JP5337620B2 - Workpiece adhesive holding device and vacuum bonding machine - Google Patents

Description

  The present invention relates to a glass substrate such as CF glass or TFT glass or PES (Poly-Ether-Sulphone) in the manufacturing process of a flat panel display such as a liquid crystal display (LCD), a plasma display (PDP), and a flexible display. Substrate assembling apparatus including a substrate laminating machine that detachably holds and attaches a plate-shaped workpiece such as a synthetic resin substrate made of plastic film, etc., an insulator such as a substrate, a conductor or a semiconductor wafer, etc. The present invention relates to a workpiece adhesive holding device used for a substrate transfer device for transferring a plate-shaped workpiece (object to be processed), and a vacuum bonding machine using the same.

Conventionally, as this kind of work pressure-sensitive adhesive holding device and vacuum bonding machine, a pressure-sensitive adhesive sheet that is a pressure-sensitive adhesive member of a substrate holding mechanism on a table and a push shaft provided as a plurality of peeling mechanisms for peeling the pressure-sensitive adhesive sheet from the substrate surface (pushing) The lower substrate that is carried in by a robot or the like is fixed by adhering with an adhesive sheet on the table, and the upper and lower substrates after bonding are lifted from the table and pushed off from the adhesive sheet. There are some (see, for example, Patent Document 1).
Also, a concave portion is formed on the substrate side surface of the holding plate, and the opening of the concave portion is hermetically covered with a deformable film made of an elastically deformable diaphragm such as a metal thin plate or rubber, and holds the adhesive facing the substrate. The pressure-sensitive adhesive member is evacuated and decompressed by introducing a gas or introducing a gas to cause the deformed film to appear and retract, thereby bringing the surface of the pressure-sensitive adhesive member into contact with the substrate and holding both of them together. In some cases, the substrate is peeled away from the surface of the adhesive member (see, for example, Patent Document 2).

JP 2003-283185 A Japanese Patent No. 3882004

However, in such a conventional workpiece adhesive holding device and vacuum bonding machine, when a plurality of push shafts are used as a peeling mechanism as in Patent Document 1, the adhesive action portion where the substrate and the adhesive member are adhered to each other is used. The area of the peeling action part by the push shaft with respect to the area is a very small part, and the peeling action due to the deformation of the substrate caused by the concentrated pressing of the push shaft reaches the adhesive action part away from the push shaft. Therefore, it is easy to bend around the pressed part of the substrate, and when both substrates that have been pasted together are partially pressed with the push shaft and peeled off from the adhesive member, the misalignment occurs at the pressed part of both substrates. A slight misalignment not only causes light leakage, but in the worst case, the substrate may be damaged due to partial pressing by the push shaft. .
Also, in Patent Document 2, when the deformed film made of a diaphragm is inflated and both substrates that have been bonded together are pushed away from the adhesive member, variations in the expansion direction and the expansion amount of the diaphragm are likely to occur. When part of the combined substrates is partially pressed in accordance with the expansion of the diaphragm, there is a problem that the pressed portion may be bent and misalignment between the substrates may occur.
Furthermore, when the substrate that is adhesively held on the lower holding plate is arranged so as to be peeled upward by the deformation of the diaphragm, the diaphragm hangs down due to gravity and sticks to the bottom surface of the recess in the free state that is not deformed. Then, it becomes difficult to be deformed upward, and there is a possibility that repeated sticking and peeling cannot be performed stably.

An object of the present invention is to deal with such a problem.
That is, the present invention performs the adhesion and peeling with the plate-like workpiece while avoiding deformation of the plate-like workpiece as much as possible in order to eliminate the problem of the peeling means due to the push shaft and the diaphragm, and the position of the adhesive pad. To maintain the same in a stable state, to make an adhesive chuck at low cost, and to repeatedly and stably perform adhesion and peeling in conjunction with loading and unloading of a plate-like workpiece. .

In order to achieve such an object, the present invention includes a holding plate, and an adhesive chuck that is disposed on the surface side of the holding plate and detachably adheres and holds a plate-like workpiece. A plurality of adhesive pads arranged opposite to the plate-like workpiece, and formed so as to follow the plate-like workpiece continuously on the back surface of the adhesive pad, and the adhesive chuck can be moved in a direction facing the plate-like workpiece. A support plate that is supported by the pressure pad, an adsorbable groove that is adjustable so as to be opposed to the plate-like workpiece adjacent to the adhesive pad, and is opposed to the plate-like workpiece continuously from the back surface of the support plate. A pressure-adjustable chamber formed around the support column and adjustable in pressure, and the suction groove has a negative pressure, whereby the adhesive pad is formed into the plate shape. Compressed from both sides of workpiece and support plate The adhesive pad and the surface of the plate workpiece are brought into contact with each other, and the pressure adjusting chamber becomes negative pressure, so that the support column is compressed so that the adhesive pad is separated from the surface of the plate workpiece. It is characterized by that.
In addition to the above-described features, the support column is formed of an elastically deformable material, and the support column is arranged so that the adhesive pad approaches the surface of the holding plate except during negative pressure in the pressure adjusting chamber. It is characterized by extending.
Further, in addition to the above-described features, the support plate and the support pillar are integrally formed of a material that can be elastically deformed.
Further, in addition to the above-described features, a suction unit that communicates with the suction groove, an atmospheric pressure adjustment unit that communicates with the pressure adjusting chamber, and a control unit that controls the operation of each of the suction unit and the atmospheric pressure adjustment unit. The suction means is operated to bring the suction groove into a negative pressure after the plate-like work is carried in, and the pressure adjusting chamber is made to be a negative pressure by the air pressure adjusting means just before the plate-like work is carried out. It is characterized by.
Also, the workpiece adhesive holding device having the above-described features is provided on either one or both of a pair of opposing holding plates, and the workpiece adhesive holding device adheres and holds the plate-like workpiece in a vacuum. It is characterized by being bonded to a workpiece.

In the present invention having the above-described features, the suction pad and the support plate are moved to the plate-shaped workpiece side by applying a vacuum to the plate-shaped workpiece by setting the suction groove to a negative pressure, and the plate-shaped workpiece is deformed. The pressure-sensitive adhesive pad is compressed from both sides of the plate-shaped workpiece and the support plate, and the surface of the plate-shaped workpiece is brought into contact with and firmly adhered to the pressure-sensitive adhesive pad. The space around the support column is evacuated to compress the support column in a direction away from the surface of the plate-like work as the volume of the support column tends to shrink, and the adhesive pad moves in the same direction via the support plate. Therefore, it can be peeled off from the surface of the plate-like workpiece without difficulty, so that adhesion and peeling from the plate-like workpiece can be reliably performed.
As a result, the plate-like workpiece can be accurately and smoothly peeled from the holding plate without causing displacement or damage, and repeated and stable adhesion and peeling can be realized.

  Further, when the support column is formed of an elastically deformable material and the support column is extended so that the adhesive pad approaches the surface of the holding plate except when the pressure adjustment chamber is under negative pressure, the pressure adjustment chamber The support column is elastically compressed and deformed in a direction away from the surface of the plate-shaped workpiece by making the pressure negative, but the support column is not compressed more than necessary, so the inner surface of the support plate is the opposite surface of the pressure adjustment chamber Without releasing the negative pressure of the pressure adjusting chamber and releasing it to the atmosphere, the shape of the support column is elastically restored and returns to the state before compression deformation, so the position of the adhesive pad is the same Can be kept stable.

  Furthermore, when the support plate and the support column are integrally formed of a material that can be elastically deformed, the support plate and the support column are integrally formed including the suction groove and the pressure adjusting chamber by a single mold forming. Can be created at low cost.

  Furthermore, a suction means that communicates with the suction groove, an atmospheric pressure adjustment means that communicates with the pressure adjusting chamber, and a control means that controls the operation of each of the suction means and the atmospheric pressure adjustment means, the control means is configured to perform suction after the plate-like workpiece is loaded. When the suction groove is made negative by operating the means and the pressure adjusting chamber is made negative by operating the air pressure adjusting means immediately before carrying out the plate-like workpiece, an adhesive pad is placed on the surface of the loaded plate-like workpiece. Since the adhesive pad is peeled off from the plate-like workpiece immediately before being brought out, adhesion and peeling can be repeatedly and stably performed in conjunction with the loading and unloading of the plate-like workpiece.

In addition, a workpiece adhesive holding device having the above-described features is provided on either or both of a pair of opposing holding plates, and the workpiece adhesive holding device adheres and holds the plate-like workpiece in a vacuum. When bonding to plate-shaped workpieces, the adhesive chuck device will forcefully peel the adhesive pad from the surface of both plate-shaped workpieces that have been bonded together with high accuracy. Misalignment can be prevented.
Accordingly, malfunctions such as light leakage can be reduced and yield can be improved.

It is a partial longitudinal section front view showing a work adhesion holding device concerning one embodiment of the present invention, (a) shows at the time of work adhesion, (b) shows at the time of work exfoliation, and (c) is after exfoliation. Indicates the time of restoration. 2A is a cross-sectional plan view of FIG. 1A, in which FIG. 1A is a partial cross-sectional plan view along line (2A)-(2A), and FIG. 1B is a part along line (2B)-(2B). FIG. It is a partial vertical front view which shows the workpiece adhesion holding apparatus which concerns on other embodiment of this invention, (a) shows the time of workpiece | work adhesion, (b) shows the time of workpiece peeling, (c) is after peeling Shows the restoration time. BRIEF DESCRIPTION OF THE DRAWINGS It is a partial reduction | decrease vertical front view which shows the vacuum bonding machine which concerns on one Example of this invention, (a) shows the time of workpiece | work adhesion, (b) shows the time of workpiece | work peeling, (c) is after peeling. Shows the restoration time.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
As shown in FIGS. 1 to 3, the workpiece adhesive holding device A according to the embodiment of the present invention is disposed on the holding plate 1 and the surface 1 a of the holding plate 1 and detachably adheres to the plate-like workpiece W. The plate-like workpiece W is detachably adhered to the holding plate 1 by the adhesive chuck 2.

  As shown in FIGS. 1 and 2, the adhesive chuck 2 is formed so as to be along the plate-like workpiece W continuously with the adhesive pads 2 a arranged opposite to the plate-like workpiece W and the back surface of the adhesive pad 2 a. And a support plate 2b that supports the adhesive pad 2a so as to be movable in a direction opposite to the plate-like workpiece W, and an adsorption capable of adjusting the pressure formed adjacent to the adhesive pad 2a and facing the plate-like workpiece W. A support column 2d formed to be able to expand and contract in the direction facing the plate-like workpiece W continuously from the groove 2c and the back surface of the support plate 2b, that is, the thickness direction of the support plate 2b, and a partition formed around the support column 2d And a pressure regulating chamber 2e capable of adjusting the atmospheric pressure.

  As shown in FIGS. 1 (a) and 2 (a), the adhesive pads 2a are arranged at predetermined intervals across the suction groove 2c, and an adhesive surface 2a1 is formed on the surface facing each plate-like workpiece W. The adhesive surface 2a1 is arranged so as to be substantially flush with the surface 1a of the holding plate 1.

The support plate 2b is formed in a flat plate shape so as to be continuous with the back surface of the plurality of adhesive pads 2a, that is, the surface opposite to the adhesive surface 2a1, and to cover the whole or substantially the entire adhesive chuck 2.
Furthermore, the support plate 2b has means for supporting the adhesive pad 2a so as to be movable in the direction facing the plate-like workpiece W, that is, in the thickness direction of the support plate 2b.
As an example of this means, a part or all of the support plate 2b is formed of a material that can be elastically deformed and elastically deformed in the thickness direction of the support plate 2b, whereby the adhesive pad 2a has a thickness of the support plate 2b. It can be reciprocated in the direction.
As another example, the support plate 2b is formed of a rigid material, and its end is supported to the holding plate 1 so as to be movable in the thickness direction of the support plate 2b. It is also possible to reciprocate in the thickness direction 2b.

A suction groove 2c is provided between the adhesive pads 2a so that the plurality of adhesive pads 2a are respectively surrounded by the suction grooves 2c, and between the surface W1 of the plate-like workpiece W and the support plate 2b. An airtight space is formed.
The pressure-sensitive adhesive surface 2a1 of the pressure-sensitive adhesive pad 2a is preferably disposed so as to be slightly recessed from the surface 1a of the holding plate 1 in a state where no pressure is applied to the support plate 2b.
The suction groove 2c communicates with a suction hole 2f formed so as to extend in the thickness direction of the support plate 2b.
The suction hole 2f opens through the outer peripheral portion of the adhesive chuck 2 so that one end thereof faces the plate-like workpiece W, and the other end communicates with a suction means 3 described later.

The support column 2d is continuous in the thickness direction of the support plate 2b from the back surface of each portion of the support plate 2b on which the adhesive pad 2a surrounded by the suction groove 2c is formed by an elastically deformable material such as an elastomer, for example. The pressure adjusting chamber 2e is recessed around the support column 2d, and the pressure-sensitive adhesive surface 2a1 of the pressure-sensitive adhesive pad 2a is held by the holding plate except when negative pressure is applied to the pressure adjusting chamber 2e. The support column 2d is extended so as to be close to the surface 1a of 1.
The pressure regulating chamber 2e communicates with a vent 2g formed so as to extend in the thickness direction of the support plate 2b.
The air hole 2g communicates with the atmospheric pressure adjusting means 4 described later.

The adhesive pad 2a, the support plate 2b, and the support column 2d are all integrally formed of an elastically deformable material such as an elastomer, or are formed of individual materials.
As an example, at least the support plate 2b and the support column 2d are formed of elastic materials having different elastic moduli, and all of them including the adhesive pad 2a are integrated by adhesion or the like as necessary.
As another example, it is also possible to form only the support column 2d from an elastic material and to integrate them by adhesion such as adhesion, including the adhesive pad 2a as necessary.
In this way, when at least the support plate 2b and the support column 2d are formed as separate members, the expansion and contraction of all the support columns 2d can be performed regardless of the material of the support plate 2b by changing the material and shape of the support column 2d. The amount and the amount of expansion / contraction of the arbitrary support column 2d can be adjusted.

Further, in the illustrated example, as shown in FIGS. 1A and 2A and 2B, the support plate 2b is formed in a disc shape, and the entire shape of the adhesive chuck 2 including the support plate 2b is circular. It is said.
The surface of the support plate 2b is formed as an adhesive pad 2a except for the outer peripheral portion thereof, and suction grooves 2c are formed in a plurality of annular shapes, and the annular suction grooves 2c are connected to each other by a cross-shaped suction groove 2c. doing.
As another example, the entire shape of the adhesive chuck 2 including the support plate 2b can be changed to an ellipse, a rectangle, a polygon, or the like, or the adhesive pad 2a can be partitioned into a rectangle or a polygon by the suction groove 2c. It is.

An outer peripheral ring 2h made of a non-adhesive material such as metal is preferably provided on the outer peripheral portion of the adhesive chuck 2 so as to face the plate-like workpiece W so as to surround the adhesive pad 2a. As a result, the plate-like workpiece W can be easily peeled off. In particular, when the metal outer ring 2h is fixed, the plate-like workpiece W is not easily deformed at the time of peeling, so that it is further easily peeled off.
Further, a suction hole 2f communicating with suction means 3 described later is opened in the outer ring 2h so as to face the surface W1 of the plate-like workpiece W.
In the illustrated example, the outer peripheral ring 2h is fixed to the outer peripheral portion of the support plate 2b so as to protrude toward the plate-like workpiece W.
As another example, a layer such as a thin film made of a non-adhesive material may be formed instead of the outer peripheral ring 2h, or a recess may be formed without arranging anything on the outer peripheral portion of the adhesive chuck 2.

A support substrate 2i is provided on the end side of the support column 2d, and the adhesive chuck 2 is formed by integrally stacking the support substrate 2i and the support plate 2b so that the support column 2d is sandwiched therebetween. It is preferable to form a unit and to disperse the unit with respect to the holding plate 1 at appropriate intervals.
In the illustrated example, a concave portion 1b is formed at an appropriate position on the surface 1a of the holding plate 1, and the adhesive chuck 2 is accommodated in the concave portion 1b by inserting the unit into the concave portion 1b.
The support substrate 2i has a vent hole 2g that communicates the pressure regulating chamber 2e and a pressure adjusting means 4 described later.

The suction means 3 that communicates with the suction groove 2c and the atmospheric pressure adjustment means 4 that communicates with the ventilation hole 2g include, for example, a vacuum pump or a compressor. The suction means 3 and the atmospheric pressure adjustment means 4 are operated by a control means B described later. It is preferable to control.
The control means B is a controller that is electrically connected to the suction means 3, the atmospheric pressure adjustment means 4, the workpiece transfer means C described later, and the like, and is operated in conjunction with the workpiece transfer means C described later according to a preset program. 3. It is preferable to control the operation of the atmospheric pressure adjusting means 4 respectively.

  The workpiece transfer means C is composed of a transfer robot that detachably holds the plate-like workpiece W with, for example, a suction pad, and the plate-like workpiece W is adhered to the holding plate 1 and the adhesive from outside the area where the holding plate 1 is provided. It carries in toward the chuck | zipper 2, and is comprised so that the plate-shaped workpiece | work W may be carried out toward an external area | region from the holding plate 1a after that.

  As an example of the control of the suction means 3 and the atmospheric pressure adjustment means 4 by the control means B, the control means B performs the suction by starting the operation of the suction means 3 after loading the plate-like workpiece W by the work transfer means C. Vacuum suction is performed from the hole 2f to make the suction groove 2c have a negative pressure, and then the vacuum suction by the suction means 3 is stopped to return the suction hole 2f to the atmospheric state, immediately before the plate-like workpiece W is unloaded by the workpiece transfer means C. By starting the operation of the atmospheric pressure adjusting means 4, vacuum suction is performed from the air vent 2 g to make the pressure adjusting chamber 2 e negative, and after the plate-like workpiece W is carried out by the work transfer means C, the vacuum suction by the atmospheric pressure adjusting means 4 is stopped. Thus, the ventilation hole 2g is returned to the atmospheric state.

In such an embodiment, as shown in FIG. 1A, first, when the plate-like workpiece W is carried into the holding plate 1 and the adhesive chuck 2 by the workpiece transfer means C, the surface 1 a of the holding plate 1 is applied. Then, the suction means 3 is started to operate, and suction is performed from one end opening of the suction hole 2f, and the suction groove 2c is set to a negative pressure so that the surface W1 of the plate-like workpiece W is placed between the support plate 2b. (Airtight space) reaches a predetermined degree of vacuum.
Thereby, the surface W1 of the plate-like workpiece W is sucked and held on the outer peripheral portion of the adhesive chuck 2 or the outer peripheral ring 2h fixed thereto.
At the same time, the adhesive pad 2a and the support plate 2b move to the plate-like workpiece W side to suppress the deformation of the plate-like workpiece W as much as possible, and the adhesive pad from both sides of the plate-like workpiece W and the support plate 2b. 2a is compressed in the direction facing the plate-like workpiece W, that is, in the thickness direction of the support plate 2b. Along with this, the adhesive pad 2a and the support plate 2b are elastically deformed or moved in parallel, so that the surface W1 of the plate-like workpiece W comes into contact with the adhesive pad 2a, and both of them are securely adhered.

Thereafter, the suction means 3 stops operating, vacuum suction from one end opening of the suction hole 2f is stopped, and the suction hole 2f and the suction groove 2c return to the atmospheric state.
However, in this state, the suction holding of the plate-like workpiece W by suction is released from one end opening of the suction hole 2f, but the adhesive surface 2a1 of the adhesive pad 2a is adhered to the surface W1 of the plate-like workpiece W. The plate-like workpiece W is not displaced relative to the surface 1a of the holding plate 1.

Then, immediately before the plate-like workpiece W is carried out by the workpiece transfer means C, as shown in FIG. 1B, the air pressure adjusting means 4 starts to operate, and the pressure adjusting chamber 2e is opened by vacuum suction from the vent hole 2g. Use negative pressure.
As a result, the space around the support column 2d is evacuated, the entire support plate 2b is pulled toward the support substrate 2i in an attempt to shrink its volume, and the support column 2d moves away from the surface W1 of the plate-like workpiece W. As a result, the adhesive pad 2a moves in the same direction via the support plate 2b, and the adhesive surface 2a1 is peeled off from the surface W1 of the plate-like workpiece W without difficulty.
At this time, since the support column 2d is not compressed more than necessary, the inner surface 2b 'located on the pressure regulating chamber 2e side of the support plate 2b adheres to the opposing surface 2e' of the pressure regulating chamber 2e, causing malfunction. Nor.

Thereafter, when unloading of the plate-like workpiece W by the workpiece transfer means C is completed, as shown in FIG. 1 (c), the operation of the atmospheric pressure adjusting means 4 is stopped, the vacuum suction from the vent hole 2g is stopped, and the adjustment is performed. The pressure chamber 2e returns to the atmospheric state.
As a result, the surrounding space of the support column 2d expands and deforms in a direction in which the support column 2d approaches the surface W1 of the plate-like workpiece W in an attempt to expand its volume, and the shape of the support column 2d is elastically restored accordingly. Then, the support plate 2b and the adhesive pad 2a move toward the surface 1a of the holding plate 1, and the adhesive surface 2a1 of the adhesive pad 2a moves to near the extension line of the surface 1a, returning to the initial state.
Thereafter, the above-described operation is repeated.

  Therefore, according to such an embodiment, the plate-like workpiece W can be securely held to be adhered, and can be reliably peeled off from the plate-like workpiece W.

Further, in the illustrated example, as shown in FIGS. 2A and 2B, the support columns 2d are arranged so that the substantially center positions of the adhesive pads 2a surrounded by the suction grooves 2c are supported by the plurality of support columns 2d, respectively. Has been.
As another example, when the area of the adhesive pad 2a is relatively small, the adhesive pad 2a surrounded by the suction groove 2c is disposed so as to be supported by only one support column 2d, If any part of the adhesive pad 2a surrounded by the suction groove 2c is supported by the support pillar 2d, for example, as shown in FIGS. 3A to 3C, it is related to the arrangement of the suction groove 2c. Alternatively, the support columns 2d may be arranged at equal intervals.
Even in such a case, the same effect as the above-described embodiment can be obtained.
Next, an embodiment of the present invention will be described with reference to the drawings.

  In this embodiment, as shown in FIGS. 4 (a) to 4 (c), a pair of holding plates 1 and 1 'that are vertically opposed to each other is used as a plate-like work W such as a liquid crystal display (LCD), a plasma display (PDP), A workpiece according to an embodiment of the present invention is applied to a vacuum laminating machine that detachably adheres and holds a glass substrate or a plastic film substrate used for a panel such as a flexible display and bonds these two substrates W and W ′ to each other. The case where the adhesion holding device A is incorporated is shown.

  This vacuum bonding machine is a parallel surface 1a, 1a of a pair of upper and lower holding plates 1, 1 'formed of a platen having a thickness that does not deform (bend) with a rigid body such as metal or ceramics. ', The upper and lower substrates W, W' are detachably held, and the upper and lower holding plates 1, 1 'are relatively moved after the inside of the closed space D defined by the surroundings reaches a predetermined degree of vacuum. Adjusting and moving in the XYθ direction (horizontal direction), the substrates W and W ′ are aligned with each other, and then at least one of the substrates W and W ′ is placed on the surfaces 1 a and 1 a of the upper and lower holding plates 1 and 1 ′. After peeling from one of 1a 'and overlapping, a vacuum break in the closed space D is performed, and a predetermined gap is formed between the substrates W and W' due to a pressure difference generated between the inside and outside of the substrates W and W '. To pressurize.

  More specifically, as shown by the solid line in FIG. 4A, the upper and lower holding plates 1 and 1 'are supported by a lifting means (not shown) so as to be relatively movable in the Z direction (up and down direction). In the atmosphere of atmospheric pressure, with the upper and lower holding plates 1 and 1 'separated in the vertical direction, the substrates W and W' are carried in from the outside of the vacuum bonding machine by the work transfer means C toward the respective surfaces 1a and 1a '. The upper and lower holding plates 1 and 1 'are set and held on the surfaces 1a and 1a', respectively.

  After the substrates W and W 'are set by the work transfer means (B), the upper and lower holding plates 1 and 1' are moved closer to each other by the operation of the elevating means described above, as shown by the two-dot chain line in FIG. By moving, a closed space D is defined between them.

  Subsequently, when the air is exhausted from the closed space D by the operation of the intake means (not shown) to reach a predetermined vacuum level, the upper and lower holding plates 1 are operated by the operation of the horizontal moving means (not shown). , 1 ′ is adjusted and moved in the XYθ direction with respect to the other, so that rough alignment and fine alignment are sequentially performed as alignment between the substrates W and W ′ held by them.

After these alignments are completed, one of the substrates W and W ′ held by the upper and lower holding plates 1 and 1 ′ is moved toward the other, and one of the opposing surfaces of the upper and lower substrates W and W ′ is moved. By pressure-bonding the annular adhesive (seal material) S applied to one or both, the two are sealed and overlapped.
In the illustrated example, the upper substrate W ′ held on the upper holding plate 1 ′ is moved downward, and the annular adhesive (seal material) on the lower substrate W is moved with respect to the lower substrate W held on the lower holding plate 1. It is crimped instantaneously across S.

Thereafter, as shown in FIG. 4B, the holding of one of the upper and lower holding plates 1 and 1 'with respect to one of the upper and lower substrates W and W' overlapped with each other is released, and the above-described lifting means is operated. The upper and lower holding plates 1, 1 ′ are moved away from each other.
In the illustrated example, after the upper holding plate 1 ′ is released from the upper substrate W ′, the upper holding plate 1 ′ is moved up and separated from the upper substrate W ′.

  Further, at the same time, the air intake means described above is reversely operated, or air or nitrogen is supplied into the closed space D by another mechanism, and the atmosphere in the closed space D is returned to atmospheric pressure. The upper and lower substrates W and W ′ are evenly pressed by the pressure difference generated between the inside and outside of W and W ′, and the liquid crystal is squeezed to a predetermined gap to complete the bonding process.

After this bonding step is completed, the other holding of the upper and lower holding plates 1 and 1 'with respect to the other of the upper and lower substrates W and W' is released, and as shown in FIG. W and W ′ are carried out of the vacuum bonding machine by the work transfer means C.
In the illustrated example, after the holding of the lower holding plate 1 with respect to the lower substrate W is released, the bonded upper and lower substrates W and W ′ are carried out by the work transfer means C.

The adhesive chuck 2 of the workpiece adhesive holding device A according to the embodiment of the present invention is disposed on either one or both of the upper and lower holding plates 1 and 1 'of the vacuum bonding machine having such a structure. .
In the illustrated example, the adhesive chuck 2 is provided only on the lower holding plate 1.
Specifically, the concave portion 1b is formed only on the surface 1a of the lower holding plate 1, and the unitized adhesive chuck 2 is stored and disposed by stacking so that the support pillar 2d is sandwiched between the support plate 2b and the support substrate 2i. doing.
Furthermore, in the illustrated example, only two sets of the adhesive chucks 2 are arranged because of space, but as many as the number of adhesive chucks that can be immovably held according to the size of the lower substrate W are arranged. ing.

  Further, although not shown, the surface 1a 'of the upper holding plate 1' has a conventionally well-known structure composed of the above-described adhesive chuck 2, the adhesive chuck of other structure, the vacuum chuck, the electrostatic chuck, or the like, or a combination thereof. The holding means and the peeling means are provided.

As shown in FIG. 4 (a), the plurality of adhesive chucks 2 arranged in this way are connected to the suction means 3 by connecting the respective suction holes 2f to each other, as shown in FIGS. 4 (b) and 4 (c). In addition, the air holes 2g are connected to each other by pipes and communicated with the atmospheric pressure adjusting means 4.
The suction means 3 and the atmospheric pressure adjusting means 4 are controlled by the control means B so as to be interlocked with the workpiece transfer means C, the lifting means, the suction means, the horizontal movement means, etc., as in the above-described embodiment.

  The control means B starts the operation of the suction means 3 in the atmosphere of atmospheric pressure as shown by the solid line in FIG. After vacuum suction from the suction hole 2f of the chuck 2 to make the suction groove 2c have a negative pressure, the upper and lower substrates W and W ′ are overlapped as shown by the two-dot chain line in FIG. 4A (the closed space D is in a vacuum state). Then, the vacuum suction by the suction means 3 is stopped to return the suction hole 2f to the atmospheric state, and after the bonding of the upper and lower substrates W and W ′ as shown in FIG. 4B is completed (the closed space D is in the atmospheric state). By starting the operation of the atmospheric pressure adjusting means 4, the pressure adjusting chamber 2e is vacuumed by vacuum suction from the air vent 2g, and the upper and lower substrates W, W 'by the work transferring means C as shown in FIG. After carrying out, vacuum suction by the atmospheric pressure adjusting means 4 is stopped to make the vent hole 2g large. It is controlled to return to the state.

In such an embodiment, as shown by the solid line in FIG. 4A, when the lower substrate W is carried into the lower holding plate 1 and the adhesive chuck 2 by the work transfer means C, the suction means 3 starts to operate. Then, suction is performed from one end opening of the suction hole 2f, and the surface W1 of the lower substrate W is sucked and held on the outer peripheral portion of the adhesive chuck 2 or the outer peripheral ring 2h, and the suction groove 2c also becomes negative pressure.
At this time, for example, when the support plate 2b is softer than the hardness of the plate-like workpiece W, the support plate 2b is pulled toward the surface W1 of the lower substrate W as compared with the plate-like workpiece W, and accordingly, the adhesive is adhered. The pad 2a is also drawn toward the surface W1 of the plate-like workpiece W. Finally, the adhesive surface 2a1 of the adhesive pad 2a comes into contact with and adheres to the surface W1 of the lower substrate W.

Thereafter, as shown by a two-dot chain line in FIG. 4A, when the upper and lower substrates W and W ′ are superposed, the suction means 3 is stopped, the vacuum suction from the suction hole 2f is stopped, and the suction is performed. The holes 2f and the suction grooves 2c return to the atmospheric state.
However, in this state, since the adhesive surface 2a1 of the adhesive pad 2a is adhered to the surface W1 of the lower substrate W, the lower substrate W is not displaced with respect to the surface 1a of the lower holding plate 1.

Then, as shown in FIG. 4B, when the bonding of the upper and lower substrates W and W ′ is completed, the atmospheric pressure adjusting means 4 starts to operate and is vacuum-sucked from the vent hole 2g, so that the pressure adjusting chamber 2e is negative pressure. become.
As a result, the space around the support column 2d is evacuated, the entire support plate 2b is pulled toward the support substrate 2i in an attempt to shrink its volume, and the support column 2d moves away from the surface W1 of the lower substrate W accordingly. Thus, the adhesive pad 2a also moves in the same direction, and the adhesive surface 2a1 of the adhesive pad 2a is peeled off from the surface W1 of the lower substrate W without difficulty.
At this time, since the support column 2d is not compressed more than necessary, the inner surface 2b 'located on the pressure regulating chamber 2e side of the support plate 2b adheres to the opposing surface 2e' of the pressure regulating chamber 2e, causing malfunction. There is no.

Thereafter, when unloading of the upper and lower substrates W, W ′ by the workpiece transfer means C is completed, the operation of the atmospheric pressure adjusting means 4 is stopped as shown in FIG. 4C, and the vacuum suction from the vent hole 2g is stopped. The pressure regulating chamber 2e returns to the atmospheric state.
As a result, the space around the support column 2d expands and the support column 2d expands and deforms, and the shape of the support column 2d is restored elastically, and the support plate 2b and the adhesive pad 2a start to rise. Then, the adhesive surface 2a1 rises to a height position substantially the same as the surface 1a of the lower holding plate 1, and returns to the initial state.
Thereafter, the above-described operation is repeated.

Therefore, according to such an embodiment, the lower substrate W can be securely adhered and peeled off from the bonded upper and lower substrates W and W ′.
Thereby, it is possible to prevent misalignment of the upper and lower substrates W and W ′ that have been bonded together with high accuracy.

  In the embodiment shown above, the workpiece adhesive holding device A of the present invention is a glass substrate or plastic film used for a panel such as a liquid crystal display as a plate-like workpiece W with respect to a pair of holding plates 1 and 1 'opposed to each other vertically. Although the substrate is detachably adhered and held, and the workpiece adhesion holding device A according to the embodiment of the present invention is incorporated in a vacuum bonding machine that bonds these two substrates W and W ′ to each other, However, the present invention is not limited thereto, and the workpiece adhesive holding device A is incorporated into a substrate assembly device other than this vacuum bonding machine or a substrate transfer device for transferring a substrate, or a plate-like workpiece other than a glass substrate for LCD panels or a plastic film substrate. May be adhered and held.

A Workpiece adhesive holding device B Control means C Workpiece transfer means D Closed space S Annular adhesive (sealing material) W, W 'Plate work (substrate)
W1 surface 1,1 'holding plate 1a, 1a' surface 2 adhesive chuck 2a adhesive pad 2b support plate 2c suction groove 2d support column 2e pressure regulating chamber 2f suction hole 2g vent hole 2h outer ring 2i support substrate 3 suction means 4 pressure adjustment means

Claims (5)

A holding plate (1), and an adhesive chuck (2) disposed on the surface side of the holding plate (1) to detachably hold the plate-like workpiece (W);
The adhesive chuck (2)
A plurality of adhesive pads (2a) arranged opposite to the plate-like workpiece (W);
The adhesive pad (2a) is continuously formed on the back surface of the adhesive pad (2a) along the plate-like workpiece (W), and supports the adhesive chuck (2) so as to be movable in a direction facing the plate-like workpiece (W). A support plate (2b);
A suction groove (2c) capable of adjusting the atmospheric pressure, which is formed adjacent to the adhesive pad (2a) and facing the plate-like workpiece (W);
A support column (2d) formed so as to be stretchable in a direction facing the plate-like workpiece (W) continuously from the back surface of the support plate (2b);
A pressure regulation chamber (2e) capable of adjusting the atmospheric pressure formed around the support column (2d),
When the suction groove (2c) becomes a negative pressure, the adhesive pad (2a) is compressed from both sides of the plate-like work (W) and the support plate (2b), and the adhesive pad (2a) and the plate are compressed. The surface (W1) of the workpiece (W),
When the pressure regulating chamber (2e) becomes a negative pressure, the support column (2d) is compressed so that the adhesive pad (2a) is separated from the surface (W1) of the plate-like workpiece (W). A workpiece adhesive holding device.   The support column (2d) is formed of an elastically deformable material, and the adhesive pad (2a) is formed on the surface (1a) of the holding plate (1) except when negative pressure is applied to the pressure regulating chamber (2e). 2. The work adhesive holding device according to claim 1, wherein the support pillar (2d) is extended so as to approach.   The work adhesive holding device according to claim 1 or 2, wherein the support plate (2b) and the support column (2d) are integrally formed of an elastically deformable material. The suction means (3) communicating with the suction groove (2c), the atmospheric pressure adjusting means (4) communicating with the pressure regulating chamber (2e), and the suction means (3) and the atmospheric pressure adjusting means (4) are controlled to operate. Control means (B),
This control means (B) operates the suction means (3) after carrying in the plate-like workpiece (W) to make the suction groove (2c) negative pressure, and immediately before carrying out the plate-like workpiece (W). The work pressure-sensitive adhesive holding device according to claim 1, 2, or 3, wherein the pressure adjusting chamber (2e) is set to a negative pressure by operating the atmospheric pressure adjusting means (4).   The workpiece adhesive holding device (A) according to any one of claims 1 to 4 is provided on either one or both of a pair of opposing holding plates (1, 1 '), and the workpiece adhesive holding device ( A vacuum bonding machine characterized in that the plate-like workpiece (W) is adhered and held in a vacuum in A) and bonded to another plate-like workpiece (W ′).

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