JP5305940B2 - Manufacturing method of reflector mold - Google Patents

Description

The present invention relates to a mold for manufacturing how used in the manufacture of the reflector to be applied to such a reflective liquid crystal display device.

  2. Description of the Related Art Conventionally, as a reflection plate applied to a reflective liquid crystal display device or the like, a reflection plate in which triangular pyramid prisms are closely arranged on one surface and a highly reflective metal film such as silver is formed on the surface thereof is known. . In addition, as a method of manufacturing this type of reflector, after manufacturing a mold having a triangular pyramid prism in which the concave and convex directions are opposite to those of the triangular pyramid prism formed on the reflector, this mold triangular pyramid prism There is known a method of transferring the light to a reflector material (see, for example, Patent Document 1).

  Patent Document 1 describes a method for producing a mold used for forming a reflector as shown in FIG. In addition, the code | symbol (a)-(e) of FIG. 7 has shown the cross-sectional shape of the metal mold | die in each manufacturing stage, and the code | symbol (f)-(j) of FIG. 7 shows the planar shape of the metal mold | die in each manufacturing stage. Show.

  In manufacturing the mold, first, in step 1, as shown in FIGS. 7 (a) and 7 (f), on the base substrate 100 such as glass, the top of each other is in contact with the photoresist. A number of regular triangular prisms 101 arranged in the same direction are formed. Thereby, a concave portion 102 having a triangular planar shape is formed in an adjacent portion of each regular triangular prism 101.

  Next, in step 2, Ni-P electroless plating is applied to the base substrate 100 on which the triangular prisms 101 formed in step 1 are arranged, and then the interface between the Ni-P electroless plating and the photoresist is peeled off. 7 (b) and (g), a first electroforming mold 105 in which a regular triangular prism-shaped concave portion 103 is formed in a portion corresponding to the regular triangular prism 101, and a regular triangular prism 104 is formed in a portion corresponding to the concave portion 102. Is made.

  Next, in step 3, the regular triangular prism 104 of the manufactured first electroforming mold 105 is cut to form a triangular pyramid 106 having a predetermined height as shown in FIGS. 7 (c) and 7 (h). Thereby, a concave portion 107 having a triangular planar shape is formed in an adjacent portion of each triangular pyramid 106.

  Next, in step 4, the second electroplating process is performed on the first electroforming mold 105 in which the triangular pyramids 106 formed in step 3 are arranged, and then the interface between the second plating body and the first electroforming mold 105 is peeled off. Then, as shown in FIGS. 7D and 7I, a triangular pyramid-shaped concave portion 108 is formed in a portion corresponding to the triangular pyramid 106, and a regular triangular prism 109 is formed in a portion corresponding to the concave portion 107. A two-electroforming mold 110 is produced.

  Finally, in step 5, the regular triangular prism 109 of the produced second electroforming mold 110 is cut, so that the triangular pyramids 111 having a predetermined height are closely packed as shown in FIGS. 7 (e) and 7 (j). An arrayed reflector manufacturing mold 112 is obtained.

JP 2006-189664 A

  However, the conventional mold manufacturing method shown in FIGS. 7 (a) to 7 (j) repeats the plating process and the peeling process twice, so that the warpage of the electroforming mold increases every plating and every peeling. The deformation of the electroforming mold becomes large, and it becomes difficult to form an accurate triangular pyramid 111 on the reflector manufacturing die 112 by cutting. For this reason, the optical characteristics of the reflector manufactured from the reflector manufacturing mold 112 are not so high.

  The present invention has been made in order to solve such problems of the prior art, and an object of the present invention is to provide a mold manufacturing method for manufacturing a highly accurate reflector, and to provide a reflection with good optical characteristics. To provide a board.

  In order to solve the above problems, the present invention relates to a manufacturing method of a reflector manufacturing mold. First, a large number of triangular pyramid-shaped convex portions are formed in a close-packed arrangement on one side of a silicon substrate by cutting. The first convex portion group in which each vertex on the bottom surface is directed in a specific direction, and the first convex portion group forms a second convex portion group in which the orientation of each vertex on the bottom surface is different by 180 °. A step of forming a photoresist layer on the convex formation surface of the silicon substrate, and a portion corresponding to the first convex group in the photoresist layer, each of which constitutes the first convex group A step of forming a through hole having the same triangle shape as the bottom surface of the convex portion and the direction of each vertex being the same, and using the photoresist layer in which the through hole of the triangle is formed as a mask on one side of the silicon substrate Dry etching is performed, and the first convex group is And a step of forming a triangular prism-shaped recess in the portion where the first protrusion group is removed, and after removing the photoresist layer, electroforming a mold material on one side of the silicon substrate, Producing a mold material having a triangular pyramid-shaped concave portion transferred from the second convex portion group and a triangular prism-shaped convex portion transferred from the triangular prism-shaped concave portion; and from the mold material, the silicon After removing the substrate, the triangular prism-shaped convex portion is cut to form a triangular pyramid-shaped convex portion that is the same shape as the triangular pyramid-shaped concave portion.

  According to such a configuration, a required mold for manufacturing a reflector can be manufactured by performing only one plating (electroforming) process. Therefore, compared to the case where two plating processes are repeated, plating is performed and plating is peeled off. The deformation of the mold at the time can be suppressed.

  The present invention also relates to a method of manufacturing a reflector manufacturing mold. Secondly, a plurality of triangular prism-shaped concave portions arranged in the same direction with their vertices in contact with each other on one side of the first silicon substrate. A step of forming by dry etching, a step of bonding a second silicon substrate to a recess forming surface of the first silicon substrate via a silicon oxide film, and a plurality of triangular pyramid-shaped convex portions on the second silicon substrate. Are formed in a close-packed arrangement by cutting, and each vertex on the bottom surface is oriented in the same direction as a triangular prism-shaped concave portion formed on one side of the first silicon substrate, and is arranged above the concave portion. A step of forming a convex portion group and a second convex portion group in which the direction of each vertex on the bottom surface is 180 ° different from the first convex portion group, and each convex portion constituting the second convex portion group Silicon oxide film formed around A step of removing the first convex portion group; and a triangle transferred from the second convex portion group by electroforming a mold material on one surface of the first silicon substrate having the second convex portion group. A step of producing a mold material having a conical recess and a triangular prism-shaped projection transferred from the triangular prism-shaped recess; and after removing the first silicon substrate from the mold material, the triangular prism shape And a step of forming a triangular pyramid-shaped convex portion that is the same shape as the triangular pyramid-shaped concave portion.

  Also by this method, a mold for manufacturing a reflector can be manufactured by performing only one plating (electroforming) process. Therefore, compared to the case where two plating processes are repeated, the plating process and the plating peeling process can be performed. Deformation of the mold can be suppressed.

  In the manufacturing method of the reflector manufacturing mold of the present invention, a required mold can be manufactured by performing only one plating (electroforming) process, and therefore, compared with the case of repeating two plating processes. In addition, it is possible to suppress the deformation of the mold when the plating is peeled off, and it is possible to manufacture a mold capable of replicating the reflector with high accuracy and good optical characteristics.

It is an AA end view of Drawing 2 showing the metallic mold manufacturing method concerning a 1st embodiment. It is a top view which shows the metal mold | die manufacturing method which concerns on 1st Embodiment. It is a BB end view of Drawing 4 showing the metallic mold manufacturing method concerning a 2nd embodiment. It is a top view which shows the metal mold | die manufacturing method concerning 2nd Embodiment. It is sectional drawing which shows the manufacturing method of a reflecting plate. It is sectional drawing of the reflecting plate which concerns on this invention. It is process explanatory drawing of the metal mold | die manufacturing method which concerns on a prior art example.

<A 1st embodiment of a manufacturing method of a metallic mold for reflector production>
1st Embodiment of the manufacturing method of the metal mold | die for reflector manufacture which concerns on this invention is described using FIG.1 and FIG.2.

  First, as shown in FIG. 1A and FIG. 2A, triangular pyramid-shaped convex portions 2 are formed in a close-packed arrangement on one surface of a silicon substrate 1 by ductile mode cutting (first step). ). Note that the mark ● displayed in FIG. 2A indicates the apex of each convex portion 2. When the triangular pyramid-shaped convex portions 2 are arranged in a close-packed manner, as shown in FIG. 2 (a), the convex portion 2a having an upward triangular bottom surface and the convex portion 2b having a downward triangular shape are alternately in contact with one side of the bottom surface. Formed. Such a set of convex portions 2 is composed of three directions whose directions are different from each other by 60 ° within a plane along the surface of the silicon substrate 1 (FIG. 2A). Ll direction, mm direction, and nn direction).

  Next, as shown in FIG. 1B, a photoresist layer 3 is uniformly formed on the surface of the silicon substrate 1 on which the convex portions 2 are formed (second step). Formation of the photoresist layer 3 on the silicon substrate 1 can be performed by a method of attaching a dry resist film, a method of spin-coating a liquid resist, and drying.

  Next, as shown in FIGS. 1C and 2B, a large number of through holes 4 having a triangular planar shape are formed in a predetermined arrangement in the photoresist layer 3 (third step). In this example, the through-hole 4 is formed in the part corresponding to the convex part 2b in which one vertex in the bottom face was formed downward among the convex parts 2 formed in the silicon substrate 1. The through-hole 4 is formed by, for example, forming a photoresist layer 3 using a positive photoresist material and positioning a light-shielding mask having an opening corresponding to the through-hole 4 on the photoresist layer 3. After the photoresist layer 3 is exposed through the light shielding mask, the photoresist layer 3 can be developed to remove the exposed portion.

  Next, as shown in FIG. 1 (d), dry etching was performed on one surface of the silicon substrate 1 using the photoresist layer 3 in which the through holes 4 were formed as a mask, and one vertex on the bottom surface was formed downward. The convex portion 2a is removed, and a triangular prism-shaped concave portion 5 is formed in the surface layer portion of the silicon substrate 1 below the convex portion 2a (fourth step). The dry etching methods include reactive gas etching, reactive ion etching, reactive ion beam etching, ion beam etching, and reactive laser beam etching. These dry etching methods are the same as the photoresist material used. Therefore, when the recess 5 is formed, an appropriate dry etching method corresponding to the photoresist material to be used is selected.

  Next, after removing the remaining portion of the photoresist layer 3 from the surface of the silicon substrate 1, a mold material such as nickel is electroformed on one side of the silicon substrate 1 as shown in FIG. A mold material 8 having a triangular pyramid-shaped concave portion 6 transferred from the convex portion 2 and a triangular prism-shaped convex portion 7 transferred from the triangular prism-shaped concave portion 5 is produced (fifth step).

  Finally, the silicon substrate 1 is peeled from the mold material 8 and the mold material 8 shown in FIG. 1 (f) is taken out alone, and then the triangular prism-shaped convex portion 7 is cut to obtain FIG. As shown in FIG. 2G and FIG. 2C, a reflector manufacturing die 10 having a triangular pyramid-shaped concave portion 6 and a triangular pyramid-shaped convex portion 9 in which the concave and convex directions of the concave portion 6 are reversed. To obtain (sixth step). In FIG. 2C, for easy understanding, a circle mark is displayed at the bottom of the concave portion 6 and a mark ● is displayed at the vertex of the convex portion 9.

  In the manufacturing method of the reflector manufacturing mold of this example, the required reflector manufacturing mold 10 can be manufactured by performing only one plating (electroforming) step in the fifth step, so that the plating is performed twice. Compared with the conventional manufacturing method of reflector molds that repeats the process, it is possible to suppress the deformation of the mold at the time of plating and plating peeling, and it is possible to duplicate the reflector with high accuracy and good optical characteristics A mold can be manufactured. Moreover, since the manufacturing method of the reflector manufacturing die of this example cuts the silicon substrate 1 in the ductile mode in the first step, the silicon substrate 1 is not cracked and a good product is manufactured with a high yield. Can do.

<Second Embodiment of Manufacturing Method of Reflector Production Mold>
2nd Embodiment of the manufacturing method of the metal mold | die for reflector manufacture which concerns on this invention is described using FIG.3 and FIG.4.

  First, as shown in FIGS. 3 (a) and 4 (a), a number of triangular prisms having triangular bases arranged in the same direction on one side of the first silicon substrate 11 with their vertices in contact with each other. The recess 12 is formed by dry etching (first step). In the first silicon substrate 11 manufactured in the first step, the portion in contact with each recess 12 is a triangular plane. The recess 12 is formed on the first silicon substrate 11 by forming a photoresist layer on one surface of the first silicon substrate 11 and opening a through hole corresponding to the recess 12 in the photoresist layer, and then masking the photoresist layer. As described above, it can be performed by a method of performing dry etching on one surface of the first silicon substrate 11. The formation of the photoresist layer on the first silicon substrate 11 can be performed by a method of attaching a dry resist film or a method of spin-coating and drying a liquid resist. For example, a photoresist layer is formed using a positive photoresist material, and a light shielding mask having an opening corresponding to a through hole is positioned and set on the photoresist layer. After the photoresist layer is exposed, the photoresist layer can be developed to remove the exposed portion. Also, as dry etching methods, reactive gas etching, reactive ion etching, reactive ion beam etching, ion beam etching, reactive laser beam etching, and the like are appropriately performed according to the photoresist material to be used. You can choose the law.

  Next, as shown in FIG. 3B, the second silicon substrate 14 is bonded to the surface of the first silicon substrate 11 where the recess 12 is formed via the silicon oxide film 13 (second step). The silicon oxide film 13 can be formed in advance on one surface of the second silicon substrate 14, and the second silicon substrate 14 is bonded to the first silicon substrate 11 by pressing between the members 11 and 14 under heating. Can be added. In addition, after joining with the 1st silicon substrate 11, the thinning process by grinding | polishing is performed to the surface of the 2nd silicon substrate 14 as needed.

  Next, as shown in FIG. 3C and FIG. 4B, triangular pyramid-shaped convex portions 15 are formed on the second silicon substrate 14 in a close-packed arrangement by ductile mode cutting (third). Process). When the triangular pyramid-shaped convex portions 15 are arranged in a close-packed manner, as shown in FIG. 4 (b), the convex portion 15a with one apex on the bottom face upward and the convex portion 15b with a downward direction are alternately formed. The arrangement of the convex portions 15 is adjusted above the concave portion 12 formed in the first silicon substrate 11 so that the convex portion 15 having the same vertex as the concave portion 12 is formed on the bottom surface. . Such a set of convex portions 15 is formed by three directions in which a cutting edge formed at an angle of the blade edge of 60 ° is different in orientation by 60 ° within a plane along the surface of the silicon substrate 1 (FIG. 4B). Ll direction, mm direction, and nn direction).

  Next, as shown in FIGS. 3D and 4C, the silicon oxide film 13 exposed on the surface of the first silicon substrate 11 is removed by solvent treatment (fourth step). In this process, the convex portion 15 formed above the concave portion 12 formed in the first silicon substrate 11 via the silicon oxide film 13 is also removed. Therefore, the triangular silicon concave portions 12 and the convex portions 15 are alternately formed in the surface direction on the first silicon substrate 11 after the fourth step.

  Next, as shown in FIG. 3E, a mold material such as nickel is electroformed on one surface of the first silicon substrate 11, and the triangular pyramid-shaped concave portion 16 transferred from the triangular pyramidal convex portion 15 is formed. Then, a mold material 18 having a triangular prism-shaped convex portion 17 transferred from the triangular prism-shaped concave portion 12 is produced (fifth step).

  Finally, after peeling the silicon substrate 1 from the mold material 8 and taking out the mold material 18 shown in FIG. 3 (f) alone, the triangular prism-shaped convex portion 17 is cut, and FIG. As shown in FIG. 4G and FIG. 4D, a reflector manufacturing die 20 having a triangular pyramid-shaped concave portion 16 and a triangular pyramid-shaped convex portion 19 in which the direction of the concave and convex portions is reversed. To obtain (sixth step). In FIG. 2D, for easy understanding, a circle mark is displayed at the bottom of the concave portion 16 and a mark ● is displayed at the vertex of the convex portion 19.

  In the manufacturing method of the reflector manufacturing mold of this example, the required reflector manufacturing mold 20 can be manufactured only by performing one plating (electroforming) process in the fifth process. It has the same effect as the manufacturing method of the metal mold | die for reflecting plate manufacture concerning this.

<Configuration of reflector and manufacturing method thereof>
Hereinafter, the configuration of the reflector according to the present invention and the manufacturing method thereof will be described with reference to FIGS.

  As shown in FIG. 5, the reflecting plate according to the present invention is formed on the reflecting plate manufacturing die 10 by pressing the reflecting plate material 30 against the concave / convex pattern forming surface of the reflecting plate manufacturing die 10 under heating, for example. It is formed by transferring the triangular pyramid-shaped concave portion 6 and convex portion 9 to the reflector plate material 30.

  Therefore, as shown in FIG. 6, the reflecting plate 31 according to the present invention includes a triangular pyramid-shaped convex portion 32 transferred from the triangular pyramid-shaped concave portion 6 formed in the reflecting plate manufacturing mold 10, and a reflecting member. Triangular pyramid-shaped concave portions 33 transferred from the triangular pyramid-shaped convex portions 9 formed on the plate manufacturing mold 10 are formed in a close-packed pattern. Even when the reflector manufacturing mold 20 is used, the same reflector 31 can be obtained.

  Since the reflecting plate of the present invention has the triangular pyramid-shaped convex portions 32 and the triangular pyramid-shaped concave portions 33 arranged in a close-packed manner, the reflecting plate in which the triangular pyramid-shaped convex portions are arranged in a close-packed state and an optical device are provided. And can be used as a retroreflector.

  The present invention can be used for manufacturing a reflector that reflects incident light in the incident direction.

DESCRIPTION OF SYMBOLS 1 Silicon substrate 2 Triangular pyramid-shaped convex part 3 Photoresist layer 4 Triangular shape through-hole 5 Triangular prism-shaped concave part 6 Triangular pyramid-shaped concave part 7 Triangular prism-shaped convex part 8 Mold material 9 Triangular pyramid-shaped convex part DESCRIPTION OF SYMBOLS 10 Reflector manufacturing die 11 1st silicon substrate 12 Triangular prism-shaped recessed part 13 Silicon oxide film 14 2nd silicon substrate 15 Triangular pyramid-shaped convex part 16 Triangular pyramid-shaped recessed part 17 Triangular prism-shaped convex part 18 Mold material 19 Triangular pyramid shape 20 Reflector plate mold 30 Reflector material 31 Reflector plate 32 Triangular pyramid convex portion 33 Triangular pyramid concave portion

Claims (2)

A plurality of triangular pyramid-shaped convex portions are formed in a close-packed arrangement on one side of the silicon substrate by cutting, and a first convex portion group in which each vertex on the bottom surface is directed in a specific direction, and the first convex portion A step of forming a second convex portion group, wherein the direction of each vertex on the bottom surface is 180 ° different from the portion group;
Forming a photoresist layer on the convex forming surface of the silicon substrate;
A portion of the photoresist layer corresponding to the first convex portion group has a triangle that is the same as the shape of the bottom surface of each convex portion that constitutes the first convex portion group, and the direction of each vertex is the same. Forming a hole;
Using the photoresist layer in which the triangular through holes are formed as a mask, dry etching was performed on one surface of the silicon substrate to remove the first convex portion group, and the first convex portion group was removed. Forming a triangular prism-shaped recess in the part;
After removing the photoresist layer, a mold material is electroformed on one side of the silicon substrate, and a triangular pyramid-shaped concave portion transferred from the second convex portion group, and a triangular prism transferred from the triangular prism-shaped concave portion Producing a mold material having a convex portion of the shape;
Removing the silicon substrate from the mold material, and then cutting the triangular prism-shaped convex portion to form a triangular pyramid-shaped convex portion having the same shape as the triangular pyramid-shaped concave portion. A method for producing a reflector mold for manufacturing a reflector. Forming a plurality of triangular prism-shaped concave portions arranged in the same direction on one side of the first silicon substrate in contact with each other by dry etching;
Bonding a second silicon substrate to the recess forming surface of the first silicon substrate via a silicon oxide film;
A large number of triangular pyramid-shaped convex portions are formed in the second silicon substrate in a close-packed arrangement by cutting, and each vertex on the bottom surface is in the same direction as a triangular prism-shaped concave portion formed on one side of the first silicon substrate. Forming a first convex portion group that is directed and disposed above the concave portion, and a second convex portion group that is different from the first convex portion group in a direction of each vertex on the bottom surface by 180 °. When,
Removing the silicon oxide film formed around each of the convex portions constituting the second convex portion group and the first convex portion group;
A mold material is electroformed on one surface of the first silicon substrate having the second convex portion group, and transferred from the triangular pyramid-shaped concave portion transferred from the second convex portion group and the triangular prism-shaped concave portion. Producing a mold material having a triangular prism-shaped convex portion,
Removing the first silicon substrate from the mold material, and then cutting the triangular prism-shaped convex portion to form a triangular pyramid-shaped convex portion having the same shape as the triangular pyramid-shaped concave portion. A method for manufacturing a mold for manufacturing a reflecting plate.

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