JP5256518B2 - Semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device and a manufacturing method thereof, and more specifically to a semiconductor device that can cope with a change in arrangement of pin terminals and screw block terminals that serve as electrodes and a manufacturing method thereof.

Semiconductor devices used for inverter drive of industrial equipment have various forms corresponding to the number of switching elements such as IGBTs (Insulated Gate Bipolar Transistors) and the number of packages. The 1 in 1 represents a semiconductor device in which one switching element is mounted in one package, and 2 in 1 represents a semiconductor device in which two switching elements are mounted in one package. 7in1 represents a semiconductor device in which a total of seven switching elements including six switching elements for three-phase inverter applications and one switching element for brake applications are mounted in one package.

  In addition, screw block terminals and pin terminals are attached to these semiconductor devices (for example, power semiconductor packages) in order to connect to external devices and the like. The semiconductor device employs a structure in which the mounting positions of the screw block terminals and pin terminals can be easily changed according to the form. That is, the case member constituting the package of the semiconductor device is formed with a wall-like fixing member extending from the side wall portion at a predetermined interval in order to provide a plurality of fixing positions along the periphery. The screw block terminal and the pin terminal are fixed by a fixing member located at a predetermined position corresponding to the form. As documents disclosing the semiconductor device in which the screw block terminal is fixed to the case member, there are, for example, Japanese Unexamined Patent Application Publication No. 2008-10656 (Patent Document 1) and Japanese Unexamined Patent Application Publication No. 2008-130984 (Patent Document 2).

JP 2008-10656 A JP 2008-130984 A

  Japanese Patent Application Laid-Open Nos. 2008-10656 and 2008-130984 disclose a block main body, a nut fixed to the block main body, and an electrode that is held by the block main body and electrically connects the nut and the semiconductor mounting substrate. A semiconductor device is disclosed in which a screw block terminal having the following is electrically connected to a semiconductor mounting substrate. However, the screw block terminal in each of the above documents does not take measures against problems caused by thermal stress generated by a temperature cycle applied to the semiconductor device when the screw block terminal is used.

  For example, a screw terminal (screw block terminal) disclosed in Japanese Patent Application Laid-Open No. 2008-10656 is formed by fitting a hole formed in an electrode and a protrusion formed in a screw terminal main body so that the screw terminal is It is possible to prevent the electrode from being displaced or floated due to thermal stress during assembly. This is because the protrusions and the holes interfere with each other to prevent the electrodes from being displaced or lifted. Here, “floating” refers to a phenomenon in which the electrode floats upward with respect to a desired position with respect to the screw terminal body or the semiconductor mounting substrate.

  In addition, the screw block terminal disclosed in Japanese Patent Application Laid-Open No. 2008-130984 is provided with a protruding contact portion for suppressing the stress tightened with a bolt when an external terminal is attached to a nut from being concentrated in one place. However, in any of the screw block terminals disclosed in any document, consideration is not given to a temperature cycle particularly in use after assembly.

  For example, in the screw terminal disclosed in Japanese Patent Application Laid-Open No. 2008-10656, even when a temperature cycle is applied when the semiconductor device is used, the displacement of the electrode is suppressed by the protruding portion of the screw terminal body.

  In a module (power semiconductor package) using a base plate made of a metal material such as copper or aluminum, the base plate is relatively easily deformed by a temperature cycle during use. However, the semiconductor mounting substrate made of an insulating material such as a resin material or ceramic disposed on the base plate has a relatively small amount of deformation due to a temperature change. For this reason, a particularly large thermal stress is applied to the connection portion of the semiconductor mounting substrate with the screw terminal electrode. When a large thermal stress is repeatedly applied to the connecting portion due to the application of a temperature cycle, the electrode cannot follow the deformation of the base plate particularly when the displacement amount of the electrode is small. Then, a defect such as a crack may occur in the semiconductor mounting substrate at the connection portion between the electrode and the semiconductor mounting substrate.

  In addition, the screw block terminal disclosed in Japanese Patent Application Laid-Open No. 2008-130984 is not originally configured with consideration given to the application of a temperature cycle and thermal stress.

  The present invention has been made to solve the above problems. The purpose is to suppress the displacement and floating of the electrode due to heating during assembly of the module, and stress due to the temperature cycle during use of the module, particularly at the junction between the substrate and the electrode. It is an object of the present invention to provide a semiconductor device in which concentration is suppressed and a manufacturing method thereof.

A semiconductor device according to the present invention includes a semiconductor mounting substrate, a housing having an opening and accommodating the semiconductor mounting substrate, and a terminal fixed at a peripheral edge constituting the opening and electrically connected to the semiconductor mounting substrate. A semiconductor device is provided. The terminal includes a terminal main body and an electrode held by the terminal main body and electrically connected to the semiconductor mounting substrate. The electrode is movable in a first direction intersecting the main surface of the semiconductor mounting substrate, and is held by the terminal body so that the electrode is held by the terminal body when the electrode is incorporated into the terminal body. The terminal body has a protrusion. The electrode has a first electrode portion formed with a first hole extending in the first direction and a main surface facing the main surface of the semiconductor mounting substrate that is bent with respect to the first electrode portion. And a second electrode portion. The protrusion is fitted into the first hole, and the length of the first hole in the first direction is 400 μm or more longer than the length of the protrusion in the first direction.

  The manufacturing method of the semiconductor device according to the present invention includes a step of forming each member constituting the semiconductor device and a step of assembling the members. The step of forming includes a step of forming a terminal. The step of forming the terminal includes a step of preparing a terminal main body and an electrode, and a step of assembling the terminal main body and the electrode to complete the terminal. When preparing the electrode in the preparing step, the main surface of the first electrode portion is attached to the first electrode portion extending in the first direction intersecting the main surface of the semiconductor mounting substrate on which the terminal is mounted. A through hole for positioning is formed. In the step of assembling the members, the electrode is positioned with respect to the terminal body using a jig that penetrates the positioning hole.

  ADVANTAGE OF THE INVENTION According to this invention, the semiconductor device with which the stress concentration resulting from the temperature cycle at the time of use is suppressed especially in the junction location of a board | substrate and an electrode is provided. This is because the electrodes constituting the terminals of the semiconductor device are held so as to be movable in the first direction intersecting the main surface of the semiconductor mounting substrate, that is, the direction along which the floating occurs. . Accordingly, it is possible to suppress the substrate from being damaged at the junction.

  Further, according to the manufacturing method of the present invention, the semiconductor device is assembled in a state where the jig is passed through the hole formed in the electrode portion. Therefore, since the jig suppresses the occurrence of displacement and floating of the electrode, the position of the electrode can be precisely controlled even during assembly. As mentioned above, according to this invention, the semiconductor device which can suppress the malfunction at the time of an assembly and use can be provided.

It is a top view which shows the structure of the power semiconductor package in Embodiment 1 of this invention. It is a perspective view which shows typically the fixing method of the terminal in the power semiconductor package of FIG. FIG. 2 is an enlarged view near a fixing member in the power semiconductor package of FIG. 1. It is a perspective view which shows the structure of the screw block terminal in the power semiconductor package of FIG. It is sectional drawing which shows a mode that the screw block terminal of FIG. 4 is fixed to the power semiconductor package of FIG. It is a bottom view of the screw block terminal of FIG. It is a perspective view which shows the structure of the one modified example different from FIG. 4 of the screw block terminal in Embodiment 1 of this invention. It is a perspective view which shows the structure of the other modification different from FIG. 7 of the screw block terminal in Embodiment 1 of this invention. It is a perspective view which shows the structure of the further another modified example different from FIG. 8 of the screw block terminal in Embodiment 1 of this invention. It is a perspective view which shows the structure of the screw block terminal in Embodiment 2 of this invention. It is sectional drawing which shows a mode that the screw block terminal of FIG. 10 is fixed to the power semiconductor package of FIG. It is a perspective view which shows the process in which the screw block terminal in Embodiment 3 of this invention is connected to a semiconductor mounting substrate. It is a perspective view which shows the structure of the screw block terminal in Embodiment 3 of this invention. It is sectional drawing which shows a mode that the screw block terminal of FIG. 13 is fixed to the power semiconductor package of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each embodiment, elements having the same function are denoted by the same reference numerals, and the description thereof will not be repeated unless particularly necessary.

(Embodiment 1)
1 and 2, a power semiconductor package as a semiconductor device in the present embodiment includes a base plate 5, a semiconductor mounting substrate (insulating substrate) 1 placed thereon, and a base plate 5. A fixed mother case 11 as a housing, a fixing member 21, a screw block terminal 31 and a pin terminal 51 as terminals are provided. The base plate 5 is made of a material having excellent heat dissipation such as copper or copper alloy, and the semiconductor mounting substrate 1 is placed thereon. The semiconductor mounting substrate 1 is made of an insulating substrate such as ceramic, and a copper foil or copper plate wiring pattern is formed on its surface, and a power semiconductor element or the like is fixed on the wiring pattern. The mother case 11 is substantially rectangular and has an opening 13. By fixing the mother case 11 to the base plate 5, the semiconductor mounting substrate 1 is accommodated in the opening 13. The peripheral edge 12 constituting the opening 13 mainly has four peripheral edges 12a to 12d. The peripheral edges 12a and 12c and the peripheral edges 12b and 12d are parallel to each other. The fixing member has a plurality of fixing positions 22, and each of the plurality of fixing positions 22 is formed along each of the peripheral edges 12a to 12d. Each of the screw block terminal 31 and the pin terminal 51 is fixed at the peripheral edge 12 and is fixed by using a fixing member 21 at an arbitrary fixing position 22. In FIG. 1, twelve pin terminals 51 are arranged at equal intervals in a set of two on the peripheral edge 12a, and two screw block terminals 31 are arranged on the peripheral edge 12b. Four screw block terminals 31 are arranged at equal intervals on the peripheral edge 12c, and two pin terminals 51 are arranged in pairs on the peripheral edge 12d. The screw block terminal 31 is electrically connected to the semiconductor mounting substrate 1 by an electrode 32 included in the screw block terminal 31 itself, and the pin terminal 51 is electrically connected to the semiconductor mounting substrate 1 by a wire (not shown).

  1 to 3, the fixing member 21 includes a plurality of wall main bodies 23 a, a plurality of connection portions 23 b, and a bottom portion 23 c. Each of the plurality of wall main bodies 23 a extends in parallel with the peripheral edge 12, and is arranged at equal intervals along the peripheral edge 12. Each of the plurality of connecting portions 23 b connects each of the plurality of wall main bodies 23 a and the peripheral edge 12, and is arranged along the peripheral edge 12 at equal intervals. A plurality of wall main bodies 23a and peripheral edges 12 form grooves, and the grooves are partitioned into a plurality of fixed positions 22 by a plurality of connecting portions 23b. The bottom 23c is in the horizontal direction and extends on the opposite side of the peripheral edge 12.

  The bottom portion 23 c has a thick portion 24 and a thin portion 25. Each of the thin portions 25 is formed at a position corresponding to each of the plurality of fixed positions 22, and the thick portion 24 is formed between the thin portions 25. That is, the thick part 24 and the thin part 25 are alternately formed along the peripheral edge 12.

  The mother case 11 and the fixing member 21 are made of, for example, a thermoplastic resin. Specific examples of the resin material include PPS (polyphenylene sulfide) and PBT (polybutylene terephthalate).

  The screw block terminal in FIG. 5 is shown in a cross-sectional view along the line VV in FIG. 4 and 5, the screw block terminal 31 (terminal) of the present embodiment includes a screw terminal main body 35 (terminal main body), a nut 34, an electrode 32, and a protrusion 38. Yes. As shown in FIG. 4, the screw terminal main body 35 has a substantially rectangular parallelepiped shape that has a projecting portion 35 a that projects forward and extends downward. The screw terminal main body 35 of FIG. 4 has a region where the screw terminal main body 35 is cut through at a part below the depth side, and the cutout portion on the base side of the overhang portion 35a has an R shape. . However, the screw terminal main body 35 is not limited to such a shape, and may have a configuration that does not have the above-described indented region, and the cut-out portion has a rectangular parallelepiped shape instead of an R shape. Also good.

  The nut 34 is fixed to the hollow portion 36, and the electrode 32 is disposed on the upper surface of the rectangular parallelepiped portion of the screw terminal body 35. The electrode 32 covers the nut 34 and has an opening 33 coaxial with the nut 34. The electrode 32 passes through the inside of the overhanging portion 35a, and the tip end portion 37 extends forward and downward of the overhanging portion 35a, and is held by the overhanging portion 35a. The protruding portion 38 extends from the overhanging portion 35a toward a side surface (side surface 35b in FIG. 6) in which a rectangular parallelepiped portion of the screw terminal body 35 is pierced in an R shape, and the tip thereof is the vertical direction in FIG. Has spread. The protrusion 38 has a shape corresponding to the fixed position 22 (FIG. 3) in plan view. In addition, in FIG. 6, the front-end | tip part 37 is shown typically and the dimension of the vertical direction differs from actual.

  In particular, referring to FIG. 5, the screw block terminal 31 is fixed to the mother case 11 by fitting (press-fitting) the protrusion 38 into the desired fixing position 22 from above. In a state where the screw block terminal 31 is fixed, the tip portion 37 of the electrode 32 is in contact with the semiconductor mounting substrate 1, and a part of the overhang portion 35a is disposed on the bottom portion 23c. As a result, the nut 34 and the semiconductor mounting substrate 1 are electrically connected. The screw block terminal 31 extends from the fixed position 22 to the side of the mother case 11 across the periphery 12. The screw terminal main body 35 and the protrusion 38 are made of the same resin.

  Note that the tip portion 37 bent in a staircase shape is in a state where the left side in FIG. 4 is partially missing. However, the tip portion 37 is not limited to such a shape, and may be, for example, a mode in which a missing region does not exist, or a mode in which the right side in FIG.

  Here, with particular reference to FIGS. 4 and 5, the electrode 32 is made of a structure in which a metal material such as copper, copper alloy, nickel, nickel alloy or the like has a flat plate shape. The structure is bent at several places. Since the flat plate has such a bent shape, the electrode 32 is easily held by the screw terminal body 35.

  Further, a claw 42 in which the screw terminal body 35 is bent toward the electrode 32 is formed on the side surface of the protruding portion 35 a of the screw terminal body 35. The claw 42 functions as a gripping part (first gripping part) that grips an end of the electrode 32 (first electrode part), and the electrode 32 and the claw 42 are engaged. Thereby, the electrode 32 is held by the screw terminal body 35.

  Of the electrodes 32 bent as described above, the opening 33 has a direction (for example, perpendicular) that intersects the main surface of the semiconductor mounting substrate 1 when the screw block terminal 31 is connected to the semiconductor mounting substrate 1 ( A hole 41 (first hole) penetrating the first electrode part is formed in a part of the first electrode part extending in the first direction). Here, the electrode 32 is bent with respect to the first electrode portion, and extends along the main surface of the semiconductor mounting substrate 1 (for example, parallel) when the screw block terminal 31 is connected to the semiconductor mounting substrate 1. A region extending in the direction (second direction) is referred to as a second electrode portion. Here, the main surface refers to the main surface having the largest area among the surfaces.

  The screw terminal main body 35 is made of, for example, a thermoplastic resin, for example, like the mother case 11 and the fixing member 21. Specific examples of the resin material include PPS (polyphenylene sulfide) and PBT (polybutylene terephthalate). The screw terminal main body 35 has a main body protrusion 40 (protrusion). The main body protrusion 40 is made of the same material as that of the screw terminal main body 35 and has a shape in which a part of the outer surface of the screw terminal main body 35 is raised in a convex shape.

  The main body protrusion 40 is preferably formed on a part of the outer surface of the screw terminal main body 35 extending in the first direction. In other words, when the screw block terminal 31 is assembled, it is preferably formed on a part of the outer surface of the screw terminal body 35 that extends in the first direction and contacts the first electrode portion.

  Both the main body protrusion 40 and the hole 41 are formed to have, for example, a circular shape or an elliptical shape in plan view of the first electrode portion. However, it is not limited to these shapes, and may be formed to have a rectangular shape, for example. The main body protrusion 40 and the hole 41 are preferably formed so that the main body protrusion 40 is positioned in the hole 41 when the screw block terminal 31 is assembled. In other words, the main body protrusion 40 and the hole 41 are preferably formed so as to face each other.

  Here, the length of the hole 41 in the first direction is preferably 400 μm or more and 800 μm or less longer than the length of the main body protrusion 40 in the first direction. However, in FIGS. 2 and 4, the length of the hole 41 in the first direction is slightly exaggerated and illustrated as being longer than the length of the main body protrusion 40 in the first direction.

  Next, a method for manufacturing the power semiconductor package of the present embodiment including the screw block terminal 31 will be described focusing on the method for manufacturing the screw block terminal 31.

  First, each member such as the semiconductor mounting substrate 1, the base plate 5, the mother case 11, the fixing member 21, the screw block terminal 31, the pin terminal 51, and the like constituting the power semiconductor package of FIG. 1 is formed. In particular, when the screw block terminal 31 is formed, the screw terminal main body 35, the nut 34, and the electrode 32 constituting the screw block terminal 31 are first prepared. The screw terminal main body 35 is formed with a protrusion 38 and a main body protrusion 40.

  The corner of the second electrode portion of the electrode 32 has an arc shape in plan view. However, the shape is not limited to such a shape, and may be an arbitrary shape such as a triangular shape or a rectangular shape in a plan view.

  Thereafter, the components constituting the screw block terminal 31 described above are assembled so as to become the screw block terminal 31 shown in FIGS. 4 and 5. At this time, when the screw terminal body 35 is incorporated into the electrode 32, only the tip 37 is bent in a staircase shape in advance, and a metal flat plate in which the opening 33 and the hole 41 are formed is formed from below the screw terminal body 35. , And is inserted so as to penetrate the protruding portion 35a upward. Here, in the flat plate, a region inserted into the overhanging portion 35a becomes the first electrode portion. At this time, the main body protruding portion 40 of the screw terminal main body 35 is fitted into the hole 41 formed in the flat plate. Thereafter, the flat plate protruding above the overhanging portion 35a is bent to be held on the upper portion of the screw terminal body 35 as a second electrode portion. In this way, the screw terminal main body 35 shown in FIGS. 4 and 5 is formed.

  After each member including the screw terminal main body 35 is formed as described above, these members are assembled so as to form the power semiconductor package shown in FIG. At this time, the tip 37 of the electrode 32 of the screw terminal main body 35 is connected to, for example, soldering on the region where the wiring pattern is formed on the main surface of the semiconductor mounting substrate 1.

Here, the effect of this Embodiment is demonstrated.
In the screw block terminal 31 of the present embodiment, when the electrode 32 is incorporated into the screw terminal main body 35, the main body protrusion 40 of the screw terminal main body 35 is fitted into the hole 41 of the electrode 32. For this reason, when the assembled screw block terminal 31 is connected to the main surface of the semiconductor mounting substrate 1 (when assembling the power semiconductor package), the electrode 32 is caused by insufficient adhesive force when the tip portion 37 is soldered. Can be prevented from floating upward or causing displacement. This is because the upward displacement of the electrode 32 is restricted when the hole 41 interferes with the main body protrusion 40.

  Further, when a temperature cycle is applied to the power semiconductor package during use of the power semiconductor package, the base plate 5, the semiconductor mounting substrate 1, the electrode 32, and the screw terminal body 35 are repeatedly heated and cooled. At this time, since the base plate 5 is made of a metal material, the base plate 5 is deformed in the vertical direction according to a temperature change, but the semiconductor mounting substrate 1 made of an insulating material such as ceramic has a small deformation amount. Here, the electrode 32 is interfered with the main body protrusion 40, but the length of the hole 41 in the first direction, that is, the direction in which the base plate 5 is deformed is sufficiently larger than the length of the main body protrusion 40 in the first direction. Therefore, the electrode 32 can move in the first direction according to the deformation of the base plate 5. For this reason, it is suppressed that stress concentrates on the connection part with the electrode 32 (front-end | tip part 37) of the semiconductor mounting substrate 1, and defects, such as a crack, generate | occur | produce.

  The length of the hole 41 in the first direction is sufficiently large to absorb the amount of deformation caused by the temperature cycle during use (400 μm or more longer than the length of the main body protrusion 40 in the first direction) and is assembled. It is sufficiently small to suppress the floating of the electrode at the time (800 μm or less longer than the length of the main body protrusion 40 in the first direction). For this reason, the semiconductor device of this Embodiment can suppress the crack generation of the semiconductor mounting substrate 1 resulting from the temperature cycle at the time of module use, suppressing the floating of the electrode at the time of an assembly.

  The length of the hole 41 in the first direction is preferably 400 μm or more longer than the length of the main body protrusion 40 in the first direction because the base caused by the temperature cycle when the semiconductor device is used. This is because the amount of displacement of the plate 5 in the vertical direction is about 200 μm. For this reason, in the initial state, for example, if the main body protrusion 40 is fitted in the substantially central portion of the hole 41 (with respect to the first direction), even if the base plate 5 is displaced in the vertical direction, the electrode 32 (hole 41). ) Can be moved without being interfered by the main body projection 40.

  As described above, the electrode 32 of the screw block terminal 31 of the present embodiment is held by the main body protrusion 40 of the screw terminal main body 35 during assembly, and can be moved in the first direction according to the temperature change during use. It has become a structure. That is, both problems such as displacement and floating of the electrode 32 during assembly, and problems such as generation of cracks in the semiconductor mounting substrate 1 during use are suppressed, and a high-quality semiconductor device can be provided.

  As a modification of the present embodiment, for example, referring to FIG. 7, the outer peripheral portion (region where electrode 32 is sandwiched from both sides) of screw terminal main body 35 may include claws 43. The claw 43 functions as a gripping part (second gripping part) that grips the end of the second electrode part, and the electrode 32 and the claw 43 are engaged. The screw block terminal 31 in FIG. 7 is the same as the screw block terminal 31 in FIG. 4 except that the claw 43 is formed.

  In this way, for example, when the electrode 32 moves according to the displacement of the base plate 5 when the power semiconductor package is used, the claw 43 is located on the second electrode portion from the near side to the far side in FIG. It has a role of suppressing displacement in the direction extending in the second direction (second direction). For this reason, the nail | claw 43 can suppress the position shift of the electrode 32. FIG.

  Furthermore, as another modified example of the present embodiment, referring to FIG. 8, for example, a region 42 a of the nail 42 in which the screw terminal body 35 grips the electrode 32 is opposed to the first electrode portion. The width (indicated by an arrow in FIG. 8) is preferably 2 mm or more. The screw block terminal 31 in FIG. 8 is the same as the screw block terminal 31 in FIG. 7 except for the aspect of the claw 42 described above.

  As described above, the electrode 32 is incorporated so as to be inserted upward from below the screw terminal body 35, so that the electrode 32 is held by the screw terminal body 35 regardless of the width of the claw 42. However, since the claw 42 has a sufficient width as described above, the electrode 32 is gripped from both the claw 42 and the outer peripheral portion of the screw terminal body 35 that intersects the claw 42 (the portion that sandwiches the electrode 32 from both sides). The In particular, the claw 42 can firmly hold the end portion of the first electrode portion. For this reason, the electrode 32 is gripped more reliably.

  Furthermore, as another modification of the present embodiment, referring to FIG. 9, for example, a hole 46 (second hole) is formed in a part of the second electrode portion of screw terminal body 35. The screw terminal body 35 is formed with a positioning projection 47 that fits into the hole 46 in a state where the screw block terminal 31 is assembled.

  In the screw block terminal 31 of FIG. 9, two holes 46 and two positioning projections 47 are formed. However, the number of these formed is arbitrary.

  Here, the length of the hole 46 in the second direction is preferably 400 μm or more longer than the length of the positioning projection 47 in the second direction.

  In this way, the positioning projection 47 penetrating the hole 46 is, for example, like the claw 43 of the screw block terminal 31 of FIG. 7, from the near side to the far side of the second electrode portion in FIG. It has a role to suppress the displacement of. This is due to the same reason that the main body protrusion 40 described above interferes with the hole 41. Therefore, the position shift of the electrode 32 can be suppressed by the hole 46 and the positioning projection 47.

(Embodiment 2)
The screw block terminal in FIG. 11 is shown in a cross-sectional view along the line XI-XI in FIG. Referring to FIG. 10 and FIG. 11, the screw block terminal 31 of the present embodiment has no hole 41 formed in the first electrode part, and the first electrode part has a flat electrode part as a whole. Filled with. Further, the main body protrusion 40 is not formed on the screw terminal main body 35. The screw block terminal 31 in FIG. 10 is the same as the screw block terminal 31 in FIG. 8 except for the above differences.

  When the main body protrusion 40 and the hole 41 are not formed as in the screw block terminal 31 of the present embodiment, the electrode 32 is connected when the screw block terminal 31 is connected (assembled) on the semiconductor mounting substrate 1. May cause floating or misalignment. This is because the electrode 32 is interfered by the main body projection 40 and the effect of suppressing the upward displacement is lost. In order to suppress this, it is preferable that the screw terminal main body 35 has a claw 42 (a gripping part for gripping the end of the first electrode part) having a width of 2 mm or more, like the screw block terminal 31 of FIG. .

  In this way, a problem such as the upward lifting of the electrode 32 due to insufficient adhesive force when the tip 37 of the screw block terminal 31 is connected to the semiconductor mounting substrate 1 is caused by the wide claw 42. It is suppressed by the stronger gripping force possessed by. Therefore, similarly to the screw block terminal 31 of the first embodiment, problems such as upward lifting of the electrode 32 due to heating during assembly are suppressed.

  In addition, when the base plate 5 (see FIG. 1) is repeatedly displaced in the vertical direction due to a temperature cycle during use of the power semiconductor package on which the screw block terminal 31 is mounted, the electrode 32 moves up and down following the displacement of the base plate 5. Can move in the direction. This is because the electrode 32 is not interfered by the main body protrusion 40 and is held by the screw terminal main body 35. Therefore, similarly to the screw block terminal 31 of the first embodiment, the electrode 32 cannot follow the displacement of the base plate 5 when the module is used, so that stress concentrates on the connection portion between the electrode 32 and the semiconductor mounting substrate 1, and the semiconductor mounting substrate. 1 is prevented from cracking.

  In addition, since the claw 43 is formed, even if the electrode 32 is displaced in the vertical direction when the module is used, for example, the possibility that the position of the second electrode portion moves in the second direction to cause a positional shift is reduced. be able to. However, in FIG. 10, the claw 43 is formed to suppress the displacement of the electrode 32 in the second direction, but instead, the hole 46 and the positioning projection 47 shown in FIG. 9 are formed. There may be.

  As described above, the electrode 32 of the screw block terminal 31 of the present embodiment is held by the main body protrusion 40 of the screw terminal main body 35 during assembly, and can be moved in the first direction according to the temperature change during use. It has become a structure. That is, both problems such as displacement and floating of the electrode 32 during assembly, and problems such as generation of cracks in the semiconductor mounting substrate 1 during use are suppressed, and a high-quality semiconductor device can be provided.

  The second embodiment of the present invention is different from the first embodiment of the present invention only in each point described above. That is, the configuration, conditions, procedures, effects, and the like that have not been described above for the second embodiment of the present invention are all in accordance with the first embodiment of the present invention.

(Embodiment 3)
The screw block terminal 31 in FIG. 14 is shown in a sectional view taken along the line XIV-XIV in FIG. With reference to FIG. 12 to FIG. 14, in the screw block terminal 31 of the present embodiment, the hole 41 is formed in the first electrode portion, but the main body protruding portion 40 is not formed. In addition, a recess 41 a having a size substantially the same as that of the hole 41 in a plan view is formed at substantially the same location as the location where the main body protrusion 40 of the screw terminal main body 35 is formed. The screw block terminal 31 in FIG. 13 is the same as the screw block terminal 31 in FIG. 8 except for the above differences.

  When the screw block terminal 31 of the present embodiment is connected to the semiconductor mounting substrate 1, as shown in FIG. 12, it penetrates the hole 41 (positioning hole) formed for positioning the electrode 32. For example, a rod-shaped jig 45 reaching the concave portion 41a at the back is inserted. This suppresses the electrode 32 from being displaced or floated when the jig 45 is connected to the semiconductor mounting substrate 1 of the tip portion 37 in the same manner as the main body protrusion 40 (see FIG. 4). This is because the displacement of the electrode 32 with respect to the screw terminal body 35 is limited by the jig 45 penetrating the hole 41 and interfering with a recess formed in the screw terminal body 35.

  Thus, the jig 45 has a function similar to that of the main body protrusion 40 of the first embodiment. Therefore, for example, the circular size formed by the cross section intersecting the extending direction of the main body protrusion 40 is The size is preferably the same.

  However, since the jig 45 is not a component constituting the screw block terminal 31, there is a jig or protrusion that restrains the displacement of the electrode 32 as shown in FIGS. 13 and 14 when the power semiconductor package is assembled. do not do. Therefore, as in the second embodiment, the electrode 32 can move following the vertical deformation of the base plate 5. Therefore, the generation of cracks in the semiconductor mounting substrate 1 at the connecting portion between the tip portion 37 and the semiconductor mounting substrate 1 is suppressed.

  As described above, the electrode 32 of the screw block terminal 31 of the present embodiment is held by the main body protrusion 40 of the screw terminal main body 35 during assembly, and can be moved in the first direction according to the temperature change during use. It has become a structure. That is, both problems such as displacement and floating of the electrode 32 during assembly, and problems such as generation of cracks in the semiconductor mounting substrate 1 during use are suppressed, and a high-quality semiconductor device can be provided.

  12 and 13, the claw 43 is formed in order to suppress the displacement of the electrode 32 in the second direction. Instead, the hole 46 and the positioning protrusion shown in FIG. The structure in which the part 47 was formed may be sufficient.

  The third embodiment of the present invention is different from the first embodiment of the present invention only in each point described above. That is, the configuration, conditions, procedures, effects, and the like that have not been described above for the third embodiment of the present invention are all in accordance with the first embodiment of the present invention.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

  The present invention is particularly excellent as a technique for suppressing occurrence of defects both during assembly and actual use of a power semiconductor package.

  DESCRIPTION OF SYMBOLS 1 Semiconductor mounting substrate, 5 Base board, 11 Mother case, 12, 12a, 12b, 12c, 12d Perimeter, 13 opening, 21 Fixing member, 22 Fixing position, 23a Wall main body, 23b Connection part, 23c Bottom part, 24 Thick part , 25 Thin portion, 31 Screw block terminal, 32 Electrode, 33 Opening, 34 Nut, 35 Screw terminal main body, 35a Overhang portion, 35b Side surface, 36 Hollow portion, 37 Tip portion, 38 Protruding portion, 40 Main body protruding portion, 41 , 46 hole, 41a recess, 42, 43 claw, 42a region, 45 jig, 47 positioning protrusion, 51 pin terminal.

Claims (5)

A semiconductor mounting substrate;
A housing having an opening and storing the semiconductor mounting substrate;
A semiconductor device comprising a terminal fixed at a peripheral edge constituting the opening and electrically connected to the semiconductor mounting substrate;
The terminal includes a terminal body, and an electrode that is held by the terminal body and is electrically connected to the semiconductor mounting substrate,
The terminal body is movable in a first direction intersecting a main surface of the semiconductor mounting substrate, and the terminal body is held by the terminal body when the electrode is incorporated into the terminal body. Held in the
The terminal body has a protrusion,
The electrode is formed with a first hole and extends in the first direction, and is bent with respect to the first electrode portion, and faces the main surface of the semiconductor mounting substrate. A second electrode portion having a main surface,
The protrusion is fitted into the first hole;
The length of the first hole in the first direction is a semiconductor device that is 400 μm or more longer than the length of the protrusion in the first direction . Said first hole, the length of the first direction, said protrusions, 800 [mu] m or less longer than a length of the first direction, the semiconductor device according to claim 1. The outer peripheral portion of the terminal body includes a first gripping portion for gripping an end portion of the first electrode portion, a semiconductor device according to claim 1 or 2. Second hole is formed in a portion of the second electrode portion, the terminal body has a positioning protrusion which fits into the second hole, a semiconductor according to any one of claims 1 to 3, apparatus. The outer peripheral portion of the terminal body includes a second gripping portion for gripping an end portion of the second electrode portion, a semiconductor device according to any one of claims 1 to 4.

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