JP5311237B2 - Suspension substrate, suspension, suspension with head, hard disk drive, and method for manufacturing suspension substrate - Google Patents

Description

  The present invention relates to a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a method for manufacturing a suspension substrate, and in particular, a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension capable of improving high-frequency characteristics. The present invention relates to a method for manufacturing an industrial substrate.

  In general, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. The suspension substrate includes a metal support layer and a wiring layer having a plurality of wirings stacked on the metal support layer with an insulating layer interposed therebetween. To write or read data.

  In recent years, it has been demanded to increase the amount of information processing and improve the processing speed by increasing the speed of signal transmission. For this purpose, it is necessary to improve electrical characteristics such as differential impedance.

  In order to cope with this, for example, a suspension substrate as shown in Patent Document 1 is known. Here, each of the first write wiring pattern and the second write wiring pattern has two divided lines, and the divided lines of the first write wiring pattern and the second line The divided lines of the write wiring pattern are alternately arranged. In this way, the differential impedance between the first write wiring pattern and the second write wiring pattern is reduced.

JP 2010-114366 A

  By the way, in order to achieve impedance matching between the magnetic head mounted on the suspension board and the preamplifier connected to the suspension board, the suspension board wiring is designed as a distributed constant circuit as the data speed increases. It is desired to improve the high frequency characteristics while reducing the differential impedance.

  However, in the suspension substrate shown in Patent Document 1, the first write wiring pattern and the second write wiring pattern are arranged on a base insulating layer laminated on a metal support layer made of stainless steel. Yes. For this reason, since each write wiring pattern is close to the metal support layer, the signal is attenuated by an unnecessary current flowing through the metal support layer through electromagnetic induction or the like, and the high frequency characteristics of each write wiring pattern are improved. Has become difficult.

  The present invention has been made in consideration of such points, and provides a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a method for manufacturing a suspension substrate that can improve high-frequency characteristics. Objective.

  The present invention provides a suspension substrate that has a head slider mounted thereon and extends from a head region including a head side terminal portion connected to the head slider to a tail region including a tail terminal portion to which an external connection substrate is connected. An insulating layer, a metal support layer provided on one surface of the first insulating layer, a first wiring layer provided on the other surface of the first insulating layer and having a connection wiring portion, and provided on the first insulating layer A second insulating layer that covers the first wiring layer; and a second wiring layer that is provided in the second insulating layer and includes a plurality of wirings including the first wiring and the second wiring. The first wiring includes a head side wiring portion extending from the head side terminal portion and a plurality of divided wiring portions divided from the head side wiring portion, and penetrates the second insulating layer through the second insulating layer. A plurality of conductive connection portions, each divided wiring portion of the first wiring , Via a corresponding conductive connection portion, to provide a substrate for suspension, characterized in that connected to the connection wiring of the first wiring layer.

  In the suspension substrate described above, the second wiring includes a head-side wiring portion extending from the head-side terminal portion and a plurality of divided wiring portions divided from the head-side wiring portion. It is preferable that the portions and the divided wiring portions of the second wiring are alternately arranged.

  In the suspension substrate described above, the second wiring of the second wiring layer includes a tail side wiring portion that extends from the tail terminal portion and is connected to each divided wiring portion, and the first wiring layer is formed from the connection wiring portion. Each of the divided wirings of the second wiring includes a second connection wiring portion provided on the tail region side, and a plurality of second conductive connection portions penetrating the second insulating layer are provided in the second insulating layer. The part is preferably connected to the second connection wiring part of the first wiring layer through the corresponding second conductive connection part.

  In the suspension substrate described above, the connection wiring portion and the second connection wiring portion of the first wiring layer are preferably formed of the same material as the plurality of wirings of the second wiring layer.

  In the suspension substrate described above, it is preferable that the connection wiring portion of the first wiring layer is disposed in the head region, and the second connection wiring portion is disposed in the tail region.

  In the suspension substrate described above, it is preferable that portions of the metal support layer corresponding to the connection wiring portion of the first wiring layer and the second connection wiring portion are cut out.

  In the suspension substrate described above, it is preferable that the first wiring and the second wiring of the second wiring layer constitute a pair of writing wirings.

  In the suspension substrate described above, it is preferable that the plurality of wirings of the second wiring layer have a pair of reading wirings.

  In the suspension substrate described above, it is preferable that at least a part of the head side terminal portion is provided on a surface of the second insulating layer on the second wiring layer side.

  In the suspension substrate described above, it is preferable that the first wiring layer has power supply wiring for supplying power to the laser diode to be mounted.

  In the suspension substrate described above, it is preferable that the power supply wiring of the first wiring layer is arranged outside the wiring located on the outermost side among the plurality of wirings of the second wiring layer in plan view.

  In the suspension substrate described above, the thickness of the first insulating layer is preferably equal to or less than the thickness of the second insulating layer.

  The present invention provides a suspension comprising a base plate and any one of the above-described suspension substrates attached to the base plate via a load beam.

  The present invention provides a suspension with a head comprising the above-described suspension and a head slider mounted on the suspension.

  The present invention provides a hard disk drive having the above-described suspension with a head.

  The present invention relates to a method of manufacturing a suspension substrate that is mounted on a head slider and extends from a head region including a head side terminal portion connected to the head slider to a tail region including a tail terminal portion to which an external connection substrate is connected. Preparing a laminate having a first insulating layer, a metal support layer provided on one surface of the first insulating layer, and a first wiring layer provided on the other surface of the first insulating layer. And forming a connection wiring portion in the first wiring layer, forming a second insulating layer on the first insulating layer so as to cover the first wiring layer, and at a position corresponding to the connection wiring portion, Forming a plurality of insulating layer through holes penetrating the second insulating layer; forming a second wiring layer having a plurality of wirings including a first wiring and a second wiring in the second insulating layer; In the step of forming the second wiring layer The first wiring of the second wiring layer is formed so as to include a head side wiring portion extending from the head side terminal portion and a plurality of divided wiring portions divided from the head side wiring portion. A suspension substrate, wherein a conductive connection portion is formed in the hole, and each divided wiring portion of the first wiring is connected to the connection wiring portion of the first wiring layer via the corresponding conductive connection portion. Provide a method.

  In the suspension substrate manufacturing method described above, in the step of forming the second wiring layer, the second wiring of the second wiring layer is divided from the head side wiring portion extending from the head side terminal portion and the head side wiring portion. It is preferable that the divided wiring portions of the first wiring and the divided wiring portions of the second wiring are alternately arranged.

  In the above-described suspension substrate manufacturing method, in the step of forming the connection wiring portion, the second connection wiring portion is formed closer to the tail region than the connection wiring portion of the first wiring layer, thereby forming the insulating layer through-hole. In the step of forming the second wiring layer, a plurality of second insulating layer through holes penetrating the second insulating layer are formed at positions corresponding to the second connection wiring portion. The second wiring extends from the tail terminal portion and is formed so as to include a tail-side wiring portion connected to each divided wiring portion, and a second conductive connection portion is formed in each second insulating layer through-hole. In addition, each divided wiring portion of the second wiring is preferably connected to the second connection wiring portion of the first wiring layer via the corresponding second conductive connection portion.

  In the suspension board manufacturing method described above, it is preferable that the connection wiring portion and the second connection wiring portion of the first wiring layer are formed of the same material as the plurality of wirings of the second wiring layer.

  In the method for manufacturing the suspension substrate described above, it is preferable that the metal support layer further includes a step of notching portions corresponding to the connection wiring portion and the second connection wiring portion of the first wiring layer.

  According to the present invention, the first wiring of the second wiring layer has a plurality of divided wiring portions, and the second wiring layer supports the metal via the second insulating layer, the first wiring layer, and the first insulating layer. Laminated in layers. Thus, the second wiring layer having the first wiring can be separated from the metal support layer, and an electric signal transmitted in the first wiring is signaled by an unnecessary current flowing through the metal support layer through electromagnetic induction or the like. Attenuation can be suppressed. For this reason, the high frequency characteristic of each wiring of a 2nd wiring layer can be improved.

FIG. 1 is a plan view showing an example of a suspension substrate according to an embodiment of the present invention. FIG. 2A is a plan view showing a head-side jumper part in the suspension substrate according to the embodiment of the present invention, and FIG. 2B is a plan view showing a tail-side jumper part. FIG. 3 is a diagram showing a cross-sectional structure including a head-side jumper portion in the suspension substrate according to the embodiment of the present invention. FIG. 4 is a plan view showing an example of a suspension in the embodiment of the present invention. FIG. 5 is a plan view showing an example of a suspension with a head according to an embodiment of the present invention. FIG. 6 is a perspective view showing an example of a hard disk drive according to the embodiment of the present invention. 7A to 7E are views showing a method for manufacturing a suspension substrate in the embodiment of the present invention. FIG. 8 is a diagram showing a modification of FIG. FIG. 9A is a diagram showing another modification of FIG. 3, and is a diagram showing a cross-sectional structure including a head-side jumper portion, and FIG. 9B is a cross-sectional structure including a tail-side jumper portion. Figure.

  A manufacturing method of a suspension substrate, a suspension, a suspension with a head, a hard disk drive, and a suspension substrate according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the suspension substrate 1 is mounted with a head slider 112 (see FIG. 5) to be described later, and from the head region 2 including the head side terminal portion 4 connected to the head slider 112 to the external connection substrate 113. Is formed so as to extend to the tail region 3 including the tail terminal portion 5 connected thereto. Here, the head region 2 means a region around the mounted head slider 112 and close to the head side terminal portion 4 connected to the head slider 112, and the tail region 3 is an external connection board. This means a region close to the tail terminal portion 5 connected to 113. An example of the external connection board 113 is a flexible printed board.

  As shown in FIG. 1 and FIG. 3, the suspension substrate 1 is provided on the insulating layer 10, one surface of the insulating layer 10, the conductive metal support layer 20, and the other surface of the insulating layer 10. The first wiring layer 30 provided, the second insulating layer 40 provided on the first insulating layer 10 and covering the first wiring layer 30, and the second wiring provided on the second insulating layer 40 and having a plurality of wirings And a layer 50. The plurality of wirings of the second wiring layer 50 include a first wiring 51 and a second wiring 52 that constitute a pair of writing wirings, a third wiring 53 and a fourth wiring 54 that constitute a pair of reading wirings, Is included. That is, as shown in FIG. 3, each of the first wiring 51 and the second wiring 52 constituting the writing wiring and the third wiring 53 and the fourth wiring 54 constituting the reading wiring are both the second wiring. It is provided on the insulating layer 40.

  As shown in FIGS. 2 and 3, the first wiring layer 30 includes a head-side jumper wiring part (connection wiring part) 31, a tail-side jumper wiring part (second connection wiring part) 32, and a laser to be mounted. Power supply wiring 33 for supplying power to the diode 114 (see FIG. 5). The laser diode 114 is mounted on the back surface of the head slider 112 corresponding to the thermally assisted recording method. The thermally assisted recording method is a disk 123 (FIG. 6) in which magnetic particles are made smaller to increase the density. In the recording method, a portion having magnetic recording is instantaneously heated to enable recording with high coercive force, which is difficult at room temperature. The power supply wiring 33 is a plurality of wirings of the second wiring layer 50 in a plan view (when viewed as shown in FIG. 1 or FIG. 2), that is, the outermost (right side in FIGS. 2 and 3). The two wirings 52 are arranged outside the divided wiring part. Thereby, the influence on signal transmission by external noise etc. can be reduced. In FIG. 1, the power supply wiring 33 is omitted for the sake of clarity.

  At least a part of the head-side terminal portion 4 provided in the head region 2 is provided on the surface of the second insulating layer 40 on the second wiring layer 50 side. That is, the head-side terminal portion 4 is provided on the first insulating layer 10, and is connected to the power supply wiring 33 of the first wiring layer 30. The laser diode terminal (power supply terminal, not shown) and the second insulating layer And a plurality of head terminals 4 a connected to the respective wirings 51 to 54 of the second wiring layer 50. In this way, the head-side terminal portion 4 has a two-stage configuration and can be connected to corresponding pads of the high-performance head slider 112 having a large number of pads. The laser diode terminal is formed of the same material as the power supply wiring 33 of the first wiring layer 30 and is subjected to nickel (Ni) plating and gold (Au) plating. The head terminal 4a is formed of the same material as the wirings 51 to 54 of the second wiring layer 50, and is subjected to nickel plating and gold plating in the same manner as the laser diode terminal.

  As shown in FIGS. 1 to 3, the first wiring 51 includes a first head-side wiring part 51 a extending from the head terminal 4 a of the head-side terminal part 4, and a plurality of (divided from the first head-side wiring part 51 a ( For example, two first divided wiring portions 51b and 51c are included, and the first head side wiring portion 51a is connected to each first division via a head side jumper portion 71 provided in the head region 2. The wiring parts 51b and 51c are connected so as to be divided. The first wiring 51 further includes a first tail-side wiring part 51d extending from the tail terminal part 5, and each first divided wiring part 51b, 51c is on the tail side described later on the second insulating layer 40. In the vicinity of the jumper part 72, the first tail side wiring part 51d is connected so as to be divided.

  The second wiring 52 includes a second head-side wiring portion 52a extending from the head terminal 4a of the head-side terminal portion 4, and a plurality of (for example, two) second divided wirings divided from the second head-side wiring portion 52a. Parts 52b and 52c. Each of the second divided wiring portions 52b and 52c is connected on the second insulating layer 40 so as to be divided from the second head side wiring portion 52a in the vicinity of the head side jumper portion 71. The second wiring 52 further includes a second tail side wiring portion 52 d extending from the tail terminal portion 5, and each of the second divided wiring portions 52 b and 52 c is a tail side jumper portion 72 provided in the tail region 3. The second tail side wiring portion 52d is connected to be separated from the second tail side wiring portion 52d.

  The first divided wiring portions 51 b and 51 c of the first wiring 51 and the second divided wiring portions 52 b and 52 c of the second wiring 52 are alternately arranged. That is, one second divided wiring portion 52b is interposed between the two first divided wiring portions 51b and 51c, and the other first divided wiring portion is interposed between the two second divided wiring portions 52b and 52c. The part 51c is interposed. In this way, an interleaved wiring structure is formed by the first wiring 51 and the second wiring 52.

  As shown in FIG. 2A, in the head-side jumper portion 71, two head-side insulating layer through holes (insulating layer through-holes) 41a and 41b penetrating the second insulating layer 40 are provided. Head side conductive connection portions (conductive connection portions, vias) 73a and 73b are provided in the layer through holes 41a and 41b. The head-side jumper wiring part 31 of the first wiring layer 30 is provided at a position corresponding to the head-side conductive connection parts 73a and 73b, and the first divided wiring parts 51b and 51c of the first wiring 51 correspond to each other. The head-side jumper wiring part 31 of the first wiring layer 30 is connected via the head-side conductive connection parts 73a and 73b. That is, one first divided wiring portion 51b is connected to the head side jumper wiring portion 31 via one head side conductive connection portion 73a, and the other first divided wiring portion 51c is connected to the other head side conductive connection portion. It is connected to the head side jumper wiring part 31 through 73b. The first head-side wiring part 51a is connected to the first divided wiring part 51b through the head-side conductive connection part 73a.

  The tail side jumper portion 72 has the same structure as the head side jumper portion 71, and is provided on the tail region 3 side from the head side jumper portion 71 as shown in FIG. In the tail side jumper portion 72, as shown in FIG. 2B, two tail side insulating layer through holes (second insulating layer through holes) 42a and 42b penetrating the second insulating layer 40 are provided. Tail side conductive connection portions (second conductive connection portions, vias) 74a, 74b are provided in the tail side insulating layer through holes 42a, 42b. The tail-side jumper wiring portion 32 of the first insulating layer 30 is provided at a position corresponding to the tail-side conductive connection portions 74a and 74b, and the second divided wiring portions 52b and 52c of the second wiring 52 correspond to each other. The tail side jumper wiring part 32 of the first wiring layer 30 is connected via the tail side conductive connection parts 74a and 74b. That is, one second divided wiring portion 52b is connected to the tail side jumper wiring portion 32 via one tail side conductive connection portion 74a, and the other second divided wiring portion 52c is connected to the other tail side conductive connection portion. It is connected to the tail side jumper wiring part 32 through 74b. The second tail side wiring portion 52d is connected to the second divided wiring portion 51c via the tail side conductive connection portion 74b.

  As shown in FIG. 3, a protective layer 60 that covers the second wiring layer 50 is provided on the second insulating layer 40. In FIGS. 1 and 2, the protective layer 60 is omitted for the sake of clarity.

  Although not shown, between the first insulating layer 10 and the first wiring layer 30, and between the second insulating layer 40 and the second wiring layer 50 and the conductive connection portions 73a, 73b, 74a, 74b, A seed layer made of nickel (Ni), chromium (Cr), copper (Cu) and having a thickness of about 300 nm may be interposed. In this case, the adhesion between the insulating layers 10 and 40 and the corresponding wiring layers 30 and 50 or the conductive connection portions 73a, 73b, 74a, and 74b can be improved.

  Next, each component will be described in detail.

  The material of the first insulating layer 10 and the second insulating layer 40 is not particularly limited as long as it has a desired insulating property. For example, it is preferable to use polyimide (PI). The material of each of the insulating layers 10 and 40 can be a photosensitive material or a non-photosensitive material. The thickness of the first insulating layer 10 is preferably equal to or less than the thickness of the second insulating layer 40. Of these, the thickness of the first insulating layer 10 is preferably 3 μm to 15 μm, particularly preferably 5 μm, and the thickness of the second insulating layer 40 is preferably 3 μm to 10 μm, particularly preferably 5 μm. Thus, the insulation performance between the metal support layer 20 and the first wiring layer 30 and the insulation performance between the first wiring layer 30 and the second wiring layer 50 are ensured, and the rigidity of the suspension substrate 1 as a whole is increased. It can be prevented from being lost.

  The wirings 51 to 54 of the second wiring layer 50, the jumper wiring parts 31, 32 of the first wiring layer 30, and the power supply wiring 33 are configured as conductors for transmitting electrical signals and are formed of the same material. Yes. The material of each wiring 33, 51 to 54 and each jumper wiring part 31, 32 is not particularly limited as long as it has a desired conductivity, but it is preferable to use copper (Cu). . In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of each wiring 33, 51-54 and each jumper wiring part 31, 32 is, for example, 1 μm to 18 μm, especially 5 μm to 12 μm. As a result, it is possible to ensure the transmission characteristics of the wires 33 and 51 to 54 and the jumper wires 31 and 32 and to prevent loss of flexibility as the suspension substrate 1 as a whole.

  The material of each of the conductive connection portions 73a, 73b, 74a, and 74b is not particularly limited as long as it is a material having desired conductivity, and examples thereof include copper or nickel. In the present embodiment, the conductive connection portions 73a, 73b, 74a, and 74b are formed of the same material as the wirings 51 to 54 of the second wiring layer 50.

  The material of the metal support layer 20 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. In addition, the thickness of the metal support layer 20 can be 10 micrometers-30 micrometers as an example, and can be 15 micrometers-25 micrometers especially.

  As a material of the protective layer 60, it is preferable to use a resin material, for example, polyimide. The material of the protective layer 60 can be a photosensitive material or a non-photosensitive material. The thickness of the protective layer 60 is preferably 3 μm to 10 μm, particularly 5 μm.

  Next, the suspension 101 in the present embodiment will be described with reference to FIG. A suspension 101 shown in FIG. 4 is provided on the surface opposite to the surface on which the above-described suspension substrate 1 and the head slider 112 (see FIG. 5) described later of the suspension substrate 1 are mounted. And a load beam 102 for holding the disk 123 (see FIG. 6).

  Next, the suspension with head 111 in the present embodiment will be described with reference to FIG. A suspension with head 111 shown in FIG. 5 includes the suspension 101 described above and a head slider 112 mounted on the head region 2 of the suspension substrate 1.

  Next, the hard disk drive 121 in the present embodiment will be described with reference to FIG. The hard disk drive 121 shown in FIG. 6 has a case 122, a disk 123 that is rotatably attached to the case 122, stores data, a spindle motor 124 that rotates the disk 123, and a desired flying height on the disk 123. And a suspension 111 with a head including a head slider 112 that writes and reads data to and from the disk 123. Of these, the suspension with head 111 is movably attached to the case 122, and a voice coil motor 125 that moves the head slider 112 of the suspension with head 111 along the disk 123 is attached to the case 122. Yes. The suspension with head 111 is attached to the voice coil motor 125 via an arm 126.

  Next, the operation of the present embodiment having such a configuration, that is, a method for manufacturing the suspension substrate 1 according to the present embodiment will be described. Here, as an example, a method for manufacturing the suspension substrate 1 by the subtractive method will be described with reference to FIG. 7 showing a cross-sectional structure of the head-side jumper portion 71. Since the tail side jumper portion 72 can be manufactured in the same manner as the head side jumper portion 71, detailed description thereof is omitted here.

  First, the first insulating layer 10, the conductive metal support layer 20 provided on one surface of the first insulating layer 10, and the first wiring layer 30 provided on the other surface of the first insulating layer 10. Are prepared (see FIG. 7A). In this case, first, the metal support layer 20 is prepared, and the first insulating layer 10 is formed on the metal support layer 20 by a coating method using non-photosensitive polyimide. Subsequently, nickel, chromium, and copper are sequentially coated on the first insulating layer 10 by a sputtering method to form a seed layer (not shown). Thereafter, the first wiring layer 30 is formed by copper plating using the seed layer as a conductive medium. In this way, a laminated body 75 having the first insulating layer 10, the metal support layer 20, and the first wiring layer 30 is obtained.

  Subsequently, a head-side jumper wiring portion 31 is formed in the first wiring layer 30 (see FIG. 7B). In this case, a patterned resist (not shown) is formed on the first wiring layer 30 using a dry film by a photofabrication technique, and a portion of the first wiring layer 30 exposed from the resist. Is etched. Thereby, the head side jumper wiring part 31 is obtained. At this time, the power supply wiring 33 and the laser diode terminal (not shown) are formed in the same manner. Here, the method of etching the first wiring layer 30 is not particularly limited, but it is preferable to perform wet etching. Further, as the etching solution, for example, an iron chloride etching solution such as ferric chloride aqueous solution or a copper chloride etching solution such as copper chloride aqueous solution can be used. After the etching is performed, the resist is removed.

  Next, a second insulating layer 40 is formed on the first insulating layer 10 so as to cover the first wiring layer 30, and the second insulating layer 40 is disposed at a position corresponding to the head-side jumper wiring portion 31. The penetrating head side insulating layer through holes 41a and 41b are formed (see FIG. 7C). In this case, first, the second insulating layer 40 is formed on the first insulating layer 10 so as to cover the first wiring layer 30. Subsequently, a patterned resist (not shown) is formed on the formed second insulating layer 40, and a portion of the second insulating layer 40 exposed from the resist is etched to be processed. As a result, head-side insulating layer through-holes 41 a and 41 b that penetrate the second insulating layer 40 are obtained. For example, an organic alkaline solution can be used as the etching solution. After the etching is performed, the resist is removed.

  Thereafter, although not shown, a seed layer is formed by sputtering on the second insulating layer 40 and on the exposed portion of the head-side jumper wiring portion 31.

  Next, the second wiring layer 50 having the wirings 51 to 54 is formed on the second insulating layer 40 (see FIG. 7D). At this time, head-side conductive connection portions 73a and 73b are formed in the head-side insulating layer through holes 41a and 41b, respectively. In this case, a patterned resist (not shown) is formed on the second insulating layer 40, and the wirings 51 to 54 are formed on the second insulating layer 40 by electrolytic copper plating at the opening of the resist. In addition, head-side conductive connection portions 73a and 73b are formed in the head-side insulating layer through holes 41a and 41b. Here, the first divided wiring portions 51b and 51c of the first wiring 51 and the corresponding head side conductive connection portions 73a and 73b are integrally formed. At this time, the head terminal 4a is formed in the same manner. Thereafter, the resist is removed.

  After the second wiring layer 50 is formed, a protective layer 60 that covers the second wiring layer 50 is formed on the second insulating layer 40 (see FIG. 7E). In this case, first, the protective layer 60 is formed on the second insulating layer 40 so as to cover the second wiring layer 50. Subsequently, a patterned resist (not shown) is formed on the formed protective layer 60, and a portion of the protective layer 60 exposed from the resist is etched to be processed. For example, an organic alkaline solution can be used as the etching solution. After the etching is performed, the resist is removed.

  Subsequently, although not shown, a patterned resist is formed on the protective layer 60, and the portion of the first insulating layer 10 exposed from the resist is etched to expose the metal support layer 20 in a desired shape, Outline processing is performed. Note that as the etching solution, the etching solution used for etching the second insulating layer 40 can be used. After the etching is performed, the resist is removed.

  Next, although not shown, nickel plating and gold plating are sequentially applied to the head side terminal portion (laser diode terminal and head terminal 4a) 4 and tail terminal portion 5. Thereafter, the metal support layer 20 is trimmed by etching. Thus, the suspension substrate 1 in the present embodiment is obtained.

  The load beam 102 is attached to the lower surface of the suspension substrate 1 obtained in this way, and the suspension 101 shown in FIG. 4 is obtained. A head slider 112 is mounted on the head region 2 of the suspension 101 to obtain the suspension with head 111 shown in FIG. In this case, the plurality of pads of the head slider 112 are connected to the corresponding head side terminal portions 4. Further, the suspension with head 111 is attached to the case 122 of the hard disk drive 121, and the hard disk drive 121 shown in FIG. 6 is obtained.

  When data is written and read in the hard disk drive 121 shown in FIG. 6, the head slider 112 of the suspension with head 111 is moved along the disk 123 by the voice coil motor 125 and is rotated by the spindle motor 124. Keep close to the desired flying height. As a result, data is exchanged between the head slider 112 and the disk 123. During this time, electrical signals are transmitted by the respective wirings 51 to 54 extending between the head side terminal portion 4 and the tail terminal portion 5 of the suspension substrate 1.

  Thus, according to the present embodiment, the first wiring 51 and the second wiring 52 of the second wiring layer 50 have an interleaved wiring structure as a pair of write wirings, and the second wiring layer 50 is The metal support layer 20 is laminated via the second insulating layer 40, the first wiring layer 30 and the first insulating layer 10. Thus, the first wiring 51 and the second wiring 52 can be separated from the metal support layer 20, and an electric signal transmitted through the first wiring 51 and the second wiring 52 is electromagnetically induced to the metal support layer 20. It is possible to suppress signal attenuation due to unnecessary current flowing through the. For this reason, the high frequency characteristics of the first wiring 51 and the second wiring 52 of the second wiring layer 50 can be improved.

  In addition, according to the present embodiment, similarly to the first wiring 51 and the second wiring 52, the third wiring 53 and the fourth wiring 54 constituting a pair of reading wirings are formed on the second insulating layer 40. Is provided. As a result, like the pair of write wirings, the electric signal transmitted through the third wiring 53 and the fourth wiring 54 is attenuated by an unnecessary current flowing through the metal support layer 20 through electromagnetic induction or the like. This can be suppressed, and the high-frequency characteristics of the third wiring 53 and the fourth wiring 54 can be improved.

  In addition, according to the present embodiment, as described above, the second wiring layer 50 having the wirings 51 to 54 is made of metal via the second insulating layer 40, the first wiring layer 30, and the first insulating layer 10. Since it is laminated on the support layer 20, the electric signal transmitted in each of the wirings 51 to 54 of the second wiring layer 50 is attenuated by an unnecessary current flowing through the metal support layer 20 through electromagnetic induction or the like. Can be suppressed. As a result, the thickness of the first insulating layer 10 can be reduced, and the overall thickness of the suspension substrate 1 can be reduced. Further, in this case, the flexibility of the suspension substrate 1 can be improved to prevent warping and the amount of insulating material used can be reduced, and the suspension substrate 1 can be reduced in weight and cost. it can.

  Further, according to the present embodiment, the first wiring 51 and the second wiring 52 of the second wiring layer 50 constituting the pair of write wirings have an interleaved wiring structure. Thereby, the differential impedance between the first wiring 51 and the second wiring 52 can be reduced, and the electrical characteristics can be improved. In particular, according to the present embodiment, the head side jumper wiring portion 31 of the first wiring layer 30 is disposed in the head region 2, and the tail side jumper wiring portion 32 is disposed in the tail region 3. Accordingly, the first divided wiring portions 51b and 51c and the second divided wiring portions 52b and 52c can be lengthened, and the differential impedance between the first wiring 51 and the second wiring 52 is further reduced. can do.

  Further, according to the present embodiment, the second wiring layer 50 includes the first wiring 51 and the second wiring 52 that constitute a pair of writing wirings, the third wiring 53 that constitutes a pair of reading wirings, and The first wiring layer 30 includes a power supply wiring 33. As described above, the power supply wiring 33 is arranged on the first insulating layer 10 and the wiring connecting the head slider 112 and the external connection substrate 113 is arranged on the second insulating layer 40, thereby reducing the degree of freedom in wiring design. Can be improved.

  Further, according to the present embodiment, the head-side terminal portion 4 is provided on the first insulating layer 10 and is connected to a laser diode terminal (not shown) connected to the power supply wiring 33 of the first wiring layer 30. And a head terminal 4 a provided on the second insulating layer 40 and connected to the wirings 51 to 54 of the second wiring layer 50. As a result, the head-side terminal portion 4 connected to the head slider 112 can have a two-stage configuration, and a high-performance head slider 112 having a large number of pads can be mounted.

  Further, according to the present embodiment, the power supply wiring 33 of the first wiring layer 30 is outside the wiring located on the outermost side of the first wiring 51 and the second wiring 52 of the second wiring layer 50 in plan view. Is arranged. Thereby, each wiring 51-54 of the 2nd wiring layer 50 can be protected from an external noise, and the electrical property of each wiring 51-54 of the 2nd wiring layer 50 can be improved.

  Further, according to the present embodiment, the jumper wiring portions 31 and 32 of the first wiring layer 30 are formed of the same material as the wirings 51 to 54 of the second wiring layer 50. Thereby, it is possible to prevent the first wiring 51 and the second wiring 52 from being reduced in conductivity by the corresponding jumper wiring portions 31 and 32.

  In the present embodiment, an example in which the second wiring layer 50 includes the third wiring 53 and the fourth wiring 54 that constitute a pair of reading wirings has been described. However, the present invention is not limited to this, and the first wiring layer 30 may have a pair of reading wirings. In other words, the reading wiring may be provided on the first insulating layer 10. Further, the example in which the first wiring layer 30 has the power supply wiring 33 has been described, but the second wiring layer 50 may have the power supply wiring 33.

  In the present embodiment, the power supply wiring 33 of the first wiring layer 30 is outside the wiring located on the outermost side of the first wiring 51 and the second wiring 52 of the second wiring layer 50 in plan view. The example of arrangement has been described. However, the present invention is not limited to this, and the power supply wiring 33 may be arranged at an arbitrary position on the first insulating layer 10.

  In the present embodiment, the head side jumper wiring portion 31 is disposed in the head region 2 and the tail side jumper wiring portion 32 is disposed in the tail region 3. However, the present invention is not limited to this, and the head-side jumper wiring portion 31 may be disposed closer to the tail region 3 than the head region 2, or the tail-side jumper wiring portion 32 may be disposed closer to the tail region 3. May be arranged on the head region 2 side.

  In the present embodiment, the example in which the first wiring 51 of the second wiring layer 50 includes the two first divided wiring portions 51b and 51c has been described. However, the present invention is not limited to this. The first wiring 51 may have three or more first divided wiring portions and may be connected by the head-side jumper wiring portion 31. Similarly, the second wiring 52 of the second wiring layer 50 may have three or more second divided wiring portions and may be connected by the tail side jumper wiring portion 32.

  Furthermore, in the present embodiment, the example in which the protective layer 60 that covers the second wiring layer 50 is provided on the second insulating layer 40 has been described. However, the present invention is not limited to this, and it is not necessary to provide such a protective layer 60 as shown in FIG. In this case, it is preferable that the wirings 51 to 54 of the second wiring layer 50 and the conductive connection portions 73a, 73b, 74a, and 74b are plated for corrosion prevention.

  Further, in the present embodiment, as shown in FIG. 9, a part of the metal support layer 20 may be cut out. That is, in the modification shown in FIGS. 9A and 9B, a portion of the metal support layer 20 corresponding to the head-side jumper wiring portion 31 of the first wiring layer 30 is notched, and the head side An opening 22a is formed, and the first insulating layer 10 is exposed in the head side opening 22a. Similarly, a portion of the metal support layer 20 corresponding to the tail-side jumper wiring portion 32 of the first wiring layer 30 is cut out to form a tail-side opening 22b. 1 The insulating layer 10 is exposed. Such a notch can be formed by etching when the metal support layer 20 is trimmed. 9A and 9B, the metal support layer main body 21 of the metal support layer 20 is provided on both sides of the openings 22a and 22b, and the openings 22a and 22b are formed on the metal support layer main body. However, if the portions of the metal support layer 20 corresponding to the jumper wiring portions 31 and 32 are notched, the shapes of the openings 22a and 22b are arbitrary. can do.

  According to the modification shown in FIG. 9, it is further suppressed that the electric signal transmitted in each jumper wiring part 31, 32 is attenuated by an unnecessary current flowing through the metal support layer 20 through electromagnetic induction or the like. can do. For this reason, the high frequency characteristics of the first wiring 51 and the second wiring 52 of the second wiring layer 50 can be further improved.

  Although the embodiments of the present invention have been described in detail, the suspension substrate, the suspension, the suspension with a head, the hard disk drive, and the suspension substrate manufacturing method according to the present invention are not limited to the above-described embodiments. Instead, various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Head area | region 3 Tail area | region 4 Head side terminal part 4a Head terminal 5 Tail terminal part 10 1st insulating layer 20 Metal support layer 21 Metal support layer main body 22a Head side opening part 22b Tail side opening part 30 1st wiring Layer 31 Head side jumper wiring portion 32 Tail side jumper wiring portion 33 Power supply wiring 40 Second insulating layers 41a and 41b Head side insulating layer through holes 42a and 42b Tail side insulating layer through holes 50 Second wiring layer 51 First wiring 51a First 1 head side wiring part 51b, 51c first divided wiring part 51d first tail side wiring part 52 second wiring 52a second head side wiring part 52b, 52c second divided wiring part 52d second tail side wiring part 53 third wiring 54 4th wiring 60 Protective layer 71 Head side jumper part 72 Tail side jumper parts 73a and 73b Head side conductive connection part 4a, 74b tail side conductive connection portion 80 stack 101 suspension 102 load beam 111 mounted suspension head 112 head slider 113 external connection substrate 114 laser diode 121 hard disk drive 122 case 123 disk 124 spindle motor 125 voice coil motor 126 Arm

Claims (18)

In the suspension substrate that is mounted on the head slider and extends from the head region including the head side terminal portion connected to the head slider to the tail region including the tail terminal portion to which the external connection substrate is connected,
A first insulating layer;
A metal support layer provided on one surface of the first insulating layer;
A first wiring layer provided on the other surface of the first insulating layer and having a connection wiring portion;
A second insulating layer provided on a surface of the first insulating layer on the first wiring layer side and covering the first wiring layer;
A second wiring layer provided on a surface opposite to the first insulating layer side of the second insulating layer and having a plurality of wirings including the first wiring and the second wiring;
The first wiring of the second wiring layer includes a head side wiring part extending from the head side terminal part, and a plurality of divided wiring parts divided from the head side wiring part,
The second insulating layer is provided with a plurality of conductive connection portions penetrating the second insulating layer,
Each of the divided wiring portions of the first wiring is connected to the connection wiring portion of the first wiring layer via a corresponding conductive connection portion. The suspension substrate according to claim 1 , wherein a portion of the metal support layer corresponding to the connection wiring portion of the first wiring layer is cut out. The second wiring includes a head side wiring portion extending from the head side terminal portion, and a plurality of divided wiring portions divided from the head side wiring portion,
The suspension substrate according to claim 1 or 2, wherein the divided wiring portions of the first wiring and the divided wiring portions of the second wiring are alternately arranged. The second wiring of the second wiring layer includes a tail side wiring portion that extends from the tail terminal portion and is connected to each divided wiring portion,
The first wiring layer has a second connection wiring portion provided on the tail region side from the connection wiring portion,
In the second insulating layer, a plurality of second conductive connection portions penetrating the second insulating layer are provided,
4. The suspension according to claim 3, wherein each divided wiring portion of the second wiring is connected to a second connection wiring portion of the first wiring layer through a corresponding second conductive connection portion. Substrate.   The suspension substrate according to claim 4, wherein a portion of the metal support layer corresponding to the second connection wiring portion of the first wiring layer is cut out.   6. The suspension substrate according to claim 1, wherein at least part of the head side terminal portion is provided on a surface of the second insulating layer on the second wiring layer side.   The suspension substrate according to any one of claims 1 to 6, wherein the first wiring layer has power wiring for supplying power to a laser diode to be mounted.   8. The suspension substrate according to claim 7, wherein the power supply wiring of the first wiring layer is arranged outside a wiring located on the outermost side among the plurality of wirings of the second wiring layer in plan view. .   The suspension substrate according to any one of claims 1 to 8, wherein a thickness of the first insulating layer is equal to or less than a thickness of the second insulating layer. A base plate;
A suspension board comprising the suspension substrate according to claim 1 attached to a base plate via a load beam. A suspension according to claim 10;
And a head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 11. In the manufacturing method of the suspension substrate, the head slider is mounted and extends from the head region including the head side terminal portion connected to the head slider to the tail region including the tail terminal portion to which the external connection substrate is connected.
Preparing a laminate having a first insulating layer, a metal support layer provided on one surface of the first insulating layer, and a first wiring layer provided on the other surface of the first insulating layer; ,
Forming a connection wiring portion in the first wiring layer;
A second insulating layer is formed on the surface of the first insulating layer on the first wiring layer side so as to cover the first wiring layer, and a plurality of holes penetrating the second insulating layer are provided at positions corresponding to the connection wiring portions. Forming an insulating layer through hole; and
Forming a second wiring layer having a plurality of wirings including a first wiring and a second wiring on a surface of the second insulating layer opposite to the first insulating layer side,
In the step of forming the second wiring layer, the first wiring of the second wiring layer includes a head side wiring portion extending from the head side terminal portion and a plurality of divided wiring portions divided from the head side wiring portion. And a conductive connection portion is formed in each insulating layer through-hole,
Each of the divided wiring portions of the first wiring is connected to the connection wiring portion of the first wiring layer through the corresponding conductive connection portion.   The method for manufacturing a suspension substrate according to claim 13, further comprising a step of notching a portion of the metal support layer corresponding to the connection wiring portion of the first wiring layer. In the step of forming the second wiring layer, the second wiring of the second wiring layer includes a head side wiring portion extending from the head side terminal portion and a plurality of divided wiring portions divided from the head side wiring portion. Formed into
The method for manufacturing a suspension substrate according to claim 13 or 14, wherein the divided wiring portions of the first wiring and the divided wiring portions of the second wiring are alternately arranged. In the step of forming the connection wiring portion, the second connection wiring portion is formed on the tail region side from the connection wiring portion of the first wiring layer,
In the step of forming the insulating layer through hole, a plurality of second insulating layer through holes penetrating the second insulating layer are formed at positions corresponding to the second connection wiring portions,
In the step of forming the second wiring layer, the second wiring of the second wiring layer is formed so as to include a tail side wiring portion that extends from the tail terminal portion and is connected to each divided wiring portion. A second conductive connection portion is formed in the insulating layer through-hole,
The suspension wiring according to claim 15, wherein each divided wiring portion of the second wiring is connected to the second connection wiring portion of the first wiring layer via the corresponding second conductive connection portion. A method for manufacturing a substrate.   17. The method for manufacturing a suspension substrate according to claim 16, wherein the connection wiring portion and the second connection wiring portion of the first wiring layer are formed of the same material as the plurality of wirings of the second wiring layer. .   The method for manufacturing a suspension substrate according to claim 16 or 17, further comprising a step of notching a portion of the metal support layer corresponding to the second connection wiring portion of the first wiring layer.

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