JP5354668B2 - Method for producing antiglare film, method for producing antiglare film and mold - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an anti-glare film for preventing visual confirmation performance from being reduced due to its whitening while showing superior anti-glare performance and achieving high contrast without causing glare even when applying this film to an image display displaying highly precise images, and to provide a method of manufacturing a metallic mold being favorably used in the method of manufacturing the anti-glare film. <P>SOLUTION: The method of manufacturing the anti-glare film includes a step of computing a micro phase separation structure of block copolymer composed of two or more segments by calculating machine simulation by using this block copolymer as a model, a step of creating a micro phase separation pattern showing a maximal value so far as energy spectrum is in a scope of space frequency of 0.025 to 0.125 &mu;m<SP>-1</SP>based on themicro phase separation structure, and a step of forming a surface having irregularities on a transparent basic material by using the micro phase separation pattern. The method of manufacturing the metallic mold being favorably used in this method of manufacturing the anti-glare film is also provided. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a method for producing an antiglare (antiglare) film and a method for producing a mold suitably used for the method for producing the antiglare film.

  In an image display device such as a liquid crystal display, a plasma display panel, a cathode ray tube (CRT) display, an organic electroluminescence (EL) display, and the like, when external light is reflected on the display surface, visibility is significantly impaired. Conventionally, in order to prevent such reflection of external light, display is performed using a television or personal computer that emphasizes image quality, a video camera or digital camera that is used outdoors with strong external light, and reflected light. In a cellular phone or the like, a film layer for preventing reflection of external light is provided on the surface of an image display device. This film layer consists of a film that has been subjected to anti-reflection treatment using interference by the optical multilayer film, and anti-glare treatment that scatters incident light by blurring the incident light by forming fine irregularities on the surface. It is divided roughly into the thing which consists of the film which was given. The former non-reflective film is costly because it is necessary to form a multilayer film having a uniform optical film thickness. On the other hand, since the latter anti-glare film can be manufactured at a relatively low cost, it is widely used in applications such as large personal computers and monitors.

  Conventionally, such an antiglare film is based on random surface irregularities by, for example, applying a resin solution in which fine particles are dispersed on a substrate sheet while adjusting the film thickness and exposing the fine particles to the coating film surface. It is manufactured by a method of forming on a material sheet. However, the antiglare film manufactured using a resin solution in which such fine particles are dispersed has an influence on the arrangement and shape of surface irregularities depending on the dispersion state and application state of the fine particles in the resin solution. It is difficult to obtain surface irregularities as described above, and when the haze of the antiglare film is set low, there is a problem that a sufficient antiglare effect cannot be obtained. Furthermore, when such a conventional anti-glare film is disposed on the surface of the image display device, the entire display surface becomes whitish due to scattered light, and the display becomes cloudy, so-called “whiteness” is likely to occur. There was a problem. Also, with the recent high definition of image display devices, the pixels of the image display device and the surface uneven shape of the antiglare film interfere with each other, and as a result, a luminance distribution occurs and the display surface becomes difficult to see. There was also a problem that the “glare” phenomenon was likely to occur. In order to eliminate glare, there is an attempt to scatter light by providing a refractive index difference between the binder resin and the fine particles dispersed therein, but such an antiglare film is disposed on the surface of the image display device. In some cases, there is a problem that the contrast tends to be lowered due to light scattering at the interface between the fine particles and the binder resin.

  On the other hand, there is also an attempt to develop anti-glare properties only by fine irregularities formed on the surface of the transparent resin layer without containing fine particles. For example, in Japanese Patent Laid-Open No. 2002-189106 (Patent Document 1), a three-dimensional 10-point average roughness on a transparent resin film and an average distance between adjacent convex portions on a three-dimensional roughness reference surface are described. Further, an antiglare film is disclosed in which a cured product layer of an ionizing radiation curable resin layer having fine surface irregularities each satisfying a predetermined value is laminated. This antiglare film is manufactured by curing the ionizing radiation curable resin in a state where the ionizing radiation curable resin is sandwiched between the embossing mold and the transparent resin film. However, even with the antiglare film disclosed in Patent Document 1, it has been difficult to achieve a sufficient antiglare effect, suppression of whitening, high contrast, and suppression of glare.

  As a method for producing a film having fine irregularities formed on the surface, a method of transferring the irregular shape of a roll having an irregular surface to the film is known. As a method for producing a roll having such a concavo-convex surface, for example, in JP-A-6-34961 (Patent Document 2), a cylindrical body is made using a metal or the like, and electronic engraving, etching, sandblasting, etc. are performed on the surface. A method of forming irregularities by the above method is disclosed. Japanese Patent Application Laid-Open No. 2004-29240 (Patent Document 3) discloses a method for producing an embossing roll by the bead shot method, and Japanese Patent Application Laid-Open No. 2004-90187 (Patent Document 4). There has been disclosed a method for producing an embossing roll through a step of forming a metal plating layer on the surface, a step of mirror polishing the surface of the metal plating layer, and a step of peening if necessary.

  However, in such a state that the surface of the embossing roll is subjected to blasting treatment, the uneven diameter distribution caused by the particle size distribution of the blast particles is generated, and the depth of the dent obtained by blasting can be controlled. It was difficult to obtain an uneven shape excellent in antiglare function with good reproducibility.

  Further, Patent Document 1 described above describes that a concavo-convex surface is formed by a sandblasting method or a bead shot method, preferably using a roller having a chromium plating on the surface of iron. Furthermore, it is preferable to use the mold surface with such irregularities after applying chrome plating for the purpose of improving durability during use, thereby making it harder and preventing corrosion. There is also a statement that it is possible. On the other hand, in each Example of Unexamined-Japanese-Patent No. 2004-45471 (patent document 5) and Unexamined-Japanese-Patent No. 2004-45472 (patent document 6), the iron core surface is chromium-plated and liquid sandblasting of # 250 is performed. After that, it is described that chrome plating is performed again to form a fine uneven shape on the surface.

  However, in such an embossing roll manufacturing method, since blasting and shots are performed on chromium plating with high hardness, it is difficult to form unevenness, and it is difficult to precisely control the shape of the formed unevenness. It was.

  Japanese Patent Application Laid-Open No. 2000-284106 (Patent Document 7) describes performing an etching process and / or a thin film laminating process after subjecting a base material to sandblasting. Japanese Patent Application Laid-Open No. 2006-53371 (Patent Document 8) describes that an electroless nickel plating is performed after a substrate is polished and sandblasted. Japanese Patent Application Laid-Open No. 2007-188792 (Patent Document 9) discloses that an embossed plate is produced by performing copper plating or nickel plating on a substrate, polishing, sandblasting, and then performing chromium plating. It is described. Furthermore, Japanese Patent Application Laid-Open No. 2007-237541 (Patent Document 10) discloses that after copper plating or nickel plating, polishing, sand blasting, etching or copper plating, and chromium plating are performed. To produce an embossed plate. In these production methods using sandblasting, it is difficult to form the surface uneven shape in a precisely controlled state, so that a relatively large uneven shape having a period of 50 μm or more is also produced in the surface uneven shape. As a result, there is a problem that the so-called glare that the large uneven shape and the pixels of the image display device interfere with each other and a luminance distribution is generated and the display surface is difficult to see is likely to occur.

JP 2002-189106 A JP-A-6-34961 JP 2004-29240 A JP 2004-90187 A JP 2004-45471 A JP 2004-45472 A JP 2000-284106 A JP 2006-53371 A JP 2007-188792 A JP 2007-237541 A

  It is an object of the present invention to exhibit excellent anti-glare performance when applied to an image display device while having low haze, and to prevent deterioration in visibility due to whitishness, and to achieve high definition. Even when applied to an image display device, it is to provide a method for producing an antiglare film capable of expressing high contrast without causing glare. Moreover, the other objective of this invention is to provide the manufacturing method of the metal mold | die used suitably for the manufacturing method of the said glare-proof film.

The present invention uses a segment which is an assembly of a plurality of homogenous monomer units as a constituent unit, and a block copolymer consisting of two or more types of segments composed of different monomer units as a model, by computer simulation. A step of calculating the microphase separation structure of the block copolymer, and a microphase in which the energy spectrum exhibits a maximum value in the spatial frequency range of 0.025 to 0.125 μm ⁻¹ based on the obtained microphase separation structure. Provided is a method for producing an antiglare film comprising a step of creating a separation pattern and a step of forming an uneven surface on a transparent substrate using the created microphase separation pattern.

In the method for producing an antiglare film of the present invention, the position of the maximum value of the energy spectrum of the microphase separation pattern is adjusted to a spatial frequency of 0.025 to 0.125 μm ⁻ by adjusting the unit of length of computer simulation. Controlled within the range of ¹ . In the step of forming the concavo-convex surface, the concavo-convex surface is preferably formed such that a concave portion or a convex portion constituting the concavo-convex surface corresponds to at least one kind of segment in the microphase separation structure.

  The microphase separation pattern can be created as image data having gradation by paying attention to at least one kind of segment in the microphase separation structure. In this case, in the step of forming the concavo-convex surface, the concavo-convex surface is formed so that the concave portion or the convex portion constituting the concavo-convex surface corresponds to the gradation of the microphase separation pattern. The microphase separation pattern may be image data binarized into 0 and 1, and in this case, in the step of forming the concavo-convex surface, the concavo-convex surface has a concave portion or a convex portion constituting the microscopic surface. It is formed so as to correspond to a region which is 0 of the phase separation pattern.

  In the method for producing an antiglare film of the present invention, the computer simulation is preferably a two-dimensional computer simulation.

  The block copolymer to be modeled is a binary having a first segment and a second segment composed of a monomer unit different from the monomer unit constituting the first segment as a structural unit. A block copolymer is preferred. Moreover, it is preferable that the number of the 1st segment which comprises the said binary block copolymer, and the number of the 2nd segment are the same.

  In the method for producing an antiglare film of the present invention, the computer simulation is preferably performed using a combined swing method.

  The step of forming the uneven surface preferably includes a step of producing a mold having an uneven surface using the microphase separation pattern and transferring the uneven surface of the mold onto a transparent substrate.

  Moreover, this invention provides the manufacturing method of the metal mold | die suitably used for the manufacturing method of the anti-glare film of the said invention. The method for producing a mold of the present invention includes a first plating process for performing copper plating or nickel plating on a surface of a mold base, a polishing process for polishing a surface plated by the first plating process, A photosensitive resin film forming step for forming a photosensitive resin film on the coated surface, an exposure step for exposing the microphase separation pattern on the photosensitive resin film, and a photosensitive resin film on which the microphase separation pattern is exposed. A developing process for developing, a first etching process for performing an etching process using the developed photosensitive resin film as a mask, and forming irregularities on the polished plated surface, and a photosensitive resin film for peeling the photosensitive resin film A peeling step and a second plating step of performing chromium plating on the formed uneven surface.

  The mold manufacturing method of the present invention includes a second etching step in which the uneven shape of the uneven surface formed by the first etching step is blunted by an etching process between the photosensitive resin film peeling step and the second plating step. It is preferable to include.

  The chromium plating layer formed by chromium plating in the second plating step preferably has a thickness of 1 to 10 μm. Moreover, it is preferable that the uneven surface to which the chromium plating formed in the 2nd plating process was performed is an uneven surface of the metal mold | die transferred on a transparent base material. That is, it is preferable to use the concavo-convex surface subjected to chromium plating as the concavo-convex surface of the mold transferred onto the transparent substrate without providing a step of polishing the surface after the second plating step.

  According to the present invention, when applied to an image display device while having a low haze, it exhibits excellent anti-glare performance, and can prevent deterioration in visibility due to whitishness, and also has high definition. Even when applied to an image display device, an antiglare film that exhibits high contrast without causing glare can be produced with good reproducibility.

It is a figure which illustrates typically the block copolymer comprised from 2 or more types of segments. It is a figure which shows the example of the micro phase-separation structure of the binary block copolymer which consists of segment A and B calculated by the computer simulation of a two-dimensional plane. It is a figure for demonstrating the model of the block copolymer in a coupling | bonding rocking | fluctuation method. It is a figure which shows an example of the state by which many binary block copolymers are arrange | positioned so that the constraint conditions in a coupling | bonding fluctuation method may be satisfy | filled. It is a figure for demonstrating sufficiency of constraint conditions [I] and [II] at the time of displacing the segment of a block copolymer in a coupling | bonding rocking | fluctuation method. It is a figure for demonstrating the potential energy change of the system which can arise when the segment of a block copolymer is displaced in a bond fluctuation method. It is a figure which shows the micro phase-separation pattern obtained by the two-dimensional computer simulation of the binary block copolymer of the total number of segments 2. It is a figure which shows the micro phase-separation pattern obtained by the two-dimensional computer simulation of the binary block copolymer of the total number of segments 4. It is a figure which shows the micro phase-separation pattern obtained by the two-dimensional computer simulation of the binary block copolymer of the total number of segments of 8. It is a figure which shows the micro phase-separation pattern obtained by the two-dimensional computer simulation of the binary block copolymer of the total number of segments 16. It is a view showing a cross section taken along f _x = 0 of the energy spectrum G ² computed from microphase separation pattern shown in FIG. _{7 (f x, f y)} . It is a view showing a cross section taken along f _x = 0 of the energy spectrum G ² computed from microphase separation pattern shown in FIG. _{8 (f x, f y)} . It is a view showing a cross section taken along f _x = 0 of the energy spectrum G ² computed from microphase separation pattern (f _x, f _y) shown in FIG. It is a view showing a cross section taken along f _x = 0 of the energy spectrum G ² computed from microphase separation pattern shown in FIG. _{10 (f x, f y)} . It is a figure which shows typically a preferable example of the first half part of the manufacturing method of the metal mold | die of this invention. It is a figure which shows typically a preferable example of the second half part of the manufacturing method of the metal mold | die of this invention. It is a figure which shows typically the state which side etching advances in a 1st etching process. It is a figure which shows typically the state where the uneven surface formed by the 1st etching process dulls by the 2nd etching process. It is a figure which shows the pattern used for the comparative example 1. FIG. Example 1 is a diagram showing a cross section taken along f _x = 0 in Example 2 and Comparative Example 1 are calculated from the pattern used for the energy spectrum ^{_{G 2 (f x, f y}} ).

<Method for producing antiglare film>
The method for producing an antiglare film of the present invention is based on the microphase separation structure of the block copolymer obtained by computer simulation, and a pattern (microphase separation pattern) reflecting the microphase separation structure is obtained. It produces and forms a fine uneven surface (fine uneven surface) on a transparent base material using this pattern, It is characterized by the above-mentioned. Here, “pattern” typically means image data composed of a gradation of two gradations or three gradations or more created by a computer, which is used to form a fine uneven surface of an antiglare film. However, the present invention is not limited to this, and data (such as matrix data) that can be uniquely converted into the image data can be included. Examples of data that can be uniquely converted to image data include data in which only the coordinates and gradations of each pixel are stored.

  First, the significance of using a microphase separation pattern created based on the microphase separation structure of the block copolymer obtained by computer simulation will be described. In general, since different types of polymers (heterogeneous homopolymers) are incompatible with each other, concentrated solutions or melts in which different types of polymers are mixed exhibit macroscopic phase separation, while two or more types of single polymers are mixed. In a block copolymer that is formed from a monomer, the same type of monomers are continuous to some extent, and has a block-like arrangement, since different polymer chains are chemically bonded, macroscopic phase separation is A microphase-separated structure in which the same kind of polymer chains are aggregated independently without being generated. The microphase-separated structure of the block copolymer depends on the composition of each polymer chain formed from the same type of monomer, the length of each polymer chain, and the system temperature. For example, it is known to show a structure such as a sea-island structure, a lamellar structure, and a co-continuous structure.

  In this way, the microphase separation structure of the block copolymer is macroscopically uniform because dissimilar polymer chains are chemically bonded, but at a distance about the length of each polymer chain. It has a feature that different types of polymer chains are separated. The correlation length in the microphase-separated structure, that is, the size of the region where the same kind of polymer chains are aggregated and the distance between the regions where the same kind of polymer chains are aggregated are the composition of each polymer chain, Since it depends on the length of the polymer chain, the temperature of the system, etc., a microphase separation structure having a predetermined correlation length can be obtained by appropriately selecting these conditions.

  Here, it is preferable that the fine uneven surface of the antiglare film does not contain a long-period component exceeding 50 μm from the viewpoint of suppressing glare generated by the fine uneven surface of the antiglare film. On the other hand, an antiglare effect such as a reflection preventing effect cannot be sufficiently exhibited on a fine uneven surface containing only a short period component of less than 10 μm. Therefore, it is preferable that the fine uneven surface of the antiglare film includes a surface shape having a period of 10 to 50 μm as a main component in order to sufficiently suppress glare while exhibiting a sufficient antiglare effect.

  As described above, the microphase-separated structure of the block copolymer exhibits a characteristic of having a predetermined correlation length while being macroscopically uniform. Therefore, if the fine irregular surface is formed using the pattern obtained from the microphase separation structure of the block copolymer, the above-mentioned characteristics of the microphase separation structure are reflected, resulting in a surface shape having a period limited to a specific range. It is possible to form a fine uneven surface containing as a main component. However, in a system using an actual block copolymer, the length of the block copolymer is at most about 1 μm, and when such a huge block copolymer is used, a uniform microphase is obtained. Since it takes a long time to form the separation structure, it is not easy to create a pattern for forming a fine uneven surface having a target period of 10 to 50 μm.

  The above-mentioned problem in the case of using an actual block copolymer can be solved by a method of calculating a microphase separation structure by computer simulation according to the present invention. That is, according to the present invention, the microphase separation structure of the block copolymer is calculated by computer simulation, a microphase separation pattern is created based on the obtained microphase separation structure, and the created microphase separation pattern is used. If a fine uneven surface is formed on a transparent substrate, a fine uneven surface reflecting the characteristics of the microphase separation structure of the block copolymer that is macroscopically uniform but exhibits a predetermined correlation length is created. In addition, in computer simulation, the unit of length can be set as a parameter, so after creating a microphase separation structure from computer simulation, set the unit of length of computer simulation appropriately. Once the microphase separation pattern is created, the target is the period of the main surface shape that constitutes the fine irregular surface 1 It can be accurately controlled within the range of ～50Myuemu. Since the fine uneven surface of the antiglare film obtained in this way is macroscopically uniform, it has the characteristics of the microphase separation structure of the block copolymer having a predetermined correlation length. When it is applied to an image display device while exhibiting a specific spatial frequency distribution and low haze, it exhibits excellent anti-glare performance and can prevent deterioration of visibility due to whitishness. In addition, even when applied to a high-definition image display device, it exhibits excellent optical characteristics that a high contrast can be exhibited without causing glare.

  Hereinafter, preferred embodiments of the method for producing an antiglare film of the present invention will be described in detail for each step.

[1] Calculation of microphase separation structure by computer simulation In this step, the microphase separation structure is calculated by computer simulation of a concentrated solution or melt of a block copolymer. Performing a computer simulation assuming a concentrated solution or melt can substantially eliminate the influence of the solvent, so that the calculation load can be reduced and a microphase exhibiting desired characteristics can be obtained. This is because the separation structure is easily constructed.

  A block copolymer used for computer simulation is a block copolymer consisting of two or more types of segments composed of different types of monomer units. A coalescence model is used. In this way, the calculation load can be reduced by performing a simulation by regarding a plurality of homogenous monomer units as one segment. As the block copolymer model, for example, referring to FIG. 1, it is composed of two types of segments, segments A and B (a polymer chain composed of segment A and a polymer chain composed of segment B). A block copolymer); further comprising a segment C (further connecting polymer chains composed of segments C); further comprising a segment D (further segment D A quaternary block copolymer in which polymer chains composed of In FIG. 1, A, B, C, and D are heterogeneous segments each composed of different monomer units.

  The number of each of the two or more types of segments included in the block copolymer model is not particularly limited, and may be 1 or more for each. The upper limit of the number of segments in each segment is not particularly limited, but considering the calculation load, it is preferably 50 or less, and more preferably 20 or less. In the binary block copolymer shown in FIG. 1, the number of segments of segments A and B are both 6.

  As described above, the block copolymer to be subjected to computer simulation may be a binary or ternary block copolymer, but in the case of calculating using a ternary or higher block copolymer, As the degree of freedom increases, the method for controlling the microphase separation structure becomes complicated. Therefore, in the computer simulation, the binary block copolymer (the first segment and the second segment composed of a monomer unit different from the monomer unit constituting the first segment as a constituent unit) It is preferable to use a block copolymer).

  In the case of using a binary block copolymer composed of the first segment and the second segment, the number of segments of the first segment and the number of segments of the second segment are the same or approximately Preferably they are the same. This means that the length of the polymer chain composed of the first segment and the length of the polymer chain composed of the second segment are the same or substantially the same. By making these polymer chains the same or substantially the same, the microphase separation structure obtained by simulation shows a structure close to a lamellar phase, so that a more stable correlation length can be obtained. It becomes easy to control the period of the fine uneven surface of the film.

  FIG. 2 is a diagram showing an example of a microphase separation structure of a binary block copolymer composed of segments A and B calculated by a two-dimensional plane computer simulation. The microphase separation structure in FIG. 2 is calculated by computer simulation using the bond fluctuation method described later. The size of the system shown in FIG. 2 is 256a × 256a (a is a unit of length of computer simulation), the total number of segments of segment A and segment B is 8, The interaction parameter ε between them was set to 2. In FIG. 2, in order to clearly understand the calculated microphase separation structure, the region where the segment A exists is displayed in white, and the region where the segment B exists is displayed in black. 2A to 2G show the microphase separation structure when the number of segments in segment A and the number of segments in segment B are changed. The number of segments in segment A and the number of segments in segment B are shown in FIG. The ratios are 1/7, 2/6, 3/5, 4/4, 5/3, 6/2, and 7/1, respectively. In the microphase-separated structure shown in FIGS. 2 (a), (b), (f) and (g), a sea-island structure is formed in which an aggregate of small segments A or B is formed in the segment B or segment A region. doing. In the microphase separation structure shown in FIGS. 2C, 2D, and 2E, the segment A and the segment B form a continuous structure close to a continuous lamellar structure. Thus, in order to obtain a stable correlation length, it is preferable that the length of the polymer chain composed of segment A and the length of the polymer chain composed of segment B are the same or substantially the same. I understand.

  As a specific method for computer simulation of a concentrated solution or melt of a block copolymer using a block copolymer model having segments as constituent units as described above, a method using a lattice model (R.G. Larson, J. Chem. Phys. 91, 2479 (1989), I. Carmesin and K. Kremer, Macromolecules 21, 2819 (1988), and A. Hoffmann, J. U. Somer, and A. Blumen, J. Chem. Chem. Phys. 106, 6709 (1997)); a method using a spring bead model (see F. Tanaka, T. Koga, Bull. Chem. Soc, Jpn. 74, 201 (2001)); Ginzburg Landau theory For That method (R.Holyst and W.T.Gozdz, J.Chem.Phys.106,4773 (1997) refer) may be a conventionally known method such as. Among these, it is preferable to use a lattice model, and it is more preferable to perform a computer simulation using a coupled fluctuation method (also called a Bond Fluctuation Model (BFM)) among lattice models. As will be described later, the micro phase separation pattern used when producing the fine uneven surface is created in a format having gradations corresponding to discrete coordinates, such as raster format image data. In this case, if a computer simulation is performed using a lattice model that calculates the existence of segments with respect to discrete coordinates, a microphase separation pattern can be obtained directly from the obtained microphase separation structure. is there. Among them, the coupled oscillation method is preferable because it has a small calculation load and a high degree of freedom.

  Further, when the microphase separation structure is calculated by computer simulation of a concentrated solution or melt of a block copolymer, it is preferable to perform calculation by computer simulation on a two-dimensional plane (two-dimensional system). This is because the microphase separation pattern used in actually producing the fine uneven surface is a two-dimensional plane pattern. It is also possible to calculate a three-dimensional microphase separation structure by computer simulation in a three-dimensional space and create a two-dimensional planar microphase separation pattern from an arbitrary cross section of the obtained three-dimensional microphase separation structure. However, it is preferable to calculate the microphase separation structure on the two-dimensional plane by computer simulation on the two-dimensional plane and create the microphase separation pattern on the two-dimensional plane because the calculation load is small.

  In the following, a specific calculation algorithm will be described by taking as an example a computer simulation by the coupled fluctuation method preferably used in the present invention. First, a block copolymer model in the bond swing method will be described with reference to FIG. FIG. 3 shows a case where one molecule of a biblock copolymer is arranged in a system used in the bond fluctuation method for easy understanding. However, in the actual simulation, the simulation is performed with a plurality of block copolymers arranged in one system. As shown in FIG. 3, in the coupled oscillation method, a system having an external shape such as a square or a rectangle and divided into a plurality of square squares by broken lines drawn at equal intervals in the vertical and horizontal directions (intervals between broken lines). a corresponds to a unit of length in computer simulation), and a block copolymer composed of two or more types of segments is arranged. At this time, the block copolymer arranged in the system represents one segment constituting the same, for example, a square occupying four masses formed by broken lines, and between adjacent segments in the block copolymer molecule. It is expressed as a combination of straight lines (between the centers of squares occupying four squares). The block copolymer shown in FIG. 3 is a binary block copolymer composed of segment 1 (number of segments 5) and segment 2 (segment number 5), which is a segment different from this segment. Both 1 and segment 2 are represented as squares occupying four squares formed by broken lines. Adjacent segments are connected by a connection 3 that is a straight line connecting the centers of squares as segments. In FIG. 3, segment 2 is given dot-like hatching so that the distinction from segment 1 is clear.

Next, a specific calculation algorithm using the coupled oscillation method will be described. First, a plurality of block copolymers are arranged in a system as shown in FIG. The number of block copolymers to be arranged is not particularly limited depending on the size of the system and the like, but generally, the proportion of the segment in the system (segment occupation ratio φ) is 60 to 90%. It is preferable to arrange so that it is 70% to 80%. The segment occupancy φ is given by the following formula:
φ (%) = {(4a ² nN) / (a ² l ² )} × 100 = {(4 nN) / l ² } × 100
Can be calculated based on In the above formula, a is a unit of length of computer simulation (interval of broken lines), l is the number of lattices (number of cells) on one side of the system, and N is the total number of segments constituting one molecule of the block copolymer. , N is the number of block copolymers arranged in the system. For example, as in the case of FIG. 2, when l = 256 and N = 8, by setting n to 1230 to 1840, φ can be in the range of 60 to 90%. Note that the microphase separation patterns shown in FIGS. 7 to 10 described later are prepared by arranging block copolymers so that φ = 78%. Here, in the bond fluctuation method, the following constraints [I] and [II] are imposed on the initial arrangement of the block copolymer.

[I] The length L of the bond connecting the centers of the segments (bond 3 in FIG. 3) satisfies the following formula (1). In the following formula (1), a is an interval between broken lines, and corresponds to a unit of length of computer simulation.
2a ≦ L ≦ 13 ^1/2 a (1)
[II] Segments cannot be placed one on top of the other (segments represented as squares cannot occupy the same mass formed by broken lines with other segments).

  FIG. 4 shows an example of a state in which a plurality of (26 molecules) binary block copolymers are arranged so as to satisfy the constraints [I] and [II].

Next, one segment (a focused segment P) is randomly selected from the system, and the segment P is randomly displaced by one square. That is, the center of the segment P on the intersection of broken lines is randomly displaced on the intersection of any adjacent broken lines. Here, in the displacement, the constraints [I] and [II] are similarly imposed. Satisfying 2a ≦ L in the above formula (1) means satisfying the condition that the joined segments are not placed one on top of the other, and satisfying L ≦ 13 ^1/2 a means the coupling between the segments. It means satisfying the condition that no intersection occurs. That is, in the displacement of the segment P, an excluded volume is considered in which no overlapping of segments occurs and no intersection occurs between the segments.

FIG. 5 is a diagram for explaining the sufficiency of the constraints [I] and [II] when displacing the segment of the block copolymer. FIG. 5A is a diagram showing a state before displacement, and FIGS. 5B to 5D are diagrams after the randomly selected segment P is randomly displaced by one cell. FIG. The displacement that reaches FIG. 5B satisfies the above-mentioned constraints [I] and [II]. On the other hand, the displacement to reach FIG. 5C causes a bond having a length exceeding 13 ^1/2 a, and thus does not satisfy the constraint condition [I]. Further, the displacement reaching FIG. 5D does not satisfy the constraint condition [II] because the segments are arranged in an overlapping manner.

  In addition, in the random displacement of the segment P, after satisfying the constraints [I] and [II], either of the following constraints [III] or [IV] is imposed. That is, only the displacement satisfying the following constraint condition [III] or satisfying [IV] among the random displacements satisfying the constraint conditions [I] and [II] is employed.

  [III] When the difference in potential energy before and after displacement is calculated, the difference in potential energy is negative or zero.

  [IV] In the case where the potential energy difference is positive, a method of determining whether or not the displacement can be adopted is applied probabilistically, and it is determined that the displacement can be adopted by the method.

A method for calculating the difference in potential energy before and after the displacement of the segment P will be described with reference to FIG. A segment different from the focused segment P is represented by the following formula (2):
2a ≦ r ≦ 5 ^1/2 a (2)
Is arranged in a range that satisfies the condition of FIG. 3, that is, with reference to FIG. 3, the center of the heterogeneous segment is arranged on an intersection (lattice point 4) of a broken line with a black circle in FIG. , The potential energy of the system increases by ΔE = εk _B T for each heterogeneous segment that satisfies such a condition. Here, ε corresponds to the χ parameter of the Flory-Huggins lattice theory, and is a dimensionless quantity parameter indicating the interaction between different types of polymers. As ε is larger, different polymers are less likely to be compatible. Therefore, as ε is larger, the potential energy when the segment P is displaced in the vicinity of a different segment is more likely to increase, so that it is difficult to employ an arrangement that satisfies the above formula (2). K _B is the Boltzmann constant and T is the temperature of the system. In the above formula (2), r is the distance between the center of the segment P of interest and the center of a different segment.

  Therefore, the difference in potential energy before and after the displacement of the segment P is such that the number of segments different from the segment P satisfying the above equation (2) before the displacement is m, and the segment P satisfying the above equation (2) after the displacement. Is ΔE × (mn), where n is the number of different segments. For example, the difference in potential energy before and after the displacement in the displacement from FIG. 5A to FIG. 5B is zero because m = 1 and n = 1. FIG. 6 shows other displacement examples. The difference in potential energy before and after displacement in the displacement from FIG. 6A to FIG. 6B is ΔE because m = 1 and n = 2. Further, the difference in potential energy before and after the displacement in the displacement from FIG. 6C to FIG. 6D is ΔE because m = 0 and n = 1.

As a method of determining whether or not the displacement can be adopted stochastically in the constraint condition [IV], for example, a Metropolis method can be cited. In the Metropolis method, a random number x of 0 or more and less than 1 is generated by calculation. If exp (−ΔE / k _B T) is larger than the random number x, the displacement is adopted, and if it is smaller than the random number x, the displacement is not adopted.

  As described above, the block copolymer is given by performing a computer simulation of selecting one segment at random from the system and determining whether or not to adopt the displacement until the steady state is reached by the Monte Carlo method. It is possible to calculate the microphase-separated structure at different parameters. The number of calculations until the steady state is reached depends on the size of the system, the length of the block copolymer, etc., and cannot be generally stated, but it is preferable to perform at least 100,000 calculations, preferably 10 million. It is more preferable to perform calculation more than once.

  In performing a computer simulation, it is preferable to use a periodic boundary condition as a system boundary condition. Even if the antiglare film is manufactured using a composite pattern created by repeatedly arranging a plurality of microphase separation patterns created from the obtained microphase separation structure, the periodic boundary conditions are used. Continuity between the fine uneven surfaces corresponding to the separation pattern is ensured, and the optical characteristics of the antiglare film are not adversely affected.

[2] Creation of Microphase Separation Pattern A microphase separation pattern can be created by converting the microphase separation structure obtained by the above-described computer simulation into image data. At this time, for example, if attention is paid to the density distribution of at least one type of segment, and 256 gray scale image data is created by setting the minimum density value to 0 and the maximum density value to 255, 256 gray scale image data is created. A microphase separation pattern is obtained. Also, when creating a microphase separation pattern from a microphase separation structure, paying attention to the presence or absence of at least one type of segment, image data binarized with 0 being a nonexistent location and 1 being an existing location Is created, a binarized microphase separation pattern can be obtained. Furthermore, paying attention to the density distribution of at least one kind of segment, an appropriate threshold value is set for the density, and a portion below the set threshold is set to 0, and a portion greater than the set threshold is set to 1, and binarized. A binarized microphase separation pattern can also be obtained by creating the image data. It is preferable to create the microphase separation pattern as binarized image data because the calculation load can be reduced.

  In the computer simulation of the block copolymer described above, since the microphase separation structure is obtained as the density distribution of each segment in the method using the Ginzburg Landau theory, a microphase separation pattern is created based on the density distribution of the segment. The method is preferably used. On the other hand, in the method using the lattice model including the coupled fluctuation method and the method using the spring-bead model, the microphase separation structure is obtained as the position coordinates of each segment. It is preferable to use a method of creating a microphase separation pattern.

  Image data that is a microphase separation pattern may be created as raster-format image data or vector-format image data.

  If an antiglare film having a fine uneven surface is produced by a method described later based on the image data which is the obtained microphase separation pattern, the fine uneven surface has a concave portion or a convex portion constituting the micro phase. A block copolymer that is formed so as to correspond to at least one segment of the separation structure, so that the fine uneven surface of the obtained antiglare film is macroscopically uniform but has a predetermined correlation length It has the characteristics of a microphase separation structure and exhibits a specific spatial frequency distribution. As a result, it has excellent anti-glare performance when applied to an image display device while having low haze, and can prevent deterioration in visibility due to whitishness, and a high-definition image display device Even when it is applied to the above, it exhibits excellent optical characteristics that a high contrast can be expressed without causing glare.

Examples of the case where the concave or convex portion on the surface of the fine irregularities is formed so as to correspond to at least one segment of the microphase separation structure include the following cases.
1) Based on the microphase separation structure calculated by computer simulation using the Ginzburg-Landau theory, paying attention to the density distribution of one of two or more types of segments, the 256 gradations corresponding to the density distribution Create a microphase separation pattern. Next, a 256-gradation mask is produced using the 256-gradation pattern, and the entire surface is exposed on the transparent substrate coated with the photocurable resin through the obtained mask. In this case, since the exposure amount of the photocurable resin varies depending on the gradation of the mask, the amount of the photocurable resin remaining on the transparent base material changes depending on the exposure amount when developed. An uneven shape is formed.
2) After applying a resist on the mold substrate, the 256 gradation pattern is directly drawn with a laser. When development is performed in this state, a mold base having a mask of 256 gradations is obtained, and by performing etching through this mask, a mold having irregularities corresponding to the gradation of the mask is obtained. . By transferring the concavo-convex surface of the mold onto the transparent substrate, an antiglare film having a fine concavo-convex surface composed of concave portions and convex portions corresponding to the gradation of the mask can be obtained.
3) Based on the microphase-separated structure calculated by computer simulation using the bond fluctuation method, pay attention to one of the two or more types of segments and set the location where the focused segment does not exist as 0 The binarized microphase separation pattern is created with 1 as the location to be processed. By forming the micro uneven surface so that the concave or convex portion on the surface of the micro uneven surface corresponds to the zero region of the micro phase separation pattern, the micro uneven surface composed of the concave and convex portions corresponding to the gradation of the micro phase separation pattern. An antiglare film having a surface is obtained.

  7 to 10 show microphase separation patterns when the number of segments N of the binary block copolymer (the total number of segments constituting the binary block copolymer) and the parameter ε are changed. The microphase separation patterns shown in FIGS. 7 to 10 are obtained by calculating a microphase separation structure by computer simulation using a binary block copolymer composed of a first segment and a second segment different from the first segment. This is binarized image data in which the area where one segment exists is 0 and the other areas are 1. The number of segments in the first segment is the same as the number of segments in the second segment. The size of the system was 256a × 256a, and a steady state was obtained by performing 1280 million million calculations. FIG. 7 shows that when the number of segments N is 2, a microphase separation pattern in which ε is 2 or more and the correlation length is substantially constant can be obtained. FIG. 8 shows that when the number of segments N is 4, a microphase separation pattern in which ε is 1.5 or more and the correlation length is substantially constant can be obtained. From FIG. 9, it can be seen that when the number of segments N is 8, a microphase separation pattern in which ε is 1.5 or more and the correlation length is substantially constant can be obtained. Further, FIG. 10 shows that when the number of segments N is 16, a microphase separation pattern in which ε is 1 or more and the correlation length is substantially constant can be obtained.

Here, the microphase separation pattern used in the present invention has a maximum value in the energy spectrum within a spatial frequency range of 0.025 to 0.125 μm ⁻¹ . By forming a fine concavo-convex surface based on such a microphase separation pattern exhibiting spatial frequency characteristics, it is possible to obtain an antiglare film having excellent antiglare performance and excellent visibility with reduced glare and whitishness. It becomes possible.

The energy spectrum of the microphase separation pattern focuses on the gradation of the microphase separation pattern obtained as image data, and represents the gradation of the image data with a two-dimensional function g (x, y). function g (x, y) to Fourier transform two-dimensional function G (f _x, f _y) to calculate the two-resulting-dimensional function G (f _x, f _y) is determined by squaring. Here, x and y represent orthogonal coordinates of the image data plane (e.g., the horizontal direction in the x direction image data, y direction is the vertical direction of the image data), f _x and f _y are each, x The spatial frequency in the direction and the spatial frequency in the y direction are represented. Actually, the two-dimensional function g (x, y) indicating the gradation of the image data is a discrete function because the gradation for each pixel is obtained as a set of discrete data points. Thus, a discrete function G (f _x, f _y) by a discrete Fourier transform defined by the following formula (3) to calculate the discrete function G (f _x, f _y) is the energy spectrum by squaring the determined. Here, π in the formula (3) is a pi, and i is an imaginary unit. M is the number of pixels in the x direction, N is the number of pixels in the y direction, l is an integer from −M / 2 to M / 2, and m is from −N / 2 to N / 2. It is an integer. Furthermore, Delta] f _x and Delta] f _y is the spatial frequency intervals of the x and y directions, is defined by equation (4) and (5). Δx and Δy in the equations (4) and (5) are horizontal resolutions in the x-axis direction and the y-axis direction, respectively. In the microphase separation pattern obtained as image data, Δx and Δy are equal to the length of one pixel in the x-axis direction and the length in the y-axis direction, respectively. That is, Δx = Δy = 4 μm when a microphase separation pattern is created as image data of 6400 dpi, and Δx = Δy = 2 μm when a microphase separation pattern is created as image data of 12800 dpi.

In microphase separation pattern created as described above, typically, the energy spectrum ^{_{G 2 (f x, f y}} ) , the horizontal, vertical, height respectively f _x, f _y, the energy spectrum G ² (f When represented by a three-dimensional graph with _x , f _y ), it is point-symmetric with respect to the origins of f _x = 0 and f _y = 0. Thus, "spatial frequency showing the maximum value of the energy spectrum" in the present invention, the energy spectrum ^{_{G 2 (f x, f y}} ) in FIG. (Horizontal axis showing a section of f _x = 0 of, be a spatial frequency f _y And a spatial frequency obtained from a two-dimensional graph in which the vertical axis is an energy spectrum. In this two-dimensional graph, the spatial frequency f _y of the horizontal axis, since the energy spectrum is symmetrical with regard f _y = 0, can be the absolute value of the spatial frequency f _y.

In the present invention, the term "energy spectrum exhibits a maximum in the range of spatial frequencies 0.025～0.125Myuemu ^-1", the energy spectrum _{^{G 2 (f x, f y}} ) in f _x = 0 of In the diagram showing the cross section, the energy spectrum includes a plurality of maximum values, and one or more of these maximum values are included in the spatial frequency range of 0.025 to 0.125 μm ⁻¹ .

11 to 14 is a view showing a cross section taken along f _x = 0, respectively, in FIG. 7 to FIG. 10 are calculated from the resulting microphase-separated pattern by the energy spectrum ^{_{G 2 (f x, f y}} ). The horizontal axis is the spatial frequency divided by the computer simulation length unit. From FIG. 11, when the number of segments N is 2, particularly ε is 2 or more, and the energy spectrum shows a clear maximum value near 0.057 / a. From this, if the unit a of the computer simulation length is set to 0.46 to 2.28 μm, the microphase separation pattern in which the energy spectrum has a maximum value within the spatial frequency range of 0.025 to 0.125 μm ^−1. Is obtained. From FIG. 12, when the number of segments N is 4, especially ε is 1.5 or more, and the energy spectrum shows a clear maximum value in the vicinity of 0.041 / a. From this, if the unit a of the computer simulation length is set to 0.33 to 1.64 μm, the microphase separation pattern in which the energy spectrum has a maximum value in the spatial frequency range of 0.025 to 0.125 μm ^−1. Is obtained. From FIG. 13, when the number of segments N is 8, ε is 1.5 or more and the energy spectrum shows a clear maximum value in the vicinity of 0.023 / a. From this, if the unit a of the computer simulation length is set to 0.18 to 0.92 μm, the microphase separation pattern in which the energy spectrum has a maximum value in the spatial frequency range of 0.025 to 0.125 μm ^−1. Is obtained. Further, from FIG. 14, when the number of segments N is 16, particularly ε is 1 or more, and the energy spectrum shows a clear maximum value in the vicinity of 0.016 / a. From this, if the unit a of the computer simulation length is set to 0.13 to 0.64 μm, the microphase separation pattern in which the energy spectrum has a maximum value in the spatial frequency range of 0.025 to 0.125 μm ^−1. Is obtained.

In this way, a micro-phase separation pattern having a maximum value in the range of the spatial frequency of 0.025 to 0.125 μm ⁻¹ is created and created by appropriately setting the computer simulation length unit a. Using the microphase separation pattern thus obtained, the concave or convex portion on the fine uneven surface of the antiglare film was obtained by forming the fine uneven surface so as to correspond to at least one kind of segment in the microphase separation structure. The micro uneven surface of the antiglare film is macroscopically uniform, but has a characteristic of the microphase separation structure of the block copolymer having a predetermined correlation length, and the correlation length is appropriately set. Therefore, it exhibits excellent optical characteristics that glare and whitish are sufficiently prevented while exhibiting a sufficient antiglare effect. When the unit a of the computer simulation length is set so that the energy spectrum shows a maximum value at a spatial frequency position lower than 0.025 μm ^{−1, the} surface shape of fine irregularities with a period exceeding 50 μm in the obtained antiglare film As a result, glare occurs when the obtained antiglare film is arranged on the surface of a high-definition image display device. When the unit a of the computer simulation length is set so that the energy spectrum shows a maximum value at a spatial frequency position higher than 0.125 μm ⁻¹ , the fine uneven surface of the obtained antiglare film is 10 μm or less. It contains a lot of short-period components and does not exhibit excellent antiglare performance.

When creating a microphase separation pattern as image data in raster format, the energy spectrum is set to a spatial frequency of 0.025 by setting the resolution so that the computer simulation length unit a has an appropriate value. A microphase separation pattern showing a maximum value within a range of 0.125 μm ⁻¹ can be obtained. For example, in the coupled oscillation method, when a = 2 μm, the resolution is 12800 dpi, and when a = 1 μm, the resolution is 25600 dpi. When creating a microphase separation pattern as image data in vector format, the energy spectrum has a spatial frequency of 0.025 by setting the scale so that the unit a of the computer simulation length is an appropriate value. A microphase separation pattern showing a maximum value within a range of 0.125 μm ⁻¹ can be obtained.

  Instead of calculating the microphase separation structure of the block copolymer by computer simulation, a microphase separation structure is formed using an actual block copolymer, and this is taken as a photograph, and the obtained image data is converted into the obtained image data. On the other hand, it is possible to obtain a microphase separation pattern by editing such as enlargement. However, when an actual block copolymer is used, the block copolymer that forms a stable microphase separation structure is used. In order to obtain a microphase separation pattern from a microphase separation structure obtained from an actual block copolymer, a resolution of 100 nm or less is required. Repeated observations using a microscope or scattering experiment to obtain image data, and a large number of obtained image data are arranged to form a seamless micro-phase component. There is a need to create a pattern. In view of these efforts, it is desirable to create a microphase separation pattern by the method according to the present invention.

[3] Formation of fine uneven surface using microphase separation pattern In this step, the fine uneven surface is formed on the transparent substrate using the microphase separation pattern described above. The concave portion or the convex portion constituting the fine uneven surface corresponds to at least one segment of the micro phase separation structure. For example, when the microphase separation pattern is image data binarized into 0 and 1, the concave or convex portions on the surface of the fine irregularities correspond to the 0 region (or 1 region) of the microphase separation pattern. Thus, a fine uneven surface is formed. The pattern used to form the fine uneven surface may be a pattern created by repeatedly arranging two or more microphase separation patterns.

  Specific examples of the method for forming a fine uneven surface on a transparent substrate using the microphase separation pattern include a printing method, a pattern exposure method, and an embossing method. In the printing method, for example, the above-described microphase separation pattern is printed on a transparent substrate by flexographic printing, screen printing, ink jet printing using a photocurable resin or a thermosetting resin, and then dried. Alternatively, the antiglare film of the present invention can be produced by curing with actinic rays or heating. Moreover, in the pattern exposure method, after applying a photocurable resin on a transparent substrate, direct drawing exposure by a laser using the above-described microphase separation pattern, or through a mask having the above-described microphase separation pattern. The antiglare film of the present invention can be produced by pattern exposure by whole surface exposure, development as necessary, and curing by active light or heating. Furthermore, in the embossing method, a mold having a fine uneven surface is manufactured using the micro phase separation pattern described above, the uneven surface of the manufactured mold is transferred onto a transparent substrate, and then the transparent surface on which the uneven surface is transferred. The antiglare film of the present invention can be produced by peeling the substrate from the mold. Here, the antiglare film of the present invention is preferably produced by an embossing method from the viewpoint of producing a fine uneven surface with good accuracy and reproducibility.

  Examples of the embossing method include a UV embossing method using a photocurable resin and a hot embossing method using a thermoplastic resin. Among these, the UV embossing method is preferable from the viewpoint of productivity.

  The UV embossing method forms a photocurable resin layer on the surface of a transparent substrate, and cures the photocurable resin layer while pressing the photocurable resin layer against the uneven surface of the mold so that the uneven surface of the mold is a photocurable resin. It is a method of transferring to a layer. Specifically, an ultraviolet curable resin is applied onto a transparent substrate, and the ultraviolet curable resin is irradiated with ultraviolet rays from the transparent substrate side while the coated ultraviolet curable resin is in close contact with the uneven surface of the mold. The mold resin is cured, and then the shape of the mold is transferred to the ultraviolet curable resin by peeling the transparent substrate on which the cured ultraviolet curable resin layer is formed from the mold.

  When the UV embossing method is used, the transparent substrate may be a substantially optically transparent film. For example, a triacetyl cellulose film, a polyethylene terephthalate film, a polymethyl methacrylate film, a polycarbonate film, or a norbornene compound is used as a monomer. And a resin film such as a solvent cast film of thermoplastic resin such as amorphous cyclic polyolefin and an extruded film.

  The type of the ultraviolet curable resin in the case of using the UV embossing method is not particularly limited, and a commercially available appropriate one can be used. It is also possible to use a resin that can be cured by visible light having a wavelength longer than that of ultraviolet rays by combining an ultraviolet curable resin with an appropriately selected photoinitiator. Specifically, polyfunctional acrylates such as trimethylolpropane triacrylate and pentaerythritol tetraacrylate are used alone or in admixture of two or more thereof, and Irgacure 907 (manufactured by Ciba Specialty Chemicals) ), Irgacure 184 (manufactured by Ciba Specialty Chemicals), and a photopolymerization initiator such as Lucillin TPO (manufactured by BASF) can be suitably used.

  On the other hand, the hot embossing method is a method in which a transparent base material made of a thermoplastic resin is pressed against a mold in a heated state, and the surface uneven shape of the mold is transferred to the transparent base material. The transparent base material used in the hot embossing method may be any material as long as it is substantially transparent. For example, polymethyl methacrylate, polycarbonate, polyethylene terephthalate, triacetyl cellulose, norbornene compounds are used as monomers. A solvent cast film or an extruded film of a thermoplastic resin such as amorphous cyclic polyolefin can be used. These transparent resin films can also be suitably used as a transparent substrate for applying the ultraviolet curable resin in the UV embossing method described above.

<Method for producing mold for producing antiglare film>
Below, the manufacturing method of the metal mold | die which can be used suitably for the manufacturing method of the anti-glare film of this invention is demonstrated. The method for producing the mold used for producing the antiglare film of the present invention is not particularly limited as long as it is a method capable of obtaining a predetermined surface shape using the above-described microphase separation pattern. In order to manufacture with good reproducibility, [1] first plating step, [2] polishing step, [3] photosensitive resin film forming step, [4] exposure step, and [5] development step And [6] a first etching step, [7] a photosensitive resin film peeling step, and [8] a second plating step. FIG. 15 is a diagram schematically showing a preferred example of the first half of the mold manufacturing method of the present invention. In FIG. 15, the cross section of the metal mold | die in each process is shown typically. Hereafter, each process of the manufacturing method of the metal mold | die of this invention is demonstrated in detail, referring FIG.

[1] First Plating Step In the mold manufacturing method of the present invention, first, copper plating or nickel plating is applied to the surface of the substrate used for the mold. Thus, by performing copper plating or nickel plating on the surface of the mold base, it is possible to improve the adhesion and gloss of chromium plating in the subsequent second plating step. In other words, when chrome plating is applied to the surface of iron or the like, or when chrome plating is applied again after forming irregularities on the chrome plating surface by the sandblasting method or the bead shot method, the surface tends to be rough and fine cracks occur. This makes it difficult to control the uneven shape on the surface of the mold. On the other hand, such inconvenience can be eliminated by first performing copper plating or nickel plating on the substrate surface. This is because copper plating or nickel plating has a high covering property and a strong smoothing action, so that a flat and glossy surface is formed by filling minute irregularities and nests of the mold base. is there. Due to the characteristics of these copper plating or nickel plating, even if chromium plating is applied in the second plating step described later, the roughness of the chromium plating surface that seems to be caused by minute irregularities and nests existing on the base material is eliminated. In addition, the occurrence of fine cracks is reduced due to the high coverage of copper plating or nickel plating.

  The copper or nickel used in the first plating step may be a pure metal, or may be an alloy mainly composed of copper or an alloy mainly composed of nickel. “Copper” means to include copper and copper alloy, and “nickel” means to include nickel and nickel alloy. Copper plating and nickel plating may be performed by electrolytic plating or electroless plating, respectively, but electrolytic plating is usually employed.

  When copper plating or nickel plating is performed, if the plating layer is too thin, the influence of the underlying surface cannot be completely eliminated. Therefore, the thickness is preferably 50 μm or more. Although the upper limit of the plating layer thickness is not critical, the upper limit of the plating layer thickness is preferably about 500 μm in view of cost and the like.

  In the metal mold manufacturing method of the present invention, examples of the metal material suitably used for forming the metal mold substrate include aluminum and iron from the viewpoint of cost. From the viewpoint of handling convenience, it is more preferable to use lightweight aluminum. The aluminum and iron here may be pure metals, respectively, or may be an alloy mainly composed of aluminum or iron.

  Moreover, the shape of the mold base material may be an appropriate shape conventionally employed in the field, and may be, for example, a plate-like shape, a columnar shape, or a cylindrical roll. If a mold is produced using a roll-shaped substrate, there is an advantage that the antiglare film can be produced in a continuous roll shape.

[2] Polishing Step In the subsequent polishing step, the surface of the substrate that has been subjected to copper plating or nickel plating in the first plating step described above is polished. It is preferable that the base material surface is grind | polished in the state close | similar to a mirror surface through the said process. This is because metal plates and metal rolls that serve as base materials are often subjected to machining such as cutting and grinding in order to achieve the desired accuracy, and as a result, machine marks remain on the base material surface. This is because even if copper plating or nickel plating is applied, those processed marks may remain, and the surface may not be completely smooth in the plated state. That is, even if a process described later is performed on the surface where such deep processed marks remain, unevenness such as processed marks may be deeper than the unevenness formed after each process is performed. Such effects may remain, and when an antiglare film is produced using such a mold, the optical characteristics may be unexpectedly affected. In FIG. 15 (a), a plate-shaped mold substrate 7 is subjected to copper plating or nickel plating on the surface in the first plating step (for the copper plating or nickel plating layer formed in this step). Further, a state in which the surface 8 is mirror-polished by a polishing process is schematically shown.

  There is no particular limitation on the method for polishing the surface of the substrate on which copper plating or nickel plating has been applied, and any of mechanical polishing, electrolytic polishing, and chemical polishing can be used. Examples of the mechanical polishing method include super finishing, lapping, fluid polishing, and buff polishing. As for the surface roughness after polishing, the center line average roughness Ra in accordance with the provisions of JIS B 0601 is preferably 0.1 μm or less, and more preferably 0.05 μm or less. If the centerline average roughness Ra after polishing is greater than 0.1 μm, the final unevenness of the mold surface may remain affected by the surface roughness after polishing. In addition, the lower limit of the center line average roughness Ra is not particularly limited, and there is no limit in particular because there is a natural limit from the viewpoint of processing time and processing cost.

[3] Photosensitive resin film forming step In the subsequent photosensitive resin film forming step, the photosensitive resin was dissolved in the solvent on the polished surface 8 of the mold substrate 7 that was mirror-polished by the polishing step described above. A photosensitive resin film is formed by applying as a solution, heating and drying. FIG. 15B schematically shows a state where the photosensitive resin film 9 is formed on the polished surface 8 of the mold base 7.

  A conventionally known photosensitive resin can be used as the photosensitive resin. Examples of the negative photosensitive resin having a property of curing the photosensitive part include, for example, a monomer or prepolymer of an acrylate ester having an acrylic group or a methacrylic group in the molecule, a mixture of bisazide and a diene rubber, polyvinyl Cinnamate compounds and the like can be used. Further, as a positive photosensitive resin having such a property that a photosensitive part is eluted by development and only an unexposed part remains, for example, a phenol resin type or a novolac resin type can be used. Moreover, you may mix | blend various additives, such as a sensitizer, a development accelerator, an adhesiveness modifier, and a coating property improving agent, with a photosensitive resin as needed.

  When these photosensitive resins are applied to the polished surface 8 of the mold base 7, it is preferable to dilute and apply in an appropriate solvent in order to form a good coating film. As the solvent, cellosolve solvents, propylene glycol solvents, ester solvents, alcohol solvents, ketone solvents, highly polar solvents, and the like can be used.

  As a method for applying the photosensitive resin solution, known methods such as meniscus coating, fountain coating, dip coating, spin coating, roll coating, wire bar coating, air knife coating, blade coating, and curtain coating may be used. it can. The thickness of the coating film is preferably in the range of 1 to 6 μm after drying.

[4] Exposure Step In the subsequent exposure step, the gradation pattern described above is exposed on the photosensitive resin film 9 formed in the photosensitive resin film formation step described above. The light source used in the exposure process may be appropriately selected according to the photosensitive wavelength and sensitivity of the coated photosensitive resin. For example, the g-line (wavelength: 436 nm) of the high-pressure mercury lamp, the h-line (wavelength: 405 nm) of the high-pressure mercury lamp. ), I line (wavelength: 365 nm) of high pressure mercury lamp, semiconductor laser (wavelength: 830 nm, 532 nm, 488 nm, 405 nm, etc.), YAG laser (wavelength: 1064 nm), KrF excimer laser (wavelength: 248 nm), ArF excimer laser (wavelength) 193 nm), F2 excimer laser (wavelength: 157 nm), or the like.

  In the mold manufacturing method of the present invention, in order to form the surface unevenness with high accuracy, in the exposure step, it is preferable to expose the microphase separation pattern on the photosensitive resin film in a precisely controlled state. . In the mold manufacturing method of the present invention, in order to accurately expose the microphase separation pattern on the photosensitive resin film, it is computer-controlled based on the microphase separation pattern which is image data created by a computer. It is preferable to draw a pattern on the photosensitive resin film with a laser beam emitted from the laser head. When performing such laser drawing, a laser drawing apparatus for making a printing plate can be used. Examples of such a laser drawing apparatus include Laser Stream FX (manufactured by Sink Laboratory Co., Ltd.) and the like.

  FIG. 15C schematically shows a state in which the pattern is exposed to the photosensitive resin film 9. When the photosensitive resin film is formed of a negative photosensitive resin, the exposed region 10 undergoes a crosslinking reaction of the resin by exposure, and the solubility in a developing solution described later decreases. Therefore, the unexposed area 11 in the developing process is dissolved by the developer, and only the exposed area 10 remains on the substrate surface as a mask. On the other hand, in the case where the photosensitive resin film is formed of a positive photosensitive resin, the exposed region 10 is cut by bonding of the resin by exposure, and the solubility in a developer described later increases. Therefore, the area 10 exposed in the development process is dissolved by the developer, and only the unexposed area 11 remains on the substrate surface as a mask.

[5] Development Step In the subsequent development step, when a negative photosensitive resin is used for the photosensitive resin film 9, the unexposed region 11 is dissolved by the developer, and only the exposed region 10 is gold. It remains on the mold substrate and acts as a mask in the subsequent first etching step. On the other hand, when a positive photosensitive resin is used for the photosensitive resin film 9, only the exposed region 10 is dissolved by the developer, and the unexposed region 11 remains on the mold substrate. It acts as a mask in the subsequent first etching step.

  A conventionally well-known thing can be used about the developing solution used for a image development process. For example, inorganic alkalis such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia, primary amines such as ethylamine and n-propylamine, diethylamine, di-n-butylamine and the like Secondary amines, tertiary amines such as triethylamine, methyldiethylamine, alcohol amines such as dimethylethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, trimethylhydroxyethylammonium hydroxide, etc. Examples include alkaline aqueous solutions such as quaternary ammonium salts, cyclic amines such as pyrrole and piperidine; and organic solvents such as xylene and toluene.

  The development method in the development step is not particularly limited, and methods such as immersion development, spray development, brush development, and ultrasonic development can be used.

  FIG. 15D schematically shows a state in which a development process is performed using a negative photosensitive resin for the photosensitive resin film 9. In FIG. 15C, the unexposed region 11 is dissolved by the developer, and only the exposed region 10 becomes the remaining mask 12 on the substrate surface. FIG. 15E schematically shows a state in which a development process is performed using a positive photosensitive resin for the photosensitive resin film 9. In FIG. 15C, the exposed area 10 is dissolved by the developer, and only the unexposed area 11 becomes the remaining mask 12 on the substrate surface.

[6] First Etching Step In the subsequent first etching step, the mold base is mainly used in a portion where there is no mask, using the photosensitive resin film remaining on the mold base surface after the development step as a mask. The material is etched to form irregularities on the polished plated surface. FIG. 16 is a diagram schematically showing a preferred example of the latter half of the mold manufacturing method of the present invention. FIG. 16A schematically shows a state in which the mold base 7 in the portion 13 without a mask is etched mainly by the first etching step. The mold base 7 below the mask 12 is not etched from the mold base surface, but etching from the portion 13 without the mask proceeds with the progress of etching. Therefore, in the vicinity of the boundary between the mask 12 and the portion 13 without the mask, the mold base 7 under the mask 12 is also etched. In the vicinity of the boundary between the mask 12 and the portion 13 without the mask, the die base material 7 below the mask 12 is also etched, which is hereinafter referred to as side etching. FIG. 17 schematically shows the progress of side etching. A dotted line 14 in FIG. 17 shows the surface of the mold base material that changes with the progress of etching in stages.

The etching process in the first etching step is usually performed using a ferric chloride (FeCl ₃ ) solution, a cupric chloride (CuCl ₂ ) solution, an alkali etching solution (Cu (NH ₃ ) ₄ Cl ₂ ), etc. Although it is performed by corroding the surface, a strong acid such as hydrochloric acid or sulfuric acid can be used, or reverse electrolytic etching by applying a potential opposite to that during electrolytic plating can also be used. The concave shape formed on the mold base material when the etching process is performed differs depending on the type of the base metal, the type of the photosensitive resin film, the etching technique, and the like. In the following cases, the etching is performed isotropically from the metal surface in contact with the etching solution. The etching amount here is the thickness of the base material to be cut by etching.

  The etching amount in the first etching step is preferably 1 to 50 μm. When the etching amount is less than 1 μm, the unevenness shape is hardly formed on the metal surface, and the die is almost flat, so that the antiglare property is not exhibited. In addition, when the etching amount exceeds 50 μm, the height difference of the concavo-convex shape formed on the metal surface becomes large, and in the image display device to which the antiglare film produced using the obtained mold is applied, it is white. There is a risk of injury. The etching process in the first etching step may be performed by one etching process, or the etching process may be performed twice or more. In the case where the etching process is performed twice or more, the total etching amount in the two or more etching processes is preferably 1 to 50 μm.

[7] Photosensitive resin film peeling step In the subsequent photosensitive resin film peeling step, the remaining photosensitive resin film used as a mask in the first etching step is completely dissolved and removed. In the photosensitive resin film peeling step, the photosensitive resin film is dissolved using a peeling solution. As the stripper, the same developer as that described above can be used. When a negative photosensitive resin film is used by changing pH, temperature, concentration, immersion time, etc., the exposed portion is exposed. When the positive photosensitive resin film is used, the photosensitive resin film in the non-exposed portion is completely dissolved and removed. There is no particular limitation on the peeling method in the photosensitive resin film peeling step, and methods such as immersion development, spray development, brush development, and ultrasonic development can be used.

  FIG. 16B schematically shows a state where the photosensitive resin film used as the mask 12 in the first etching process is completely dissolved and removed by the photosensitive resin film peeling process. The first surface irregularities 15 are formed on the surface of the mold substrate by etching using the mask 12 made of a photosensitive resin film.

[8] Second plating step Subsequently, the surface unevenness shape is blunted by performing chromium plating on the formed uneven surface (first surface unevenness shape 15). In FIG. 16 (c), by forming the chromium plating layer 16 on the first surface uneven shape 15 formed by the etching process of the first etching step, the unevenness is duller than the first surface uneven shape 15. The state where the surface (the surface 17 of chrome plating) is formed is shown.

In the present invention, chrome plating is employed which has a glossy surface, a high hardness, a low coefficient of friction, and good release properties on the surface of a flat plate or a roll. The type of chrome plating is not particularly limited, but it is preferable to use a chrome plating that expresses a good gloss, so-called gloss chrome plating or decorative chrome plating. Chromium plating is usually performed by electrolysis, and an aqueous solution containing chromic anhydride (CrO ₃ ) and a small amount of sulfuric acid is used as the plating bath. By adjusting the current density and electrolysis time, the thickness of the chromium plating can be controlled.

  In the second plating step, it is not preferable to perform plating other than chromium plating. This is because plating other than chromium has low hardness and wear resistance, so that the durability as a mold is lowered, and unevenness is worn away during use or the mold is damaged. In an antiglare film obtained from such a mold, there is a high possibility that a sufficient antiglare function cannot be obtained, and there is a high possibility that defects will occur on the film.

  Further, the surface polishing after plating as disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 2004-90187 is also not preferable in the present invention. That is, it is preferable to use the concavo-convex surface subjected to chrome plating as the concavo-convex surface of the mold transferred onto the transparent substrate without providing a step of polishing the surface after the second plating step. By polishing, a flat part is generated on the outermost surface, which may lead to deterioration of optical characteristics, and since shape control factors increase, shape control with good reproducibility becomes difficult. Depending on the reason.

  In this way, in the mold manufacturing method of the present invention, a chrome plating is applied to the surface on which the fine surface irregularities are formed, whereby a mold having an irregular surface and a higher surface hardness can be obtained. . The bluntness of the irregularities at this time varies depending on the type of the base metal, the size and depth of the irregularities obtained from the first etching process, and the type and thickness of the plating. The greatest factor in controlling is the plating thickness. If the thickness of the chrome plating is thin, the effect of dulling the surface shape of the unevenness obtained before the chrome plating process is insufficient, and the optical characteristics of the antiglare film obtained by transferring the uneven shape onto a transparent substrate Is not so good. On the other hand, when the plating thickness is too thick, productivity is deteriorated and a projection-like plating defect called a nodule is generated, which is not preferable. Therefore, the thickness of the chrome plating is preferably in the range of 1 to 10 μm, and more preferably in the range of 3 to 6 μm.

  The chromium plating layer formed in the second plating step is preferably formed to have a Vickers hardness of 800 or more, and more preferably 1000 or more. When the Vickers hardness of the chrome plating layer is less than 800, the durability when using the mold is reduced, and the decrease in hardness due to chrome plating is due to abnormalities in the plating bath composition, electrolysis conditions, etc. during the plating process. This is because the possibility of occurrence is high, and the possibility of undesirably affecting the occurrence of defects is also high.

  Moreover, in the manufacturing method of the metal mold | die of this invention, the uneven | corrugated surface formed by the 1st etching process is etched between the above-mentioned [7] photosensitive resin film peeling process and [8] 2nd plating process. It is preferable to include the 2nd etching process blunted by. In the second etching process, the first surface irregularities 15 formed by the first etching process using the photosensitive resin film as a mask are blunted by an etching process. By this second etching process, there is no portion with a steep surface inclination in the first surface irregularity shape 15 formed by the first etching process, and the optical characteristics of the antiglare film manufactured using the obtained mold are reduced. It changes in the preferred direction. In FIG. 18, by the second etching process, the first surface unevenness shape 15 of the mold base 7 is blunted, the portion having a steep surface inclination is blunted, and the second surface unevenness having a gentle surface inclination is obtained. The state where the shape 18 is formed is shown.

Similarly to the first etching step, the etching process in the second etching step is usually ferric chloride (FeCl ₃ ) solution, cupric chloride (CuCl ₂ ) solution, alkaline etching solution (Cu (NH ₃ ) ₄ Cl ₂ ) or the like, and by corroding the surface, strong acid such as hydrochloric acid or sulfuric acid can be used, or reverse electrolytic etching by applying a potential opposite to that during electrolytic plating can also be used. The bluntness of the unevenness after the etching process varies depending on the type of the underlying metal, the etching technique, and the size and depth of the unevenness obtained by the first etching process. The largest factor in controlling the amount is the etching amount. The etching amount here is also the thickness of the base material to be cut by etching, as in the first etching step. When the etching amount is small, the effect of dulling the surface shape of the unevenness obtained by the first etching process is insufficient, and the optical characteristics of the antiglare film obtained by transferring the uneven shape onto the transparent substrate are not so much. It doesn't get better. On the other hand, when the etching amount is too large, the uneven shape is almost lost and the die is almost flat, so that the antiglare property is not exhibited. Therefore, the etching amount is preferably in the range of 1 to 50 μm, and more preferably in the range of 4 to 20 μm. Similarly to the first etching process, the etching process in the second etching process may be performed by one etching process, or the etching process may be performed twice or more. In the case where the etching process is performed twice or more, the total etching amount in the two or more etching processes is preferably 1 to 50 μm.

  By using the mold obtained by the mold manufacturing method of the present invention, the fine uneven surface shape is accurately controlled and formed, so that sufficient anti-glare property is exhibited and whitish does not occur. Even when it is arranged on the surface of a high-definition image display device, glare does not occur and an antiglare film exhibiting high contrast can be obtained.

  EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

<Example 1>
A surface of a 200 mm diameter aluminum roll (JIS A5056) with copper ballad plating is prepared. Copper ballad plating consists of a copper plating layer / thin silver plating layer / surface copper plating layer, and the thickness of the entire plating layer is set to be about 200 μm. The copper plating surface is mirror-polished, and a photosensitive resin is applied to the polished copper plating surface and dried to form a photosensitive resin film. Next, a pattern in which a plurality of microphase separation patterns shown in FIG. 7D are continuously arranged repeatedly is exposed on a photosensitive resin film with a laser beam and developed. The laser beam exposure and development are performed using Laser Stream FX (manufactured by Sink Laboratories). A positive photosensitive resin is used for the photosensitive resin film. In FIG. 7D, the computer simulation length unit a is set to 2 μm.

  Thereafter, a first etching process is performed with cupric chloride solution. In this case, the etching amount is set to 7 μm. The photosensitive resin film is removed from the roll after the first etching process, and the second etching process is performed again with cupric chloride solution. In this case, the etching amount is set to 18 μm. Thereafter, chrome plating is performed, and the mold A is manufactured. At this time, the chrome plating thickness is set to 4 μm.

A photocurable resin composition GRANDIC 806T (manufactured by Dainippon Ink & Chemicals, Inc.) is dissolved in ethyl acetate to obtain a 50% strength by weight solution. Further, a photopolymerization initiator, Lucillin TPO (manufactured by BASF). Chemical name: 2,4,6-trimethylbenzoyldiphenylphosphine oxide) is added at 5 parts by weight per 100 parts by weight of the curable resin component to prepare a coating solution. This coating solution is coated on a 80 μm thick triacetylcellulose (TAC) film so that the coating thickness after drying is 10 μm, and dried for 3 minutes in a dryer set at 60 ° C. The dried film is brought into close contact with the uneven surface of the previously obtained mold A with a rubber roll so that the photocurable resin composition layer is on the mold side. In this state, light from a high-pressure mercury lamp with an intensity of 20 mW / cm ² is irradiated from the TAC film side so that the amount of light converted to h-ray is 200 mJ / cm ² to cure the photocurable resin composition layer. Thereafter, the TAC film is peeled from the mold together with the cured resin, and a transparent anti-glare film A composed of a laminate of the cured resin having irregularities on the surface and the TAC film is produced.

<Example 2>
A mold B is obtained in the same manner as in Example 1 except that the microphase separation pattern shown in FIG. 8D is used as the pattern exposed by the laser beam. An antiglare film B is produced in the same manner as in Example 1 except that the obtained mold B is used. In FIG. 8D, the computer simulation length unit a is set to 1 μm.

<Comparative Example 1>
A mold C is obtained in the same manner as in Example 1 except that a binarized image pattern in which dots having a diameter of 14 μm are randomly arranged as shown in FIG. 19 is used as a pattern exposed by laser light. . An antiglare film C is produced in the same manner as in Example 1 except that the obtained mold C is used.

FIG. 20 shows a cross section at f _x = 0 of the energy spectrum G ² (f _x , f _y ) calculated from the patterns used in Example 1, Example 2, and Comparative Example 1. The microphase separation pattern used in Example 1 has a maximum value at a spatial frequency of 0.057 μm ⁻¹ , and the microphase separation pattern used in Example 2 has a maximum value at a spatial frequency of 0.078 μm ^−1. The pattern used in Comparative Example 1 has a maximum value at a spatial frequency of 0.047 μm ⁻¹ . In addition, from FIG. 20, the microphase separation patterns used in Example 1 and Example 2 have less spatial frequency components than 0.025 μm ⁻¹ than the pattern used in Comparative Example 1, and are macroscopically uniform. I understand that there is. As a result, in the antiglare films A and B produced by the method of the present invention, the pattern used for forming the fine uneven surface has a predetermined correlation length while being macroscopically uniform. Since it has the characteristics of a combined microphase separation structure and the correlation length is appropriately set, the obtained fine uneven surface has a predetermined correlation length while being macroscopically uniform. Does not occur, exhibits sufficient antiglare properties, and does not generate whiteness. In addition, since the haze is low, the contrast does not decrease even when it is arranged in an image display device. On the other hand, the antiglare film C produced using a pattern that does not use a microphase separation pattern has a random irregular surface with a long long period because the low spatial frequency component of the pattern is larger than the microphase separation pattern. As a result, glare occurs.

  It should be understood that the embodiments and examples disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  A, B, C, D, 1, 2 segments, 3 Bonds connecting the centers of the segments, P Focused segments, 4 Grid points where potential is generated when segments different from P are placed, 7 gold Mold substrate, 8 Surface of substrate polished by polishing process, 9 Photosensitive resin film, 10 Photosensitive resin film exposed in exposure process, 11 Photosensitive resin film not exposed in exposure process, 12 Mask, 13 Location without mask, 14 Surface formed stepwise by etching, 15 Substrate surface after first etching step (first surface irregular shape), 16 Chromium plating layer, 17 Chromium plating surface, 18 Second etching Substrate surface after the process (second surface irregular shape).

Claims (13)

The block copolymer is obtained by computer simulation using a segment which is an assembly of a plurality of the same monomer units as a structural unit and a block copolymer composed of two or more types of segments composed of different monomer units as a model. Calculating the microphase separation structure of
Based on the microphase separation structure, creating a microphase separation pattern in which the energy spectrum shows a maximum value in the spatial frequency range of 0.025 to 0.125 μm ⁻¹ ;
Using the microphase separation pattern, forming a concavo-convex surface on a transparent substrate;
A method for producing an antiglare film, comprising: The position of the maximum value of the energy spectrum of the microphase separation pattern is controlled within a range of a spatial frequency of 0.025 to 0.125 μm ⁻¹ by adjusting a unit of length of the computer simulation. A method for producing an antiglare film according to 1.   3. The step of forming the concavo-convex surface, wherein the concavo-convex surface is formed such that a concave portion or a convex portion constituting the concavo-convex surface corresponds to at least one kind of segment in the microphase separation structure. Manufacturing method of anti-glare film. Focusing on at least one segment in the microphase separation structure, creating a microphase separation pattern as image data having gradation,
In the step of forming the concavo-convex surface, the concavo-convex surface is formed such that a concave portion or a convex portion constituting the concavo-convex surface corresponds to a gradation of the microphase separation pattern. Manufacturing method of anti-glare film. The microphase separation pattern is image data binarized into 0 and 1,
5. The antiglare layer according to claim 4, wherein in the step of forming the concavo-convex surface, the concavo-convex surface is formed such that a concave portion or a convex portion constituting the concavo-convex surface corresponds to a region where the microphase separation pattern is zero. A method for producing a film.   The method for producing an antiglare film according to any one of claims 1 to 5, wherein a microphase separation structure of the block copolymer is calculated by a two-dimensional computer simulation.   The block copolymer is a binary block copolymer having a first segment and a second segment composed of a monomer unit different from the monomer unit constituting the first segment. The method for producing an antiglare film according to any one of claims 1 to 6, which is a coalescence.   The method for producing an antiglare film according to claim 7, wherein the number of the first segments and the number of the second segments constituting the binary block copolymer are the same.   The said computer simulation is a manufacturing method of the anti-glare film in any one of Claims 1-8 performed using a coupling | bonding rocking | fluctuation method.   The step of forming the uneven surface includes a step of producing a mold having an uneven surface using the microphase separation pattern and transferring the uneven surface of the mold onto the transparent substrate. 10. A method for producing an antiglare film according to any one of 9 above. A method for manufacturing the mold according to claim 10, comprising:
A first plating step of performing copper plating or nickel plating on the surface of the mold base;
A polishing step of polishing the surface plated by the first plating step;
A photosensitive resin film forming step of forming a photosensitive resin film on the polished surface;
An exposure step of exposing the microphase separation pattern on the photosensitive resin film;
A development step of developing the photosensitive resin film exposed to the microphase separation pattern;
A first etching step of performing an etching process using the developed photosensitive resin film as a mask and forming irregularities on the polished plated surface;
A photosensitive resin film peeling step for peeling the photosensitive resin film;
A second plating step of applying chromium plating to the formed uneven surface;
A method for manufacturing a mold, including:   The manufacturing method of the metal mold | die of Claim 11 including the 2nd etching process of blunting the uneven | corrugated shape of the formed uneven surface by an etching process between the said photosensitive resin film peeling process and a said 2nd plating process. . The thickness of the chromium plating layer formed by chromium plating in the second plating step is 1 to 10 μm,
The method for producing a mold according to claim 11 or 12, wherein the concavo-convex surface formed with chromium plating in the second plating step is an concavo-convex surface of the mold transferred onto the transparent substrate.

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