JP5287275B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light-emitting device that can be used for a display device, a lighting fixture, a display, a backlight source of a liquid crystal display, a projector device, a laser display, an endoscope, and the like, and particularly relates to a light-emitting device using a semiconductor light-emitting element.

  As a first light emitting device using a conventional optical semiconductor element, a device that can seal a semiconductor laser is disclosed (for example, see Patent Document 1). FIG. 12 is a cross-sectional view showing a conventional light emitting device. The semiconductor laser 610 is bonded to the header 612. A condensing lens 625 that transmits light from the semiconductor laser 610 is attached to the inner can 620a. The inner can 620a is attached to the header 612, and the inner can 620a is covered with the outer can 620b. The outer can 620b includes a glass window 630 that further transmits the light transmitted from the condenser lens 625. The light emitted from the semiconductor laser 610 passes through the lens 625 and further passes through the glass window 630.

  Further, as a second light emitting device of a conventional can type laser, a device in which a fluorescent material layer is arranged in a light extraction portion is disclosed (for example, see Patent Document 2). FIG. 13 is a cross-sectional view showing a conventional light emitting device. The second light emitting device includes a semiconductor light emitting element 710, a stem 712 and a can 720. The semiconductor light emitting device 710 is mounted on the stem 712 and covered with a can 720. The can 720 is provided with an extraction window 730 that transmits light from the semiconductor light emitting element 710, and a fluorescent material layer 735 is disposed in the extraction window 730. The fluorescent material layer 735 is disposed on the outside of the extraction window 730 by application.

JP-A 64-53436 Japanese Patent Laid-Open No. 11-87778 (particularly FIG. 95)

In the conventional first light emitting device, since the lens 625 is simply attached to the center of the can, the lens 625 easily falls off. Since the lens 625 is mainly intended to have a light collecting effect, it is not preferable that the lens is covered with a non-translucent member such as a can. Although the lens 625 includes the outer can 620b, the lens is not dropped. It is not enough as a structure to prevent.
In the conventional second light emitting device, since the fluorescent material layer 735 is formed on the surface of the extraction window 730 by coating, the fluorescent material layer 735 may be peeled off. In addition, since the take-out window 730 is simply attached to the center of the can 720, there is a problem that the take-out window easily falls off or the light emission efficiency is deteriorated depending on the attachment method. Further, in the case where the light of the semiconductor light emitting element 710 is emitted to the outside through the fluorescent material layer 735, the fluorescent material layer 735 is deteriorated by the heat caused by the light, and the light cannot be extracted to the outside sufficiently. There are also problems.
Accordingly, the present invention provides a light emitting device having a configuration capable of firmly fixing a translucent member, and also provides a light emitting device capable of efficiently extracting emitted light from a semiconductor light emitting element to the outside. For the purpose.

  A light-emitting device comprising: a semiconductor light-emitting element; a holder that covers the semiconductor light-emitting element and has a through-hole through which light from the semiconductor light-emitting element passes; and a translucent member disposed on the through-hole of the holder The translucent member has an inner hole into which the translucent member is inserted, and an engaging portion having an opening capable of engaging the translucent member at one end of the inner hole. And a sleeve surrounding the fixing member is provided on the holder, and the fixing member is fixed to the sleeve. According to this configuration, it is possible to prevent the translucent member from falling off. Further, light can be emitted to the outside without reducing the light extraction efficiency from the semiconductor light emitting element.

  The upper surface of the sleeve is preferably substantially the same height as the upper surface of the fixing member. According to this configuration, it is possible to prevent the translucent member from falling off.

  Moreover, it is preferable that the welding trace which reaches a fixing member from the side surface of the said sleeve is formed. According to this configuration, it is possible to prevent the translucent member from falling off. In addition, heat generated in the translucent member can be transmitted to the fixing member and the sleeve to improve heat dissipation.

  It is preferable that a support member is provided between the upper surface of the holder and the translucent member, and at least a part of the translucent member and the support member is fitted in an inner hole of the fixing member. . According to this configuration, the translucent member can be firmly fixed.

  In addition, the support member includes a base portion that is disposed on the holder and is fitted to the sleeve, and a protrusion portion that protrudes from an upper surface of the base portion and is fitted to an inner hole of the fixing member. Is preferred. According to such a configuration, the translucent member can be firmly fixed together with the support member.

  ADVANTAGE OF THE INVENTION According to this invention, the light-emitting device which has a structure which can fix a translucent member firmly can be provided. In addition, it is possible to provide a light-emitting device that can emit light without reducing the light extraction efficiency from the semiconductor light-emitting element.

1 is a schematic perspective view showing a light emitting device according to a first embodiment of the present invention. It is a schematic sectional drawing which shows the light-emitting device which concerns on 1st Embodiment of this invention. It is the schematic sectional drawing which expanded some light emitting devices concerning a 1st embodiment of the present invention. It is a schematic sectional drawing which shows the application example of a supporting member. It is a schematic sectional drawing which shows the example of arrangement | positioning of the spacer in the light-emitting device of this invention. It is a schematic sectional drawing which shows the light-emitting device which concerns on 2nd Embodiment of this invention. It is the schematic sectional drawing to which a part of light-emitting device concerning a 2nd embodiment of the present invention was expanded. It is a schematic sectional drawing which shows the light-emitting device which concerns on 3rd Embodiment of this invention. It is the schematic sectional drawing to which a part of light-emitting device concerning a 3rd embodiment of the present invention was expanded. It is the schematic sectional drawing which expanded a part of light-emitting device concerning 4th Embodiment of this invention. It is the schematic sectional drawing to which a part of light-emitting device concerning a 5th embodiment of the present invention was expanded. It is a schematic sectional drawing which shows the conventional light-emitting device. It is a schematic sectional drawing which shows the conventional light-emitting device.

  The best mode for carrying out the present invention (hereinafter referred to as “embodiment”) will be described in detail below with reference to the drawings. However, the present invention is not limited to this embodiment.

<First Embodiment>
FIG. 1 is a schematic perspective view showing a light emitting device according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing the light emitting device according to the first embodiment of the present invention. FIG. 3 is an enlarged schematic sectional view of a part of the light emitting device according to the first embodiment of the present invention.

The light emitting device according to the present embodiment includes a semiconductor light emitting element 110, a holder 120 that covers the semiconductor light emitting element 110 and has a through hole 122 through which light from the semiconductor light emitting element 110 passes, and a through hole 122 of the holder 120. A translucent member 130 to be disposed.
The semiconductor light emitting element 110 is placed on the stem 112 via, for example, an adhesive or a heat dissipation member. The stem 112 includes a substantially disc-shaped stem bottom portion 113 and a columnar stem column body 114 disposed upright at the approximate center of the upper surface of the stem bottom portion 113. Leads 115 used for connection to an external power supply project on the upper and lower surfaces (surface opposite to the upper surface) of the stem bottom 113. The semiconductor light emitting element 110 is fixed to the side surface of the stem column 114 and is electrically connected to the lead 115 via a conductive member such as a wire. A cap 116 that covers the semiconductor light emitting element 110 together with the stem column body 114 is connected to the upper surface of the stem bottom 113. The cap 116 has a cup shape with an opening on the stem bottom portion 113 side, and a window portion 117 through which light emitted from the semiconductor light emitting element 110 passes is formed at a substantially central portion of the upper surface thereof.
The holder 120 has a substantially cylindrical shape, and has an upper surface and a lower surface that face each other. The through hole 122 of the holder 120 penetrates from the center of the upper surface of the holder 120 to the lower surface. The through hole 122 of the holder 120 has an inner diameter larger than the outer diameter of the cap 116 that covers the semiconductor light emitting element 110, and the lower surface side of the holder 120 is formed on the stem bottom 113 so as to include the semiconductor light emitting element 110 and the cap 116. Fixed. A lens 125 is provided inside the through hole 122 of the holder 120. The lens 125 is disposed between the cap 116 that covers the semiconductor light emitting element 110 and the translucent member 130. The light emitted from the semiconductor light emitting device 110 is collected by the lens 125 and irradiated to the translucent member 130.
A support member 140 that supports the translucent member 130 is provided between the upper surface of the holder 120 and the translucent member 130. The support member 140 has a substantially cylindrical shape. The support member 140 is disposed on the upper surface of the holder 120 so as to cover the through hole 122 of the holder 120. A through-hole 142 through which light from the semiconductor light emitting element 110 passes is provided in a substantially central portion of the support member 140. The translucent member 130 is disposed on the support member 140 so as to close the through hole 142 of the support member. The light emitted from the semiconductor light emitting device 110 passes through the through hole 142 and enters the translucent member 130. The support member 140 may be omitted. In the present embodiment, the translucent member 130 has a shape obtained by combining a substantially truncated cone and a columnar shape.
The light emitting device according to the present embodiment includes a fixing member 150 that locks the translucent member 130. The fixing member 150 has an inner hole 152 into which the translucent member 130 is inserted, and an engaging portion 154 having an opening 156 capable of engaging the translucent member 130 at one end of the inner hole 152 is provided. It becomes. The locking portion 154 is smaller than the maximum diameter of the translucent member 130. Thereby, falling off of the translucent member can be prevented while suppressing a decrease in light extraction efficiency due to light shielding.
A sleeve 160 surrounding the fixing member 150 is provided on the holder 120. The sleeve 160 has a substantially cylindrical shape, and is connected to the peripheral portion of the through hole 122 on the upper surface of the holder 120. The holder 120 and the sleeve 160 are not necessarily different members. Both can be the same member, which can reduce the number of parts of the product. Moreover, each may be comprised with the some member. The outer diameter of the support member 140 is preferably substantially the same as the inner diameter of the sleeve 160. The support member 140 is fitted in the sleeve 160. Thereby, shakiness of the support member 140 in the radial direction can be suppressed. The outer diameter of the fixing member 150 is preferably substantially the same as the inner diameter of the sleeve. The fixing member 150 is fitted in the inner hole of the sleeve 160, and the locking portion 154 is in contact with the translucent member 130 inserted in the inner hole 152 of the fixing member.
The fixing member 150 is fixed to the sleeve 160 in a state where the locking portion 154 is in contact with the translucent member 130. The translucent member 130 is sandwiched between the upper surface of the holder 120 and the locking portion 154 of the fixing member 150 together with the support member 140. The fixing member 150 is preferably fixed to the sleeve 160 in a state where the translucent member 130 is pressed to the holder 120 side by the locking portion 154. The fixing member 150 may be provided with a gap, unevenness, and screw shape so that it can be removed. However, in order to increase the fixing strength, it is preferable to fix the sleeve 160 and the fixing member 150 by YAG welding or the like. In the present embodiment, a welding mark 170 reaching the fixing member from the side surface of the sleeve is formed by irradiating the YAG laser from the outside of the sleeve. The heat generated in the translucent member can be released to the outside through the welding marks. The upper surface of the sleeve 160 is preferably substantially the same height as the upper surface of the fixing member 150. Thereby, it can be set as the structure where the fixing member 150 cannot fall off easily.
The length of the inner hole 152 of the fixing member 150 is preferably set to be substantially the same length or slightly shorter in consideration of the tolerance of the translucent member 130. As a result, when the fixing member 150 is fitted into the sleeve 160, there may be a gap 175 between the lower surface of the fixing member 150 and the upper surface of the support member 140. At this time, a part of the upper surface side of the translucent member 130 is inserted into the inner hole 152 of the fixing member 150. The lower surface side of the translucent member 130 protrudes below the lower surface of the fixing member 150 from the inner hole 152 of the fixing member 150. The lower surface of the fixing member 150 faces the upper surface of the support member 140 in a state of being separated so that a gap 175 exists.

  In the light emitting device according to the present embodiment, since the translucent member 130 is sandwiched between the upper surface of the holder 120 and the locking portion 154 of the fixing member 150, the positional deviation of the translucent member 130 can be suppressed. In addition, since the sleeve 160 is provided around the fixing member 150 that locks the translucent member 130, the fixing member 150 can be protected from the outside. It has a structure that is difficult to drop out. In addition, since the fixing member 150 is fitted in the sleeve 160 and the outer surface of the fixing member 150 and the inner surface of the sleeve 160 are in contact with each other, the contact area between the fixing member 150 and the sleeve 160 is sufficiently increased. Can be secured. Thereby, the fixing member 150 can be firmly fixed. Moreover, since the heat generated in the translucent member 130 can be efficiently radiated, deterioration of the translucent member can be suppressed.

  The individual members will be described below.

(holder)
The holder surrounds the periphery of the cap and the stem in which the semiconductor light emitting element is built. The stem bottom is fixed to the inner hole of the holder. A lens can be fixed in the inner hole of the holder.

  The holder has an upper surface and a lower surface facing each other, and is provided with a through hole penetrating from the upper surface to the lower surface. The shape of the holder 120 exemplifies a substantially cylindrical shape, but is not particularly limited as long as it is a shape into which a cap or stem can be inserted. The planar shape of the through-hole 122 of the holder 120 is preferably a circle, but may be a shape that approximates a circle. The through hole 122 of the holder 120 may be inclined or curved so that the inner diameter decreases from the lower end side toward the upper end side.

  In the light emitting device according to the present embodiment, a through-hole is formed at substantially the center of the upper surface of the holder as viewed from the light emitting direction side of the semiconductor light emitting element. Thereby, the emitted light from the semiconductor light emitting element can be efficiently emitted to the outside.

  The material of the holder is not particularly limited, but is a material excellent in adhesiveness with the stem bottom portion and the sleeve to be connected, and further can dissipate conduction heat from a heat source such as a semiconductor light emitting element. A material is preferred. Examples include nickel, cobalt, iron, brass, stainless steel, an alloy of nickel and iron, an iron-nickel-cobalt alloy (Kovar), and the like.

(sleeve)
The sleeve is configured to surround the support member, the translucent member, and the fixing member disposed on the holder, and the lower surface of the sleeve is joined to the upper surface of the holder by, for example, welding. A fixing member is fixed to the inner hole of the sleeve. The sleeve has a role of protecting the fixing member from the outside.

The sleeve has a substantially cylindrical shape. The shape of the sleeve is not particularly limited as long as it can surround the support member, the translucent member, and the fixing member. The shape of the sleeve can be a rectangular tube or a shape approximating these shapes in addition to the cylindrical shape.
The inner diameter of the sleeve is not particularly limited as long as the support member, the translucent member, and the fixing member can be disposed inside. If the inner diameter of the sleeve is substantially the same as the outer diameter of the fixing member, it is preferable because the fixing member can be fitted and fixed.
The upper surface of the sleeve is preferably substantially the same height as the upper surface of the fixing member. Thereby, it can be set as the structure where a fixing member cannot fall off easily. Further, the upper surface of the sleeve may slightly protrude from the upper surface of the fixing member. Thereby, according to the usage form of the light-emitting device of this invention, when attaching optical members, such as a light guide, to the front-end | tip of a fixing member or a sleeve, light can be guided efficiently and stably.

  The sleeve can also have a function of radiating heat conducted from the translucent member through the fixing member to the holder or the outside. For this purpose, the sleeve is preferably made of a material having high thermal conductivity. As an example, nickel, cobalt, iron, brass, stainless steel, an alloy of nickel and iron, an alloy of iron, nickel and cobalt (Kovar), or the like can be given. Moreover, it is preferable that the sleeve is made of a material excellent in adhesiveness with the holder and the fixing member to be connected. Further, the holder and the sleeve or the holder and the spacer described later are preferably made of a material that improves the weldability, for example, by being joined by welding.

(Fixing member)
The fixing member is for fixing the translucent member. The fixing member has an inner hole into which the translucent member is inserted, and a locking portion having an opening that can lock the translucent member is provided at one end of the inner hole. The opening of the fixing member can emit light from the translucent member to the outside with desired optical characteristics.

  The shape of the fixing member is not particularly limited, and various shapes can be mentioned. The outer shape of the fixing member is preferably substantially the same as the inner shape of the sleeve. The planar shape of the opening is not particularly limited, and examples thereof include a polygon such as a circle, an ellipse, a rectangle, a square, and a rhombus in a plan view inside or outside the fixing member. Further, the planar shape may be different between the inside and the outside of the fixing member.

  The central axis of the inner hole of the fixing member is preferably substantially the same as the light emission axis from the semiconductor light emitting element or the central axis of the through hole of the support member. The central axis of the opening of the fixing member is preferably substantially the same as the central axis of the inner hole of the fixing member.

  The size and shape of the opening of the locking portion of the fixing member are not particularly limited as long as light from the semiconductor light emitting element can be transmitted. The opening of the locking portion preferably has an inner diameter that increases in the light traveling direction. Specifically, it is preferable that the light incident side of the opening of the locking portion is smaller than the maximum diameter of the translucent member. In the present specification, the light incident side refers to the side on which light from the semiconductor light emitting element is incident, and the light exit side refers to the other end side, of both ends of the opening and the through hole. By making the opening of the locking portion smaller than the maximum diameter of the translucent member, it is possible to prevent the translucent member from falling off. In addition, by expanding the opening of the locking part toward the tip, and making the light emission side of the opening of the locking part the same as or larger than the maximum diameter of the translucent member, from the light emission observation surface side When viewed, the surface area of the translucent member can be increased, and the light extraction efficiency can be improved. The opening is preferably a tapered shape or a curved surface with a wide opening in the opening direction. The extent of the opening in the opening direction is not particularly limited. For example, the opening has an inclination angle of about 30 to 90 ° with respect to the upper surface of the fixing member extending on the outer periphery of the opening. Is preferred. By setting such an inclination angle, the light from the translucent member can be efficiently reflected by the inner wall of the opening, so that the light extraction efficiency can be improved.

  As the fixing member, a member having high thermal conductivity and the same thermal expansion coefficient as that of the sleeve is preferably used, and specifically, a metal is preferably used. More specifically, it is preferable to use iron, stainless steel, iron-nickel alloy, Kovar alloy, or aluminum alloy. If it does in this way, the heat which arises in a translucent member can be diffused. Further, it is possible to prevent the sleeve and the fixing member from being defective based on the difference in thermal expansion coefficient between the sleeve and the fixing member, and to improve the yield.

  The fixing member may include a reflecting member on the surface. The reflecting member reflects light emitted from the semiconductor light emitting element or light emitted from the translucent member. The reflecting member can be disposed on, for example, a part or the whole of the inner hole of the fixing member, a part or the whole of the sleeve, a part or the whole of the inside and / or the outside of the holder. It is preferable that the member is disposed at and around the portion where the member is disposed, that is, the inner hole and the opening of the fixing member, the through hole and the upper surface of the support member. By disposing such a reflecting member, the light emitted and / or reflected in an unintended direction can be efficiently extracted to the outside by being re-reflected, and the light extraction efficiency can be improved.

The reflecting member is not particularly limited. For example, Ag, Au, Al, Ni, In, Pd, Rh, Pt, Ti, and other metals, In-Ag, Au-Ag, Ag-Bi, Ag- Nd-Cu, Ag-Au-Cu, Ti-Ni-Au-Ag-Al, Ti-Ag-Al, Ti-Ni-Au-Ag, Ni-Au-Ag, Au-Ag-Al, Ti-Ag, alloys such as _{Ag-Al, AlN, SiO 2} , TiO 2, Ta 2 O 5, SiO, SiN, ZnO, Al 2 O 3, Ti 3 O 5, Ti 2 O 3, TiO, Nb 2 O 5, CeO 5 , ZnS, MgF _2, or a combination thereof, or a single layer film or a laminated film. Although the thickness of the reflecting member is not particularly limited, for example, it is preferably formed along the inner wall of the through hole so as not to block the inside of the through hole.

The reflective member may be covered with a protective film. The protective film functions to suppress the deterioration of the reflecting member, thereby extending the life of the light emitting device. The reflecting member is prevented from coming into contact with the outside, and the chemical reaction and contamination of the reflecting member itself are prevented.
The protective film is preferably formed of a material having a high light transmittance. Thereby, the light reflected by the reflecting member can be efficiently extracted to the outside. _{Specifically, ZnO, SiO, SiO 2,} Al 2 O 3, ITO, MgF 2, Nb 2 O 5, TiO 2, ZrO 2, AlN glass, ceramics _{(ZrO 2, Al 2 O 3} , AlN, GaN, SiN etc.), resin (silicone resin, epoxy resin etc.) or a combination thereof.
The protective film can also contribute to adhesion between the second light transmissive member and the first light transmissive member and the cap. Thereby, the contact | adhesion intensity | strength to the cap of a 2nd translucent member and a 1st translucent member can be improved.
In addition, although the thickness of a protective film is not specifically limited, For example, it is preferable to form so that all the reflection members may be covered so that the inside of a through-hole may not be block | closed.
Since the fixing member and the supporting member of the present invention can be attached to and detached from the holder, the formation of the reflecting member and the protective film is not a holder unit, but a fixing member and a supporting member that are members independent of the holder. Can be done against.

(Fixing method of fixing member and sleeve)
The fixing member and the sleeve can be shaped to fit the connecting portion, and a screw type in which the fixing member and the sleeve are provided with a male screw and a female screw, and a fitting type in which the fixing member and the sleeve are provided with irregularities can be adopted. it can. There is also a joining method in which the fixing member and the sleeve are fixed by welding or adhesive to increase the fixing strength. The welding fixation is, for example, YAG laser welding, in which a part of the fixing member and the sleeve are melted and fixed by welding.
In the case of welding fixation, heat caused by the laser is easily transmitted to the peripheral members. For example, if the inner hole or lower surface of the fixing member is to be welded and fixed to another member, the translucent member may be deteriorated or discolored by heat generated during welding. In the present invention, since the outer surface of the fixing member located far from the translucent member is fixed by welding, it is possible to prevent the translucent member from being deteriorated or discolored.

It is preferable that the sleeve and the fixing member have a contact area enough to weld both. By securing a sufficient contact area between the sleeve and the fixing member, the fixing member can be firmly fixed, and heat conducted from the translucent member through the fixing member can be efficiently radiated. .
The position where the fixing member and the sleeve are fixed is preferably a region close to the translucent member in a plane where both are in contact or close to each other. As a result, it is possible to secure a heat dissipation path that efficiently conducts heat generated in the translucent member from the fixing member to the sleeve. Moreover, in order to improve heat dissipation, it is preferable to weld between a fixing member and a sleeve via a member with high heat conductivity, such as silver.
In the case of YAG welding, a welding mark reaching the fixing member from the side surface of the sleeve is formed by irradiating the YAG laser from the outside of the sleeve. It is preferable that the welding mark is formed from the side surface of the sleeve toward the contact portion between the fixing member and the translucent member. By forming a welding mark so as to be close to the translucent member, heat generated in the translucent member can be efficiently released to the outside through the welding mark, so that the translucent member is deteriorated. Can be prevented. Moreover, since no welding mark remains in the inner hole of the fixing member, it is possible to suppress the loss of light caused by the light of the translucent member entering the welding mark.

  The adhesive is fixed in advance by making a hole in the side of the sleeve, inserting the fixing member into the inner hole of the sleeve, and then filling the hole provided in the side of the sleeve with an organic or inorganic adhesive. And the sleeve are fixed. In the light emitting device of the present invention, since the fixing member is fixed to the sleeve, the adhesive does not exist in the inner hole of the fixing member, and the adhesive exists outside the fixing member. Therefore, it is possible to prevent a decrease in light extraction efficiency caused by the light from the semiconductor light emitting element being absorbed by the adhesive. In addition, the adhesive can be prevented from being deteriorated by light from the semiconductor light emitting device.

(Support member)
The support member is provided between the holder and the translucent member inside the sleeve. The support member has a substantially columnar shape, and a through-hole that extends from the holder side to the translucent member side is formed in the approximate center. The light emitted from the semiconductor light emitting element and having passed through the through hole of the holder passes through the through hole of the support member and is emitted to the light transmissive member side. The support member has a function of reflecting the return light from the translucent member while supporting the translucent member.

The shape of the support member may be a polygonal column shape or a shape approximating these shapes in addition to the columnar shape. It is preferable that the support member has a plane that can fix at least the translucent member.
The thickness of the support member is not particularly limited, but can be appropriately adjusted depending on the characteristics of the semiconductor light emitting element and lens used, the structure and size of the holder, and the like. The diameter (or width) of the support member is at least larger than the diameter of the through hole of the holder, and is the same as or smaller than the diameter of the inner hole of the sleeve. The diameter (or width) of the support member is preferably substantially the same as the diameter of the inner hole of the sleeve. Thereby, the shakiness of the support member in the radial direction can be suppressed in the sleeve.
In addition, in order to sufficiently reflect the light from the translucent member, the projected area of the support member in the light emitting direction from the semiconductor light emitting element is equal to or larger than the projected area of the translucent member. It is preferable to adjust so that.

  The through hole of the support member is formed substantially at the center when viewed from the upper surface side of the support member. The light emitted from the semiconductor light emitting element passes through the through hole of the support member and is emitted to the light transmissive member side. The central axis in the opening width of the through hole is preferably substantially the same as the light emission axis from the semiconductor light emitting element. The opening shape of the through hole is not limited to a circle but may be an ellipse or a polygon. Moreover, the opening shape of the through hole may have different opening shapes on the holder side and the translucent member side.

The through hole of the support member may have an inclined portion formed by changing the opening width in one direction. As the shape of the inclined portion, for example, the region of the inclined portion of the through hole of the support member has a substantially inverted truncated cone shape, that is, the inner diameter increases from the holder side toward the translucent member side. It is done. By providing the through hole having such a shape, the light incident surface of the translucent member can be sufficiently secured, and thus the light extraction efficiency is improved. In this case, the lens and the spherical mirror are adjusted so that the focal point of the light from the semiconductor light emitting element substantially coincides with the light incident side end of the through hole of the support member, or the semiconductor light emitting element is close to the through hole of the support member. It is preferable to arrange so as to. Thereby, the light from the semiconductor light emitting element can be incident on the translucent member without attenuation due to the interference of the support member, and the light that has entered the through hole can be prevented from returning to the holder side again. .
In addition, the region of the inclined portion of the through hole of the support member may have a substantially truncated cone shape, that is, the inner diameter decreases from the holder side toward the translucent member side. By providing the through hole having such a shape, the light returning from the translucent member toward the holder can be reflected by the support member. Thereby, the light extraction efficiency can be improved. Moreover, since the contact area of a translucent member and a supporting member increases, heat dissipation can be improved further.

  The through hole of the support member may have a large enlargement ratio of the opening diameter near the light incident side of light from the semiconductor light emitting element and a small enlargement ratio near the light exit side. For example, an inclined portion having a curved surface such as a dome shape can be used. The curved inclined portion can refract light reflected by the inclined portion toward the center of the light emission side. Therefore, the number of reflections of light within the through hole of the support member can be reduced, and light loss can be reduced.

  The material of the support member is not particularly limited, and various materials can be used. However, for example, when the reflective member is formed on the surface of the support member by a plating method, it is preferable to use a conductive member as the support member. Specific examples of the material include copper, brass, SUS, nickel, kovar, and aluminum. On the other hand, when the reflective member is formed by sputtering or vapor deposition, various members can be used as the support member in addition to the conductive member.

  The support member can be attached to and detached from the holder and the fixing member. Therefore, it is possible to adjust the distance between the semiconductor light emitting element and the translucent member, or to provide a function of reflecting the return light from the translucent member simply by attaching the support member.

  FIG. 4 is a schematic cross-sectional view showing an application example of the support member. The through hole 142 of the support member 140 may be filled with a light transmissive member 143 having translucency. The light transmissive member 143 has a refractive index greater than the refractive index of the atmosphere (refractive index at a wavelength of 400 to 800: approximately 1), and is the same as the refractive index of the translucent member 130 disposed on the support member 140 or It is preferable to have a refractive index smaller than that. Specific examples of the material include glass, resin, quartz, and sapphire. By filling the through hole 142 of the support member 140 with the light transmitting member 143, the difference in refractive index with the light transmitting member 130 disposed on the support member 140 can be reduced, so that the light is emitted from the semiconductor light emitting element. Thus, it is possible to prevent a decrease in light output passing through the through hole of the support member. In addition, by filling the through hole 142 of the support member 140 with the light transmission member 143, the heat dissipation effect can be enhanced by the increase in the volume of the support member 140.

(Translucent member)
The translucent member is for transmitting light from the semiconductor light emitting element and emitting light to the outside. In the present embodiment, the translucent member has a substantially combined truncated cone and columnar shape. The shape of the translucent member is not particularly limited, and various shapes can be adopted. For example, a truncated cone shape, a plano-convex lens shape, a flat plate shape, a disk shape, a spherical shape, an elliptical spherical shape, a hemispherical shape, a semi-elliptical spherical shape, or a combination thereof can be given.

The translucent member can contain a wavelength conversion member, a diffusion member, and the like, which will be described later. By including such a member in the translucent member, heat from light from the semiconductor light emitting element is easily generated. Therefore, the heat radiation effect by the fixing member and the sleeve can be obtained more effectively.
As a material of such a translucent member, it is preferable to use a member that hardly absorbs light from the semiconductor light emitting element, the wavelength conversion member, and the diffusion member. Specifically, quartz glass, borosilicate glass, low-melting glass, silicone resin, epoxy resin, or the like, or a ceramic material such as alumina can be used.

(Wavelength conversion member)
The wavelength conversion member is capable of absorbing at least a part of light from the semiconductor light emitting element and converting the absorbed light to a different wavelength. That is, it is possible to extract the color mixture light of the light whose wavelength is converted by the wavelength conversion member and the light from the semiconductor light emitting element.
Furthermore, the wavelength conversion member can be provided in the vicinity of the semiconductor light emitting element so that the light from the semiconductor light emitting element is irradiated, in addition to being contained in the translucent member.

As the wavelength conversion member, it is more efficient to convert light from the semiconductor light emitting element into a longer wavelength. The wavelength conversion member may be formed of a single layer of one type of fluorescent material or the like, or may be formed of a single layer in which two or more types of fluorescent materials are mixed. Two or more monolayers may be laminated, or two or more monolayers in which two or more kinds of fluorescent materials are mixed may be laminated.
As a material of such a wavelength conversion member, for example, a nitride phosphor / oxynitride phosphor mainly activated by a lanthanoid element such as Eu or Ce, a lanthanoid element such as Eu, or a transition such as Mn Alkaline earth halogen apatite phosphor, alkaline earth metal borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth silicate, alkaline earth sulfide mainly activated by metal elements Activated mainly by lanthanoid elements such as alkaline earth thiogallate, alkaline earth silicon nitride, germanate, or lanthanoid elements such as Ce It is preferable that it is at least any one or more selected from organics and organic complexes.

(Diffusion member)
The diffusion member only needs to be able to diffuse light from the semiconductor light emitting element and the wavelength conversion member, and can be appropriately selected depending on the light emission wavelength of the semiconductor light emitting element, the refractive index of the translucent member, and the like. Examples of the material for such a diffusion member include SiO ₂ , Al ₂ O ₃ , SiN, MgO, Si ₃ O ₂ , SiC, AlN, diamond, Ag, Al, Au, Cu, W, and Mg.

  The diffusion member is used in combination with a wavelength conversion member such as a phosphor to satisfactorily reflect light from the semiconductor light emitting element and the phosphor, and suppress color unevenness that tends to occur due to the use of a phosphor having a large particle size. Can be preferably used. In addition, the half width of the emission spectrum can be narrowed, and a light emitting device with high color purity can be obtained. On the other hand, a diffusing material having a wavelength of 1 nm or more and less than 1 μm has a low interference effect with respect to the light wavelength from the semiconductor light emitting device, but has a high transparency and can increase the viscosity of the translucent member without reducing the luminous intensity.

(Semiconductor light emitting device)
Various semiconductor light emitting devices such as light emitting diodes and semiconductor laser devices can be used. Since semiconductor laser light has high directivity, it is easy to guide light in one direction. Therefore, it becomes possible to take out the emitted light from the semiconductor laser element to the outside of the light emitting device with high efficiency. In the case of a blue semiconductor laser element, it is preferably formed from a group III nitride semiconductor.
In particular, since a semiconductor laser has a higher light density than a light emitting diode, the brightness as a light emitting device can be easily improved by using a semiconductor laser, but the translucent member generates heat locally because the light density is high, Easy to deteriorate and discolor. The invention of the present application is particularly effective when a semiconductor laser is used as a light-emitting element because the adverse effect of the heat on the translucent member and peripheral members can be greatly reduced.

  In addition, when a light emitting diode is used for the semiconductor light emitting element, an edge emitting type is preferable. An edge-emitting diode is a type of light-emitting diode that is classified from the structural surface, and refers to a device that extracts light from the end surface of an active layer in the same manner as a semiconductor laser. This makes it possible to output light from the end face by raising the refractive index of the active layer to cause an optical waveguide action. By narrowing the output area in this way, it is possible to easily guide the output light from the semiconductor light emitting element into the through hole of the support member. As a result, the light extraction efficiency from the light emitting device can be increased.

  Further, when heat generated during use of the semiconductor light emitting device is stored in the device, the characteristics of the semiconductor light emitting device are deteriorated and the life life is reduced. In order to prevent this, the heat generated from the semiconductor light emitting element is conducted to the stem column and the bottom of the stem that are mechanically and electrically connected, and is further released to the outside air. That is, the stem bottom part and the stem column body play a role of a heat sink, and have a heat dissipation effect.

  Therefore, it is preferable that the material of the stem bottom part and the stem column body has good thermal conductivity so that it can serve as a heat medium. Specific examples include SPC, copper, brass, tungsten, aluminum, copper / tungsten alloy, and the like. In addition, since the stem bottom is bonded to the cap, the stem bottom may be determined in consideration of the material of the cap and the adhesion to the cap.

The cap is for covering the light emitting element, and in particular for hermetically sealing the semiconductor light emitting element mounted on the stem. The cap is provided with a window portion through which light from the semiconductor light emitting element passes. The window portion is sealed with glass or the like.
The cap is not particularly limited, but is preferably formed of a material having high thermal conductivity. For example, various materials such as Ni-Fe alloy, Kovar, Ni, Co, Fe, and brass can be used. Usually, the cap is separated from the semiconductor light emitting element, covers the semiconductor light emitting element, and is bonded to the stem by resistance welding, soldering, or the like. Therefore, it is preferably formed of Fe—Ni alloy, Ni, Kovar or the like that can be resistance-welded using projection. Further, the cap may be plated with, for example, Ni, Ag or the like in order to prevent deterioration such as oxidation.
The shape of the cap is not particularly limited, and for example, a bottomed cylindrical shape (such as a cylinder or a polygonal column) or a truncated cone (such as a truncated cone or a polygonal truncated cone), a dome shape, and a deformed shape thereof. Various shapes are mentioned.

  The shape of the cap and the stem is not particularly limited as long as the semiconductor light emitting element can be sealed. For example, the stem bottom portion constituting the stem may be a substantially cylindrical shape having a cavity inside, and the cap that closes the upper portion may be a substantially disc shape.

(lens)
In the light emitting device of the present invention, it is preferable that a lens is provided between the semiconductor light emitting element and the support member.
The lens may have any shape as long as the light emitted from the semiconductor light emitting element is condensed on the incident portion of the support member, and a plurality of lenses may be arranged side by side between the semiconductor light emitting element and the support member. Good. The lens can be formed of inorganic glass, resin, or the like, and among them, inorganic glass is preferable. A lens is provided between the semiconductor light emitting element and the support member, and the light emitted from the semiconductor light emitting element via the lens can be led to the support member, thereby condensing the light emitted from the semiconductor light emitting element and improving the efficiency. It can be led to the support member well. The lens may contain a material that functions as a wavelength conversion member such as a fluorescent substance. As a result, the wavelength-converted excitation light is reliably condensed on the emitting portion by the lens function, so that the color variation can be eliminated and the wavelength conversion member can be manufactured at the same time by manufacturing the lens. Therefore, the manufacturing cost of the wavelength conversion member can be suppressed.

(Spacer)
FIG. 5 is a schematic cross-sectional view showing an example of arrangement of spacers in the light emitting device of the present invention. A spacer 180 can be provided between the holder 120 and the sleeve 160 and the support member 140. The spacer 180 is for adjusting the distance between the condensing point of the light from the semiconductor light emitting element 110 or the lens 125 and the support member 140. The spacer 180 is fixed to the upper surface of the holder 120 by welding or the like. When the spacer 180 is used, the sleeve 160 and the support member 140 are disposed on the holder 120 via the spacer 180. In the present specification, the term “upper” in the position configuration or the like is not limited to the case where the upper surface of the substrate is necessarily formed in contact with the upper surface. It is used in a sense that includes other inclusions in between.

The spacer 180 has a cylindrical shape having an inner hole 182. The shape of the spacer 180 can be a rectangular tube or a shape approximating these shapes in addition to the cylindrical shape. When the spacer 180 is used, since the sleeve 160 and the support member 140 are disposed on the spacer 180, the diameter of the spacer 180 is the same as or larger than the diameter of the sleeve 160, and the diameter of the inner hole 182 of the spacer is The support member 140 is formed to be smaller than the outer diameter. The spacer 180 preferably has a flat surface that can stably fix at least the sleeve 160 and the support member 140.
The thickness of the spacer 180 can be appropriately adjusted depending on the characteristics of the semiconductor light emitting device 110 and the lens 125 used, the structure and size of the holder 120 and the sleeve 160, and the like. For example, when the thickness of the spacer 180 is adjusted so that the position of the focal point of the light of the semiconductor light emitting element 110 condensed by the lens 125 substantially coincides with the light incident side end of the through hole 142 of the support member 140, the semiconductor light emission. Light from the element 110 can be efficiently incident on the through hole 142 of the support member 140 and the diameter of the light incident side of the through hole 142 of the support member 140 can be reduced. Thereby, the light that has entered the through hole 142 of the one-end support member 140 can be prevented from returning to the holder 120 side again. By using the spacer 180, the distance between the semiconductor light emitting element 110 and the support member 140 can be adjusted not in units of the holder 120 but in units of the spacer 180 that is a member independent of the holder 120.

  The material of the spacer 180 is not particularly limited, and various materials can be used. However, it is preferable that the material is excellent in adhesion to the holder 120 and the sleeve 160 to be connected. In addition, the material is preferably a material that can dissipate conduction heat from the semiconductor light emitting element 110, the translucent member 130, and the like. Specific examples of the material include copper, brass, SUS, nickel, kovar, and aluminum.

Second Embodiment
FIG. 6 is a schematic cross-sectional view showing a light emitting device according to the second embodiment. FIG. 7 is an enlarged schematic cross-sectional view of a part of the light emitting device according to the second embodiment. The light emitting device according to this embodiment is different in the configuration of the support member and the fixing member from the light emitting device of the first embodiment described above. Note that a description of the common structure is omitted.

The light emitting device according to the present embodiment includes a semiconductor light emitting element 110, a holder 120 that covers the semiconductor light emitting element 110 and has a through hole 122 through which light from the semiconductor light emitting element 110 passes, and a through hole 122 of the holder 120. A translucent member 130 to be disposed.
The semiconductor light emitting device 110 is placed on the stem 112. A cap 116 that covers the semiconductor light emitting device 110 is connected to the stem 112. The cap 116 has a window portion 117 through which light emitted from the semiconductor light emitting device 110 passes at a substantially central portion of the upper surface.
The holder 120 has a substantially cylindrical shape, and has an upper surface and a lower surface that face each other. The through hole 122 of the holder 120 penetrates from the center of the upper surface of the holder 120 to the lower surface. The holder 120 is fixed to the stem bottom 113 so as to include the semiconductor light emitting device 110 and the cap 116.
A support member 140 that supports the translucent member 130 is provided between the upper surface of the holder 120 and the translucent member 130. A through-hole 142 through which light from the semiconductor light emitting element 110 passes is provided in a substantially central portion of the support member 140. The translucent member 130 is disposed on the support member 140 so as to close the through hole 142 of the support member. In the present embodiment, the translucent member 130 has a shape obtained by combining a substantially truncated cone and a columnar shape.
The light emitting device according to the present embodiment includes a fixing member 150 that locks the translucent member 130. The fixing member 150 has an inner hole 152 into which the translucent member 130 is inserted, and a locking portion having an opening 156 that can lock the translucent member 130 together with the support member 140 at one end of the inner hole 152. 154 is provided. The locking portion 154 is smaller than the maximum diameter of the translucent member 130.
A sleeve 160 surrounding the support member 140 and the fixing member 150 is provided on the holder 120. The sleeve 160 has a substantially cylindrical shape and is connected to the peripheral edge portion of the through hole 122 of the holder 120.

  In the light emitting device of the present embodiment, the support member 140 includes a base portion 144 disposed on the holder and a protruding portion 146 that protrudes from the upper surface of the base portion 144. The protruding upper surface of the protruding portion 146 has a diameter substantially the same as the maximum diameter of the translucent member 130. Both the base portion 144 and the protruding portion 146 have a disk shape. The central axes of the base portion 144 and the protruding portion 146 are substantially the same, and a through hole 142 is provided in the central portion. The base portion 146 of the support member 140 has an outer diameter substantially the same as the inner diameter of the sleeve 160 and is fitted to the sleeve 160. Further, the protruding portion 146 of the support member 140 has a diameter substantially the same as the diameter of the inner hole 152 of the fixing member 150, and the translucent member 130 and the support member 140 are inserted into the inner hole 152 of the fixing member 150. At least a part of the protruding portion 146 is fitted.

The fixing member 150 is fitted in the inner hole 162 of the sleeve 160, and the locking portion 154 is in contact with the translucent member 130. The fixing member 150 is fixed to the sleeve 160 in a state where the locking portion 154 is in contact with the translucent member 130. The translucent member 130 is sandwiched between the upper surface of the holder 120 and the locking portion 154 of the fixing member 150 together with the support member 140. The fixing member 150 is preferably fixed to the sleeve 160 in a state where the translucent member 130 is pressed to the holder 120 side by the locking portion 154.
In the present embodiment, the side surface of the translucent member 130 is covered with the inner hole 152 of the fixing member 150. The lower surface of the fixing member 150 faces the upper surface of the base portion 146 of the support member 140 in a state of being separated so that a gap portion 175 exists. Accordingly, the gap 175 does not exist in the side surface direction of the translucent member 130, and the gap 175 exists at a position below the lower surface of the translucent member 130. Therefore, when light from the semiconductor light emitting device 110 enters the light transmissive member 130 and light is emitted to the front surface and the side surface of the light transmissive member 130, the light from the semiconductor light emitting device 110 is efficiently extracted to the outside. The emission intensity can be improved.

  In the light emitting device according to the present embodiment, since the translucent member 130 is sandwiched between the upper surface of the holder 120 and the locking portion 154 of the fixing member 150, the positional deviation of the translucent member 130 can be suppressed. In addition, since the sleeve 160 is provided around the fixing member 150 that locks the translucent member 130, the fixing member 150 can be protected from the outside. It has a structure that is difficult to drop out. In addition, since the fixing member 150 is fitted in the sleeve 160 and the outer surface of the fixing member 150 and the inner surface of the sleeve 160 are in contact with each other, the contact area between the fixing member 150 and the sleeve 160 is sufficiently increased. Can be secured. Thereby, the fixing member 150 can be firmly fixed. Further, the heat generated in the translucent member 130 can be efficiently radiated.

<Third Embodiment>
FIG. 8 is a schematic cross-sectional view showing a light emitting device according to the third embodiment. FIG. 9 is an enlarged schematic cross-sectional view of a part of the light emitting device according to the third embodiment. The light emitting device according to the present embodiment differs from the light emitting device of the first embodiment described above in the configuration of the support member, the fixing member, and the sleeve. Note that a description of the common structure is omitted.

The light emitting device according to the present embodiment includes a semiconductor light emitting element 110, a holder 120 that covers the semiconductor light emitting element 110 and has a through hole 122 through which light from the semiconductor light emitting element 110 passes, and a through hole 122 of the holder 120. A translucent member 130 to be disposed.
The semiconductor light emitting device 110 is placed on the stem 112. A cap 116 that covers the semiconductor light emitting device 110 is connected to the stem 112. The cap 116 has a window portion 117 through which light emitted from the semiconductor light emitting device 110 passes at a substantially central portion of the upper surface.
The holder 120 has a substantially cylindrical shape, and has an upper surface and a lower surface that face each other. The through hole 122 of the holder 120 penetrates from the center of the upper surface of the holder 120 to the lower surface. The holder 120 is fixed to the stem bottom 113 so as to include the semiconductor light emitting device 110 and the cap 116.
A sleeve 160 is provided on the holder 120. The sleeve 160 has a substantially cylindrical shape, and is connected to the peripheral edge portion of the through hole 122 on the upper surface of the holder 120. In the present embodiment, the inner hole 162 of the sleeve 160 has a stepped portion 162c whose diameter changes inside. The lower surface side of the sleeve from the stepped portion 162c is a first inner hole 162a, and the upper surface side of the sleeve from the stepped portion 162c is a second inner hole 162b. The diameter of the first inner hole 162a is smaller than the diameter of the second inner hole 162b.

  A support member 140 that supports the translucent member 130 is provided on the stepped portion 162c of the sleeve. The support member 140 is disposed so as to cover the first inner hole 162 a of the sleeve 160. The support member 140 includes a base portion 144 disposed on the stepped portion 162 c of the sleeve 160 and a protruding portion 146 that protrudes from the upper surface of the base portion 144. The protruding upper surface of the protruding portion 146 has a diameter substantially the same as the maximum diameter of the translucent member 130. Both the base portion 144 and the protruding portion 146 have a disk shape. The central axes of the base portion 144 and the protruding portion 146 are substantially the same, and a through hole 142 through which light from the semiconductor light emitting element 110 passes is provided at the central portion. The translucent member 130 is disposed on the support member 140 so as to close the through hole 142 of the support member. In the present embodiment, the translucent member 130 has a shape obtained by combining a substantially truncated cone and a columnar shape.

  The light emitting device according to the present embodiment includes a fixing member 150 that locks the translucent member 130. The fixing member 150 has an inner hole 152 into which the translucent member 130 is inserted, and a locking portion having an opening 156 that can lock the translucent member 130 together with the support member 140 at one end of the inner hole 152. 154 is provided. The locking portion 154 is smaller than the maximum diameter of the translucent member 130.

  The diameter of the second inner hole 162b of the sleeve 160 is formed to be the same as or slightly larger than the outer diameter of the base portion 144 and the fixing member 150 of the support member 140. 2 in the inner hole 162b. The diameter of the first inner hole 162a of the sleeve 160 is formed to be smaller than the outer diameters of the base portion 144 and the fixing member 150 of the support member 140, and the support member 140 and the fixing member 150 move toward the first inner hole 162a. It has a structure that does not come off. The base portion 144 and the fixing member 150 of the support member 140 preferably have an outer diameter substantially the same as the diameter of the second inner hole 162b of the sleeve 160. Thereby, the shakiness of the support member 140 and the fixing member 150 in the sleeve 160 in the radial direction can be suppressed.

  The fixing member 150 is fitted into the second inner hole 162 b of the sleeve 160, and the locking portion 154 is in contact with the translucent member 130. The fixing member 150 is fixed to the sleeve 160 in a state where the locking portion 154 is in contact with the translucent member 130. The translucent member 130 is sandwiched between the upper surface of the holder 120 and the locking portion 154 of the fixing member 150 together with the support member 140. The fixing member 150 is preferably fixed to the sleeve 160 in a state where the translucent member 130 is pressed to the holder 120 side by the locking portion 154.

  In the light emitting device according to this embodiment, a sleeve 160 is provided around the fixing member 150 that locks the translucent member 130. Thereby, since the fixing member 150 can be protected from the outside, the impact resistance is increased, and the fixing member 150 is difficult to drop off. In addition, since the fixing member 150 is fitted in the sleeve 160 and the outer surface of the fixing member 150 and the inner surface of the sleeve 160 are in contact with each other, the contact area between the fixing member 150 and the sleeve 160 is sufficiently increased. Can be secured. Thereby, the fixing member 150 can be firmly fixed. Further, the heat generated in the translucent member 130 can be efficiently radiated.

<Fourth embodiment>
FIG. 10 is an enlarged schematic cross-sectional view of a part of the light emitting device according to the fourth embodiment. The light emitting device according to the present embodiment differs from the light emitting device according to the first embodiment described above in the configuration of the light transmissive member, the support member, and the fixing member. In addition, there is a part which abbreviate | omits description about a common structure.

The light emitting device according to the present embodiment includes a semiconductor light emitting element 110, a holder 120 that covers the semiconductor light emitting element 110 and has a through hole 122 through which light from the semiconductor light emitting element 110 passes, and a through hole 122 of the holder 120. A translucent member 130 to be disposed.
The semiconductor light emitting device 110 is placed on the stem 112. A cap 116 that covers the semiconductor light emitting device 110 is connected to the stem 112. The cap 116 has a window portion 117 through which light emitted from the semiconductor light emitting device 110 passes at a substantially central portion of the upper surface.
The holder 120 has a substantially cylindrical shape, and has an upper surface and a lower surface that face each other. The through hole 122 of the holder 120 penetrates from the center of the upper surface of the holder 120 to the lower surface. The holder 120 is fixed to the stem bottom 113 so as to include the semiconductor light emitting device 110 and the cap 116.
A support member 140 that supports the translucent member 130 is provided between the upper surface of the holder 120 and the translucent member 130. The support member 140 includes a base portion 144 disposed on the holder and a protruding portion 146 that protrudes from the upper surface of the base portion 144. The projecting upper surface of the projecting portion 146 has substantially the same diameter as the translucent member 130. Both the base portion 144 and the protruding portion 146 have a disk shape. The central axes of the base portion 144 and the protruding portion 146 are substantially the same, and a through hole 142 is provided in the central portion. The translucent member 130 is disposed on the support member 140 so as to close the through hole 142. In the present embodiment, the translucent member 130 has a cylindrical shape.
The translucent member 130 is locked to the fixing member 150. The fixing member 150 has an inner hole 152 into which the translucent member 130 is inserted, and a locking portion having an opening 156 that can lock the translucent member 130 together with the support member 140 at one end of the inner hole 152. 154 is provided. The locking portion 154 is smaller than the maximum diameter of the translucent member 130.
A sleeve 160 surrounding the support member 140 and the fixing member 150 is provided on the holder 120. The sleeve 160 has a substantially cylindrical shape, and is connected to the peripheral edge portion of the through hole 122 on the upper surface of the holder 120.

  The fixing member 150 is fitted in the inner hole 162 of the sleeve 160, and the locking portion 154 is in contact with the translucent member 130. The fixing member 150 is fixed to the sleeve 160 in a state where the locking portion 154 is in contact with the translucent member 130. Thus, the translucent member 130 is sandwiched between the upper surface of the holder 120 and the locking portion 154 of the fixing member 150 together with the support member 140. The fixing member 150 is preferably fixed to the sleeve 160 in a state where the translucent member 130 is pressed to the holder 120 side by the locking portion. In the present embodiment, the locking portion 154 of the fixing member 150 has a surface substantially parallel to the upper surface of the translucent member 130. Thereby, the translucent member 130 can be firmly fixed.

  In the light emitting device according to the present embodiment, since the translucent member 130 is sandwiched between the upper surface of the holder 120 and the engaging portion 154 of the fixing member 150, the positional deviation of the translucent member 150 can be suppressed. In addition, since the sleeve 160 is provided around the fixing member 150 that locks the translucent member 130, the fixing member 150 can be protected from the outside. It has a structure that is difficult to drop out. In addition, since the fixing member 150 is fitted in the sleeve 160 and the outer surface of the fixing member 150 and the inner surface of the sleeve 160 are in contact with each other, the contact area between the fixing member 150 and the sleeve 160 is sufficiently increased. Can be secured. Thereby, the fixing member 150 can be firmly fixed. Further, the heat generated in the translucent member 130 can be efficiently radiated. Moreover, since the contact area of the inner hole 152 of the fixing member 150 and the translucent member 130 is increased as compared with the first embodiment, the heat dissipation can be further enhanced.

<Fifth Embodiment>
FIG. 11 is an enlarged schematic cross-sectional view of a part of the light emitting device according to the fifth embodiment. The light emitting device according to this embodiment is different in the configuration of the support member and the fixing member from the light emitting device of the first embodiment described above. Note that a description of the common structure is omitted.

The light emitting device according to the present embodiment includes a semiconductor light emitting element 110, a holder 120 that covers the semiconductor light emitting element 110 and has a through hole 122 through which light from the semiconductor light emitting element 110 passes, and a through hole 122 of the holder 120. A translucent member 130 to be disposed.
The semiconductor light emitting device 110 is placed on the stem 112. A cap 116 that covers the semiconductor light emitting device 110 is connected to the stem 112. The cap 116 has a window portion 117 through which light emitted from the semiconductor light emitting device 110 passes at a substantially central portion of the upper surface.
The holder 120 has a substantially cylindrical shape, and has an upper surface and a lower surface that face each other. The through hole 122 of the holder 120 penetrates from the center of the upper surface of the holder 120 to the lower surface. The holder 120 is fixed to the stem bottom 113 so as to include the semiconductor light emitting device 110 and the cap 116.
A support member 140 that supports the translucent member 130 is provided between the upper surface of the holder 120 and the translucent member 130. The support member 140 includes a base portion 144 disposed on the holder and a protruding portion 146 that protrudes from the upper surface of the base portion 144. The protruding upper surface of the protruding portion 146 has a diameter substantially the same as the maximum diameter of the translucent member 130. Both the base portion 144 and the protruding portion 146 have a disk shape. The central axes of the base portion 144 and the protruding portion 146 are substantially the same, and a through hole 142 is provided in the central portion. The translucent member 130 is disposed on the protruding portion 146 of the support member 140 so as to close the through hole 142. In the present embodiment, the translucent member 130 has a shape obtained by combining a substantially truncated cone and a columnar shape.
The translucent member 130 is locked to the fixing member 150. The fixing member 150 has an inner hole 152 into which the translucent member 130 is inserted, and a locking portion having an opening 156 that can lock the translucent member 130 together with the support member 140 at one end of the inner hole 152. 154 is provided. The locking portion 154 is smaller than the maximum diameter of the translucent member 130. The translucent member 130 is sandwiched between the upper surface of the holder 120 and the locking portion 154 of the fixing member 150 together with the support member 140. The fixing member 150 is preferably fixed to the sleeve 160 in a state where the translucent member 130 is pressed to the holder 120 side by the locking portion 154.
A sleeve 160 surrounding the support member 140 and the fixing member 150 is provided on the holder 120. The sleeve 160 has a substantially cylindrical shape and is connected to the peripheral edge portion of the through hole 122 of the holder 120.

  The fixing member 150 is fitted in the inner hole 162 of the sleeve 160, and the locking portion 154 is in contact with the translucent member 130. The fixing member 150 is fixed to the sleeve 160 in a state where the locking portion 154 is in contact with the translucent member 130. Thus, the translucent member 130 is sandwiched between the upper surface of the holder 120 and the locking portion 154 of the fixing member 150 together with the support member 140. The fixing member 150 is preferably fixed to the sleeve 160 in a state where the translucent member 130 is pressed to the holder 120 side by the locking portion.

  In the present embodiment, the opening 156 of the locking portion 154 of the fixing member 150 has an inner diameter that decreases from the holder 120 side toward the translucent member 130 side. The region of the opening 156 of the locking portion 154 has a substantially truncated cone shape, which is the same as the shape of the substantially truncated cone portion of the translucent member. Thereby, the translucent member 130 is fitted in the opening 156 of the locking portion 154. Therefore, the contact area between the fixing member 150 and the translucent member 130 is increased, and heat dissipation can be improved.

  In the light emitting device according to the present embodiment, since the translucent member 130 is sandwiched between the upper surface of the holder 120 and the locking portion 154 of the fixing member 150, the positional deviation of the translucent member 130 can be suppressed. In addition, since the sleeve 160 is provided around the fixing member 150 that locks the translucent member 130, the fixing member 150 can be protected from the outside. It has a structure that is difficult to drop out. In addition, since the fixing member 150 is fitted in the sleeve 160 and the outer surface of the fixing member 150 and the inner surface of the sleeve 160 are in contact with each other, the contact area between the fixing member 150 and the sleeve 160 is sufficiently increased. Can be secured. Thereby, the fixing member 150 can be firmly fixed. Further, the heat generated in the translucent member 130 can be efficiently radiated.

Examples according to the present invention will be described in detail below. Needless to say, the present invention is not limited to the following examples.

Example 1
FIG. 8 is a schematic cross-sectional view illustrating the light emitting device according to the first embodiment. FIG. 9 is an enlarged schematic cross-sectional view of a part of the light emitting device according to the first embodiment.
The light emitting device 100 according to the first embodiment includes a semiconductor light emitting element 110, a holder 120 that covers the semiconductor light emitting element 110 and has a through hole 122 through which light from the semiconductor light emitting element 110 passes, and a top of the through hole 122 of the holder 120. It is a light-emitting device provided with the translucent member 130 arrange | positioned in this, and the fixing member 150 which latches the translucent member 130. FIG.

The semiconductor light emitting device 110 is placed on the stem 112. A cap 116 that covers the semiconductor light emitting device 110 is connected to the stem 112.
As the semiconductor light emitting device 110, a GaN-based semiconductor laser device having an emission peak wavelength of 445 nm is used.
The stem 112 includes a stem bottom portion 113, a stem column body 114, and a lead 115. As the stem bottom portion 113 and the stem column body 114, those mainly composed of iron (Fe) and copper (Cu) are used. The lead 115 is fixed to the stem bottom 113 by low melting glass. The semiconductor light emitting device 110 is mounted on the stem column body 114, and the semiconductor light emitting device 110 and the leads 115 are electrically connected via wires.
The cap 116 has a shape in which the upper end of the cylinder is covered with an annular upper surface, and the cap 116 has light emitted from the semiconductor light emitting device 110 at a portion facing the light emitting surface of the semiconductor light emitting device 110. A circular window 117 is formed through which passes. The cap 116 uses Kovar.

The holder 120 has a substantially cylindrical shape, and has an upper surface and a lower surface that face each other. The through hole 122 of the holder 120 penetrates from the center of the upper surface of the holder 120 to the lower surface. The holder 120 is fixed to the stem bottom 113 so as to include the semiconductor light emitting device 110 and the cap 116. A lens 125 that collects light from the semiconductor light emitting element 110 is provided inside the holder 120.
A spacer 180 is provided on the holder 120. The spacer 180 has a cylindrical shape having an inner hole 182. The diameter of the spacer 180 is 5.6 mm, and the diameter of the inner hole 182 of the spacer 180 is 1.4 mm. The thickness of the spacer 180 is such that the position of the focal point of the light of the semiconductor light emitting element 110 condensed by the lens 125 substantially coincides with the light incident side of the inner hole 142 of the support member 140 disposed on the spacer 180. adjust.
A sleeve 160 is provided on the spacer 180. The sleeve 160 has a cylindrical shape having an inner hole 162. The inner hole 162 of the sleeve 160 communicates with the first inner hole 162a located on the lower surface side of the sleeve 160, and is located on the upper surface side of the sleeve, and is located on the upper surface side of the sleeve, more than the first inner hole 162a. A second inner hole 162b having a large diameter. A step portion 162c is formed between the first inner hole 162a and the second inner hole 162b due to a difference in inner diameter. The diameter of the first inner hole 162a is 1.4 mm, and the diameter of the second inner hole 162b is 2.5 mm.
The holder 120, the spacer 180, and the sleeve 160 are mainly made of stainless steel, and the holder 120 and the spacer 180, and the spacer 180 and the sleeve 160 are fixed by YAG welding.

A support member 140 that supports the translucent member 130 is disposed on the stepped portion 162 c of the sleeve 160. The support member 140 includes a small diameter portion 144 having a diameter equal to or smaller than the diameter of the inner hole 152 of the fixing member 150 and a large diameter portion 146 connected to the small diameter portion 144. Each of the small diameter portion 144 and the large diameter portion 146 has a disk shape. At least a part of the small diameter portion 144 of the support member 140 is inserted into the inner hole 152 of the fixing member 150. The diameter of the small diameter portion 144 of the support member 140 is 1 mm. The diameter of the large diameter portion 146 of the support member 140 is 2.5 mm. The central axes of the small-diameter portion 144 and the large-diameter portion 146 are substantially the same, and a through-hole 142 that communicates from the lower surface side of the large-diameter portion 146 to the upper surface side of the small-diameter portion 144 is provided in the central portion. The through hole 142 of the support member 140 has a shape that becomes a wide opening from the lower surface facing the semiconductor light emitting element 110 toward the upper surface. The diameter of the through hole 142 of the support member 140 is 0.21 mm on the lower surface side of the support member 140 and 0.37 mm on the upper surface side, and the inclined portion of the through hole 142 has an inclination angle of 80 ° with respect to the upper surface of the support member 140. It is. The support member 140 uses stainless steel, and a reflection member is provided on the surface of the support member 140. The reflecting member is laminated in the order of Ni, Ag, and Al, and a protective film of SiO ₂ is formed on the reflecting member.

  The translucent member 130 is disposed on the support member 140. The translucent member 130 has a shape in which a truncated cone and a disc shape are combined, and has an upper surface diameter of 0.45 mm, a lower surface diameter of 1 mm, and a thickness of 0.6 mm. The translucent member 130 is made of borosilicate glass and contains an yttrium / aluminum oxide phosphor (YAG phosphor) as a wavelength conversion member.

The fixing member 150 has an inner hole 152 into which the small diameter portion 144 of the translucent member 130 and the support member 140 is inserted, and the translucent member 130 can be locked together with the support member 140 at one end of the inner hole 152. A locking portion 154 having an opening 156 is provided. The locking portion 154 is smaller than the maximum diameter of the translucent member 130. The fixing member 150 is fitted in the sleeve 160. The diameter of the fixing member 150 is 2.5 mm, and the diameter of the inner hole 152 is 1 mm. The diameter of the opening 156 of the locking part 154 is 0.9 mm on the lower surface side and 1 mm on the upper surface side, and the inclination angle of the opening 156 is 85 °. The fixing member 150 is made of stainless steel, and a reflecting member is provided on the surface of the fixing member 150. The reflecting member is laminated in the order of Ni, Ag, and Al, and a protective film of SiO ₂ is formed on the reflecting member. The fixing member 150 and the sleeve 160 are fixed by YAG welding.

  The light emitting device 100 produced as described above has a structure in which the fixing member 150 that locks the translucent member 130 is difficult to drop off. In addition, since the contact area between the fixing member 150 and the sleeve 160 can be sufficiently secured, the fixing member 150 can be firmly fixed. Further, the heat generated in the translucent member 130 can be efficiently radiated.

  The light emitting device of the present invention can be used for an endoscope light source, an in-vehicle light source, an inspection light source, a sensor light source, a display light source, and the like.

DESCRIPTION OF SYMBOLS 100 Light-emitting device 110 Semiconductor light-emitting element 112 Stem 113 Stem bottom part 114 Stem pillar body 115 Lead 116 Cap 117 Window part 120 Holder 122 Holder through-hole 125 Lens 130 Translucent member 140 Support member 142 Support member through-hole 143 Light transmissive member 144 Support member base 146 Support member protrusion 150 Fixing member 152 Fixing member inner hole 154 Locking portion 156 Locking portion opening 156a Locking portion opening light incident side 156b Locking portion opening Light exit side 160 Sleeve 162 Sleeve inner hole 162a First inner hole 162b Second inner hole 162c Stepped portion 170 Weld mark 175 Space portion 180 Spacer 182 Spacer inner hole 600 Light emitting device 610 Semiconductor laser 612 Header 620a Inner can 620b Outer can 625 lens 630 Las window 640 optical fiber 700 emitting device 710 semiconductor light-emitting element 712 a stem 720 scans 730 the extraction window 735 phosphor layer

Claims (3)

A semiconductor light emitting device;
A holder that covers the semiconductor light emitting element and has a through-hole through which light from the semiconductor light emitting element passes;
A translucent member disposed on the through hole of the holder;
A fixing member having an inner hole into which the light transmissive member is inserted, and a locking portion for locking the light transmissive member in the inner hole;
A light-emitting device that surrounds the fixing member and includes a sleeve to which the fixing member is fixed ,
A support member is provided between the upper surface of the holder and the translucent member, and includes a base portion that is fitted to the sleeve, and a projecting portion that projects from the upper surface of the base portion and supports the translucent member. ,
At least a part of the translucent member and the protruding portion is fitted by an inner hole of the fixing member .   The light emitting device according to claim 1, wherein an upper surface of the sleeve is substantially the same height as an upper surface of the fixing member.   The light emitting device according to claim 1, wherein a welding mark reaching the fixing member from a side surface of the sleeve is formed.

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