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JP5304314B2 - Lead frame for LED light emitting element, manufacturing method thereof, and LED light emitting element using the same - Google Patents

Lead frame for LED light emitting element, manufacturing method thereof, and LED light emitting element using the same Download PDF

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JP5304314B2
JP5304314B2 JP2009045460A JP2009045460A JP5304314B2 JP 5304314 B2 JP5304314 B2 JP 5304314B2 JP 2009045460 A JP2009045460 A JP 2009045460A JP 2009045460 A JP2009045460 A JP 2009045460A JP 5304314 B2 JP5304314 B2 JP 5304314B2
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lead
back surface
resin
electrical connection
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JP2010135718A (en
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修 吉岡
仁 本村
健人 塚本
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Toppan Inc
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Toppan Inc
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Priority to JP2009045460A priority Critical patent/JP5304314B2/en
Priority to TW98137514A priority patent/TWI471995B/en
Priority to KR1020107029799A priority patent/KR101257581B1/en
Priority to PCT/JP2009/068921 priority patent/WO2010053133A1/en
Priority to CN2009801249733A priority patent/CN102077371B/en
Publication of JP2010135718A publication Critical patent/JP2010135718A/en
Priority to US12/737,678 priority patent/US8841692B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a leadframe substrate for an LED light emitting element which has both high heat dissipation performance and a high optical gain property as a substrate for element carrying (for lead) for the light emitting element (LED module), to provide a method of manufacturing the same, and to provide the LED light emitting element using the same, inexpensively. <P>SOLUTION: A leadframe is provided with, on a same flat surface, a pad section 2 which has an LED chip 10 mounted thereon and is arranged on one or a plurality of areas, and a lead section 2a having a wire bonding area where electrical connection to the chip is performed through wire bonding. The relationship between an area S1 of an LED chip mounting surface A of the pad sections 2 and an area S2 of a heat dissipating rear surface B of the pad sections 2 which faces the mounting front surface A satisfies a relation of 0&lt;S1&lt;S2, wherein on a side surface section of an upper structure section, a step-shaped section or a taper-shaped section which widens from the mounting surface A toward the heat dissipating rear surface B is formed, and on the side surface section of an lower structure section, the step-shaped section or the taper-shaped section which widens from the heat dissipating rear surface B toward the mounting front surface A is formed. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

本発明は、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）を担持、搭載する発光素子用リードフレーム及びその製造方法及びそれを用いたＬＥＤ発光素子に関する。   The present invention relates to a lead frame for a light emitting element that carries and mounts an LED (Light Emitting Diode), a manufacturing method thereof, and an LED light emitting element using the same.

一般的に、半導体集積回路やＬＥＤ発光素子などの電子素子を担持、搭載するためのリードフレームは、板状の鉄−ニッケル等の合金薄板、銅−ニッケル−錫等の合金薄板からなるリードフレーム用金属材料を、その片面又は両面から塩化第二鉄等のエッチャントを用いてフォトエッチング加工して製造され、半導体集積回路やＬＥＤ素子を搭載するためのパッド部（アイランド部）と、該パッド部とは絶縁状態に離反し、電子素子と電気的に接続が行われるインナーリード部及びアウトリード部を備えている。   In general, lead frames for carrying and mounting electronic elements such as semiconductor integrated circuits and LED light emitting elements are lead frames made of plate-like alloy thin plates such as iron-nickel and copper-nickel-tin alloy thin plates. A pad part (island part) for mounting a semiconductor integrated circuit and an LED element, which is manufactured by photo-etching a metal material for use from one or both sides using an etchant such as ferric chloride, and the pad part Is provided with an inner lead portion and an out lead portion that are separated from each other in an insulating state and are electrically connected to the electronic element.

上記リードフレームのパッド部は、その表面側に電子素子を載置するための搭載部（搭載面）と、その裏面側には、ＬＥＤ発光素子などの電子素子本体から発生する駆動熱や、電子素子周囲の環境条件による熱を放散させるための放熱部（放熱板）を備えたものがあり、電子素子側に熱が蓄積されないように、パッド部裏面側の放熱部から外界側に熱が放熱されるようになっている。   The pad portion of the lead frame includes a mounting portion (mounting surface) for placing an electronic element on the front surface side, and driving heat generated from an electronic element body such as an LED light emitting element, Some devices have a heat radiating part (heat radiating plate) to dissipate heat due to environmental conditions around the element. Heat is radiated from the heat radiating part on the back side of the pad part to the outside so that heat does not accumulate on the electronic element side. It has come to be.

半導体集積回路やＬＥＤ発光素子など電子素子を担持するための基板としては、合金薄板からなるリードフレームを用いたリードフレーム基板以外に、セラミック基板やプリント基板等が使用されるが、電子素子を載置するパッド部に形成される放熱部に関しては、その放熱効率の観点から、放熱部の放熱面積がなるべく広いことが望まれている。そして特許文献１〜４には、ＬＥＤ等の電子的発光素子の担持体へのマウント技術、及び発光素子に対する蓄熱を防止するための放熱技術が記載されている。   As a substrate for supporting an electronic device such as a semiconductor integrated circuit or an LED light emitting device, a ceramic substrate or a printed circuit board is used in addition to a lead frame substrate using a lead frame made of an alloy thin plate. With respect to the heat radiating portion formed on the pad portion to be placed, it is desired that the heat radiating area of the heat radiating portion is as large as possible from the viewpoint of the heat radiating efficiency. Patent Documents 1 to 4 describe a technique for mounting an electronic light-emitting element such as an LED on a carrier, and a heat dissipation technique for preventing heat storage on the light-emitting element.

特開２００３−８０７１号公報JP 2003-8071 A 特開２００３−３４７６００号公報JP 2003-347600 A 特開２００４−１７２１６０号公報JP 2004-172160 A 特開２００７−２２０９２５号公報JP 2007-220925 A

ＬＥＤ発光素子用の素子担持体用の基板として、例えば、セラミック基板を用いた場合は、放熱特性は良好であり、信頼性も優秀であるが、価格が高いという欠点があった。また、素子担持体用（及びリード用）の基板として、プリント基板を用いた場合は、プリント基板の基材であるエポキシ樹脂が、熱放散性に劣る欠点があり、それを解消するため、基板の内層にＣｕ（銅）、あるいはＡｌ（アルミ）からなる金属板を挿入したプリント基板を採用せざるを得ない。また、ＬＥＤ光源の高光反射率を確保するために、基板を介して形成される発光素子の光反射表面に光反射性のセラミックインクを塗布する工程を必要としていた。   For example, when a ceramic substrate is used as a substrate for an element carrier for an LED light emitting device, the heat dissipation characteristics are good and the reliability is excellent, but there is a disadvantage that the price is high. In addition, when a printed circuit board is used as a substrate for an element carrier (and for leads), the epoxy resin that is the base material of the printed circuit board has a disadvantage that it is inferior in heat dissipation. A printed circuit board in which a metal plate made of Cu (copper) or Al (aluminum) is inserted into the inner layer must be adopted. Moreover, in order to ensure the high light reflectivity of an LED light source, the process of apply | coating a light reflective ceramic ink to the light reflection surface of the light emitting element formed through a board | substrate was required.

また、ＬＥＤ発光素子用の素子担持用（及びリード用）の基板として、合金薄板からなるリードフレーム基板を用いる場合、熱放散性に欠けるという欠点の他に、ＬＥＤ光源の高い光利得（光照射方向への高い光反射率）を確保するために、リードフレーム基板を介して形成される発光素子の光反射面に、特殊な複合樹脂（セラミックインク＋Ｓｉ樹脂）からなる複合材を積層して欠点をカバーする必要があり、また、リードフレーム基板方式を用いているにも関わらず、ＬＥＤモジュールから実装基板面への放熱面の十分な確保ができず、放熱性能が不足する欠点があった。   In addition, when a lead frame substrate made of an alloy thin plate is used as an element carrying (and lead) substrate for an LED light emitting element, in addition to the disadvantage of lack of heat dissipation, the high light gain (light irradiation) of the LED light source In order to ensure high light reflectance in the direction), a composite material made of a special composite resin (ceramic ink + Si resin) is laminated on the light reflecting surface of the light emitting element formed via the lead frame substrate. Although the lead frame substrate method is used, a sufficient heat radiation surface from the LED module to the mounting substrate surface cannot be secured, resulting in a shortage of heat radiation performance.

また、セラミック基板以外のプリント基板、あるいはリードフレーム基板方式は、何れも放熱特性が劣るだけでなく、セラミック基板を用いたＬＥＤ発光素子の製造方法に比較して、その製法や工程が複雑になる欠点があった。   In addition, the printed circuit board other than the ceramic substrate or the lead frame substrate system is not only inferior in heat dissipation characteristics, but also has a complicated manufacturing method and process as compared with the LED light emitting device manufacturing method using the ceramic substrate. There were drawbacks.

本発明は、上記問題点に鑑みなされたものであり、発光素子（ＬＥＤモジュール）用の素子担持用（リード用）の基板として、高放熱性能と高光利得性を兼ね備えた発光素子用リードフレーム基板、及びその製造方法、及びそれを用いたＬＥＤ発光素子を安価に提供することを目的とする。   The present invention has been made in view of the above-described problems, and as a substrate for an element carrying (lead) for a light emitting element (LED module), the lead frame substrate for a light emitting element having both high heat dissipation performance and high optical gain. And a manufacturing method thereof, and an LED light-emitting element using the same, and an object thereof are to provide at low cost.

本発明の請求項１に係る発明は、少なくともＬＥＤチップ１０を搭載するための１乃至複数箇所のパッド部２と、前記ＬＥＤチップと電気的接続を行うための電気的接続エリアを有するリード部２ａとを同一平面に備えたＬＥＤ発光素子用リードフレームであって、前記パッド部２のＬＥＤチップ搭載用表面Ａの面積Ｓｌと、該搭載用表面Ａと対向する該パッド部２の放熱用裏面Ｂの面積Ｓ２との関係が０＜Ｓｌ＜Ｓ２であり、前記パッド部は該搭載用表面Ａを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｂを有する下部構造部とからなり、該上部構造の下面が該下部構造の上面の面積の一部と連結し、該上部構造と該下部構造の間に段差を有し、該上部構造部の側面部には、搭載用表面Ａから放熱用裏面Ｂの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅが形成され、該下部構造部の側面部には、放熱用裏面Ｂから搭載用表面Ａの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅ１が形成され、かつ、
前記リード部２ａは、前記パッド部２の搭載用表面Ａと同一面に前記電気的接続エリアＣと、該電気的接続エリアＣと対向し前記パッド部２の放熱用裏面Ｂと同一面にある放熱用裏面Ｄとを有し、前記電気的接続エリアＣの面積Ｓ３と前記放熱用裏面Ｄの面積Ｓ４との関係が０＜Ｓ３＜Ｓ４であり、前記リード部２ａは該電気的接続エリアＣを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｄを有する下部構造部とからなり、該上部構造部の側面部には、電気的接続エリアＣから放熱用裏面Ｄの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部が形成され、該下部構造部の側面部には、放熱用裏面Ｄから電気的接続エリアＣの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅ１が形成されていることで、パッド部２及びリード部２ａの前記上部構造部のテーパー状部Ｅのテーパーはハの字状で
あり、下部構造部のテーパー状部Ｅｌのテーパーは逆ハの字状であり、上部構造部と下部構造部の各々のテーパー方向は逆方向となるため、パッド部２とリード部２ａとで挟まれた部位の充填樹脂は、上側の面である上部構造部側の面と、下側の面である下部構造部側の面との間にくびれた部位を有するようになり、断面視でくびれ部を有する鼓状あるいは砂時計状となり、このくびれ部の上下で各々逆の方向のテーパー状部となった側面で充填樹脂を保持し充填樹脂のリードフレーム１からの脱落を防止することを特徴とするＬＥＤ発光素子用リードフレームである。 The invention according to claim 1 of the present invention includes at least one pad portion 2 for mounting the LED chip 10 and a lead portion 2a having an electrical connection area for electrical connection with the LED chip. In the same plane, the area S1 of the LED chip mounting surface A of the pad portion 2 and the heat dissipating back surface B of the pad portion 2 facing the mounting surface A. The relationship with the area S2 is 0 <Sl <S2, and the pad portion has an upper structure portion having the mounting surface A, and a lower structure portion having the heat dissipation back surface B which is integral with the upper structure portion. And the lower surface of the upper structure is connected to a part of the area of the upper surface of the lower structure, and there is a step between the upper structure and the lower structure. From the front surface A to the back surface B for heat dissipation , Is formed stepped portion or tapered portion E for holding the filler resin during resin molding, the side portions of the lower structure portion, extends in the direction of the mounting surface A from radiating back side B, a resin mold A stepped portion or a tapered portion E1 for holding the filling resin at the time is formed, and
The lead portion 2a is on the same surface as the mounting surface A of the pad portion 2 and is on the same surface as the electrical connection area C and the back surface B for heat dissipation of the pad portion 2 facing the electrical connection area C. The relationship between the area S3 of the electrical connection area C and the area S4 of the heat dissipation back surface D is 0 <S3 <S4, and the lead portion 2a is connected to the electrical connection area C. And an upper structure part and a lower structure part having the heat radiation back surface D, which are integral with the upper structure part, and the side surface portion of the upper structure part is connected to the heat radiation back surface D from the electrical connection area C. A stepped portion or a tapered portion for holding the filled resin at the time of resin molding is formed, and the side surface portion of the lower structure portion extends from the heat radiation back surface D to the electrical connection area C. Expands to hold the filled resin during resin molding By Sajo portion or tapered portion E1 are formed, the taper of the tapered portion E of the upper structure portion of the pad portion 2 and the lead portions 2a is shaped Ha, tapered portion of the lower structure portion Since the taper of El is an inverted C shape and the taper directions of the upper structure portion and the lower structure portion are opposite directions, the filling resin at the portion sandwiched between the pad portion 2 and the lead portion 2a is the upper side. It has a constricted part between the surface on the upper structure part side which is the surface of the lower surface and the surface on the lower structure part side which is the lower surface, and becomes a drum shape or hourglass shape having a constricted part in a sectional view. The LED light-emitting element lead frame is characterized in that the filling resin is held by the side surfaces that are tapered in the opposite directions above and below the constricted portion to prevent the filling resin from falling off the lead frame 1. .

本発明の請求項２に係る発明は、上記請求項１に係るＬＥＤ発光素子用リードフレームにおいて、前記パッド部２及び前記リード部２ａとをその表裏面を同一平面とする１単位フレームとして、各単位フレームが互いに縦横方向に１乃至複数本のタイバーにて連結されて多面付け配列されたＬＥＤ発光素子用リードフレームであって、前記パッド部２及びリード部２ａ及びタイバーのそれぞれ表面又は裏面又は表裏両面の面高さのうち、前記タイバーの面高さが低位に設定され、前記パッド部２及び前記リード部２ａよりもタイバーの厚さが薄く形成されていることを特徴とするＬＥＤ発光素子用リードフレームである。 The invention according to claim 2 of the present invention, the LED light-emitting element lead frame for according to the claim 1, and the pad portion 2 and the lead portions 2a as a unit frame for the front and rear surfaces thereof flush with each LED frame light emitting element lead frames in which unit frames are connected to each other by one or more tie bars in the vertical and horizontal directions and arranged in multiple faces, and each of the front surface, the back surface, and the front and back surfaces of the pad portion 2, the lead portion 2a, and the tie bar. For the LED light emitting element, the surface height of the tie bar is set to a lower level among the surface heights of both surfaces, and the tie bar is thinner than the pad portion 2 and the lead portion 2a. Lead frame.

本発明の請求項３に係る発明は、板状のリードフレーム用金属材料の表面にパッド部２の面積Ｓｌからなる搭載用表面Ａを形成するためのフォトレジストをパターン形成し、該金属材料の裏面に、前記パッド部２の搭載用表面Ａと対向する面積Ｓ２からなる放熱用裏面Ｂを形成するためのフォトレジストをパターン形成し、該金属材料の表裏両面からエッチング加工することで、前記パッド部２の搭載用表面Ａの面積Ｓｌと放熱用裏面Ｂの面積Ｓ２との関係を０＜Ｓｌ＜Ｓ２とし、かつ、前記パッド部２は、該搭載用表面Ａを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｂを有する下部構造部とからなるパッド部２とし、該上部構造の下面が該下部構造の上面の面積の一部と連結させ、該上部構造と該下部構造の間に段差を設け、該上部構造部の側面部には、搭載用表面Ａから放熱用裏面Ｂの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅを形成し、該下部構造部の側面部には、放熱用裏面Ｂから搭載用表面Ａの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅ１を形成し、かつ、
板状のリードフレーム用金属材料の表面にリード部２ａの面積Ｓ３からなる電気的接続エリアＣを形成するためのフォトレジストをパターン形成し、該金属材料の裏面に、前記リード部２ａの電気的接続エリアＣと対向する面積Ｓ４からなる放熱用裏面Ｄを形成する
ためのフォトレジストをパターン形成し、該金属材料の表裏両面からエッチング加工することで、前記リード部２ａの電気的接続エリアＣの面積Ｓ３と放熱用裏面Ｃの面積Ｓ４との関係をＳ３＜Ｓ４とし、かつ、前記リード部２ａは該電気的接続エリアＣを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｄを有する下部構造部とからなるリード部２ａとし、該上部構造部の側面部には、電気的接続エリアＣから放熱用裏面Ｄの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部を形成し、該下部構造部の側面部には、放熱用裏面Ｄから電気的接続エリアＣの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅ１を形成することを特徴とする請求項１のＬＥＤ発光素子用リードフレームの製造方法である。 According to a third aspect of the present invention, a photoresist for forming a mounting surface A having an area S1 of the pad portion 2 is formed on the surface of a plate-like metal material for a lead frame. By patterning a photoresist on the back surface to form a heat-dissipating back surface B having an area S2 facing the mounting surface A of the pad portion 2, the pad is formed by etching from both the front and back surfaces of the metal material. The relationship between the area S1 of the mounting surface A of the part 2 and the area S2 of the back surface B for heat dissipation is 0 <Sl <S2, and the pad part 2 includes the upper structure part having the mounting surface A, A pad portion 2 made of a lower structure portion having the heat dissipation back surface B, which is integral with the upper structure portion, and the lower surface of the upper structure is connected to a part of the area of the upper surface of the lower structure, Steps between the substructures Provided on the side surface portion of the upper structure portion, extends in the direction of the radiating back side B from the mounting surface A, to form a stepped portion or a tapered portion E for holding the filler resin during resin molding, the On the side surface portion of the lower structure portion, a stepped portion or a tapered portion E1 is formed to extend from the heat dissipating back surface B to the mounting surface A, and to hold the filling resin during resin molding, and
A photoresist for forming an electrical connection area C composed of the area S3 of the lead portion 2a is patterned on the surface of the plate-like metal material for the lead frame, and the electrical surface of the lead portion 2a is formed on the back surface of the metal material. The photoresist for forming the heat radiation back surface D having the area S4 facing the connection area C is patterned and etched from both the front and back surfaces of the metal material, so that the electrical connection area C of the lead portion 2a The relationship between the area S3 and the area S4 of the back surface C for heat dissipation is S3 <S4, and the lead portion 2a is integrated with the upper structure portion having the electrical connection area C, and the heat dissipation. The lead portion 2a is composed of a lower structure portion having a rear surface D, and the side surface portion of the upper structure portion extends from the electrical connection area C in the direction of the heat radiation back surface D. A stepped portion or a tapered portion for holding the filling resin is formed, and the side surface portion of the lower structure portion is filled with a filling resin at the time of resin molding that extends from the heat dissipating back surface D to the electrical connection area C. 2. The method of manufacturing a lead frame for an LED light emitting element according to claim 1 , wherein a stepped portion or a tapered portion E1 for holding is formed.

本発明の請求項４に係る発明は、請求項３記載のＬＥＤ発光素子用リードフレームの製造方法において、前記パッド部２及び前記リード部２ａとをその表裏面を同一平面とする１単位フレームとして、各単位フレームが互いに縦横方向に１乃至複数本のタイバーにて連結されて多面付け配列されたＬＥＤ発光素子用リードフレームであって、前記パッド部２及びリード部２ａ及びタイバーのそれぞれ表面又は裏面又は表裏両面の面高さのうち、前記タイバーの面高さが低位に設定され、前記パッド部２及び前記リード部２ａよりもタイバーの厚さが薄く形成されていることを特徴とするＬＥＤ発光素子用リードフレームの製造方法である。 According to a fourth aspect of the present invention, in the method for manufacturing a lead frame for an LED light emitting device according to the third aspect , the pad portion 2 and the lead portion 2a are formed as a single unit frame whose front and back surfaces are the same plane. , Each LED is a LED light-emitting element lead frame in which the unit frames are connected to each other by one or a plurality of tie bars in the vertical and horizontal directions, and each of the front and back surfaces of the pad part 2, the lead part 2a, and the tie bar. Alternatively, among the front and back surface heights, the LED light emission is characterized in that the surface height of the tie bar is set to a low level and the tie bar is thinner than the pad portion 2 and the lead portion 2a. It is a manufacturing method of an element lead frame.

本発明の請求項５に係る発明は、少なくともＬＥＤチップ１０等のＩＣチップを搭載した１乃至複数箇所のパッド部２と、前記ＬＥＤチップと電気的接続を行う電気的接続エリアＣを有するリード部２ａとを同一平面に備えたリードフレームを、前記パッド部２のＬＥＤチップ搭載用表面Ａより該搭載用表面Ａと対向する放熱用裏面Ｂに亘って、その厚さ方向に充填樹脂によりモールド加工が施され、前記パッド部の搭載用表面Ａより上面側には、ＬＥＤチップ及び電気的接続エリアを含めて透明樹脂が被覆されたＬＥＤ発光素子であって、前記パッド部の搭載用表面Ａの面積Ｓ１と放熱用裏面Ｂの面積Ｓ２との関係がＳ１＜Ｓ２であり、前記パッド部は該搭載用表面Ａを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｂを有する下部構造部とからなり、該上部構造の下面が該下部
構造の上面の面積の一部と連結し、該上部構造と該下部構造の間に段差を有し、該上部構造部の側面部には、搭載用表面Ａから放熱用裏面Ｂの方向に拡がる段差状部又はテーパー状部Ｅが形成され、該下部構造部の側面部には、放熱用裏面Ｂから搭載用表面Ａの方向に拡がる段差状部又はテーパー状部Ｅ１が形成され、上部構造部のテーパー状部Ｅのテーパーはハの字状であり、下部構造部のテーパー状部Ｅｌのテーパーは逆ハの字状であり、上部構造部と下部構造部の各々のテーパー方向は逆方向となり、かつ、
前記リード部２ａは、前記パッド部２の搭載用表面Ａと同一面の電気的接続エリアＣと、該エリアＣと対向し前記パッド部２の放熱用裏面Ｂと同一面の放熱用裏面Ｄとを有し、前記電気的接続エリアＣの面積Ｓ３と前記放熱用裏面Ｄの面積Ｓ４との関係がＳ３＜Ｓ４であり、前記リード部２ａは該電気的接続エリアＣを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｄを有する下部構造部とからなり、該上部構造部の側面部には、電気的接続エリアＣから放熱用裏面Ｄの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部が形成され、パッド部２とリード部２ａとで挟まれた部位の充填樹脂は、上側の面である上部構造部側の面と、下側の面である下部構造部側の面との間にくびれた部位を有するようになり、断面視でくびれ部を有する鼓状あるいは砂時計状となり、このくびれ部の上下で各々逆の方向のテーパー状部となった側面で充填樹脂を保持し充填樹脂のリードフレーム１からの脱落を防止することを特徴とするＬＥＤ発光素子である。 The invention according to claim 5 of the present invention is a lead portion having at least one pad portion 2 on which an IC chip such as an LED chip 10 is mounted and an electrical connection area C for electrical connection with the LED chip. 2a and the lead frame provided on the same plane from the LED chip mounting surface A of the pad portion 2 to the heat dissipating back surface B opposite to the mounting surface A by molding with a filling resin in the thickness direction. The LED light emitting device is coated with a transparent resin including the LED chip and the electrical connection area on the upper surface side of the mounting surface A of the pad portion, and the pad surface of the mounting surface A of the pad portion is The relationship between the area S1 and the area S2 of the heat dissipating back surface B is S1 <S2, and the pad portion is integrated with the upper structure portion having the mounting surface A and the heat dissipating back surface B. The To consists of a lower structure portion, the lower surface of the upper structure is lower portions
It is connected to a part of the area of the upper surface of the structure, has a step between the upper structure and the lower structure, and spreads in the direction from the mounting surface A to the heat radiating back surface B on the side surface of the upper structure portion. A stepped portion or a tapered portion E is formed, and a stepped portion or a tapered portion E1 extending from the heat dissipating back surface B to the mounting surface A is formed on the side surface portion of the lower structure portion. The taper of the taper-shaped portion E is a C-shape, the taper of the taper-shaped portion El of the lower structure portion is a reverse C-shape, and the taper directions of the upper structure portion and the lower structure portion are opposite to each other. ,And,
The lead portion 2a includes an electrical connection area C that is the same surface as the mounting surface A of the pad portion 2, and a heat dissipation back surface D that faces the area C and is the same surface as the heat dissipation back surface B of the pad portion 2. The relationship between the area S3 of the electrical connection area C and the area S4 of the heat dissipating back surface D is S3 <S4, and the lead portion 2a includes an upper structure portion having the electrical connection area C; A resin mold comprising a lower structure portion having the heat dissipation back surface D, which is integral with the upper structure portion, and extending in the direction of the heat dissipation back surface D from the electrical connection area C to the side surface portion of the upper structure portion. The stepped portion or the tapered portion for holding the filling resin at the time is formed, and the filling resin at the portion sandwiched between the pad portion 2 and the lead portion 2a is the surface on the upper structure portion side which is the upper surface. , The constricted part between the lower surface and the lower surface From the lead frame 1 of the filling resin, the filling resin is held by the side surfaces that are tapered in the opposite direction at the top and bottom of the constricted portion. It is an LED light emitting element characterized by preventing omission.

本発明の請求項６に係る発明は、上記請求項５に係るＬＥＤ発光素子において、前記充填樹脂の光屈折率ｎ１と透明樹脂の光屈折率ｎ２との関係がｎ１＞ｎ２に設定され、前記充填樹脂を高反射率の樹脂としたことを特徴とするＬＥＤ発光素子である。 According to a sixth aspect of the present invention, in the LED light emitting device according to the fifth aspect , the relationship between the light refractive index n1 of the filling resin and the light refractive index n2 of the transparent resin is set to n1> n2, An LED light emitting device characterized in that a filling resin is a resin having a high reflectance.

本発明の請求項７に係る発明は、請求項５または６に係るＬＥＤ発光素子において、前記充填樹脂に反射率特性向上用の微粒子を添加したことを特徴とするＬＥＤ発光素子である。 The invention according to claim 7 of the present invention is the LED light emitting element according to claim 5 or 6 , wherein fine particles for improving reflectance characteristics are added to the filling resin.

本発明によれば、ＬＥＤ発光素子用リードフレームにおけるパッド部２のＬＥＤチップ搭載用表面Ａの面積Ｓ1 と搭載用表面Ａと対向する放熱用裏面Ｂの面積Ｓ2 との関係を０＜Ｓ1 ＜Ｓ2 、電気的接続エリアＣの面積Ｓ3 と放熱用裏面Ｄの面積Ｓ4 との関係を０＜Ｓ3 ＜Ｓ4 に設定し、放熱用裏面Ｂの面積を搭載用表面Ａよりも広く、放熱用裏面Ｄの面積を電気的接続エリアＣよりも広くして製造されるため、リードフレーム裏面側における高い放熱性能が得られる。   According to the present invention, the relationship between the area S1 of the LED chip mounting surface A of the pad portion 2 in the LED light emitting element lead frame and the area S2 of the heat dissipating back surface B facing the mounting surface A is 0 <S1 <S2. The relationship between the area S3 of the electrical connection area C and the area S4 of the heat dissipating back surface D is set to 0 <S3 <S4, and the area of the heat dissipating back surface B is larger than that of the mounting surface A. Since the area is made wider than the electrical connection area C, high heat dissipation performance on the back side of the lead frame can be obtained.

また、ＬＥＤ発光素子用リードフレームの表面側また表裏両面側には、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部が形成されるため、リードフレームと充填樹脂の確実な密着性が得られ、リードフレームと充填樹脂との分離や、リードフレームからの充填樹脂の離脱などを防止して確実な耐離脱性を向上できる効果がある。   In addition, a stepped portion or a tapered portion for holding the filling resin at the time of resin molding is formed on the front side or both sides of the LED light emitting element lead frame, so that the lead frame and the filling resin can be securely connected. Adhesiveness is obtained, and there is an effect that the separation between the lead frame and the filling resin and the detachment of the filling resin from the lead frame can be prevented to improve reliable detachment resistance.

また、本発明によれば、充填樹脂に高反射率の樹脂を使用し、充填樹脂又はその表面に高い反射率を持たせることにより、ＬＥＤチップ１０から発せられた光を効率よく外部に放出させることが可能になり、また、発光素子においては、充填樹脂の光屈折率ｎ1 と発
光素子に使用する透明樹脂の光屈折率ｎ2 との関係をｎ1 ＞ｎ2 に設定することにより、充填樹脂４と透明樹脂５との境界面における反射率を増加させることができ、充填樹脂又はその表面における高い反射率を得ることができる。 In addition, according to the present invention, a resin having a high reflectance is used as the filling resin, and the filling resin or the surface thereof has a high reflectance, whereby the light emitted from the LED chip 10 is efficiently emitted to the outside. Further, in the light emitting element, by setting the relationship between the light refractive index n1 of the filling resin and the light refractive index n2 of the transparent resin used for the light emitting element to satisfy n1> n2, The reflectance at the boundary surface with the transparent resin 5 can be increased, and a high reflectance at the filling resin or its surface can be obtained.

本発明の第１実施例におけるＬＥＤ発光素子用リードフレーム１を用いて製造した本発明のＬＥＤ発光素子ＬE の上面図。The top view of LED light emitting element LE of this invention manufactured using the lead frame 1 for LED light emitting elements in 1st Example of this invention. 本発明の第１実施例例におけるＬＥＤ発光素子用リードフレーム１を用いて製造した本発明のＬＥＤ発光素子ＬE の裏面図。The back view of LED light emitting element LE of this invention manufactured using the lead frame 1 for LED light emitting elements in 1st Example of this invention. 本発明の第１実施例におけるＬＥＤ発光素子用リードフレーム１を用いて製造した本発明のＬＥＤ発光素子ＬE のＸ1 −Ｘ1 側断面図。FIG. 3 is a cross-sectional view of the LED light emitting element LE of the present invention manufactured using the LED light emitting element lead frame 1 according to the first embodiment of the present invention, taken along the X1-X1 side. 本発明の第１実施例におけるＬＥＤ発光素子用リードフレーム１を用いて製造した本発明のＬＥＤ発光素子ＬE のＸ2 −Ｘ2 側断面図。FIG. 2 is an X2-X2 side cross-sectional view of the LED light emitting device LE of the present invention manufactured using the LED light emitting device lead frame 1 in the first embodiment of the present invention. 本発明の第１実施例におけるＬＥＤ発光素子用リードフレーム１を用いて製造した本発明のＬＥＤ発光素子ＬE のＹ−Ｙ側断面図。The YY side sectional drawing of LED light emitting element LE of this invention manufactured using the lead frame 1 for LED light emitting elements in 1st Example of this invention. 本発明の第１実施例におけるＬＥＤ素子に係わる充填樹脂の機能を説明するための模式断面図。The schematic cross section for demonstrating the function of the filling resin concerning the LED element in 1st Example of this invention. 本発明の第２実施例におけるＬＥＤ発光素子用リードフレーム１を用いて製造した本発明のＬＥＤ発光素子ＬE の上面図。The top view of LED light emitting element LE of this invention manufactured using the lead frame 1 for LED light emitting elements in 2nd Example of this invention. 本発明の第２実施例におけるＬＥＤ発光素子用リードフレーム１を用いて製造した本発明のＬＥＤ発光素子ＬE の上面図。The top view of LED light emitting element LE of this invention manufactured using the lead frame 1 for LED light emitting elements in 2nd Example of this invention. 本発明の第２実施例におけるＬＥＤ発光素子用リードフレーム１を用いて製造した本発明のＬＥＤ発光素子ＬE のＹ−Ｙ側断面図。YY side sectional drawing of LED light emitting element LE of this invention manufactured using the lead frame 1 for LED light emitting elements in 2nd Example of this invention. 本発明の第３実施例におけるタイバーにて連結した多面付け状態のＬＥＤ発光素子用リードフレーム１を説明する上面図。The top view explaining the lead frame 1 for LED light emitting elements of the multi-faced state connected with the tie bar in 3rd Example of this invention. 本発明の第３実施例におけるタイバーにて連結した多面付け状態のＬＥＤ発光素子用リードフレーム１を説明する側断面図。The sectional side view explaining the lead frame 1 for LED light emitting elements of the multi-faceted state connected with the tie bar in 3rd Example of this invention. 金型を用いたリードフレームへの樹脂モールドの一例を説明する側断面図。The sectional side view explaining an example of the resin mold to the lead frame using a metal mold | die.

本発明を実施の形態に基づいて以下に詳細に説明すれば、図１は、本発明に係わるＬＥＤ発光素子用リードフレーム１を用いて製造した本発明のＬＥＤ発光素子ＬＥの第１実施例（請求項１、２、６、７、１１、１５、１６）を示す上面図、図２は、その裏面図である。また、図３は、図１中のＸ1 −Ｘ１線における側断面図を、図４は、図１中のＸ2−Ｘ２線における側断面図を、図５は図１中のＹ−Ｙ線における側断面図を各々示す。   DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below based on an embodiment. FIG. 1 shows a first embodiment of an LED light emitting element LE according to the present invention manufactured using the LED light emitting element lead frame 1 according to the present invention. Claims 1, 2, 6, 7, 11, 15, 16) are top views, and FIG. 2 is a back view thereof. 3 is a side sectional view taken along line X1-X1 in FIG. 1, FIG. 4 is a side sectional view taken along line X2-X2 in FIG. 1, and FIG. 5 is taken along line YY in FIG. Side sectional views are shown respectively.

本発明の第１実施例におけるＬＥＤ発光素子用リードフレーム１は、金属合金製の板状の基材をフォトエッチング加工することにより形成され、図１、図３、図５に示すように
、ＬＥＤチップ１０を搭載するための１乃至複数箇所に形成された厚さｔ1 のパッド部２を備える。該パッド部２は、厚さｔ2 の上部構造部と、そのパッド部２の裏面側に、上部構造部と一体である、厚さｔ3 の放熱部３（放熱板）である下部構造部とを備えている。なお、図５中、Ｗはワイヤー（金線）の一例を示し、パッド部２の搭載用表面ＡのＬＥＤチップ１０と、リード部２ａのワイヤーボンディングエリアＣとの間をワイヤーボンディングにより結線したワイヤーである。 The LED light emitting element lead frame 1 according to the first embodiment of the present invention is formed by photoetching a plate-like base material made of a metal alloy. As shown in FIGS. A pad portion 2 having a thickness t1 formed at one or a plurality of places for mounting the chip 10 is provided. The pad portion 2 has an upper structure portion having a thickness t2 and a lower structure portion which is a heat radiating portion 3 (heat radiating plate) having a thickness t3 integrated with the upper structure portion on the back surface side of the pad portion 2. I have. In addition, in FIG. 5, W shows an example of a wire (gold wire), and is a wire in which the LED chip 10 on the mounting surface A of the pad portion 2 and the wire bonding area C of the lead portion 2a are connected by wire bonding. It is.

図１、図３、図５に示すように、該パッド部２の表面（上面）は、ＬＥＤチップ１０を搭載するための面積Ｓ1 の搭載用表面Ａとなっており、該パッド部２と対向する裏面側の放熱部３の外面は、ＬＥＤチップ１０本体から発生する駆動熱やＬＥＤチップ１０の周囲環境条件による熱を放散させて、ＩＣチップ１０に熱が蓄積されないように、パッド部２裏面側から外界側に熱を放散させるための面積Ｓ2 の放熱用裏面Ｂ（放熱板）となっている。   As shown in FIGS. 1, 3, and 5, the surface (upper surface) of the pad portion 2 is a mounting surface A having an area S 1 for mounting the LED chip 10, and faces the pad portion 2. The outer surface of the heat radiating part 3 on the back surface side that dissipates the heat generated by the LED chip 10 main body and the ambient conditions of the LED chip 10 so that heat is not accumulated in the IC chip 10 so that the heat is not accumulated in the IC chip 10. This is a heat-dissipating back surface B (heat dissipating plate) having an area S2 for dissipating heat from the side to the outside.

また、図１、図４、図５に示すように、金属合金製の板状の基材をフォトエッチング加工することにより形成された前記パッド部２に対して、所定の間隔を置いて離反して隣接する位置には、１乃至複数箇所に形成された厚さｔ1 のリード部２ａを備えている。該リード部２ａは、厚さｔ2 の上部構造部と、該上部構造部と対向する下部（パッド部２の裏面側）には、該上部構造部と一体である、厚さｔ3 の放熱部３ａ（放熱板）である下部構造部を備えている。リード部２ａは、板状の基材のフォトエッチング加工時に、前記パッド部２の形成と同時に形成される。該リード部２ａの表面は、ワイヤーボンディングやチップボンディング等により、ＬＥＤチップ１０とリード部２ａとの電気的接続を行う際に接続性を向上させるため、銀メッキ等が施された面積Ｓ3 の電気的接続エリアＣとなっていて、該リード部２ａの、電気的接続エリアＣと対向する裏面側は、面積Ｓ4 の放熱用裏面Ｄ（放熱板）となっている。   In addition, as shown in FIGS. 1, 4 and 5, the pad portion 2 formed by photo-etching a plate-like base material made of a metal alloy is separated from the pad portion 2 at a predetermined interval. In adjacent positions, lead portions 2a having a thickness t1 formed at one or a plurality of locations are provided. The lead portion 2a has an upper structure portion having a thickness t2 and a heat radiation portion 3a having a thickness t3 integrated with the upper structure portion on the lower portion (the back side of the pad portion 2) facing the upper structure portion. The lower structure part which is (heat sink) is provided. The lead part 2a is formed simultaneously with the formation of the pad part 2 when the plate-like base material is photoetched. The surface of the lead portion 2a has an area S3 subjected to silver plating or the like in order to improve connectivity when the LED chip 10 and the lead portion 2a are electrically connected by wire bonding or chip bonding. The back surface side of the lead portion 2a facing the electrical connection area C is a heat radiation back surface D (heat radiation plate) having an area S4.

前記パッド部２の搭載用表面Ａと、リード部２ａの電気的接続エリアＣの面とは、同一の板状基材から形成されるため、高さにおいて、略同一平面内にある。リード部２ａの電気的接エリアＣは、パッド部２の搭載用表面Ａ上に実装されるＬＥＤ発光素子１０に対してワイヤーボンディングやチップボンディングにて接続される。なお、電気的接続エリアＣへのメッキは、銀メッキに変えて、金メッキ、パラジウムメッキとしても構わない。また、電気的接続エリアＣ面に銀メッキ、金メッキ、パラジウムメッキを行うのに先立ち、耐熱拡散性に優れたＮｉ（ニッケル）メッキ等の下地メッキを行うことであっても構わない。さらには、ＬＥＤ発光素子ＬＥを外部基板に搭載、接続させるために、放熱用裏面にも、銀メッキ、金メッキ、パラジウムメッキや、Ｎｉ（ニッケル）メッキ等の下地メッキを行っても構わない。   Since the mounting surface A of the pad portion 2 and the surface of the electrical connection area C of the lead portion 2a are formed from the same plate-like base material, they are substantially in the same plane in height. The electrical contact area C of the lead portion 2a is connected to the LED light emitting element 10 mounted on the mounting surface A of the pad portion 2 by wire bonding or chip bonding. The plating on the electrical connection area C may be gold plating or palladium plating instead of silver plating. Further, prior to performing silver plating, gold plating, and palladium plating on the surface C of the electrical connection area, it may be possible to perform base plating such as Ni (nickel) plating excellent in heat diffusion resistance. Further, in order to mount and connect the LED light emitting element LE to the external substrate, the rear surface for heat dissipation may be subjected to base plating such as silver plating, gold plating, palladium plating, or Ni (nickel) plating.

本発明においては、図３に示すように、パッド部２の前記搭載用表面Ａの面積Ｓ1 と、該表面Ａと対向する前記放熱用裏面Ｂの面積Ｓ2 との関係が、Ｓ1 ＜Ｓ2 となっており、その搭載用表面Ａの面積よりも放熱用裏面Ｂの面積が広くなるように設定されている。また、図４に示すように、リード部２ａの前記ワイヤーボンディングエリアＣの面積Ｓ3 と、該エリアＣと対向する前記放熱用裏面Ｄの面積Ｓ4 との関係が、Ｓ3 ＜Ｓ4 となっており、そのワイヤーボンディングエリアＣの面積よりも放熱用裏面Ｄの面積が広くなるように設定されている。   In the present invention, as shown in FIG. 3, the relationship between the area S1 of the mounting surface A of the pad portion 2 and the area S2 of the heat dissipating back surface B facing the surface A is S1 <S2. The area of the heat radiating back surface B is set larger than the area of the mounting surface A. Further, as shown in FIG. 4, the relationship between the area S3 of the wire bonding area C of the lead portion 2a and the area S4 of the heat radiating back surface D facing the area C is S3 <S4. It is set so that the area of the heat radiation back surface D is larger than the area of the wire bonding area C.

また、図３に示すように、前記パッド部２の搭載用表面Ａと放熱用裏面Ｂとの間における該パッド部２の側面部は、その該パッド部２が搭載用表面Ａから放熱用裏面Ｂの方向（リードフレーム１の表面側から裏面側の方向）に拡がる、段差状部Ｅ又はテーパー状部Ｅとして形成されている。その側面部の段差状部Ｅ又はテーパー状部Ｅに対して、表面Ａから裏面Ｂ方向に引く法線は、屈曲又は湾曲した形状となっていて、この段差状部Ｅ又はテーパー状部Ｅは、後にモールド充填加工により充填される樹脂をフレーム表面側から裏面側の方向に脱落しないように保持することができるようになっている。   Further, as shown in FIG. 3, the side surface portion of the pad portion 2 between the mounting surface A and the heat dissipating back surface B of the pad portion 2 is such that the pad portion 2 extends from the mounting surface A to the heat dissipating back surface. It is formed as a stepped portion E or a tapered portion E that extends in the direction B (from the front surface side to the back surface side of the lead frame 1). The normal line drawn from the front surface A to the back surface B direction with respect to the stepped portion E or the tapered portion E of the side surface portion has a bent or curved shape, and the stepped portion E or the tapered portion E is The resin to be filled later by mold filling can be held so as not to fall off in the direction from the frame front side to the back side.

また、図４に示すように、前記リード部２ａのエリアＣと放熱用裏面Ｄとの間における該リード部２ａの側面部は、その該リード部２ａがエリアＣから放熱用裏面Ｄの方向（リードフレーム１の表面側から裏面側の方向）に拡がる、段差状部Ｅ又はテーパー状部Ｅとして形成されている。その側面部の段差状部Ｅ又はテーパー状部Ｅに対して、エリアＣから裏面Ｄ方向に引く法線は、屈曲又は湾曲した形状となっていて、この段差状部Ｅ又はテーパー状部Ｅは、後にモールド充填加工により充填される樹脂をフレーム表面側から裏面側の方向に脱落しないように保持することができるようになっている。   Further, as shown in FIG. 4, the side surface portion of the lead portion 2a between the area C of the lead portion 2a and the heat radiation back surface D is such that the lead portion 2a extends from the area C to the heat radiation back surface D ( It is formed as a stepped portion E or a tapered portion E that extends from the front surface side to the back surface side of the lead frame 1. The normal line drawn from the area C to the back surface D direction with respect to the stepped portion E or the tapered portion E of the side surface portion has a bent or curved shape, and the stepped portion E or the tapered portion E is The resin to be filled later by mold filling can be held so as not to fall off in the direction from the frame front side to the back side.

図１、図４、図５に示すように、前記リード部２ａの表面は、前記パッド部２の搭載用表面Ａと同一面の電気的接続エリアＣとなっていて、パッド部２の搭載用表面Ａに搭載したＬＥＤチップ１０と接続するためのワイヤーがボンディングされる領域、または、ＬＥＤチップ１０に形成された接続用電極と半田などを介してチップボンディグされる領域となっており、該エリアＣと対向して、前記パッド部２の放熱用裏面Ｂと同一面になる放熱用裏面Ｄを備えている。   As shown in FIGS. 1, 4, and 5, the surface of the lead portion 2 a is an electrical connection area C that is flush with the mounting surface A of the pad portion 2. It is a region where wires for connecting to the LED chip 10 mounted on the surface A are bonded, or a region bonded to the chip via a connection electrode and solder formed on the LED chip 10, Opposite the area C, a heat dissipating back surface D that is flush with the heat dissipating back surface B of the pad portion 2 is provided.

図１〜図５に示す本発明の上記ＬＥＤ発光素子用リードフレーム１は、板状の鉄−ニッケル等の合金薄板又は銅−ニッケル−錫等の合金薄板を金属材料として用いるが、熱伝導率が高い銅又は銅合金を金属材料として用いる方が、リードフレームの放熱性が向上するため好ましい。   The LED light-emitting element lead frame 1 of the present invention shown in FIGS. 1 to 5 uses a plate-like alloy thin plate such as iron-nickel or an alloy thin plate such as copper-nickel-tin as a metal material, but has a thermal conductivity. It is preferable to use high-copper or copper alloy as the metal material because the heat dissipation of the lead frame is improved.

本発明に係わるリードフレームは、リードフレーム用金属板の表裏面にフォトレジスト（感光性樹脂）を塗布し、フォトレジストへのパターン露光と現像処理等をすることにより、レジストパターンを形成した後、その表裏両面から塩化第二鉄等のエッチャントを用いてレジスト非形成部をフォトエッチング加工することにより、ＬＥＤ素子を搭載するためのパッド部２と、該パッド部２とは絶縁状態に離反しているリード部２ａが形成されている。   In the lead frame according to the present invention, a photoresist (photosensitive resin) is applied to the front and back surfaces of the metal plate for the lead frame, and a resist pattern is formed by pattern exposure and development processing on the photoresist. By photoetching the resist non-formation part using an etchant such as ferric chloride from both the front and back sides, the pad part 2 for mounting the LED element and the pad part 2 are separated from each other in an insulating state. Lead portion 2a is formed.

次に本発明のＬＥＤ発光素子用リードフレームの製造方法を説明する。まず、鉄−ニッケル等の合金薄板又は銅−ニッケル−錫等の金属合金製の板状のリードフレーム用金属材料の表面に、フォトレジスト（感光性樹脂）を塗布してフォトレジスト層を形成する。次いで、パッド部２の面積Ｓ1 からなる搭載用表面Ａ、及びリード部２ａの面積Ｓ3 からなる電気的接続エリアＣにレジストパターンを形成するために、所定のパターンを有するパターン露光用フォトマスクを介してフォトレジスト層にパターンを露光し、次いで、フォトレジスト層に現像、必要に応じて硬膜処理を行う。これにより、パッド部２の搭載用表面Ａ及びリード部２ａの電気的接続エリアＣとなる部分を残してフォトレジストが現像除去され、パッド部２の搭載用表面Ａを形成する部位、及び、リード部２ａの電気的接続エリアＣを形成する部位にレジストパターンが形成される。   Next, the manufacturing method of the lead frame for LED light emitting elements of this invention is demonstrated. First, a photoresist (photosensitive resin) is applied to the surface of a sheet metal material for a lead frame made of an alloy thin plate such as iron-nickel or a metal alloy such as copper-nickel-tin to form a photoresist layer. . Next, in order to form a resist pattern on the mounting surface A composed of the area S1 of the pad portion 2 and the electrical connection area C composed of the area S3 of the lead portion 2a, a pattern exposure photomask having a predetermined pattern is used. Then, the pattern is exposed on the photoresist layer, and then the photoresist layer is developed and, if necessary, hardened. As a result, the photoresist is developed and removed leaving a portion to be the mounting surface A of the pad portion 2 and the electrical connection area C of the lead portion 2a, and a portion for forming the mounting surface A of the pad portion 2 and the lead A resist pattern is formed at a site where the electrical connection area C of the portion 2a is formed.

同様に、該金属材料の裏面にもフォトレジストを塗布してフォトレジスト層を形成後、パターン露光、現像等という一連の処理を行う。パターン露光にあたっては、パッド部２の面積Ｓ2 （Ｓ1 ＜Ｓ2 ）からなる放熱用裏面Ｂ、及びリード部２Ａの面積Ｓ4 （Ｓ3 ＜Ｓ4 ）からなる放熱用裏面Ｄを形成するためのパターンを露光する。これにより、パッド部２の放熱用裏面Ｂとなる部分、及びリード部２Ａの放熱用裏面Ｄとなる部分を残して、フォトレジストが現像除去され、パッド部２の放熱用裏面Ｂを形成部位、及び、リード部２ａの放熱用裏面Ｄを形成部位にレジストパターンが形成される。これにより、前記リードフレーム用金属材料の表裏面の各々フォトレジスト非形成部の面積の差分（ΔＳP ＝Ｓ2 −Ｓ1 、ΔＳP ＞０、ΔＳL ＝Ｓ4 −Ｓ3 、ΔＳL ＞０、）を有するレジストパターン
が形成される。 Similarly, after applying a photoresist to the back surface of the metal material to form a photoresist layer, a series of processes such as pattern exposure and development are performed. In pattern exposure, a pattern for forming a heat radiating back surface B composed of the area S2 (S1 <S2) of the pad portion 2 and a heat radiating back surface D composed of the area S4 (S3 <S4) of the lead portion 2A is exposed. . Thereby, the photoresist is developed and removed, leaving the portion to be the heat radiation back surface B of the pad portion 2 and the portion to be the heat radiation back surface D of the lead portion 2A, and the heat radiation back surface B of the pad portion 2 is formed. And a resist pattern is formed in the formation site | part in the back surface D for thermal radiation of the lead part 2a. As a result, a resist pattern having a difference (ΔSP = S2−S1, ΔSP> 0, ΔSL = S4−S3, ΔSL> 0) of the areas where the photoresist is not formed on the front and back surfaces of the metal material for the lead frame is obtained. It is formed.

次に、該金属材料の裏面に耐腐食用の樹脂フィルムを貼着し、該金属材料の表面側から表面のフォトレジスト非形成部を所定の深度（例えば、図３、図４に示す厚さｔ2 ）まで塩化第二鉄等のエッチャントを用いてエッチング加工処理（ハーフエッチング処理）した後、洗浄などを行い、その表面に耐腐食用の樹脂フィルムを貼着する。   Next, a corrosion-resistant resin film is attached to the back surface of the metal material, and the photoresist non-formation portion on the surface from the surface side of the metal material is formed at a predetermined depth (for example, the thickness shown in FIGS. 3 and 4). Etching (half-etching) using an etchant such as ferric chloride until t2), followed by washing and attaching a corrosion-resistant resin film to the surface.

次に、該金属材料の裏面の耐腐食用の樹脂フィルムを剥がし、該金属材料の裏面側から、裏面のフォトレジスト非形成部を所定の深度（例えば図３、図４に示す厚さｔ3 ）まで塩化第二鉄等のエッチャントを用いてエッチング加工処理を行う。これにより、表面、裏面に各々対応するレジストパターンが形成されていない金属部位に貫通部が形成され、図１〜図５に示すような搭載用表面Ａの面積Ｓ1 と放熱用裏面Ｂの面積Ｓ2 との関係がＳ1 ＜Ｓ2 となるパッド部２と、電気的接続エリアＣの面積Ｓ3 と前記放熱用裏面Ｄの面積Ｓ4 との関係がＳ3 ＜Ｓ4 となるリード部２ａからなるＬＥＤ発光素子用リードフレームが形成される。   Next, the corrosion-resistant resin film on the back surface of the metal material is peeled off, and the photoresist non-formed portion on the back surface is formed at a predetermined depth (for example, thickness t3 shown in FIGS. 3 and 4) from the back surface side of the metal material. Etching is performed using an etchant such as ferric chloride. As a result, penetrating portions are formed in the metal portions where the resist patterns corresponding to the front and back surfaces are not formed, and the area S1 of the mounting surface A and the area S2 of the heat dissipating back surface B as shown in FIGS. The LED light emitting element lead comprising the lead portion 2a in which the relationship between the pad portion 2 where S1 <S2 and the area S3 of the electrical connection area C and the area S4 of the heat dissipating back surface D is S3 <S4. A frame is formed.

そして、その搭載用表面Ａと放熱用裏面Ｂとの間における前記パッド部の側面部に、その搭載用表面Ａから放熱用裏面Ｂの方向に拡がるモールド充填樹脂を保持するための段差状部Ｅ又はテーパー状部Ｅが形成され、電気的接続エリアＣと放熱用裏面Ｄとの間における前記リード部２ａの側面側には、その電気的接続エリアＣから放熱用裏面Ｄの方向に拡がる、モールド時に充填される樹脂（充填樹脂）を保持するための段差状部Ｅ又はテーパー状部Ｅが形成されたＬＥＤ発光素子用リードフレーム１が形成される。次いで、リードフレーム１に以下の例に記す一連の樹脂モールド加工を行い、ＬＥＤ発光素子用リードフレームを得る。   Then, the stepped portion E for holding the mold filling resin extending in the direction from the mounting surface A to the heat dissipation back surface B on the side surface portion of the pad portion between the mounting surface A and the heat dissipation back surface B. Alternatively, a taper-shaped portion E is formed, and the mold extends on the side surface side of the lead portion 2a between the electrical connection area C and the heat radiation back surface D from the electrical connection area C toward the heat radiation back surface D. The LED light emitting element lead frame 1 in which the stepped portion E or the tapered portion E for holding the resin (filled resin) that is sometimes filled is formed. Next, the lead frame 1 is subjected to a series of resin mold processing described in the following example to obtain an LED light-emitting element lead frame.

すなわち、リードフレーム１を収める所定の内部形状とした凹部を予め形成している金型の凹部内に、リードフレームを装填する。なお、金型としては図１２に示すように、蓋となる板状の上金型４０と、溶融する充填樹脂４を注入する注入口４２と連通するリードフレーム１（多面付けリードフレームＭＬ）を装填可能な凹部４３を内部空間として形成した下金型４１との２枚構成とし、下金型４１の凹部４３にリードフレーム１（多面付けリードフレームＭＬ）を装填後に、上金型４０で下金型４１に蓋をして型締めするものが一般的である。   That is, the lead frame is loaded into a recess of a mold in which a recess having a predetermined internal shape for accommodating the lead frame 1 is formed in advance. As shown in FIG. 12, the mold includes a plate-shaped upper mold 40 serving as a lid, and a lead frame 1 (multi-faced lead frame ML) communicating with an injection port 42 for injecting a filling resin 4 to be melted. The lower mold 41 is formed with a loadable recess 43 formed as an internal space. After the lead frame 1 (multi-sided lead frame ML) is loaded into the recess 43 of the lower mold 41, the upper mold 40 In general, the mold 41 is covered and clamped.

ついで、注入口４２から、凹部４３（内部空間）内に加熱溶融した充填樹脂４を注入して、装填されたリードフレーム１（多面付けリードフレームＭＬ）に充填樹脂４が充填されて成型されたＬＥＤ発光素子用リードフレームが得られる。成型後、冷却して上金型を外し、リードフレーム１を下金型から取り出す。これにより、搭載用表面Ａと放熱用裏面Ｂのそれぞれの面、及び、電気的接続エリアＣと放熱用裏面Ｄのそれぞれの面とが各々充填樹脂から外面に露呈し、かつ、パッド部２とリード部２Ａ間に充填樹脂が充填されたＬＥＤ発光素子用リードフレームが形成される。   Next, the filling resin 4 heated and melted is injected into the recess 43 (internal space) from the injection port 42, and the filled lead frame 1 (multi-sided lead frame ML) is filled with the filling resin 4 and molded. An LED light-emitting element lead frame is obtained. After molding, it is cooled and the upper mold is removed, and the lead frame 1 is taken out from the lower mold. Thereby, each surface of the mounting surface A and the heat radiating back surface B, and each surface of the electrical connection area C and the heat radiating back surface D are exposed from the filling resin to the outer surface, and the pad portion 2 An LED light-emitting element lead frame filled with a filling resin is formed between the lead portions 2A.

なお、図１、および図２中に示す吊りリード２０は、エッチング加工処理後に、パッド部２及びリード部２ａが金属材料から脱落するのを防止するために、必要な期間、パッド部２及びリード部２ａを金属材料に連結保持しておくために形成しているもので、吊りリード部２０を切断して、本発明のリードフレームが得られる。なお、側断面図においては、吊りリード部２０の図示は省略している。吊りリード部２０と金属材料との連結部を切断して、本発明のリードフレームが得られる。吊りリード部２０の切断時期は、ＬＥＤチップの搭載後、または、樹脂モールド後が挙げられるが、適宜設定して構わない。また、上述した説明では、エッチング加工は、表裏の面に各々１回ずつ行い、計２回行っているが、表裏から同時に行う１回のエッチングで金属材料にエッチング加工を行うことであっても構わない。   Note that the suspension lead 20 shown in FIG. 1 and FIG. 2 has a pad portion 2 and a lead for a necessary period in order to prevent the pad portion 2 and the lead portion 2a from falling off the metal material after the etching process. The portion 2a is formed so as to be connected and held to a metal material, and the suspension lead portion 20 is cut to obtain the lead frame of the present invention. In addition, illustration of the suspension lead part 20 is abbreviate | omitted in the sectional side view. The connecting portion between the suspension lead portion 20 and the metal material is cut to obtain the lead frame of the present invention. Although the cutting time of the suspension lead part 20 may be after LED chip mounting or after resin molding, it may be set as appropriate. Further, in the above description, the etching process is performed once for each of the front and back surfaces, a total of two times. However, even if the metal material is etched by one etching performed simultaneously from the front and back surfaces, I do not care.

次に本発明のＬＥＤ発光素子を説明すれば、図１〜図５に示すように、ＬＥＤチップ１０を搭載した１乃至複数箇所のパッド部２と、前記ＬＥＤチップとの電気的接続を行う電気的接続エリアＣを有するリード部２ａとを同一平面に備えたリードフレーム１を備えている。   Next, the LED light-emitting element of the present invention will be described. As shown in FIGS. 1 to 5, one or a plurality of pad portions 2 on which the LED chip 10 is mounted and an electric connection for electrically connecting the LED chip. A lead frame 1 having a lead portion 2a having a general connection area C on the same plane is provided.

前記リードフレーム１は、パッド部２のＬＥＤチップ搭載用表面Ａより該搭載用表面Ａと対向する放熱用裏面Ｂに亘って、及びリード部２ａの電気的接続エリアＣより該エリアＣと対向する放熱用裏面Ｄに亘って、その厚さ方向に、充填樹脂４によりモールド加工が施されている。   The lead frame 1 faces the area C from the LED chip mounting surface A of the pad portion 2 to the heat dissipating back surface B facing the mounting surface A, and from the electrical connection area C of the lead portion 2a. A molding process is performed by the filling resin 4 in the thickness direction over the heat dissipating back surface D.

前記パッド部２の搭載用表面Ａより上面側、及びリード部２ａの電気的接続エリアＣより上面側には、ＬＥＤチップ１０及び電気的接続エリアＣを含めて、透明樹脂５が層状に被覆されている。なお、図面では、透明材料５は層状としているが、ドーム状であっても構わない。   Transparent resin 5 is coated in layers on the upper surface side from the mounting surface A of the pad portion 2 and the upper surface side from the electrical connection area C of the lead portion 2a including the LED chip 10 and the electrical connection area C. ing. In the drawing, the transparent material 5 is layered, but it may be dome-shaped.

前記パッド部２の搭載用表面Ａの面積Ｓ1 と放熱用裏面Ｂの面積Ｓ2 との関係は、Ｓ1 ＜Ｓ2 に設定され、前記ワイヤーボンディングエリアＣの面積Ｓ3 と放熱用裏面Ｄの面積Ｓ4 との関係は、Ｓ3 ＜Ｓ4 に設定されている。このため、放熱部位が広く設定でき、放熱性に優れたＬＥＤ素子とすることが出来る。また、その搭載用表面Ａと放熱用裏面Ｂとの間、及び電気的接続エリアＣと放熱用裏面Ｄとの間における前記パッド部２、及びリード部２ａの側面部には、放熱用裏面Ｂ、Ｄの方向に拡がる段差状部Ｅ又はテーパー状部Ｅを呈している。そのため、充填樹脂４を溶融状態にてモールド加工する際、及びモールド加工後は、該充填樹脂４が、この段差状部Ｅ又はテーパー状部Ｅによって保持され、かつ、充填樹脂とリードフレームとの接触面積は大きくなる。そのため、充填樹脂とリードフレームとは強固に密着することになり、充填樹脂からのリードフレームの脱落、もしくは、リードフレームからの充填樹脂の脱落を防止できる。本発明のリードフレームは、一般的なフォトエッチング法にて安価に形成することが可能なため、安価なリードフレームの供給を可能としている。   The relationship between the area S1 of the mounting surface A of the pad portion 2 and the area S2 of the heat radiation back surface B is set to S1 <S2, and the relationship between the area S3 of the wire bonding area C and the area S4 of the heat radiation back surface D is as follows. The relationship is set to S3 <S4. For this reason, a heat radiation part can be set widely and it can be set as the LED element excellent in heat dissipation. Further, the side surface of the pad portion 2 and the lead portion 2a between the mounting surface A and the heat dissipating back surface B and between the electrical connection area C and the heat dissipating back surface D has a heat dissipating back surface B. , A stepped portion E or a tapered portion E extending in the direction of D is exhibited. Therefore, when the filling resin 4 is molded in a molten state and after the molding, the filling resin 4 is held by the stepped portion E or the tapered portion E, and the filling resin 4 and the lead frame The contact area increases. Therefore, the filling resin and the lead frame are in close contact with each other, and the drop of the lead frame from the filling resin or the dropping of the filling resin from the lead frame can be prevented. Since the lead frame of the present invention can be formed inexpensively by a general photoetching method, it is possible to supply an inexpensive lead frame.

本発明のＬＥＤ発光素子においては、ＬＥＤ素子１０が透明樹脂層５の層内に埋設された状態で発光するため、ＬＥＤ素子１０から発せられた光を透明樹脂５から外側に出射すにあたり高い光利得性を持たせることが重要である。そのために、例えば、光透過性のあるアクリル系樹脂（ポリメタメチルアクリレート樹脂）などの透明性の良好な樹脂５を選定することは勿論であるが、本発明者は特に、前記充填樹脂４として、充填樹脂４と透明樹脂５との境界面において、高い反射性を有する樹脂を使用することを提案する。   In the LED light emitting device of the present invention, since the LED device 10 emits light while being embedded in the layer of the transparent resin layer 5, high light is emitted when the light emitted from the LED device 10 is emitted from the transparent resin 5 to the outside. It is important to provide gain. For this purpose, for example, a resin 5 having good transparency, such as a light-transmitting acrylic resin (polymetamethyl acrylate resin), is selected. It is proposed to use a highly reflective resin at the boundary surface between the filling resin 4 and the transparent resin 5.

前記充填樹脂４として、高い反射率を有することが望ましいが、その他に、耐熱性、耐光性、熱導電性、高い光拡散性を有することも望ましい。そのため、前記充填樹脂４として、例えば、エポキシ樹脂、変性エポキシ樹脂、シリコーン樹脂、アクリル樹脂、ポリカーボネイト樹脂、芳香族系ポリエステル樹脂（不飽和ポリエステル樹脂）、ポリフタルアミド（ＰＰＡ）、液晶ポリマ（ＬＣＰ）などの有機高分子材料が望ましく、１種の樹脂又は、複数種の樹脂の混合樹脂を用いて構わない。   The filling resin 4 desirably has a high reflectance, but in addition, it preferably has heat resistance, light resistance, thermal conductivity, and high light diffusibility. Therefore, as the filling resin 4, for example, epoxy resin, modified epoxy resin, silicone resin, acrylic resin, polycarbonate resin, aromatic polyester resin (unsaturated polyester resin), polyphthalamide (PPA), liquid crystal polymer (LCP) Organic polymer materials such as these are desirable, and one type of resin or a mixed resin of a plurality of types of resins may be used.

充填樹脂４の光屈折率ｎ1 と透明樹脂５の光屈折率ｎ2 との関係を、ｎ1 ＞ｎ2 に設定することが、充填樹脂４と透明樹脂５との境界面における高い反射率を得るために適当であり、屈折率の差が大きいほど高い反射を行うことになる。しかし、樹脂の屈折率は概ね２以下であり、樹脂だけで屈折率差を大きくするには限界が有る。そのため、本発明においては、充填樹脂４として、上記の１種の樹脂又は複数種の樹脂の混合樹脂を主体とする
樹脂に、粉状物質や粒状物質などの添加剤を混合した光拡散性樹脂を使用することを提案する。かかる充填樹脂では、その屈折率ｎを２以上にできるため、充填樹脂４と透明樹脂５との境界面における高い反射性を得ることができる。なお、充填樹脂４に添加する添加剤としては、例えば、ＳｉＯ2 、ＴｉＯ2 、Ａｌ2 Ｏ3 、酸化ジルコニウム、セラミック材、又はそれらの混合物などの微粒子が上げられ、主体樹脂に対する添加剤の混合比率は本発明においては適宜に設定することができる。例えば１％〜２０％、若しくはそれ以上である。 Setting the relationship between the light refractive index n1 of the filling resin 4 and the light refractive index n2 of the transparent resin 5 so that n1> n2 is obtained in order to obtain a high reflectance at the interface between the filling resin 4 and the transparent resin 5. It is appropriate, and the higher the difference in refractive index, the higher the reflection. However, the refractive index of the resin is approximately 2 or less, and there is a limit in increasing the refractive index difference only with the resin. Therefore, in the present invention, as the filling resin 4, a light diffusing resin in which an additive such as a powdery substance or a granular substance is mixed with a resin mainly composed of the above-mentioned one kind of resin or a mixed resin of plural kinds of resins. Suggest to use. In such a filling resin, since the refractive index n can be 2 or more, high reflectivity at the boundary surface between the filling resin 4 and the transparent resin 5 can be obtained. Examples of the additive to be added to the filling resin 4 include fine particles such as SiO 2 , TiO 2 , Al 2 O 3 , zirconium oxide, ceramic material, or a mixture thereof. The ratio can be set appropriately in the present invention. For example, it is 1% to 20% or more.

以下に、充填樹脂に反射性を持たせることによる効果を説明する。
図６に示すように、ＬＥＤチップ１０から発せられた光Ｌは、透明樹脂５中を進行して外部に放出される。しかし、ＬＥＤチップ１０から発せられた光の一部は、外部（空気）と接触する透明樹脂５の境界で反射する（図６中の反射光Ｍ（全反射光や半反射光など））。充填樹脂に高い反射率を持たせた場合、透明樹脂５の境界で反射した反射光Ｍ（空気と透明樹脂５との界面における全反射光や半反射光など）が、充填樹脂の表面に到達した際に、再度反射光を反射させることが可能になり、充填樹脂の表面で再反射した再反射光ＮをＬＥＤ素子より放出させることが可能になる。一方、充填樹脂が反射率を持たない場合、反射光Ｍはそのまま充填樹脂中に進入してしまい、ＬＥＤ素子からの放出が無くなる。 Below, the effect by giving reflectivity to filling resin is demonstrated.
As shown in FIG. 6, the light L emitted from the LED chip 10 travels through the transparent resin 5 and is emitted to the outside. However, a part of the light emitted from the LED chip 10 is reflected at the boundary of the transparent resin 5 in contact with the outside (air) (reflected light M (total reflection light, semi-reflection light, etc. in FIG. 6)). When the filling resin has a high reflectance, the reflected light M reflected at the boundary of the transparent resin 5 (total reflection light or semi-reflection light at the interface between the air and the transparent resin 5) reaches the surface of the filling resin. In this case, the reflected light can be reflected again, and the re-reflected light N re-reflected on the surface of the filling resin can be emitted from the LED element. On the other hand, when the filling resin has no reflectance, the reflected light M enters the filling resin as it is, and the emission from the LED element is eliminated.

このように、充填樹脂に高い反射率を持たせることで、ＬＥＤチップ１０から発せられた光を効率よく外部に放出させることが可能となる。   In this way, by giving the filling resin a high reflectance, it becomes possible to efficiently emit the light emitted from the LED chip 10 to the outside.

なお、ＬＥＤチップ搭載用表面、電気的接続エリアに金属メッキを行った場合、メッキ面にて反射光Ｍを再反射光Ｎとすることが出来るので、ＬＥＤチップ１０から発せられた光を効率よく利用するには好ましい。   In addition, when metal plating is performed on the surface for mounting the LED chip and the electrical connection area, the reflected light M can be changed to the re-reflected light N on the plated surface, so that the light emitted from the LED chip 10 can be efficiently used. It is preferable to use.

さらに充填樹脂表面に、光反射率の優れたセラミックインクなどをコーティングすることも、ＬＥＤチップ１０から発せられた光を効率よく利用する上で好ましいといえる。   Furthermore, it can be said that it is preferable to coat the surface of the filled resin with a ceramic ink having an excellent light reflectivity in order to efficiently use the light emitted from the LED chip 10.

次に本発明のＬＥＤ発光素子ＬＥの第２の実施例（請求項３、４、８、９、１２、１４）について説明すれば、図７は、図１中のＸ1 −Ｘ1 線における側断面図、図８は、図１中のＸ2 −Ｘ2 線における側断面図、図９は、図１中のＹ−Ｙ線における側断面図を各々示す。   Next, a second embodiment of the LED light emitting device LE according to the present invention (claims 3, 4, 8, 9, 12, 14) will be described. FIG. 7 is a sectional side view taken along line X1-X1 in FIG. 8 is a side sectional view taken along line X2-X2 in FIG. 1, and FIG. 9 is a side sectional view taken along line YY in FIG.

第２の実施例におけるＬＥＤ発光素子ＬＥは、図７に示すように、リードフレーム１のパッド部２のＬＥＤチップ搭載用表面Ａの面積Ｓ1 と、該搭載用表面Ａと対向する該パッド部２の放熱用裏面Ｂの面積Ｓ2 との関係は、０＜Ｓ1 ＜Ｓ2 となっている。   As shown in FIG. 7, the LED light emitting element LE in the second embodiment has an area S1 of the LED chip mounting surface A of the pad portion 2 of the lead frame 1 and the pad portion 2 facing the mounting surface A. The relation with the area S2 of the heat radiation back surface B is 0 <S1 <S2.

パッド部２は、搭載用表面Ａを有する上部構造部と、該上部構造部と対向する下部（パッド部２の裏面側）には、該上部構造部と一体であり放熱用裏面Ｂを有する、放熱部３（放熱板）である下部構造部とで構成されている。   The pad portion 2 has an upper structure portion having a mounting surface A, and a lower portion (back side of the pad portion 2) opposite to the upper structure portion, which is integral with the upper structure portion and has a heat radiation back surface B. It is comprised with the lower structure part which is the thermal radiation part 3 (radiation board).

そして、搭載用表面Ａと放熱用裏面Ｂとの間における前記パッド部の上部構造部の側面部には、その搭載用表面Ａから放熱用裏面Ｂの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅが形成されている。一方、放熱部３（放熱板）である下部構造部の側面部には、その放熱用裏面Ｂから搭載用表面Ａの方向に拡がる、樹脂モールド時の充填樹脂を保持するためのテーパー状部Ｅ1 が形成されている。   Then, on the side surface portion of the upper structure portion of the pad portion between the mounting surface A and the heat radiating back surface B, a filling resin that spreads from the mounting surface A in the direction of the heat radiating back surface B during resin molding. A stepped portion or a tapered portion E for holding is formed. On the other hand, on the side surface portion of the lower structure portion that is the heat radiating portion 3 (heat radiating plate), a tapered portion E1 that extends from the heat radiating back surface B to the mounting surface A and holds the filling resin during resin molding. Is formed.

また、リードフレーム１のリード部２ａは、図８に示すように、前記パッド部２の搭載用表面Ａと同一面に前記電気的接続エリアＣと、該電気的接続エリアＣと対向し前記パッ
ド部２の放熱用裏面Ｂと同一面にある放熱用裏面Ｄとを有し、電気的接続エリアＣの面積Ｓ3 と前記放熱用裏面Ｄの面積Ｓ4 との関係は、０＜Ｓ3 ＜Ｓ4 となっている。 Further, as shown in FIG. 8, the lead portion 2a of the lead frame 1 has the electrical connection area C on the same surface as the mounting surface A of the pad portion 2, and the pad facing the electrical connection area C. The heat dissipation back surface D of the part 2 is in the same plane as the heat dissipation back surface D, and the relationship between the area S3 of the electrical connection area C and the area S4 of the heat dissipation back surface D is 0 <S3 <S4. ing.

該リード部２ａは、電気的接続エリアＣを有する上部構造部と、該上部構造部と対向する下部（パッド部２の裏面側）には、該上部構造部と一体であり放熱用裏面Ｄを有する、放熱部３ａ（放熱板）である下部構造部とで構成されている。   The lead portion 2a is integrated with the upper structure portion on the upper structure portion having the electrical connection area C and the lower portion (the back surface side of the pad portion 2) facing the upper structure portion, and the heat dissipating back surface D is provided. And a lower structure part which is a heat radiating part 3a (heat radiating plate).

そして、電気的接続エリアＣと放熱用裏面Ｄとの間における前記リード部２ａの上部構造部の側面側には、図８に示すように、その電気的接続エリアＣから放熱用裏面Ｄの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅが形成されている。一方、放熱部３（放熱板）である下部構造部の側面部には、その放熱用裏面Ｄから電気的接続エリアＣの方向に拡がる、樹脂モールド時の充填樹脂を保持するためのテーパー状部Ｅ1 が形成されている。   Then, on the side surface side of the upper structure portion of the lead portion 2a between the electrical connection area C and the heat radiation back surface D, as shown in FIG. 8, the direction from the electrical connection area C to the heat radiation back surface D is shown. A stepped portion or a tapered portion E for holding the filled resin at the time of resin molding is formed. On the other hand, the side surface portion of the lower structure portion, which is the heat radiating portion 3 (heat radiating plate), is a tapered portion for holding the filled resin at the time of resin molding, spreading from the heat radiating back surface D to the electrical connection area C. E1 is formed.

このようにして形成されたリードフレーム１に対し、前述したように、金型を用いた樹脂モールド加工を行い、充填樹脂４を成型し、搭載用表面Ａと放熱用裏面Ｂのそれぞれ面、電気的接続エリアＣと放熱用裏面Ｄのそれぞれ面が露呈した充填樹脂４が充填されたＬＥＤ発光素子用リードフレームが形成される。   As described above, the lead frame 1 formed in this manner is subjected to resin molding using a mold to mold the filling resin 4, and each surface of the mounting surface A and the heat radiation back surface B is electrically connected. A lead frame for an LED light emitting element filled with the filling resin 4 exposed on the surfaces of the target connection area C and the heat radiation back surface D is formed.

図９は本発明の第２の実施例におけるＬＥＤ発光素子ＬＥの側断面図であり、図９中、Ｗはワイヤー（金線）の一例を示し、パッド部２の搭載用表面ＡのＬＥＤチップ１０と、リード部２ａのワイヤーボンディングエリアＣとの間をワイヤーボンディングにより結線したワイヤーである。   FIG. 9 is a sectional side view of the LED light emitting element LE in the second embodiment of the present invention. In FIG. 9, W represents an example of a wire (gold wire), and the LED chip on the mounting surface A of the pad portion 2. 10 and a wire bonding area C of the lead portion 2a.

かかる構造としたリードフレーム１においては、上部構造部のテーパー状部Ｅのテーパーは例えばハの字状であり、下部構造部のテーパー状部Ｅ１のテーパーは例えば逆ハの字状と、上部構造部と下部構造部の各々のテーパー方向は逆方向となっている。そのため、例えば、パッド部２とリード部２ａとで挟まれた部位の充填樹脂は、上側の面（上部構造部側の面）と下側の面（下部構造部側の面）との間にくびれた部位を有するようになり、図９に示すように断面視で鼓状（あるいは、砂時計状）となる。リードフレーム１は、このくびれ部の上下で各々逆の方向のテーパ部となった側面で充填樹脂を保持するため、充填樹脂のリードフレーム１からの脱落を防止できる。   In the lead frame 1 having such a structure, the taper portion E of the upper structure portion has a taper shape, for example, and the taper portion E1 of the lower structure portion has, for example, an inverted C shape, The taper directions of the part and the lower structure part are opposite to each other. Therefore, for example, the filling resin at the portion sandwiched between the pad portion 2 and the lead portion 2a is between the upper surface (the surface on the upper structure portion side) and the lower surface (the surface on the lower structure portion side). It has a constricted portion, and has a drum shape (or hourglass shape) in a cross-sectional view as shown in FIG. Since the lead frame 1 holds the filling resin on the side surfaces that are tapered in the opposite directions at the top and bottom of the constricted portion, the dropping of the filling resin from the lead frame 1 can be prevented.

なお、前述したように、金属材料を露出するレジストパターンを形成し、エッチャントでエッチングを行う際、レジストパターンから露出した金属材料部位には等方的にエッチングが行われる。そのため、前述したように金属材料の両面から各々エッチングを行うことで、テーパー状部Ｅのテーパー方向と、テーパー状部Ｅ１のテーパー方向とが逆となったリードフレーム１を得ることが可能である。   As described above, when a resist pattern exposing a metal material is formed and etching is performed with an etchant, the metal material portion exposed from the resist pattern is etched isotropically. Therefore, it is possible to obtain the lead frame 1 in which the taper direction of the tapered portion E and the taper direction of the tapered portion E1 are reversed by performing etching from both surfaces of the metal material as described above. .

次に、本発明のＬＥＤ発光素子用リードフレームの第３の実施例（請求項５、１０）について、図１０、図１１に基づいて、以下に説明する。図１０は、多面付けして製造されたリードフレーム１を説明する上面図、図１１（ａ）〜（ｂ）は、その拡大側断面図である。   Next, a third embodiment (Claims 5 and 10) of the lead frame for an LED light emitting element according to the present invention will be described below with reference to FIGS. FIG. 10 is a top view for explaining the lead frame 1 manufactured with multiple faces, and FIGS. 11A and 11B are enlarged side sectional views thereof.

第３の実施例におけるＬＥＤ発光素子用リードフレームは、図１０に示すように、本発明におけるリードフレーム１のパッド部２及びリード部２ａとを、その表裏面を同一平面とする１単位フレームとしている（図１０の点線Ｚ部が１単位フレームを示す）。１単位フレームは、枚葉状あるいは帯状の金属材料に、複数の１単位フレームを互いに縦横方向に多面付け配列した多面付けリードフレームＭＬを用いて製造される。   As shown in FIG. 10, the LED light-emitting element lead frame according to the third embodiment is configured such that the pad portion 2 and the lead portion 2a of the lead frame 1 according to the present invention are formed as a single unit frame with the front and back surfaces in the same plane. (The dotted line Z in FIG. 10 indicates one unit frame). One unit frame is manufactured by using a multi-sided lead frame ML in which a plurality of 1-unit frames are arranged side by side in the vertical and horizontal directions on a sheet-like or strip-shaped metal material.

図１０に示すように、エッチング後にリードフレーム１が金属材料から脱離することを防止するためにタイバー３０と呼称される、例えば格子状の枠部を形成している。１単位フレームは、枠部であるタイバー３０の開口部の領域内にタイバー３０と連結するよう形成する。なお、本実施例では、１単位フレームと、タイバー３０との連結は、ダイバー３０から分岐させた吊りリード２０を介して行っているが、仕様によっては、吊りリード２０を形成せずに、１単位フレームとタイバー３０とを直接に連結させることであっても構わない。   As shown in FIG. 10, in order to prevent the lead frame 1 from being detached from the metal material after etching, for example, a lattice-like frame portion called a tie bar 30 is formed. One unit frame is formed so as to be connected to the tie bar 30 in the region of the opening of the tie bar 30 which is a frame portion. In this embodiment, the unit frame and the tie bar 30 are connected via the suspension lead 20 branched from the diver 30. However, depending on the specification, the suspension lead 20 is not formed and The unit frame and the tie bar 30 may be directly connected.

タイバー３０、吊りリード２０は、エッチングにてパッド部２及びリード部２ａを形成する際に、パッド部２及びリード部２ａを形成するのと同様の手法にて、タイバー３０、吊りリード２０を形成する金属材料部位にもフォトレジストを形成して形成するもので、吊りバー２０、もしくは、タイバー３０の部位を切断、断裁し、金属材料から各１単位フレームを切り離す。なお、１単位フレームとするリードフレームは、上述した実施例１もしくは実施例２のリードフレームのいずれであっても構わない。   When the pad portion 2 and the lead portion 2a are formed by etching, the tie bar 30 and the suspension lead 20 are formed by the same method as that for forming the pad portion 2 and the lead portion 2a. The metal material part to be formed is also formed by forming a photoresist. The part of the suspension bar 20 or the tie bar 30 is cut and cut to separate each unit frame from the metal material. Note that the lead frame as one unit frame may be either the lead frame of the first embodiment or the second embodiment described above.

図１１（ａ）に示すように、多面付けリードフレームＭＬに形成された各１単位フレームのパッド部２及びリード部２ａのそれぞれ表面の面高さ、又は裏面の面高さ、又は表裏両面のそれぞれ面の高さは、例えば金属材料の厚みと略同一のｔ1 としている。一方、本実施例では、吊りバー２０、タイバー３０の面高さは、低位（例えば、放熱部３、放熱部３ａの厚さｔ3 と同じ高さ）に設定されて形成され、前記パッド部２及び前記リード部２ａの厚さよりも、吊りバー２０、タイバー３０の厚さは薄くしている。この、厚みを薄くした吊りバー２０、タイバー３０は、金属材料にエッチングを行い、パッド部２及びリード部２ａを形成する際に、吊りバー２０、タイバー３０とする金属材料部位にハーフエッチングを行うことで形成することが可能である。すなわち、吊りバー２０、タイバー３０を形成すべき金属材料部位の一方の面側（例えば、放熱部側の面側）に吊りバー２０形成用フォトレジスト、タイバー３０形成用フォトレジストを形成し、しかる後に、前述したようにパッド部２及びリード部２ａを形成するためのエッチングを金属材料の両面から行うものである。なお、ハーフエッチングにより厚さを薄くした吊りバー２０、タイバー３０を表面（ＬＥＤチップ搭載用表面、電気的接続エリア）側に形成する場合には、吊りバー２０形成用フォトレジスト、タイバー３０形成用フォトレジストは、表面（ＬＥＤチップ搭載用表面、電気的接続エリア）側に形成する。   As shown in FIG. 11 (a), the surface height, the back surface height, or both the front and back surfaces of the pad portion 2 and the lead portion 2a of each unit frame formed on the multi-faced lead frame ML. The height of each surface is, for example, t1 which is substantially the same as the thickness of the metal material. On the other hand, in this embodiment, the surface height of the suspension bar 20 and the tie bar 30 is set to a low level (for example, the same height as the thickness t3 of the heat dissipating part 3 and the heat dissipating part 3a). And the thickness of the suspension bar 20 and the tie bar 30 is made thinner than the thickness of the lead part 2a. The suspending bar 20 and tie bar 30 having a reduced thickness are etched into a metal material, and half-etching is performed on the metal material portions to be the suspending bar 20 and the tie bar 30 when the pad portion 2 and the lead portion 2a are formed. Can be formed. That is, the suspension bar 20 formation photoresist and the tie bar 30 formation photoresist are formed on one surface side (for example, the surface side of the heat radiation portion) of the metal material portion where the suspension bar 20 and the tie bar 30 are to be formed. Later, as described above, the etching for forming the pad portion 2 and the lead portion 2a is performed from both sides of the metal material. When the suspension bar 20 and the tie bar 30 that are reduced in thickness by half etching are formed on the surface (LED chip mounting surface, electrical connection area) side, the suspension bar 20 formation photoresist and the tie bar 30 formation are formed. The photoresist is formed on the surface (LED chip mounting surface, electrical connection area) side.

図１０、図１１（ａ）に示すように１単位のリードフレーム１の複数単位を多面付けしてフォトエッチングにて製造された平坦状のリードフレームＭＬは、前述したように、ＬＥＤ発光素子用リードフレーム製造用の金型内に装填し、充填樹脂４を金型内の凹部（内部空間）に注入、充填して成型する。これにより、図１１（ｂ）に示すように、搭載用表面Ａと放熱用裏面Ｂのそれぞれ面、電気的接続エリアＣと放熱用裏面Ｄのそれぞれ面が露呈した充填樹脂４が充填されて多面付けされたＬＥＤ発光素子用リードフレームＭＬが形成される。   As shown in FIG. 10 and FIG. 11A, the flat lead frame ML manufactured by photo-etching with multiple units of one unit of the lead frame 1 is used for LED light emitting devices as described above. The resin is loaded into a mold for manufacturing a lead frame, and the filling resin 4 is injected into a recess (internal space) in the mold, filled and molded. As a result, as shown in FIG. 11B, the filling resin 4 is exposed so that the surfaces of the mounting surface A and the back surface B for heat dissipation, and the respective surfaces of the electrical connection area C and the back surface D for heat dissipation are exposed. The attached LED light emitting element lead frame ML is formed.

その後、多面付けされたＬＥＤ発光素子用リードフレームＭＬに切断を行い、切り離された１単位フレームが得られる。なお、ＬＥＤ発光素子用リードフレームＭＬの切断時期は、樹脂モールド後に限らず、ＬＥＤチップの搭載後、または、透明樹脂の形成後であっても構わず、適宜設定して構わない。   Thereafter, the LED light-emitting element lead frame ML that is multifaceted is cut to obtain a single unit frame that is cut off. The cutting time of the LED light-emitting element lead frame ML is not limited to after resin molding, but may be after LED chip mounting or after transparent resin formation, and may be set as appropriate.

多面付けされたＬＥＤ発光素子用リードフレームＭＬに樹脂モールド加工を行う際、凹部（内部空間）を有する金型内に充填樹脂が注入される。充填樹脂が注入される際、樹脂の注入口の近傍の１単位フレームから、注入口から離れた部位にある１単位フレームへと、順次に樹脂が流れていき、樹脂モールドされていく。   When resin molding is performed on the LED light emitting element lead frame ML that is multifaceted, a filling resin is injected into a mold having a recess (internal space). When the filling resin is injected, the resin sequentially flows from one unit frame in the vicinity of the resin injection port to one unit frame in a part away from the injection port, and is resin-molded.

ここで、本発明のＬＥＤ発光素子用リードフレームにおいては、表面（ＬＥＤチップ搭載用表面、電気的接続エリア）と裏面（放熱用裏面）とは各々充填樹脂から露出させている。そのため、表面と裏面に充填樹脂が付着しないよう、凹部の深さ（内部空間の高さ）はリードフレームの厚みと略同一とするものである。すなわち、凹部の深さ（内部空間の高さ）をリードフレームの厚みと略同一とすることで、金型内にリードフレームを装填した際に、リードフレームの表面と裏面とは各々、上金型の面と下金型の面とに密着するようになり、凹部（内部空間）に樹脂を注入した際に、リードフレームの表面と裏面とへの樹脂の付着が防止できるためである。   Here, in the lead frame for LED light emitting element of the present invention, the front surface (LED chip mounting surface, electrical connection area) and the back surface (heat dissipating back surface) are each exposed from the filling resin. For this reason, the depth of the recess (the height of the internal space) is substantially the same as the thickness of the lead frame so that the filling resin does not adhere to the front and back surfaces. That is, by making the depth of the recess (the height of the internal space) substantially the same as the thickness of the lead frame, when the lead frame is loaded into the mold, the front and back surfaces of the lead frame are This is because it comes into close contact with the surface of the mold and the surface of the lower mold, and when resin is injected into the recess (internal space), adhesion of the resin to the front and back surfaces of the lead frame can be prevented.

そのため、吊りバー２０、タイバー３０の厚みが、リードフレームの厚みと同じ程度と厚かった場合、吊りバー２０、タイバー３０が樹脂の流れを妨げる、あるいは、堰き止めることになる。その結果、多面付けされたＬＥＤ発光素子用リードフレームＭＬにおいて、樹脂モールドされなかった部位を生じることになる。充填樹脂が充填されなかった部位は気泡を有する部位となり、ＬＥＤ発光素子用リードフレームの品質、ひいては、ＬＥＤ発光素子の品質が低下することになる。そのため、はなはだしい場合は、気泡を有するＬＥＤ発光素子用リードフレームは欠陥品として廃棄される。   Therefore, when the thickness of the suspension bar 20 and the tie bar 30 is as thick as the thickness of the lead frame, the suspension bar 20 and the tie bar 30 hinder or block the resin flow. As a result, in the LED light emitting element lead frame ML that is multifaceted, a portion that is not resin-molded is generated. The part not filled with the filling resin becomes a part having air bubbles, and the quality of the lead frame for the LED light emitting element, and hence the quality of the LED light emitting element is deteriorated. For this reason, in a severe case, the LED light emitting element lead frame having bubbles is discarded as a defective product.

一方、本実施例では、吊りバー２０、タイバー３０の厚みを、例えば、下部構造部である放熱部３、放熱部３ａの厚さｔ3 と同じ高さとなるよう薄くしている。そのため、充填樹脂の注入時に、樹脂は吊りバー２０、タイバー３０と金型との間に出来た隙間を流れていくことになり、樹脂の流れを妨げ、あるいは、堰き止めることが無くなる。その結果、本実施例の多面付けされたＬＥＤ発光素子用リードフレームＭＬでは、気泡を有さない充填樹脂をリードフレームに成型することが可能になり、ＬＥＤ発光素子用リードフレームの品質を良くすることが可能になる。また、欠陥品が無くなるため製造歩留まりが上がり、ひいては、ＬＥＤ発光素子用リードフレームの製造コストを下げることが可能になる。さらに、吊りバー２０、タイバー３０を切断刃にて切断するが、厚みが薄くなっているため切断時に切断刃に掛かる負荷が少なくなり、切断刃の寿命を長くすることが出来る。   On the other hand, in the present embodiment, the thicknesses of the suspension bar 20 and the tie bar 30 are reduced so as to be the same height as the thickness t3 of the heat dissipating part 3 and the heat dissipating part 3a as the lower structure, for example. Therefore, when the filling resin is injected, the resin flows through the gaps formed between the suspension bar 20 and the tie bar 30 and the mold, so that the flow of the resin is not hindered or blocked. As a result, in the multi-sided LED light emitting element lead frame ML of the present embodiment, it becomes possible to mold a filling resin having no air bubbles into the lead frame, thereby improving the quality of the LED light emitting element lead frame. It becomes possible. Further, since there are no defective products, the manufacturing yield increases, and as a result, the manufacturing cost of the LED light emitting element lead frame can be reduced. Furthermore, although the suspension bar 20 and the tie bar 30 are cut with a cutting blade, since the thickness is reduced, the load applied to the cutting blade during cutting is reduced, and the life of the cutting blade can be extended.

なお、本実施例では、リードフレームの裏面側（下構造部の側）に放熱部と略同じ厚さとした吊りバー２０、タイバー３０を設けているが、リードフレームの表面側（上構造部の側）に上構造部と同じ厚さとした吊りバー２０、タイバー３０を設けることであっても構わない。   In this embodiment, the suspension bar 20 and the tie bar 30 having the same thickness as that of the heat radiating part are provided on the back surface side (lower structure part side) of the lead frame. The suspension bar 20 and the tie bar 30 having the same thickness as the upper structure portion may be provided on the side).

Ａ…搭載用表面
Ｂ…放熱用裏面
Ｃ…ワイヤーボンディングエリア
Ｄ…放熱用裏面
Ｅ…段差状部又はテーパー状部
Ｅ1 …テーパー状部（又は角面取り部）
１…リードフレーム
２…パッド部
２ａ…リード部
３…放熱部
３ａ…放熱部
４…充填樹脂
５…透明樹脂
２０…吊りリード
２０…吊りリード
３０…タイバー
ＭＬ…多面付けリードフレーム
Ｌ…ＬＥＤ発光光線
Ｍ…反射光
Ｎ…再反射光
Ｗ…ワイヤー
Ｚ…１単位フレーム A ... Mounting surface B ... Back surface for heat dissipation C ... Wire bonding area D ... Back surface for heat dissipation E ... Stepped portion or tapered portion E1 ... Tapered portion (or square chamfered portion)
DESCRIPTION OF SYMBOLS 1 ... Lead frame 2 ... Pad part 2a ... Lead part 3 ... Radiation part 3a ... Radiation part 4 ... Filling resin 5 ... Transparent resin 20 ... Hanging lead 20 ... Hanging lead 30 ... Tie bar ML ... Multi-sided lead frame L ... LED light emission M ... reflected light N ... re-reflected light W ... wire Z ... 1 unit frame

Claims (7)

少なくともＬＥＤチップ１０を搭載するための１乃至複数箇所のパッド部２と、前記ＬＥＤチップと電気的接続を行うための電気的接続エリアを有するリード部２ａとを同一平面に備えたＬＥＤ発光素子用リードフレームであって、前記パッド部２のＬＥＤチップ搭載用表面Ａの面積Ｓｌと、該搭載用表面Ａと対向する該パッド部２の放熱用裏面Ｂの面積Ｓ２との関係が０＜Ｓｌ＜Ｓ２であり、前記パッド部は該搭載用表面Ａを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｂを有する下部構造部とからなり、該上部構造の下面が該下部構造の上面の面積の一部と連結し、該上部構造と該下部構造の間に段差を有し、該上部構造部の側面部には、搭載用表面Ａから放熱用裏面Ｂの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅが形成され、該下部構造部の側面部には、放熱用裏面Ｂから搭載用表面Ａの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅ１が形成され、かつ、
前記リード部２ａは、前記パッド部２の搭載用表面Ａと同一面に前記電気的接続エリアＣと、該電気的接続エリアＣと対向し前記パッド部２の放熱用裏面Ｂと同一面にある放熱用裏面Ｄとを有し、前記電気的接続エリアＣの面積Ｓ３と前記放熱用裏面Ｄの面積Ｓ４との関係が０＜Ｓ３＜Ｓ４であり、前記リード部２ａは該電気的接続エリアＣを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｄを有する下部構造部とからなり、該上部構造部の側面部には、電気的接続エリアＣから放熱用裏面Ｄの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部が形成され、該下部構造部の側面部には、放熱用裏面Ｄから電気的接続エリアＣの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅ１が形成されていることで、パッド部２及びリード部２ａの前記上部構造部のテーパー状部Ｅのテーパーはハの字状であり、下部構造部のテーパー状部Ｅｌのテーパーは逆ハの字状であり、上部構造部と下部構造部の各々のテーパー方向は逆方向となるため、パッド部２とリード部２ａとで挟まれた部位の充填樹脂は、上側の面である上部構造部側の面と、下側の面である下部構造部側の面との間にくびれた部位を有するようになり、断面視でくびれ部を有する鼓状あるいは砂時計状となり、このくびれ部の上下で各々逆の方向のテーパー状部となった側面で充填樹脂を保持し充填樹脂のリードフレーム１からの脱落を防止することを特徴とするＬＥＤ発光素子用リードフレーム。 For LED light-emitting elements comprising at least one pad portion 2 for mounting the LED chip 10 and a lead portion 2a having an electrical connection area for electrical connection with the LED chip on the same plane In the lead frame, the relationship between the area S1 of the LED chip mounting surface A of the pad portion 2 and the area S2 of the heat dissipating back surface B of the pad portion 2 facing the mounting surface A is 0 <Sl < The pad portion is composed of an upper structure portion having the mounting surface A and a lower structure portion having the heat dissipating back surface B, which is integral with the upper structure portion, and the lower surface of the upper structure is It is connected to a part of the area of the upper surface of the lower structure, and has a step between the upper structure and the lower structure, and the side surface portion of the upper structure portion extends from the mounting surface A to the heat dissipating back surface B. Expand the filling resin during resin molding Is stepped portion or tapered portion E for lifting is formed on a side surface portion of the lower structure portion, it extends in the direction of the mounting surface A from radiating back side B, to hold the fill resin during resin molding A stepped portion or a tapered portion E1 is formed, and
The lead portion 2a is on the same surface as the mounting surface A of the pad portion 2 and is on the same surface as the electrical connection area C and the back surface B for heat dissipation of the pad portion 2 facing the electrical connection area C. The relationship between the area S3 of the electrical connection area C and the area S4 of the heat dissipation back surface D is 0 <S3 <S4, and the lead portion 2a is connected to the electrical connection area C. And an upper structure part and a lower structure part having the heat radiation back surface D, which are integral with the upper structure part, and the side surface portion of the upper structure part is connected to the heat radiation back surface D from the electrical connection area C. A stepped portion or a tapered portion for holding the filled resin at the time of resin molding is formed, and the side surface portion of the lower structure portion extends from the heat radiation back surface D to the electrical connection area C. Expands to hold the filled resin during resin molding By Sajo portion or tapered portion E1 are formed, the taper of the tapered portion E of the upper structure portion of the pad portion 2 and the lead portions 2a is shaped Ha, tapered portion of the lower structure portion Since the taper of El is an inverted C shape and the taper directions of the upper structure portion and the lower structure portion are opposite directions, the filling resin at the portion sandwiched between the pad portion 2 and the lead portion 2a is the upper side. It has a constricted part between the surface on the upper structure part side which is the surface of the lower surface and the surface on the lower structure part side which is the lower surface, and becomes a drum shape or hourglass shape having a constricted part in a sectional view. A lead frame for an LED light-emitting element, characterized in that the filling resin is held on the side surfaces of the constricted portion which are respectively tapered in opposite directions to prevent the filling resin from falling off from the lead frame 1. 前記パッド部２及び前記リード部２ａとをその表裏面を同一平面とする１単位フレームとして、各単位フレームが互いに縦横方向に１乃至複数本のタイバーにて連結されて多面
付け配列されたＬＥＤ発光素子用リードフレームであって、前記パッド部２及びリード部２ａ及びタイバーのそれぞれ表面又は裏面又は表裏両面の面高さのうち、前記タイバーの面高さが低位に設定され、前記パッド部２及び前記リード部２ａよりもタイバーの厚さが薄く形成されていることを特徴とする請求項１記載のＬＥＤ発光素子用リードフレーム。 LED light emission in which the pad portion 2 and the lead portion 2a are formed as a single unit frame with the front and back surfaces being in the same plane, and each unit frame is connected to each other by one or more tie bars in the vertical and horizontal directions. It is a lead frame for an element, and the surface height of the tie bar is set low among the surface heights of the front surface, the back surface, or both the front and back surfaces of the pad portion 2, the lead portion 2a, and the tie bar. LED light-emitting element lead frame for according to claim 1, characterized in that it is formed is thin tie bars than the lead portion 2a. 板状のリードフレーム用金属材料の表面にパッド部２の面積Ｓｌからなる搭載用表面Ａを形成するためのフォトレジストをパターン形成し、該金属材料の裏面に、前記パッド部２の搭載用表面Ａと対向する面積Ｓ２からなる放熱用裏面Ｂを形成するためのフォトレジストをパターン形成し、該金属材料の表裏両面からエッチング加工することで、前記パッド部２の搭載用表面Ａの面積Ｓｌと放熱用裏面Ｂの面積Ｓ２との関係を０＜Ｓｌ＜Ｓ２とし、かつ、前記パッド部２は、該搭載用表面Ａを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｂを有する下部構造部とからなるパッド部２とし、該上部構造の下面が該下部構造の上面の面積の一部と連結させ、該上部構造と該下部構造の間に段差を設け、該上部構造部の側面部には、搭載用表面Ａから放熱用裏面Ｂの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅを形成し、該下部構造部の側面部には、放熱用裏面Ｂから搭載用表面Ａの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅ１を形成し、かつ、
板状のリードフレーム用金属材料の表面にリード部２ａの面積Ｓ３からなる電気的接続エリアＣを形成するためのフォトレジストをパターン形成し、該金属材料の裏面に、前記リード部２ａの電気的接続エリアＣと対向する面積Ｓ４からなる放熱用裏面Ｄを形成するためのフォトレジストをパターン形成し、該金属材料の表裏両面からエッチング加工することで、前記リード部２ａの電気的接続エリアＣの面積Ｓ３と放熱用裏面Ｃの面積Ｓ４との関係をＳ３＜Ｓ４とし、かつ、前記リード部２ａは該電気的接続エリアＣを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｄを有する下部構造部とからなるリード部２ａとし、該上部構造部の側面部には、電気的接続エリアＣから放熱用裏面Ｄの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部を形成し、該下部構造部の側面部には、放熱用裏面Ｄから電気的接続エリアＣの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部Ｅ１を形成することを特徴とする請求項１のＬＥＤ発光素子用リードフレームの製造方法。 A photoresist for forming a mounting surface A having an area S1 of the pad portion 2 is formed on the surface of the plate-like metal material for the lead frame, and the mounting surface of the pad portion 2 is formed on the back surface of the metal material. By patterning a photoresist for forming a heat-dissipating back surface B having an area S2 facing A, and etching from both the front and back surfaces of the metal material, the area S1 of the mounting surface A of the pad portion 2 The relationship with the area S2 of the heat radiating back surface B is 0 <Sl <S2, and the pad portion 2 is integrated with the upper structure portion having the mounting surface A and the upper structure portion. The pad portion 2 is composed of a lower structure portion having a back surface B, the lower surface of the upper structure is connected to a part of the area of the upper surface of the lower structure, a step is provided between the upper structure and the lower structure, On the side of the superstructure Spreads in the direction of the radiating back side B from the mounting surface A, to form a stepped portion or a tapered portion E for holding the filler resin during resin molding, the side surface portion of said lower structure unit, a heat radiation Forming a stepped portion or a tapered portion E1 that extends from the back surface B in the direction of the mounting surface A to hold the filled resin during resin molding; and
A photoresist for forming an electrical connection area C composed of the area S3 of the lead portion 2a is patterned on the surface of the plate-like metal material for the lead frame, and the electrical surface of the lead portion 2a is formed on the back surface of the metal material. The photoresist for forming the heat radiation back surface D having the area S4 facing the connection area C is patterned and etched from both the front and back surfaces of the metal material, so that the electrical connection area C of the lead portion 2a The relationship between the area S3 and the area S4 of the back surface C for heat dissipation is S3 <S4, and the lead portion 2a is integrated with the upper structure portion having the electrical connection area C, and the heat dissipation. The lead portion 2a is composed of a lower structure portion having a rear surface D, and the side surface portion of the upper structure portion extends from the electrical connection area C in the direction of the heat radiation back surface D. A stepped portion or a tapered portion for holding the filling resin is formed, and the side surface portion of the lower structure portion is filled with a filling resin at the time of resin molding that extends from the heat dissipating back surface D to the electrical connection area C. The method of manufacturing a lead frame for an LED light-emitting element according to claim 1 , wherein a stepped portion or a tapered portion E1 for holding is formed. 請求項３記載のＬＥＤ発光素子用リードフレームの製造方法において、前記パッド部２及び前記リード部２ａとをその表裏面を同一平面とする１単位フレームとして、各単位フレームが互いに縦横方向に１乃至複数本のタイバーにて連結されて多面付け配列されたＬＥＤ発光素子用リードフレームであって、前記パッド部２及びリード部２ａ及びタイバーのそれぞれ表面又は裏面又は表裏両面の面高さのうち、前記タイバーの面高さが低位に設定され、前記パッド部２及び前記リード部２ａよりもタイバーの厚さが薄く形成されていることを特徴とするＬＥＤ発光素子用リードフレームの製造方法。 4. The method for manufacturing a lead frame for an LED light-emitting element according to claim 3 , wherein the pad portion 2 and the lead portion 2a are one unit frame with the front and back surfaces being the same plane, and each unit frame is 1 to 2 in the vertical and horizontal directions. The LED light emitting element lead frame is connected by a plurality of tie bars and arranged in a multi-faceted manner, and the pad part 2, the lead part 2a, and the tie bar, each of the surface heights of the front surface, the back surface, and the front and back surfaces, A method of manufacturing a lead frame for an LED light-emitting element, wherein the surface height of the tie bar is set at a low level, and the tie bar is thinner than the pad portion 2 and the lead portion 2a. 少なくともＬＥＤチップ１０等のＩＣチップを搭載した１乃至複数箇所のパッド部２と、前記ＬＥＤチップと電気的接続を行う電気的接続エリアＣを有するリード部２ａとを同一平面に備えたリードフレームを、前記パッド部２のＬＥＤチップ搭載用表面Ａより該搭載用表面Ａと対向する放熱用裏面Ｂに亘って、その厚さ方向に充填樹脂によりモールド加工が施され、前記パッド部の搭載用表面Ａより上面側には、ＬＥＤチップ及び電気的接続エリアを含めて透明樹脂が被覆されたＬＥＤ発光素子であって、前記パッド部の搭載用表面Ａの面積Ｓ１と放熱用裏面Ｂの面積Ｓ２との関係がＳ１＜Ｓ２であり、前記パッド部は該搭載用表面Ａを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｂを有する下部構造部とからなり、該上部構造の下面が該下部構造の上面の面積の一部と連結し、該上部構造と該下部構造の間に段差を有し、該上部構造部の側面部には、搭載用表面Ａから放熱用裏面Ｂの方向に拡がる段差状部又はテーパー状部Ｅが形成され、該下部構造部の側面部には、放熱用裏面Ｂから搭載用表面Ａの方向に拡がる段差状部又はテーパー状部Ｅ１が形成され、上部構造部のテーパー状部Ｅのテーパーはハの字状であり、下部構造部のテーパー状部Ｅｌのテーパーは逆ハの字状であり、上部構造部と下部構造部の各々のテーパー方向は逆方向となり、かつ、
前記リード部２ａは、前記パッド部２の搭載用表面Ａと同一面の電気的接続エリアＣと、該エリアＣと対向し前記パッド部２の放熱用裏面Ｂと同一面の放熱用裏面Ｄとを有し、前記電気的接続エリアＣの面積Ｓ３と前記放熱用裏面Ｄの面積Ｓ４との関係がＳ３＜Ｓ４であり、前記リード部２ａは該電気的接続エリアＣを有する上部構造部と、該上部構造部と一体である、該放熱用裏面Ｄを有する下部構造部とからなり、該上部構造部の側面部には、電気的接続エリアＣから放熱用裏面Ｄの方向に拡がる、樹脂モールド時の充填樹脂を保持するための段差状部又はテーパー状部が形成され、パッド部２とリード部２ａとで挟まれた部位の充填樹脂は、上側の面である上部構造部側の面と、下側の面である下部構造部側の面との間にくびれた部位を有するようになり、断面視でくびれ部を有する鼓状あるいは砂時計状となり、このくびれ部の上下で各々逆の方向のテーパー状部となった側面で充填樹脂を保持し充填樹脂のリードフレーム１からの脱落を防止することを特徴とするＬＥＤ発光素子。 A lead frame having at least one pad portion 2 on which an IC chip such as an LED chip 10 is mounted and a lead portion 2a having an electrical connection area C for electrical connection with the LED chip on the same plane. From the LED chip mounting surface A of the pad portion 2 to the heat dissipating back surface B facing the mounting surface A, the pad portion 2 is molded with a filling resin in the thickness direction, and the mounting surface of the pad portion is The LED light emitting element covered with a transparent resin including the LED chip and the electrical connection area on the upper surface side from A, the area S1 of the mounting surface A of the pad portion and the area S2 of the heat dissipating back surface B a relationship S1 <S2, the pad portion is made of an upper structure portion having a surface a for the mounting is integral with the upper structure portion, a lower structure having a heat-dissipating back surface B, the Connecting the lower surface of the section structure and part of the area of the upper surface of the lower structure has a step between the upper structure and said lower structure, the side surface portion of the upper structure portion, the heat dissipation from the mounting surface A A stepped portion or a tapered portion E extending in the direction of the rear surface B is formed, and a stepped portion or a tapered portion E1 extending in the direction from the rear surface B for heat dissipation to the mounting surface A is formed on the side surface portion of the lower structure portion. The tapered portion E of the upper structure portion has a C-shaped taper, and the tapered portion El of the lower structure portion has an inverted C-shape, and each of the upper structure portion and the lower structure portion The taper direction is the opposite direction, and
The lead portion 2a includes an electrical connection area C that is the same surface as the mounting surface A of the pad portion 2, and a heat dissipation back surface D that faces the area C and is the same surface as the heat dissipation back surface B of the pad portion 2. The relationship between the area S3 of the electrical connection area C and the area S4 of the heat dissipating back surface D is S3 <S4, and the lead portion 2a includes an upper structure portion having the electrical connection area C; A resin mold comprising a lower structure portion having the heat dissipation back surface D, which is integral with the upper structure portion, and extending in the direction of the heat dissipation back surface D from the electrical connection area C to the side surface portion of the upper structure portion. The stepped portion or the tapered portion for holding the filling resin at the time is formed, and the filling resin at the portion sandwiched between the pad portion 2 and the lead portion 2a is the surface on the upper structure portion side which is the upper surface. , The constricted part between the lower surface and the lower surface From the lead frame 1 of the filling resin, the filling resin is held by the side surfaces that are tapered in the opposite direction at the top and bottom of the constricted portion. LED light emitting element characterized by preventing falling off. 前記充填樹脂の光屈折率ｎ１と透明樹脂の光屈折率ｎ２との関係がｎ１＞ｎ２に設定され、前記充填樹脂を高反射率の樹脂としたことを特徴とする請求項５記載のＬＥＤ発光素子。 6. The LED emission according to claim 5 , wherein the relationship between the light refractive index n1 of the filling resin and the light refractive index n2 of the transparent resin is set to n1> n2, and the filling resin is a highly reflective resin. element. 前記充填樹脂に反射率特性向上用の微粒子を添加したことを特徴とする請求項５または６記載のＬＥＤ発光素子。 The LED light-emitting element according to claim 5, wherein fine particles for improving reflectance characteristics are added to the filling resin.
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