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JP5231792B2 - Manufacturing method of electronic device - Google Patents

Manufacturing method of electronic device Download PDF

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Publication number
JP5231792B2
JP5231792B2 JP2007317037A JP2007317037A JP5231792B2 JP 5231792 B2 JP5231792 B2 JP 5231792B2 JP 2007317037 A JP2007317037 A JP 2007317037A JP 2007317037 A JP2007317037 A JP 2007317037A JP 5231792 B2 JP5231792 B2 JP 5231792B2
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wire
tip
hole
electronic device
capillary
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JP2009141193A (en
JP2009141193A5 (en
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忠宏 岡崎
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Rohm Co Ltd
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Rohm Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H—ELECTRICITY
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

本発明は、各種半導体製品などの製造に用いられる電子装置の製造方法および電子装置に関する。 The present invention relates to an electronic device manufacturing method and an electronic device used for manufacturing various semiconductor products.

図８は、従来の電子装置の製造方法におけるワイヤボンディング方法の一例によってボンディングされた電子素子を示している（たとえば、特許文献１参照）。同図に示された電子素子９２は、導通支持部材であるリードフレーム９１に搭載されている。電子素子９２とボンディングパッド９１ａとは、たとえば絶縁性接着剤を用いたダイボンディングによって接合されている。電子素子９２の電極９２ａとパッド９１ｂとは、ワイヤ９９によって接合されている。 FIG. 8 shows an electronic element bonded by an example of a wire bonding method in a conventional method for manufacturing an electronic device (see, for example, Patent Document 1). The electronic element 92 shown in the figure is mounted on a lead frame 91 which is a conduction support member. The electronic element 92 and the bonding pad 91a are bonded by, for example, die bonding using an insulating adhesive. The electrode 92 a and the pad 91 b of the electronic element 92 are joined by a wire 99.

ワイヤ９９によるワイヤボンディングを行うには、キャピラリ９３を用いる。まず、ボンディングパッド９１ａにボンディングされた電子素子９２の電極９２ａ直上にキャピラリ９３を位置させる。この状態でキャピラリ９３からワイヤ９９を突出させ、この突出部分を溶解させることにより溶融ボールを形成する。次に、キャピラリ９３を電極９２ａに接近させ、上記溶融ボールを電極９２ａに付着させる。そして、キャピラリ９３からワイヤ９９を送り出しながらキャピラリ９３を電極９２ａから離間させる。以上の作業により、電極９２ａに対するファーストボンディング工程が完了する。次いで、キャピラリ９３をパッド９１ｂに接近させ、ワイヤ９９の先端をパッド９１ｂに対して押し付ける。これにより、ワイヤ９９を切断する。このときの押し付け力によって、リードフレーム９１側に残存したワイヤ９９の端部が、パッド９１ｂに接合される。この後に、キャピラリ９３をパッド９１ｂから離間させる。以上の作業により、パッド９１ｂに対するセカンドボンディング工程が完了する。   In order to perform wire bonding using the wire 99, a capillary 93 is used. First, the capillary 93 is positioned immediately above the electrode 92a of the electronic element 92 bonded to the bonding pad 91a. In this state, the wire 99 is protruded from the capillary 93, and the protruding portion is melted to form a molten ball. Next, the capillary 93 is brought close to the electrode 92a, and the molten ball is attached to the electrode 92a. Then, the capillary 93 is separated from the electrode 92 a while feeding the wire 99 from the capillary 93. With the above operations, the first bonding process for the electrode 92a is completed. Next, the capillary 93 is brought close to the pad 91b, and the tip of the wire 99 is pressed against the pad 91b. Thereby, the wire 99 is cut. Due to the pressing force at this time, the end portion of the wire 99 remaining on the lead frame 91 side is joined to the pad 91b. Thereafter, the capillary 93 is separated from the pad 91b. With the above operation, the second bonding process for the pad 91b is completed.

上記に示したように、従来技術においては、ワイヤボンディングを行うにあたり、ファーストボンディング工程、セカンドボンディング工程毎に、キャピラリを上下動させる必要があった。近年、ワイヤボンディングに高速化が求められる傾向にあるが、従来技術の方法ではこの要望を十分に満足させることができなかった。   As described above, in the prior art, it is necessary to move the capillary up and down for each of the first bonding process and the second bonding process when performing wire bonding. In recent years, there has been a tendency to increase the speed of wire bonding, but the prior art method has not been able to satisfy this demand sufficiently.

特開２００５−５１０３１号公報JP 2005-51031 A

本発明は、上記事情のもとで考え出されたものであって、ワイヤボンディングに要する時間の短縮化を図る事が可能な電子装置の製造方法および電子装置を提供することをその課題とする。 The present invention has been conceived under the above circumstances, and an object thereof is to provide an electronic device manufacturing method and an electronic device capable of shortening the time required for wire bonding. .

本発明の第一の側面によって提供される電子装置の製造方法は、貫通孔を有し、この貫通孔に挿通されたワイヤを上記貫通孔先端から送り出すことができるキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断することにより、２つの上記接続対象部を、両端が上記先端と上記中間部である接続ワイヤによって接続する電子装置の製造方法であって、上記キャピラリとして、上記ワイヤを送り出す方向に直角な方向において、上記貫通孔先端から離間し、かつ、送り出されたワイヤの先端を捕捉できる捕捉部、を有するものを用い、上記ワイヤを上記キャピラリから送り出した後に、上記送り出されたワイヤの先端を上記捕捉部に捕捉させるように、上記送り出されたワイヤを変形する工程と、上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴としている。 According to a first aspect of the present invention, there is provided a method of manufacturing an electronic device using a capillary having a through-hole and capable of feeding a wire inserted through the through-hole from a tip of the through-hole. By joining the tip to one connection target part, joining the intermediate part of the wire to the other connection target part, and cutting the two connection target parts, both ends are the tip and the intermediate part A method of manufacturing an electronic device connected by a connection wire, wherein the capillaries are separated from the tip of the through-hole in the direction perpendicular to the direction of feeding out the wire, and can capture the tip of the fed-out wire as the capillary After the wire is fed out from the capillary, the wire is fed out so that the tip of the fed wire is captured by the capturing part. Deforming the wire, and approaching the capillaries to the two joining target parts so that the tip of the through-hole faces the other joining target part and the capturing part faces the one joining target part. In this state, the tip of the wire is joined to one of the connection target portions, and the intermediate portion sandwiched between the tip of the through hole and the other connection target portion of the wire is connected to the other connection target. And a step of joining and cutting the target portion.

このような構成によれば、上記キャピラリを一度上下動することで、２つの上記接続対象部を上記接続ワイヤで接続できる。これにより、ワイヤボンディングに要する時間の短縮化を図ることができる。   According to such a configuration, by moving the capillary once up and down, the two connection target portions can be connected by the connection wire. Thereby, the time required for wire bonding can be shortened.

本発明の第二の側面によって提供される電子装置の製造方法は、ワイヤを貫通孔先端から送り出すことができるキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断することにより、２つの上記接続対象部を、両端が上記先端と上記中間部である接続ワイヤによって接続する電子装置の製造方法であって、上記キャピラリとして、上記貫通孔先端から離間し、かつ、送り出されたワイヤの先端を捕捉できる捕捉部、を有するものを用い、上記ワイヤを上記キャピラリから送り出した後に、上記送り出されたワイヤの先端を上記捕捉部に捕捉させるように、上記送り出されたワイヤを変形する工程と、上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴としている。本発明の第三の側面によって提供される電子装置の製造方法は、ワイヤを通す貫通孔を有するキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断する電子装置の製造方法であって、上記キャピラリとして、上記ワイヤを送り出す方向に直角な方向において、上記貫通孔先端から離間し、かつ、送り出されたワイヤの先端を捕捉できる捕捉部、を有するものを用い、上記ワイヤを上記キャピラリから送り出した後に、上記送り出されたワイヤの先端を上記捕捉部に捕捉させるように、上記送り出されたワイヤを変形する工程と、上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴としている。本発明の第四の側面によって提供される電子装置の製造方法は、ワイヤを通す貫通孔を有し、上記貫通孔先端から離間し、ワイヤの先端を捕捉できる捕捉部を有するキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断する電子装置の製造方法であって、上記ワイヤを上記キャピラリから送り出した後に、上記送り出されたワイヤの先端を上記捕捉部に捕捉させるように、上記送り出されたワイヤを変形する工程と、上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴としている。本発明の第五の側面によって提供される電子装置の製造方法は、ワイヤを通す貫通孔を有し、上記貫通孔先端から離間し、ワイヤの先端を捕捉できる捕捉部を有するキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断する電子装置の製造方法であって、上記ワイヤの先端を上記捕捉部に捕捉させるように、上記ワイヤを変形する工程と、上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴としている。本発明の好ましい実施の形態においては、上記送り出されたワイヤを変形する工程においては、風力により上記送り出されたワイヤを変形する。本発明の好ましい実施の形態においては、上記キャピラリは、上記貫通孔先端と上記捕捉部とをつなぐ溝をさらに有し、上記送り出されたワイヤを変形する工程においては、上記送り出されたワイヤのうち上記中間部から上記先端の間における部分を上記溝に沿わせる。本発明の好ましい実施の形態においては、上記捕捉部は、凹部である。本発明の好ましい実施の形態においては、上記凹部は、部分球形状である。本発明の好ましい実施の形態においては、上記捕捉部は、凹部であり、上記溝の幅方向における上記凹部の寸法は、上記溝の幅よりも大である。本発明の好ましい実施の形態においては、上記捕捉部は、上記貫通孔の貫通方向において上記貫通孔先端よりも上流側に位置している。According to a second aspect of the present invention, there is provided a method for manufacturing an electronic device, in which a tip of the wire is joined to one connection target portion using a capillary capable of feeding the wire from the tip of the through hole. A method of manufacturing an electronic device in which an intermediate part is joined to the other connection target part, and the two connection target parts are connected by a connection wire whose both ends are the tip and the intermediate part, As the capillary, one having a capture part that is separated from the tip of the through hole and that can catch the tip of the sent wire, and after feeding the wire from the capillary, the tip of the sent wire is A step of deforming the delivered wire so as to be captured by the capturing part; and the tip of the through hole is the other part to be joined; The tip of the wire is bonded to one of the connection target portions in a state where the capillary is close to the two bonding target portions so as to face the bonding target portions, respectively, and the penetration of the wire A step of joining and cutting the intermediate portion sandwiched between the hole tip and the other connection target portion and the other connection target portion. According to a third aspect of the present invention, there is provided a method for manufacturing an electronic device, wherein a tip having a through-hole through which a wire is passed is used to join the tip of the wire to one connection target portion, and an intermediate portion of the wire is connected. A method of manufacturing an electronic device that joins and cuts to the other connection target portion, wherein the wire is separated from the tip of the through hole and sent out in the direction perpendicular to the direction of feeding out the wire as the capillary A step of deforming the delivered wire so that the capture portion captures the distal end of the fed wire after the wire is delivered from the capillary using a capture portion that can capture the distal end of the wire. And the two capillaries so that the tip of the through hole faces the other joining target part and the capture part faces one joining target part. The intermediate portion sandwiched between the tip of the through hole and the other connection target portion of the wire while bonding the tip of the wire to one of the connection target portions in a state of being close to the connection target portion And a step of joining and cutting to the other connection target part. The method for manufacturing an electronic device provided by the fourth aspect of the present invention uses a capillary having a through-hole through which a wire passes, spaced apart from the tip of the through-hole, and having a capturing portion that can capture the tip of the wire. A method of manufacturing an electronic device in which the tip of the wire is joined to one connection target part, and the middle part of the wire is joined to the other connection target part, and then cut, after the wire is fed out from the capillary A step of deforming the delivered wire so that the capture portion captures the distal end of the delivered wire; the through-hole distal end is the other joint target portion; and the capture portion is the one joint In a state where the capillaries are close to the two joining target parts so as to face each target part, the tip of the wire is joined to one of the connection target parts, and the wire The intermediate portion sandwiched between the through-hole tip and the other of the connection target unit out of, is characterized in that joined to the other of the connection target unit and having a step of cutting. The method for manufacturing an electronic device provided by the fifth aspect of the present invention includes a capillary having a through-hole through which a wire passes, and having a capture portion that is separated from the tip of the through-hole and can capture the tip of the wire. An electronic device manufacturing method in which the tip of the wire is joined to one connection target part, and the middle part of the wire is joined to the other connection target part, and is cut, and the tip of the wire is used as the capture part. The step of deforming the wire so as to be captured, and the capillaries are arranged in such a manner that the tip of the through-hole faces the other joining target part and the capturing part faces the one joining target part. While the tip of the wire is joined to one of the connection target parts in a state of being close to the joining target part, the intermediate part sandwiched between the tip of the through hole and the other connection target part of the wire is , It is characterized by comprising the steps of bonding to the connection target of the square, and disconnects, the. In a preferred embodiment of the present invention, in the step of deforming the delivered wire, the delivered wire is deformed by wind power. In a preferred embodiment of the present invention, the capillary further includes a groove connecting the tip of the through hole and the capturing portion, and in the step of deforming the sent wire, A portion between the intermediate portion and the tip is placed along the groove. In preferable embodiment of this invention, the said capture | acquisition part is a recessed part. In a preferred embodiment of the present invention, the concave portion has a partial spherical shape. In a preferred embodiment of the present invention, the capturing part is a concave part, and the dimension of the concave part in the width direction of the groove is larger than the width of the groove. In a preferred embodiment of the present invention, the capturing part is located upstream of the tip of the through hole in the penetration direction of the through hole.

本発明の第六の側面によって提供される電子装置の製造方法は、ワイヤを通す貫通孔を有し、上記貫通孔先端から離間し、ワイヤの先端を捕捉できる捕捉部を有するキャピラリを用いる電子装置の製造方法であって、上記ワイヤを変形させることにより上記ワイヤの先端を上記捕捉部に捕捉させる工程と、上記貫通孔先端が他方の上記接合対象部に接近し、上記捕捉部が一方の上記接合対象部に接近するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴としている。本発明の好ましい実施の形態においては、上記捕捉させる工程においては、風力により上記送り出されたワイヤを変形する。本発明の好ましい実施の形態においては、上記キャピラリは、上記貫通孔先端と上記捕捉部とをつなぐ溝をさらに有し、上記捕捉させる工程においては、上記送り出されたワイヤのうち上記中間部から上記先端の間における部分を上記溝に沿わせる。本発明の好ましい実施の形態においては、上記捕捉部は、凹部である。本発明の好ましい実施の形態においては、上記凹部は、部分球形状である。本発明の好ましい実施の形態においては、上記捕捉部は、凹部であり、上記溝の幅方向における上記凹部の寸法は、上記溝の幅よりも大である。本発明の好ましい実施の形態においては、上記捕捉部は、上記貫通孔の貫通方向において上記貫通孔先端よりも上流側に位置している。  An electronic device manufacturing method provided by a sixth aspect of the present invention includes an electronic device using a capillary that has a through-hole through which a wire passes, and has a capture portion that is spaced from the tip of the through-hole and can capture the tip of the wire. A step of causing the capturing part to capture the tip of the wire by deforming the wire, the tip of the through hole approaching the other part to be joined, and the capturing part being one of the above The tip of the wire is joined to one of the connection subject portions in a state where the capillary is brought close to the two joining subject portions so as to approach the joining subject portion, and the through-hole tip of the wire and A step of joining and cutting the intermediate portion sandwiched between the other connection target portions and the other connection target portion. In a preferred embodiment of the present invention, in the step of capturing, the wire sent out is deformed by wind power. In a preferred embodiment of the present invention, the capillary further has a groove that connects the tip of the through hole and the capturing portion, and in the capturing step, the capillary is connected to the intermediate portion from the intermediate portion. The portion between the tips is aligned with the groove. In preferable embodiment of this invention, the said capture | acquisition part is a recessed part. In a preferred embodiment of the present invention, the concave portion has a partial spherical shape. In a preferred embodiment of the present invention, the capturing part is a concave part, and the dimension of the concave part in the width direction of the groove is larger than the width of the groove. In a preferred embodiment of the present invention, the capturing part is located upstream of the tip of the through hole in the penetration direction of the through hole.

本発明の第七の側面によって提供される電子装置は、電子素子と、上記電子素子の表面に形成された電極と、両端に２つのボンディング部を有し、かつ一方のボンディング部が上記電極に接合されたワイヤと、上記ワイヤの他方のボンディング部が接合されたパッドと、を備えた電子装置であって、上記一方のボンディング部は、膨出形状であり、上記ワイヤのうち上記一方のボンディング部以外の部分は、上記一方のボンディング部から上記表面が向く方向に対して交差する方向に延びているとともに、上記表面が向く方向において上記一方のボンディング部のうち上記表面からもっとも離間した部位と上記パッドとの間に位置するとともに、上記一方のボンディング部および上記ワイヤのうち上記一方のボンディング部から延びる部分は、金属接合面を持たず一様な金属材料によって形成されていることを特徴としている。本発明の第八の側面によって提供される電子装置は電子素子と、上記電子素子の表面に形成された電極と、両端に２つのボンディング部を有し、かつ一方のボンディング部が上記電極に接合されたワイヤと、上記ワイヤの他方のボンディング部が接合されたパッドと、を備えた電子装置であって、上記一方のボンディング部は、膨出形状であり、上記ワイヤのうち上記一方のボンディング部から延びる部分は、上記表面が向く方向に対して交差する方向に延びているとともに、上記表面が向く方向において上記一方のボンディング部のうち上記表面からもっとも離間した部位と上記電極との間から上記パッドに向かって延びているとともに、上記一方のボンディング部および上記ワイヤのうち上記一方のボンディング部から延びる部分は、金属接合面を持たず一様な金属材料によって形成されていることを特徴としている。 An electronic device provided by a seventh aspect of the present invention includes an electronic element, an electrode formed on the surface of the electronic element, two bonding portions at both ends, and one bonding portion serving as the electrode. An electronic device comprising a bonded wire and a pad to which the other bonding portion of the wire is bonded, wherein the one bonding portion has a bulging shape, and the one of the wires is bonded. The portion other than the portion extends in a direction intersecting the direction in which the surface faces from the one bonding portion, and a portion of the one bonding portion that is most separated from the surface in the direction in which the surface faces. together positioned between the pads, the portion extending from one of the bonding portions above of one of the bonding portion and the wire above It is characterized by being formed by a uniform metal material without the metal bonding surface. An electronic device provided by an eighth aspect of the present invention has an electronic element, an electrode formed on the surface of the electronic element, two bonding portions at both ends, and one bonding portion is bonded to the electrode. And a pad to which the other bonding portion of the wire is bonded, wherein the one bonding portion has a bulging shape, and the one bonding portion of the wires The portion extending from the surface extends in a direction crossing the direction in which the surface faces, and in the direction in which the surface faces, the portion of the one bonding portion that is farthest from the surface and between the electrode and the electrode with and extends toward the pad, the portion extending from one of the bonding portions above of one of the bonding portion and the wire above, gold It is characterized by being formed by a uniform metallic material no joint surfaces.

本発明の好ましい実施の形態においては、上記他方のボンディング部は、上記パッドに対する押し跡が形成されている。 In a preferred embodiment of the present invention, the other bonding portion is formed with a mark against the pad.

本発明のその他の特徴および利点は、添付図面を参照して以下に行う詳細な説明によって、より明らかとなろう。   Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

以下、本発明の好ましい実施の形態につき、図面を参照して具体的に説明する。   Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

図１および図２は、本発明に係る電子装置の製造方法に用いられるキャピラリの一例を示している。キャピラリ１は、例えばアルミナ製であり、貫通孔１１、貫通孔先端１２、捕捉部１３、および溝１４を有している。キャピラリ１は、円柱状の部分と、その下方において、貫通孔１１に垂直な一方向に隆起した部分とを有する。貫通孔１１は、キャピラリ１内部に形成された円柱状の孔である。また、貫通孔１１はキャピラリ１における円柱部分の中心に位置している。貫通孔先端１２は、上記貫通孔１１の内表面とキャピラリ１の外表面との境界部分である。なおキャピラリ１は、貫通孔１１内部にワイヤ２０を挿通することが可能である。また、キャピラリ１は、ワイヤ２０を、貫通孔１１に対して固定でき、また貫通孔１１から貫通孔先端１２へ送り出すことが可能である。捕捉部１３は、キャピラリ１１の外表面の一部分である。また、捕捉部１３は、貫通孔１１に直角な方向において貫通孔先端１２から離間し、本実施形態では、図中において、貫通孔先端１２より上方に位置している。捕捉部１３の形状は、例えば、凹型のクレーター状である。溝１４は、貫通孔先端１２から捕捉部１３までのキャピラリ１の外表面に形成されている。 1 and 2 show an example of a capillary used in the method for manufacturing an electronic device according to the present invention. The capillary 1 is made of alumina, for example, and has a through hole 11, a through hole tip 12, a capturing part 13, and a groove 14. The capillary 1 has a cylindrical part and a part protruding below in one direction perpendicular to the through hole 11. The through hole 11 is a cylindrical hole formed inside the capillary 1. Further, the through hole 11 is located at the center of the cylindrical portion in the capillary 1. The through hole tip 12 is a boundary portion between the inner surface of the through hole 11 and the outer surface of the capillary 1. The capillary 1 can insert the wire 20 into the through hole 11. Further, the capillary 1 can fix the wire 20 to the through hole 11 and can send out the wire 20 from the through hole 11 to the through hole tip 12. The capturing unit 13 is a part of the outer surface of the capillary 11. Moreover, the capture part 13 is separated from the through-hole tip 12 in a direction perpendicular to the through-hole 11, and in the present embodiment, is located above the through-hole tip 12 in the drawing. The shape of the capturing unit 13 is, for example, a concave crater shape. The groove 14 is formed on the outer surface of the capillary 1 from the through-hole tip 12 to the capturing part 13.

次に、本発明に係る電子装置の製造方法の一例について、図３〜図７を参照しつつ以下に説明する。 Next, an example of a method for manufacturing an electronic device according to the present invention will be described below with reference to FIGS.

まず、図３に示すように、貫通孔先端１２から、貫通孔１１内部に挿通されているワイヤ２０を、キャピラリ１の溝１４と同程度の長さ送り出す。ワイヤ２０のうち、キャピラリ１外部へ送り出された部分は送り出されたワイヤ２となる。送り出されたワイヤ２はワイヤ先端２１とワイヤ中間部２２を有している。ワイヤ中間部２２は、ワイヤ２０のうち貫通孔先端１２の近傍部分である。そして、ワイヤ先端２１に対してスパークを飛ばすなどにより、ワイヤ先端２１を融解する。これにより、ボール２５が形成される。   First, as shown in FIG. 3, the wire 20 inserted into the through hole 11 is fed out from the through hole tip 12 to the same length as the groove 14 of the capillary 1. Of the wire 20, the portion fed out of the capillary 1 becomes the fed wire 2. The fed wire 2 has a wire tip 21 and a wire intermediate portion 22. The wire intermediate portion 22 is a portion near the through hole tip 12 in the wire 20. Then, the wire tip 21 is melted, for example, by blowing a spark against the wire tip 21. Thereby, the ball 25 is formed.

次に、図４に示すように、ワイヤ２を中間部２２において折り曲げる。例えば、送り出されたワイヤ２に、貫通孔先端１２から捕捉部１３に向かう方向に風力を与え、送り出されたワイヤ２の中間部２２を折り曲げる。ワイヤ２に風をあて続け、捕捉部１３と貫通孔先端１２とを結ぶ直線と、ボール２５とワイヤ中間部２２とを結ぶ直線とがなす角を小さくする。上記なす角が小さくなるにつれ、ワイヤ２に与える風力を上向きに変化させる。また上記風力は、送り出されたワイヤ２のうちボール２５とワイヤ中間部２２の間の部分を、キャピラリ１の溝１４に位置させるように与える。そして、送り出されたワイヤ２のうちボール２５とワイヤ中間部２２の間の部分がキャピラリ１の溝１４に沿い、また、ボール２５が捕捉部１３に捕捉されたとき、送り出されたワイヤ２に風力を与えることを停止する。   Next, as shown in FIG. 4, the wire 2 is bent at the intermediate portion 22. For example, wind force is applied to the fed wire 2 in a direction from the through-hole tip 12 toward the capturing unit 13 to bend the intermediate portion 22 of the fed wire 2. The air is continuously applied to the wire 2 to reduce the angle formed by the straight line connecting the capturing part 13 and the through-hole tip 12 and the straight line connecting the ball 25 and the wire intermediate part 22. As the angle formed becomes smaller, the wind force applied to the wire 2 is changed upward. Moreover, the said wind force gives the part between the ball | bowl 25 and the wire intermediate part 22 among the sent wires 2 so that it may be located in the groove | channel 14 of the capillary 1. FIG. The portion of the wire 2 sent out between the ball 25 and the wire intermediate portion 22 extends along the groove 14 of the capillary 1, and when the ball 25 is caught by the catching portion 13, wind force is applied to the sent wire 2. Stop giving.

次に、図５に示すように、キャピラリ１をリードフレーム４１上に位置させる。リードフレーム４１は、パッド４３ｂを有し、電子素子４２を搭載している。電子素子４２は、電極４３ａを有している。キャピラリ１をリードフレーム４１上に位置させる際、電極４３ａの直上に捕捉部１３を、パッド４３ｂの直上に貫通孔先端１２を、それぞれ位置させる。そして、貫通孔先端１２がパッド４３ｂに、捕捉部１３が電極４３ａに、それぞれ正対するように、キャピラリ１を電極４３ａおよびパッド４３ｂに接近させる。   Next, as shown in FIG. 5, the capillary 1 is positioned on the lead frame 41. The lead frame 41 has a pad 43b and has an electronic element 42 mounted thereon. The electronic element 42 has an electrode 43a. When the capillary 1 is positioned on the lead frame 41, the capturing portion 13 is positioned directly above the electrode 43a, and the tip 12 of the through hole is positioned directly above the pad 43b. Then, the capillary 1 is brought close to the electrode 43a and the pad 43b so that the front end 12 of the through hole faces the pad 43b and the capturing portion 13 faces the electrode 43a.

次に、図６に示すように、ワイヤ中間部２２をパッド４３ｂに、ボール２５を電極４３ａに、それぞれ付着させる。この状態でキャピラリ１に超音波による振動を加える。これにより、ボール２５は、電極４３ａに接合される。また、ワイヤ中間部２２は、パッド４３ｂに接合される。そして、キャピラリ１をパッド４３ｂに押し付ける。ワイヤ中間部２２がキャピラリ１の貫通孔先端１２の近傍部とパッド４３ｂに挟まれることで、送り出されたワイヤ２はワイヤ中間部２２で切断される。   Next, as shown in FIG. 6, the wire intermediate portion 22 is attached to the pad 43b, and the ball 25 is attached to the electrode 43a. In this state, ultrasonic vibration is applied to the capillary 1. Thereby, the ball | bowl 25 is joined to the electrode 43a. Moreover, the wire intermediate part 22 is joined to the pad 43b. Then, the capillary 1 is pressed against the pad 43b. Since the wire intermediate portion 22 is sandwiched between the vicinity of the through-hole tip 12 of the capillary 1 and the pad 43b, the fed wire 2 is cut at the wire intermediate portion 22.

次に、図７に示すように、ワイヤ２０を貫通孔１１に対して固定した状態で、キャピラリ１を電極４３ａおよびパッド４３ｂから離間させる。一方、電極４３ａとパッド４３ｂとは接続ワイヤ３により接続され、ボンディング部３１およびボンディング部３２が形成されている。ボンディング部３１，３２は、ボール２５および電極４３ａ、ワイヤ中間部２２およびパッド４３ｂ、がそれぞれ接合された部分である。以上の作業により、電極４３ａとパッド４３ｂを接続ワイヤ３で接続する工程が終了する。この後は、ワイヤボンディングすべき他の電極またはパッドに対して、同様のワイヤボンディングを施す。   Next, as shown in FIG. 7, the capillary 1 is separated from the electrode 43 a and the pad 43 b in a state where the wire 20 is fixed to the through hole 11. On the other hand, the electrode 43a and the pad 43b are connected by the connection wire 3, and the bonding part 31 and the bonding part 32 are formed. The bonding portions 31 and 32 are portions where the ball 25 and the electrode 43a, the wire intermediate portion 22 and the pad 43b are bonded to each other. With the above operation, the process of connecting the electrode 43a and the pad 43b with the connection wire 3 is completed. Thereafter, similar wire bonding is performed on other electrodes or pads to be wire bonded.

次に、本実施形態の電子装置の製造方法の作用について説明する。 Next, the effect | action of the manufacturing method of the electronic device of this embodiment is demonstrated.

本実施形態によれば、キャピラリ１を一度上下動することで、電極４３ａとパッド４３ｂという２つの接続対象部を接続できる。これにより、ワイヤボンディングに要する時間の短縮化を図ることができる。   According to this embodiment, by moving the capillary 1 up and down once, it is possible to connect the two connection target parts, the electrode 43a and the pad 43b. Thereby, the time required for wire bonding can be shortened.

風力を用いることで、ワイヤ２のある一点に集中して力を加えることなく、ワイヤ２の側面、ボール２５の表面に力を分散して加えることができる。つまり、同じ大きさのモーメントが風以外の方法でワイヤ２に与えられた場合と比較して、ワイヤ２のある一点に与えられる力は小さくなる。その結果、ワイヤ２を折り曲げる際、ワイヤ２において力が与えられた部分に起こりうる意図しない変形や断線を防ぐことができる。   By using the wind force, the force can be distributed and applied to the side surface of the wire 2 and the surface of the ball 25 without applying the force concentrated on one point of the wire 2. That is, the force applied to a certain point of the wire 2 is smaller than when a moment of the same magnitude is applied to the wire 2 by a method other than wind. As a result, when the wire 2 is bent, it is possible to prevent unintentional deformation or disconnection that may occur in a portion of the wire 2 where a force is applied.

また、溝１４の存在によって、ワイヤ中間部２２を折り曲げ、ボール２５をキャピラリ１における捕捉部１３に捕捉させる際、送り出されたワイヤ２におけるワイヤ中間部２２とボール２５の間の部分が固定されやすくなる。その結果、送り出されたワイヤ２の先端のボール２５は、捕捉部１３に固定されやすくなる。したがって、本発明に係るキャピラリを用いたワイヤボンディングをより確実に行うことができる。   Further, when the wire intermediate portion 22 is bent and the ball 25 is captured by the capturing portion 13 in the capillary 1 due to the presence of the groove 14, the portion between the wire intermediate portion 22 and the ball 25 in the fed wire 2 is easily fixed. Become. As a result, the ball 25 at the tip of the fed wire 2 is easily fixed to the capturing unit 13. Therefore, wire bonding using the capillary according to the present invention can be performed more reliably.

本発明に係る電子装置の製造方法および電子装置は、上述した実施形態に限定されるものではない。本発明に係る電子装置の製造方法および電子装置の各部の具体的な構成は、種々に設計変更自在である。 The method for manufacturing an electronic device and the electronic device according to the present invention are not limited to the above-described embodiments. The method of manufacturing the electronic device according to the present invention and the specific configuration of each part of the electronic device can be modified in various ways.

本発明に係る電子装置の製造方法に用いられるキャピラリの一例を示す要部斜視図である。It is a principal part perspective view which shows an example of the capillary used for the manufacturing method of the electronic device which concerns on this invention. 図１のII−II線に沿う要部断面図である。It is principal part sectional drawing in alignment with the II-II line | wire of FIG. 本発明に係る電子装置の製造方法の一例におけるボールの形成を示す要部断面図である。It is principal part sectional drawing which shows formation of the ball | bowl in an example of the manufacturing method of the electronic device which concerns on this invention. 本発明に係る電子装置の製造方法の一例においてワイヤを変形する工程を示す要部断面図である。It is principal part sectional drawing which shows the process of deform | transforming a wire in an example of the manufacturing method of the electronic device which concerns on this invention. 本発明に係る電子装置の製造方法の一例におけるキャピラリの接近動作を示す要部断面図である。It is principal part sectional drawing which shows the approach operation | movement of the capillary in an example of the manufacturing method of the electronic device which concerns on this invention. 本発明に係る電子装置の製造方法の一例におけるキャピラリの押し付け動作を示す要部断面図である。It is principal part sectional drawing which shows the pressing operation of the capillary in an example of the manufacturing method of the electronic device which concerns on this invention. 本発明に係る電子装置の製造方法の一例におけるキャピラリの引き上げ動作を示す要部断面図である。It is principal part sectional drawing which shows the raising operation | movement of a capillary in an example of the manufacturing method of the electronic device which concerns on this invention. 従来の電子装置の製造方法の一例によってワイヤボンディングされた素子を示す断面図である。It is sectional drawing which shows the element wire-bonded by an example of the manufacturing method of the conventional electronic device .

１ キャピラリ
１１ 貫通孔
１２ 貫通孔先端
１３ 捕捉部
１４ 溝
２０ ワイヤ
２ 送り出されたワイヤ
２１ ワイヤ先端
２２ ワイヤ中間部
２５ ボール
３ 接続ワイヤ
３１ ボンディング部
３２ ボンディング部
４１ リードフレーム
４２ 電子素子
４３ａ 電極
４３ｂ パッド DESCRIPTION OF SYMBOLS 1 Capillary 11 Through-hole 12 Through-hole tip 13 Capture part 14 Groove 20 Wire 2 Wire sent out 21 Wire tip 22 Wire intermediate part 25 Ball 3 Connection wire 31 Bonding part 32 Bonding part 41 Lead frame 42 Electronic element 43a Electrode 43b Pad

Claims (18)

貫通孔を有し、この貫通孔に挿通されたワイヤを上記貫通孔先端から送り出すことができるキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断することにより、２つの上記接続対象部を、両端が上記先端と上記中間部である接続ワイヤによって接続する電子装置の製造方法であって、
上記キャピラリとして、上記ワイヤを送り出す方向に直角な方向において、上記貫通孔先端から離間し、かつ、送り出されたワイヤの先端を捕捉できる捕捉部、を有するものを用い、
上記ワイヤを上記キャピラリから送り出した後に、上記送り出されたワイヤの先端を上記捕捉部に捕捉させるように、上記送り出されたワイヤを変形する工程と、
上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴とする電子装置の製造方法。 Using a capillary having a through-hole and capable of feeding the wire inserted through the through-hole from the tip of the through-hole, the tip of the wire is joined to one connection target part, and the middle part of the wire is joined to the other part A method of manufacturing an electronic device in which two connection target parts are connected to each other by a connection wire whose both ends are the tip and the intermediate part by joining and cutting the connection target part of
As the capillary, in a direction perpendicular to the direction in which the wire is sent out, the capillaries are separated from the tip of the through hole and have a capturing part that can catch the tip of the sent wire,
A step of deforming the delivered wire so that the capture portion captures the tip of the delivered wire after delivering the wire from the capillary;
In a state where the capillary is brought close to the two joining target parts such that the tip of the through hole faces the other joining target part and the capturing part faces one of the joining target parts, The tip is joined to one of the connection target parts, and the intermediate portion sandwiched between the tip of the through hole and the other connection target part of the wire is joined to the other connection target part and cut. And a method for manufacturing the electronic device. ワイヤを貫通孔先端から送り出すことができるキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断することにより、２つの上記接続対象部を、両端が上記先端と上記中間部である接続ワイヤによって接続する電子装置の製造方法であって、
上記キャピラリとして、上記貫通孔先端から離間し、かつ、送り出されたワイヤの先端を捕捉できる捕捉部、を有するものを用い、
上記ワイヤを上記キャピラリから送り出した後に、上記送り出されたワイヤの先端を上記捕捉部に捕捉させるように、上記送り出されたワイヤを変形する工程と、
上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴とする電子装置の製造方法。 By using a capillary that can send out the wire from the tip of the through-hole, joining the tip of the wire to one connection target part, joining the intermediate part of the wire to the other connection target part, and cutting, A method of manufacturing an electronic device in which two connection target parts are connected by a connection wire whose both ends are the tip and the intermediate part,
As the capillary, using a capture part that is separated from the tip of the through hole and that can capture the tip of the fed wire,
A step of deforming the delivered wire so that the capture portion captures the tip of the delivered wire after delivering the wire from the capillary;
In a state where the capillary is brought close to the two joining target parts such that the tip of the through hole faces the other joining target part and the capturing part faces one of the joining target parts, The tip is joined to one of the connection target parts, and the intermediate portion sandwiched between the tip of the through hole and the other connection target part of the wire is joined to the other connection target part and cut. And a method for manufacturing the electronic device. ワイヤを通す貫通孔を有するキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断する電子装置の製造方法であって、
上記キャピラリとして、上記ワイヤを送り出す方向に直角な方向において、上記貫通孔先端から離間し、かつ、送り出されたワイヤの先端を捕捉できる捕捉部、を有するものを用い、
上記ワイヤを上記キャピラリから送り出した後に、上記送り出されたワイヤの先端を上記捕捉部に捕捉させるように、上記送り出されたワイヤを変形する工程と、
上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴とする電子装置の製造方法。 In a method of manufacturing an electronic device, using a capillary having a through-hole through which a wire passes, the tip of the wire is joined to one connection target part, and the intermediate part of the wire is joined to the other connection target part and cut. There,
As the capillary, in a direction perpendicular to the direction in which the wire is sent out, the capillaries are separated from the tip of the through hole and have a capturing part that can catch the tip of the sent wire,
A step of deforming the delivered wire so that the capture portion captures the tip of the delivered wire after delivering the wire from the capillary;
In a state where the capillary is brought close to the two joining target parts such that the tip of the through hole faces the other joining target part and the capturing part faces one of the joining target parts, The tip is joined to one of the connection target parts, and the intermediate portion sandwiched between the tip of the through hole and the other connection target part of the wire is joined to the other connection target part and cut. And a method for manufacturing the electronic device. ワイヤを通す貫通孔を有し、上記貫通孔先端から離間し、ワイヤの先端を捕捉できる捕捉部を有するキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断する電子装置の製造方法であって、
上記ワイヤを上記キャピラリから送り出した後に、上記送り出されたワイヤの先端を上記捕捉部に捕捉させるように、上記送り出されたワイヤを変形する工程と、
上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴とする電子装置の製造方法。 Using a capillary having a through-hole through which a wire passes, spaced apart from the tip of the through-hole, and having a capturing portion capable of capturing the tip of the wire, the tip of the wire is joined to one connection target portion, and the middle of the wire A method of manufacturing an electronic device for joining and cutting a part to the other connection target part,
A step of deforming the delivered wire so that the capture portion captures the tip of the delivered wire after delivering the wire from the capillary;
In a state where the capillary is brought close to the two joining target parts such that the tip of the through hole faces the other joining target part and the capturing part faces one of the joining target parts, The tip is joined to one of the connection target parts, and the intermediate portion sandwiched between the tip of the through hole and the other connection target part of the wire is joined to the other connection target part and cut. And a method for manufacturing the electronic device. ワイヤを通す貫通孔を有し、上記貫通孔先端から離間し、ワイヤの先端を捕捉できる捕捉部を有するキャピラリを用いて、上記ワイヤの先端を一方の接続対象部に接合し、上記ワイヤの中間部を他方の接続対象部に接合し、かつ切断する電子装置の製造方法であって、
上記ワイヤの先端を上記捕捉部に捕捉させるように、上記ワイヤを変形する工程と、
上記貫通孔先端が他方の上記接合対象部に、上記捕捉部が一方の上記接合対象部に、それぞれ正対するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴とする電子装置の製造方法。 Using a capillary having a through-hole through which a wire passes, spaced apart from the tip of the through-hole, and having a capturing portion capable of capturing the tip of the wire, the tip of the wire is joined to one connection target portion, and the middle of the wire A method of manufacturing an electronic device for joining and cutting a part to the other connection target part,
A step of deforming the wire so that the capturing part captures the tip of the wire;
In a state where the capillary is brought close to the two joining target parts such that the tip of the through hole faces the other joining target part and the capturing part faces one of the joining target parts, The tip is joined to one of the connection target parts, and the intermediate portion sandwiched between the tip of the through hole and the other connection target part of the wire is joined to the other connection target part and cut. And a method for manufacturing the electronic device. 上記送り出されたワイヤを変形する工程においては、風力により上記送り出されたワイヤを変形する、請求項１ないし５のいずれかに記載の電子装置の製造方法。   The method of manufacturing an electronic device according to claim 1, wherein in the step of deforming the sent-out wire, the sent-out wire is deformed by wind power. 上記キャピラリは、上記貫通孔先端と上記捕捉部とをつなぐ溝をさらに有し、
上記送り出されたワイヤを変形する工程においては、上記送り出されたワイヤのうち上記中間部から上記先端の間における部分を上記溝に沿わせる、請求項１ないし６のいずれかに記載の電子装置の製造方法。 The capillary further includes a groove that connects the tip of the through hole and the capturing part,
7. The electronic device according to claim 1, wherein, in the step of deforming the sent-out wire, a portion between the intermediate portion and the tip of the sent-out wire extends along the groove. Production method. 上記捕捉部は、凹部である、請求項１ないし７のいずれかに記載の電子装置の製造方法。   The method of manufacturing an electronic device according to claim 1, wherein the capturing part is a concave part. 上記凹部は、部分球形状である、請求項８に記載の電子装置の製造方法。   The method for manufacturing an electronic device according to claim 8, wherein the concave portion has a partial spherical shape. 上記捕捉部は、凹部であり、
上記溝の幅方向における上記凹部の寸法は、上記溝の幅よりも大である、請求項７に記載の電子装置の製造方法。 The capturing part is a concave part,
The method for manufacturing an electronic device according to claim 7, wherein a size of the concave portion in a width direction of the groove is larger than a width of the groove. 上記捕捉部は、上記貫通孔の貫通方向において上記貫通孔先端よりも上流側に位置している、請求項１ないし１０のいずれかに記載の電子装置の製造方法。   11. The method of manufacturing an electronic device according to claim 1, wherein the capturing part is located upstream of the tip of the through hole in the through direction of the through hole. ワイヤを通す貫通孔を有し、上記貫通孔先端から離間し、ワイヤの先端を捕捉できる捕捉部を有するキャピラリを用いる電子装置の製造方法であって、
上記ワイヤを変形させることにより上記ワイヤの先端を上記捕捉部に捕捉させる工程と、
上記貫通孔先端が他方の上記接合対象部に接近し、上記捕捉部が一方の上記接合対象部に接近するように、上記キャピラリを２つの上記接合対象部に接近させた状態で、上記ワイヤの先端を一方の上記接続対象部に接合するとともに、上記ワイヤのうち上記貫通孔先端と他方の上記接続対象部とに挟まれた上記中間部を、他方の上記接続対象部に接合し、かつ切断する工程と、を有することを特徴とする電子装置の製造方法。 A method for manufacturing an electronic device using a capillary having a through-hole through which a wire passes, spaced apart from the tip of the through-hole, and having a capturing part capable of capturing the tip of the wire
A step of causing the capturing part to capture the tip of the wire by deforming the wire;
With the capillary close to the two joining target parts such that the tip of the through hole approaches the other joining target part and the capture part approaches one of the joining target parts, The tip is joined to one of the connection target parts, and the intermediate portion sandwiched between the tip of the through hole and the other connection target part of the wire is joined to the other connection target part and cut. And a method for manufacturing the electronic device. 上記捕捉させる工程においては、風力により上記送り出されたワイヤを変形する、請求項１２に記載の電子装置の製造方法。   The method of manufacturing an electronic device according to claim 12, wherein, in the capturing step, the wire sent out is deformed by wind power. 上記キャピラリは、上記貫通孔先端と上記捕捉部とをつなぐ溝をさらに有し、
上記捕捉させる工程においては、上記送り出されたワイヤのうち上記中間部から上記先端の間における部分を上記溝に沿わせる、請求項１２または１３に記載の電子装置の製造方法。 The capillary further includes a groove that connects the tip of the through hole and the capturing part,
14. The method of manufacturing an electronic device according to claim 12 or 13, wherein, in the capturing step, a portion between the intermediate portion and the tip of the fed-out wire extends along the groove. 上記捕捉部は、凹部である、請求項１２ないし１４のいずれかに記載の電子装置の製造方法。   The method of manufacturing an electronic device according to claim 12, wherein the capturing part is a concave part. 上記凹部は、部分球形状である、請求項１５に記載の電子装置の製造方法。   The method of manufacturing an electronic device according to claim 15, wherein the concave portion has a partial spherical shape. 上記捕捉部は、凹部であり、
上記溝の幅方向における上記凹部の寸法は、上記溝の幅よりも大である、請求項１４に記載の電子装置の製造方法。 The capturing part is a concave part,
The method of manufacturing an electronic device according to claim 14, wherein a size of the recess in a width direction of the groove is larger than a width of the groove. 上記捕捉部は、上記貫通孔の貫通方向において上記貫通孔先端よりも上流側に位置している、請求項１２ないし１７のいずれかに記載の電子装置の製造方法。 18. The method of manufacturing an electronic device according to claim 12, wherein the capturing unit is located upstream of the tip of the through hole in the through direction of the through hole .
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