

  2. Description of the Related Art Conventionally, lighting devices that use LED (light emitting diode) elements as light sources have been used for various home appliances, OA equipment, display lights for vehicle equipment, general lighting, in-vehicle lighting, displays, and the like. Some such lighting devices include an LED element package having LED elements.

  As an LED element package, what was conventionally described in patent document 1-2, for example is known. However, in such an LED element package, since the LED element is provided on the lead frame, the entire thickness is increased to, for example, about 2 to 3 mm, so that it is difficult to reduce the thickness.

  On the other hand, Patent Literature 3-4 discloses a coreless semiconductor package. The coreless semiconductor package is a form of a semiconductor package that has been developed to solve the two problems of thinning the semiconductor package and improving heat dissipation characteristics. A core member such as an internal wiring board called a lead frame or an interposer has a certain thickness in order to maintain the shape and mechanical strength that can be transported and processed by itself. Since the coreless semiconductor package described above does not include a core member such as a lead frame or an internal wiring board (referred to as an interposer) (coreless), the semiconductor package can be thinned.

JP-A-62-232976 JP 2002-314137 A Japanese Patent Publication No. 4-47977 JP 2001-358254 A

  However, when an LED element is mounted on such a conventional coreless semiconductor package, there is a problem that light emission efficiency from the semiconductor package (LED element package) is lowered.

  That is, when an LED element is mounted on a conventional coreless semiconductor package, part of the light from the LED element is emitted from the surface (light emitting surface), but other light is not emitted from the light emitting surface. Due to internal reflection, leakage from the side surface or back surface of the semiconductor package to the outside occurs. As described above, light leaks from the side surface or the back surface of the semiconductor package, so that light from the front surface (light emitting surface) is lost. Such a loss of light causes a decrease in light emission efficiency in the LED element package, which is a problem in improving the luminance of the LED element package, and is therefore a big problem.

  The present invention has been made in consideration of the above points, and it is possible to reduce the thickness of the LED element package and improve the luminous efficiency of the LED element package. An object of the present invention is to provide a manufacturing method thereof, an LED element package and a manufacturing method thereof.

  The present invention relates to a resin-made lead frame used for manufacturing an LED element package, comprising a die pad on which the LED element is placed and a wiring conductor provided around the die pad, and at least around the die pad from the LED element. A reflective resin part for reflecting the light is provided, and a support substrate is provided on the back surface of the die pad, the wiring conductor, and the reflective resin part, and the die pad and the wiring conductor are formed on the support substrate by plating using a plating forming resist. The reflective resin portion is a lead frame with a resin characterized by comprising a plating forming resist.

  The present invention is the lead frame with resin, wherein an additional reflective resin portion is provided around the wiring conductor.

  The present invention is the lead frame with resin, wherein the reflective resin portion is filled between the die pad and the wiring conductor.

  In the present invention, a plurality of unit lead frames each corresponding to one LED element are mounted on a support substrate. Each unit lead frame includes a die pad corresponding to one LED element and a wiring conductor corresponding to this die pad. And a reflective resin portion surrounding the die pad and the wiring conductor, and a boundary gap portion is provided between each unit lead frame and a unit lead frame adjacent to the unit lead frame. A lead frame with a resin, which is filled with a resin made of the same material as the resin portion.

  The present invention is the lead frame with resin characterized in that at least one of the die pad and the wiring conductor has a protruding portion protruding toward the side.

  The present invention is the lead frame with resin, wherein the reflective resin portion has a trapezoidal cross section that tapers upward.

  According to the present invention, there is provided a lead frame with a resin, wherein a recess is formed on the back side of at least one of a die pad and a wiring conductor, and the recess is filled with a resin made of the same material as the reflective resin portion. It is.

  According to the present invention, there is provided a lead frame with a resin, wherein a concave portion is formed on at least one surface side of a die pad and a wiring conductor, and the concave portion is filled with a resin made of the same material as the reflective resin portion. It is.

  The present invention is a lead frame with a resin characterized in that the die pad back surface has a larger area than the die pad surface, and the wiring conductor surface has a larger area than the wiring conductor back surface.

  The present invention is the lead frame with resin, wherein the wiring conductor is composed of a first wiring conductor and a second wiring conductor arranged on both sides of the die pad.

  In the present invention, the surface of the reflective resin portion filled between the die pad and the wiring conductor is flush with the surface of the die pad and the surface of the wiring conductor, or is filled between the die pad and the wiring conductor. The lead frame with resin is characterized in that the surface of the reflective resin portion is positioned below the surface of the die pad and the surface of the wiring conductor.

  In the LED element package, the present invention provides a die pad, an LED element placed on the die pad, a wiring conductor provided around the die pad, a conductive portion that electrically connects the wiring conductor and the LED element, and at least A reflection resin portion provided around the die pad for reflecting light from the LED element; and a sealing resin portion for sealing the die pad, the LED element, the wiring conductor, the conductive portion, and the reflection resin portion. The wiring conductor is formed by plating using a plating formation resist, and the reflective resin portion is made of a plating formation resist.

  The present invention is an LED element package characterized in that an additional reflective resin portion is provided around a wiring conductor.

  The present invention is the LED element package, wherein the reflective resin portion is filled between the die pad and the wiring conductor.

  The present invention is the LED element package characterized in that at least one of the die pad and the wiring conductor has a protruding portion protruding sideways.

  The present invention is the LED element package characterized in that the reflective resin portion has a trapezoidal cross section that tapers upward.

  The present invention provides an LED element package characterized in that a recess is formed on the back side of at least one of the die pad and the wiring conductor, and the recess is filled with a resin made of the same material as the reflective resin portion. is there.

  The present invention is an LED element package characterized in that a concave portion is formed on at least one surface side of a die pad and a wiring conductor, and the concave portion is filled with a resin made of the same material as the reflective resin portion. is there.

  The present invention is an LED element package characterized in that the die pad back surface has a larger area than the die pad surface, and the wiring conductor surface has a larger area than the wiring conductor back surface.

  The present invention is the LED element package characterized in that the wiring conductor includes a first wiring conductor and a second wiring conductor arranged on both sides of the die pad.

  The present invention relates to a resin lead frame manufacturing method used for manufacturing an LED element package, a step of preparing a support substrate that functions as a support member, and a plating formation resist having a desired pattern on the surface of the support substrate. A step of providing a resist for forming a plating functioning as a reflective resin portion for reflecting light from the LED element, a die pad for plating the surface side of the support substrate, and mounting the LED element, and the periphery of the die pad And a step of forming a wiring conductor, and the reflective resin portion is provided at least around the die pad.

  The present invention is the method for manufacturing a resin-attached lead frame, wherein the plating formation resist is formed by a photolithography method.

  The present invention is the method for manufacturing a lead frame with a resin, wherein the resist for plating formation is formed by a resin molding method.

  The present invention is the method of manufacturing a resin-attached lead frame, wherein the plating formation resist is formed by a screen printing method.

  The present invention relates to a method of manufacturing an LED element package, a step of producing a lead frame with a resin by a method of manufacturing a lead frame with a resin, a step of mounting an LED element on a die pad of a lead frame with a resin, an LED element and a wiring A step of connecting a conductor with a conductive portion, a step of forming a sealing resin portion by sealing a die pad, an LED element, a wiring conductor, a conductive portion and a reflective resin portion on a support substrate with a sealing resin; And a step of removing the substrate from the sealing resin portion.

  According to the present invention, since the reflection resin part for reflecting the light from the LED element is provided at least around the die pad, the light from the LED element is reflected by the reflection resin part, and this light is reflected to the LED element package. Can be led to the surface (light emitting surface) side. Therefore, light can be prevented from leaking from the side surface or the back surface of the semiconductor package, and the light emission efficiency of the LED element package can be improved.

  According to the present invention, since the LED element package does not have a core member such as a lead frame or a metal substrate, the LED element package can be made thin.

The top view and sectional drawing which show the lead frame with resin by the 1st Embodiment of this invention. Sectional drawing which shows the LED element package by the 1st Embodiment of this invention. Sectional drawing which shows the state by which the LED element package by the 1st Embodiment of this invention is arrange | positioned on the wiring board. The figure which shows the manufacturing method of the lead frame with a resin by the 1st Embodiment of this invention. The figure which shows the modification of the manufacturing method of the lead frame with resin by the 1st Embodiment of this invention. The figure which shows the manufacturing method of the LED element package by the 1st Embodiment of this invention. Sectional drawing which shows the lead frame with resin by the 2nd Embodiment of this invention. Sectional drawing which shows the LED element package by the 2nd Embodiment of this invention. Sectional drawing which shows the lead frame with resin by the 3rd Embodiment of this invention. Sectional drawing which shows the LED element package by the 3rd Embodiment of this invention. Sectional drawing which shows the lead frame with resin by the 4th Embodiment of this invention. Sectional drawing which shows the LED element package by the 4th Embodiment of this invention. Sectional drawing which shows the lead frame with resin by the 5th Embodiment of this invention. Sectional drawing which shows the LED element package by the 5th Embodiment of this invention. Sectional drawing which shows the lead frame with resin by the 6th Embodiment of this invention. Sectional drawing which shows the LED element package by the 6th Embodiment of this invention. Sectional drawing which shows the lead frame with resin by the 7th Embodiment of this invention. Sectional drawing which shows the LED element package by the 7th Embodiment of this invention. Sectional drawing which shows the lead frame with resin by the 8th Embodiment of this invention. Sectional drawing which shows the LED element package by the 8th Embodiment of this invention.

First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 6 are diagrams showing a first embodiment of the present invention.

Configuration of Lead Frame with Resin First, an outline of the lead frame with resin according to the present embodiment will be described with reference to FIGS. FIG. 1A is a plan view showing a lead frame according to the present embodiment, and FIG. 1B is a cross-sectional view taken along line AA ′ in FIG.

  A lead frame 20 with resin shown in FIGS. 1A and 1B includes a die pad 21 on which an LED element 11 (described later) is placed, and a wiring conductor 30 around the die pad 21 and spaced from the die pad 21. It has.

  Among these, a reflection resin portion 23 for reflecting light from the LED element 11 (described later) is provided around the die pad 21. That is, the reflective resin portion 23 is filled around the die pad 21 and between the die pad 21 and the wiring conductor 30 (reflective resin portion 23a). A reflective resin portion 23 is also provided around the die pad 21 at a position opposite to the wiring conductor 30 when viewed from the die pad 21 (reflective resin portion 23b).

  Further, an additional reflective resin portion 23 (23 c) is provided around the wiring conductor 30 and at a position opposite to the die pad 21 when viewed from the wiring conductor 30. In the present embodiment, the reflection resin portions 23a, 23b, and 23c are integrally configured as a whole (see FIG. 1A), but not limited thereto, the reflection resin portions 23a, 23b, and 23c are respectively formed. It may be configured separately.

  As shown in FIG. 1B, the reflection resin portion 23 (23a, 23b) provided around the die pad 21 and the reflection resin portion 23 (additional reflection resin portion 23c) provided around the wiring conductor 30 are Both have a rectangular cross section.

  On the other hand, as shown in FIGS. 1A and 1B, a thin plate-like support substrate 40 is provided on the back surface of the die pad 21, the wiring conductor 30 and the reflective resin portion 23, and the die pad 21, the wiring conductor 30 and the reflective resin portion 23 are provided. Is supported by the support substrate 40.

  As shown in FIGS. 1A and 1B, a plurality of unit lead frames 50 each corresponding to one LED element 11 may be mounted on a single support substrate 40 (multi-sided). This is called a lead frame with adhesive resin). That is, the unit lead frame 50 includes a die pad 21 corresponding to one LED element 11, a wiring conductor 30 corresponding to the die pad 21, and a reflective resin portion 23 surrounding the die pad 21 and the wiring conductor 30. In this case, the unit lead frame 50 and the adjacent unit lead frame 50 (drawn with a two-dot chain line) are arranged via the boundary gap 28. The boundary gap portion 28 is a portion that is cut when the LED elements 11 are separated into individual pieces. The boundary gap portion 28 is filled with a resin made of the same material as the reflective resin portion 23. Specifically, the boundary gap portion 28 is preferably formed integrally with the reflective resin portion 23 and filled.

  Hereinafter, each component which comprises such a lead frame 20 with a resin is demonstrated sequentially.

  As the support substrate 40, for example, a conductive substrate such as copper, iron-nickel alloy, iron-nickel-chromium alloy, iron-nickel-carbon alloy, or the surface is made of Cu, Ni, Ag, Pd, Au or an alloy thereof. An insulating substrate provided with a conductive layer can be used. The support substrate 40 has a substantially rectangular planar shape, and the thickness can be set to 0.08 mm to 0.25 mm, for example. The support substrate 40 may have a transport hole 27 (also referred to as a jig hole) that is used when the support substrate 40 is transported or positioned in the manufacturing process.

  The die pad 21 and the wiring conductor 30 are metals that are formed on the support substrate 40 by plating using a plating formation resist. In this case, the reflective resin portion 23 is made of a plating formation resist. That is, the reflection resin portion 23 reflects light from the LED element 11 and also functions as a plating formation resist when the die pad 21 and the wiring conductor 30 are formed by plating.

  The die pad 21 and the wiring conductor 30 may each consist of one or more plating layers. For example, the plating layer includes a main body plating layer formed on the support substrate 40, and a reflection plating layer that is formed on the main body plating layer and functions as a reflection surface for reflecting light from the LED element 11 (described later). It may consist of

  In this case, the main body plating layer can be composed of a plating layer containing a metal such as nickel (Ni). In addition, the thickness of a main body plating layer can be 10 micrometers-100 micrometers, for example.

  On the other hand, the reflective plating layer is made of a plating layer having a high visible light reflectivity, and functions as a reflective surface for reflecting light from the LED element 11 (described later). Examples of the material constituting the reflective plating layer include a three-layer structure of silver (Ag), gold (Au), palladium (Pd), nickel (Ni) / palladium (Pd) / gold (Au), and the like. However, silver (Ag) is preferably used from the viewpoint of light reflectance. The thickness of the reflective plating layer is, for example, 1 μm to 5 μm in the case of silver, and in the case of a three-layer structure of Ni / Pd / Au, the thickness of Ni is 0.2 μm or more and the thickness of Pd is 0.01 to 0. It is preferable that the thickness of Au is 0.001 to 0.03 μm.

  As described above, the reflective resin portion 23 has a function of reflecting light from the LED element 11 (described later) and a function as a plating formation resist. Examples of the reflective resin portion 23 having such a function include an epoxy resin, a silicone resin, a polyphthalamide (PPA) resin, a liquid crystal polymer (LCP), and the like. The reflective resin portion 23 may be mixed with a filler such as barium sulfate in order to increase the light reflectance. The thickness of the reflective resin portion 23 can be set to 5 μm to 500 μm, for example, and is thicker than the thickness of the die pad 21 and the wiring conductor 30 in the embodiment shown in FIG.

Configuration of LED Element Package Next, an outline of the coreless LED element package according to the present embodiment will be described with reference to FIG.

  The LED element package 10 includes a die pad 21, an LED element 11 placed on the die pad 21, and a wiring conductor 30 provided around the die pad 21 and spaced from the die pad 21.

  Among these, a reflection resin portion 23 for reflecting light from the LED elements 11 is provided around the die pad 21. That is, as in FIGS. 1A and 1B, the reflective resin portion 23 (23 a) is provided around the die pad 21 between the die pad 21 and the wiring conductor 30, and the wiring conductor 30 is viewed from the die pad 21. The reflective resin portion 23 (23b) is provided at a position on the opposite side. Further, an additional reflective resin portion 23 (23 c) is provided around the wiring conductor 30 and at a position opposite to the die pad 21 when viewed from the wiring conductor 30.

  The wiring conductor 30 and the LED element 11 are electrically connected by a bonding wire (conductive portion) 12. The LED element 11 is electrically connected to the die pad 21. Further, the die pad 21, the LED element 11, the wiring conductor 30, the bonding wire 12, and the reflective resin portion 23 are sealed with a sealing resin portion 13.

  An external terminal 22 is formed on the back surface of the die pad 21, and an external terminal 31 is formed on the back surface of the wiring conductor 30. The external terminals 22 and the external terminals 31 are exposed outward from the sealing resin portion 13. The entire back surface of the LED element package 10 is covered with the external terminals 22, the external terminals 31, and the reflective resin portion 23. This prevents light from the LED element 11 from leaking from the back surface of the LED element package 10.

  Hereinafter, each component which comprises such an LED element package 10 is demonstrated sequentially.

  As the LED element 11, those conventionally used in general can be used. Further, as the light emitting layer of the LED element 11, for example, by appropriately selecting a material made of a compound semiconductor single crystal such as GaP, GaAs, GaAlAs, GaAsP, AlInGaP, or InGaN, an emission wavelength ranging from ultraviolet light to infrared light is selected. be able to.

  The LED element 11 is fixed on the die pad 21 with solder or conductive die bonding paste (not shown). As such a conductive die bonding paste, a die bonding paste made of an epoxy resin or a silicone resin containing a filler such as silver can be selected.

  The bonding wire 12 is made of a material having good conductivity such as gold, and one end thereof is connected to the terminal portion 11 a of the LED element 11 and the other end is connected to the wiring conductor 30.

  As the sealing resin portion 13, it is desirable to select a material having a high light transmittance and a high refractive index at the emission wavelength of the LED element package 10 in order to improve the light extraction efficiency. Therefore, it is possible to select an epoxy resin or a silicone resin as a resin that satisfies the characteristics of high heat resistance, weather resistance, and mechanical strength. The shape of the sealing resin portion 13 can be realized in various ways. For example, the entire shape of the sealing resin portion 13 can be a rectangular parallelepiped, a cylindrical shape, a cone shape, or the like. The thickness of the sealing resin portion 13 (that is, the thickness of the LED element package 10 as a whole) can be 200 μm to 500 μm, and is thinner than conventionally known LED element packages (for example, PLCC type, SON type). Can be configured. A light emitting surface 13 a that emits light from the LED element 11 is formed on the surface of the sealing resin portion 13 (that is, the upper surface in FIG. 2). The shape of the light emitting surface 13a may be a flat surface or a lens using a spherical surface, or a surface having irregularities for scattering light.

  In addition, since the structure of the die pad 21, the wiring conductor 30, and the reflective resin part 23 is the same as the structure already demonstrated using Fig.1 (a) (b) among the LED element packages 10, detailed description here. Is omitted.

  Next, the operation of the present embodiment having such a configuration will be described.

  As shown in FIG. 3, the LED element package 10 is disposed on the wiring board 35. Such a wiring board 35 has a board body 36 and wiring terminal portions 37 and 38 formed on the board body 36. Among these, one wiring terminal portion 37 is connected to the external terminal 22 of the die pad 21 via one connection metal portion 33. The other wiring terminal portion 38 is connected to the external terminal 31 of the wiring conductor 30 via the other connecting metal portion 34. In addition, the connection metal parts 33 and 34 can be comprised, for example from solder.

  In this way, when the LED element package 10 is disposed on the wiring board 35 and a current is passed between the wiring terminal portions 37 and 38, a current is applied to the LED element 11 on the die pad 21, and the LED element 11 is turned on. To do.

  At this time, most of the light L from the LED element 11 is directly emitted from the light emitting surface 13a or is emitted from the light emitting surface 13a by being reflected by the surface of the die pad 21. On the other hand, a part of the light L from the LED element 11 does not go to the light emitting surface 13 a side because of internal reflection in the sealing resin portion 13. On the other hand, in this embodiment, a reflective resin portion 23 for reflecting the light L from the LED element 11 is provided around the die pad 21. Thereby, the light L which does not go to the light emission surface 13a side can be reflected by the reflective resin part 23, and can be guide | induced toward the light emission surface 13a side. As a result, as shown in FIG. 3, the light L of the LED element 11 can be prevented from leaking from the side surface or the back surface of the semiconductor package 10, and most of the light L can be extracted from the light emitting surface 13a. In this way, the light emission efficiency of the LED element package 10 can be improved.

  On the other hand, as a comparative example, when such a reflective resin portion 23 is not provided, a part of the light L from the LED element 11 is part of the side surface or the back surface of the LED element package 10 (for example, between the die pad 21 and the wiring conductor 30). Escape to the outside through the gap. In this case, the luminous efficiency of the LED element package 10 may be reduced.

  In FIG. 3, the heat generated from the LED element 11 is released outward from the external terminal 22 of the die pad 21 through the connection metal portion 33 (reference numeral H in FIG. 3). Therefore, the heat from the LED element 11 does not accumulate in the sealing resin portion 13, and the LED element 11 can be prevented from being destroyed by the heat.

Manufacturing Method of Lead Frame with Resin Next, a manufacturing method of the lead frame with resin according to the present embodiment will be described with reference to FIGS. Among these, FIGS. 4A to 4F are views showing a method of manufacturing a resin-attached lead frame according to the present embodiment, in which a plating forming resist is formed by a photolithography method, and FIG. (a)-(d) is a modified example of the manufacturing method of the lead frame with resin according to the present embodiment, and shows a case where a resist for plating formation is formed by a resin molding method. Hereinafter, a method for manufacturing a lead frame with resin will be described in the order of FIGS. 4A to 4F and FIGS. 5A to 5D.

  First, with reference to FIGS. 4A to 4F, description will be given of a method of manufacturing a resin-made lead frame according to the present embodiment, in which a plating forming resist is formed by a photolithography method.

  First, as shown in FIG. 4A, a support substrate 40 that functions as a support member is prepared. The support substrate 40 can be made of various materials as described above. However, for example, when copper or a copper alloy is used as the support substrate 40, the support substrate 40 is selectively etched after the LED element 11 is incorporated. 40 can be removed. As will be described later, in order to easily peel the die pad 21, the wiring conductor 30 and the reflective resin portion 23 from the support substrate 40, a surface treatment is performed to make the one surface of the support substrate 40 uneven, and the peelability is improved. It is also possible to take measures such as performing peeling treatment. Examples of the surface treatment here include blasting by sandblasting, and examples of the peeling treatment include a method of forming an oxide film on the surface 40 a of the support substrate 40.

  Next, a plating forming resist having a desired pattern is formed on the surface 40a of the support substrate 40 by a photolithography method, and functions as the reflective resin portion 23 for reflecting the light from the LED element 11. A resist (hereinafter simply referred to as a reflective resin portion 23) is provided (FIG. 4B). In this case, the reflective resin portion 23 is made of an epoxy resin mixed with a white filler such as barium sulfate or titanium oxide. An example of such a white photoresist is PSR-4000LEW manufactured by Taiyo Ink Manufacturing Co., Ltd.

  Openings 23d and 23e are formed in the reflective resin portion 23 at locations corresponding to the formation locations of the die pad 21 and the respective wiring conductors 30, and the surface 40a of the support substrate 40 is exposed from the openings 23d and 23e. Yes. In this case, a film of the reflective resin portion 23 is provided on the entire surface 40a of the support substrate 40, the film of the reflective resin portion 23 is exposed through a photomask, and then developed to open the reflective resin portion 23. The portions 23d and 23e are formed. The thickness of the reflective resin portion 23 is set to be larger than the thickness of the die pad 21 and the wiring conductor 30.

  Next, a resist layer 42 having a desired pattern is provided on the back surface 40b of the support substrate 40 (FIG. 4C). The resist layer 42 is made of a resin that can be peeled off by alkali, acid, solvent, or the like. In addition, the resist layer 42 has an opening 42a at a position corresponding to the site where the transfer hole 27 is formed, and the back surface 40b of the support substrate 40 is exposed from the opening 42a. In this case, a resist layer 42 is provided on the entire back surface 40 b of the support substrate 40, the resist layer 42 is exposed through a photomask, and then developed to form an opening 42 a in the resist layer 42. On the other hand, a transport hole 27 is opened in the surface portion on the opposite side of the opening 42a through the support substrate 40. The reflective resin portion 23 is formed so as not to block the transport hole 27 in this portion. In addition, it is covered with a peelable cover 45 for the purpose of preventing the plating layer (die pad 21 and wiring conductor 30) from being formed in the next step.

  Next, the back surface 40 b side of the support substrate 40 is covered with a cover 43, and electrolytic plating is performed on the front surface 40 a side of the support substrate 40. In this case, the reflective resin portion 23 is used as a plating formation resist. As a result, metal is deposited in the openings 23d and 23e on the support substrate 40 to form the die pad 21 on which the LED element 11 is placed, and the wiring conductor 30 is formed around the die pad 21 (FIG. 4 ( d)).

  Here, when the die pad 21 and the wiring conductor 30 are composed of, for example, a main body plating layer and a reflection plating layer, the die pad 21 and the wiring conductor 30 can be formed by the following method. That is, first, electrolytic plating is performed on the support substrate 40 to form a main body plating layer made of, for example, nickel (Ni). At this time, for example, a nickel sulfamate plating bath having a high nickel concentration can be used as the plating solution. Next, a reflective plating layer made of, for example, a three-layer structure of silver (Ag), gold (Au), palladium (Pd), nickel (Ni) / palladium (Pd) / gold (Au), etc. on the main body plating layer. Form. In this case, for example, a cyan plating bath can be used as the plating solution.

  Subsequently, as shown in FIG. 4E, the front surface 40 a side of the support substrate 40 is covered with a cover 44, and the back surface side cover 43 of the support substrate 40 is peeled off. Next, etching is performed on the back surface side of the support substrate 40 so that the support substrate 40 has a predetermined outer shape, and a desired transfer hole is formed at a position corresponding to the opening 42 a of the resist layer 42 on the support substrate 40. 27 is formed. The transport hole 27 is used when the support substrate 40 is transported or positioned in the manufacturing process of the LED element package 10 described later.

  Next, the covers 44 and 45 on the front surface side of the support substrate 40 are peeled off, and the resist layer 42 on the back surface 40b side of the support substrate 40 is further peeled off (FIG. 4F). The reflective resin portion 23 is left as it is. In this way, the lead frame with resin 20 shown in FIGS. 1A and 1B is obtained.

  In the case where a plurality of unit lead frames 50 are formed on the support substrate 40, a plurality of unit lead frames 50 are formed on the support substrate 40. It is desirable to fill the portion 28 with a resin made of the same material as that of the reflective resin portion 23 and coat it. By filling the resin and covering the support substrate 40 in this manner, the boundary gap 28 can be prevented from being unnecessarily plated when the die pad 21 and the wiring conductor 30 are formed by electrolytic plating, and the manufacturing cost can be reduced. .

  Next, with reference to FIGS. 5A to 5D, a case of forming a resist for plating formation by a resin molding method, which is a modification of the method for manufacturing a lead frame with resin according to the present embodiment, will be described.

  First, as shown in FIG. 5A, a support substrate 40 that functions as a support member is prepared.

  Next, a plating forming resist having a desired pattern (that is, the reflective resin portion 23) is provided on the surface 40a of the support substrate 40 by a resin molding method (FIG. 5B). In this case, the reflection resin portion 23 is made of, for example, a silicone resin or polyphthalamide (PPA) resin mixed with a filler such as barium sulfate. Examples of the resin molding method include an injection molding method and a transfer molding method. In particular, when the reflective resin portion 23 is made of a silicone-based resin, it is preferable to use a transfer molding method. On the other hand, when the reflective resin portion 23 is made of a polyphthalamide (PPA) resin, it is preferable to use an injection molding method.

  In this case, openings 23d and 23e are formed in the reflective resin portion 23 at locations corresponding to the formation portions of the die pad 21 and the wiring conductors 30, respectively, and the surface 40a of the support substrate 40 is formed from the openings 23d and 23e. Exposed. The thickness of the reflective resin portion 23 is set to be larger than the thickness of the die pad 21 and the wiring conductor 30.

  Next, electrolytic plating is performed on the surface 40a side of the support substrate 40 (FIG. 5C). In this case, the reflective resin portion 23 is used as a plating formation resist. As a result, metal is deposited in the openings 23 d and 23 e on the support substrate 40 to form the die pad 21 for mounting the LED element 11, and the wiring conductor 30 is formed around the die pad 21.

  Here, when the die pad 21 and the wiring conductor 30 are composed of, for example, a main body plating layer and a reflection plating layer, the die pad 21 and the wiring conductor 30 can be formed by the following method. That is, first, electrolytic plating is performed on the support substrate 40 to form a main body plating layer made of, for example, nickel (Ni). At this time, for example, a nickel sulfamate plating bath having a high nickel concentration can be used as the plating solution. Next, a reflective plating layer made of, for example, a three-layer structure of silver (Ag), gold (Au), palladium (Pd), nickel (Ni) / palladium (Pd) / gold (Au), etc. on the main body plating layer. Form. In this case, for example, a cyan plating bath can be used as the plating solution.

  Subsequently, as shown in FIG. 5 (d), the support substrate 40 is made into a predetermined outer shape by pressing, and a desired transfer hole 27 is formed in the support substrate 40. Of these, the conveying hole 27 may be formed by cutting using a drill. The transport hole 27 is used when the support substrate 40 is transported or positioned in the manufacturing process of the LED element package 10 described later.

  In this way, the lead frame with resin 20 shown in FIGS. 1A and 1B is obtained.

  As described above, when the plating forming resist is formed by the resin molding method, the manufacturing process can be simplified as compared with the case where the etching process is performed using the photoresist, and the manufacturing cost can be reduced. As another method for forming a plating formation resist, a method of screen printing a resist can be realized. This method also has a simple process and can reduce costs.

Method for Manufacturing LED Element Package Next, a method for manufacturing a coreless LED element package according to the present embodiment will be described with reference to FIGS.

  First, the support substrate 40 and the support substrate 40 are formed by the steps shown in FIGS. 4A to 4F (photolithography method) or FIGS. 5A to 5D (resin molding method). A lead frame 20 with a resin having a die pad 21, a wiring conductor 30 provided around the die pad 21, and a reflective resin portion 23 provided around the die pad 21 is produced (FIG. 6A). In the case of a multi-faced resin lead frame, the boundary gap portion 28 is formed integrally with the reflective resin portion 23 at this stage and is filled with resin (shown by a two-dot chain line in FIGS. 6A to 6C).

  Next, the LED element 11 is mounted and fixed on the die pad 21 via solder or conductive die bonding paste (not shown) (FIG. 6B).

  Next, using the bonding wire 12, the terminal part 11a of the LED element 11 and the wiring conductor 30 are electrically connected (wire bonding) (FIG. 6C).

  Thereafter, the die pad 21, the wiring conductor 30, the reflective resin portion 23, the LED element 11, and the bonding wire 12 on the support substrate 40 are sealed with a sealing resin portion 13 made of, for example, epoxy resin or silicone resin (FIG. 6D). ).

  Next, the support substrate 40 on the back surface side is removed from the die pad 21, the wiring conductor 30, and the reflective resin portion 23 by, for example, etching or physical peeling. In this way, the LED element package 10 shown in FIG. 2 can be obtained (FIG. 6E).

  A plurality of die pads 21 and wiring conductors 30 are formed on the support substrate 40 in advance, and the LED elements 11 are mounted on the die pads 21 and electrically connected, and the entire support substrate is sealed together. After sealing with the stop resin, the LED element package 10 shown in FIG. 2 may be obtained by dicing the sealing resin portion 13 for each LED element package including each LED element 11. FIG. 6D shows a state in which the sealing resin portion 13 is diced along the boundary gap portion 28 leaving the support substrate 40.

  As described above, according to the present embodiment, a lead frame, an internal wiring board (referred to as an interposer) or the like is not used to mount the LED element 11, and therefore the thickness of the LED element package 10 is reduced. Can do. Specifically, the thickness of the LED element package 10 can be set to, for example, 200 μm to 500 μm.

  Further, according to the present embodiment, since the reflective resin portion 23 for reflecting the light from the LED element 11 is provided around the die pad 21, the light from the LED element 11 is reflected by the reflective resin portion 23, This light can be guided to the light emitting surface 13 a side of the LED element package 10. As a result, the light emission efficiency of the LED element package 10 can be improved, and the LED element package 10 can be increased in luminance with power saving.

  Further, according to the present embodiment, since the reflective resin portion 23 also functions as a resist for plating formation, the LED element package 10 emits light without increasing the number of steps as compared with the conventional coreless semiconductor package manufacturing method. Efficiency can be improved. Therefore, the manufacturing cost does not increase.

  Moreover, according to this Embodiment, since the die pad 21 is comprised by metal plating, it is easy to release the heat | fever from the LED element 11 to the outward of the LED element package 10, and can improve the heat dissipation of the LED element package 10. it can.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. 7 and 8 are diagrams showing a second embodiment of the present invention. The second embodiment shown in FIG. 7 and FIG. 8 is different in that a protruding portion 29 protruding from the die pad 21 and the wiring conductor 30 to the side is provided. This is substantially the same as the first embodiment. 7 and 8, the same parts as those of the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the lead frame with resin 20A shown in FIG. 7 and the LED element package 10A shown in FIG. 8, the die pad 21 has a protruding portion 29 protruding toward the side, and the wiring conductor 30 protrudes toward the side. A protrusion 39 is provided.

  In the present embodiment, as shown in FIGS. 7 and 8, the die pad 21 and the wiring conductor 30 are thicker than the reflective resin portion 23. The protrusions 29 and 39 extend on the reflective resin portion 23, respectively. In addition, it is preferable that the protrusion parts 29 and 39 are provided over the perimeter of the die pad 21 and the wiring conductor 30, respectively.

  In the case of manufacturing the lead frame with resin 20A shown in FIG. 7, in the step of performing electrolytic plating on the surface 40a side of the support substrate 40 to form the die pad 21 and the wiring conductor 30 (FIGS. 4D and 5C). )), Plating is deposited thicker than the reflective resin portion 23. In this case, the metal deposited in the openings 23d and 23e of the reflective resin portion 23 is deposited upward along the inner walls of the openings 23d and 23e, and then rises from the reflective resin portion 23 to the surface of the reflective resin portion 23. Along the horizontal direction. As a result, protrusions 29 and 39 projecting sideways are formed on the die pad 21 and the wiring conductor 30, respectively.

  In addition, the manufacturing method of the lead frame with resin 20A is the same as the manufacturing method of the lead frame with resin 20 in the first embodiment (FIGS. 4A to 4F and FIGS. 5A to 5D). ) And the description thereof is omitted here.

  Further, the manufacturing method of the LED element package 10A shown in FIG. 8 is substantially the same as the manufacturing method (FIGS. 6A to 6E) of the LED element package 10 in the first embodiment described above. The description is omitted.

  According to the present embodiment, since the die pad 21 and the wiring conductor 30 have the protrusions 29 and 39 protruding respectively to the sides, the die pad 21 and the wiring conductor 30 fall off from the sealing resin portion 13. This can be prevented.

  In the present embodiment, the example in which the protrusions 29 and 39 are provided on both the die pad 21 and the wiring conductor 30 is shown. However, the present invention is not limited to this. You may provide only in either.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIG. 9 and FIG. 9 and 10 are diagrams showing a third embodiment of the present invention. The third embodiment shown in FIG. 9 and FIG. 10 is different in that the reflective resin portion 23 has a trapezoidal cross section that tapers upward, and the other configuration is the same as that of the first embodiment described above. It is almost the same. 9 and 10, the same parts as those of the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the lead frame with resin 20B shown in FIG. 9 and the LED element package 10B shown in FIG. 10, the reflective resin portion 23 has a trapezoidal cross section that tapers upward (on the front side).

  Specifically, it is the periphery of the die pad 21, the reflective resin portion 23 a filled between the die pad 21 and the wiring conductor 30, and the periphery of the die pad 21, opposite to the wiring conductor 30 as viewed from the die pad 21. Each of the reflective resin portion 23b provided on the side and the additional reflective resin portion 23c provided on the opposite side of the die pad 21 when viewed from the wiring conductor 30 has a trapezoidal cross section.

  The manufacturing method of the lead frame with resin 20B shown in FIG. 9 is substantially the same as the manufacturing method of the lead frame with resin 20 in the first embodiment described above. However, in order to make the reflective resin portion 23 have such a shape, it is preferable to employ the method (resin molding method) shown in FIGS.

  Also, the manufacturing method of the LED element package 10B shown in FIG. 10 is substantially the same as the manufacturing method (FIGS. 6A to 6E) of the LED element package 10 in the first embodiment described above. The description is omitted.

  According to the present embodiment, since the inclined surface 24 (see FIG. 10) that expands upward is formed in the reflective resin portion 23, the light from the LED element 11 is easily reflected, and the LED element The luminous efficiency of the package 10B can be further improved.

  Further, according to the present embodiment, the die pad 21 and the wiring conductor 30 each have a trapezoidal shape that tapers downward (on the back surface side), so that the die pad 21 and the wiring conductor 30 are separated from the sealing resin portion 13. It can be prevented from falling off.

Fourth Embodiment Next, a fourth embodiment of the present invention will be described with reference to FIG. 11 and FIG. 11 and 12 are diagrams showing a fourth embodiment of the present invention. The fourth embodiment shown in FIG. 11 and FIG. 12 is different in that backside resin portions 25 and 26 are provided on the backside of the die pad 21 and the wiring conductor 30, respectively. This is substantially the same as the first embodiment. 11 and 12, the same parts as those in the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the lead frame with resin 20C shown in FIG. 11 and the LED element package 10C shown in FIG. 12, recesses 21a and 30a are formed on the back side of the die pad 21 and the back side of the wiring conductor 30, respectively. The recesses 21 a and 30 a are filled with backside resin parts 25 and 26 made of the same resin material as the reflective resin part 23, respectively. These back surface side resin parts 25 and 26 each have a substantially rectangular cross section. In addition, it is preferable that the back surface side resin portions 25 and 26 are configured integrally with the reflective resin portion 23.

  As shown in FIG. 12, in the LED element package 10C, the back surface side resin portions 25 and 26 are exposed outward from the LED element package 10C. Thereby, the external terminal 22 of the die pad 21 is composed of two terminal portions 22 a and 22 b separated from each other via the back surface side resin portion 25. Similarly, the external terminal 31 of the wiring conductor 30 includes two terminal portions 31 a and 31 b separated from each other via the back surface side resin portion 26.

  When the lead frame with resin 20C shown in FIG. 11 is manufactured, in the step of providing a plating forming resist (reflective resin portion 23) on the surface 40a of the support substrate 40 (FIG. 5B), on the surface 40a of the support substrate 40. In addition, together with the reflective resin portion 23, backside resin portions 25 and 26 made of the same resin material as the reflective resin portion 23 are integrally formed.

  In addition, the manufacturing method of the resin-attached lead frame 20C is the same as that of the first embodiment described above except that the back-side resin portions 25 and 26 are provided as the plating forming resist pattern at the stage shown in FIG. Is substantially the same as the method for manufacturing the lead frame 20 with resin (FIGS. 5A to 5D), and the description thereof is omitted here. However, in order to form the back surface side resin parts 25 and 26 having such a shape, it is preferable to adopt the method (resin molding method) shown in FIGS.

  The manufacturing method of the LED element package 10C shown in FIG. 12 is substantially the same as the manufacturing method (FIGS. 6A to 6E) of the LED element package 10 in the first embodiment described above. Then, explanation is omitted.

  According to the present embodiment, by providing the back surface side resin portions 25 and 26, the external terminals 22 and 31 can be configured by two terminal portions 22a, 22b, 31a and 31b, respectively. In this case, for example, if the size (shape, area) of the terminal portions 22a, 22b, 31a, 31b is all the same, when the LED element package 10 is mounted on the wiring board 35 (see FIG. 3), the terminal portions 22a, The amount of solder (connection metal portions 33 and 34) placed on 22b, 31a and 31b can be made uniform. As a result, the LED element package 10 can be fixed to the wiring board 35 with a good balance.

  Further, according to the present embodiment, since the back surface side resin portions 25 and 26 integrally formed with the reflective resin portion 23 are provided on the back surfaces of the die pad 21 and the wiring conductor 30, respectively, the die pad 21 and the wiring conductor 30 are provided. Can be prevented from falling off from the sealing resin portion 13.

  In the present embodiment, the back side resin portions 25 and 26 are provided on the back side of both the die pad 21 and the wiring conductor 30. However, the present invention is not limited to this, and the back side resin portions 25 and 26 are provided on the die pad 21. Alternatively, the wiring conductor 30 may be provided only on the back surface.

Fifth Embodiment Next, a fifth embodiment of the present invention will be described with reference to FIGS. 13 and 14 are diagrams showing a fifth embodiment of the present invention. The fifth embodiment shown in FIGS. 13 and 14 is different in that the anchor resin portion 46 is provided on the surface side of the wiring conductor 30, and the other configuration is the first embodiment described above. Is almost the same. 13 and 14, the same parts as those in the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the lead frame with resin 20D shown in FIG. 13 and the LED element package 10D shown in FIG. 14, a recess 30b is formed on the surface side of the wiring conductor 30. The concave portion 30 b is filled with an anchor resin portion 46 made of the same resin material as that of the reflective resin portion 23. The anchor resin portion 46 has a substantially rectangular shape in cross section, and an upper portion thereof protrudes from the wiring conductor 30 and is embedded in the sealing resin portion 13 (FIG. 14). The anchor resin portion 46 is preferably configured integrally with the reflective resin portion 23.

  When the lead frame 20D with resin shown in FIG. 13 is manufactured, in the step (FIG. 5 (b)) of providing a plating forming resist (reflective resin portion 23) on the surface 40a of the support substrate 40, reflection is performed on the support substrate 40. Together with the resin portion 23, an anchor resin portion 46 made of the same resin material as that of the reflective resin portion 23 is integrally formed.

  In addition, the manufacturing method of the lead frame with resin 20D is substantially the same as the manufacturing method of the lead frame with resin 20 in the first embodiment described above (FIGS. 5A to 5D). Description is omitted. However, in order to form the anchor resin portion 46 having such a shape, it is preferable to employ the method (resin molding method) shown in FIGS.

  Further, the manufacturing method of the LED element package 10D shown in FIG. 14 is substantially the same as the manufacturing method (FIGS. 6A to 6E) of the LED element package 10 in the first embodiment described above. Then, explanation is omitted.

  According to the present embodiment, by providing the anchor resin portion 46, the anchor effect between the wiring conductor 30 and the sealing resin portion 13 is enhanced, and the wiring conductor 30 and the sealing resin portion 13 are firmly fixed. be able to.

  In the present embodiment, an example in which the anchor resin portion 46 is provided on the surface of the wiring conductor 30 has been described. However, the present invention is not limited to this, and such an anchor resin portion is provided on both surfaces of the die pad 21 and the wiring conductor 30. It may be provided, or may be provided only on the surface of the die pad 21.

Sixth Embodiment Next, a sixth embodiment of the present invention will be described with reference to FIGS. 15 and 16 are views showing a sixth embodiment of the present invention. The sixth embodiment shown in FIGS. 15 and 16 is different in the shapes of the die pad 21, the reflective resin portion 23b, and the wiring conductor 30, and the other configurations are substantially the same as those in the first embodiment described above. is there. In FIG. 15 and FIG. 16, the same parts as those of the first embodiment shown in FIG. 1 to FIG.

  In the lead frame with resin 20E shown in FIG. 15 and the LED element package 10E shown in FIG. 16, the die pad 21 has a larger area on the back surface 21d (external terminal 22) than on the front surface 21c. On the other hand, regarding the wiring conductor 30, the surface 30c has a larger area than the back surface 30d (external terminal 31). In this case, as shown in FIGS. 15 and 16, the reflective resin portion 23a filled between the die pad 21 and the wiring conductor 30 has a substantially crank shape in cross section.

  The method for manufacturing the lead frame with resin 20E shown in FIG. 15 is substantially the same as the method for manufacturing the lead frame with resin 20 in the first embodiment described above (FIGS. 5A to 5D). Then, explanation is omitted. However, in order to form the reflective resin portion 23 having such a shape, it is preferable to employ the method (resin molding method) shown in FIGS.

  Further, the manufacturing method of the LED element package 10E shown in FIG. 16 is substantially the same as the manufacturing method (FIGS. 6A to 6E) of the LED element package 10 in the first embodiment described above. Then, explanation is omitted.

  According to the present embodiment, since the area of the back surface 21d of the die pad 21 is larger than that of the front surface 21c of the die pad 21, the heat radiation surface (back surface 21d) immediately below the LED element 11 can be increased, and the LED element The heat from 11 can be effectively dissipated. On the other hand, since the area of the front surface 30c of the wiring conductor 30 is larger than that of the back surface 30d, a sufficient space on the bonding surface (front surface 30c) can be secured, and bonding work by the bonding wire 12 can be performed. It is easier to do.

Seventh Embodiment Next, a seventh embodiment of the present invention will be described with reference to FIGS. 17 and 18 are diagrams showing a seventh embodiment of the present invention. The seventh embodiment shown in FIG. 17 and FIG. 18 is different in that the wiring conductor 30 is composed of a first wiring conductor 30e and a second wiring conductor 30f that are electrically insulated and independent from each other. In other respects, the configuration is substantially the same as that of the first embodiment described above. 17 and 18, the same parts as those of the first embodiment shown in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.

In the lead frame with resin 20F shown in FIG. 17 and the LED element package 10F shown in FIG. 18, the wiring conductor 30 is composed of a first wiring conductor 30e and a second wiring conductor 30f arranged on both sides of the die pad 21, respectively. It has become. Among between the first wiring conductor 30e and the die pad 21 is filled with reflecting resin portion 23a _1, the reflective resin portion 23a ₂ is filled between the second wiring conductor 30f and the die pad 21.

  As shown in FIG. 18, the LED element 11 according to the present embodiment has two terminal portions 11a and 11b. One of the terminal portions 11a is a first wiring conductor 30e via a bonding wire 12. The other terminal portion 11 b is connected to the second wiring conductor 30 f through the bonding wire 12.

  The manufacturing method of the lead frame with resin 20F shown in FIG. 17 is the manufacturing method of the lead frame with resin 20 in the first embodiment described above (FIG. 4A) except that the pattern of the plating resist (reflective resin portion 23) is different. )-(F) and FIGS. 5 (a)-(d)), the description is omitted here.

  Also, the manufacturing method of the LED element package 10F shown in FIG. 18 is substantially the same as the manufacturing method (FIGS. 6A to 6E) of the LED element package 10 in the first embodiment described above. Then, explanation is omitted.

  According to the present embodiment, it is possible to improve the light emission efficiency of the LED element package 10F on which the LED element 11 having the two terminal portions 11a and 11b is mounted.

  In the present embodiment, the LED element package 10F has one die pad 21 and two wiring conductors 30 (a first wiring conductor 30e and a second wiring conductor 30f). However, the present invention is not limited to this, and the LED element package 10 </ b> F may include two or more die pads 21 and / or three or more wiring conductors 30.

Eighth Embodiment Next, an eighth embodiment of the present invention will be described with reference to FIGS. 19 and 20 are diagrams showing an eighth embodiment of the present invention. In the eighth embodiment shown in FIGS. 19 and 20, the surface 23f of the reflective resin portion 23a is flush with the surface 21c of the die pad 21 and the surface 30c of the wiring conductor 30, and the LED element 11 is soldered. It differs from the point connected to the die pad 21 and the wiring conductor 30 by the conductive parts 14a, 14b such as balls or Au bumps, and the other configurations are the first embodiment and the third embodiment described above. Is almost the same. 19 and 20, the same parts as those in the first embodiment shown in FIGS. 1 to 6 and the third embodiment shown in FIGS. Omitted.

  In the lead frame with resin 20G shown in FIG. 19 and the LED element package 10G shown in FIG. 20, the surface 23f of the reflective resin portion 23a filled between the die pad 21 and the wiring conductor 30 is the surface 21c of the die pad 21 and the wiring conductor. The surface 30c of 30 is located on the same plane as each other.

  Further, it is provided around the die pad 21 and between the die pad 21 and the wiring conductor 30, and around the die pad 21 and on the opposite side of the wiring conductor 30 from the die pad 21. Both the reflection resin portion 23b and the additional reflection resin portion 23c provided on the opposite side of the die pad 21 when viewed from the wiring conductor 30 have a trapezoidal cross section.

  In the LED element package 10 </ b> G according to this embodiment shown in FIG. 20, the LED element 11 is placed across the die pad 21 and the wiring conductor 30. The LED element 11 is connected to the die pad 21 via one solder ball or Au bump (conductive portion) 14a, and is connected to the wiring conductor 30 via the other solder ball or Au bump (conductive portion) 14b. Yes (flip chip method).

  The manufacturing method of the lead frame with resin 20G shown in FIG. 19 is substantially the same as the manufacturing method of the lead frame with resin 20 in the first embodiment described above (FIGS. 5A to 5D). Then, explanation is omitted. However, in order to form the reflective resin portion 23a having such a shape, it is preferable to employ the method (resin molding method) shown in FIGS.

  Also, the manufacturing method of the LED element package 10G shown in FIG. 20 is substantially the same as the manufacturing method (FIGS. 6A to 6E) of the LED element package 10 in the first embodiment described above. Then, explanation is omitted.

  According to the present embodiment, since the flip chip method is used, it is possible to avoid the shadow of the bonding wire in the illumination and to improve the light emission efficiency of the LED element package 10G.

  In the present embodiment, the surface 23f of the reflective resin portion 23a is flush with the surface 21c of the die pad 21 and the surface 30c of the wiring conductor 30. However, the present invention is not limited to this, and the surface 23 f of the reflective resin portion 23 a filled between the die pad 21 and the wiring conductor 30 may be positioned below the surface 21 c of the die pad 21 and the surface 30 c of the wiring conductor 30. .

10, 10A-10G LED element package 11 LED element 12 Bonding wire 13 Sealing resin portion 20, 20A-20G Lead frame with resin 21 Die pad 22 External terminal 23, 23a-23c Reflective resin portion 30 Wiring conductor 40 Support substrate

Claims (26)

In the lead frame with resin used for producing the LED element package,
A die pad for mounting the LED element;
With a wiring conductor provided around the die pad,
A reflection resin part for reflecting light from the LED element is provided at least around the die pad,
A support substrate is provided on the back surface of the die pad, the wiring conductor, and the reflective resin portion,
The die pad and the wiring conductor are formed on a support substrate by plating using a plating formation resist, and the reflective resin portion is made of a plating formation resist.   The lead frame with resin according to claim 1, wherein an additional reflective resin portion is provided around the wiring conductor.   3. The lead frame with resin according to claim 1, wherein the reflective resin portion is filled between the die pad and the wiring conductor.   A plurality of unit lead frames each corresponding to one LED element are mounted on the support substrate. Each unit lead frame has a die pad corresponding to one LED element, a wiring conductor corresponding to this die pad, and these die pads. And a reflective resin portion surrounding the wiring conductor, and a boundary gap is provided between each unit lead frame and a unit lead frame adjacent to the unit lead frame, and the boundary gap is the same as the reflective resin portion. 2. The resin-attached lead frame according to claim 1, which is filled with a resin made of a material.   5. The lead frame with resin according to claim 1, wherein at least one of the die pad and the wiring conductor has a protruding portion that protrudes sideways.   The lead frame with resin according to any one of claims 1 to 4, wherein the reflective resin portion has a trapezoidal cross section that tapers upward.   5. A concave portion is formed on at least one back side of the die pad and the wiring conductor, and the concave portion is filled with a resin made of the same material as the reflective resin portion. A lead frame with resin according to one item.   5. A concave portion is formed on at least one surface side of the die pad and the wiring conductor, and the concave portion is filled with a resin made of the same material as the reflective resin portion. A lead frame with resin according to one item.   5. The lead frame with resin according to claim 1, wherein the die pad back surface has a larger area than the die pad surface, and the wiring conductor surface has a larger area than the wiring conductor back surface.   5. The lead frame with resin according to claim 1, wherein the wiring conductor includes a first wiring conductor and a second wiring conductor arranged on both sides of the die pad.   The surface of the reflective resin portion filled between the die pad and the wiring conductor is flush with the surface of the die pad and the surface of the wiring conductor, or the reflective resin portion filled between the die pad and the wiring conductor. 4. The lead frame with resin according to claim 3, wherein the surface of the lead is positioned below the surface of the die pad and the surface of the wiring conductor. In LED element package,
Die pad,
An LED element mounted on a die pad;
A wiring conductor provided around the die pad;
A conductive portion that electrically connects the wiring conductor and the LED element;
A reflection resin portion provided at least around the die pad for reflecting light from the LED element;
A die pad, an LED element, a wiring conductor, a conductive portion and a sealing resin portion for sealing the reflective resin portion;
A die pad and a wiring conductor are formed by plating using a plating formation resist, and the reflective resin portion is made of a plating formation resist.   The LED element package according to claim 12, wherein an additional reflective resin portion is provided around the wiring conductor.   14. The LED element package according to claim 12, wherein the reflective resin portion is filled between the die pad and the wiring conductor.   15. The LED element package according to claim 12, wherein at least one of the die pad and the wiring conductor has a protruding portion that protrudes sideways.   The LED element package according to any one of claims 12 to 14, wherein the reflective resin portion has a trapezoidal cross section that tapers upward.   15. The concave portion is formed on at least one back surface side of the die pad and the wiring conductor, and the concave portion is filled with a resin made of the same material as that of the reflective resin portion. The LED element package according to one item.   15. A concave portion is formed on at least one surface side of the die pad and the wiring conductor, and the concave portion is filled with a resin made of the same material as that of the reflective resin portion. The LED element package according to one item.   15. The LED element package according to claim 12, wherein the die pad back surface has a larger area than the die pad surface, and the wiring conductor surface has a larger area than the wiring conductor back surface.   The LED element package according to claim 12, wherein the wiring conductor includes a first wiring conductor and a second wiring conductor disposed on both sides of the die pad.   The surface of the reflective resin portion filled between the die pad and the wiring conductor is flush with the surface of the die pad and the surface of the wiring conductor, or the reflective resin portion filled between the die pad and the wiring conductor. The LED element package according to claim 14, wherein the surface of the LED element is located below the surface of the die pad and the surface of the wiring conductor. In the manufacturing method of the lead frame with resin used for producing the LED element package,
Preparing a support substrate that functions as a support member;
Providing a plating formation resist having a desired pattern on the surface of the support substrate, the plating formation resist functioning as a reflective resin portion for reflecting light from the LED element;
Plating the surface side of the support substrate, and providing a die pad on which the LED element is placed, and forming a wiring conductor around the die pad,
A method for manufacturing a lead frame with resin, wherein the reflective resin portion is provided at least around the die pad.   The method for manufacturing a lead frame with resin according to claim 22, wherein the resist for plating formation is formed by a photolithography method.   The method for manufacturing a lead frame with resin according to claim 22, wherein the resist for plating formation is formed by a resin molding method.   The method for manufacturing a lead frame with resin according to claim 22, wherein the resist for plating formation is formed by a screen printing method. In the manufacturing method of the LED element package,
A step of producing a lead frame with a resin by the method of manufacturing a lead frame with a resin according to any one of claims 22 to 25;
Mounting the LED element on the die pad of the lead frame with resin;
Connecting the LED element and the wiring conductor by a conductive portion;
Forming a sealing resin portion by sealing the die pad, LED element, wiring conductor, conductive portion and reflective resin portion on the support substrate with a sealing resin;
And a step of removing the support substrate from the sealing resin portion.

Images