JP5371570B2 - Connector board - Google Patents

Description

  The present invention relates to a connector board in which signal lines in a plurality of printed boards are electrically connected by connectors.

In the connector board, in order to enhance the effect of reducing radiation noise, a plurality of ground conductor surface connection conductors are used to electrically connect the ground conductor surfaces of both printed circuit boards at a plurality of locations.
For example, in the connector board disclosed in Patent Document 1 below, a plurality of metal pins (ground conductor surface connection conductors) are arranged so as to surround the high-frequency component provided on the lower board in a bowl shape. The ground conductor surface on the upper substrate and the ground conductor surface on the lower substrate are electrically connected using a plurality of metal pins.

JP 2001-284870 A (paragraph number [0005], FIG. 1)

Since the conventional connector board is configured as described above, the radiation noise reduction effect is enhanced by arranging a large number of metal pins, which are conductors for ground conductor surface connection, on the lower board. However, there are problems in that it is difficult to reduce the cost and size by arranging a large number of metal pins.
Moreover, since there is no reference regarding the location where the metal pin that is the conductor for connecting the ground conductor surface is arranged, there is a problem that the effect of reducing the radiation noise cannot be sufficiently obtained if the number of metal pins is reduced.

  The present invention has been made to solve the above-described problems, and it is an object of the present invention to obtain a connector substrate that can obtain a sufficient reduction effect of radiation noise without arranging a large number of ground conductor surface connection conductors. Objective.

A connector board according to the present invention includes a signal line connecting pin for electrically connecting one end of a signal line on a first printed board and one end of a signal line on a second printed board, and a ground conductor surface on the first printed board. And a ground conductor connection pin for electrically connecting the ground conductor surface of the second printed circuit board, and point connection with the ground conductor connection pin connection point with respect to the ground conductor surface of the first and second printed circuit boards The grounding conductor for electrically connecting the grounding conductor surface of the first printed circuit board and the grounding conductor surface of the second printed circuit board within a region in the range of 1 cm from the location on the first and second printed circuit boards A conductor surface connection conductor is provided.

According to the present invention, the signal line connecting pin that electrically connects one end of the signal line on the first printed circuit board and one end of the signal line on the second printed circuit board, the ground conductor surface on the first printed circuit board, A connector including a ground conductor connection pin for electrically connecting the ground conductor surface of the second printed circuit board, and a connection point of the ground conductor connection pin with respect to the ground conductor surface of the first and second printed circuit boards is point-symmetric. A ground conductor surface that electrically connects the ground conductor surface of the first printed circuit board and the ground conductor surface of the second printed circuit board within an area in the range of 1 cm from the location on the first and second printed circuit boards. Since the connection conductor is provided, the effect of sufficiently reducing the radiation noise can be obtained by using only one ground conductor surface connection conductor. .

It is a perspective view which shows the connector board | substrate by Embodiment 1 of this invention. It is sectional drawing which shows the signal wire | line connector which comprises the connector board | substrate by Embodiment 1 of this invention. It is explanatory drawing which shows the electric field strength of the radiation noise in the shield structure of the connector board | substrate of FIG. It is explanatory drawing which shows the correlation with the connection location of the conductor 25 for ground conductor surface connection, and the frequency where the electric field strength of radiation noise becomes the maximum. It is a perspective view which shows the connector board | substrate by Embodiment 2 of this invention. It is sectional drawing which shows the signal wire | line connector which comprises the connector board | substrate by Embodiment 2 of this invention. It is a perspective view which shows the connector board | substrate by Embodiment 3 of this invention.

Embodiment 1 FIG.
FIG. 1 is a perspective view showing a connector board according to Embodiment 1 of the present invention, and FIG. 2 is a cross-sectional view showing a signal line connector constituting the connector board according to Embodiment 1 of the present invention.
1 and 2, the printed circuit board 1 has a ground conductor surface 2 formed on one surface (upper surface in the figure), and a signal line 3 wired on the other surface (lower surface in the figure). It is a substrate. The printed circuit board 1 constitutes a first printed circuit board.

The signal line 3 wired to the printed circuit board 1 is constituted by a microstrip line, one end is electrically connected to the signal line connector 20 and the other end is electrically connected to the circuit terminal 4.
The circuit terminal 4 is a terminal connected to an external circuit (not shown) or another circuit element.

The printed board 11 is a board in which a ground conductor surface 12 is formed on one surface (lower surface in the drawing) and a signal line 13 is wired on the other surface (upper surface in the drawing). The printed board 11 constitutes a second printed board.
Although FIG. 1 shows an example in which the printed boards 1 and 11 are arranged so that the surfaces on which the signal lines 3 and 13 are wired face each other, the signal lines 3 and 13 are not necessarily wired. It is not necessary for the surfaces on the side to face each other. For example, the printed circuit board 1, the surface on which the signal line 3 is wired and the surface on which the ground conductor surface 12 is formed face each other. 11 may be arranged.
Moreover, the printed circuit boards 1 and 11 may be arranged so that the surfaces on which the ground conductor surfaces 2 and 12 are formed face each other.

The signal line 13 wired to the printed circuit board 11 is configured by a microstrip line, and one end is electrically connected to the signal line connector 20 and the other end is electrically connected to the circuit terminal 14.
The circuit terminal 14 is a terminal connected to an external circuit (not shown) or another circuit element.

The signal line connector 20 includes a signal line connection pin 20a and a ground conductor connection pin 20b. The signal line connector 20 electrically connects one end of the signal line 3 on the printed circuit board 1 and one end of the signal line 13 on the printed circuit board 11. The board connecting member electrically connects the ground conductor surface 2 of the printed circuit board 1 and the ground conductor surface 12 of the printed circuit board 11.
The signal line connecting pin 20 a of the signal line connector 20 is a rod-shaped metal conductor that electrically connects one end of the signal line 3 on the printed circuit board 1 and one end of the signal line 13 on the printed circuit board 11.
The ground conductor connection pin 20 b of the signal line connector 20 is a rod-shaped metal conductor that electrically connects the ground conductor surface 2 of the printed circuit board 1 and the ground conductor surface 12 of the printed circuit board 11.

The pin connection location 21 is a location where the ground conductor surface 2 on the printed circuit board 1 and the ground conductor connection pin 20 b of the signal line connector 20 are connected.
The point symmetric part 23 is a part that is point symmetric with respect to the pin connection part 21 of the signal line connector 20 with respect to the center 22 of the printed circuit board 1.
The vicinity region 24 is a region in the vicinity of the point symmetry point 23, that is, a region in the range of 1 cm from the point symmetry point 23.
The ground conductor surface connection conductor 25 is a rod-shaped metal conductor that is disposed in the vicinity region 24 and electrically connects the ground conductor surface 2 of the printed circuit board 1 and the ground conductor surface 12 of the printed circuit board 11.

Next, the operation will be described.
FIG. 3 is an explanatory diagram showing the electric field strength of radiation noise in the shield structure of the connector board of FIG.
FIG. 4 is an explanatory diagram showing the correlation between the connection location of the ground conductor surface connection conductor 25 and the frequency at which the electric field intensity of the radiation noise is maximum.

In the connector board of FIG. 1, the ground conductor surface connection conductor 25 is disposed, but when no ground conductor surface connection conductor 25 is disposed, the electric field strength of the radiation noise is indicated by a broken line in FIG. Thus, it becomes maximum at the frequency f1.
As shown in FIG. 1, when the ground conductor surface connecting conductor 25 is arranged in the vicinity region 24 of the point-symmetrical portion 23, the electric field intensity of the radiated noise is higher than the frequency f1, as shown by the solid line in FIG. It becomes maximum at the frequency f2, which is a high frequency.
Therefore, it can be seen that if the ground conductor surface connection conductor 25 is disposed in the vicinity region 24 of the point-symmetrical portion 23, an effect of reducing radiation noise can be obtained as shown by the arrow in FIG.

At this time, if the place where the ground conductor surface connecting conductor 25 is disposed is changed to the outside of the vicinity region 24 of the point symmetrical place 23, the frequency at which the radiation noise becomes maximum changes as shown in FIG.
FIG. 4 shows the correlation between the connection location of the ground conductor surface connection conductor 25 and the frequency at which the electric field intensity of the radiation noise is maximized when the connector board of FIG. 1 is viewed from above.
That is, the alternate long and short dash line in FIG. 4 indicates a contour line of the frequency at which the electric field strength of the radiation noise is maximum.

As apparent from FIG. 4, the frequency at which the electric field intensity of the radiation noise is maximized is the highest when the ground conductor surface connecting conductor 25 is disposed in the vicinity region 24 of the point-symmetrical portion 23. Sometimes, radiation noise can be reduced most favorably.
Therefore, in the connector board in which the signal lines 3 and 13 of the plurality of printed boards 1 and 11 are electrically connected by the signal line connector 20, in order to reduce radiation noise, one ground conductor surface connecting conductor 25 is provided. It can be said that it is effective to arrange the ground conductor surface connecting conductor 25 in the vicinity region 24 of the point-symmetrical portion 23 when the shield structure is configured by using.

  As apparent from the above, according to the first embodiment, one end of the signal line 3 on the printed circuit board 1 and one end of the signal line 13 on the printed circuit board 11 are electrically connected, and the ground conductor surface on the printed circuit board 1 is also connected. 2 and a signal line connector 20 that electrically connects the ground conductor surface 12 of the printed circuit board 11, and a printed circuit board 1 that is point-symmetric with respect to the connection position of the signal line connector 20 to the ground conductor surfaces 2 and 12 of the printed circuit boards 1 and 11 , 11, the ground conductor surface 2 on the printed circuit board 1 and the ground conductor surface connection conductor 25 for electrically connecting the ground conductor surface 12 on the printed circuit board 11 are provided in the region 24 in the vicinity of the location on the printed circuit board 1. Therefore, the effect of sufficiently reducing the radiation noise can be obtained by using only one ground conductor surface connecting conductor 25.

  In the first embodiment, the case where one ground conductor surface connecting conductor 25 is used is shown. However, even when two or more ground conductor surface connecting conductors 25 are used, at least one ground conductor surface is used. If the connecting conductor 25 is disposed in the vicinity region 24 of the point-symmetrical portion 23, the same effect as in the first embodiment can be obtained.

  In the first embodiment, the circuit board 4 is arranged on the ground conductor surface 2 side of the printed circuit board 1. However, the circuit terminal 4 is electrically connected to the signal line 3 wired on the printed circuit board 1. If it is the structure which has, it will not limit about the location where the circuit terminal 4 is arrange | positioned.

  In the first embodiment, the printed boards 1 and 11 are single-layer boards. However, if the printed board 1 has a ground conductor surface and a signal line, the types of the printed boards 1 and 11 are single. It is not limited to a layer substrate.

  Further, in the first embodiment, the signal line connecting pin 20a and the ground conductor connecting pin 20b of the signal line connector 20 and the ground conductor surface connecting conductor 25 are shown as rod-shaped metal conductors. It should just have the characteristic which can electrically connect between two distant points, and is not limited to a rod-shaped metal conductor.

Embodiment 2. FIG.
5 is a perspective view showing a connector board according to Embodiment 2 of the present invention, and FIG. 6 is a cross-sectional view showing a signal line connector constituting the connector board according to Embodiment 2 of the present invention.
5 and FIG. 6, the same reference numerals as those in FIG. 1 and FIG.
1 shows an example in which one signal line 3 is wired to the printed circuit board 1 (the signal line 13 is the printed circuit board 11). However, in the connector board of FIG. 5 and 6 show examples in which the printed circuit board 1 (signal lines 15 and 16 are printed circuit boards 11) is wired.

The signal lines 5 and 6 wired to the printed circuit board 1 are configured by microstrip lines, one end is electrically connected to the signal line connector 30 and the other end is electrically connected to the circuit terminals 7 and 8. ing.
The circuit terminals 7 and 8 are terminals connected to an external circuit (not shown) or other circuit elements.
The signal lines 15 and 16 wired on the printed circuit board 11 are constituted by microstrip lines, one end is electrically connected to the signal line connector 30 and the other end is electrically connected to the circuit terminals 17 and 18. ing.
The circuit terminals 17 and 18 are terminals connected to an external circuit (not shown) or other circuit elements.

The signal line connector 30 includes signal line connection pins 30a and 30b and ground conductor connection pins 30c and 30d. One end of the signal lines 5 and 6 on the printed circuit board 1 and the signal lines 15 and 16 on the printed circuit board 11 are connected. A board connecting member that electrically connects one end and electrically connects the ground conductor surface 2 of the printed circuit board 1 and the ground conductor surface 12 of the printed circuit board 11.
The signal line connection pin 30 a of the signal line connector 30 is a rod-shaped metal conductor that electrically connects one end of the signal line 5 on the printed circuit board 1 and one end of the signal line 15 on the printed circuit board 11.
The signal line connection pin 30 b of the signal line connector 30 is a rod-shaped metal conductor that electrically connects one end of the signal line 6 on the printed circuit board 1 and one end of the signal line 16 on the printed circuit board 11.
The ground conductor connection pins 30 c and 30 d of the signal line connector 30 are rod-shaped metal conductors that electrically connect the ground conductor surface 2 of the printed circuit board 1 and the ground conductor surface 12 of the printed circuit board 11.

The pin connection location 31 is a location where the ground conductor surface 2 on the printed circuit board 1 and the ground conductor connection pin 30 c of the signal line connector 30 are connected.
The point symmetry place 32 is a place that is point symmetric with respect to the pin connection place 31 of the signal line connector 30 with respect to the center 22 of the printed circuit board 1.
The vicinity region 33 is a region in the vicinity of the point symmetry point 32, that is, a region in a range of 1 cm from the point symmetry point 32.

Next, the operation will be described.
In the second embodiment, an example in which the two signal lines 5 and 6 are wired to the printed circuit board 1 (the signal lines 15 and 16 are the printed circuit board 11) is shown, but the signal line connector 30 is connected to the signal line. Since the pins 30a and 30b and the ground conductor connection pins 30c and 30d are configured, the two signal lines 5 and 6 (signal lines 15 and 16) can be handled simultaneously.

In the connector board of FIG. 5, the ground conductor surface connection conductor 25 is disposed as in the connector board of FIG. 1, but when no ground conductor surface connection conductor 25 is disposed, the electric field of radiation noise is provided. The intensity becomes maximum at the frequency f1, as indicated by the broken line in FIG.
As shown in FIG. 5, when the ground conductor surface connecting conductor 25 is arranged in the vicinity region 33 of the point-symmetrical portion 32, the electric field intensity of the radiated noise is higher than the frequency f1, as shown by the solid line in FIG. It becomes maximum at the frequency f2, which is a high frequency.
Therefore, it can be seen that if the ground conductor surface connection conductor 25 is disposed in the vicinity region 33 of the point symmetry portion 32, an effect of reducing radiation noise can be obtained as shown by an arrow in FIG.

At this time, if the place where the ground conductor surface connecting conductor 25 is disposed is changed outside the vicinity region 33 of the point symmetry place 32, the frequency at which the radiation noise becomes maximum changes as shown in FIG.
As apparent from FIG. 4, the frequency at which the electric field intensity of the radiation noise is maximized is the highest when the ground conductor surface connecting conductor 25 is disposed in the vicinity region 33 of the point-symmetrical portion 32. Sometimes, radiation noise can be reduced most favorably.
Therefore, in the connector board in which the signal lines in the plurality of printed boards 1 and 11 are electrically connected by the signal line connector 30, one ground conductor surface connecting conductor 25 is used to reduce radiation noise. When the shield structure is configured, it can be said that it is effective to arrange the ground conductor surface connection conductor 25 in the vicinity region 33 of the point symmetry portion 32.

  As apparent from the above, according to the second embodiment, one end of the signal lines 5 and 6 in the printed circuit board 1 and one end of the signal lines 15 and 16 in the printed circuit board 11 are electrically connected, and the printed circuit board 1 The signal line connector 30 for electrically connecting the ground conductor surface 2 of the printed circuit board 11 and the ground conductor surface 12 of the printed circuit board 11, and the point of connection of the signal line connector 30 with respect to the ground conductor surfaces 2 and 12 of the printed circuit boards 1 and 11 in point symmetry. In the region 33 in the vicinity of the place on the printed circuit boards 1 and 11, the ground conductor surface 2 on the printed circuit board 1 and the ground conductor surface connection conductor 25 for electrically connecting the ground conductor surface 12 on the printed circuit board 11 are provided. Since it is configured as described above, the effect of sufficiently reducing the radiation noise can be obtained by using only one ground conductor surface connecting conductor 25. To.

  In the second embodiment, the signal line connector 30 includes signal line connection pins 30a and 30b and ground conductor connection pins 30c and 30d, and two signal lines 5 and 6 (signal lines 15 and 16). However, it is not necessary to be limited to one that handles two signal lines at the same time, and three or more signal lines may be handled at the same time.

Embodiment 3 FIG.
7 is a perspective view showing a connector substrate according to Embodiment 3 of the present invention. In the figure, the same reference numerals as those in FIG.
The circuit component 40 is a component such as a high-frequency circuit, a logic circuit, or a power supply circuit, and is mounted on the printed board 11.

Although the circuit component 40 is not mounted on the printed circuit board 1 or the printed circuit board 11 in the first embodiment, the circuit component 40 may be mounted on the printed circuit board 11 as shown in FIG. .
Even when the circuit component 40 is mounted on the printed circuit board 11, since the connector board has a shield structure similar to that of the first embodiment, a single ground conductor surface connection is made as in the first embodiment. A sufficient reduction effect of radiation noise can be obtained only by using the conductor 25.

In the third embodiment, the circuit component 40 is mounted on the printed circuit board 11. However, the circuit component 40 may be mounted on the printed circuit board 1, or the circuit component 40 may be mounted on the printed circuit board 1. And may be mounted on both of the printed circuit board 11.
Further, the number of circuit components 40 is not limited to one, and two or more circuit components 40 may be mounted.
Further, the place where the circuit component 40 is mounted is not limited.

  DESCRIPTION OF SYMBOLS 1 Printed circuit board (1st printed circuit board), 2 Ground conductor surface, 3 Signal line, 4 Circuit terminal, 5, 6 Signal line, 7, 8 Circuit terminal, 11 Printed circuit board (2nd printed circuit board), 12 Grounded conductor Surface, 13 signal line, 14 circuit terminal, 15, 16 signal line, 17, 18 circuit terminal, 20 signal line connector, 20a signal line connection pin, 20b ground conductor connection pin, 21 pin connection point, 22 printed circuit board 1 , 23 point symmetrical location, 24 neighborhood region, 25 ground conductor surface connection conductor, 30 signal line connector, 30a, 30b signal line connection pin, 30c, 30d ground conductor connection pin, 31 pin connection location, 32 points Symmetric location, 33 neighborhood, 40 circuit components.

Claims (1)

A first printed circuit board in which a ground conductor surface is formed on one surface and two or more signal lines are wired on the other surface;
A second printed circuit board in which a ground conductor surface is formed on one surface and two or more signal lines are wired on the other surface;
A signal line connecting pin for electrically connecting one end of the signal line on the first printed circuit board and one end of the signal line on the second printed circuit board; a ground conductor surface on the first printed circuit board; A connector including a ground conductor connecting pin for electrically connecting a ground conductor surface on the printed circuit board;
Within a region in the range of 1 centimeter from the location on the first and second printed circuit boards that is point-symmetric with respect to the connection location of the ground conductor connection pin with respect to the ground conductor surface on the first and second printed circuit boards. A ground conductor surface connecting conductor for electrically connecting the ground conductor surface of the first printed circuit board and the ground conductor surface of the second printed circuit board ;
A circuit component is mounted on at least one of the first and second printed boards.
A connector board characterized by that .

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