JP5262226B2 - Vapor deposition mask and method of manufacturing vapor deposition mask - Google Patents

Abstract

A deposition mask and a manufacturing method of deposition mask are provided to deposit the depositing materials with the high efficiency by forming a penetration hole consisting of a groove and a hole in a metal sheet. A deposition mask(20) comprises a metal sheet(34). The metal sheet has a first side and the second side which is opposite to the first side. A penetration hole(25) extending the interval between the first side and the second side is formed in the metal sheet. The groove(26) having the shape of standing the first side of the metal sheet is built up. A hole(27) is formed in the second side of the metal sheet. The groove and the hole are put through. The penetration hole passing through the metal sheet is formed owing to the groove and the hole.

Description

  The present invention relates to a vapor deposition mask used for vapor deposition in a desired pattern, and more particularly to a vapor deposition mask capable of forming a vapor deposition material with high utilization efficiency.

  The present invention also relates to a method of manufacturing a vapor deposition mask used for performing vapor deposition with a desired pattern, and more particularly to a method of manufacturing a vapor deposition mask capable of forming a vapor deposition material with high utilization efficiency.

2. Description of the Related Art Conventionally, a method of forming a thin film with a desired pattern using a deposition mask including through holes arranged in a desired pattern is known. In recent years, vapor deposition is sometimes used when a very expensive material is formed, for example, when an organic material is vapor-deposited on a substrate at the time of manufacturing an organic EL display device. In general, a deposition mask can be manufactured by forming a through hole in a metal plate by etching using a photolithography technique (for example, Patent Document 1).
JP 2004-39319 A

  By the way, when forming a vapor deposition material on a board | substrate using a vapor deposition mask, vapor deposition material adheres also to a vapor deposition mask. That is, not all the vapor deposition materials used adhere to the substrate. Moreover, if the aperture ratio of a vapor deposition mask becomes low, the utilization efficiency of vapor deposition material will also fall. For example, when an organic light emitting material is vapor-deposited on a substrate to manufacture a color display device, the vapor deposition mask for vapor-depositing an organic light emitting material capable of emitting one color is usually less than 34%. The utilization efficiency of is very low. When an expensive vapor deposition material is used, low utilization efficiency is a big problem. In addition, the utilization efficiency here refers to the ratio which adhered to the board | substrate among the used vapor deposition materials.

  Moreover, some vapor deposition materials move obliquely with respect to the sheet surface of the metal sheet that forms the vapor deposition mask and head toward the substrate. In order to increase the utilization efficiency of the vapor deposition material by effectively using the vapor deposition material that moves obliquely, it is preferable to form a through-hole in the metal sheet with the wall surface greatly inclined and tapered. However, if a through hole is to be formed in a metal sheet by etching, it may be difficult to greatly incline the wall surface of the through hole. Specifically, when the spacing between adjacent holes is short, the wall surface on the side facing the adjacent holes tends to stand out. Further, when a through-hole having a rectangular shape in plan view is produced by etching, the wall surface along the long side of the through-hole can be greatly inclined, while the wall surface along the short side of the through-hole stands up. Tend.

  The present invention has been made in consideration of such points, and an object thereof is to provide a vapor deposition mask capable of forming a vapor deposition material with high utilization efficiency. Moreover, an object of this invention is to provide the manufacturing method of the vapor deposition mask which can form into a film with vapor deposition material with high utilization efficiency.

  By the way, when the wall surface of the through hole is raised, not only the utilization efficiency of the vapor deposition material is deteriorated, but also other problems are caused. The metal sheet forming the vapor deposition mask has a certain thickness due to manufacturing restrictions or usage restrictions. Therefore, if the wall surface of the through hole is upright, a part of the vapor deposition material moves obliquely as described above, so that it is stable at a predetermined thickness in the edge region of the vapor deposition region (region to be deposited). Therefore, it becomes difficult to form a film. In order to avoid this problem, it is considered effective to make the through holes larger than the desired pattern. However, when this method is employed, the through hole of the vapor deposition mask is connected when adjacent vapor deposition regions are close to each other. Therefore, for example, in the case where an organic light emitting material is formed as each pixel of a display device, this method cannot be adopted, and adjacent film formation regions (pixels) must be deposited in separate deposition steps. I must. That is, the same material is deposited in two portions by vapor-depositing every other half of the film-forming region in one vapor deposition process and vapor-depositing the remaining film-forming region in the second vapor deposition process. There must be. For this reason, when three types of organic light-emitting materials are vapor-deposited in order to produce a color display device, a total of six vapor deposition steps must be provided twice for each type of organic light-emitting material. It would be more convenient if the present invention could solve such problems and reduce the number of vapor deposition steps.

  The vapor deposition mask by this invention has the 1st surface and the 2nd surface on the opposite side to the said 1st surface, The metal sheet | seat in which the through-hole extended between the said 1st surface and the said 2nd surface was formed A groove extending linearly is formed on the first surface side of the metal sheet, and a hole is formed on the second surface side of the metal sheet. A through hole penetrating the metal sheet is formed by the groove and the hole.

  In the vapor deposition mask according to the present invention, the groove may be formed by etching the metal sheet from the first surface side.

  In the vapor deposition mask according to the present invention, the cross-sectional area of the groove in the cross section along the sheet surface of the metal sheet is gradually decreased from the first surface side to the second surface side. Also good.

  Furthermore, in the vapor deposition mask according to the present invention, the hole may be formed by etching the metal sheet from the second surface side.

  Furthermore, in the vapor deposition mask according to the present invention, the cross-sectional area of the hole in the cross section along the sheet surface of the metal sheet gradually decreases from the second surface side toward the first surface side. Also good.

  Furthermore, in the vapor deposition mask according to the present invention, the region surrounded by the connection portion between the wall surface of the groove and the wall surface of the hole has a rectangular shape in a plan view of the metal sheet and is surrounded by the connection portion. The longitudinal direction may extend along the longitudinal direction of the linear groove.

  Furthermore, in the vapor deposition mask according to the present invention, a plurality of the grooves extending linearly may be provided in parallel with each other.

  Furthermore, in the vapor deposition mask according to the present invention, a plurality of the holes may be provided at intervals along the longitudinal direction of the groove.

  Furthermore, in the vapor deposition mask according to the present invention, a plurality of grooves extending in parallel with each other are provided at equal intervals, and a plurality of holes are provided at equal intervals along the longitudinal direction of each groove, In plan view, the length between the two through holes adjacent to each other along the longitudinal direction of each groove may be shorter than the length between the two through holes respectively formed in the adjacent grooves.

  Furthermore, in the vapor deposition mask according to the present invention, when a plurality of the holes are provided at intervals along the longitudinal direction of the groove, the first of the groove along a direction orthogonal to the longitudinal direction of the groove. The width on the surface may be narrower in a portion between two adjacent holes in the longitudinal direction than a portion in which the holes in the longitudinal direction are formed.

  Furthermore, in the vapor deposition mask according to the present invention, the groove is formed by a plurality of holes formed on the first surface side, and two of the plurality of holes adjacent to each other along the longitudinal direction of the groove. Two holes may be connected on the first surface.

  Furthermore, in the vapor deposition mask according to the present invention, when a plurality of the holes are provided at intervals along the longitudinal direction of the groove, the groove is formed by a plurality of holes formed on the first surface side. Two holes adjacent to each other along the longitudinal direction of the groove among the plurality of holes are connected to the first surface, and the hole formed on the second surface side is the first hole. You may make it arrange | position in the position facing the hole which is formed in the surface side and comprises the said groove | channel.

  In the method of manufacturing a vapor deposition mask according to the present invention, a metal sheet having a first surface and a second surface opposite to the first surface is etched and linearly formed on the first surface side of the metal sheet. Forming the extending groove; and etching the metal sheet to form a hole on the second surface side of the metal sheet, wherein the groove and the hole communicate with each other, and the groove The groove and the hole are formed so that a through-hole penetrating the metal sheet is formed by the hole.

  In the deposition mask manufacturing method according to the present invention, a plurality of grooves extending in parallel with each other are formed at equal intervals, and a plurality of holes are formed at equal intervals along the longitudinal direction of each groove, In plan view of the manufactured sheet, the length between two through holes adjacent to each other in the longitudinal direction of each groove is set to be shorter than the length between two through holes formed in each adjacent groove. May be.

  Further, in the method of manufacturing a vapor deposition mask according to the present invention, the groove and the region surrounded by the connection portion between the wall surface of the groove and the wall surface of the hole have a rectangular shape in a plan view of the metal sheet. The longitudinal direction of the region where the hole is formed and surrounded by the connecting portion may extend along the longitudinal direction of the linear groove.

  Furthermore, the manufacturing method of the vapor deposition mask according to the present invention further includes a step of supplying the metal sheet, and in the step of forming the groove, a groove extending along a supply direction of the metal sheet is formed. May be.

  Furthermore, in the method for manufacturing a vapor deposition mask according to the present invention, the groove may be formed by etching the metal sheet, and the hole may be formed by etching the metal sheet.

  In such a method for manufacturing a vapor deposition mask, the first surface and the second surface of the metal sheet are etched simultaneously, and the step of forming the hole and the step of forming the groove are performed in parallel. May be.

  Alternatively, in such a method for manufacturing a vapor deposition mask, the first surface and the second surface of the metal sheet are simultaneously etched to form the hole and the groove are formed in parallel. Thereafter, only one of the step of forming the hole and the step of forming the groove may be continued.

  Or the manufacturing method of such a vapor deposition mask is a process implemented after the said hole is formed by etching the said metal sheet | seat, Comprising: The process of sealing the formed said hole with resin further In addition, after the hole is sealed, the groove leading to the hole may be formed by etching the metal sheet from the first surface side. In the step of forming the hole in the method of manufacturing the vapor deposition mask, the first surface and the second surface of the metal sheet may be etched at the same time, so that the formation of the groove partially proceeds.

  Furthermore, in the method for manufacturing a vapor deposition mask according to the present invention, the step of forming the hole may be performed before the step of forming the groove.

  Furthermore, in the method for manufacturing a vapor deposition mask according to the present invention, the step of forming the groove may be performed before the step of forming the hole.

  Further, in the step of forming the groove of the method for manufacturing a vapor deposition mask according to the present invention, a plurality of holes are arranged in a line so that adjacent two holes are connected to the first surface, and the first surface side is arranged. The groove may be formed by forming the groove. In such a method for manufacturing a vapor deposition mask, the hole formed on the second surface side may be formed at a position facing the hole forming the groove formed on the first surface side. Further, in the step of forming the groove of such a method for manufacturing a vapor deposition mask, the plurality of holes constituting the groove include a resist formed by arranging a plurality of through holes arranged at intervals on the first surface. By etching the first surface of the metal sheet in a state of being provided, the resist is formed on the first surface side of the metal sheet at a position corresponding to the through hole of the resist. Etching to form a groove is made of a resist bridge portion in which two holes adjacent in the longitudinal direction of the groove are located between two through holes of the resist corresponding to the two holes, respectively. It may be done so that it is connected below.

  According to the present invention, the through hole is formed in the metal sheet by the linear groove and the hole. Therefore, the vapor deposition material that proceeds obliquely with respect to the sheet surface of the metal sheet and that travels substantially along the longitudinal direction of the groove can be used for vapor deposition with high efficiency. Thereby, the utilization efficiency of vapor deposition material can be improved.

  Hereinafter, an embodiment of an evaporation mask and an evaporation mask manufacturing method according to the present invention will be described with reference to FIGS. Here, FIG. 1 to FIG. 18 are diagrams for explaining an embodiment of the present invention. In the following embodiments, a vapor deposition mask (metal mask for vapor deposition) used for patterning an organic light emitting material on a glass substrate in a desired pattern when producing an organic EL display device, and production of the vapor deposition mask The method will be described as an example. However, the present invention is not limited to such an application, and the present invention can be applied to a deposition mask (metal mask for deposition) used for various purposes and a method for manufacturing the deposition mask.

  First, an example of a vapor deposition mask that can be manufactured by the vapor deposition mask manufacturing method according to the present invention will be described mainly with reference to FIGS. Here, FIG. 1 is a perspective view showing an example of a vapor deposition mask and a vapor deposition mask device, FIG. 2 is a partial plan view of the vapor deposition mask, and FIG. 3 is a cross-sectional view taken along line III-III in FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

  As shown in FIGS. 1 to 4, the vapor deposition mask 20 includes a metal sheet 34 having a first surface 34 a and a second surface 34 b facing each other. The metal sheet 34 has a large number of through holes 25 extending between the first surface 34a and the second surface 34b. The vapor deposition mask apparatus 10 has the vapor deposition mask 20 and the flame | frame 15 fixed to this vapor deposition mask 20, as shown in FIG. In the example shown in FIG. 1, the frame 15 is attached to the peripheral edge portion of the vapor deposition mask 20 (metal sheet 34).

  The vapor deposition mask apparatus 10 shown in FIG. 1 is supported in the vapor deposition apparatus 40 so that the vapor deposition mask 20 faces the glass substrate 42 as shown in FIG. Here, FIG. 5 is a diagram for explaining a method of using the vapor deposition mask device 10. In the vapor deposition apparatus 40, a crucible 44 for accommodating a vapor deposition material (for example, an organic light emitting material) 48 and a heater 46 for heating the crucible 44 are disposed below the glass substrate 42 with the vapor deposition mask apparatus 10 interposed therebetween. Has been. The vapor deposition material 48 in the crucible 44 is vaporized or sublimated by heating from the heater 46 and adheres to the surface of the glass substrate 42. As described above, a large number of through holes 25 are formed in the vapor deposition mask 20, and the vapor deposition material 48 adheres to the glass substrate 42 through the through holes 25. As a result, the vapor deposition material 48 is formed on the surface of the glass substrate 42 in a desired pattern corresponding to the position of the through hole 25 of the vapor deposition mask 20.

  As shown in FIGS. 1 and 2, in the present embodiment, the metal sheet 34 forming the vapor deposition mask 20 has a substantially rectangular shape in plan view, and more precisely, has a substantially rectangular shape in plan view. Yes. As shown in FIGS. 3 and 4, a linearly extending groove 26 is formed on the first surface 34 a side of the metal sheet 34, and a hole (recessed portion, recess) is formed on the second surface 34 b side of the metal sheet 34. Hole) 27 is formed. The hole 27 and the groove 26 communicate with each other. As a result, the through hole 25 penetrating the metal sheet 34 is formed by the hole 27 and the groove 26.

  In the example shown in FIG. 3, the cross-sectional area of the groove 26 in the cross section along the sheet surface of the metal sheet 34 gradually decreases from the first surface 34 a side to the second surface 34 b side. Such a groove | channel 26 can be formed by etching the metal sheet | seat 34 from the 1st surface 34a side, for example so that it may mention later. Similarly, in the example shown in FIGS. 3 and 4, the cross-sectional area of the hole 27 in the cross section along the sheet surface of the metal sheet 34 gradually decreases from the second surface 34b side to the first surface 34a side. Go. Such a hole 27 can be formed by etching the metal sheet 34 from the second surface 34b side, as will be described later, for example.

  As shown in FIGS. 1 and 2, the groove 26 extends linearly along the sheet surface of the metal sheet 34. A large number of grooves 26 extending in parallel with each other are formed on the first surface 34 a of the metal sheet 34. A large number of holes 27 communicating with the grooves 26 are formed for each groove 26. A large number of holes 27 facing each groove 26 are arranged on a straight line at a predetermined interval along the longitudinal direction of the groove 26.

  In the field of view from the direction (thickness direction) orthogonal to the sheet surface of the metal sheet 34, in other words, in a plan view of the metal sheet 34, the hole 27 is formed in a rectangular shape, and more specifically in a rectangular shape. The longitudinal direction of the hole 27, that is, the direction along the long side of the rectangular outline of the hole 27 is along the longitudinal direction of the groove 26 (direction in which the groove 26 extends (extending direction)). As shown in FIG. 2, the hole 27 is formed at a position facing the groove 26. More specifically, the hole 27 is arranged so that the center in the plan view of the hole 27 is located at the center in the width direction orthogonal to the longitudinal direction of the groove 26. The width of the hole 27 is narrower than the width of the groove 26. In addition, the rectangular shape or the rectangular shape here does not indicate only an accurate rectangular shape or an accurate rectangular shape, but an approximately rectangular shape and an approximately rectangular shape that can be produced when an attempt is made to produce the rectangular shape or the rectangle by etching. It is a concept that includes

  The hole 27 extends from the second surface 34 b of the metal sheet 34 to the bottom of the groove 26. The wall surface 26 a of the groove 26 and the wall surface 27 a of the hole 27 are connected by a circumferential connection portion 28. As shown in FIGS. 3 and 4, the connecting portion 28 is composed of a ridge line of the overhanging portion 28 a that minimizes the opening area (the area of the through hole 25 in plan view). Since the shape of the hole 27 in plan view is rectangular, the region surrounded by the circumferential connection portion 28 is also rectangular in view from the direction orthogonal to the sheet surface of the metal sheet 34 (in plan view). It has become. As shown in FIG. 2, the longitudinal direction of the region surrounded by the connecting portion 28 extends along the longitudinal direction of the linear groove 26. Further, in the present embodiment, as shown in FIG. 2, in the field of view from the direction orthogonal to the sheet surface of the metal sheet 34 (in plan view), two adjacent penetrations along the longitudinal direction of each groove 26 The length La between the holes 25 (regions surrounded by the connecting portions 28) is longer than the length Lb between the two through holes 25 (regions surrounded by the connecting portions 28) formed in the adjacent grooves 26, respectively. It is getting shorter.

  6 and 7, when the vapor deposition mask device 10 is accommodated in the vapor deposition device 40, the second surface 20b of the vapor deposition mask 20 corresponding to the second surface 34b of the metal sheet 34 is the glass substrate 42. The first surface 20 a of the vapor deposition mask 20 corresponding to the first surface 34 a of the metal sheet 34 faces the crucible 44 holding the vapor deposition material 48. That is, as shown in FIGS. 6 and 7, the vapor deposition material 48 enters the through hole 25 from the gradually tapering groove 26 side, and then exits the through hole 25 through the hole 27.

  As described above, since the hole 27 is tapered from the second surface 34b side to the first surface 34a side, an overhanging portion 28a having a minimum opening area is formed in the through hole 25. And when vapor deposition is performed using such a vapor deposition mask 20, the film thickness of the vapor deposition film 49 formed in the area | region corresponding to the back side of the protrusion part 28a of the glass substrate 42 is not stabilized. As a result of confirmation by the present inventor, in the vapor deposition mask 20 used for vapor-depositing an organic light emitting material when an organic EL display is produced, the first through the connection portion 28 between the wall surface 26a of the groove 26 and the wall surface 27a of the hole 27. If the length Lc along the direction orthogonal to the sheet surface of the metal sheet 34 up to the second surface 34b (20b) is 10 μm or less (more desirably 5 μm or less), or the wall surface 26a and the hole 27 of the groove 26 As long as it is less than one third of the length Ld along the direction perpendicular to the sheet surface of the metal sheet 34 from the connecting portion 28 to the wall surface 27a to the first surface 34a (20a), the film thickness is stable. The vapor deposition film 49 could be formed in the film formation region (region to be formed).

  Further, as shown in FIGS. 6 and 7, some of the vapor deposition materials 48 do not move linearly from the crucible 44 toward the glass substrate 42, but move obliquely with respect to the plate surface of the glass substrate 42. There is also. As described above, if the cross-sectional shape of the through-hole 25 stands up in a direction perpendicular to the sheet surface of the metal sheet 34, the vapor deposition material 48 that moves obliquely cannot be used effectively.

  And generally, when the space | interval of the adjacent through-hole 25 is short, there exists a tendency for the wall surface by the side of the adjacent through-hole to stand out. In the present embodiment, in a plan view, the through holes 25 are arranged with a certain spacing interval La along one direction, and more than the spacing interval La along another direction different from one direction. They are arranged with a long spacing Lb. However, according to the present embodiment, since the groove 26 extends along one direction in which the separation interval La becomes shorter, in the cross section that crosses the longitudinal direction of the through hole 25, the adjacent through hole side in one direction. Instead of the wall surface rising, as shown in FIG. 7, the wall surface itself forming the through hole 25 has only the hole 27 portion having the adjusted thickness Lc.

  Moreover, generally, the wall surface of the through hole 25 tends to be cut off in a cross section that crosses the longitudinal direction of the through hole 25 having a rectangular shape in a plan view (a cross section that crosses a rectangular short side). That is, the wall surface along the short side of the through hole 25 having a rectangular shape in plan view tends to be cut off. However, according to the present embodiment, since the longitudinal direction of the through hole 25 coincides with the longitudinal direction of the groove 26, in the cross section that crosses the longitudinal direction of the through hole 25, the wall surface that forms the through hole 25 stands up. As shown in FIG. 7, the wall surface itself forming the through hole 25 has only the hole 27 portion whose thickness Lc is adjusted.

  From the above, in the cross section that traverses the longitudinal direction of the through-hole 25 shown in FIG. 7, the vapor deposition material 48 that moves obliquely and moves toward the glass substrate 42 is effectively used, and the vapor deposition material utilization efficiency (film formation efficiency). ) Can be greatly improved. Further, as shown in FIG. 7, since there is almost no wall surface forming the through-hole 25, a stable film formation with a sufficient film thickness is possible even in the region corresponding to the edge region of the through-hole 25 in the glass substrate 42. can do. Therefore, it is not necessary to form the through-hole 25 with a larger opening area than in the conventional film formation region (region to be formed). For this reason, the through-holes 25 can be formed at short intervals, and patterning at a fine pitch can be performed with high accuracy once.

  On the other hand, as shown in FIG. 6, the wall surface of the through hole 25 is also present in the groove 26 in the cross section that crosses the width direction of the through hole 25 having a rectangular shape in plan view (the cross section that crosses the long side of the rectangular shape). doing. If the wall surface 26a of the groove 26 has a contour indicated by a dotted line in FIG. 6 in the cross section in the width direction of the through hole 25, the deposition material 48 that moves obliquely adheres to the deposition mask 20 and reaches the glass substrate 42. Not reach. That is, in order to increase the utilization efficiency of the vapor deposition material (the ratio of adhering to the glass substrate 42) and save the expensive vapor deposition material, the cross section is perpendicular to the longitudinal direction of the groove 26 and perpendicular to the sheet surface of the metal sheet 34. In the cross section shown in FIG. 6, a straight line L connecting the connection portion 28 of the wall surface 26 a of the groove 26 and the wall surface 27 a of the hole 27 and the end portion of the groove 26 on the first surface 34 a (20 a) side is a second surface 34 b ( The angle θ formed with 20b) is preferably small, and the angle θ is preferably 45 ° or less.

  As the angle θ is decreased, the wall surfaces 26a of the adjacent grooves 26 are connected as shown by a two-dot chain line in FIG. However, considering the strength of the vapor deposition mask 20, the wall surfaces 26a of the adjacent grooves 26 are preferably not connected to each other, and the flat first surface 34a (20a) has a flatness of 5 μm or more between the adjacent grooves 26. More preferably, a surface is formed.

  That is, the angle θ formed by the straight line L with respect to the second surface 34b (20b) is not less than the angle at which a flat surface of 5 μm or more is formed between the grooves 26 in the first surface 34a (20a). Thus, it is preferably 45 ° or less.

  As described above, in the present embodiment, the plurality of through holes 25 are arranged along the linearly extending groove 26 with a constant separation distance La. A plurality of grooves 26 are formed at predetermined intervals. As a result, as shown in FIG. 2, the through holes 25 are arranged with a certain separation distance Lb not only in the longitudinal direction of the groove 26 but also in a direction perpendicular to the longitudinal direction of the groove 26. As an example, when the vapor deposition mask 20 (vapor deposition mask apparatus 10) is used to produce a medium-sized display (for example, a 20-inch display), the above-described separation distance La can be set to about 20 μm or more and 50 μm or less. The separation distance Lb can be about 84 μm or more and 254 μm or less. Further, the length of one side of the rectangular through hole 25 (when the through hole 25 has a rectangular shape, the long side or the short side) can be about 8 μm to 64 μm.

  Then, the vapor deposition mask 20 (vapor deposition mask device 10) and the glass substrate 42 are relatively moved along the direction orthogonal to the longitudinal direction of the groove 26, and the organic light emitting material for red, the organic light emitting material for green, and the blue color are blue. A display for color display can be produced by sequentially depositing organic light-emitting materials for use. In particular, according to the present embodiment, it is not necessary to set the opening area of the through-hole 25 larger than the area to be vapor-deposited. Can be formed. Therefore, when vapor-depositing organic light emitting materials of three colors, three steps can be omitted as compared with the conventional method in which the film formation of each color is performed twice.

  The frame 15 attached to the periphery of the vapor deposition mask 20 is for holding the vapor deposition mask 20 in a stretched state so that the vapor deposition mask 20 is not bent. The vapor deposition mask 20 and the frame 15 are fixed to each other, for example, by spot welding. As described above, the vapor deposition mask device 10 is held inside the vapor deposition device 40 that is in a high temperature atmosphere. Therefore, the vapor deposition mask 20 and the frame 15 are preferably made of the same material having a low coefficient of thermal expansion in order to prevent the vapor deposition frame from being bent or generating thermal stress. As such a material, for example, a 36% Ni invar material can be used.

  Next, the manufacturing method of such a vapor deposition mask 20 and the vapor deposition mask apparatus 10 is demonstrated mainly using FIG. 8 thru | or FIG. Of these, FIG. 8 is a diagram for explaining the overall method of manufacturing a vapor deposition mask, FIG. 9 is a diagram for explaining a method of forming a resist pattern on a metal sheet, and FIG. 10 is a metal sheet. It is a figure for demonstrating the method to etch.

  As shown in FIG. 8, the manufacturing method of the vapor deposition mask in this Embodiment is a process which supplies the metal sheet 34 extended in strip | belt shape, and performs the etching using a photolithographic technique to the metal sheet 34, and is made of metal. A step of forming a linearly extending groove 26 on the first surface 34 a side of the sheet 34 and etching using a photolithography technique are performed on the metal sheet 34, and a hole 27 is formed on the second surface 34 b side of the metal sheet 34. Forming a step. Each step will be described in more detail below. In the present embodiment, as described below, the first surface 34a and the second surface 34b of the metal sheet 34 are etched at the same time, and the step of forming the groove 26 and the step of forming the hole 27 are performed in parallel. Done.

  As shown in FIG. 8, in the present embodiment, a wound body 29 in which a metal sheet 34 is wound around a supply core 31 is prepared. Then, when the supply core 31 rotates and the wound body 29 is rewound, a metal sheet 34 extending in a strip shape is supplied as shown in FIG. The metal sheet 34 is formed with the through hole 25 to form the vapor deposition mask 20. Therefore, as described above, the metal sheet 34 is made of, for example, 36% Ni invar material. However, the sheet is not limited thereto, and a sheet made of stainless steel, copper, iron, or aluminum can be used as the metal sheet 34.

  The supplied metal sheet 34 is subjected to an etching process by an etching apparatus (etching means) 50. Specifically, first, a photosensitive resist material is applied on the first surface 34a of the metal sheet 34 (on the lower surface in FIG. 9) and on the second surface 34b. Resist films 36a and 36b are formed. Next, glass dry plates 37a and 37b are prepared so as not to transmit light to regions to be removed of the resist films 36a and 36b, and the glass dry plates 37a and 37b are arranged on the resist films 36a and 36b.

  Thereafter, as shown in FIG. 9, the resist film 36 is exposed through a glass dry plate 37, and the resist film 36 is further developed. As described above, a resist pattern (also simply referred to as a resist) 35a is formed on the first surface 34a of the metal sheet 34, and a resist pattern (simply simply a resist) is formed on the second surface 34b of the metal sheet 34. 35b) is also formed.

  In addition, the area | region which faces resist film 36a, 36b which should be removed among glass dry plates 37a, 37b is made black, and you may make it use visible light as exposure light. In this case, the visible light is absorbed by the black portions, so that light does not enter the regions to be removed of the resist films 36 a and 36 b, and the resist films 36 a and 36 b are not fixed on the metal sheet 34. On the other hand, light enters a region where the resist films 36 a and 36 b should not be removed, and the resist films 36 a and 36 b in the regions are fixed on the metal sheet 34. The unfixed resist films 36a and 36b are removed by, for example, hot water washing.

  Next, as shown in FIG. 10, using the resist patterns 35a and 35b formed on the metal sheet 34 as a mask, the metal sheet 34 is moved to the first surface 34a side by an etching solution (for example, ferric chloride solution) 38. Etching is performed from the second surface 34b side. In the present embodiment, the etching solution 38 is directed from the lower nozzle 51a of the etching apparatus 50 disposed below the conveyed metal sheet 34 toward the first surface 34a of the metal sheet 34 over the resist pattern 35a. Is injected. At the same time, the etching solution 38 is sprayed from the upper nozzle 51b of the etching apparatus 50 disposed above the conveyed metal sheet 34 toward the second surface 34b of the metal sheet 34 through the resist pattern 35b. At this time, as shown by a dotted line in FIG. 10, erosion by the etching solution starts in a region of the metal sheet 34 that is not covered with the resist patterns 35a and 35b. Thereafter, erosion proceeds not only in the thickness direction of the metal sheet 34 but also in the direction along the sheet surface of the metal sheet 34. As described above, erosion by the etching solution proceeds from the first surface 34a to the second surface 34b side of the metal sheet 34 to form the groove 26. Similarly, erosion by the etching solution is eroded by the metal sheet 34. The holes 27 are formed by proceeding from the second surface 34b of the 34 toward the first surface 34a side. Finally, the groove 26 and the hole 27 communicate with each other, and the through hole 25 penetrating the metal sheet 34 is formed by the groove 26 and the hole 27.

  Thereafter, the resist patterns 35a and 35b on the metal sheet 34 are removed, and the metal sheet 34 is washed with water. In this manner, the vapor deposition mask sheet-like member 18 made of the metal sheet 34 having a large number of through holes 25 is obtained.

  The vapor deposition mask sheet-like member 18 thus obtained is conveyed to a cutting device (cutting means) 53 by a pair of conveyance rollers 52, 52 that rotate while holding the vapor deposition mask sheet-like member 18. Is done. The supply core 31 described above is rotated by the rotation of the transport rollers 52 and 52 via the tension (tensile force) acting on the vapor deposition mask sheet member 18 and the metal sheet 34, and the metal body 29 is rotated from the wound body 29. A sheet 34 is supplied.

  By cutting the metal sheet 34 in which a large number of through holes 25 are formed into a predetermined length by a cutting device (cutting means) 53, a sheet-like vapor deposition mask 20 is obtained. And the vapor deposition mask apparatus 10 is obtained by attaching the flame | frame 15 with respect to each vapor deposition mask 20. As shown in FIG. The frame 15 may be attached to one surface 20a of the vapor deposition mask 20 or may be attached to the other surface 20b of the vapor deposition mask 20.

  As described above, when the elongated groove 26 is formed in a straight line, the direction in which the groove 26 extends and the direction in which the metal sheet 34 is supplied (the direction in which the metal sheet 34 is conveyed) are substantially parallel. It is preferable that In this case, during manufacture of the vapor deposition mask 20, it can prevent that the metal sheet | seat 34 extends or is cut | disconnected in the part of the groove | channel 26 where thickness is thin.

  As described above, according to the present embodiment, the through holes 25 are formed in the metal sheet 34 by the linear grooves 26 and the holes 27. Therefore, the vapor deposition material 48 that proceeds obliquely with respect to the sheet surface of the metal sheet 34 and that travels substantially along the longitudinal direction of the groove 26 can be used for vapor deposition with high efficiency. Thereby, the utilization efficiency of the vapor deposition material 48 can be improved significantly. The vapor deposition mask 20 according to the present embodiment is, for example, a vapor deposition mask (evaporation metal used for patterning an expensive organic light-emitting material on the substrate 42 in a desired pattern when manufacturing an organic EL display device. Very suitable for mask).

  Moreover, according to this Embodiment, the utilization efficiency of the vapor deposition material 48 is improved significantly, ensuring the thickness of the metal sheet 34 more than a certain amount. In other words, the use efficiency of the vapor deposition material 48 is greatly increased by locally reducing the thickness of the metal sheet 34 without reducing the thickness of the metal sheet 34 as a whole. Therefore, the rigidity of the metal sheet 34 and the vapor deposition mask 20 can be secured, and the vapor deposition mask 20 (the metal sheet 34) is deformed when the vapor deposition mask 20 is produced or handled (conveyed or used). Can be effectively prevented. As a result, when the obtained vapor deposition mask 20 is used, vapor deposition with a very high-definition pattern can be performed with high accuracy.

  Further, according to the present embodiment, in the step of supplying the metal sheet 34, the winding body 29 around which the metal sheet 34 is wound is rewound to supply the metal sheet 34 extending in a belt shape. Such a wound body 29 is available at a low cost and is very convenient for handling.

  Various modifications can be made to the above-described embodiment within the scope of the present invention. Hereinafter, an example of a modification will be described with reference to the drawings as appropriate. In FIGS. 13 to 18 referred to below, the same parts as those of the above-described embodiment and the same parts in the modifications described below are denoted by the same reference numerals, and detailed details overlapping. Description is omitted.

(Modification 1)
In the above-described embodiment, the example in which the first surface 34a and the second surface 34b of the metal sheet 34 are etched at the same time and the grooves 26 and the holes 27 are formed in parallel is shown, but the present invention is not limited thereto. . For example, as shown in FIG. 11, the step of forming the hole 27 may be performed before the step of forming the groove 26, or the step of forming the groove 26 as shown in FIG. It may be performed before the step of forming the hole 27. When the step of forming the hole 27 is performed before the step of forming the groove 26, the step of filling the hole 27 with a resin after forming the hole 27 by etching from the second surface 34b side of the metal sheet 34, or Further, a step of filling the hole 27 with resin and covering the second surface 34b of the metal sheet 34 with a resin film may be further provided. In this case, the groove 26 can be formed with high accuracy by etching. The resin film on the hole 27 and the second surface 34b is removed after the groove 26 is formed. Similarly, when the step of forming the groove 26 is performed before the step of forming the hole 27, the groove 26 is formed by etching from the first surface 34a side of the metal sheet 34, and then the groove 26 is filled with resin. A step of filling the groove 26 with resin and covering the first surface 34a of the metal sheet 34 with a resin film may be further provided. In this case, the hole 27 can be accurately formed by etching. The resin film on the groove 26 and the first surface 34a is removed after the hole 27 is formed.

  Alternatively, as shown in FIG. 13, the first surface 34 a and the second surface 34 b of the metal sheet 34 are simultaneously etched to form the hole 27 and the groove 26 to be performed in parallel, and then the hole Only one of the step of forming 27 and the step of forming the groove 26 may be continued. That is, in this method, the etching is performed in two stages, and in the first etching, the step of forming the hole 27 and the step of forming the groove 26 are performed in parallel. Then, in the first etching, either the step of forming the hole 27 or the step of forming the groove 26 is completed, and the step of forming the hole 27 and the step of forming the groove 26 in the second etching. Only one of the other will continue to be implemented. When applied to the manufacture of the vapor deposition mask 20 of the above-described embodiment, it is preferable that the formation of the hole 27 that requires a small amount of etching by etching is completed by the first etching. According to such a method, it is possible to efficiently produce the groove 26 and the hole 27 having different amounts of etching by etching.

  Here, a modification of the manufacturing method shown in FIG. 14 will be described in detail. Here, FIGS. 14A to 14E are views for explaining a modification of the manufacturing method of the vapor deposition mask, and each is a metal sheet 34 in a cross section along the width direction of the groove 26. Is shown.

  As shown in FIG. 14A, a resist (resist pattern) 35a is formed on the first surface 34a of the metal sheet 34 and the second surface 34b of the metal sheet 34 is formed in the same manner as described above. A resist (resist pattern) 35b is formed. Next, the first etching is performed on the metal sheet 34 through the resists 35a and 35b. In the first etching, the first surface 34a and the second surface 34b of the metal sheet 34 are simultaneously etched, and the groove 26 on the first surface 34a side and the hole 27 on the second surface 34b side are formed in parallel. To go. However, the amount of etching by etching to form the hole 27 is much smaller than the amount of etching by etching to form the groove 26. Therefore, as shown in FIG. 14B, when the hole 27 having a desired shape is formed on the second surface 34b side of the metal sheet 34, the groove 26 is still in the middle of formation. In the state shown in FIG. 14B, the first etching for the metal sheet 34 is completed.

  Next, as shown in FIG. 14C, the formed hole 27 is covered with a resin 39 having resistance to the etching solution 38. That is, the hole 27 is sealed with the resin 39 having resistance to the etching solution 38. In the example shown in FIG. 14C, the resin 39 film is formed so as to cover not only the formed hole 27 but also the second surface 34b (resist 35b).

  Thereafter, the second etching is performed on the metal sheet 34. In the second etching, the metal sheet 34 is etched only from the first surface 34a side, and the formation of the grooves 26 proceeds from the first surface 34a side. This is because the metal sheet 34 is coated with a resin 39 having resistance to the etching solution 38 on the second surface 34b side. Therefore, the shape of the hole 27 formed in a desired shape is not impaired by the first etching. And as shown in FIG.14 (d), when the groove | channel 26 of a desired shape is formed in the 1st surface 34a side of the metal sheet 34, the 2nd time etching with respect to the metal sheet 34 is complete | finished. At this time, as shown in FIG. 14 (d), the groove 26 extends to a position reaching the hole 27 along the thickness direction of the metal sheet 34, thereby the groove 26 and the hole communicating with each other. Through holes 25 are formed in the metal sheet 34 by 27.

  Next, the resists 35 a and 35 b and the resin film 39 are removed from the metal sheet 34. The resin film 39 can be removed by burning, for example. Thus, as shown in FIG.14 (e), the vapor deposition mask 20 (the sheet-like member 18 for vapor deposition mask) is obtained.

  In the above manufacturing method, when the second etching is completed and the hole 27 and the groove 26 communicate with each other to form the through hole 25, the hole 27 is sealed with the resin 39. And according to such a manufacturing method, the groove | channel 26 and the hole 27 (namely, through-hole 25) can be formed stably very accurately.

  If the hole 27 is not sealed with resin, the first surface 34a and the second surface 34b of the metal sheet 34a communicate with each other through the through hole 25. In this case, a fresh etching solution 38 (see FIG. 10) having a high erosion capability flows from the inside of the groove 26 toward the hole 27 side. At this time, the hydraulic pressure increases in the hole 27 where the cross-sectional area (opening area) is small and in the vicinity of the overhanging portion 28a, and these regions are eroded locally by the fresh etching solution. In addition, the etching solution that has flowed from the first surface 34a side to the second surface 34b side may remain around the hole 27 on the second surface 34b. For these reasons, it is difficult to stabilize the shape of the connecting portion 28 that defines the contour of the through hole 25 and to make the contours of all the through holes 25 uniform. In the first place, if the hole 27 was not sealed with the resin 39, the cross-sectional shape of the through hole 25 (due to the pressure generated when the groove 26 passes through the hole 27 and the etching solution starts to flow toward the second surface 34b) ( In particular, the shape of the overhanging portion 28a may be distorted.

  On the other hand, according to the present modification in which the hole 27 is sealed with the resin 39 when the hole 27 communicates with the groove 26 and the through hole 25 is produced, all of the above problems are avoided. The through hole 25 having a desired shape can be formed with high accuracy and stability. In addition, according to this method, the hole 27 and the groove 26 can be formed in a desired shape with extremely high accuracy, so that the metal sheet 34 from the connecting portion 28 to the second surface 34b (20b) described above can be formed. The length Lc (see FIG. 6) along the direction orthogonal to the sheet surface can be stably reduced to 5 μm or less (more specifically, 2 to 4 μm). As a result, when the obtained vapor deposition mask 20 is used, vapor deposition with a very high-definition pattern can be performed with high accuracy. In particular, it is possible to stabilize the film thickness of the deposited film at the edge in the film formation region (region to be formed).

(Modification 2)
Further, in the above-described embodiment, the groove 26 is formed by etching the metal sheet 34 from the first surface 34a side, and the hole 27 is formed by etching the metal sheet 34 from the second surface 34b side. Although the example formed is shown, it is not restricted to this. For example, after the metal sheet 34 is etched from the first surface 34 a side to form the groove 26, a resist pattern (resist) is further formed on the first surface 34 b side of the metal sheet 34, and the metal sheet The hole 27 may be formed by etching 34 from the first surface 34a side. In this case, a hole 27 extending from the bottom of the groove 26 to the second surface 34 b of the metal sheet 34 can be formed, and the formed hole 27 is the first surface 34 a of the metal sheet 34 in the same manner as the groove 26. The cross-sectional area becomes smaller from the side toward the second surface 34b side. That is, according to this method, the cross-sectional area (opening area) of the through hole 25 in the cross section along the sheet surface of the metal sheet 34 gradually decreases from the first surface 34a side to the second surface 34b side. To go. Therefore, according to the vapor deposition mask 20 made of the metal sheet 34 manufactured in this manner, vapor deposition with a high-definition pattern can be performed with extremely high accuracy.

(Modification 3)
Furthermore, the structure of the groove | channel 26 formed in the 1st surface 34a side of the metal sheet | seat 34 in embodiment mentioned above is only an example. For example, in the above-described embodiment, the example in which the groove 26 has a substantially uniform width and a substantially uniform depth along the longitudinal direction thereof is shown, but the present invention is not limited to this. As an example, as shown in FIG. 15, the width on the first surface 34 a of the groove 26 along the direction orthogonal to the longitudinal direction of the groove 26 (that is, the width direction of the groove) may not be constant. In the vapor deposition mask 20 shown in FIG. 15, the width Wa of the portion where the hole 27 is formed in the longitudinal direction of the groove 26 is thicker than the width Wb of the portion between two adjacent holes 27 in the longitudinal direction of the groove 26. It has become.

  Such a groove 26 is formed of a plurality of holes (groove constituting holes) 30 formed on the first surface 34 a side by side along the longitudinal direction of the groove 26. Of the plurality of holes 30 constituting the groove 26, two holes 27 adjacent to each other along the longitudinal direction of the groove 26 are connected to each other on the first surface 34a. In other words, the two holes 27 are formed so as to partially overlap on the first surface 34a. That is, the outer contours of the two holes 27 are connected to each other on the first surface 34a. 15 and 16, the hole 27 formed on the second surface 34b side faces the hole 30 formed on the first surface 34a side in order to form the groove 26. Is arranged. In particular, in the present embodiment, as can be understood from FIGS. 15 and 16, the center position C27 along the longitudinal direction of the groove 26 of the hole 27 formed on the second surface 34b side is the first surface 34a. The center position C30 along the longitudinal direction of the groove 26 of the groove forming hole 30 formed on the side coincides with the longitudinal direction of the groove 26. Furthermore, in this embodiment, as can be understood from FIG. 15, the center position along the width direction of the groove 26 of the hole 27 formed on the second surface 34b side is formed on the first surface 34a side. The center position of the groove forming hole 30 along the width direction of the groove 26 coincides with the width direction of the groove 26. FIG. 16 shows a cross section along the longitudinal direction of the groove 26.

  As shown in FIG. 16, the groove 26 extends linearly, but the depth of the groove 26 is not constant. The depth Da of the portion where the hole 27 is formed in the longitudinal direction of the groove 26 is deeper than the depth Db of the portion between two adjacent holes 27 in the longitudinal direction of the groove 26.

  In addition, about the other structure of the vapor deposition mask 20 shown by FIG. 15 and FIG. 16, it can be set as the structure same as the vapor deposition mask demonstrated in embodiment mentioned above. For example, the cross-sectional shape along the width direction of the groove 26 can be the same as the cross-sectional shape of the groove in the above-described vapor deposition mask (see FIG. 3).

  According to such a vapor deposition sheet 20, the same effect as the vapor deposition sheet in embodiment mentioned above can be anticipated. For example, since the through hole 25 is formed in the metal sheet 34 by the linear groove 26 and the hole 27, the vapor deposition material 48 (see FIG. 5) that moves obliquely with respect to the sheet surface of the metal sheet 34. Therefore, the vapor deposition material 48 that advances substantially along the longitudinal direction of the groove 26 can be used for vapor deposition with high efficiency. Thereby, the utilization efficiency of the vapor deposition material 48 can be improved significantly. In particular, according to the present modification, it is possible to ensure the rigidity of the metal sheet 34 and the vapor deposition mask 20 as compared with the vapor deposition mask in the above-described embodiment. For this reason, it can prevent more effectively that the vapor deposition mask 20 (metal sheet | seat 34) deform | transforms at the time of preparation of the vapor deposition mask 20, and handling (conveyance, use, etc.). As a result, when the obtained vapor deposition mask 20 is used, vapor deposition with an extremely high-definition pattern can be performed with higher accuracy.

  Here, an example of the manufacturing method of the vapor deposition sheet shown by FIG. 15 and FIG. 16 is demonstrated with reference to FIG. 17 and FIG. The vapor deposition sheet 20 shown in FIGS. 15 and 16 can be produced by any of the above-described manufacturing methods shown in FIGS. 8, 11, 12, and 13. As an example, the manufacturing method described below is the same as the manufacturing method described with reference to FIGS. 13 and 14. Here, FIG. 17A to FIG. 17E are views for explaining a method of manufacturing a vapor deposition mask, and all show the metal sheet 34 in a cross section along the longitudinal direction of the groove. FIG. 18 is a plan view showing an example of a resist (resist pattern) 35 a that can be arranged on the first surface 34 a of the metal sheet 34 together with the outer contours of the groove 26 and the through hole 25 to be formed.

  First, as shown in FIG. 17A, a resist (resist pattern) 35a is formed on the first surface 34a of the metal sheet 34, and a resist (resist pattern) 35b is formed on the second surface 34b of the metal sheet 34. Form. In this example, as shown in FIG. 18, the resist 35a formed on the first surface 34a of the metal sheet 34 has a hole 30 that forms the groove 26 on the first surface 34a. A through hole 35a1 is formed at each position to be formed. As shown in FIG. 18, the plurality of through holes 35a1 are arranged at intervals along the longitudinal direction of the groove 26 to be formed (the vertical direction on the paper surface of FIG. 18). Therefore, the resist 35a has a bridge portion 35a2 positioned between two through holes 35a1 adjacent to each other along the longitudinal direction of the groove 26 to be formed.

  Next, the first etching is performed on the metal sheet 34 through the resists 35a and 35b. In the first etching, the first surface 34a and the second surface 34b of the metal sheet 34 are etched at the same time, and the hole 30 that forms the groove 26 on the first surface 34a side and the second surface 34b side The holes 27 are formed in parallel. That is, the plurality of holes 30 constituting the groove 26 are formed in the first state of the metal sheet 34 with the resist 35a formed by arranging the plurality of through holes 35a1 in a line at intervals on the first surface 34a. By etching the first surface 34a, it is formed on the first surface 34a side of the metal sheet 34 at a position corresponding to the through hole 35a1 of the resist 35a. Then, as shown in FIG. 17B, a hole 27 having a desired shape is formed on the second surface 34b side of the metal sheet 34, and the hole 30 constituting the groove 26 is completely formed. In a state in which the first etching is not performed, the first etching for the metal sheet 34 is completed. Next, as shown in FIG. 17C, a resin film 39 made of a resin resistant to the etching solution 38 is formed so as to cover the formed hole 27 and the second surface 34b (resist 35b). . That is, the hole 27 is sealed with the resin 39 having resistance to the etching solution 38.

  Thereafter, the second etching is performed on the metal sheet 34. In the second etching, the metal sheet 34 is etched only from the first surface 34a side, and the formation of the holes 30 constituting the grooves 26 proceeds from the first surface 34a side. At this time, since the hole 27 is sealed with the resin 39 having resistance to the etching solution 38, the shape of the hole 27 formed by the first etching is not impaired. Then, as shown in FIG. 17D, when the hole 30 having a desired shape is formed on the first surface 34a side of the metal sheet 34, the second etching for the metal sheet 34 is completed.

  As described above, the erosion of the metal sheet 34 by etching proceeds not only in the thickness direction of the metal sheet 34 but also in the direction along the sheet surface of the metal sheet 34. Then, as shown in FIG. 17 (d), through the two-stage etching process, the hole 30 formed from the first surface 34a has a thickness of the metal sheet 34 up to the hole 27 formed on the second surface 34b side. In addition to extending in the longitudinal direction, it also extends in the direction along the sheet surface of the metal sheet 34 so as to be connected to the adjacent hole 30 along the longitudinal direction of the groove 26 to be formed at the first surface 34a. Then, in the second etching, all the two holes 3 adjacent to each other along the longitudinal direction of the groove 26 of the plurality of holes 30 are two through holes 35a1 of the resist 35a corresponding to the two holes 30, respectively. Until the connection is made below the bridge portion 35a2 of the resist 35a located between the two. That is, after the second etching is completed, a gap is formed between the bridge portion 35a2 of the resist 35a and the metal sheet 34. In this way, by two-stage etching, the two adjacent holes 30 are finally connected to each other on the first surface 34a, and a plurality of holes (groove constituting holes) 30 are arranged in a line to form the first. The grooves 26 are formed from the plurality of holes 30 finally from the surface 34a side. The two holes 30 adjacent along the longitudinal direction of the groove 26 may start to overlap on the first surface 34a during the first etching process or during the second etching process. There may be.

  Thereafter, the resists 35a, 35b and the resin film 39 are removed from the metal sheet 34, and as shown in FIG. 17E, the vapor deposition mask 20 (the vapor deposition mask sheet-like member 18) is obtained.

  According to the above manufacturing method, the same effect as the manufacturing method described with reference to FIGS. 13 and 14 can be expected. For example, according to the above manufacturing method, the through hole 25 having a desired shape can be formed with high accuracy and stability. Further, according to the above manufacturing method, the length Lc (see FIG. 6) along the direction perpendicular to the sheet surface of the metal sheet 34 from the connecting portion 28 to the second surface 34b (20b) is stabilized. And 5 μm or less (more specifically, 2 to 4 μm). As a result, when the obtained vapor deposition mask 20 is used, vapor deposition with a very high-definition pattern can be performed with high accuracy. In particular, it is possible to stabilize the film thickness of the deposited film at the edge in the film formation region (region to be formed).

  The resist 35a formed on the first surface 34a of the metal sheet 34 has a bridge portion 35a2 between the through holes 35a1. Therefore, the resist 35a has higher rigidity than the case where the elongated through holes extending linearly corresponding to the grooves 26 to be formed are arranged side by side, and the resist 35a has a high rigidity to the metal sheet 34. Adhesion is improved. That is, it is effective that the resist 35a is deformed on the first surface 34a of the metal sheet 34 during the etching or the resist 35a is peeled off from the first surface 34a of the metal sheet 34. Can be prevented. Thereby, the through hole 25 having a desired shape can be formed more accurately and stably.

(Modification 4)
Furthermore, the structure of the hole 27 formed in the 1st surface 34a side of the metal sheet | seat 34 in embodiment mentioned above is only an example. For example, in the above-described embodiment, the example in which the hole 27 has a rectangular shape in plan view has been described. However, the shape is not limited thereto, and the hole 27 may have various shapes such as a square.

(Modification 5)
Furthermore, although the example which supplies the metal sheet 34 extended in strip | belt shape was shown in embodiment mentioned above, it is not restricted to this. The vapor deposition mask 20 may be formed by supplying a sheet-like metal sheet 34 and etching the metal sheet 34.

(Modification 6)
Furthermore, although the example which attaches the flame | frame 15 with respect to the vapor deposition mask 20 cut | disconnected by predetermined length was shown in embodiment mentioned above, it is not restricted to this. For example, the frame 15 may be attached to the vapor deposition mask sheet-like member 18 before cutting, and then the vapor deposition mask sheet-like member 18 to which the frame 15 is fixed may be cut to a predetermined length. .

(Modification 7)
In addition, although the some modification with respect to embodiment mentioned above was demonstrated above, naturally, it is also possible to apply combining several modifications suitably.

FIG. 1 is a perspective view showing an embodiment of a vapor deposition mask according to the present invention. FIG. 2 is a partial plan view showing the vapor deposition mask shown in FIG. 3 is a cross-sectional view taken along a line III-III in FIG. FIG. 4 is a cross-sectional view taken along a line IV-IV in FIG. FIG. 5 is a diagram for explaining how to use the vapor deposition mask. FIG. 6 is a diagram for explaining the operation of the vapor deposition mask in the cross section corresponding to FIG. 3. FIG. 7 is a diagram for explaining the operation of the vapor deposition mask in the cross section corresponding to FIG. 4. FIG. 8 is a diagram for explaining an embodiment of a method for manufacturing a vapor deposition mask according to the present invention. FIG. 9 is a diagram for explaining a method of forming a resist pattern on a metal sheet. FIG. 10 is a diagram for explaining a method of etching a metal sheet. FIG. 11 is a diagram corresponding to FIG. 8 and is a diagram for explaining a modification of the method for manufacturing the vapor deposition mask. FIG. 12 is a diagram corresponding to FIG. 8 and is a diagram for explaining another modified example of the method of manufacturing the vapor deposition mask. FIG. 13 is a diagram corresponding to FIG. 8 and is a diagram for explaining still another modified example of the method of manufacturing the vapor deposition mask. 14 (a) to 14 (e) are diagrams for explaining the manufacturing method shown in FIG. 13, and each of the metal sheets is shown in a cross section along the width direction of the groove to be formed. FIG. FIG. 15 is a partial plan view corresponding to FIG. 2 and showing a modification of the vapor deposition mask. 16 is a cross-sectional view taken along line XVI-XVI in FIG. 17 (a) to 17 (e) are diagrams for explaining an example of a method of manufacturing the vapor deposition mask shown in FIG. 15, and both are cross sections along the longitudinal direction of the groove to be formed. It is a figure which shows a metal sheet | seat. 18 is a partial plan view showing an example of a resist that can be used in the manufacturing method shown in FIG.

Explanation of symbols

20 Deposition mask 20a One surface 20b The other surface 25 Through hole 26 Groove 26a Wall surface 27 Hole 27a Wall surface 28 Connection portion 30 Hole 34 Metal sheet 34a First surface 34b Second surface 35a Resist (resist pattern)
35a1 Through hole 35a2 Bridge portion 35b Resist (resist pattern)
39 Resin (resin film)
L Straight line La Length Lb Length Lc Length Ld Length θ Angle Wa Width Wb Width

Claims (15)

A metal sheet having a first surface and a second surface opposite to the first surface, and having a through hole extending between the first surface and the second surface;
A groove extending linearly is formed on the first surface side of the metal sheet,
A hole is formed on the second surface side of the metal sheet,
The groove and the hole communicate with each other, and a through hole is formed through the metal sheet by the groove and the hole.
From the first surface side toward the second surface side, the cross-sectional area of the groove in the cross section along the sheet surface of the metal sheet gradually decreases,
From the second surface side toward the first surface side, the cross-sectional area of the hole in the cross section along the sheet surface of the metal sheet gradually decreases,
A plurality of the holes are provided at intervals along the longitudinal direction of the groove,
The width of the groove on the first surface along the direction orthogonal to the longitudinal direction of the groove is such that the two adjacent holes in the longitudinal direction have a width larger than the portion where the hole in the longitudinal direction is formed. Narrow in the middle part,
The groove is formed by a plurality of holes formed in a straight line on the first surface side, and two holes adjacent to each other along the longitudinal direction of the groove of the plurality of holes are the first holes. Connected on one side,
The hole formed on the second surface side is disposed at a position facing the hole that is formed on the first surface side and that forms the groove. Deposition mask used when depositing materials. The region surrounded by the connection portion between the wall surface of the groove and the wall surface of the hole has a rectangular shape in a field of view from a direction orthogonal to the sheet surface of the metal sheet,
The vapor deposition mask according to claim 1, wherein a longitudinal direction of a region surrounded by the connection portion extends along a longitudinal direction of the linear groove. The vapor deposition mask according to claim 1, wherein a plurality of the grooves extending linearly are provided in parallel to each other. A plurality of grooves extending in parallel to each other are provided at equal intervals,
A plurality of holes are provided at equal intervals along the longitudinal direction of each groove,
In plan view of the metal sheet, the length between two through holes adjacent to each other along the longitudinal direction of the groove is shorter than the length between two through holes formed in the adjacent grooves. The vapor deposition mask as described in any one of Claims 1 thru | or 3 characterized by the above-mentioned. Etching a metal sheet having a first surface and a second surface opposite to the first surface to form a linearly extending groove on the first surface side of the metal sheet;
Etching the metal sheet to form a hole on the second surface side of the metal sheet, and
The groove and the hole are formed such that the groove and the hole communicate with each other, and the groove and the hole form a through-hole penetrating the metal sheet.
In the step of forming the hole, a plurality of holes are formed at equal intervals along the longitudinal direction of the groove,
In the step of forming the groove, the groove is formed by forming a plurality of holes in a straight line from the first surface side so that two adjacent holes are connected on the first surface. ,
The width of the groove on the first surface along the direction orthogonal to the longitudinal direction of the groove is such that the two adjacent holes in the longitudinal direction have a width larger than the portion where the hole in the longitudinal direction is formed. Narrow in the middle part,
The hole formed on the second surface side is formed at a position where the hole is formed on the first surface side so as to face the hole constituting the groove, at the time of manufacturing the organic EL display device A method of manufacturing a vapor deposition mask used when vapor-depositing an organic light emitting material. A plurality of grooves extending in parallel to each other are formed at equal intervals,
In a plan view of the metal sheet, the length between two through holes adjacent to each other along the longitudinal direction of the groove is shorter than the length between the two through holes formed in the adjacent grooves. The method for manufacturing a vapor deposition mask according to claim 5, wherein: The groove and the hole are formed so that the region surrounded by the connection portion between the wall surface of the groove and the wall surface of the hole has a rectangular shape in plan view of the metal sheet,
The method of manufacturing a vapor deposition mask according to claim 5 or 6, wherein a longitudinal direction of a region surrounded by the connecting portion extends along a longitudinal direction of the linear groove. The groove is formed by etching the metal sheet,
The method for manufacturing a vapor deposition mask according to claim 5, wherein the hole is formed by etching the metal sheet. The vapor deposition according to claim 8, wherein the first surface and the second surface of the metal sheet are etched simultaneously, and the step of forming the hole and the step of forming the groove are performed in parallel. Mask manufacturing method. The first surface and the second surface of the metal sheet are simultaneously etched to form the hole and the groove are formed in parallel, and then the step of forming the hole and the groove are performed. The method for manufacturing a vapor deposition mask according to claim 8, wherein only one of the forming steps is continuously performed. A step performed after the hole is formed by etching the metal sheet, further comprising a step of sealing the formed hole with a resin;
9. The deposition mask according to claim 8, wherein after the hole is sealed, the groove leading to the hole is formed by etching the metal sheet from the first surface side. Method. 12. The deposition mask according to claim 11, wherein in the step of forming the hole, the first surface and the second surface of the metal sheet are simultaneously etched, and the formation of the groove partially proceeds. Production method. The method of manufacturing a vapor deposition mask according to claim 5, wherein the step of forming the hole is performed before the step of forming the groove. The method of manufacturing a vapor deposition mask according to claim 5, wherein the step of forming the groove is performed before the step of forming the hole. In the step of forming the groove,
The plurality of holes constituting the groove are formed by etching the first surface of the metal sheet in a state where a resist formed by arranging a plurality of through holes at intervals is provided on the first surface. , Formed on the first surface side of the metal sheet at a position corresponding to the through hole of the resist,
In the etching for forming the groove including the plurality of holes, two holes adjacent along the longitudinal direction of the groove are positioned between two through holes of the resist corresponding to the two holes, respectively. The method for manufacturing a vapor deposition mask according to claim 5, wherein the vapor deposition mask is connected so as to be connected below a bridge portion of the resist.

Images