JP5229243B2 - Air conditioning indoor unit and method for manufacturing transmission device provided in the air conditioning indoor unit - Google Patents

Description

The present invention relates to an air-conditioning indoor unit , and more particularly to an air-conditioning indoor unit including a transmission device that transmits an infrared signal via an infrared light-emitting diode.

  A wireless remote control unit (hereinafter referred to as a remote controller) includes a transmission circuit that transmits an infrared signal via an infrared light emitting diode. The intensity of the infrared signal emitted from the infrared light emitting diode is determined by the current value supplied to the infrared light emitting diode. Therefore, if the intensity of the infrared signal differs depending on the model of the device to be transmitted, a corresponding number of remote controllers are required.

  However, providing different remote controllers for each model increases costs in terms of parts and assembly, and various circuits for reducing the cost have been studied. For example, Patent Document 1 (Japanese Patent Laid-Open No. 2003-148790) discloses a technology in which each air conditioner and remote controller share model type information, and the remote controller changes the internal settings according to the type of air conditioner to be transmitted. Has been. Japanese Patent Application Laid-Open No. 2006-311053 discloses a technique in which a remote controller includes a plurality of transmission circuits and a transmission circuit is selected by a switch.

  According to the technology of Patent Document 1, since one remote controller can support various types of air conditioners, management costs can be reduced by standardization, but a large-capacity memory and electronic components that are compatible with all models are mounted. This increases the part cost. In addition, according to the technique of Patent Document 2, a circuit for switching the switch is necessary, and the cost of parts correspondingly increases. That is, both involve an increase in component costs.

An object of the present invention, in accordance with the current to be supplied to the infrared light emitting diodes, is mounted to only the electronic component group required, and the substrate to which the electronic component group is mounted is also used, a transmission apparatus of an infrared signal It is to provide an air conditioning indoor unit .

An air conditioning indoor unit according to a first aspect of the present invention includes a transmission device that transmits an infrared signal by supplying a predetermined current to an infrared light emitting diode, and a main body in which a receiving unit that receives the infrared signal is located on the front side or the lower side. And a casing. Transmitting device includes a substrate, a wiring pattern first transmitting circuit, and a for the second transmission circuit wiring pattern. The first transmission circuit wiring pattern is formed on the substrate, and a first electronic component group for supplying a first current to the infrared light emitting diode is mounted thereon. The second transmission circuit wiring pattern is formed on the substrate, and a second electronic component group for supplying a second current different from the first current to the infrared light emitting diode is mounted thereon. And in the transmission apparatus corresponding to the main body casing in which the reception unit is located on the front side, the first electronic component group is mounted on the first transmission circuit wiring pattern. Further, in the transmission device corresponding to the main body casing in which the reception unit is located on the lower surface side, the second electronic component group is selectively mounted on the second transmission circuit wiring pattern.

  In this transmission device, only the minimum necessary components for supplying the necessary current to the infrared light emitting diode are mounted, so that an increase in cost due to an increase in the number of components is suppressed.

Air conditioner indoor unit according to a second aspect of the present invention is the air conditioning indoor unit pertaining to the first aspect, the infrared emission intensity when the second current is supplied to the infrared light emitting diode, a first current to the infrared light emitting diode Is greater than when supplied.

  In this transmitter, since one of a plurality of transmitters having different infrared emission intensities can be manufactured using one substrate, it is not necessary to change the substrate for each magnitude of the infrared emission intensity.

Air conditioner indoor unit according to the third aspect of the present invention is the air conditioning indoor unit pertaining to the first aspect, the second electronic component group, and a common shared group of electronic components between the first electronic component group, the Non-common electronic component groups that are not common to one electronic component group are included. When the first electronic component group is mounted on the first transmission circuit wiring pattern, the non-common electronic component group is not mounted on the second transmission circuit wiring pattern.

  In this transmission device, when the first electronic component group is mounted on the first transmission circuit wiring pattern, the non-common electronic component group is not mounted on the second transmission circuit wiring pattern, so the number of components is reduced accordingly. Is done.

Air conditioning indoor unit pertaining to a fourth aspect of the present invention is the air conditioning indoor unit pertaining to a third aspect, the first electronic component group of at least, and a switching element and a jumper wire. The switching element has a collector terminal connected to the cathode side line of the infrared light emitting diode. The jumper line is connected in series to the base terminal side line of the switching element. The common electronic component group of the second electronic component group includes an electronic component group obtained by removing the jumper line from the first electronic component group.

  In this transmission device, the common electronic component group of the second electronic component group is formed only by removing the jumper wire from the first electronic component group. For example, in the production of the transmission device, the first current is supplied to the infrared light emitting diode. Even when the production amount of the transmission device decreases and the production amount of the transmission device for supplying the second current increases, it is easy to divert components.

Air conditioning indoor unit pertaining to a fifth aspect of the present invention is the air conditioning indoor unit pertaining to the fourth aspect, by the non-common electronic component group is mounted on the wiring pattern for the second transmission circuit, the first switching element A circuit is formed to increase the base current.

  In this transmission device, the difference between the first current and the second current is determined by the non-common electronic component group. Therefore, when a transmission device that further increases the infrared light emission intensity is required, that is, the first current and the second current in the infrared light emitting diode. If a transmitter for supplying a current different from the current is required, the non-common electronic component group may be changed, and the model can be easily expanded.

Air conditioning indoor unit pertaining to a sixth aspect of the present invention is the air conditioning indoor unit pertaining to a third aspect, the second transmission circuit wiring pattern is common common wiring pattern between the first transmission circuit wiring pattern Is included. The common electronic component group is mounted on the common wiring pattern in the same arrangement as that of the first electronic component group.

  In this transmission device, a sub-unit for mounting a common electronic component group on a common wiring pattern irrespective of whether a transmission device that supplies a first current to an infrared light emitting diode or a transmission device that supplies a second current is manufactured. Even if assembly is performed in advance, productivity is improved because it is not wasted.

Air conditioning indoor unit pertaining to a seventh aspect of the present invention is the air conditioning indoor unit pertaining to the first aspect, the second transmission circuit wiring pattern is common common wiring pattern between the first transmission circuit wiring pattern Is included. In this transmission apparatus, wiring saving is achieved by forming a common wiring pattern, so that the cost associated with wiring is reduced.

The manufacturing method of the transmission apparatus which concerns on the 8th viewpoint of this invention is a manufacturing method of the transmission apparatus with which the air-conditioning indoor unit which concerns on a 1st viewpoint is provided , Comprising: On the board | substrate, the wiring pattern for 1st transmission circuits, and 2nd transmission A circuit wiring pattern is formed. A first electronic component group for supplying a first current to the infrared light emitting diode is mounted on the first transmission circuit wiring pattern. A second electronic component group for supplying a second current different from the first current to the infrared light emitting diode is mounted on the second transmission circuit wiring pattern. When the transmission device is used as a device for supplying the first current to the infrared light emitting diode, the first electronic component group is mounted on the first transmission circuit wiring pattern, and the second electronic circuit is mounted on the second transmission circuit wiring pattern. Parts group is not mounted.

  In this method for manufacturing a transmitting device, the current supplied to the infrared light emitting diode is determined by selecting an electronic component group mounted on the substrate at the time of manufacturing, and therefore there is no need to provide a switching means for switching.

In the air conditioner indoor unit according to the first aspect of the present invention, only the minimum necessary components for supplying the necessary current to the infrared light emitting diode are mounted, so that an increase in cost due to an increase in the number of components is suppressed.

In the air conditioner indoor unit according to the second aspect of the present invention, since any one of a plurality of transmitters having different infrared light emission intensities can be manufactured using a single substrate, a substrate for each magnitude of the infrared light emission intensity. There is no need to change.

In the air conditioning indoor unit according to the third aspect of the present invention, when the first electronic component group is mounted on the first transmission circuit wiring pattern, the non-common electronic component group is not mounted on the second transmission circuit wiring pattern. The number of parts is reduced accordingly.

In the air conditioning indoor unit according to the fourth aspect of the present invention, the common electronic component group of the second electronic component group is formed only by removing the jumper wire from the first electronic component group, so that the component diversion is easy.

In the air conditioner indoor unit according to the fifth aspect of the present invention, the difference between the first current and the second current is determined by the non-common electronic component group, so that the model expansion is easy.

In the air conditioning indoor unit pertaining to the sixth aspect of the present invention, productivity is improved because it is not wasted even if the subassembly for mounting the common electronic component group on the common wiring pattern is performed in advance.

In the air conditioning indoor unit pertaining to the seventh aspect of the present invention, wiring saving is achieved by forming a common wiring pattern, so the cost associated with wiring is reduced.

  In the method for manufacturing a transmitting apparatus according to the eighth aspect of the present invention, the current supplied to the infrared light emitting diode is determined by selecting an electronic component group mounted on the substrate at the time of manufacture, so that switching means for switching, etc. It is not necessary to have.

Schematic of the remote control in which the transmission apparatus which concerns on this embodiment is used, and the air-conditioning indoor unit which is the to-be-transmitted apparatus. The circuit diagram of the 1st transmission circuit mounted in a 1st remote control. The circuit diagram of the 2nd transmission circuit carried in the 2nd remote control. (A) The top view of the wiring pattern part for 1st transmission circuits of a board | substrate, (b) The top view of the wiring pattern part for 2nd transmission circuits of a board | substrate.

  FIG. 1 is a schematic diagram of a remote controller in which the transmission device according to the present embodiment is used and an air conditioning indoor unit that is a device to be transmitted. In FIG. 1, there are two types of air conditioning indoor units 1, a first air conditioning indoor unit 1A and a second air conditioning indoor unit 1B. The first air conditioning indoor unit 1A has a light receiving portion 10a that receives infrared rays from a wireless remote control unit 2 (hereinafter referred to as a remote control 2) on the front side of the main casing 10. The second air conditioning indoor unit 1 </ b> B has a light receiving portion 10 b that receives infrared rays from the remote controller 2 on the lower surface side of the main casing 10.

  Since the light receiving unit 10b of the second air conditioning indoor unit 1B is on the lower surface side of the main body casing 10, the infrared rays emitted from the remote controller 2 are reflected by the wall and the object rather than directly entering the light receiving unit 10b and enter the light receiving unit. Probability is high. When the infrared intensity from the remote controller 2 is small, the intensity is further attenuated by reflection, and the second air conditioning indoor unit 1B may not react. Therefore, it is preferable that the infrared emission intensity is large.

  In addition to the condition that the light receiving unit as shown in FIG. 1 is located on the front surface or the lower surface of the main casing 10, the infrared intensity of the remote controller 2 is not limited to an air conditioning indoor unit in which the light receiving unit is located at the same location. May be different. For convenience of explanation, the remote controller 2 on the side with the lower infrared intensity is called the first remote controller 2A, and the remote controller 2 on the side with the higher infrared intensity is called the second remote controller 2B.

(First transmission circuit 21)
FIG. 2 is a circuit diagram of a first transmission circuit mounted on the first remote controller. In FIG. 2, the first transmission circuit 21 is mounted on the substrate 20 and includes an infrared light emitting diode D1, a first transistor Q1, a first resistor R1, a second resistor R2, and a jumper line JP.

  The infrared light emitting diode D1 emits infrared light having an intensity corresponding to the supplied current. The first transistor Q1 is a switching element that supplies and cuts off current to the infrared light emitting diode D1, and its collector terminal is connected to the cathode terminal of the infrared light emitting diode D1. The emitter terminal is grounded.

  The first resistor R1 is a resistor that limits the current supplied to the infrared light emitting diode D1, and one terminal is connected to the anode terminal of the infrared light emitting diode D1, and the other terminal is connected to the power supply Vcc.

  The second resistor R2 is a resistor that limits the base current of the first transistor Q1, and one terminal is connected to the base terminal of the first transistor Q1. Jumper line JP has one terminal connected to second resistor R2, and the other terminal connected to a signal line of a microcomputer (not shown). The jumper line JP is not mounted when the first transmission circuit 21 is not mounted on the substrate 20.

  In the first transmission circuit 21, a signal of a predetermined voltage is output from the microcomputer to the base terminal of the first transistor Q1, whereby the collector terminal and the emitter terminal are turned on, and the infrared light emitting diode D1 is supplied from the power source Vcc to the first terminal. One current is supplied, and the infrared light emitting diode D1 emits light.

  The first transistor Q1, the first resistor R1, the second resistor R2, and the jumper line JP are an electronic component group for supplying a first current to the infrared light emitting diode D1, and for the convenience of the following description, the first electronic component is used. This is called group 210.

(Second transmission circuit 22)
FIG. 3 is a circuit diagram of a second transmission circuit mounted on the second remote controller. In FIG. 3, the second transmission circuit 22 is mounted on the substrate 20, and includes an infrared light emitting diode D1, a first transistor Q1, a first resistor R1, a second resistor R2, a second transistor Q2, a third resistor R3, And a fourth resistor R4.

  The functions of the infrared light emitting diode D1, the first transistor Q1, the first resistor R1, and the second resistor R2 in the second transmission circuit 22 are the same as those functions in the first transmission circuit 21, and thus the description thereof is omitted.

  The second transistor Q2 is a switching element that supplies and cuts off the base current of the first transistor Q1, and has a collector terminal connected to the power supply Vcc and an emitter terminal connected to the second resistor R2.

  The third resistor R3 has one terminal connected to the base terminal of the second transistor Q2, and the other terminal connected to the signal line of the microcomputer.

  In the second transmission circuit 22, when a signal of a predetermined voltage is output from the microcomputer to the base terminal of the second transistor Q2, the collector terminal and the emitter terminal of the second transistor Q2 are turned on, whereby the first transistor A base current flows through the base terminal of the transistor Q1, the collector terminal and the emitter terminal of the first transistor Q1 are turned on, a second current is supplied from the power source Vcc to the infrared light emitting diode D1, and the infrared light emitting diode D1 emits light.

  The first transistor Q1, the first resistor R1, the second resistor R2, the second transistor Q2, the third resistor R3, and the fourth resistor R4 are an electronic component group for supplying a second current to the infrared light emitting diode D1. For convenience of the following description, this will be referred to as a second electronic component group 220.

  Further, since the first transistor Q1, the first resistor R1, and the second resistor R2 of the second transmission circuit 22 are common to the first transmission circuit 21, the common electronic component group 221 is convenient for the following explanation. Called. The common electronic component group 221 of the second electronic component group 220 is formed only by removing the jumper line JP from the first electronic component group 210. Therefore, for example, in the production plan for the remote controller 2, the first remote controller 2A on which the first transmission circuit 21 is mounted. Even when the production amount of the second remote controller 2B equipped with the second transmission circuit 22 is increased and the production amount of the second remote control 2B is increased, the diversion of the parts is easy.

  Further, since the second transistor Q2, the third resistor R3, and the fourth resistor R4 are not common to the first transmission circuit 21, they are referred to as a non-common electronic component group 222 for convenience of the following description. By mounting the non-common electronic component group 222 on the substrate 20, a circuit for increasing the base current of the first switching element Q1 is formed. That is, the larger the base current of the first switching element Q1, the larger the current supplied to the infrared light emitting diode D1, and the larger the current of the infrared light emitting diode D1, the stronger the emission intensity of the infrared light emitting diode D1.

  That is, the second current supplied from the power supply Vcc to the infrared light emitting diode D1 by the second transmission circuit 22 is larger than the first current supplied from the power supply Vcc to the infrared light emitting diode D1 by the first transmission circuit 21, and emits infrared light. The light emission intensity of the diode D1 is also strong. Then, the difference between the first current and the second current is determined by the non-common electronic component group 222. If a transmitter that further increases the infrared emission intensity is required, the non-common electronic component group 222 may be changed. .

  The first remote controller 2A and the second remote controller 2B have a difference in configuration between the first transmission circuit 21 and the second transmission circuit 22, but the other configuration is the same. Therefore, when the wiring pattern is screen-printed on the substrate 20, the substrate 20 has the wiring pattern 10 that can correspond to both the first transmission circuit 21 and the second transmission circuit 22. It is not necessary to manufacture a substrate every time, and an increase in manufacturing cost can be suppressed. Hereinafter, specific examples will be described with reference to the drawings.

  4A is a plan view of the first transmission circuit wiring pattern portion of the substrate, and FIG. 4B is a plan view of the second transmission circuit wiring pattern portion of the substrate. 4A, the first transmission circuit wiring pattern 11 includes a wiring pattern 110 surrounded by a broken line and a wiring pattern 111 surrounded by an alternate long and short dash line. The second transmission circuit wiring pattern 12 includes a wiring pattern 110 surrounded by a broken line and a wiring pattern 112 surrounded by a two-dot chain line.

  Since the wiring pattern 110 surrounded by the broken line is common between the first transmission circuit wiring pattern 11 and the second transmission circuit wiring pattern 12, it is hereinafter referred to as a common wiring pattern 110. Since the common wiring pattern 110 is formed, wiring saving can be achieved, so that the cost related to wiring is reduced.

  In the present embodiment, since the first transmission circuit wiring pattern 11 and the second transmission circuit wiring pattern 12 are formed on one substrate 20, the first electronic component is formed on the first transmission circuit wiring pattern 11. By mounting the group 210, the first transmission circuit 21 for supplying the first current to the infrared light emitting diode D1 is manufactured. Further, by mounting the second electronic component group 220 on the second transmission circuit wiring pattern 12, the second transmission circuit 22 for supplying the second current to the infrared light emitting diode D1 is manufactured.

  In addition, since the common electronic component group 221 of the second electronic component group 220 is mounted on the common wiring pattern 110 in the same arrangement as the mounting arrangement of the first electronic component group 220, the first remote controller on which the first transmission circuit 21 is mounted. Regardless of which of the second remote controller 2B mounted with 2A and the second transmission circuit 22 is produced, it is useless even if the subassembly for mounting the common electronic component group 221 on the common wiring pattern 110 is performed in advance. Don't be.

  Further, the current supplied to the infrared light emitting diode D1 by the manufacturing method as described above includes the wiring pattern 10 (including the first transmission circuit wiring pattern 11 and the second transmission circuit wiring pattern 12) on the substrate 20 at the time of manufacturing. ) Is determined depending on which of the first electronic component group 210 and the second electronic component group 220 is selected as the electronic component group to be mounted on (), so that it is not necessary to provide switching means for switching.

  As described above, the first electronic component group 210 is mounted on the first transmission circuit wiring pattern 11 on the substrate 20 if the first remote controller 2A is used even if the external appearance is exactly the same. The second electronic component group 220 is not mounted on the wiring pattern 12. In the case of the second remote controller 2B, the second electronic component group 220 is mounted on the second transmission circuit wiring pattern 12 on the substrate 20, and the first electronic component group 210 is mounted on the first transmission circuit wiring pattern 11. Is not implemented.

  Note that a common electronic component group 221 exists between the first electronic component group 210 and the second electronic component group 220, and the first electronic component group 210 is for causing the first current to flow through the infrared light emitting diode D1. Since it is an electronic component group, the first electronic component group 210 cannot be said to be mounted because the common electronic component group 221 alone cannot flow the first current through the infrared light emitting diode D1.

  Similarly, the second electronic component group 220 is an electronic component group for passing a second current through the infrared light emitting diode D1, and the second current cannot be passed through the infrared light emitting diode D1 with the common electronic component group 221 alone. It cannot be said that the second electronic component group 220 is mounted.

<Features>
(1)
In the first remote controller 2 </ b> A and the second remote controller 2 </ b> B, the first transmission circuit wiring pattern 11 and the second transmission circuit wiring pattern 12 are formed on the substrate 20. When used as the first remote controller 2A, a first electronic component group 210 for supplying a first current to the infrared light emitting diode D1 is mounted on the first transmission circuit wiring pattern 11. When used as the second remote controller 2B, a second electronic component group 220 for supplying a second current to the infrared light emitting diode D1 is mounted on the second transmission circuit wiring pattern 12. That is, it is selectively performed that the first electronic component group 210 is mounted on the first transmission circuit wiring pattern 11 or that the second electronic component group 220 is mounted on the second transmission circuit wiring pattern 12. . As a result, only the minimum necessary parts for supplying the necessary current to the infrared light emitting diode D1 can be mounted on the first remote controller 2A or the second remote controller 2B. The increase is suppressed, and as a result, the manufacturing cost can be reduced.

(2)
In addition, since one of the first remote controller 2A and the second remote controller 2B having different infrared emission intensity can be manufactured using one substrate 20, it is not necessary to change the substrate for each magnitude of the infrared emission intensity. .

(3)
The second electronic component group 220 includes a common electronic component group 221 that is common to the first electronic component group 210 and a non-common electronic component group 222 that is not common to the first electronic component group 210. It is out. When the first electronic component group 210 is mounted on the first transmission circuit wiring pattern 11, the non-common electronic component group 222 is not mounted on the second transmission circuit wiring pattern 12. Is done.

  As described above, according to the present invention, only the necessary electronic component group is mounted according to the current to be supplied to the infrared light emitting diode, and the board on which the electronic component group is mounted is also used. This is useful not only for remote control of indoor units but also for remote control of other devices.

11 First Transmitting Circuit Wiring Pattern 12 Second Transmitting Circuit Wiring Pattern 20 Substrate 20
D1 Infrared light emitting diode Q1 First switching element JP Jumper wire

JP 2003-148790 A JP 2006-311053 A

Claims (8)

A transmitter (2) for supplying a predetermined current to the infrared light emitting diode (D1) and transmitting an infrared signal ;
A main body casing (10) in which a receiver (10b) for receiving the infrared signal is located on the front side or the lower side;
With
The transmission device (2)
A substrate (20);
A first transmission circuit wiring pattern (11) formed on the substrate (20) and mounted with a first electronic component group for supplying a first current to the infrared light emitting diode (D1);
A second transmission circuit wiring pattern (12) formed on the substrate (20) and mounted with a second electronic component group for supplying a second current different from the first current to the infrared light emitting diode (D1). )When,
Have
In the transmission device (2) corresponding to the main casing (10) in which the reception unit (10b) is located on the front side, the first electronic component group is mounted on the first transmission circuit wiring pattern (11). ,
In the transmission device (2) corresponding to the main casing (10) in which the reception unit (10b) is located on the lower surface side, the second electronic component group is mounted on the second transmission circuit wiring pattern (12). The
Air conditioning indoor unit (1). Infrared light emission intensity when the second current is supplied to the infrared light emitting diode (D1) is larger than when the first current is supplied to the infrared light emitting diode (D1),
The air conditioning indoor unit (1) according to claim 1 . The second electronic component group is:
A common electronic component group common to the first electronic component group;
A non-common electronic component group that is not common to the first electronic component group;
Including
When the first electronic component group is mounted on the first transmission circuit wiring pattern (11), the non-common electronic component group is not mounted on the second transmission circuit wiring pattern (12).
The air conditioning indoor unit (1) according to claim 1 . The first electronic component group is at least
A switching element (Q1) having a collector terminal connected to the cathode side line of the infrared light emitting diode (D1);
A jumper wire (JP) connected in series to the base terminal side line of the switching element (Q1);
Including
The common electronic component group of the second electronic component group includes an electronic component group obtained by removing the jumper wire (JP) from the first electronic component group.
The air conditioning indoor unit (1) according to claim 3 . A circuit for increasing the base current of the first switching element (Q1) is formed by mounting the non-common electronic component group on the second transmission circuit wiring pattern.
The air conditioning indoor unit (1) according to claim 4 . The second transmission circuit wiring pattern (12) includes a common wiring pattern common to the first transmission circuit wiring pattern (11),
The common electronic component group is mounted on the common wiring pattern in the same arrangement as the first electronic component group.
The air conditioning indoor unit (1) according to claim 3 . The second transmission circuit wiring pattern (12) includes a common wiring pattern common to the first transmission circuit wiring pattern (11).
The air conditioning indoor unit (1) according to claim 1 . It is a manufacturing method of the transmitting device with which the air-conditioning indoor unit according to claim 1 is provided ,
On the substrate (20),
A first transmission circuit wiring pattern (11) on which a first electronic component group for supplying a first current to the infrared light emitting diode (D1) is mounted;
A second transmission circuit wiring pattern (12) on which a second electronic component group for supplying a second current different from the first current to the infrared light emitting diode (D1) is mounted;
Formed,
When the transmission device is used as a device for supplying the first current to the infrared light emitting diode (D1), the first electronic component group is mounted on the first transmission circuit wiring pattern (11), and The second electronic component group is not mounted on the second transmission circuit wiring pattern (12).
A method for manufacturing a transmitter.

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