JP5241328B2 - 誘電体磁器および積層セラミックコンデンサ - Google Patents
誘電体磁器および積層セラミックコンデンサ Download PDFInfo
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- JP5241328B2 JP5241328B2 JP2008139329A JP2008139329A JP5241328B2 JP 5241328 B2 JP5241328 B2 JP 5241328B2 JP 2008139329 A JP2008139329 A JP 2008139329A JP 2008139329 A JP2008139329 A JP 2008139329A JP 5241328 B2 JP5241328 B2 JP 5241328B2
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- 239000000919 ceramic Substances 0.000 claims description 104
- 229910002113 barium titanate Inorganic materials 0.000 claims description 59
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 59
- 239000013078 crystal Substances 0.000 claims description 45
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 42
- 239000003985 ceramic capacitor Substances 0.000 claims description 24
- 229910052788 barium Inorganic materials 0.000 claims description 23
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 claims description 23
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052720 vanadium Inorganic materials 0.000 claims description 22
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 20
- 229910052749 magnesium Inorganic materials 0.000 claims description 20
- 239000011777 magnesium Substances 0.000 claims description 20
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 18
- 229910052748 manganese Inorganic materials 0.000 claims description 18
- 239000011572 manganese Substances 0.000 claims description 18
- 229910052769 Ytterbium Inorganic materials 0.000 claims description 14
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052727 yttrium Inorganic materials 0.000 claims description 14
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 14
- 229910052692 Dysprosium Inorganic materials 0.000 claims description 12
- 229910052691 Erbium Inorganic materials 0.000 claims description 12
- 229910052689 Holmium Inorganic materials 0.000 claims description 12
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 claims description 12
- UYAHIZSMUZPPFV-UHFFFAOYSA-N erbium Chemical compound [Er] UYAHIZSMUZPPFV-UHFFFAOYSA-N 0.000 claims description 12
- KJZYNXUDTRRSPN-UHFFFAOYSA-N holmium atom Chemical compound [Ho] KJZYNXUDTRRSPN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052771 Terbium Inorganic materials 0.000 claims description 11
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 claims description 11
- VASIZKWUTCETSD-UHFFFAOYSA-N manganese(II) oxide Inorganic materials [Mn]=O VASIZKWUTCETSD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 description 83
- 238000009413 insulation Methods 0.000 description 41
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- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 16
- 238000002441 X-ray diffraction Methods 0.000 description 15
- 230000001965 increasing effect Effects 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000000654 additive Substances 0.000 description 9
- 230000007423 decrease Effects 0.000 description 9
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 8
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- 238000005245 sintering Methods 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 239000002994 raw material Substances 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
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- 239000012298 atmosphere Substances 0.000 description 5
- 238000009616 inductively coupled plasma Methods 0.000 description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 4
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- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
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- 238000010438 heat treatment Methods 0.000 description 3
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- 239000006104 solid solution Substances 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
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- 238000005498 polishing Methods 0.000 description 2
- 238000010405 reoxidation reaction Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000255777 Lepidoptera Species 0.000 description 1
- 229910018068 Li 2 O Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000001479 atomic absorption spectroscopy Methods 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 150000001553 barium compounds Chemical class 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
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- 238000005238 degreasing Methods 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
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- 238000007731 hot pressing Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 238000004451 qualitative analysis Methods 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000012086 standard solution Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
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- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/80—Phases present in the sintered or melt-cast ceramic products other than the main phase
- C04B2235/85—Intergranular or grain boundary phases
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- Ceramic Engineering (AREA)
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- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Inorganic Insulating Materials (AREA)
Description
ムをMgO換算で0〜0.1モル、マンガンをMnO換算で0〜0.5モル、イットリウム,ジスプロシウム,ホルミウムおよびエルビウムから選ばれる1種の希土類元素をRE2O3換算で0.5〜1.5モル、イッテルビウムをYb 2 O 3 換算で0.3〜0.7モル含有するとともに、X線回折チャートにおいて、正方晶系のチタン酸バリウムを示す(004)面の回折強度が、立方晶系のチタン酸バリウムを示す(004)面の回折強度よりも大きく、かつ前記結晶粒子の平均粒径が0.21〜0.28μmであることを特徴とする。
まず、原料粉末として、BT粉末、MgO粉末、Y2O3粉末、Dy2O3粉末、Ho2O3粉末、Er2O3粉末、Tb4O7粉末(第2希土類元素)、MnCO3粉末およびV2O5粉末を準備し、これらの各種粉末を表1に示す割合で混合した。これらの原料粉末は純度が99.9%のものを用いた。なお、BT粉末の平均粒径は表1に示した。MgO粉末、Y2O3粉末、Dy2O3粉末、Ho2O3粉末、Er2O3粉末、Tb4O7粉末、MnCO3粉末およびV2O5粉末は平均粒径が0.1μmのものを用いた。BT粉末のBa/Ti比は1とした。焼結助剤はSiO2=55、BaO=20、CaO=15、Li2O=10(モル%)組成のガラス粉末を用いた。ガラス粉末の添加量はBT粉末100質量部に対して1質量部とした。
[実施例2]
次に、実施例1に示した本発明の試料である各組成に、さらにイッテルビウムをYb2O3換算で0.35モル添加して、実施例1と同様の方法で試料を作製し評価した(試料No.2−1〜2−21)。
7 内部電極層
10 コンデンサ本体
Claims (5)
- チタン酸バリウムを主成分とする結晶粒子と、該結晶粒子間に存在する粒界相とを有する誘電体磁器であって、前記チタン酸バリウムを構成するバリウム100モルに対して、バナジウムをV2O5換算で0.05〜0.3モル、マグネシウムをMgO換算で0〜0.1モル、マンガンをMnO換算で0〜0.5モル、イットリウム,ジスプロシウム,ホルミウムおよびエルビウムから選ばれる1種の希土類元素をRE2O3換算で0.5〜1.5モル、イッテルビウムをYb 2 O 3 換算で0.3〜0.7モル含有するとともに、X線回折チャートにおいて、正方晶系のチタン酸バリウムを示す(004)面の回折強度が、立方晶系のチタン酸バリウムを示す(004)面の回折強度よりも大きく、かつ前記結晶粒子の平均粒径が0.21〜0.28μmであることを特徴とする誘電体磁器。
- 前記マグネシウムがMgO換算で0モルであることを特徴とする請求項1に記載の誘電体磁器。
- 前記マンガンがMnO換算で0モルであることを特徴とする請求項2に記載の誘電体磁器。
- 前記チタン酸バリウムを構成するバリウム100モルに対して、さらにテルビウムをTb4O7換算で0.3モル以下含有することを特徴とする請求項1乃至3のうちいずれかに記載の誘電体磁器。
- 請求項1乃至4のうちいずれかに記載の誘電体磁器からなる誘電体層と内部電極層との積層体から構成されていることを特徴とする積層セラミックコンデンサ。
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PCT/JP2009/055984 WO2009145001A1 (ja) | 2008-05-28 | 2009-03-25 | 誘電体磁器および積層セラミックコンデンサ |
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