JP5242201B2 - 接合治具およびそれを用いた異種材料接合体の製造方法 - Google Patents
接合治具およびそれを用いた異種材料接合体の製造方法 Download PDFInfo
- Publication number
- JP5242201B2 JP5242201B2 JP2008064349A JP2008064349A JP5242201B2 JP 5242201 B2 JP5242201 B2 JP 5242201B2 JP 2008064349 A JP2008064349 A JP 2008064349A JP 2008064349 A JP2008064349 A JP 2008064349A JP 5242201 B2 JP5242201 B2 JP 5242201B2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- steam
- joining
- joined body
- brazing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title claims description 220
- 238000005304 joining Methods 0.000 title claims description 192
- 238000004519 manufacturing process Methods 0.000 title claims description 64
- 238000000034 method Methods 0.000 title claims description 26
- 238000005219 brazing Methods 0.000 claims description 100
- 238000010438 heat treatment Methods 0.000 claims description 21
- 238000012546 transfer Methods 0.000 claims description 15
- 239000002994 raw material Substances 0.000 claims description 13
- 238000004891 communication Methods 0.000 claims description 7
- 238000007599 discharging Methods 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 5
- 239000004927 clay Substances 0.000 claims description 3
- 238000003754 machining Methods 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 10
- 229910052799 carbon Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 230000009466 transformation Effects 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 238000005192 partition Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 239000011777 magnesium Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910001566 austenite Inorganic materials 0.000 description 2
- 229910001563 bainite Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910000734 martensite Inorganic materials 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910001562 pearlite Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0014—Brazing of honeycomb sandwich structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
- B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
- B23K26/103—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam the laser beam rotating around the fixed workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/28—Seam welding of curved planar seams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/02—Honeycomb structures
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Press-Shaping Or Shaping Using Conveyers (AREA)
- Laminated Bodies (AREA)
Description
本実施例では図8に示すような一対の接合治具5を用いた。この接合治具5は、一方の挟時部17に加熱時に接合面余剰となり気化したろう材を外部へ排出する機構を備えたものである。この接合治具は、図1に示すように二つの板状部材2,3の間の接合面28にろう材27を配した状態で積層してなる板状部材積層体4を図4に示すように挟持する挟持面15を備えた一対の平板形状の挟持部5で構成される。一方の挟持部17は、具体例として図16、図17に示されるような円盤形状とした。
実施例と同様の材料を用い、図6に示すように、内部にろう材の蒸気を排出する機構を備えていない従来の接合治具9の挟持部17,18(図6参照)で板状部材積層体4を図27に示すように挟持した状態で加熱し、接合させて口金基体を得た以外は、実施例と同様の方法にてハニカム構造体成形用口金を製造した。
Claims (8)
- 二つの板状部材の間の接合面にろう材を配した状態で積層してなる板状部材積層体を挟持する挟持面を備えた一対の平板形状の挟持部で構成され、
前記板状部材積層体を一対の前記挟持部で挟持した状態で加熱した場合に前記接合面で余剰したろう材の蒸気が流入するように前記挟持面に設けられた複数の蒸気流入口と、
前記蒸気流入口と連通して前記ろう材の蒸気の流路となるように設けられた蒸気流路と、
前記蒸気流路と連通して前記ろう材の蒸気を外部へ排出するように側面に設けられた蒸気排出口と、を有し、
前記板状部材積層体を一対の前記挟持部で挟持した場合に前記二つの板状部材の一方の板状部材は、前記接合面と、複数の前記蒸気流入口と、を連通する複数の裏孔を有しており、
前記板状部材積層体を一対の前記挟持部で挟持した状態で加熱した場合に、前記接合面で余剰したろう材の蒸気を、複数の前記裏孔より前記蒸気流入口に流入せしめ、前記蒸気流路を経て複数の前記蒸気排出口から排出し、前記二つの板状部材が接合された異種材料接合体を得る接合治具。 - 前記蒸気流路が隣接する前記蒸気流入口どうしを連通するように設けられた請求項1に記載の接合治具。
- 前記複数の蒸気排出口が一方の挟持部の側面全周に渡って間隔を置いて設けられた請求項1または2に記載の接合治具。
- 前記蒸気流路の少なくとも一部が前記挟持面と平行に格子状に設けられた請求項1〜3のいずれか1項に記載の接合治具。
- 前記蒸気流路の幅を0.05〜50mm、深さを0.05〜50mmとした請求項1〜4のいずれか1項に記載の接合治具。
- 前記一対の挟持部は、前記一方の板状部材の熱伝達率(W/m2・K)の1.5倍以上の熱伝達率(W/m2・K)を有する材料で構成された請求項1〜5のいずれか1項に記載の接合治具。
- 請求項1〜6のいずれか1項に記載の前記接合治具の前記挟持面で複数の前記裏孔と複数の前記蒸気流入口のうち少なくとも一部の前記蒸気流入口とが連通するように前記板状部材積層体を挟持した後、
前記板状部材積層体を前記ろう材が融解する温度以上に加熱するとともに、加熱雰囲気の圧力を前記ろう材の蒸気圧よりも低い圧力まで減圧することにより、前記接合面で余剰した前記ろう材の蒸気を、前記裏孔より前記蒸気流入口に流入せしめ、前記蒸気流路を経て前記蒸気排出口より排出し、前記二つの板状部材が接合された異種材料接合体を得る異種材料接合体の製造方法。 - 前記異種材料接合体を構成する前記一方の板状部材は、成形用坏土の導入孔となる前記裏孔と連通して前記接合面に沿って格子状に設けられた溝部を有してなり、
前記異種材料接合体を構成する他方の板状部材に、成形原料を格子状に成形するためのスリットを前記溝部と連通するように格子状に形成して、
ハニカム構造体を成形するための口金として、前記二つの板状部材が接合された異種材料接合体を製造する請求項7に記載の異種材料接合体の製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008064349A JP5242201B2 (ja) | 2008-03-13 | 2008-03-13 | 接合治具およびそれを用いた異種材料接合体の製造方法 |
US12/400,399 US8225983B2 (en) | 2008-03-13 | 2009-03-09 | Joining jig and method for manufacturing a bonded body of different members by using the jig |
EP09250667.4A EP2103374B1 (en) | 2008-03-13 | 2009-03-10 | Joining jig and method for manufacturing a bonded body of different members by using the jig |
CN200910126478.8A CN101530954B (zh) | 2008-03-13 | 2009-03-11 | 接合夹具及使用它的不同种材料接合体的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008064349A JP5242201B2 (ja) | 2008-03-13 | 2008-03-13 | 接合治具およびそれを用いた異種材料接合体の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2009220121A JP2009220121A (ja) | 2009-10-01 |
JP5242201B2 true JP5242201B2 (ja) | 2013-07-24 |
Family
ID=40732087
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008064349A Active JP5242201B2 (ja) | 2008-03-13 | 2008-03-13 | 接合治具およびそれを用いた異種材料接合体の製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8225983B2 (ja) |
EP (1) | EP2103374B1 (ja) |
JP (1) | JP5242201B2 (ja) |
CN (1) | CN101530954B (ja) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5345487B2 (ja) | 2008-09-24 | 2013-11-20 | 日本碍子株式会社 | 接合体及びハニカム構造体成形用口金 |
WO2011059186A2 (ko) * | 2009-11-10 | 2011-05-19 | 동국대학교 산학협력단 | 솔더링 지그, 평면 어레이 안테나 및 이의 제조 방법 |
DE102010026338A1 (de) * | 2010-07-07 | 2012-01-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Fixiervorrichtung für Solarzellen sowie Verfahren zur Fixierung von Solarzellen |
EP2629073A1 (en) * | 2010-10-15 | 2013-08-21 | Toyota Jidosha Kabushiki Kaisha | Device for detecting temperature of cooling liquid |
US20130175324A1 (en) * | 2012-01-11 | 2013-07-11 | Advanced Semiconductor Engineering, Inc. | Thermal compression head for flip chip bonding |
US9486029B2 (en) | 2014-03-31 | 2016-11-08 | Raytheon Company | Solid-liquid energy dissipation system, and helmet using the same |
CA3156178C (en) * | 2015-09-08 | 2023-10-31 | Berkshire Grey Operating Company, Inc. | Systems and methods for providing dynamic vacuum pressure in an articulated arm end effector |
FR3068273B1 (fr) * | 2017-06-29 | 2019-08-16 | Safran Nacelles | Dispositif et procede d'assemblage de pieces pour nacelle de turboreacteur d'aeronef |
JP6994644B2 (ja) * | 2017-12-01 | 2022-01-14 | パナソニックIpマネジメント株式会社 | 接合体と接合方法および接合材料 |
EP4056982A4 (en) * | 2019-11-05 | 2023-08-02 | Hitachi High-Tech Corporation | SAMPLE ANALYZER |
JP7426882B2 (ja) * | 2020-04-02 | 2024-02-02 | 株式会社Uacj | アルミニウム製組み付け体及びろう付体の製造方法 |
CN114178639B (zh) * | 2022-02-17 | 2022-05-17 | 太原理工大学 | 一种用于铍窗和不锈钢基座的脉冲激光钎焊封接方法 |
KR20240018915A (ko) * | 2022-08-03 | 2024-02-14 | 삼성전자주식회사 | 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법 |
KR20240018908A (ko) * | 2022-08-03 | 2024-02-14 | 삼성전자주식회사 | 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3514842A (en) | 1968-01-16 | 1970-06-02 | North American Rockwell | Brazing process |
JPH0555739A (ja) * | 1991-07-18 | 1993-03-05 | Fujitsu Ltd | ヒータチツプとそれを用いた細線接合方法 |
US5761787A (en) * | 1995-11-30 | 1998-06-09 | Corning Incorporated | Method of making bonded pin extrusion die |
JP3621513B2 (ja) | 1996-06-19 | 2005-02-16 | 日本特殊陶業株式会社 | Al金属接合体 |
JP4332980B2 (ja) | 1999-03-18 | 2009-09-16 | 株式会社デンソー | ハニカム構造体成形用金型の製造方法 |
JP2001126952A (ja) * | 1999-10-29 | 2001-05-11 | Taiyo Yuden Co Ltd | 積層セラミック電子部品の製造方法及びセラミックシートのプレス装置 |
DE10024111B4 (de) * | 2000-05-18 | 2006-02-23 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Bauelements aus übereinander gestapelten miteinander verlöteten Platten |
EP1238741B1 (en) | 2001-02-27 | 2011-06-29 | Rohr, Inc. | Fabrication method for Titanium aluminide honeycomb panel structures |
JP4266103B2 (ja) * | 2001-12-07 | 2009-05-20 | 日本碍子株式会社 | 多孔質セラミック体の製造方法 |
JP2003285308A (ja) | 2002-03-28 | 2003-10-07 | Ngk Insulators Ltd | ハニカム成形用口金及びこれを用いたハニカム成形用口金治具 |
JP2005302929A (ja) * | 2004-04-09 | 2005-10-27 | Matsushita Electric Ind Co Ltd | ガス抜きプリント基板 |
JP4426400B2 (ja) | 2004-08-11 | 2010-03-03 | 日本碍子株式会社 | ハニカム構造体成形用口金及びその製造方法 |
JP5185501B2 (ja) * | 2006-01-06 | 2013-04-17 | 日本碍子株式会社 | ハニカム構造体成形用口金の製造方法 |
JP2007227663A (ja) * | 2006-02-23 | 2007-09-06 | Sharp Corp | 半田付け実装構造の製造方法および製造装置 |
JP5202306B2 (ja) * | 2006-03-15 | 2013-06-05 | 日本碍子株式会社 | 口金用の異種材料接合体の製造方法 |
WO2007114089A1 (ja) | 2006-03-31 | 2007-10-11 | Ngk Insulators, Ltd. | ハニカム構造体成形用口金、及びその製造方法 |
-
2008
- 2008-03-13 JP JP2008064349A patent/JP5242201B2/ja active Active
-
2009
- 2009-03-09 US US12/400,399 patent/US8225983B2/en active Active
- 2009-03-10 EP EP09250667.4A patent/EP2103374B1/en active Active
- 2009-03-11 CN CN200910126478.8A patent/CN101530954B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
EP2103374B1 (en) | 2016-08-31 |
CN101530954A (zh) | 2009-09-16 |
US20090230176A1 (en) | 2009-09-17 |
JP2009220121A (ja) | 2009-10-01 |
CN101530954B (zh) | 2014-09-17 |
EP2103374A1 (en) | 2009-09-23 |
US8225983B2 (en) | 2012-07-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5242201B2 (ja) | 接合治具およびそれを用いた異種材料接合体の製造方法 | |
JP5202306B2 (ja) | 口金用の異種材料接合体の製造方法 | |
US7900811B1 (en) | Method for producing components with internal architectures, such as micro-channel reactors, via diffusion bonding sheets | |
JP4426400B2 (ja) | ハニカム構造体成形用口金及びその製造方法 | |
JP5897552B2 (ja) | 炭化タングステン基超硬合金接合体及びその製造方法 | |
EP2002949B1 (en) | Die for forming a honeycomb structure and method for manufacturing the same | |
WO2015077490A1 (en) | Method of using additive materials for production of fluid flow channels | |
JP6046712B2 (ja) | ハニカム構造体成形用口金及びその製造方法 | |
JP5185501B2 (ja) | ハニカム構造体成形用口金の製造方法 | |
US20150086670A1 (en) | Die for forming honeycomb structure and manufacturing method therefor | |
JP5345487B2 (ja) | 接合体及びハニカム構造体成形用口金 | |
JP5242200B2 (ja) | 異種材料接合体の製造方法 | |
JP2014082476A (ja) | 流路部材およびこれを用いた熱交換器ならびに半導体製造装置 | |
JP2006172964A (ja) | 固体電解質型燃料電池のスタック構造体 | |
JP5513865B2 (ja) | 超硬合金接合体及びその製造方法 | |
JP5101182B2 (ja) | 水素透過膜モジュール | |
KR102624495B1 (ko) | 마이크로채널 히트싱크 및 이의 제조방법 | |
JP2003290935A (ja) | 熱圧着方法及び熱圧着装置 | |
CN113698207B (zh) | 一种碳化硅微反应组件的制造方法及碳化硅微反应组件 | |
JP3814413B2 (ja) | 芯鞘複合繊維の湿式紡糸用口金 | |
JP5162268B2 (ja) | ハニカム構造体成形用口金 | |
JP2008120626A (ja) | 接合体と接合方法 | |
JPH11350234A (ja) | 賦形用口金 | |
JP2008246583A (ja) | 熱圧着方法及び熱圧着装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101119 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20120614 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120717 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120914 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130305 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130403 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160412 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 5242201 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |