JP5359551B2 - Air conditioning system - Google Patents

Abstract

An installation for cooling an electronic device provided on a floor in a room includes an underfloor space below the floor; an air conditioner for sending air to the underfloor space; a first opening provided in the floor and adjacent to the electronic device, for sending air from the underfloor space to the room; and a second opening provided in the floor and adjacent to the air conditioner, the second opening being configured to cause the air pressure of the lower side of the second opening to be lower than the air pressure of the upper side of the second opening.

Description

  The present invention relates to an air conditioning system in which an air conditioner blows cooling air to a floor below the floor and supplies the cooling air to an electronic device installed on the floor above the floor.

  Conventionally, a data center that supplies cold air to an electronic device through a panel from an underfloor floor has been used. Such a data center has a double floor configuration having a floor under the floor and a floor above the floor, and electronic devices are installed on the floor above the floor. In such data centers, the heat generation per server rack tends to increase as the heat generation density of the electronic devices mounted in the rack increases, and the occurrence of hot spots due to the exhaust of the electronic devices is a problem. It has become.

  Here, the flow of wind in the data center will be described with reference to FIG. As shown in the figure, as the flow of wind in the data center, a flow that is blown out from the air conditioner and sucked into the rack (see (1) in FIG. 14) and a flow that is blown out from the air conditioner and sucked into the air conditioner (in FIG. 14) (See (2)), a flow exhausted from the rack and sucked into the air conditioner (see (3) in FIG. 14), and a flow exhausted from the rack and sucked into the rack (see (4) in FIG. 14).

  When there is a large amount of air in the flow path exhausted from the rack and sucked by the rack, a hot spot is generated due to the exhaust of the electronic equipment. Further, when the air volume blown out from the air conditioner is insufficient, as shown in FIG. 15, the electronic device mounted at the lower part of the rack is cooled, whereas the electronic device mounted at the upper part of the rack is mounted. A cooling spot is insufficient for the electronic equipment and cooling cannot be performed, and a hot spot is generated in the upper part of the rack.

  Here, the example of FIG. 15 will be specifically described. FIG. 15 shows an example of the air conditioner 20 that blows out cooling air with an air volume of 300 m <3> / min at a constant temperature of 20 degC and cools a rack with a total required air volume of 320 m <3> / min (equivalent to about 59 kW).

  As shown in FIG. 15, the cooling air of 20 degC is supplied to the electronic equipment mounting rack through the floor under the floor and the panel. At this time, the cooling air is supplied in turn from the electronic devices mounted on the lower stage of the rack. Therefore, temperature variations occur between the upper and lower stages, and the electronic equipment loaded on the upper stage causes exhaust gas recirculation due to insufficient cooling air. Hot spots occur.

  For this reason, as a method for preventing such hot spots, a technique is known in which the amount of air sucked by an electronic device is made larger than the amount of air blown from an air conditioner. For example, cold air and exhaust air are mixed on the floor, which is a space in contact with the air conditioner suction port, and the amount of air sucked by the electronic device is made larger than the amount of air blown from the air conditioner.

JP-A-8-303815

  However, in the technology for increasing the intake air volume of the electronic devices described above, the cold air and the exhaust gas are mixed on the floor floor, which is the space in contact with the air conditioner suction inlet, so that the amount of air blown from the floor floor to the floor floor is reduced. Among them, there is a problem that a part of the energy returns directly to the air conditioner suction port without being supplied to the electronic device, and the energy is not effectively used.

  Accordingly, the present invention has been made to solve the above-described problems of the prior art, and takes hot exhaust air from the floor above the floor to increase the air volume, and the hot air due to exhaust wrapping generated due to insufficient air volume. An object is to efficiently prevent the generation of spots.

  In one aspect, the air conditioning system disclosed in the present application is a negative pressure region that is a region in the underfloor floor that is negative with respect to the positive pressure of the upper floor in order to take the exhaust heat air from the upper floor to the lower floor. An opening is provided on the floor in contact with the floor.

  The disclosed system takes in the exhaust heat air from the floor above the floor to increase the air volume, and can effectively prevent the occurrence of hot spots due to the exhaust sneaking caused by the shortage of the air volume.

FIG. 1 is a block diagram illustrating the configuration of the air conditioning system according to the first embodiment. FIG. 2 is a detailed configuration diagram of the opening and the air conditioner. FIG. 3 is a diagram for explaining cooling of the rack. FIG. 4 is a top view of the data center to which the air conditioning system according to the first embodiment is applied. FIG. 5 is a lateral view of the data center to which the air conditioning system according to the first embodiment is applied. FIG. 6 is a perspective view of a data center to which the air conditioning system according to the first embodiment is applied. FIG. 7 is a diagram illustrating a simulation result. FIG. 8 is a diagram showing a simulation result. FIG. 9 is a diagram showing a simulation result. FIG. 10 is a diagram for explaining the pressure distribution. FIG. 11 is a diagram illustrating an example of an installation position of the opening. FIG. 12 is a diagram showing a simulation result. FIG. 13 is a block diagram illustrating the configuration of the air conditioning system according to the second embodiment. FIG. 14 is a diagram for explaining the flow of wind in the air conditioning system. FIG. 15 is a diagram for explaining cooling of a conventional rack.

  Embodiments of an air conditioning system according to the present invention will be described below in detail with reference to the accompanying drawings.

  In the following examples, the configuration and processing flow of the air conditioning system according to Example 1 will be described in order, and finally the effects of Example 1 will be described.

[Configuration of air conditioning system]
Next, the configuration of the air conditioning system 100 will be described with reference to FIG. FIG. 1 is a block diagram illustrating the configuration of the air conditioning system according to the first embodiment. As shown in the figure, the air conditioning system 100 has a double floor configuration of an upper floor 1a and an underfloor floor 1b. The air conditioner 20 blows cooling air to the underfloor floor 1b and is installed on the upper floor 1a. The cooling air is supplied to the electronic device 40a. A floor opening panel for supplying cooling air to the electronic device 40a is usually provided at a location adjacent to the electronic device in order to prevent mixing with the exhaust heat air. These parts will be described below.

  The opening 10 provided separately from the floor opening panel provided adjacent to the electronic device for supplying cooling air to the electronic device is provided on the floor in order to take the exhaust heat air from the floor floor 1a to the floor floor 1b. The floor tile 31 is provided in contact with a negative pressure region that is a region in the underfloor floor 1b that is negative with respect to the positive pressure of the floor 1a.

  The air conditioner 20 has a blower 21 that blows air to the underfloor floor 1b, and a heat exchanger 24 that cools exhaust heat air from the electronic device 40a. The air blower 21 blows cooling air to the underfloor floor 1b, and the cooling air flows to the floor. It supplies to the electronic device 40a installed on the floor 1a through the surface opening panel 50.

  Here, the detailed structure of the opening part 10 and the air conditioner 20 is demonstrated using FIG. FIG. 2 is a detailed configuration diagram of the opening and the air conditioner. As shown in the figure, the opening 10 is installed on the floor tile 31 in contact with the negative pressure region in the vicinity of the air conditioner.

  The air conditioner 20 includes a blower 21, an air conditioner suction port 23, and a heat exchanger 24. The blower 21 is driven by a built-in motor 21a and blows cooling air from the air conditioner outlet to the lower floor 1b.

  The heat exchanger 24 cools the exhaust heat air of the electronic device 40 a sucked in by the air conditioner suction port 23 and blows the cooled cooling air to the blower 21.

  Here, the cooling of the rack will be described in detail with reference to FIG. FIG. 3 illustrates rack cooling. FIG. 3 shows an example of a case where the air conditioner 20 blows out cooling air having an air volume of 300 m <3> / min at a constant temperature of 20 degC and cooling a rack having a total required air volume of 320 m <3> / min (equivalent to about 59 kW).

  As shown in the figure, after being cooled by the air conditioner 20, the cooling air blown out of the blower with a temperature of 20 degC and an air volume of 300 m3 / min is mixed with the exhausted hot air of 30 degC and 20 m3 / min taken into the opening 10. A total of 320 m 3 / min of wind is blown out on the floor.

  That is, in the air conditioning system 1, in order to take in the exhaust heat air from the electronic equipment, the average temperature of the cooling air mixed with the air under the empty floor rises, but the air volume of the cooling air can be increased. It is possible to prevent temperature variations on the surface and to prevent hot spots.

  Returning to the description of FIG. 1, the electronic device 40 a is mounted on the rack 40 installed on the floor tile 31, is supplied with cooling air by the air conditioner 20, and blows exhaust heat air to the floor 1 a on the floor. To do.

  The floor opening panel 50 is an opening panel installed on a floor tile in the vicinity of the rack 40 in order to supply the cooling air blown to the underfloor floor 1b to the floor floor 1a.

  Here, using FIG. 4 to FIG. 12, a data center to which the air conditioning system 1 according to the first embodiment is applied is modeled, and the simulation is performed using the underfloor floor height, air conditioner air volume, and air conditioner blowout opening area as parameters. The results will be described. First, a center to which an air conditioning system that is a simulation target is applied will be described with reference to FIGS. FIG. 4 is a top view of the data center to which the air conditioning system according to the first embodiment is applied. FIG. 5 is a lateral view of the data center to which the air conditioning system according to the first embodiment is applied. FIG. 6 is a perspective view of a data center to which the air conditioning system according to the first embodiment is applied.

  As shown in FIGS. 4 to 6, as a model of the data center to be simulated, the room size is “7.2 [m] times 10.8 [m] (W × D)”, and the floor-to-floor height is “2”. .5 [m] ”, the size of the floor panel 30 is“ 0.6 [m] × 0.6 [m] (W × D), and the area of the opening 10 is “0.8 [m] × 0.00. 6 [m] (W × D) ”is set.

  First, as a simulation process, when parameters (floor height under floor, air conditioner air volume) are changed, the maximum vertical distance from the front of the air conditioner within the range of negative pressure that is negative pressure on the floor below the floor floor pressure. It was confirmed how the value of the distance d [m] (hereinafter referred to as negative pressure distance) changes.

  The simulation results are shown in FIGS. 7 to 9 are diagrams showing simulation results. The examples of FIGS. 7 and 8 are simulation results for confirming a change in the value of the negative pressure distance d when the underfloor floor height is changed. As illustrated in FIGS. 7 and 8, in the simulation result, the value of the negative pressure distance d increases as the floor below the floor decreases.

  Moreover, the example of FIG. 9 is a simulation result for confirming the change of the value of the negative pressure distance d when the air conditioner air volume is changed. As shown in FIG. 9, the value of the negative pressure distance d increases as the air flow rate of the air conditioner increases.

  Here, the pressure distribution under the floor will be described with reference to FIG. FIG. 10 is a diagram for explaining the pressure distribution. As shown in the figure, a change in the negative pressure distance d when the height of the floor under the floor is changed and a change in pressure distribution at a height of −0.04 [m] from the floor surface are shown. Here, in the example of FIG. 10, the black part has shown the negative pressure area | region which is an area | region in the underfloor floor which is a negative pressure with respect to the positive pressure of an upper floor. As shown in FIG. 10, the negative pressure distance d is shorter as the height of the floor under the floor is higher.

  Further, as illustrated in FIG. 10, when the height of the underfloor floor is “h = 0.9”, there is no negative pressure region on the side where the electronic device is installed with respect to the air conditioner, and the air conditioning There is a negative pressure region on the opposite side of the machine from the side where the electronic equipment is installed. In the case of such a data center, an opening may be provided on the side opposite to the side where the electronic device is installed with respect to the air conditioner. That is, the position of the opening suitable for the data center conditions can be determined based on the simulation result.

  Next, using FIG. 11 and FIG. 12, a data center to which the air conditioning system 1 according to the first embodiment is applied is modeled, and a floor surface opening panel 50 is provided in an underfloor area in which a negative pressure is applied to the floor floor. The effect of increasing the air volume, which is a simulation result when performing the above, will be described. In the examples of FIGS. 11 and 12, it is assumed that the simulation is performed in a state where the air volume of the air conditioner is set to 4.0 [m3 / s] and the blowing temperature is set to 20 degC. FIG. 11 is a diagram illustrating an example of an installation position of the opening. FIG. 12 is a diagram showing a simulation result.

  As shown in FIG. 11, an opening is provided in the negative pressure region near the air conditioner as a model of the data center to be simulated. Also, identification numbers (“Grill No.” in FIG. 12) 1 to 20 are assigned to the floor opening panels of the data center.

  The simulation result in such a data center is shown in FIG. In FIG. 12, the air volume of the opening part 10 and each floor surface opening panel 50 and the blowing temperature of the opening part 10 and each floor surface opening panel 50 are shown as a simulation result.

  Specifically, in FIG. 12, “Grill No.” that is the identification number of each grill, “Air Flow” that is the amount of wind blown from each grill, and “Temperature” that is the temperature of the blown wind. ] In correspondence with each other.

  As shown in FIG. 12, in the data center to which the air conditioning system 1 according to the first embodiment is applied, the air volume of the air conditioner is increased by 0.87 [m3 / s] to 4.0 [m3 / s]. Have achieved. Further, in the data center to which the air conditioning system 1 according to the first embodiment is applied, the temperature of the wind blown from each grill is suppressed to a temperature increase of 0.95 to 1.13 degC with respect to the blowing temperature 20 degC of the air conditioner. Yes.

[Effect of Example 1]
As described above, in the air conditioning system 1 according to the first embodiment, the air conditioning system 1 is provided with the opening 4 on the floor surface in contact with the negative pressure region in order to take the exhaust hot air from the floor floor to the floor floor. Hot air is taken from the floor above the floor to increase the air volume, and it is possible to efficiently prevent the occurrence of hot spots due to exhaust wraparound caused by the shortage of air volume.

  In the first embodiment, the case where the opening is always open has been described. However, the present embodiment is not limited to this, and the opening / closing of the opening may be controlled.

  Therefore, in the following second embodiment, the direction of the wind passing through the opening is detected, and the opening and closing of the opening is controlled according to the direction of the wind passing through the opening. The structure of the air conditioning system which concerns on 2 is demonstrated. FIG. 13 is a block diagram illustrating the configuration of the air conditioning system according to the second embodiment.

  As shown in the figure, the air conditioning system 100a according to the second embodiment is newly provided with a wind direction / air speed sensor 60 and an opening panel control unit 70 as compared with the air conditioning system 100 according to the first embodiment. Different. The opening 10 can be opened and closed, and the opening and closing is controlled by an opening panel controller 70 described later.

  The wind direction / air speed sensor 60 detects the direction of the wind passing through the opening 10 with respect to the opening 10 provided to take in the exhaust heat wind under the floor. The wind direction and wind speed sensor 60 notifies the opening panel control unit 70 of the detected result.

  For the opening 10 provided to take in the exhaust heat wind under the floor, the opening panel control unit 70 controls to open the opening 10 when the direction of the wind is detected from above the floor to below the floor, When the wind direction sensor 60 detects that the wind direction is from below the floor to above the floor, control is performed so as to close the opening 10.

  As described above, in the second embodiment, the air conditioning system 100a detects the direction of the wind passing through the opening 10 by the wind direction / air velocity sensor 60. The air-conditioning system 100a detects the opening 10 provided by the wind direction / air speed sensor 60 to take in the exhaust heat wind under the floor, and the opening 10 is detected when the direction of the wind is detected from the floor to the floor. When the wind direction / wind velocity sensor 60 detects that the wind direction is from below the floor to above the floor, the opening 10 is controlled to be closed. For this reason, when it is detected that the direction of the wind is from below the floor to the floor with respect to the opening 10 provided to take in the exhaust heat wind under the floor, the cool air exhaust is performed on the floor above the floor by closing the opening 10. It is possible to avoid mixing.

  Although the embodiments of the present invention have been described so far, the present invention may be implemented in various different forms other than the embodiments described above. Therefore, another embodiment included in the present invention will be described below as a third embodiment.

(1) Opening and closing the opening using pressure information In the second embodiment, the direction of the wind passing through the opening is detected, and the opening and closing of the opening is controlled according to the direction of the wind passing through the opening. However, the present embodiment is not limited to this, and the underfloor pressure information of the opening may be detected, and the opening / closing of the opening may be controlled according to the underfloor pressure information of the opening.

  Specifically, the air conditioning system includes an underfloor pressure sensor that detects underfloor pressure information of the opening, and an open panel control unit that controls opening and closing of the opening according to the underfloor pressure information of the opening. And the opening panel control part of an air-conditioning system, when the underfloor pressure information detected by the underfloor pressure sensor is equal to or lower than a predetermined threshold, When the underfloor pressure information detected by the underfloor pressure sensor is equal to or greater than a predetermined threshold, the opening is closed.

  As described above, the air conditioning system detects the underfloor pressure information of the opening for the opening provided to take in the exhaust heat air under the floor, and when the detected underfloor pressure information is equal to or less than a predetermined threshold, Control is performed to open the opening, and when the underfloor pressure information detected by the underfloor pressure sensor is equal to or greater than a predetermined threshold, the opening is controlled to close. For this reason, when the underfloor pressure information is equal to or greater than a predetermined threshold value, it is possible to prevent cold air exhaust from mixing on the floor above the floor by closing the opening.

DESCRIPTION OF SYMBOLS 1,100 Air-conditioning system 1a Floor on the floor 1b Floor under floor 10 Opening part 20 Air conditioner 21 Blower 22 Air-conditioner blowout duct 23 Air-conditioner inlet 24 Heat exchanger 31 Floor tile 40 Rack 40a Electronic device

Claims (2)

An air conditioning system that has an underfloor floor and that cools electronic devices installed on the floor, and that blows cooling air to the underfloor floor; and
A floor opening panel provided at a position for supplying cooling air to the electronic device on the floor;
When the air conditioner blows, an opening provided on the floor surface in contact with the negative pressure area that is an area in the under floor floor that is negative with respect to the positive pressure of the floor floor;
An underfloor pressure sensor that detects underfloor pressure information of the opening with respect to the opening provided to take in the exhaust heat wind under the floor,
When the underfloor pressure information detected by the underfloor pressure sensor is less than a predetermined threshold, control is performed to open the opening, and the underfloor pressure information detected by the underfloor pressure sensor is equal to or greater than a predetermined threshold. If so, an opening panel control unit that controls to close the opening,
An air conditioning system comprising: A wind direction / air velocity sensor for detecting the direction of the wind passing through the opening with respect to the opening provided to take in the exhaust heat wind under the floor;
An opening panel controller for controlling the opening to be closed when the wind direction sensor detects that the wind direction is from below the floor ;
The air conditioning system according to claim 1, further comprising:

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