JP5308409B2 - Method for producing sheet-shaped epoxy resin composition material for electronic component sealing and electronic component - Google Patents

Description

  The present invention relates to a method for producing a sheet-like epoxy resin composition material for encapsulating electronic components that does not contain a glass substrate, and a multilayer circuit board, a component-embedded circuit board, an IC encapsulating package, and a heat dissipation that are electronic components using the same. It is related to the insulator.

  In recent years, with the demand for downsizing and high functionality of electronic devices, multilayer circuit boards are actively manufactured by a build-up method or the like for the purpose of shortening the wiring distance and downsizing.

  Furthermore, in recent years, the development of circuit boards with built-in components has attracted attention for the purpose of miniaturization and noise reduction by increasing the wiring distance between active components and passive components and increasing the degree of freedom in designing the layout between components. Has been. (For example, refer to Patent Document 1).

  The molding materials for these multilayer circuit boards and component-embedded circuit boards desirably have a high glass transition temperature (Tg) and a low linear expansion coefficient in terms of mounting reliability. Further, in view of stress relaxation with an electronic component such as an IC, it is desirable that the elastic property is an isotropic physical property having a lower elastic modulus and no anisotropy.

  Conventionally, in multilayer circuit boards and component-embedded circuit boards, a prepreg, which is a material in which a glass base material is impregnated with an epoxy resin, is used as a molding material for the board. This prepreg has sufficient mechanical strength that does not break even if it is thin after molding, and can reduce the linear expansion coefficient in the XY directions to ensure the mounting reliability of ICs and electronic components.

  However, when such a prepreg is used as a molding material for a substrate of a component built-in circuit board, there are the following problems. That is, in order to use the prepreg as a molding material for a circuit board with a built-in component, it is necessary to punch out the parts of the built-in component in advance, but it is necessary to punch out the hard part and the soft part of the glass base material and the resin at the same time. This makes it difficult to work. In addition, since the ratio of the glass base material is small around the built-in components, the physical properties such as the linear expansion coefficient as a whole of the substrate are uneven, and it is difficult to obtain a highly reliable substrate.

As a technology to cope with this problem, a sheet-like epoxy resin composition material for electronic component sealing, which is compounded using an inorganic filler (inorganic filler) having a low linear expansion coefficient without using a glass substrate, is used instead of a prepreg. It is known to be used as a molding material for a substrate (for example, see Patent Document 1). According to this technique, a material having a low coefficient of linear expansion can be obtained, and a component-embedded circuit board can be easily obtained by sealing a component without punching a sheet.

  Even if punching is performed, it is an ideal material for a circuit board with a built-in component because it is easy to punch unlike a material such as a conventional prepreg.

Japanese Patent No. 3375555

However, this sheet-shaped epoxy resin composition material for encapsulating electronic components is required to have the following points. First, in order to incorporate the components, it is desirable that the thickness of at least the semi-cured sheet-like epoxy resin composition material is 150 to 500 μm, more preferably 300 to 500 μm.

  In addition, when forming a sheet-like epoxy resin composition material for electronic component sealing, the volatile matter (heat loss component) in the sheet is reduced in order to perform vacuum forming (quick molding) in a short time without generating voids. Less is desirable.

  In addition, it is desirable that the difference in the degree of drying between the sheet surface and the deep part (on the carrier material side) is small and the remaining volatile content (heat loss) is also small.

  In addition, it is desirable that the sheet can be produced efficiently in a short time while ensuring the above-described thickness.

  However, it has not been technically easy in the prior art to satisfy all of the above properties.

  Furthermore, when the sheet-like epoxy resin composition material for electronic component sealing is used as a molding material for a circuit board having a built-in component, silica as an inorganic filler requires a volume of 55 vol% or more (mass of 70 mass% or more). It is. However, when a conventional laminate resin is blended with an inorganic filler to this level and dried to a semi-cured state (B stage state), it is not easy to obtain a thick sheet in a uniform dry state. It was.

  The present invention has been made in view of the circumstances as described above, and it is possible to produce a sheet-like epoxy resin composition material for encapsulating thick electronic components in a uniform dry state with a small amount of volatile matter in a short time. It aims at providing the manufacturing method of the sheet-like epoxy resin composition material for electronic component sealing, and the electronic component obtained by it.

  The method for producing a sheet-like epoxy resin composition material for encapsulating electronic components according to the present invention comprises an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler as essential components, and diluted in a solvent at a solid content concentration of 5 to 95% by mass. A step of preparing at least two semi-cured sheet-like epoxy resin composition materials with a carrier material obtained by applying the dried epoxy resin composition to a carrier material and drying, and these sheet-like epoxy resin compositions with a carrier material Two sheets of the material are overlapped so that the sheet-like epoxy resin composition materials are in contact with each other, and this overlap is performed a plurality of times as necessary, so that the sheet-like epoxy resin composition material is finally transferred to two carriers. And a step of increasing the thickness so that the total thickness of the sheet-like epoxy resin composition material is 150 to 500 μm by superimposing them all inside the material. To.

  In the method for producing a sheet-like epoxy resin composition material for encapsulating electronic components, a semi-cured carrier obtained by applying the epoxy resin composition to a carrier material and drying it so that the thickness after drying is 75 to 250 μm Two sheet-like epoxy resin composition materials with a material are prepared, and these sheet-like epoxy resin composition materials with a carrier material are overlapped so that the sheet-like epoxy resin composition materials are in contact with each other. It is preferable to increase the film thickness so that the total thickness of the film becomes 150 to 500 μm.

  In this method for producing a sheet-like epoxy resin composition material for encapsulating electronic components, the two sheet-like epoxy resin composition materials with a carrier material are different in fluidity at the molding temperature of the sheet-like epoxy resin composition material. It is preferable to use one.

  In this method for producing an electronic component sealing sheet-like epoxy resin composition material, one of the two sheet-like epoxy resin composition materials with a carrier material has a weight-average molecular weight of 20000 to one sheet-like epoxy resin composition material. It is preferable to blend 0.1 to 2% by mass of 1000000 nitrile butadiene rubber or butadiene rubber.

  In this method for producing a sheet-like epoxy resin composition material for sealing electronic parts, each of the sheet-like epoxy resin composition materials is at least one selected from silica, aluminum oxide, barium titanate, and ferrite as an inorganic filler. It is preferable to blend 50 to 95% by mass of the seed with respect to the total amount of the epoxy resin composition.

  The multilayer circuit board of the present invention is formed by using the sheet-like epoxy resin composition material for electronic component sealing obtained by the above method.

  The component-embedded circuit board of the present invention is formed using the sheet-like epoxy resin composition material for electronic component sealing obtained by the above method.

  The IC sealed package of the present invention is characterized in that it is molded using the sheet-like epoxy resin composition material for electronic component sealing obtained by the above method.

  The heat dissipating insulator of the present invention is characterized by being molded using the sheet-shaped epoxy resin composition material for electronic component sealing obtained by the above method.

  ADVANTAGE OF THE INVENTION According to this invention, the sheet-like epoxy resin composition material for thick electronic component sealing of a uniform dry state with little volatile matter can be produced in a short time.

It is the figure which showed an example of the manufacturing method of the sheet-like epoxy resin composition material for electronic component sealing of this invention.

  The present invention is described in detail below.

  Although it does not specifically limit as an epoxy resin mix | blended with an epoxy resin composition in this invention, For example, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a bisphenol S type epoxy resin, a phenol novolak type epoxy resin , Alkylphenol novolac type epoxy resin, aralkyl type epoxy resin, biphenol type epoxy resin, naphthalene type epoxy resin, dicyclopentadiene type epoxy resin, epoxidized product of condensate of phenol and aromatic aldehyde having phenolic hydroxyl group, triglycidyl Isocyanurate, alicyclic epoxy resin, and the like can be used. These may be used alone or in combination of two or more.

  Among them, a liquid epoxy resin, in particular, an epoxy resin having a softening temperature of preferably 80 ° C. or lower, more preferably 60 ° C. or lower can be suitably used. Such an epoxy resin is suitable for increasing the filling of the inorganic filler.

  Moreover, when biphenyl aralkyl type epoxy resin is used, excellent reliability can be obtained and drop impact resistance can be enhanced.

As a hardening | curing agent mix | blended with an epoxy resin composition in this invention, a phenol type hardening | curing agent, a dicyandiamide, an amine type hardening | curing agent, an acid anhydride type hardening | curing agent, a thiol type hardening | curing agent etc. can be used, for example. These may be used alone or in combination of two or more.

  As a phenol type hardening | curing agent, phenol type hardening | curing agents, such as a novolak type, an aralkyl type, a terpene type, etc. can be used, for example.

  Among them, in view of increasing the filling of the inorganic filler and the like, it is preferable to use a phenol novolac resin as the phenolic curing agent, and it is more preferable that the softening temperature is 80 ° C. or less.

  Further, when an aralkyl type phenol resin, particularly, a phenol phenyl aralkyl resin or a phenol biphenyl aralkyl resin is used as the phenolic curing agent, impact resistance can be remarkably improved. In addition, a highly reliable molded product (cured product) having a low moisture absorption rate can be obtained.

  Examples of the curing accelerator blended in the epoxy resin composition in the present invention include, for example, an imidazole curing accelerator, an amine curing accelerator, an organophosphorus curing accelerator, an onium salt curing accelerator, and a metal chelate curing accelerator. An agent, a microencapsulated curing accelerator, and the like can be used. These may be used alone or in combination of two or more.

  Of these, imidazole-based curing accelerators are effective in imparting a high glass transition temperature and latency. As the imidazole curing accelerator, 2-ethyl-4-methylimidazole and 1-cyanoethyl-2-ethyl-4-methylimidazole are preferable.

The inorganic filler blended in the epoxy resin composition in the present invention is not particularly limited. For example, silica (SiO ₂ ) such as fused silica and crystalline silica, aluminum oxide (Al ₂ O ₃ ), Magnesium oxide (MgO), boron nitride (BN), aluminum nitride (AlN), zinc oxide (ZnO), or the like can be used. These may be used alone or in combination of two or more.

  Also, high dielectric constant fillers such as barium titanate and titanium oxide, magnetic fillers such as ferrite (soft ferrite and hard ferrite), magnesium hydroxide, aluminum hydroxide, antimony trioxide, antimony pentoxide, guanidine salt, boric acid Inorganic flame retardants such as zinc, molybdenum compounds and zinc stannate, talc, barium sulfate, calcium carbonate, mica powder and the like can also be used as inorganic fillers. These inorganic fillers have a high degree of freedom in thermal conductivity, relative permittivity, flame retardancy, particle size distribution, or color tone, and are appropriately formulated and designed for particle size design when desired functions are selectively exhibited. High filling can be easily performed.

  In addition, when an inorganic filler having a maximum particle size of 20 μm or less, preferably 10 μm or less, through holes can be accurately and accurately formed by laser processing or drilling, and drill wear is prevented. can do.

In the present invention, as the inorganic filler, it is preferable to use at least one selected from silica, aluminum oxide, barium titanate, and ferrite. When silica is used, low linear expansion, low moisture absorption, low dielectric constant, low dielectric loss tangent, high strength and high elastic modulus can be achieved, and high heat resistance and surface smoothness can be obtained. Can do. Moreover, when using aluminum oxide, the effect similar to a silica can be acquired, and heat dissipation can be acquired highly. In addition, when barium titanate is used, the dielectric constant can be increased and a substrate with a built-in capacitor can be manufactured. That is, a capacitor layer can be provided in the substrate. When ferrite is used, high electromagnetic shielding characteristics can be ensured.

  The compounding amount of the inorganic filler is preferably 50 to 95% by mass or more, more preferably 70 to 95% by mass with respect to the total amount of the epoxy resin composition (excluding the solvent). By making the compounding quantity of an inorganic filler into this range, the linear expansion coefficient of the sheet-like epoxy resin composition material for electronic component sealing becomes small, and conduction | electrical_connection reliability and mounting reliability improve. For example, high insulation reliability and heat resistance reliability can be ensured with silica by highly blending the inorganic filler in this way. Moreover, high heat dissipation can be ensured with aluminum oxide, high dielectric properties can be ensured with barium titanate, and high electromagnetic shielding properties can be ensured with ferrite.

  In the present invention, it is preferable to add a dispersant to the epoxy resin composition in order to improve the dispersibility of the inorganic filler. Examples of the dispersant include coupling agents such as epoxy silane, mercapto silane, amino silane, vinyl silane, styryl silane, methacryloxy silane, acryloxy silane, titanate, alkyl ethers, and sorbitan esters. Dispersing agents such as those based on alkyl, polyether ether amines, and polymers can be used.

  Then, the epoxy resin composition can be prepared by blending the above-described epoxy resin, curing agent, curing accelerator, inorganic filler, and surface treatment agent, leveling agent, dispersant, etc. of the inorganic filler as necessary. it can.

  A slurry varnish can be prepared by dissolving and diluting the epoxy resin composition in a solvent such as methyl ethyl ketone (MEK) or N, N-dimethylformamide (DMF). At this time, in this invention, it dilutes with a solvent so that solid content concentration (concentration of an epoxy resin composition) may be 5-95 mass%, and a slurry-like varnish is prepared.

  Next, the slurry-like varnish obtained by diluting the epoxy resin composition with this solvent is applied to one side of the carrier material that has been subjected to the mold release treatment, and then heated by hot air spraying or the like to be semi-cured Allow to dry. Thereby, a sheet-like epoxy resin composition material with a carrier material can be obtained.

  Here, as a carrier material (base film), for example, a polymer film, a metal film, or the like that has been subjected to a release treatment on one or both sides can be used. Examples of the polymer film that can be used include polyolefins such as polypropylene and polyvinyl chloride, polyesters such as polyethylene terephthalate (PET), polycarbonate, acetyl cellulose, tetrafluoroethylene, and polyphenylene sulfide. Moreover, as a metal film, metal foils, such as copper foil, aluminum foil, nickel foil, etc. can be used, for example.

  As the carrier material, it is preferable to use a polyester, particularly a polyethylene terephthalate (PET) film, in terms of cost and heat resistance.

  The thickness of the carrier material is usually 10 to 200 μm.

  The mold release treatment can be performed, for example, by coating the surface of the carrier material with organopolysiloxane, modified organopolysiloxane, fluorine-based polymer or the like.

The sheet-like epoxy resin composition material of the sheet-like epoxy resin composition material with a carrier material is in a semi-cured state on the surface of the carrier material subjected to the release treatment. The semi-cured state is a so-called B-stage state, which is a state in which the epoxy resin composition is partially reacted by heating the epoxy resin composition. Accordingly, the sheet-like epoxy resin composition material has the property of being once melted by the heat and pressure of lamination molding and then cured, as in the case of the conventional prepreg.

  Moreover, it is preferable that the amount of the solvent remaining after drying is less than 0.5% by mass with respect to the total amount of the sheet-like epoxy resin composition material. When the amount of the solvent increases, voids are likely to occur during molding.

  As described above, at least two sheet-shaped epoxy resin composition materials with a carrier material in a semi-cured state obtained by applying an epoxy resin composition diluted in a solvent to a carrier material and drying are prepared.

  As the next step, two of the sheet-like epoxy resin composition materials with a carrier material are superposed so that the sheet-like epoxy resin composition materials are in contact with each other, and this superposition is performed a plurality of times as necessary. Finally, all the sheet-like epoxy resin composition materials are overlapped on the inside of the two carrier materials to increase the thickness so that the total thickness of the sheet-like epoxy resin composition materials becomes 150 to 500 μm. Thereby, it becomes possible to produce a sheet-shaped epoxy resin composition material for encapsulating thick electronic components with a small volatile content in a uniform dry state in a short time.

  The thickness of the sheet-like epoxy resin composition material with a carrier material is preferably 75 to 250 μm as the thickness after drying of the epoxy resin composition. If this thickness is too small, a large number of overlapping sheets are required to obtain a final thickness of 150 to 500 μm, which complicates the process, and the consumption of auxiliary materials may increase. On the other hand, if this thickness is too large, it may be difficult to dry uniformly, which may be insufficient in terms of productivity.

  In a preferred embodiment, two sheets of a semi-cured sheet-like epoxy resin composition material with a carrier material obtained by applying and drying the epoxy resin composition on a carrier material so that the thickness after drying becomes 75 to 250 μm are prepared. . Then, these sheet-like epoxy resin composition materials with a carrier material are stacked so that the sheet-like epoxy resin composition materials are in contact with each other, and the sheet-like epoxy resin composition material is thickened so that the total thickness of the sheet-like epoxy resin composition materials is 150 to 500 μm. Let This makes it possible to more efficiently produce a thick electronic component sealing sheet-like epoxy resin composition material having a small volatile content and a uniform dry state.

  In this case, as the two sheet-like epoxy resin composition materials with a carrier material, those having different flow properties at the molding temperature of the sheet-like epoxy resin composition material are used, ensuring insulation and incorporating electronic components. It is possible to appropriately balance the securing of the layer. For example, 0.1 to 2% by mass of nitrile butadiene rubber or butadiene rubber having a weight average molecular weight of 20,000 to 1,000,000 is added to one of the two sheet-like epoxy resin composition materials with a carrier material. It is preferable to mix. By doing in this way, it becomes possible to superimpose a high fluidity layer and a low fluidity layer almost without changing the composition of two sheet-like epoxy resin composition materials.

  In the present invention, the sheet-like epoxy resin composition material with a carrier material can be superposed using a roll laminator. Although the pressure conditions of a roll laminator are not specifically limited, For example, it can carry out at a normal pressure.

  Moreover, you may superimpose the sheet-like epoxy resin composition material with a cut | disconnected carrier material other than the superimposition by a roll laminator.

  Superposition of a sheet-like epoxy resin composition material with a carrier material by a roll laminator is, for example, in-line immediately after application of the epoxy resin composition of one sheet-like epoxy resin composition material with a carrier material and the other prepared in advance. It can carry out continuously by supplying the sheet-like epoxy resin composition material with a carrier material.

  Alternatively, after the application and drying of the epoxy resin composition, each sheet-like epoxy resin composition material with a carrier material is wound around a separate roll as a separate process, and then unwound from these two rolls. You may superimpose as a separate process.

  The sheet-like epoxy resin composition material with a carrier material wound in advance on a roll is preferably covered with a cover film on the surface opposite to the carrier material. Then, by removing the cover film immediately before the overlapping, it is possible to prevent foreign matters from being mixed. As the cover film, a film that has been subjected to a release treatment in advance or a polyolefin-based easily peelable film can be preferably used. By using these, the sheet-like epoxy resin composition material can be easily peeled off from the carrier material without heating. As a result, it is easy to adjust the thickness by adjusting the number of stacked sheets.

  In addition, when the three or more sheet-like epoxy resin composition materials with a carrier material are superposed, the superposition order is arbitrary, and the superposed ones may be further superposed.

  FIG. 1 is a diagram showing an example of a method for producing a sheet-like epoxy resin composition material for electronic component sealing according to the present invention. In this example, one sheet-like epoxy resin composition material 1a with a carrier material is composed of a sheet-like epoxy resin composition material 10a, a carrier material 11a, and a cover film 12a, and is previously wound around a roll (not shown) as a separate process. The one that has been turned is used.

  The other sheet-like epoxy resin composition material 1b with a carrier material is composed of a carrier material 11b and a sheet-like epoxy resin composition material 10b immediately after the epoxy resin composition is applied and dried.

  And the sheet-like epoxy resin composition material 1a with a carrier material and the sheet-like epoxy resin composition material 1b with a carrier material are laminated by the roll laminator 30 provided with the rolls 23 and 24 as follows. The sheet-like epoxy resin composition material 1b with a carrier material is continuously supplied to the roll laminator 30 via the roll 22 in-line immediately after application and drying of the epoxy resin composition. On the other hand, after peeling the cover film 12a from the sheet-like epoxy resin composition material 1a with a carrier material with the roll 21 downstream of the roll 20, the sheet-like epoxy resin composition material 1b with a carrier material is supplied to the roll laminator 30. The sheet-like epoxy resin composition material 1a with a carrier material and the sheet-like epoxy resin composition material 1b with a carrier material are brought into contact with each other so that the sheet-like epoxy resin composition material 10a and the sheet-like epoxy resin composition material 10b are in contact with each other. Lamination is performed by rolls 23 and 24 of a roll laminator 30.

  In the present invention, as described above, the sheet-like epoxy resin composition material is finally overlapped inside the two carrier materials so that the total thickness of the sheet-like epoxy resin composition material becomes 150 to 500 μm. Increase the film thickness. If the thickness is smaller than 150 μm, it may be difficult to secure an insulating layer in which an IC or a passive component is embedded. On the other hand, if this thickness exceeds 500 μm, the insulating layer after molding becomes thick, resulting in high cost and weight problems, and in terms of quality, embedding paste by forming vias that penetrate the insulating layer. May be difficult.

  As described above, in the present invention, a plurality of sheet-like epoxy resin composition materials can be stacked to easily increase the film thickness, and thus is particularly effective for sealing a passive component having a height or an IC. Moreover, the volatile matter in the finally obtained sheet-like epoxy resin composition material for encapsulating electronic parts is small, and for example, a loss of 0.5% or less can be obtained at 160 ° C. for 15 minutes. Furthermore, it is possible to obtain a sheet-like epoxy resin composition material for encapsulating an electronic component having a low volatile content with a uniform volatile content with respect to the thickness.

  The thus produced sheet-shaped epoxy resin composition material for encapsulating electronic components is used as a molding material for a substrate. For example, a known method is applied to a multilayer circuit board, a component-embedded substrate, an IC encapsulation. Packages, heat insulators, etc. can be manufactured. The molded product using the sheet-like epoxy resin composition material for electronic component sealing was formed by press molding of a material containing the sheet-like epoxy resin composition material for electronic component sealing, or by roll laminator, vacuum laminator, or the like. Then, it can obtain as hardened | cured material by performing post-hardening as needed. Such molding can be performed, for example, under conditions of a pressure of 0.1 to 10 MPa, a temperature of 150 to 200 ° C., and a time of 10 to 240 minutes.

EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples at all.
<Example 1>
A bisphenol A type epoxy resin (manufactured by DIC Corporation, “850S”) was used as the epoxy resin.

  A phenol novolac resin (Maywa Kasei Kogyo Co., Ltd., “DL92”) was used as a curing agent.

    As a curing accelerator, imidazole (manufactured by Shikoku Chemicals Co., Ltd., “2E4MZ”) was used.

  Silica (manufactured by Admatechs, “SO25R”) was used as the inorganic filler.

  33 parts by mass of an epoxy resin, 33 parts by mass of a curing agent, 1 part by mass of a curing accelerator, 400 parts by mass of an inorganic filler, and 4 parts by mass of a coupling agent as other components are blended into a planetary mixer. And kneaded to obtain an epoxy resin composition.

  The slurry varnish was obtained by mix | blending and diluting 70 mass parts of methyl ethyl ketone of a solvent to this.

  Next, this slurry-like varnish was applied to a carrier material made of a film made by Toray Film Processing Co., Ltd. having a thickness of 75 μm. In addition, the surface of the carrier material used in advance was subjected to a release treatment with silicone.

  Thereafter, the carrier material coated with the slurry-like varnish is heated and dried at 150 ° C. for 10 minutes, whereby a sheet-like epoxy resin with a carrier material having a semi-cured sheet-like epoxy resin composition material on one side of the carrier material is provided. A composition material was obtained. Two sheet-like epoxy resin composition materials with a carrier material were produced, and a cover film was covered on the surface opposite to the carrier material.

These two sheet-like epoxy resin composition materials with a carrier material are peeled off the cover film, and then overlapped at normal pressure with a roll laminator so that the sheet-like epoxy resin composition materials are in contact with each other. The film was thickened so that the total thickness of the material was 300 μm. Thus, an electronic component sealing sheet-like epoxy resin composition material was obtained. <Comparative Example 1>
In Example 1, the carrier material coated with the slurry varnish was heated and dried to obtain a sheet-like epoxy resin composition material for sealing an electronic component having a thickness of 300 μm in a semi-cured state on one side of the carrier material. The drying temperature was the same as in Example 1, and the drying times were 15 minutes, 20 minutes, and 25 minutes, respectively.
[Evaluation]
About the sheet-like epoxy resin composition material for electronic component sealing of Example 1 and Comparative Example 1, heat loss and flexibility were evaluated. The loss on heating was measured by drying the sheet-like epoxy resin composition material for electronic component sealing at 165 ° C./15 minutes and measuring the weight before and after the drying.

  As a result of the evaluation, the heat loss was 0.15% in the sheet-shaped epoxy resin composition material for sealing an electronic component of Example 1. In contrast, the sheet-shaped epoxy resin composition material for sealing an electronic component of Comparative Example 1 had 0.35%, 0.20%, and 0.13% for the drying time of 15 minutes, 20 minutes, and 25 minutes, respectively. It was.

  In addition, the flexibility of the sheet-like epoxy resin composition material for encapsulating an electronic component of Example 1 was easy to wind with a roll and was also easy to cut with a cutter without falling off. On the other hand, in the sheet-like epoxy resin composition material for sealing an electronic component of Comparative Example 1, a material having a drying time of 15 minutes was flexible, but a material having a drying time of 20 minutes had a large amount of heat loss (0. 2%), however, it was poor in flexibility and could be wound up with a roll, but the powder was severely fallen during cutting with a cutter. Moreover, the thing with a drying time of 25 minutes had a problem in flexibility, so that it cracked when winding with a roll.

  Thus, the electron of Example 1 which made the sheet-like epoxy resin composition material with a carrier material overlap so that sheet-like epoxy resin composition materials may contact | connect, and was thickened so that total thickness might be 150-500 micrometers. The sheet-like epoxy resin composition material for component sealing has a very small loss on heating and also has flexibility (flexibility). And the thick sheet | seat of the uniform dry state with such a small volatile content was able to be produced in a short time.

Claims (9)

  A semi-cured state obtained by applying an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler as essential components to a carrier material and drying the epoxy resin composition diluted in a solvent at a solid content concentration of 5 to 95% by mass. A step of preparing at least two sheet-like epoxy resin composition materials with a carrier material, and two of the sheet-like epoxy resin composition materials with the carrier material so that the sheet-like epoxy resin composition materials are in contact with each other. The sheet-like epoxy resin composition material is finally superposed on the inner side of the two sheets of carrier material by overlapping and performing this overlapping a plurality of times as necessary. A sheet-like epoxy resin composition for encapsulating electronic components, comprising a step of increasing the film thickness to a total thickness of 150 to 500 μm Method of manufacturing the material.   Two sheets of a semi-cured sheet-like epoxy resin composition material with a carrier material obtained by applying and drying the epoxy resin composition on a carrier material so that the thickness after drying becomes 75 to 250 μm are prepared. The sheet-like epoxy resin composition material with carrier material is overlapped so that the sheet-like epoxy resin composition materials are in contact with each other, and the total thickness of the sheet-like epoxy resin composition material is increased to 150 to 500 μm. The manufacturing method of the sheet-like epoxy resin composition material for electronic component sealing of Claim 1 characterized by the above-mentioned.   3. The electronic component according to claim 2, wherein the two sheet-like epoxy resin composition materials with a carrier material are different in fluidity at the molding temperature of the sheet-like epoxy resin composition material. The manufacturing method of the sheet-like epoxy resin composition material for sealing.   0.1 to 2% by mass of nitrile butadiene rubber or butadiene rubber having a weight average molecular weight of 20,000 to 1,000,000 is added to one of the two sheet-like epoxy resin composition materials with a carrier material. The manufacturing method of the sheet-like epoxy resin composition material for electronic component sealing of Claim 3 characterized by the above-mentioned.   Each of the sheet-like epoxy resin composition materials includes, as an inorganic filler, at least one selected from silica, aluminum oxide, barium titanate, and ferrite in an amount of 50 to 95% by mass based on the total amount of the epoxy resin composition. The method for producing a sheet-like epoxy resin composition material for sealing an electronic component according to any one of claims 1 to 4, wherein the composition is blended.   A multilayer circuit board formed by using a sheet-like epoxy resin composition material for electronic component sealing obtained by the method according to any one of claims 1 to 5.   A circuit board with a built-in component, which is molded using the sheet-like epoxy resin composition material for sealing an electronic component obtained by the method according to any one of claims 1 to 5.   An IC sealing package, which is molded using the sheet-like epoxy resin composition material for electronic component sealing obtained by the method according to any one of claims 1 to 5.   A heat dissipating insulator, which is molded using the sheet-shaped epoxy resin composition material for electronic component sealing obtained by the method according to any one of claims 1 to 5.

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