JP5304634B2 - Electronic components - Google Patents

Description

  The present invention relates to a lead frame for constituting a package in which an electronic component element is accommodated, and more specifically, a shield case portion for electromagnetically shielding an electronic component element, and a hot-side terminal connected to the electronic component element And a lead frame for an electronic component storage package.

  Conventionally, an insert molding technique has been widely used to construct a package of an electronic component element. For example, Patent Document 1 below discloses a structure in which a package for an infrared element as an electronic component element is formed by an insert molding method.

  FIG. 6 is a perspective view of the electronic component device described in Patent Document 1 as viewed from below. FIG. 7 is a front sectional view of the electronic component device described in Patent Document 1. As shown in FIG. The electronic component device 1001 has a package body 1002 made of a resin mold body. A shield case 1003 is embedded in the package body 1002 by insert molding.

  In manufacturing, as shown in FIG. 8, insert molding is performed with the lead frame 1005 brought close to the lead frame 1004 and further overlaid. Thereby, a structure in which the shield case 1003 is embedded in the package main body 1002 is obtained. In FIG. 8, the lead frame 1004 is connected to a shield case 1003 formed by deep drawing. The shield case 1003 has a substantially rectangular parallelepiped shape having an opening opened upward. In FIG. 8, the lower surface 1003a side of the shield case 1003 is illustrated. As shown in FIG. 6, a ground terminal 1006 formed by cutting and raising is formed on the lower surface 1003 a of the shield case 1003. In addition, a plurality of through holes are formed in the lower surface 1003a. Hot side terminals 1007 and 1007 are arranged so as to reach the through hole and not to contact the shield case 1003. The hot side terminals 1007 and 1007 are provided on the lead frame 1005 of FIG.

  Further, as shown in FIGS. 6 and 7, a ground terminal 1008 is formed by cutting inward from the lower surface 1003a of the shield case 1003.

  At the time of insert molding, as shown in FIG. 8, the lead frame 1005 is brought close to the lead frame 1004, and the hot-side terminals 1007 and 1007 are inserted into the through holes of the lower surface 1003a and positioned. In this state, insert molding is performed to form the package body 1002.

  As shown in FIG. 7, the package body 1002 made of the resin mold body has an opening 1002a on the upper side. An infrared sensor element S is accommodated in the opening 1002a. After housing the infrared sensor element S, the opening 1002a is closed by the optical filter 1009 having a shielding function.

  The hot side terminal electrode of the infrared sensor element S is electrically connected to the hot side terminals 1007 and 1007, and the ground potential side terminal electrode is electrically connected to the ground terminal 1008. Accordingly, the terminal electrode connected to the ground potential of the infrared sensor element S is electrically connected to the shield case 1003 via the ground terminal 1008. The shield case 1003 has the ground terminals 1006 and 1006 described above.

  When the electronic component device 1001 is mounted on a circuit board or the like, the electronic component device 1001 is turned upside down from the state shown in FIG. Then, the ground terminals 1006 and 1006 are electrically connected to electrodes connected to the ground potential on the circuit board. Further, the hot side terminals 1007 and 1007 are electrically connected to electrodes connected to the hot side potential on the circuit board.

WO2006 / 126441

  In the electronic component device 1001, the substantially rectangular parallelepiped shield case 1003 having an opening on the upper side has to be formed by deep drawing. In addition, a lead frame 1004 constituting the shield case 1003 and a lead frame 1005 provided with hot-side terminals 1007 and 1007 have to be prepared. Therefore, the number of parts was large. In addition, the lead frame 1005 must be aligned with the lead frame 1004 and placed in the mold in that state. Therefore, the manufacturing process is complicated.

An object of the present invention, the number of lead frame for constituting the shield case and the external terminal that can be reduced, and may play a simplification and reduction in cost of the manufacturing process, to provide an electronic component is there.

An electronic component according to the invention of the present invention is an electronic component comprising a metal plate, and a package body is formed by insert molding using one lead frame for forming a shield case portion and a hot-side terminal portion. A bottomed substantially rectangular parallelepiped package body having an opening opened upward, and an electronic component element housed in the opening of the package body, wherein the package body is made of a metal plate, It has a shield case part and a resin mold body integrally formed by insert molding. The shield case part has a bottom part and a side shield part connected to the bottom part. The outer peripheral edge of the bottom portion has a rectangular shape having first and second sides facing each other and third and fourth sides facing each other. The side shield portion, the first was chosen in the first, second side, have a second side shield section, said first, second side shield section, respectively, first, second A side shield part main body, and first and second extensions that extend outward from the side shield part main body on both sides of the first side and the second side in the extending direction; The two side shield portions are bent along the first and second sides with respect to the bottom surface portion, and thereby configured to shield the side surface of the electronic component element disposed above the bottom surface portion. Has been.

In yet another specific aspect of the electronic components according to the present invention, the first, such that the second extension portion, each extending in the direction along the third and fourth side, said first, second Are extended from the first and second side shield part main bodies, and the first and second extension parts form side shield parts along the third and fourth sides. The

In yet another specific aspect of the electronic components according to the present invention, the bottom portion has an opening, the hot-side terminal, extends to the opening portion so as not to contact the side surface portion and the side surface shield portions It is being done.

In the electronic component according to the present invention, since both of the shield case unit and the hot-side terminal portion is provided, it is possible to reduce the number of lead frame for constituting a package. In addition, since a complicated positioning operation between the shield case portion and the hot-side terminal portion is not required, the manufacturing process can be simplified. Therefore, the cost of the electronic component device can be reduced.

It is a perspective view which shows the lead frame for electronic component storage packages of one Embodiment of this invention. FIG. 2 is a plan view showing the electronic component storage package lead frame of the embodiment shown in FIG. 1 before a side shield part is bent. 1 is a schematic exploded perspective view of an electronic component device according to an embodiment of the present invention. It is a perspective view showing typically the state where the structure which removed the shield cover from the electronic component device of one embodiment of the present invention is mounted on the circuit board. It is a top view of the package main body prepared by one Embodiment of this invention. It is the perspective view which showed an example of the conventional electronic component apparatus and was seen from the lower surface side of the electronic component apparatus. It is front sectional drawing of the conventional electronic component apparatus. It is a perspective view which shows the some lead frame prepared at the time of manufacture of the conventional electronic component apparatus.

  Hereinafter, the present invention will be clarified by describing specific embodiments of the present invention with reference to the drawings.

  FIG. 3 is an exploded perspective view of the electronic component device according to the embodiment of the present invention. The electronic component device 1 has a package body 2. The package body 2 has an opening 2a opened upward. The package body 2 is made of a resin mold body.

  The opening 2a has a rectangular shape. Accordingly, the package body 2 has a bottomed, substantially rectangular parallelepiped shape.

  The package body 2 includes a bottom plate portion 3 having a rectangular planar shape and first to fourth side surface portions 4 to 7 extending upward from four sides of the bottom plate portion 3.

  A storage space surrounded by the first to fourth side surface portions 4 to 7 and the bottom plate portion 3 is formed. An FET 8 as an electronic component element is stored in this storage space.

  A ceramic plate 9 made of ceramics is attached so as to close the opening 2a. The ceramic plate 9 has a flat plate shape. Blackening films 10 and 10 are provided on the upper surface of the ceramic plate 9. The blackening films 10 and 10 are made of, for example, black ink. The ceramic plate 9 provided with the blackening films 10 and 10 constitutes an infrared detection unit.

  In addition, a carbon paste layer C schematically shown by a broken-line frame is formed on the upper surface of the ceramic plate 9. Further, an optical filter plate 11 made of silicon is laminated on the upper surface of the ceramic plate 9. The laminated body of the ceramic plate 9 and the optical filter plate 11 constitutes a lid member that closes the opening 2a.

  In the electronic component device 1, a shield case and a hot-side terminal are formed using an electronic component storage package lead frame as an embodiment of the present invention described below. This will be specifically described below.

  In the electronic component device 1 of the present embodiment, an electronic component storage package lead frame shown in a plan view in FIG. 2 is prepared. The electronic component storage package lead frame 21 is made of a single metal plate. In this metal plate, openings 22a, 22b and 22c are provided in the lead frame frame 22 by punching. Thereby, portions for configuring the shield case portion 23, the hot side terminals 24 and 25, and the ground side terminal 26 shown in FIG. 1 are formed. As shown in FIG. 1, the shield case portion 23 has a bottom surface portion 27 whose outer peripheral plane has a rectangular planar shape. The bottom surface portion 27 faces the opening 22b shown in FIG.

  The bottom surface portion 27 has first and second sides 27a and 27b that face each other.

  As shown in FIG. 2, the 1st side shield part 28 is continued on the outer side of the 1st edge | side 27a. The first side shield part 28 has a first side shield part main body 28a. First and second extension portions 29 and 30 are provided on both sides in the length direction of the first side 27a of the first side shield portion main body 28a. In FIG. 2, broken lines A and B indicate boundaries between the first side shield part main body 28 a and the first and second extension parts 29 and 30. As shown in FIG. 1, along the broken lines A and B, the extension portions 29 and 30 are further bent toward the second side 27b.

  Similarly, on the second side 27 b, the second side shield part 31 is connected to the bottom part 27. The second side shield part 31 has a second side shield part main body 31a that is bent later through the second side 27b. First and second extending portions 32 and 33 are connected to both sides in the length direction of the second side 27b of the second side shield portion main body 31a, respectively. The second side shield part 31 is bent upward via the second side 27b of FIG. 2, and the first and second extension parts 32 and 33 are further formed along the broken lines C and D with the first side 27a. Folded to the side. In this way, as shown in FIG. 1, the extension portions 29 and 32 form a side shield portion on the side where the hot side terminals 24 and 25 are disposed. This is referred to as a third side shield part. In the third side shield part, a slight gap is formed in the part where the extension parts 29 and 32 are opposed to each other. However, the extended portions 29 and 32 ensure electromagnetic shielding of almost the entire side surface.

  Similarly, a fourth side shield part is formed by the extension parts 30 and 33.

  Here, the lower end edges of the extension portions 29 and 32 are positioned above the bottom surface portion 27. Accordingly, in FIG. 2, the hot-side terminals 24 and 25 provided on the lead frame frame 22 do not come into contact with the extensions 29 and 32 in FIG. 1 and pass below the extensions 29 and 32. ing. That is, the hot-side terminals 24 and 25 are drawn out from the inside surrounded by the shield case 23 without being electrically connected to the shield case 23 outside the shield case 23. Finally, the hot-side terminals 24 and 25 are cut at the portion indicated by the alternate long and short dash line E in FIG. On the other hand, the ground terminal 26 is connected to the bottom surface portion 27.

  The hot-side terminals 24 and 25 are bent at portions extending into the shield case 23 from the state shown in FIG. That is, as shown in FIG. 1, the shield case 23 is processed to have electronic component element connection portions 24 a and 25 a located above the bottom surface portion 27. Connection portions 24b and 25b extending downward from the outer ends of the electronic component element connection portions 24a and 25a are provided. The lower ends of the connection portions 24 b and 25 b are located at the same height as the bottom surface portion 27. Terminal portions 24c and 25c are provided so as to extend into the shield case 23 from the lower ends of the connection portions 24b and 25b. Similarly, the ground terminal 26 also has an electronic component element connection part 26a, a connection part 26b, and a terminal part 26c.

  With respect to the first and second opposite sides of the bottom portion 27, another set of opposite third and fourth sides hangs downward on the lower end edges of the extension portions 29 and 32. It is a portion along the side, and the fourth side is a portion along the side where the lower ends of the extended portions 30 and 33 are suspended downward.

  When the electronic component device 1 is manufactured, an electronic component storage package lead frame 21 shown in FIG. 2 is prepared and bent as shown in FIG. No other lead frame is required. Accordingly, only one electronic component storage package lead frame 21 needs to be prepared. In addition, a complicated deep drawing process is not required to configure the shield case. As shown in FIG. 2, the lead frame 21 for an electronic component storage package can be easily formed by punching a flat metal plate. Therefore, the number of parts can be reduced and the cost can be reduced.

  Next, as shown in FIG. 1, the bent lead frame 21 for electronic component storage package is placed in a mold, and a resin mold body is formed by insert molding. In this way, the package body 2 shown in FIGS. 3 and 5 can be formed. As shown in FIG. 5, in the package body 2, the electronic component element connection portions 24a, 25a, and 26a of the first and second hot-side terminals 24 and 25 and the ground terminal 26 are exposed on the upper surface. Accordingly, the hot-side terminals 8a and 8b of the FET 8 may be joined to the electronic component element connection portions 24a and 25a of the first and second hot-side terminals 24 and 25 by a conductive joining material such as solder. Further, the ground-side terminal electrode 8 c of the FET 8 is joined to the electronic component element connection portion 26 a of the ground terminal 26 with a conductive joining material. This joining structure is shown in a schematic plan view in FIG. 4 with the package body 2 omitted.

  In the electronic component storage package lead frame 21 of the present embodiment, the lower ends of the extension portions 29 and 30 are positioned above the bottom surface portion 27 as described above. In other words, in the state before the bending process shown in FIG. 2, the opening 22a causes the portion that is the lower end edge after the bending process of the extension parts 29 and 30 to be positioned outside the first side 27a by the gap G. Yes. Therefore, when the first side shield part 28 is bent so as to extend upward on the first side 27 a, the lower end edges of the extension parts 29 and 30 are closer to the gap G than the first side 27 a, that is, the bottom part 27. It will be located above by the amount. Accordingly, the hot side terminal 25 does not contact the extension portion 29. Similarly, the hot side terminal 24 is not in contact with the extension portion 32.

  Accordingly, the electronic component storage package lead frame 21 made of one metal plate can be used to form the shield case 23 and the hot-side terminals 24 and 25 that should not be electrically connected to the shield case 23. .

  In the conventional electronic component device described in Patent Document 1, it is necessary to prepare a lead frame 1004 for forming a shield case and a lead frame 1005 for forming a hot-side terminal, and positioning both of them. The insert molding had to be performed after adding. In contrast, according to the present embodiment, as described above, one electronic component storage package lead frame 21 may be prepared, bent, and insert-molded. Accordingly, the manufacturing process can be greatly simplified.

  In the present embodiment, the ground-side terminal 26 is connected to the bottom surface portion 27, but the ground-side terminal 26 is not electrically connected to the bottom surface portion 27, similarly to the hot-side terminals 24 and 25. The ground side terminal 26 may be electrically connected to a portion connected to the ground potential outside.

  In the present embodiment, the extension portion 29 and the extension portion 32 face each other with a gap in the direction connecting the first side 27a and the second side 27b, that is, in the center of the third side. You may be facing in parts other than the center. However, as in the present embodiment, it is preferable that the extensions 29 and 32 have the same shape and are opposed at the center of the third side. Thereby, the symmetry of the shield case 23 can be enhanced. The extension portions 30 and 33 are the same as the extension portions 29 and 32.

  Further, in this embodiment, in order to facilitate the bending process along the broken lines A and B in FIG. 2, the notch 41 is formed between the first side shield part 28 and the first and second extension parts 29 and 30. It is provided on the upper edge side of the first side shield part 28 in between. A notch 41 is similarly provided between the second side shield part 31 and the first and second extension parts 32 and 33. This notch 41 is not necessarily provided. But by providing the notch 41, bending along the broken lines A and B and the broken lines C and D can be easily performed.

  In the above embodiment, the FET 8 is shown as the electronic component element. However, the electronic component storage package lead frame 21 can be used to store various electronic component elements other than the FET, for example, an infrared sensor element.

DESCRIPTION OF SYMBOLS 1 ... Electronic component apparatus 2 ... Package main body 2a ... Opening 3 ... Bottom plate part 4-7 ... Side part 8 ... FET
8a, 8b ... Hot side terminal 8c ... Ground side terminal 9 ... Ceramic plate 10 ... Blackening film 11 ... Optical filter plate 21 ... Lead frame for electronic component storage package 22 ... Lead frame frame body 22a, 22b, 22c ... Opening 23 ... Shield case 24, 25 ... Hot side terminals 24a, 25a, 26a ... Electronic component element connection parts 24b, 25b ... Connection parts 24c, 25c ... Terminal parts 26 ... Ground side terminals 27 ... Bottom part 27a ... First side 27b ... 2nd side 28 ... 1st side shield part 28a ... 1st side shield part main body 29 ... 1st extension part 30 ... 2nd extension part 31 ... 2nd side shield part 31a ... 2nd side shield Part main body 32 ... 1st extension part 33 ... 2nd extension part 41 ... Notch

Claims (3)

An electronic component made of a metal plate and having a package main body formed by insert molding using one lead frame for configuring a shield case portion and a hot-side terminal portion,
A bottomed substantially rectangular parallelepiped package body having an opening opened upward;
An electronic component element housed in the opening of the package body,
The package body has a shield case part made of a metal plate, and a resin mold body integrally formed by insert molding with the shield case part,
The shield case portion has a bottom surface portion, and a side shield portion connected to the bottom surface portion,
The outer peripheral edge of the bottom surface portion has a rectangular shape having first and second sides facing each other and third and fourth sides facing each other, and the side shield portion includes the first and second sides. the first was chosen two sides have a second side shield section, said first, second side shield section, respectively, a first, second side shield section body, the first The side and second side extending in both sides of the side shield part main body have first and second extension parts that extend outward, and the first and second side shield parts are the bottom part. On the other hand, an electronic component which is bent along the first and second sides and thereby shields the side surface of the electronic component element disposed above the bottom surface portion . The first and second extension parts extend from the first and second side shield part bodies so that the first and second extension parts extend in directions along the third and fourth sides, respectively. 2. The electronic component according to claim 1 , wherein the electronic component is bent and a side shield in a direction along the third and fourth sides is achieved by the first and second extensions. 3. The electronic component according to claim 1, wherein the bottom surface portion has an opening, and the hot-side terminal extends into the opening so as not to contact the bottom surface portion and the side shield portion.

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