JP5258590B2 - Integrated circuit testing equipment - Google Patents

Description

  The present invention relates to an apparatus for electrical testing of integrated circuits.

  An integrated circuit (that is, an object to be inspected) such as an uncut integrated circuit formed on a semiconductor wafer, an integrated circuit cut into a chip, or an integrated circuit cut into a chip and packaged or molded is a probe card. It is tested whether or not it has the performance according to the specification by the test apparatus using

  A probe card used for this type of test generally includes a probe board having a plurality of signal paths, that is, conductive paths, and a plurality of contacts arranged on one surface of the probe board and electrically connected to the conductive paths. Including.

  Examples of such probe boards include wiring boards made of glass-filled epoxy resins, ceramic boards made of ceramics, flexible multilayer wiring boards made of electrically insulating resins such as polyimide resins, and lower surfaces of ceramic boards. For example, a combined substrate in which a flexible multilayer wiring board is disposed is used.

  In recent years, integrated circuits have been tested at high temperatures. In this case, the integrated circuit is heated to a predetermined temperature by a heating element provided on the stage on which the integrated circuit is arranged, and thereby the probe substrate on which the contact is arranged is also heated by receiving heat from the stage and the integrated circuit. As a result, the integrated circuit and the probe substrate are thermally expanded.

  However, if the amount of thermal expansion of the integrated circuit and the amount of thermal expansion of the probe substrate are different, the relative positional relationship between the electrode of the integrated circuit and the needle tip of the contactor changes, and the needle tip is not pressed against the electrode of the integrated circuit. The presence of contacts cannot be avoided.

  In view of the above, there has been proposed a test apparatus in which a heating element is arranged in a probe substrate, the heating element is heated to heat the probe substrate, and thereby the temperature of the probe substrate is adjusted (Patent Document 1).

  However, when the heating power supplied to the heating element is derived from a so-called test power source provided in the test signal processing unit of the test apparatus, such a tester power source generally supplies a test signal or bias for the contactor. This leads to a shortage of power used to supply power. As a result, sufficient heating power is not efficiently supplied to the heating element, and it is difficult to raise the probe card to a predetermined temperature in a short time.

  For example, in a test apparatus that moves the stage relative to the probe card each time one wafer test is completed, the probe card is exposed to the atmospheric temperature each time the stage is moved away from the probe card. The temperature drops.

  In addition, in a test apparatus that divides a number of wafers into lots each containing a plurality of wafers and tests each lot, not only the test of one wafer is completed, but also one lot of wafers can be replaced. Therefore, every time the stage is moved, the probe card is exposed to the atmospheric temperature. Even in such an apparatus, the temperature of the probe substrate greatly decreases while the probe card is exposed to the atmospheric temperature.

  From the above, in the conventional test apparatus, the probe card must be raised again to a predetermined temperature for the next wafer test. However, it takes a long time to raise the probe card that has caused the temperature drop to a predetermined temperature again, and the test efficiency is extremely low.

  The power shortage of the test power source in the probe card is not only the heating power to the heating element as a power consuming member, but also electronic components such as relays and capacitors arranged in the power supply path for test signals on the contact (patent This also occurs in a probe card provided with other power consuming members such as a document 2), a memory storing the type and performance of the probe card (Patent Document 3), and a mechanical instrument such as a cooling fan.

  Moreover, the power shortage of the test power source in the probe card also occurs when the probe card itself provided in the tester is replaced with a probe card having a large number of contacts from a probe card having a small number of contacts and power consuming members. .

  An object of the present invention is to make up for power shortage, efficiently supply power, and improve test efficiency.

  The present inventors have completed the present invention by paying attention to the fact that the probe card is disposed below the test head, received by the card holder, and the like.

An electrical test apparatus according to the present invention includes a wiring board, a probe board disposed below the wiring board and having contact terminals disposed on a lower surface thereof, and a power consuming member disposed on the wiring board or the probe board. Including a probe card, a plate-like member arranged on the probe card, and a first connecting portion arranged on one of the wiring board and the plate-like member. A first connection portion having a first terminal electrically connected; and a second connection portion disposed on the other of the wiring board and the plate-like member, wherein the first terminal portion is electrically And a second connection part having a second terminal connected to the power source, and a power source for a power consuming member that supplies power to the power consuming member via the first and second terminals. The first and second terminals are positioned in a vertical relationship with each other, the first terminal includes a first conductive portion, and the second terminal includes the first conductive portion. A second conductive portion contacting at one end thereof, wherein the first connection portion is an electrical insulator supported on the one of the wiring board and the plate-like member; An electrical insulator that supports the conductive portion in a state in which the first conductive portion protrudes from above or below the electrical insulator from the inside of the electrical insulator; and the second connection portion further includes: A support portion disposed on the other side of the wiring board and the plate-like member and supporting the second conductive portion; and a wiring path electrically connected to the conductive portion. A wiring path coupled to the support portion or the conductive portion so as to protrude upward from the support portion; For example, the electrical insulator has a recess for receiving the supporting part. The first conductive portion of the first connection portion includes a pogo pin, and the plate-like member is a wiring path that penetrates the plate-like member in the vertical direction, and is electrically connected to the pogo pin. The first connection portion further includes a wiring path securing member disposed on the plate-like member via an elastic body, and the pogo pin moves the wiring path securing member up and down. It extends through and is electrically connected to the conductive portion and the wiring path.

Another electrical test apparatus according to the present invention includes a wiring board, a probe board disposed on the lower side of the wiring board, and contact terminals disposed on a lower surface , and power consumption disposed on the wiring board or the probe board. A probe card including a member, a card holder for receiving the probe card, and a first connection portion disposed on one of the wiring board and the card holder, and electrically connected to the power consuming member A first connection portion having a first terminal and a second connection portion disposed on the other of the wiring board and the card holder , the second connection portion being electrically connected to the first terminal portion A second connecting portion having two terminals, and a power source for a power consuming member that supplies power to the power consuming member through the first and second terminals. The first and second terminals are positioned in a vertical relationship with each other , the first terminal includes a first conductive portion, and the second terminal includes the conductive portion at one end thereof. And the second connecting portion is an electrical insulator disposed on the other of the wiring board and the card holder, and the second conductive portion An electrical insulator to support and a wiring path electrically connected to the second conductive portion, the electrical insulator having a recess for receiving the second conductive portion; The upper ends of the two conductive parts are retracted into the recesses.

  The electrical test apparatus further includes a test signal processing unit that generates a test signal, the test signal processing unit including a test signal power source, and the probe card is further disposed below the ceramic substrate. And a plurality of contacts arranged on the lower surface of the multilayer wiring sheet so as to be in contact with the electrode of the object to be inspected, and the wiring board receives the test signal from the test signal power source. A third connecting portion having a plurality of third terminals for receiving the contact, wherein the third terminal is connected to the contact via an internal wiring provided on the wiring board, the ceramic substrate, and the multilayer wiring sheet. May be electrically connected.

  The wiring board may have a power feeding path electrically connected to the first terminal. In addition, the first connection portion includes one of a male connector and a female connector that are detachably coupled, and the second connection portion includes the other connector of the male and female connectors. Can be included.

  A plurality of the power consuming members are arranged on the wiring board or the probe board, the wiring board has a plurality of power supply paths, the first connection portion has a plurality of the first terminals; The second connection unit may include a plurality of the second terminals, and each power supply path may be electrically connected to the power consuming member and the first terminal.

  The probe card further includes a reinforcing member disposed on the wiring board, the reinforcing member having a space that opens up and down, and the first and second connecting portions are at least partially at least partially It may be accepted in space.

  The wiring path securing member may have a recess that receives an upper end portion of the first connection portion.

  The power consuming member includes a heating element disposed inside the ceramic substrate, an electronic component disposed on the wiring substrate, a memory disposed on the probe card, and a mechanical device disposed on the probe card. At least one selected from:

  According to the present invention, since the power source for the power consuming member is included, the power of the power source for the power consuming member can be supplied to the power consuming member via the first and second terminals. As a result, the power shortage of the tester is resolved.

According to the present invention, the first terminal of the first connection portion disposed on the wiring board and the second terminal of the second connection portion disposed on the auxiliary member are positioned in a vertical relationship. Therefore, the weight of the plate-like member or the probe card acts on the first and second terminals, the first and second terminals are electrically connected securely, and the power is efficiently supplied to the power consuming member. Supplied.
As a result, the power consuming member can execute a predetermined operation in a short time, and the test efficiency is increased.

  If either one of the first and second terminals is a pogo pin and the other is a conductive portion that the pogo pin contacts, the pogo pin is pressed against the conductive portion by an internal spring member. The terminals are more securely connected electrically. As a result, the heating power is efficiently supplied from the heating element, and the probe card is raised to a predetermined temperature in a shorter time.

It is a figure which shows one Example of the testing apparatus using a probe card. It is sectional drawing which shows one Example of the probe card used with the testing apparatus shown in FIG. It is a disassembled perspective view which shows one Example of the ceramic substrate used with the probe card shown in FIG. It is a top view which shows one Example of the reinforcing member used with the test apparatus shown in FIG. It is sectional drawing which shows the 1st Example of the connection apparatus for heating electric power. It is a top view of the female connector used with the connecting apparatus for heating electric power shown in FIG. It is a top view of the male connector used with the connecting apparatus for heating electric power shown in FIG. It is sectional drawing which shows the 2nd Example of the connection apparatus for heating electric power. It is an expanded sectional view of the pogo pin part in FIG. It is sectional drawing at the time of assembling | attaching the probe card which is not equipped with the heat generating body to the baseplate which has a connector in the connecting apparatus for heating electric power shown in FIG. It is a figure which shows the 3rd Example of the connection apparatus for heating electric power, Comprising: It is a figure which shows the state which spaced apart the wiring board and the card holder. It is a figure which shows the 4th Example of the connection apparatus for heating electric power, Comprising: It shows the state which spaced apart the wiring board and the card holder.

  [Terminology]

  In the present invention, in FIG. 1, the vertical direction is referred to as the vertical direction, the horizontal direction is referred to as the horizontal direction, and the paper back direction is referred to as the front-rear direction. However, these directions differ depending on the postures of the probe board and the probe card in a state where the probe board on which a large number of contacts are arranged and the probe card using the probe board are attached to the test apparatus.

  Therefore, in the test apparatus according to the present invention, when the probe card is attached to the test apparatus, the vertical direction in the present invention is actually the vertical direction, the upside down state, the diagonal direction, It may be used in any direction, such as a state.

  [Example of test apparatus]

  Referring to FIG. 1, a test apparatus 10 uses a disk-shaped semiconductor wafer 12 as an object to be inspected, and inspects, that is, tests, a plurality of integrated circuits formed on the wafer 12 at one time or divided into a plurality of times. . Each integrated circuit has a plurality of electrodes (not shown) such as pad electrodes on the top surface.

  Referring to FIGS. 1 and 2, the test apparatus 10 includes an electrical connection device including a plurality of plate-like contacts 14, that is, a probe card 16, an inspection stage 18 on which the wafer 12 is disposed, and a probe card 16. A test head 20 that is electrically connected to the card, a card holder 22 that receives the probe card 16 at its outer peripheral edge, a card control unit 24 that controls the height or inclination of the card holder 22 relative to the inspection stage 18, and a card holder A stage control unit 26 for controlling the position of the inspection stage 18 with respect to 22, and a test signal for the contact 14 (that is, an electrical signal such as a supply signal supplied to the integrated circuit for the test and a response signal from the integrated circuit for the supply signal) ), A test signal processing unit 28 for controlling the test head 20 and the contact 14 in order to send and receive, and a probe car 16 heater control unit 30 for controlling the temperature of, and a power source 32 for supplying heating power (heating current).

  In the illustrated example, each contactor 14 uses a plate-like probe having a crank shape. Such a contact 14 is, for example, a known one described in JP-A-2005-201844.

  However, each contact 14 is a probe made from a fine metal wire such as a tungsten wire, a plate-like probe made using a photolithography technique and a deposition technique, or one surface of an electrical insulating sheet such as polyimide. Conventionally known ones such as a probe in which a plurality of wirings are formed and a part of the wirings are used as contacts may be used.

  The probe card 16 includes a reinforcing member 34 having a flat lower surface, a circular flat wiring substrate 36 held on the lower surface of the reinforcing member 34, and a flat electric connector 38 disposed on the lower surface of the wiring substrate 36. The probe board 40 disposed on the lower surface of the electrical connector 38 and the disc-shaped cover 42 disposed on the reinforcing member 34 are included. These members 34 to 42 are firmly assembled so as to be separable by a plurality of bolts.

  The reinforcing member 34 is made of a metal material such as a stainless plate. As shown in FIG. 4, the reinforcing member 34 includes an inner annular portion 34a, an outer annular portion 34b, a plurality of coupling portions 34c that couple the annular portions 34a and 34b, and a radial direction from the outer annular portion 34b. A shape having a plurality of extending portions 34d extending outward and a central frame portion 34e that integrally extends inside the inner annular portion 34a and acting as a space 34f that opens between these portions in both the upper and lower directions. It can be.

  Such a reinforcing member 34 is described in, for example, Japanese Patent Application Laid-Open No. 2008-145238. Further, for example, as described in Japanese Patent Application Laid-Open No. 2008-145238, an annular thermal deformation suppressing member that suppresses thermal deformation of the reinforcing member 34 is disposed on the upper side of the reinforcing member 34, and the upper portion of the thermal deformation suppressing member is arranged. The cover 42 may be disposed on the front.

  In the illustrated example, the wiring board 36 is manufactured in a disk shape from an electrically insulating resin such as glass-filled epoxy resin, and a plurality of conductive paths, i.e., internal wirings 46, used for passing test signals to the contact 14. And a plurality of power supply paths 48 used for supplying heating power.

  A large number of connectors 44 connected to the test head 20 are arranged on the annular peripheral edge of the upper surface of the wiring board 36. Each connector 44 has a plurality of terminals (not shown) electrically connected to the internal wiring 46.

  The reinforcing member 34 and the wiring board 36 are coaxially coupled by a plurality of screw members (not shown) in a state where the lower surface of the reinforcing member 34 and the upper surface of the wiring board 36 are in contact with each other.

  The electrical connector 38 is a well-known thing described in Unexamined-Japanese-Patent No. 2008-145238, for example. The electrical connector 38 includes a plurality of known connection pins 50 and 52 such as pogo pins extending vertically through an electrically insulating pin holder, and each of the internal wiring 46 and the power supply path 48 of the wiring board 36 is provided. The connection pins 50 and 52 are electrically connected to a conductive path 72 and a power feeding path 70 described later on the probe board 40.

  The electrical connector 38 is coupled to the lower surface of the wiring board 36 at the pin holder by a plurality of screw members and appropriate members (none of which are shown) with the upper surface of the pin holder in contact with the lower surface of the wiring board 36. ing.

  Further, each of the connection pins 50 and 52 has an upper end and a lower end separated by a spring, and an upper end connected to a terminal portion (not shown) following the internal wiring 46 of the wiring board 36 or the lower end portion of the power supply path 48. While being pressed, the lower end is pressed by another terminal portion provided on the upper surface of the probe substrate 40.

  In the illustrated example, the probe substrate 40 is a combined substrate in which a flexible multilayer sheet 54 formed of an electrically insulating resin such as a polyimide resin is provided on the lower surface of the multilayer ceramic substrate 56. The contact 14 is arranged in a cantilever manner.

  The multilayer sheet 54 has a known shape and structure having a plurality of internal wirings (not shown) inside and a plurality of probe lands (not shown) electrically connected to the internal wirings on the lower surface. And formed integrally with the ceramic substrate 56.

  Each contactor 14 has a cantilever shape on the above-described probe land by a technique such as bonding with a conductive bonding material such as solder, welding with a laser, or the like with its tip (needle tip) protruding downward. It is attached to.

  As shown in FIG. 3, the ceramic substrate 56 includes a plurality of heat generating layers 58 and a plurality of conductive layers 60. In the example shown in FIG. 3, a plurality of layers (four layers) of heat generation layers 58 spaced in the thickness direction (the vertical direction in the illustrated example) are provided, and the heat generation layers 58 adjacent in the thickness direction are provided. In the meantime, a plurality of layers (three layers) of conductive layers 60 are provided on the upper side of the uppermost heating layer 58 and on the lower side of the lowermost heating layer 58, respectively.

  Each heating layer 58 has a heating element 62 formed on one surface of a thin ceramic layer 64. The heating element 62 of each heating layer 58 has a pattern shape having an appropriate shape such as a one-stroke shape or a concentric shape.

  In contrast, each conductive layer 60 has a wiring 66 such as a wiring pattern formed on one surface of a thin ceramic layer 68. Each wiring 66 of the ceramic substrate 56 is electrically connected to the internal wiring of the multilayer sheet 54, and is used for passing test signals to the contactor 14 together with the internal wiring.

  Each heating element 62 is electrically connected to a pair of power supply paths 70 (see also FIG. 2) extending through the heating layer 58 and the conductive layer 60 in the thickness direction. The heating element 62 may be connected to a pair of feeding paths 70 provided for each heating element, or may be connected in parallel to a pair of feeding paths 70 common to the plurality of heating elements 62.

  Each wiring 66 is electrically connected to a conductive path 72 (see FIG. 2) extending through the heat generating layer 58 and the conductive layer 60 in the thickness direction. Each of the power supply path 70 and the conductive path 72 is formed by coupling conductive vias provided in the heat generation layer 58 and the conductive layer 60.

  Each conductive path 72 is electrically connected to the wiring 66 of the corresponding conductive layer 60, but is not electrically connected to the power supply path 70 of the conductive layer 60. For this reason, each heating element layer 68 is provided with an electrically insulating region (not shown) such as a through-hole through which the conductive path 72 does not contact the heating element 62 or a pattern non-existence region where the heating element 62 does not exist. It has been.

  Contrary to the above, each power supply path 70 is electrically connected to the heat generating element 62 of the corresponding heat generating layer 58, but not electrically connected to the wiring 66 of the conductive layer 60. For this reason, each electrically conductive layer 68 is provided with other electrically insulating regions (not shown) such as a through-hole through which the power supply path 70 does not come into contact with the wiring 66 and a wiring non-existing region where the wiring 66 does not exist. ing.

  An electrically insulating layer may be used instead of the conductive layer 60. In this case, a plurality of insulating layers may be provided between the heat generating layers 58 adjacent to each other in the thickness direction, above the uppermost heat generating layer 58, and below the lowermost heat generating layer 58, respectively. An insulating layer may be provided. Further, the above-described electrical insulating regions provided between the heat generating layers 58 adjacent to each other in the thickness direction, above the uppermost heat generating layer 58 and below the lowermost heat generating layer 58 do not need to be open holes.

  However, the conductive paths 72 of the insulating layers adjacent in the thickness direction are connected to each other without being in contact with the heating element 62 of the heating layer 58. For this reason, each heat generating layer 58 has the pattern non-existing region (not shown). Thereby, the test signal passing through the conductive path 72 is not affected by the heating power passing through the power supply path 70.

  In the probe board 40 as described above, the wiring board 36 is formed by a plurality of screw members and appropriate members (all not shown) in a state where the upper surface of the ceramic substrate 56 is pressed toward the lower surface of the electrical connector 38. It is connected to the lower surface of the. Thereby, the lower ends of the connection pins 50 and 52 of the electrical connector 38 are pressed against the upper ends of the power supply path 70 and the conductive path 72, respectively, and are electrically connected to the power supply path 70 and the conductive path 72.

  Referring to FIGS. 1 and 2 again, the card holder 22 is made of a metal material such as stainless steel or a resin material such as polyimide, and has a ring-shaped peripheral portion 22a like an inward flange. And an upward step 22b extending inwardly from the lower end of the peripheral edge 22a. The step portion 22 b has a ring shape like an inward flange and receives the lower side of the outer peripheral edge portion of the wiring board 36.

  The probe card 16 includes the extension 34d of the reinforcing member 34 and the wiring board so that the outer peripheral edge of the wiring board 36 is received by the step 22b and the probe card 16 is positioned below the casing of the test head 20. The outer peripheral edge 36 is attached to the step 22b of the card holder 22 by a plurality of screw members (not shown).

  The card holder 22 is attached to the frame or casing of the test apparatus 10 via a card support mechanism (not shown) that changes the inclination of the card holder 22 with respect to the inspection stage 18.

  The card support mechanism described above is controlled by the card control unit 24 prior to the test, particularly prior to the test for one lot or the test of one object to be inspected. Change height or tilt. As a result, the probe card 16 is positioned so that the virtual needle tip surface formed by the needle tip of the contactor 14 is positioned at a predetermined height with respect to the wafer 12 received by the chuck top 76.

  The card support mechanism as described above is described in, for example, Japanese Patent Laid-Open Nos. 2002-14047 and 2007-183194.

  The inspection stage 18 moves the wafer 12 in a releasable vacuum state, that is, the chuck top 76 and the chuck top 76 in a three-dimensional manner relative to the probe card 16 in the front-rear direction, the left-right direction, and the up-down direction. In addition, a chuck top moving mechanism 78 that rotationally moves around the θ axis extending in the vertical direction is provided.

  The inspection stage 18 is moved in the front-rear and left-right directions with respect to the probe card 16 by a stage moving mechanism (not shown). As a result, the inspection stage 18 is prevented from moving in the front-rear and left-right directions while the wafer 12 is being tested, but in order to replace the wafer 12 for one lot to be tested, the inspection stage 18 is moved back and forth by the stage moving mechanism. It is moved left and right.

  In addition, the inspection stage 18 has a front / rear and a left / right direction by the above-described stage moving mechanism for exchanging the wafer 12 to be tested every time one wafer test is completed during the test of the wafer 12 for one lot. Moved in the direction. However, the wafer 12 to be tested may be replaced without moving the inspection stage 1 in the front-back and left-right directions during the test of the wafer 12 for one lot.

  Instead of providing the stage moving mechanism as described above, a function of moving the chuck top 76 by the chuck top moving mechanism 78 in the front-rear direction and the left-right direction may be used.

  Prior to the test of the wafer 12, the chuck top moving mechanism 78 is controlled by the stage control unit 26 to move the chuck top 76 three-dimensionally and rotationally move around the θ axis. As a result, the wafer 12 received by the chuck top 76 is positioned so that the electrode of the integrated circuit provided on the wafer 12 faces the needle tip of the contact 14.

  When the wafer 12 to be tested is exchanged, the chuck top 76 moves to a position where the wafer 12 does not contact the contact 14 before the inspection stage 18 is moved in the front-rear and left-right directions by the stage moving mechanism. The mechanism 78 is kept lowered.

  The test head 20 is a known one having a plurality of circuit boards in which a plurality of completed integrated circuits are arranged on a support board such as a wiring board, and a box for housing these circuit boards. Is arranged.

  In the illustrated example, the integrated circuit of each circuit board is electrically connected to the internal wiring 46 of the wiring board 36 via the wiring 80 and the connector 44. As a result, the integrated circuit on each circuit board is controlled by the test signal processing unit 28 during the actual test, and passes the test signal to the integrated circuit of the wafer 12 via the probe card 16.

  The transfer of the test signal between the contact 14 and the test signal processing unit 28 may be performed directly to the test signal processing unit 28 via the connector 24, or the test signal processing unit via the connector 24 and the test head 20. 28 may be performed.

  The test signal supplied to the predetermined terminal of the connector 44 is supplied to the predetermined contact 14 via the wiring board 36, the electrical connector 38, the ceramic substrate 56, and the internal wiring of the multilayer sheet 54. The response signal from the wafer 12 is supplied to the other terminal of the connector 44 through the internal wiring.

  The test signal processing unit 28 includes a test signal power source (not shown) for the test signal. The test signal power source is independent of the power source 32. In the illustrated example, the power source 32 acts as a power source for the power consuming member.

  The power source 32 supplies heating power to the power supply path 70 via a thermal fuse 82 provided on the ceramic substrate 56. Although not shown, the thermal fuse 82 is disposed in a heating current supply path from the power source 32 to the power supply path 70.

  Similar to a general electrical fuse, the thermal fuse 82 is disconnected when the temperature of the ceramic substrate 56 exceeds an allowable value, and interrupts the heating power supply path between the power source 32 and the power supply path 70. . Thereby, the safety of the probe card 16 is maintained.

  The power source 32 may be dedicated to the probe card 16. As such, it is possible to easily apply the above-described test apparatus 10, particularly the probe card 16, to an existing test apparatus. However, a circuit other than dedicated to the probe card 16 such as a tester power supply circuit may be used as the power source 32.

  The probe card 16 also includes a temperature sensor 84 and an overheat prevention member 86 disposed on the upper surface of the probe substrate 40, particularly the ceramic substrate 56, and a stage sensor 88 provided on the lower surface of the probe substrate 40, particularly the multilayer sheet 54. Including. These sensors 84 and 88 and the member 86 are connected to the heater control unit 34.

  The temperature sensor 84 detects the temperature of the probe card 16, particularly the probe substrate 56, and supplies an electric signal corresponding to the temperature of the probe substrate 56 to the heater control unit 34. The heater control unit 34 controls the power source 32 so as to output predetermined heating power based on a signal from the temperature sensor 84.

  The heater control unit 34 outputs a signal that causes the power source 32 to cut off the supply of heating power, particularly when the temperature of the probe substrate 56 exceeds an allowable value. Such a function of the heater control unit 34 further increases the safety of the probe card 16.

  The overheat prevention member 86 is a circuit interruption member such as an IC relay, a semiconductor relay, or a transistor, and is disposed in a heating power supply path. The heater control unit 34 determines whether or not the temperature of the probe board 56 exceeds an allowable value based on a signal from the temperature sensor 84. When the temperature exceeds the allowable value, the heater control unit 34 operates the overheat preventing member 86 to generate heating power. Shut off the supply path.

  As the overheat prevention member 86, a circuit interruption member such as a bimetal may be used instead of using the circuit interruption member as described above. In this case, when the temperature of the probe substrate 56 exceeds an allowable value determined by the circuit interrupting member, the circuit interrupting member itself opens to interrupt the heating power supply path. The heater control unit 34 confirms that the circuit breaker member has been opened.

  Regardless of the overheat prevention member 86 described above, the safety of the probe card 16 is maintained. As a result, the safety of the probe card 16 is doubled in combination with the fact that the temperature fuse 82 is opened due to the temperature of the probe board 56 exceeding the allowable value and the heating power supply path is shut off. .

  When the temperature of the probe board 56 exceeds the allowable value, the heater control unit 34 outputs a signal that causes the power source 32 to cut off the supply of heating power. Such a function of the heater control unit 34 further increases the safety of the probe card 16.

  The stage sensor 88 generates an electrical signal used to determine whether or not the inspection stage 18, in particular, the chuck top 76 is positioned near (particularly below) the probe substrate 40, and outputs the electrical signal to the heater control unit 34. To do. As the stage sensor 88, a capacitance sensor that detects an electric capacitance between the probe substrate 40 and the chuck top 76 can be used.

  When the chuck top 76 is not present below the probe card 16, the chuck top 76 is moved below the probe card 16, the wafer 12 is not supplied with a test signal, etc. It may be performed during an arbitrary period between untested times or may be performed during an arbitrary period between actual tests in which a test signal is supplied to the wafer 12.

  Depending on whether the chuck top 76 is in the vicinity of the probe card 16, whether the integrated circuit is being tested, and whether the probe card 16 has a predetermined temperature, it is supplied to the heating element 62. The amount of heating power is adjusted, and the temperature of the probe card 16 is adjusted. As a result, the probe card 16 is effectively heated.

  The heating element 62 of each heat generating layer 58 generates heat at each portion in the radial direction when supplied with heating power. As a result, the ceramic substrate 56, and thus the probe substrate 40, is heated at each location in the radial direction and the vertical direction, and is raised to a predetermined temperature. As a result, the probe substrate 40 is heated to a temperature at which the thermal expansion amount of the probe substrate 40 becomes equal to the thermal expansion amount of the integrated circuit on the wafer 12, and the test efficiency is remarkably improved.

  [First Example of Connecting Device for Heating Power]

  5 to 7, in the first embodiment, the heating power from the power source 32 is supplied from the bottom plate 94 of the test head 20 to the wiring board 36. In the first embodiment, female and male connectors 90 and 92 are used that are separably coupled for heating power.

  A space is formed between the wiring board 36 and the bottom plate 94, and a plurality of compression coil springs 95 (see FIG. 5) are arranged in the space.

  The female connector 90 is coupled to the wiring board 36 by means of a screw member, fitting or the like so as to be positioned in the space 34f of the reinforcing member 34 and rising from the wiring board 36. The connector 90 includes a plurality of pogo pins 96 each acting as a terminal of the connector 90. Each pogo pin 96 is a known member that urges upper and lower ends thereof in a direction away from each other by a spring force, and the pogo pin 96 is in contact with the power supply path 48 at its lower end.

  On the other hand, the male connector 92 supports the rod-shaped conductive portion 98 (see FIG. 6) in a state where the support portion 100 is vertically penetrated by the support portion 100 made of an electrically insulating material. It is held in a protective cylinder 102 made of an electrically insulating material.

  The connector 92 has a plurality of screw members on the bottom plate 94 such that a part of the protective cylinder 102 extends downward in the space 34f of the reinforcing member 34 and the lower surface of the conductive portion 98 contacts the upper end portion of the corresponding pogo pin 96. And bonded by means such as adhesion.

The first conductive portion 98 corresponds to the pogo pin 96 that is the second conductive portion, and is provided at the same pitch as the pogo pin 96 so that the upper end of the corresponding pogo pin 96 contacts the lower surface. . The upper end portion of each conductive portion 98 is electrically connected to the lower end portion of the heating power wiring path 104.

  Instead of the conductive part 98, the wiring path 104 may be extended to the lower end of the support part 100, and the lower end part of the wiring path 104 may be used as a conductive part, or a conductive terminal corresponding to the pogo pin 96 is supported. The terminal may be a conductive portion by being provided on the lower surface of the portion 100 and electrically connecting the terminal to the wiring path 104. Further, the protective cylinder 102 may be omitted.

  Each wiring path 104 is coupled to the support portion 100 so as to protrude upward from the support portion 100, and is connected to the power source 32 via the heating power wiring 105 shown in FIG. 1. The heating power is supplied to the pogo pins 96 via the wiring path 104 and the support part 100.

  The pogo pins 96 act as connecting portions or terminals for heating power on the wiring board 36 side, the conductive portions 98 act as connecting portions or terminals for heating power on the bottom plate 94 side, and the bottom plate 94 is a plate-like member. Acts as

  The connector 90 also includes an electrical insulator 106 supported on the wiring board 36. The electrical insulator 106 has a recess 108 opened upward. Lower portions of the support portion 100 and the protective cylinder 102 are removably received in the recess 108 from above.

  In the illustrated example, each pogo pin 96 extends vertically in the electrical insulator 106 and is supported by the electrical insulator 106 such that the upper end protrudes into the recess 108, and the lower end is used for heating power. Is connected to the heating element 62 through the connection pin 52 and the power supply path 70 (see FIG. 2).

  Instead of the pogo pins 96, pin members, protrusions, or the like may be used. The connector 90 may be a male type and the connector 92 may be a female type. Further, the connector 90 may be disposed on the bottom plate 94 side, and the connector 92 may be disposed on the wiring board 36 side. In the latter case, the support portion 100 is connected to the power supply path 48 in the wiring board 36, and the pogo pin 96 is electrically connected to the wiring path 104.

  In the illustrated example, the bottom plate 94 is manufactured from the amount of the electrically insulating material. However, only the periphery of the connector 92 and the wiring path 104 may be made of the electrically insulating material.

  When the probe card 16 is disposed on the bottom surface of the bottom plate 94, the heating power is supplied from the power source 32 shown in FIG. 1 to the wiring path 104, the conductive portion 98, the pogo pin 96, the feeding path 48, the connection pin 52, and the feeding path 70. It becomes possible to supply to the heating element 62 via.

  Further, the pogo pin 96 and the conductive portion 98 are opposed to each other by the spring force of the pogo pin 96 so as to be opposed to each other through the opening provided in the cover 42 in a state where the probe card 16 is disposed on the bottom surface of the bottom plate 94. Has been. Thereby, the pogo pin 96 and the electroconductive part 98 are electrically connected reliably. As a result, the heating power is efficiently supplied to the heating element 62, and the probe card 16 is raised to a predetermined temperature in a short time.

  Contrary to the above, the pogo pin 96 and the conductive portion 98 may be disposed on the connectors 92 and 90, respectively. In this case, the connectors 90 and 92 may be disposed on the bottom plate 94 and the wiring board 36, respectively.

  [Second Embodiment of Connecting Device for Heating Power]

  With reference to FIGS. 8 to 10, the second embodiment also supplies the heating power from the power source 32 from the bottom plate 94 of the test head 20 to the power supply path 48 of the wiring board 36. The second embodiment also uses male and female connectors 110 and 112 that are separably coupled for heating power.

  A space is formed between the wiring board 36 and the bottom plate 94, and a plurality of compression coil springs 95 shown in FIG. 5 are arranged in the space.

The male connector 110 is coupled to the wiring board 36 by means of a screw member, fitting or the like in a state where the male connector 110 is positioned in the space 34f of the reinforcing member 34 and rises from the wiring board 36. It acts as a second connection portion that is a power connection portion.

The connector 110 includes an electrically insulating main portion 114 coupled to the upper surface of the wiring board 36, and a plurality of conductive portions 116 penetrating the main portion 114 in the vertical direction. In the illustrated example, each conductive portion 116 is a conductive via and acts as a terminal of the connector 110. Therefore, the main portion 114 functions as a support portion that supports the conductive portion 116 of the second connection portion.

The female connector 112 is disposed on the bottom plate 94 side, and acts as a first connection portion that is a heating power connection portion on the bottom plate 94 side.

  The connector 112 includes a plurality of wiring paths 118 supported by the bottom plate 94, a wiring path securing member 120 spaced apart from the bottom plate 94, and a wiring path securing member 120 so as to penetrate the bottom plate 94 in the vertical direction. A plurality of pogo pins 122 supported by the wiring path securing member 120 in a state of penetrating in the vertical direction, and a plurality of connection members 124 that electrically connect the wiring paths 118 and the pogo pins 122 are provided.

  Each wiring path 118 is formed of pogo pins, pin members, conductive vias, combinations thereof, and the like. Further, the lower end is brought into contact with the upper end of the connection member 124, and the upper end is above the bottom plate 94. It is protruding. The upper end portion of each wiring path 118 is connected to the power source 32 via the heating power wiring 105 shown in FIG.

The wiring path securing member 120 is made of an electrically insulating material and has a recess 126 that opens downward to receive the upper end of the connector 110. The pogo pin 122 extends vertically through the bottom of the recess 126 and contacts the lower end of the connection member 124. Therefore, the wiring route securing member 120 acts as an electrical insulator of the first connection portion that supports the pogo pin 122 so as to protrude downward.

  The wiring path securing member 120 is disposed below the bottom plate 94 via a plurality of compression coil springs 128. For this reason, the wiring path securing member 120 receives the upper end of the connector 110 in the recess 126 and presses the lower end of the pogo pin 122 against the upper end of the conductive portion 116.

  In the state where the probe card 16 is disposed on the bottom surface of the bottom plate 94, the heating power is supplied from the power source 32 shown in FIG. 1 to the wiring path 118, the connection member 124, the pogo pin 122, the conductive portion 116, the power supply path 48, and the connection pin. The heat generating body 62 can be supplied via the power supply path 52 and the power supply path 70.

  Further, in a state where the probe card 16 is disposed on the bottom surface of the bottom plate 94, the conductive portion 116 and the pogo pin 122 are vertically opposed to each other through the opening provided in the cover 42, and the pogo pin 122 and the compression coil spring 128 are They are pressed against each other by the spring force. Thereby, the electroconductive part 116 and the pogo pin 122 are electrically connected reliably. As a result, the heating power is efficiently supplied to the heating element 62, and the probe card 16 is raised to a predetermined temperature in a short time.

  In the case of the test apparatus using the probe card 16 that does not include the connector 110 as described above, the wiring path securing member 120 is pressed against the upper surface of the cover 42 by the compression coil spring 128. In such a test apparatus, if each connecting member 124 is formed of a linear member that can be elastically deformed, as shown in FIG. 10, the wiring between the bottom plate 94 and the cover 42 is maintained at a predetermined value. The path securing member 120 is displaced toward the bottom plate 42 against the spring force of the compression coil spring 128.

  As a result, the pogo pin 122 is displaced to the bottom plate 42 side together with the wiring path securing member 120 and is not pressed against the cover 42. Therefore, even if the heating power is accidentally supplied to the pogo pin, the probe card 16 has the heating power. Not affected.

  The conductive portion 116 and the pogo pin 122 may also be disposed on the connectors 112 and 110, respectively, contrary to the above. In this case, the connectors 110 and 112 may be disposed on the bottom plate 94 and the wiring board 36, respectively.

  [Third Example of Connecting Device for Heating Power]

  Referring to FIG. 11, in the third embodiment, the heating power from the power source 32 is supplied from the card holder 22 to the power supply path 48 of the wiring board 36.

Third, in the embodiment, a plurality of first conductive portions 130 each connected to the power supply path 52 shown in FIG. 2 are provided on the wiring board 36, and each is connected to the first conductive portion 130. A plurality of pogo pins 132, which are second conductive portions, are provided in a state of penetrating the card holder 22 through the step portion 22b in the vertical direction.

  The conductive portion 130 is a conductive flat land, and is provided on the lower surface of the wiring substrate 36 so as to face the stepped portion 22b.

  On the other hand, the pogo pin 132 is known in the same manner as the previously described pogo pin, and the stepped portion is in a state where the upper end portion is located below the upper surface of the stepped portion 22b and is located below the conductive portion 130. 22b. The lower end portion of each pogo pin 132 is connected to the power source 32 via the heating power wiring 136 and the heating power wiring 105 shown in FIG.

  The probe card 16 is attached to the step 22b with the outer peripheral edge of the wiring board 36 being received by the step 22b. The step portion 22b has a recess 134 that receives all the conductive portions 130 in a state where the probe card 16 is placed on the step portion 22b.

  The recess 134 is formed by a frame member 138 that opens upward. The frame member 138 is made of an electrically insulating material, and is coupled to the step portion 22b so that the recess 134 opens upward. In this case, the pogo pin 132 also penetrates the frame member 138 in the vertical direction, and the upper end portion protrudes into the recess.

  However, the frame member 138 having a height dimension substantially the same as the thickness dimension of the stepped portion 22b may be used, and the frame member 138 may be arranged on the stepped portion 22b so as to penetrate the stepped portion 22b in the vertical direction.

  In any of the above cases, the frame member 138 has the function of a connector together with the pogo pin 132 because the conductive portion 130 is received in the recess 134. The conductive portion 13 contacts the upper end of the pogo pin 132 in a state where the conductive portion 13 is received in the recess 134.

  Each conductive part 130 and each pogo pin 132 act as first and second connection parts, respectively. In addition, the portions of the first and second contact portions that are in contact with each other function as first and second terminals, respectively.

  In a state where the probe card 16 is received by the card holder 22, the heating power generates heat from the power source 32 shown in FIG. 1 via the heating power wiring 136, the pogo pin 132, the conductive portion 130, the power supply path 48, and the like. The body 62 can be supplied.

  In a state where the probe card 16 is received by the card holder 22, the conductive portion 130 and the pogo pin 132 are opposed to each other in the vertical direction and are pressed against each other by the spring force of the pogo pin 132. Thereby, the electroconductive part 130 and the pogo pin 132 are electrically connected reliably. As a result, the heating power is efficiently supplied to the heating element 62, and the probe card 16 is raised to a predetermined temperature in a short time.

  In the embodiment shown in FIG. 11, the upper end of the pogo pin 132 is retracted into the recess 134, so that even if a probe card without the conductive portion 130 is placed in the card holder 22, each probe 132 is not Such a probe card, especially a wiring board is not contacted.

  The conductive portion 130 and the pogo pin 132 may also be disposed on the stepped portion 22b and the wiring board 36, respectively, contrary to the above. Further, the conductive portion 130 may be a male connector, and the frame member 138 may be a female connector that receives the male connector. In the latter case, the pogo pin 132 or another pin may be used as a terminal for one of the male and female connectors, and the conductive portion may be used as a terminal for the other.

  [Fourth Example of Connecting Device for Heating Power]

  Referring to FIG. 12, the fourth embodiment also supplies the heating power from the power source 32 from the card holder 22 to the power supply path 48 of the wiring board 36. The fourth embodiment uses male and female connectors 140 and 142 that are separably coupled for heating power.

  The male connector 140 is coupled to the wiring board 36 so as to fall from the wiring board 36, and acts as a heating power connecting portion on the wiring board 36 side. The connector 140 includes an electrically insulating main portion 144 coupled to the lower surface of the wiring board 36, and a plurality of conductive portions 146 that penetrate the main portion 144 in the vertical direction and are connected to the wiring path 48 of the wiring substrate 36. Is provided. Each conductive portion 146 functions as a terminal of the connector 140.

  The female connector 142 is disposed on the side of the step portion 22b of the card holder 22 and acts as a heating power connecting portion on the card holder 22 side. The connector 142 includes an electrically insulating main portion 148 coupled to the upper portion of the step portion 22b, and a plurality of connectors 142 supported by the main portion 148 and the step portion 22b so as to penetrate the main portion 148 and the step portion 22b in the vertical direction. Wiring path 150.

  The main portion 148 includes a recess 152 that opens upward to receive the main portion 144 of the connector 140. Each wiring path 150 is formed of pogo pins, pin members, conductive vias, combinations thereof, and the like, and penetrates the main portion 148 and the step portion 22b in the vertical direction.

  The upper end portion of each wiring path 150 is in contact with the lower end portion of the conductive portion 146, and thus acts as a terminal portion. The lower end portion of each wiring path 150 is exposed on the lower surface of the stepped portion 22b and connected to the heating power wiring 136. Each heating power wiring 136 is connected to the power source 32 via the heating power wiring 105 shown in FIG.

  In a state where the probe card 16 is received by the card holder 22, the heating power is supplied from the power source 32 shown in FIG. 1 via the heating power wiring 136, the wiring path 150, the conductive portion 146, the power feeding path 48, and the like. It is supplied to the heating element 62.

  In the state where the probe card 16 is received by the card holder 22, the conductive portion 146 and the wiring path 150 are opposed to each other in the vertical direction and are connected to each other. Thereby, the heating power is efficiently supplied to the heating element 62, and the probe card 16 is raised to a predetermined temperature in a short time.

  Also in the embodiment shown in FIG. 12, since the upper ends of the respective wiring paths 150 are retracted into the recesses 152, even if a probe card not equipped with the connector 140 is arranged in the card holder 22, each wiring path 150 is It does not contact such a probe card, especially a wiring board.

  The connectors 140 and 142 may also be disposed on the stepped portion 22b and the wiring board 36, respectively, contrary to the above.

  In any of the above embodiments, the male connector and the female connector are separably fitted to the female connector. However, the terminal may be of a mutual fitting type in which either one of the male connector and the female connector is separably fitted to the other terminal, or both terminals are in contact with each other. The mutual contact type may be used.

  The heat generation layer 58 is not necessarily a multilayer, and may be a single layer. Further, the heat generating layer 58 may be provided on a substrate other than the ceramic substrate 56. Furthermore, instead of using the heating element 62 having a pattern shape as in the illustrated example, a heating element having another shape or structure may be used.

  The present invention stores information on the type and performance of the probe card 16 and electronic components such as IC relays and capacitors arranged on the wiring board 36 (see Patent Document 2) instead of the heating element 62 as a power consuming member. Thus, the present invention can also be applied to a test apparatus using a memory (see Patent Document 3) disposed on the probe card 16 and a mechanical instrument such as a cooling fan disposed on the probe card 16 as a power consuming member.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 10 Test apparatus 12 Semiconductor wafer 14 Contact 16 Probe card 18 Inspection stage 20 Test head 22 Card holder 34 Reinforcement member 36 Wiring board 38 Electrical connector 40 Probe board 42 Cover 44 Connector for test signal 46 Internal for test signal of wiring board Wiring 48 Power supply path for heating power of wiring board 50, 52 Connection pin 54 Multilayer sheet 56 Ceramic substrate 58 Heat generation layer 60 Conductive layer for test signal of ceramic substrate 62 Heat generating element 64, 68 Ceramic layer 66 Wiring for test signal of ceramic substrate 70 Power supply path for heating power of ceramic substrate 72 Conductive path for test signal of ceramic substrate 76 Chuck top 78 Moving mechanism 80 Test signal wiring 82 Fuse 84, 86, 88 Sensor 90, 92, 110, 112 Connector 94 Bottom plate 96 Pogo 98 Conductive part 100 Support part 102 Protection cylinder 104 Wiring path 106 Electrical insulator 108, 126 Recess 114 Main part 116, 130 Conductive part 118 Wiring path 120 Wiring path securing member 122 Pogo pin 124 Connection member 128 Compression coil spring 132 Pogo pin 134,152 Recess 136 Heating power wiring 140,142 Connector 144,148 Main part 146 Conductive part 150 Wiring path

JP-A-4-359445 WO2007-141867A1 JP 2007-183193 A

Claims (9)

A probe card including a wiring board, a probe board disposed on the lower side of the wiring board and having contact terminals disposed on a lower surface thereof, and a power consuming member disposed on the wiring board or the probe board;
A plate-like member arranged on the upper side of the probe card;
A first connecting portion disposed on one of the wiring board and the plate-like member, the first connecting portion having a first terminal electrically connected to the power consuming member;
A second connecting portion disposed on the other of the wiring board and the plate-like member, the second connecting portion having a second terminal electrically connected to the first terminal portion;
A power source for a power consuming member that supplies power to the power consuming member via the first and second terminals,
The first and second terminals are positioned in a vertical relationship with each other;
The first terminal includes a first conductive portion, and the second terminal includes a second conductive portion that contacts the first conductive portion at one end thereof,
The first connection portion is further an electric insulator supported by the one of the wiring board and the plate-like member, and the first conductive portion is electrically insulated by the first conductive portion. An electric insulator that supports the electric insulator so as to protrude from above or below the electric insulator;
The second connection part is a support part arranged on the other side of the wiring board and the plate-like member, and supports the second conductive part, and the second conductive part. A wiring path that is electrically connected to the part, and is connected to the support part or the second conductive part in a state of protruding upward from the support part,
The electrical insulator has a recess for receiving the support;
The first conductive portion of the first connection portion includes a pogo pin,
The plate-shaped member further includes a wiring path that penetrates the plate-shaped member in the vertical direction and is electrically connected to the pogo pin,
The first connection portion further includes a wiring path securing member disposed on the plate-like member via an elastic body,
The pogo pin extends vertically through the wiring path securing member and is electrically connected to the conductive portion and the wiring path . A probe card including a wiring board, a probe board disposed on the lower side of the wiring board and having contact terminals disposed on a lower surface thereof, and a power consuming member disposed on the wiring board or the probe board;
A card holder for receiving the probe card;
A first connecting portion disposed on one of the wiring board and the card holder, the first connecting portion having a first terminal electrically connected to the power consuming member;
A second connecting portion disposed on the other of the wiring board and the card holder, the second connecting portion having a second terminal electrically connected to the first terminal portion;
A power source for a power consuming member that supplies power to the power consuming member via the first and second terminals,
The first and second terminals are positioned in a vertical relationship with each other;
The first terminal includes a first conductive portion, and the second terminal includes a second conductive portion that contacts the first conductive portion at one end thereof,
The second connection portion is further an electrical insulator disposed on the other of the wiring board and the card holder, and supports the second conductive portion, and the second conductive portion. A wiring path electrically connected to the sex part,
The electrical test apparatus for an integrated circuit, wherein the electrical insulator has a recess for receiving the second conductive portion, and an upper end of the second conductive portion is retracted into the recess. Furthermore, a test signal processing unit for generating a test signal, including a test signal processing unit including a test signal power source,
The probe card further includes a ceramic substrate, a multilayer wiring sheet disposed on the lower side of the ceramic substrate, and a plurality of contacts disposed on the lower surface of the multilayer wiring sheet so as to be in contact with the electrodes of the device under test. And
The wiring board includes a third connection portion having a plurality of third terminals for receiving the test signal from the test signal power source,
The test according to claim 1 or 2, wherein the third terminal is electrically connected to the contact through an internal wiring provided on the wiring board, the ceramic substrate, and the multilayer wiring sheet. apparatus.   The test apparatus according to claim 1, wherein the wiring board has a power supply path electrically connected to the first terminal.   The first connection portion includes one of a male connector and a female connector that are detachably coupled, and the second connection portion includes the other connector of the male and female types, The test apparatus according to claim 1 or 2. The wiring board has a plurality of power supply paths,
The first connection portion has a plurality of the first terminals,
The second connection portion has a plurality of the second terminals,
The test apparatus according to claim 1, wherein each power supply path is electrically connected to the power consuming member and the first terminal.   The probe card further includes a reinforcing member disposed on the wiring board, the reinforcing member having a space that opens up and down, and the first and second connecting portions are at least partially at least partially The test apparatus according to claim 1, wherein the test apparatus is received in a space. The test apparatus according to claim 1 , wherein the wiring path securing member has a recess that receives an upper end portion of the first connection portion.   The power consuming member includes a heating element disposed inside the ceramic substrate, an electronic component disposed on the wiring substrate, a memory disposed on the probe card, and a mechanical device disposed on the probe card. The test apparatus according to claim 3, comprising at least one selected from:

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