JP5347515B2 - Lighting device - Google Patents

Description

  The present invention relates to an illumination device that performs illumination by simultaneously emitting light from a plurality of semiconductor light emitting elements such as chip-shaped LEDs (light emitting diodes).

  2. Description of the Related Art Conventionally, there has been known a lighting fixture including an LED module on which a plurality of LED elements are mounted and an outer member that has a lens body facing the LED elements and covers the LED module (see, for example, Patent Document 1). .

  In this lighting fixture, components such as a plurality of LED elements are mounted only on the lower surface of the LED module, and no components are disposed on the rear surface of the LED module. At the same time, two of the plurality of LED module holding portions provided on the outer member are electrically connected to the power source, and the two LED module holding portions are provided on the side surfaces of the LED module. A pair of terminals are held. Thereby, it forms so that electric power feeding to each LED element can be performed from the side of an LED module.

  In addition, the lighting device includes a plurality of lighting units each including a power supply board and a light emitting board connected to the power supply board. The voltage of the commercial AC power source is set to a voltage suitable for driving a light emitting element such as an LED. A power supply board having a plurality of connectors is connected to a power adapter for conversion and rectification, and a plurality of LED elements are arranged in a matrix on the light emitting board, and electric components such as constant current diodes and connectors are LED There is known a lighting device that is used by attaching to a surface on which an element is mounted and connecting a connector of the light emitting substrate to a connector of a power supply substrate (see, for example, Patent Document 2).

JP 2003-68111 A Utility Model Registration No. 3119573

  In the lighting fixture of Patent Document 1, there is no description about the arrangement of electrical components other than the LED elements with respect to the LED module, but since there are no components on the back surface of the LED module, the electrical components are mounted on the LED element. It seems that they are arranged on the same plane. And in this illuminating device, the terminal is arrange | positioned at the peripheral part of the LED module. Similarly, in the illumination device of Patent Document 2, electrical components such as a connector and a constant current element are arranged on the surface of the light emitting substrate on which the LED elements are mounted.

  In the configuration in which a plurality of electrical components and LED elements are arranged on the same surface of the substrate as described above, the space for electrical components is required on the same surface in addition to the layout space for each LED element, so the substrate does not have to be large. I do not get. Therefore, it is disadvantageous in reducing the size of the lighting device, and this becomes more prominent as the number of substrates used increases. In addition, since electrical parts such as connectors and constant current elements are non-light emitting parts, the space in which the electrical parts are arranged becomes darker than the space in which the LED elements are arranged. Therefore, it is difficult to emit light with uniform brightness even in a lighting device in which a plurality of LED elements are arranged in a matrix and emit light in a planar shape, for example.

  As described above, the prior art is disadvantageous in reducing the size, and there is a problem that it is difficult to cause the light source module to emit light in a planar shape with uniform brightness.

In order to solve the above-mentioned problem and further suppress the color unevenness of the light source module caused by the variation in the emission color of each semiconductor light-emitting element, the invention of claim 1 includes a base wall portion in which component through holes are formed, A metal device main body having an open portion opposed to the wall; a module substrate, a metal conductor provided in a predetermined pattern on the front surface of the substrate, and the module electrically connected to the metal conductor A plurality of semiconductor light emitting elements mounted on the front side surface of the substrate in a scattered manner over the entire surface, provided in a predetermined pattern on the back side surface of the module substrate, and continuous with the metal conductors and through holes. is mounted on the back conductor to overlap the arrangement region of the back conductor, and the module rear face of the component through facing the holes area only together with the semiconductor light emitting element of the substrate Rutotomoni the Comprises electrical components not higher emission than the height of the conductive light emitting device, the back surface of the module substrate so as to dissipate the electrical component from the module substrate with through the component through-hole to the apparatus main body can be achieved The module substrate is fixed to the apparatus main body in contact with the base wall, the front side insulating layer on which the semiconductor light emitting element is mounted to form the front side surface, and the electrical component is mounted to form the back side surface. And a light source module having a size over substantially the entire area of the module substrate and a heat diffusion layer provided between the both insulating layers.

  In the present invention, the base wall portion is a member for supporting the light source module, and the apparatus main body including the base wall portion is preferably made of metal in order to release heat conducted from the light source module. The lower surface opening portion of the apparatus main body may remain open or may be closed with a translucent lighting cover supported by the apparatus main body. In the latter case, the lighting cover may be made of a transparent material, or may be made of a diffusive material that diffuses light emitted from the light source module and makes the light emitting portion less noticeable.

  In the present invention, the module substrate is a member on which a semiconductor light emitting element such as a chip-like LED serving as a point light source is mounted, and is a metal formed by laminating an insulating layer on a metal base having good thermal conductivity such as aluminum. Although it is possible to use a base substrate, on the other hand, a resin substrate mainly composed of a glass epoxy resin, which has a relatively low thermal conductivity but is relatively inexpensive, can be suitably used. Non-metallic substrates such as paper phenolic materials and glass composites can be used, and substrates made of inorganic materials such as ceramics can also be used. Further, the module substrate is preferably formed in a quadrangle, for example, a square or a rectangle in order to arrange the semiconductor light emitting elements at a desired interval. Good.

In this invention, the surface on the front side of the module substrate is a surface located on the front side of the lighting device. When the lighting device is implemented with a lighting cover, this surface is covered with the cover and faces the inner surface (back surface) of the lighting cover, and the lighting device is implemented without the lighting cover. In this case, it is visible through the opening of the apparatus main body. In the present invention, the surface on the back side of the module substrate is a surface on the opposite side to the surface on the front side, and refers to a surface in contact with the base wall of the apparatus main body.
In the present invention, a chip-like LED (light emitting diode), for example, a blue LED emitting blue light can be suitably used as the semiconductor light emitting element. Furthermore, in order to emit white light, it is preferable to combine a phosphor and a blue LED, but instead, a chip-like red LED that emits red light, a chip-like blue LED that emits blue light, and green It is also possible to use a chip group that emits white light by combining chip-shaped green LEDs that emit light. In the present invention, the semiconductor light emitting elements or the chip groups are preferably arranged in a matrix in a scattered manner on the entire module substrate using, for example, COB (Chip on board) technology. Instead, they can be arranged in a staggered pattern, a radial pattern, or the like, interspersed over the entire board according to the shape of the module board.

  In addition, when the semiconductor light emitting element is a blue LED, it is preferable to combine a yellow phosphor that emits yellow light when excited with blue light in order to emit white light. However, in order to improve color rendering properties and the like. A red phosphor or a green phosphor may be mixed in the yellow phosphor. Further, in such a combination of blue LEDs and phosphors, the transparent sealing member such as a transparent silicone resin mixed with the phosphors forms a phosphor layer that fills all the blue LEDs and is laminated on the module substrate. Alternatively, a translucent sealing member in which phosphors are mixed by filling each blue LED or each chip group may be provided. In the latter case, phosphors and transparent members may be provided. The amount of the light sealing member used is small compared to the former case, which is advantageous in that the cost can be reduced.

According to the first aspect of the present invention, the plurality of semiconductor light emitting elements and the non-light emitting electrical components other than these elements are not arranged on the same surface of the module substrate, but are arranged on the front surface of the module substrate. Since the electrical components are arranged on the back surface of the module substrate in such a positional relationship as to overlap with the arrangement area, the size of the module substrate can be reduced. Therefore, it is advantageous when the lighting device is downsized. At the same time, the semiconductor light emitting elements can be arranged in almost the entire area of the module substrate without being affected by the arrangement of the electric parts, so that no darkening occurs due to the arrangement of the electric parts. Thus, the light source module can emit light in a planar shape with uniform brightness. Furthermore, since the electrical component is passed through the component through hole in the base wall portion of the apparatus body that supports the light source module and the light source module is fixed to the apparatus body, the electrical component mounted on the back side of the light source module is obstructed. Therefore, the back surface of the module substrate can be brought into close contact with the base wall. Therefore, good heat dissipation performance from the module substrate to the apparatus main body can be secured by this surface contact.

Furthermore, in the invention of claim 1, the module substrate has a size covering substantially the entire area of the module substrate, a front side insulating layer on which the semiconductor light emitting element is mounted, a back side insulating layer on which the electrical component is mounted, and And a thermal diffusion layer provided between the both insulating layers .

  In the present invention, for the front insulating layer and the back insulating layer, a resin substrate such as a glass epoxy resin, a non-metallic substrate such as a paper phenolic material or a glass composite, or a substrate made of an inorganic material such as ceramics may be used. Is possible. At the same time, in the present invention, the heat diffusion layer can be formed of a metal layer, for example, a copper foil or the like.

In the configuration in which the base wall portion as the heat receiving surface has a component through hole for allowing an electrical component to escape, the heat dissipation performance of the region facing the component through hole of the module substrate is inferior to the others. However, in the invention of claim 1, since the module substrate has a heat diffusion layer having a size over substantially the entire area, the heat transmitted from the semiconductor light emitting element mounted in the region facing the component through hole to the module substrate. Can be diffused to the entire module substrate by the thermal diffusion layer, conducted to the base wall, and released to the outside. Such heat dissipation suppresses the temperature difference between the semiconductor light emitting devices, so that the color unevenness of the light source module caused by the variation in the emission color of each semiconductor light emitting element can be suppressed.
According to a second aspect of the present invention, in the first aspect of the present invention, the semiconductor substrate is attached to the front surface of the module substrate having the same number of holes as the element mounting portion of the module substrate on which the semiconductor light emitting element is mounted. The light source module further includes a white diffuse reflection layer thinner than the thickness of the light emitting element .
According to the present invention, the white light emitted from the light emitting layer of the semiconductor light emitting element is inserted into the surrounding diffuse reflection layer, and is diffusely reflected in the light utilization direction by this diffuse reflection layer. Therefore, the semiconductor light emitting element is a point light source. In spite of high brightness, white light is not concentrated and directly projected directly below them, and the amount of light projected directly below is reduced by the amount of diffuse reflection. At the same time, the periphery of the semiconductor light emitting element emits pseudo light by the diffusely reflected light, and the luminance of the portion is improved.

According to the first aspect of the present invention, it is advantageous for downsizing, and the light source module can emit light in a planar shape with uniform brightness , and further causes variations in emission color of each semiconductor light emitting element. Ru can be suppressed color unevenness of the light source module according to an effect that.

According to the invention of claim 2, in the invention of claim 1, the luminance unevenness of the light source module is alleviated, and uncomfortable glare is improved accordingly, so that the appearance when the illumination device is viewed is improved. There is.

(A) is a side view which shows the illuminating device which concerns on one Embodiment of this invention in the state which cut the part. (B) is a top view which shows the illuminating device which concerns on one Embodiment. It is a front view which shows the illuminating device which concerns on one Embodiment in the state which notched some illumination covers. It is sectional drawing which follows the arrow F3-F3 line | wire in FIG. 1 (B). It is a front view which shows the light source module with which the illuminating device which concerns on one Embodiment is provided. It is a back view which shows the light source module with which the illuminating device which concerns on one Embodiment is provided. It is a front view shown in the state where a part of light source module of Drawing 4 was expanded and a part was notched. (A) is sectional drawing shown along the FA-FA line in FIG. (B) is sectional drawing shown along the FB-FB line in FIG. (C) is sectional drawing shown along the FC-FC line in FIG.

  Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS.

  1-3, the code | symbol 1 has shown the illuminating device. The lighting device 1 is realized as a lighting fixture commonly referred to as a base light, and is directly attached or embedded in a ceiling portion indoors or outdoors, for example, for general lighting. The lighting device 1 includes a device body 2, a lighting device 10, one or more light source modules 11, and a translucent lighting cover 27.

  The apparatus main body 2 includes a main body base 3, a pair of end plates 5, and a main body housing 7, all of which are made of metal. The size of the apparatus main body 2 is, for example, a vertical dimension (vertical dimension) of about 280 mm in FIG. 1B, and a horizontal dimension (horizontal direction) of 850 mm in FIG. 1B.

  As shown in FIGS. 1 to 3, the main body base 3 is composed of a base wall portion 3 a having a square shape, for example, a rectangular shape, a side wall portion 3 b bent obliquely downward from both side edges of the base wall portion 3 a, and the side wall portions. It has a base lower edge portion 3c bent horizontally from the lower end of 3b. For example, a plurality of, for example, quadrangular component through holes 3d are formed in the base wall 3a. The number of component through-holes 3d is the same as the number of light source modules 11 to be described later, and is provided at intervals in the longitudinal direction of the main body base 3 at the same intervals as the arrangement intervals of these light source modules 11. The inner surfaces of the pair of side wall portions 3b are reflecting surfaces and face each other. The pair of side wall portions 3b are inclined so that the distance between their inner surfaces gradually increases as the distance from the base wall portion 3a increases. The base lower edge 3c is bent in a direction approaching each other.

  The end plates 5 are fixed to both ends in the longitudinal direction of the main body base 3 with screws 6, respectively, and the longitudinal ends of the main body base 3 are closed. The inner surfaces of these end plates 5 are also reflective surfaces, and are inclined so that the distance between the inner surfaces gradually increases as the distance from the base wall portion 3a increases. At the same time, the end plate lower edge 5a bent horizontally from the lower ends of the end plates 5 is bent in a direction approaching each other. The end plate lower edge portion 5a and the base lower edge portion 3c are continuous with each other, and are open portions facing the base wall portion 3a, for example, the lower surface open portion 4 facing the base wall portion 3a from below (see FIGS. 3).

  As shown in FIGS. 1A and 3, the main body housing 7 has a rectangular box shape with an open bottom surface. The main body housing 7 is fixed to the upper surface of the main body base 3. That is, as shown in FIGS. 1B and 3, a pair of connecting fittings 8 extending in the same direction as the longitudinal direction of the base wall 3a is fixed to the upper surface of the base wall 3a. A main body housing 7 is disposed between the connection fittings 8, and a lower edge portion of the main body housing 7 is fixed to the connection fitting 8 with screws 9.

  A lighting device 10 for lighting the light source module 11 is fixed to the inner surface of the ceiling wall of the main body housing 7.

  The plurality of light source modules 11 are fixed to the lower surface of the base wall 3a with screws 12 (see FIG. 2). Adjacent light source modules 11 are in contact with each other and are continuous without a gap. As a result, each light source module 11 is disposed over substantially the entire area of the base wall 3a as shown in FIGS. A planar light source unit is formed by the light source modules 11 arranged in this manner.

  Each light source module 11 is a COB (Chip on board) module, which includes a module substrate 14, a metal conductor 15, a white diffuse reflection layer 17, a plurality of semiconductor light emitting elements such as a blue LED (blue light emitting diode) 19, and a light transmitting element. The sealing member 24 is made of a conductive material.

  The module substrate 14 has a quadrangle, for example, a rectangle as shown in FIGS. The module substrate 14 is a multilayer substrate, and includes a front-side insulating layer 31, a back-side insulating layer 32, and a thermal diffusion layer 33, as shown in FIGS. 7A to 7C, for example.

  The front-side insulating layer 31 is a member that forms the front-side surface of the module substrate 14 and is made of an insulating material such as a synthetic resin, specifically, a glass epoxy resin plate. The back-side insulating layer 32 is a member that forms the back-side surface of the module substrate 14, and is the same size as the front-side insulating layer 31 by an insulating material such as a synthetic resin, specifically glass epoxy resin, like the front-side insulating layer 31. Made of the same thickness.

  The thermal diffusion layer 33 is a member disposed in the middle portion in the thickness direction of the module substrate 14. In the present embodiment, the thermal diffusion layer 33 is laminated on the entire surface of one side of the front side insulating layer 31 and the back side insulating layer 32, and the thermal diffusion layer 33 is laminated to form the thermal diffusion layer 33. And the back-side insulating layer 32. Therefore, the thermal diffusion layer 33 is provided over substantially the entire area of the module substrate 14. The heat diffusion layer 33 is made of a metal layer having the same size as the front-side insulating layer 31 and the back-side insulating layer 32, for example, a copper foil thinner than the front-side insulating layer 31 and the back-side insulating layer 32. Moreover, the laminated body which consists of the front side insulating layer 31 and the thermal diffusion layer 33 laminated | stacked on this, and the laminated body which consists of the back side insulating layer 32 and the thermal diffusion layer 33 laminated | stacked on this are the same.

As shown in FIGS. 4 and 5, two end fixing holes 14 a are formed at both longitudinal ends of the module substrate 14, and one central fixing hole 14 b and both sides thereof are formed at the center of the module substrate 14. The through-hole 14c located in is opened. The central fixing hole 14b and the two through holes 14c are arranged in a line, and are used as a dividing starting point when the module substrate 14 is divided into two if necessary. A screw 12 screwed into the base wall 3a is passed through each of the center fixing hole 14b and the end fixing hole 14a. By tightening these screws 12, the module substrate 14 is fixed to the base wall 3a. Yes. Specifically, the module substrate 14 is fixed to the lower surface of the base wall 3a with the front insulating layer 31 disposed on the lower side. By this fixing, the back insulating layer 32 of the module substrate 14 is in close contact with the base wall 3a, and heat can be radiated from the light source module 11 to the apparatus main body 2.

  4, 5, and 7 (C), reference numeral 33 a denotes a first escape hole opened in the thermal diffusion layer 33 to prevent conduction due to contact between the screw 12 and the thermal diffusion layer 33. In FIG. 7B, reference numeral 33b denotes a second escape hole opened in the thermal diffusion layer 33 in order to prevent conduction due to contact between a through hole and a thermal diffusion layer 33, which will be described later.

  As shown in FIGS. 6 and 7A to 7C, a metal conductor 15 is provided in a predetermined pattern on a front surface (that is, a lower surface) 14d of the module substrate 14. The metal conductor 15 is formed by plating gold or nickel and gold on the copper foil mounted on the lower surface 14d in this order. As shown in FIG. 6, the metal conductor 15 is provided in, for example, an element mounting portion 15a having a substantially hexagonal shape, a linear extending portion 15b integrally extending from the element mounting portion 15a, and the element mounting portion 15a. Insulating groove 15c. The width of the insulating groove 15c is wider than the width of the extending portion 15b, and the tip of the insulating groove 15c reaches the substantially central portion of the element mounting portion 15a. An extending portion 15b of the metal conductor 15 disposed adjacent to the insulating groove portion 15c is provided so as to be inserted. As shown in FIG. 4, the element mounting portions 15a of the metal conductors 15 are arranged in a matrix so as to be aligned vertically and horizontally with respect to the module substrate.

  The electrically insulating diffuse reflection layer 17 is made of, for example, a white resist layer, and is provided on the lower surface 14d of the module substrate 14 by printing. The thickness of the diffuse reflection layer 17 is not only much thinner than the module substrate 14 but also thinner than the blue LED 19 described later. The reflectance of the diffuse reflection layer 17 is preferably 85% or more.

  As shown in FIGS. 6 and 7A, the diffuse reflection layer 17 has the same number of holes 17a as the element mounting portions 15a. These holes 17a are provided in the same arrangement as that of each element mounting portion 15a, and are opposed to the central portion of the element mounting portion 15a. Therefore, the metal conductor 15 is covered with the diffuse reflection layer 17 except for the portion facing each hole 17a. Each hole 17a consists of a circular hole, for example. In these holes 17a, as shown in FIG. 6, the distal end portions of the extending portion 15b and the insulating groove portion 15c are located.

  As shown in FIG. 7A, the blue LED 19 is formed by providing a light emitting layer 19b on one surface of an element substrate 19a made of electrically insulating sapphire or the like, and a pair of element electrodes (not shown) is provided on the light emitting layer 19b. Is provided. The blue LED 19 is thicker than the diffuse reflection layer 17.

  These blue LEDs 19 are die-bonded to the element mounting portions 15 a of the respective metal conductors 15 by a die-bonding material 20. The blue LEDs 19 thus mounted on the lower surface 14d of the module substrate 14 are arranged one by one at the center of each hole 17a. Therefore, the blue LEDs 19 are arranged in a matrix in a vertical and horizontal manner according to the arrangement of the holes 17a so as to cover substantially the entire area of the lower surface 14d. The light emitting layer 19 b of each blue LED 19 is disposed below the surface (lower surface) of the diffuse reflection layer 17.

  Each blue LED 19 is electrically connected to the metal conductor 15 in the hole 17a in which it is disposed. That is, as shown in FIGS. 6 and 7A, one element electrode of the blue LED 19 and the element mounting portion 15a are connected via the first bonding wire 21, and the other element electrode of the blue LED 19 is connected. And the extending portion 15 b are connected via the second bonding wire 22. By such connection, the blue LED 19 groups in the left two rows in FIG. 4 are connected in series, the blue LED 19 groups in the middle in FIG. 4 are connected in series, and the blue LEDs 19 in the right two rows in FIG. 4 are connected in series. Yes. These series circuits are electrically connected in parallel by a circuit (not shown) and are fed by the lighting device 10. For this reason, when the lighting device 1 is used, the blue LEDs 19 emit light all at once and are used for illumination.

  As shown in FIG. 4, the blue LED 19 rows arranged in a row in the longitudinal direction of the module substrate 14 are provided at a constant pitch P along the width direction (direction perpendicular to the longitudinal direction) of the module substrate 14. ing. At the same time, the distance L between adjacent edges of the light source modules 11 that are in contact with each other, for example, the side edge 14e in the width direction of the module substrate 14, and the blue LED 19 row arranged closest to the side edge 14e is as follows. , The length of the pitch P is 1/2.

  With this configuration, in the relationship between the adjacent light source modules 11, the blue LED 19 rows positioned on both sides of the side edge 14 e of the module substrate 14 are arranged at the same distance as the pitch P. Thereby, blue LED19 row | line | column is arrange | positioned by the same pitch P over the several light source module 11 continuous mutually (refer FIG. 2). For this reason, there exists an advantage which can suppress that the difference in the brightness of the translucent illumination cover 27 mentioned later and an illumination area comes out compared with the case where the blue LED 19 row | line | column is uneven. At the same time, when the illumination cover 27 described later is transparent and each light source module 11 is visually recognized, the illumination cover 27 is translucent or milky white, and the light emitting unit 18 described later becomes a bright spot in the cover and is subtly reflected. Even if it is a case where it is visually recognized, it is preferable at the point which the space | interval of blue LED 19 row | line | column becomes uneven and is not visually recognized on the appearance of the illuminating device 1. FIG.

  The sealing member 24 is made of a translucent material such as a transparent silicone resin, and a yellow phosphor is mixed in a powder state (not shown). The sealing member 24 is supplied to the holes 17a by potting and hardened. The sealing member 24 fills the central portion of the element mounting portion 15a exposed in the holes 17a and the blue LED 19, and is provided on the lower surface 14d. Yes. The potted sealing member 24 has its root portion dammed up by a hole 17 a and protrudes downward from the lower surface of the diffuse reflection layer 17 in a hemispherical shape.

  Reference numeral 18 in the drawing denotes a light emitting portion, and the light emitting portion 18 includes a sealing member 24 and a blue LED 19 embedded in the sealing member 24. The arrangement of the light emitting portions 18 is the same as that of the blue LED 19. Therefore, the light emitting portions 18 are scattered throughout the entire area of the module substrate 14 and arranged in a matrix. The light emitting units 18 are arranged in the vertical and horizontal directions of the module substrate 14 with an interval of 5 to 20 mm. If the distance between adjacent light emitting portions 18 is less than 5 mm, the light emitting portions 18 having the blue LEDs 19 are in a dense state, the luminous flux per unit area increases excessively, the average luminance increases, and unpleasant glare occurs. It becomes easy to give. If the distance between adjacent light-emitting portions 18 exceeds 20 mm, the number of blue LEDs 19 needs to be increased in order to compensate for the decrease in luminous flux per unit area. Therefore, it is necessary to enlarge the light source module 11. This causes an increase in the size of the lighting device 1.

  In FIG. 4, both ends E of the first series circuit formed by the left two rows of blue LED 19 groups, both ends E of the second series circuit formed by the central two rows of blue LED 19 groups, and the right two rows of blue LED 19 groups. As shown in FIG. 7B, both ends E of the third series circuit formed by are continuously connected to a through hole 34 provided in the module substrate 14 through the substrate in the thickness direction. And the back surface conductor 38 represented by FIG. 7 (B) is provided in the predetermined pattern in the back side insulating layer 32 which makes the back surface of the module board | substrate 14. FIG. Electrical components that are non-light emitting components, such as the electrical connector 35, the capacitor 36, the constant current element, specifically, the constant current diode 37, etc. shown in FIG. 5 are soldered to the back conductor 38 only on the back surface of the module substrate 14. Has been implemented.

  These electrical components occupy a partial area in the center surrounded by the periphery of the module substrate 14 and are arranged together. The region where these electrical components are arranged is a region facing the component through hole 3d by fixing the module substrate 14 to the base wall 3a as described above. Therefore, electrical components such as the electrical connector 35, the capacitor 36, and the constant current diode 37 are passed through the component through-hole 3d as shown in FIG. In this way, since the light source module 11 is fixed to the base wall 3a of the apparatus main body 2 through the electrical parts through the component through-hole 3d, the electrical components mounted on the back side of the light source module 11 are not hindered. The light source module 11 can be fixed in a state where the light source module 11 is in surface contact with the base wall 3 a of the apparatus main body 2.

  The module substrate 14 having the above configuration is screwed to the base wall portion 3a so that the longitudinal direction thereof coincides with the direction orthogonal to the longitudinal direction of the apparatus main body 2. At the same time, as shown in FIGS. 2 and 3, the side edges 14e (see FIGS. 4 and 5) of the adjacent module substrates 14 are in contact with each other. Thereby, each module substrate 14 is continuously arranged in the longitudinal direction of the apparatus main body 2 without a gap.

  The illumination cover 27 is supported by the apparatus main body 2 by closing the lower surface opening portion 4 and covers the light source module 11 from below. The illumination cover 27 is supported by the apparatus main body 2 with its peripheral portion placed on the base lower edge portion 3 c of the main body base 3 and the end plate lower edge portion 5 a of the end plate 5. The lighting cover 27 may be any of a transparent lighting cover having a diffusivity that is negligibly small, a milky white lighting cover having a high diffusivity, or a translucent lighting cover having a lower diffusivity than the milky white lighting cover. 1 is selected according to the usage environment.

  In the light source module 11 included in the lighting device 1 having the above-described configuration, the plurality of blue LEDs 19 and the electrical connector 35, the capacitor 36, and the constant current diode 37, which are other electrical components that do not emit light, are disposed on the same surface of the module substrate 14. However, each blue LED 19 is arranged on the front side surface of the module substrate 14, and the electrical components are arranged on the back side surface of the module substrate 14 in a positional relationship so as to overlap the arrangement region of the blue LEDs 19.

  Therefore, the size of the module substrate 14 is reduced as compared with the case where each blue LED 19 and the non-light emitting electrical component are arranged on the same surface of the module substrate 14, and thus the light source module 11 having such a module substrate 14 is provided. This is advantageous when the lighting device 1 in which a plurality of light sources are arranged to form a planar light source unit is downsized.

  Further, when the lighting device 1 having the above-described configuration is turned on, the blue LEDs 19 included in the light emitting units 18 emit blue light all at once, and the lower space of the lighting device 1 is illuminated. That is, when a part of blue light emitted from the light emitting layer 19 b of the blue LED 19 is transmitted through the sealing member 24, the yellow phosphor contained in the sealing member 24 is excited. Therefore, the yellow light generated by excitation and the blue light that has not excited the phosphor in the light emitted from the light emitting layer 19b are mixed to produce white light. Then, the white light is emitted downward from the light emitting unit 18 and further passes through the translucent illumination cover 27 to illuminate the lower part of the illumination device 1 which is the light utilization direction.

  By the way, since each blue LED 19 and other electrical components are separately arranged on the front and back of the module substrate 14 with respect to the module substrate 14 as described above, the plurality of blue LEDs 19 with respect to the front surface of the module substrate 14 are arranged. The arrangement is not affected by the arrangement of the electric components, that is, the electric connector 35, the capacitor 36, and the constant current diode 37 with respect to the back surface of the module substrate 14. As a result, as the blue LEDs 19 can be arranged in almost the entire area of the module substrate 14, the brightness of each part of the light source module 11 that emits light in a planar shape becomes dark due to the arrangement of the electrical components. It can be prevented from occurring. Therefore, in the illumination, the light source module 11 can emit light in a planar shape with uniform brightness.

  The module substrate 14 provided in the lighting device 1 has a white diffuse reflection layer 17 deposited on the lower surface 14d thereof, and the thickness of the diffuse reflection layer 17 is thinner than the thickness of the blue LED 19 mounted on the lower surface 14d. . During lighting of the lighting device 1, light is emitted from the light emitting layer 19 b of the blue LED 19 in all directions.

  For this reason, white light produced by the light emitting portion 18 by light emitted obliquely upward from the light emitting layer 19b is inserted into the diffuse reflection layer 17 around the light emission portion 18, and the diffuse reflection layer 17 in the light utilization direction. It is diffusely reflected in a certain downward direction. Thereby, although each light emitting part 18 having the blue LED 19 and the sealing member 24 in which the blue LED 19 is embedded is a point light source and high brightness, white light is concentrated and directly projected directly below them. Accordingly, the amount of light projected directly below the light emitting unit 18 is reduced by the amount of diffuse reflection. At the same time, the light diffusely reflected around each light emitting portion 18 causes pseudo light emission around the light emitting portion 18 and the luminance of the portion is improved.

  Accordingly, the luminance unevenness of the light source module 11 in which the plurality of point-like light emitting units 18 are arranged in a matrix is alleviated, and uncomfortable glare is improved accordingly, so that the appearance when the lighting device 1 is visually recognized is improved.

  When the illumination cover 27 of the illumination device 1 has diffusibility due to the reduction in luminance unevenness in the light source module 11, each light emitting unit 18 is clearly reflected on the illumination cover 27 as a high brightness point. Is suppressed. In other words, the light emitting units 18 are not easily viewed as “collapsed” through the illumination cover 27, so that the appearance of the illumination device 1 can be improved.

  In addition, as described above, the unevenness in luminance caused by the plurality of point light emitting portions 18 included in the light source module 11 can be alleviated with the configuration of the light source module 11 itself as described above. 27, it is not necessary to take responsibility exclusively, and the luminance unevenness mitigating performance required for the illumination cover 27 can be reduced. For this reason, it is possible to use the illumination cover 27 having a low diffusivity even in the illumination device 1 used in a usage environment in which luminance unevenness is a problem. Accordingly, the loss of light quantity in the lighting cover 27 is reduced, and the reduction in the efficiency of the lighting device 1 due to the lighting cover 27 can be reduced.

  In addition, since the luminance unevenness caused by the plurality of point-like light emitting portions 18 included in the light source module 11 can be reduced by the configuration of the light source module 11 as described above, in the lighting device 1 including the diffusive lighting cover 27, Since the illumination cover 27 disposed opposite to the planar light source unit from below can be disposed closer to the light source unit, the illumination device 1 can be made thin. If the illumination cover 27 is arranged at a large distance from the planar light source unit without reducing the thickness, reflection of the plurality of light emitting units 18 on the illumination cover 27 is further blurred. The feeling of “crushing” due to uneven brightness at 27 can be further alleviated.

  Moreover, since the lighting device 1 having the above-described configuration uses a yellow phosphor as the phosphor, each light emitting unit 18 including the phosphor and a light-transmitting sealing member 24 mixed with the phosphor is yellow. However, since the light emitting portions 18 are scattered in a matrix and are distributed over the entire module substrate 14, the entire module substrate 14 does not exhibit a yellow color. For this reason, when the module substrate 14 is visually recognized through the translucent illumination cover 27, the illumination device 1 is strongly yellowish and difficult to be visually recognized in the extinguishment state or the like, so that the merchantability of the illumination device 1 is improved. There are advantages you can do.

  On the other hand, in the structure which covers the whole lower surface of the light source module 11 with the translucent sealing member 24 mixed with the yellow phosphor, both the usage amount of the phosphor and the usage amount of the sealing member 24 are large. The cost of the lighting device 1 is high because the material is not inexpensive. However, as described above, the light emitting units 18 are scattered in a matrix and are distributed over the entire module substrate 14, so that the usage amount of the phosphor and the usage amount of the sealing member 24 are greatly increased. The cost can be reduced.

  Further, each blue LED 19 generates heat while the lighting device 1 is turned on. Most of the heat is transmitted to the element mounting portion 15a and diffused corresponding to the area of the element mounting portion 15a, and is transmitted from the element mounting portion 15a to the heat diffusion layer 33 through the front insulating layer 31. After being diffused over the entire area of the module substrate 14 by the heat diffusion layer 33, it is transmitted to the base wall portion 3 a that is in surface contact with the back side insulating layer 32 through the back side insulating layer 32, and from each part of the apparatus main body 2 to the outside. Released. In this case, as described above, the electrical components on the back surface side of the light source module 11 are not obstructed, and the back surface of the module substrate 14 is in close contact with the lower surface of the base wall portion 3a, which is a heat receiving surface. By this surface contact, good heat dissipation performance from the module substrate 14 to the apparatus main body 2 can be secured.

  As described above, since the heat of each blue LED 19 can be efficiently released to the metal device body 2 via the module substrate 14 having the thermal diffusion layer 33, the temperature increase of each blue LED 19 is suppressed, and each blue LED 19 It is possible to suppress a decrease in light emission efficiency and a change in light emission color in the LED 19.

  Further, the heat dissipation performance of the area of the module substrate 14 facing the component through hole 3d of the base wall 3a is inferior to the portion not facing the component through hole 3d. However, since the module substrate 14 has the heat diffusion layer 33 having a size over substantially the entire area, the heat released to the module substrate 14 from the blue LED 19 mounted in the region facing the component through-hole 3d is already generated. As described above, the heat diffusion layer 33 can quickly diffuse the entire module substrate 14, and can then be conducted to the base wall 3 a and discharged to the outside. Therefore, as the temperature difference between the blue LEDs 19 mounted on the light source module 11 is suppressed, the color unevenness of the light source module 11 due to the variation in the emission color of each blue LED 19 can be suppressed.

DESCRIPTION OF SYMBOLS 1 ... Illuminating device, 2 ... Apparatus main body, 3a ... Base wall part, 3d ... Component through-hole, 4 ... Lower surface open part (open part), 11 ... Light source module, 14 ... Module substrate, 14d ... Lower surface (front side) of a module substrate 15 ... metal conductor, 15a ... element mounting part, 17 ... diffuse reflection layer, 17a ... hole, 18 ... light emitting part, 19 ... blue LED (semiconductor light emitting element), 19a ... element substrate, 19b ... light emitting layer, 24 ... Sealing member, 31 ... Front side insulating layer, 32 ... Back side insulating layer, 33 ... Thermal diffusion layer, 34 ... Through hole, 35 ... Connector (electrical component), 36 ... Capacitor, 37 ... Constant current diode (electrical component) , 38 ... Back conductor

Claims (2)

A metal device main body having a base wall portion in which component through holes are formed and an open portion facing the wall portion;
Module board, metal conductor provided in a predetermined pattern on the front side surface of the board, and electrically connected to the metal conductor and mounted on the front side surface of the module board in a scattered manner over the entire surface. A plurality of semiconductor light emitting devices , a back conductor provided in a predetermined pattern on the back surface of the module substrate and continuous with the metal conductors through holes, and the component through-holes on the back surface of the module substrate provided with the mounted on the rear surface conductor Rutotomoni the semiconductor light emitting no higher emission than the height electrical components of the device as collectively only in the region overlapping the arrangement region of the semiconductor light emitting element, holes through the electrical component wherein the component the contact of the back surface of the module substrate as heat dissipation to the apparatus main body from the module substrate is made possible to the base wall portion instrumentation with through the Fixed to the body, said module substrate, wherein the front dielectric layer semiconductor light emitting element is mounted to form the front surface, and the back side insulating layer in which the electrical components to form the surface of the back side is mounted, wherein the module substrate A light source module having a size over substantially the entire area and a heat diffusion layer provided between the two insulating layers;
An illumination device comprising: A white diffuse reflection layer having the same number of holes as the element mounting portion of the module substrate on which the semiconductor light emitting element is mounted and being attached to the front side surface of the module substrate and being thinner than the thickness of the semiconductor light emitting element, The lighting device according to claim 1, further comprising a light source module .

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