JP5227441B2 - Processing equipment - Google Patents

Description

  The present invention relates to a processing apparatus and a processing method for performing processing using a processing liquid on the surface of an object to be processed, and a surface processing jig suitably used for the processing.

  In recent years, IC cards and mobile phones have been required to be thinner, smaller, and lighter. In order to satisfy this requirement, a semiconductor chip to be incorporated must be a thin semiconductor chip. For this reason, the thickness (film thickness) of the semiconductor wafer on which the semiconductor chip is based is currently 125 μm to 150 μm, but it is said that it must be 25 μm to 50 μm for the next generation chip.

  As one method for obtaining a semiconductor wafer having the above thickness, the following thinning method can be exemplified. In this method, first, a semiconductor wafer and a plate material such as a support plate are attached via a tape or adhesive having adhesive layers on both sides. The support plate serves to protect the thinned semiconductor wafer. Next, a thinned semiconductor wafer is formed by polishing the semiconductor wafer with a grinder or the like while being protected by the support plate. Finally, the support plate is peeled off from the thinned semiconductor wafer.

  However, among the above thinning methods, when the method of attaching the support plate and the semiconductor wafer via the adhesive is employed, the adhesive may remain on the semiconductor wafer after the support plate is separated from the semiconductor wafer. is there. Therefore, the adhesive must be removed to make the upper surface of the semiconductor wafer clean. Here, the thinned semiconductor wafer is generally diced in a state of being attached to a dicing tape fixed to a dicing frame, and divided into individual chips. The thinned semiconductor wafer may be attached to a dicing tape in a state of being attached to a support plate, and then the support plate may be peeled off and the adhesive on the semiconductor wafer may be removed. When a dicing tape is used, since the surface area is usually larger than that of a semiconductor wafer, the exposed surface of the dicing tape is located on the outer periphery of the semiconductor wafer. When such a semiconductor wafer is subjected to a method of dripping a treatment liquid (solvent) while rotating the object to be processed or a normal cleaning process of immersing the semiconductor wafer, the exposed surface of the dicing tape is also treated. It will be treated with liquid. That is, although the surface to be cleaned is only the surface of the semiconductor wafer, the same processing is performed even on the exposed surface of the dicing tape provided on the outer periphery of the semiconductor wafer. Depending on the type of processing liquid at this time, there is a concern about deterioration of the dicing tape, and therefore, it is desired to develop a processing method for removing the adhesive on the semiconductor wafer while protecting the dicing tape.

  The present invention has been made in view of the above-described problems, and the object of the present invention is to perform separate processing on the surface to be processed and other exposed surfaces arranged on the outer periphery of the surface to be processed. A processing apparatus, a processing method, and a surface processing jig are provided.

The processing apparatus according to the present invention includes:
A processing apparatus for performing processing on a target object having a target surface including a second target surface and a first target surface disposed on an outer periphery of the second target surface,
A mounting section for mounting the object to be processed;
A first supply unit that supplies the first processing liquid to a substantially boundary between the first processing surface and the second processing surface; and a second supply unit that supplies the second processing liquid to the second processing surface. And a processing jig.

  A processing apparatus according to the present invention supplies a first processing liquid to a substantially boundary between a first processing surface and a second processing surface, and supplies a second processing liquid to the second processing surface. And a processing jig having a second supply unit. The first processing liquid supplied to the boundary is protected by covering the first surface to be processed. Here, the second processing liquid supplied to the second processing surface reaches the first processing surface, but the first processing surface is protected by the first processing liquid. The influence on the first processed surface can be reduced. That is, desired processing can be performed on the second processing surface in a state where the influence of the second processing liquid on the first processing surface is reduced. As a result, according to the processing apparatus of the present invention, even for a target object having a plurality of processing surfaces that are required to satisfy different processing conditions, processing that satisfies the processing conditions for each processing surface. Can be provided.

  In the present invention. The “substantially boundary” means the boundary between the first processed surface and the second processed surface and the vicinity of the boundary.

  In the processing apparatus according to the present invention, it is preferable that the placement unit includes a rotation unit that rotates the object to be processed. Thereby, each of a 1st process liquid and a 2nd process liquid can be spread to the outer side of a to-be-processed object with a centrifugal force, and a to-be-processed object can be processed efficiently.

  The processing apparatus according to the present invention preferably further includes a preliminary processing jig for processing the second processed surface. According to this aspect, the second process surface can be made a cleaner surface by performing the preliminary process.

  In the processing apparatus according to the present invention, the preliminary processing jig has a facing surface facing the second processing surface, and is supplied from a supply means between the facing surface and the second processing surface. It is preferable that a processing unit that holds the preliminary processing liquid and processes the second processing surface is provided, and the preliminary processing jig is maintained in a state of being separated from the second processing surface by the separation maintaining means. According to this aspect, it is possible to supply the preliminary processing liquid to the second processing surface and recover the supplied preliminary processing liquid while maintaining a state of being separated from the second processing surface. Includes processing jig. Therefore, the pretreatment liquid can be held only between the second surface to be processed and the facing surface opposite to the second surface to be processed, and the scattering of the pretreatment liquid to other than the second surface is suppressed. In this state, preliminary processing can be performed on the second processed surface.

The processing method according to the present invention includes:
A processing method for performing processing on a target object having a target surface consisting of a second target surface and a first target surface disposed on the outer periphery of the second target surface,
Rotating the object to be processed;
A first processing step of supplying a second processing liquid to the second processing surface while supplying a first processing liquid to a substantially boundary between the first processing surface and the second processing surface; It is said.

  Therefore, the first treatment liquid receives a centrifugal force due to rotation, diffuses outside the boundary, and protects the first treatment surface by covering the first treatment surface. At the same time, the second processing liquid supplied to the second processing surface also diffuses from the dropped position to the entire processing surface. As described above, since the first processing surface is protected by the first processing liquid, the influence of the diffused second processing liquid is reduced. Thus, according to the processing method concerning this invention, a favorable process can be performed with respect to the to-be-processed object which has a several to-be-processed surface where separate process conditions are requested | required.

  In the processing method according to the present invention, in the first processing step, the second processing liquid is preferably supplied to the second processing surface after the first processing surface is covered with the first processing liquid. . According to this aspect, the first surface to be processed can be reliably protected.

  In the processing method according to the present invention, it is preferable that in the first processing step, the third processing liquid is supplied to the second surface to be processed after the supply of the second processing liquid is stopped. According to this aspect, when a processing liquid having higher volatility than the second processing liquid is used as the third processing liquid, it is possible to improve the drying property of the object to be processed.

  In the treatment method according to the present invention, in the first treatment step, after the supply of the second treatment liquid and / or the third treatment liquid is stopped, the supply of the first treatment liquid is continued while rotating the object to be treated. It is preferable to do so. According to this aspect, the first treated surface can be reliably protected. The second processing liquid and / or the third processing liquid may remain on the second target surface after the supply is stopped. In the processing method according to this aspect, the supply of the first processing liquid is continued after the supply of the second processing liquid and / or the third processing liquid is stopped, so that each of the remaining processing liquids becomes the first target liquid. Direct adhesion to the treated surface can be suppressed.

  In the processing method according to the present invention, it is preferable that the processing target is continuously rotated after the supply of the first processing liquid to the first processing surface is stopped. According to this aspect, the object to be processed can be reliably dried.

  In the treatment method according to the present invention, it is preferable that a pretreatment step of treating the second surface to be treated with a pretreatment liquid is included before the first treatment step. According to this aspect, the second surface to be processed can be made a cleaner surface.

In the processing method according to the present invention, the preliminary processing step includes:
A pretreatment liquid that is maintained apart from the second surface to be processed and has an opposing surface that faces the second surface to be processed, and is supplied between the opposing surface and the second surface to be processed. Using a surface treatment jig that includes a processing unit that holds and processes the second processed surface,
The pretreatment liquid is supplied to the surface treatment jig, and the pretreatment liquid supplied to the surface treatment jig is recovered while the pretreatment liquid is not diffused from the surface treatment jig. It is preferable to treat the treated surface.

  According to this aspect, when the need for processing on the second processed surface is higher than that on the first processed surface, the preliminary processing is performed on the second processed surface using the preliminary processing jig. Can do. As a result, efficient processing can be realized.

The surface treatment jig according to the present invention treats a target object having a target surface including a second target surface and a first target surface disposed on the outer periphery of the second target surface. A surface treatment jig used when processing with a liquid,
A first supply unit that supplies a first processing liquid to a substantially boundary between the first processing surface and the second processing surface; a second supply unit that supplies a second processing liquid to the second processing surface; It is characterized by including.

  The surface treatment jig according to the present invention supplies a first treatment liquid to the boundary between the first treatment surface and the second treatment surface, and a second treatment liquid to the second treatment surface. And a second supply unit. Therefore, it is possible to perform a good process on a target object having a first target surface and a second target surface for which different processes are required.

  The processing apparatus which concerns on this invention is a 2nd to-be-processed surface and a 1st to-be-processed object with respect to the to-be-processed object which has a 2nd to-be-processed surface and the 1st to-be-processed surface arrange | positioned on the outer periphery of a 2nd to-be-processed surface. By having a processing jig having a first supply unit for supplying the first processing liquid to the boundary with the surface and a second supply unit for supplying the second processing liquid to the second processing surface, the first processing target Separate processing can be performed on the surface and the second surface to be processed.

It is sectional drawing which shows the principal part of the treatment apparatus concerning this embodiment. (A) is sectional drawing which shows the A section of FIG. 1 in detail, (b) is a top view which shows a processing jig. (A) is sectional drawing which shows the processing jig concerning another aspect in detail, (b) is a top view which shows a processing jig. It is sectional drawing which shows the preliminary processing jig used for the processing apparatus concerning this embodiment in detail. (A) is a top view which shows the planar shape of the pretreatment jig | tool concerning a 1st aspect, (b) is a top view which shows the planar shape of the pretreatment jig | tool concerning a 2nd aspect. It is sectional drawing which shows an example of the to-be-processed object processed with the processing apparatus concerning this embodiment. It is a top view which shows an example of the to-be-processed object processed with the processing apparatus concerning this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Processing equipment)
First, the processing apparatus 100 according to the present embodiment will be described with reference to the drawings. FIG. 1 is a cross-sectional view illustrating a main part of the processing apparatus 100 according to the present embodiment, and FIG. 2A is a cross-sectional view illustrating a part A of FIG. FIG. 2B is a plan view when the processing jig included in the processing apparatus 100 is viewed from the side of the object to be processed. In this embodiment, a case where the object to be processed is circular will be described.

  The processing apparatus 100 according to the present embodiment treats the target object 18 having the second target surface 18b and the first target surface 18a disposed on the outer periphery of the second target surface 18b. The processing apparatus 100 includes a placement unit 10 on which the target object 18 is placed and a processing jig 20 that processes the target object 18 with a processing liquid. The processing jig 20 includes a first supply unit that supplies a processing liquid to a substantially boundary between the first processing surface 18a and the second processing surface 18b, and a second processing liquid that supplies the second processing liquid to the second processing surface 18b. 2 supply parts. Here, the substantially boundary means the boundary between the first processed surface 18b and the second processed surface 18a and the periphery thereof. Furthermore, the processing apparatus 100 is provided with a cleaning cup 16 so as to surround the placement unit 10 and the target object 18.

  The mounting part 10 can hold | maintain the to-be-processed object 18, for example by attracting | sucking. The placement unit 10 is provided on a rotating shaft 12 that can rotate around the center of the placement unit 10. A motor 14 that rotates the rotary shaft 12 is attached to the rotary shaft 12.

  Connected to the processing jig 20 are a first supply means 30 for supplying the first processing liquid to the processing jig 20 and a second supply means 40 for supplying the second processing liquid to the processing jig 20. The first supply means 30 includes a tank 34 in which the first processing liquid is held, a supply pipe 32 connected to the tank 34, and the like, and the supply pipe 32 is connected to the processing jig 20. Similarly, the second supply means 40 includes a tank 44 that holds the second processing liquid, a supply pipe 42 connected to the tank 44, and the like, and the supply pipe 42 is connected to the processing jig 20.

  Next, a specific configuration of the processing jig 20 will be described with reference to FIG. As shown in FIGS. 2A and 2B, the processing jig 20 includes an annular tube 22 that supplies the first processing liquid to the object to be processed 18, and the second processing liquid to the object to be processed 18. A supply nozzle 46 is included. A supply pipe 32 is connected to the pipe 22. As shown in FIG. 2B, a supply port 24 is provided in the tube 22 at a position facing the object 18 to be processed. From the supply port 24, the first processing liquid is supplied to a substantially boundary between the first processing surface 18a and the second processing surface 18b. The supply port 24 may be a hole provided in the tube 22 or a nozzle (not shown). FIG. 2B shows a case where the supply port 24 is a hole provided in the tube 22.

  In the processing jig 20 in the present embodiment, a case where a plurality of supply ports 24 are provided is illustrated. The number of the supply ports 24 can be appropriately determined depending on the size of the second processed surface 18b. When a plurality of supply ports 24 are provided, the distance between adjacent supply ports 24 is preferably equal. By providing the supply ports 24 at equal intervals, the first processing liquid can be supplied uniformly to the boundary. In the processing jig 20 shown in the present embodiment, a cross-shaped support tube 26 is provided in order to stabilize the ring shape of the tube 22. In the processing jig 20 according to the present embodiment, a supply pipe 32 is connected to substantially the center of the support pipe 26, and the processing liquid is supplied to the pipe 22 through the support pipe 26.

  Further, a supply pipe 42 is connected to the nozzle 46. From this nozzle 46, the 2nd processing liquid is supplied to the 2nd processed surface. The position of the nozzle 46 is preferably a position where the second processing liquid can be supplied to the center of the second processing target surface 18b. This is because the second processing liquid can be uniformly spread on the second processing surface 18b.

  The processing jig 20 is not limited to the above structure as long as the first processing liquid can be supplied to the approximate boundary between the first processing surface 18a and the second processing surface 18b. An example of the processing jig 80 according to another aspect will be described with reference to FIG. FIG. 3A is a cross-sectional view illustrating the processing jig 80 in detail. FIG. 3B is a plan view when the processing jig 80 is viewed in plan from the object 18 side.

  As shown in FIGS. 3A and 3B, the processing jig 80 according to another aspect includes a plurality of pipes 82 extending radially from the central portion 81 and nozzles 46. The pipe 82 is connected to the supply pipe 32, and a nozzle 84 is provided at the tip. From this nozzle 84, the 1st process liquid is supplied to the approximate boundary of the 1st processed surface 18a and the 2nd processed surface 18b. In the processing jig 80 shown in FIG. 3, an L-shaped tube is used as the tube 82. Specifically, from the central portion 81 to the position of the substantially boundary between the first processed surface 18a and the second processed surface 18b, a tube extending in parallel with the second processed surface 18b, It has a shape in which a pipe extending in a direction orthogonal to the second processing surface 18b from the boundary position is coupled. Here, the second processed surface 81b and the central portion 81 are substantially coincident with each other. The position of the nozzle 84 is appropriately determined according to the position of the boundary between the first processed surface 18a and the second processed surface 18b. The number of the tubes 82 is appropriately determined depending on the size of the second processed surface 18b. The configuration of the second supply unit can be the same as the configuration described above.

  The angle of the first processing liquid supplied from the processing jigs 20 and 80 to the object to be processed may be arbitrarily set. This angle can be adjusted by adjusting the position where the supply port and the nozzle are provided in the tube in the processing jig and the pressure of the first processing liquid supplied to the tube.

  The processing apparatus 100 according to the present embodiment can further include a preliminary processing jig for preliminary processing the second processing surface 18b. The processing apparatus 110 including the preliminary processing jig will be described with reference to FIG. 4 is a cross-sectional view of a portion corresponding to part A in FIG.

  As shown in FIG. 4, the processing apparatus 110 collects the preliminary processing jig 50, the supply means 60 for supplying the preliminary processing liquid to the preliminary processing jig 50, and the preliminary processing liquid supplied to the preliminary processing jig 50. And collecting means 70. In FIG. 4, a case where the preliminary processing jig 50 and the processing jig 20 are combined is described as an example. When the same processing liquid is used for the preliminary processing liquid and the second processing liquid, it is preferable to use the above-described second supply means 40 as the supply means 60 to the preliminary processing jig 50. In the following description, a case where the pretreatment liquid is the same as the second treatment liquid will be described as an example. Therefore, the description about the supply means 60 is abbreviate | omitted here. When the second processing liquid and the preliminary processing liquid are different, the supply unit 60 may have the same configuration as the second supply unit 40.

  The recovery means 70 includes a pump (not shown) for sucking the pretreatment liquid from the pretreatment jig 50, a tank (not shown) for storing the collected pretreatment liquid, and the like. The recovery means 70 is connected to the preliminary processing jig 50 by a recovery pipe 72.

  The processing apparatus 110 having the preliminary processing jig 50 includes a separation maintaining unit 76 that maintains the preliminary processing jig 50 in a state of being separated from the workpiece 18.

  Hereinafter, the specific configuration of the pretreatment jig 50 will be described. The preliminary processing jig 50 has a processing section 52 for holding the supplied preliminary processing liquid and processing the surface to be processed 18b. The processing unit 52 has a facing surface 52a that faces the surface to be processed 18a when the preliminary processing jig 50 is located. That is, according to the preliminary processing jig 50, the preliminary processing liquid can be held between the processing unit 52 and the facing surface 52a.

  The processing unit 52 is provided with a first through hole 56 and a second through hole 58. The first through hole 56 is a hole for supplying the pretreatment liquid to the processing unit 52, and the second through hole 58 is a hole for recovering the supplied pretreatment liquid. As described above, the preliminary processing jig 50 can collect the supplied processing liquid at the same time as supplying the processing liquid to the second processing surface 18b. Therefore, the preliminary processing liquid is held between the facing surface 52a and the second processing surface 18b. As a result, the pretreatment of the second surface to be treated 18b can be performed in a state where the pretreatment liquid is suppressed from being scattered other than the second surface to be treated 18b.

  In addition, the number and arrangement of the first through holes 56 and the second through holes 58 can be appropriately determined according to the object to be processed. The planar shapes of the first through hole 56 and the second through hole 58 can be circular, elliptical, or rectangular, and are not particularly limited as long as they do not hinder the flow of the processing liquid. The same applies to the opening diameters and the numbers of the first through holes 56 and the second through holes 58.

  Furthermore, it is preferable that the processing unit 52 includes a protruding portion 54 that protrudes from the facing surface 52a toward the object 18 to be processed. The protrusion 54 is preferably provided on the periphery of the facing surface 52a. The processing unit 52 includes the protrusion 54, so that the supplied processing liquid can be reliably held between the processing surface 18b. The treatment liquid is retained by utilizing the surface tension of the treatment liquid.

  The separation maintaining means 76 can hold the processing liquid in the processing section 52 by maintaining the distance between the surface processing jig 50 and the surface 18b to be processed at a predetermined distance. Further, the separation maintaining means 76 may include a mechanism that allows the surface treatment jig 50 to move in a direction parallel to the surface to be processed 18b and in a vertical direction with respect to the surface to be processed 18b. Specifically, the separation maintaining means 76 can be realized by an arm or the like that holds the surface treatment jig 50.

  In addition, when the facing surface 52a of the protruding portion 54 and the surface facing the second processed surface 18b are flat surfaces, the distance between the protruding portion 24 and the second processed surface 18b is 0.5 mm by the separation maintaining means 56. As described above, it is preferably maintained at 3 mm or less, and more preferably in the range of 0.5 to 1.5 mm. In addition, the distance between the protrusion 24 and the surface to be processed 18a may be as close to 0 mm as long as it does not contact. As a result, the pretreatment liquid can be reliably held.

  The area that can be processed by the processing section 52 in the preliminary processing jig 50 is preferably smaller than the area of the second processing surface 18b. Here, two examples of the planar shape of the pretreatment jig 50 will be described with reference to FIG. This planar shape substantially matches the shape of the surface that can be processed by the processing unit 52 in the preliminary processing jig 50. In FIG. 5, the processing jig 20 is not shown. Fig.5 (a) is a top view which shows the pretreatment jig | tool 50a concerning the 1st aspect arrange | positioned above the 2nd to-be-processed surface 18b, FIG.5 (b) concerns on a 2nd aspect. It is a top view which shows the pretreatment jig | tool 50b.

  As shown in FIG. 5A, the pretreatment jig 50a according to the first aspect has a circular planar shape. The pretreatment jig 50a is provided with a first through hole 56 and a second through hole 58. The processing liquid is supplied to the processing portion of the preliminary processing jig 50 through the first through hole 56, and the processing liquid supplied through the second through hole 58 is recovered. At this time, the pretreatment jig 50a is preferably used when the second surface to be treated 18b has a circular shape. Then, the second processing surface 18b is processed by moving the preliminary processing jig 50a from the approximate center of the second processing surface 18b in parallel to the second processing surface 18b by the separation maintaining means 76. Can do. Further, by rotating the object 18 in the direction indicated by the arrow, the entire second object surface 18b can be easily processed.

  As shown in FIG. 5B, the pretreatment jig 50b according to the second aspect is rectangular and has a planar shape with rounded corners. The pretreatment jig 50b according to the second aspect is provided with a first through hole 56 and a second through hole 58 having functions similar to those of the pretreatment jig 50a according to the first aspect. As shown in FIG. 5B, when the second processing surface 18b is circular, the length in the longitudinal direction of the planar shape of the preliminary processing jig 50b is substantially equal to the radius of the second processing surface 18b. It is preferable that they are the same. In this case, for example, by performing the processing while rotating the object to be processed in the direction indicated by the arrow, the entire surface of the second processed surface 18b can be processed.

  As the pretreatment jig 50, the pretreatment liquid is supplied to the second surface to be treated 18b and the supplied pretreatment liquid is collected, and the treatment is performed between the pretreatment jig 50 and the second surface to be treated 18b. As long as the liquid can be retained, the shape is not limited to the shape shown in FIG. Similarly, the opening shape, opening diameter, number, and arrangement of the first through hole 56 and the second through hole 58 are not limited to those shown in FIG. 5 as long as they do not hinder the flow of the pretreatment liquid.

  In the processing apparatus 110, the second processing liquid may be supplied to the second surface to be processed from the second through hole 58a of the preliminary processing jig 50, thereby making the processing apparatus compact. it can.

  The processing apparatus 100 according to the present embodiment includes a first supply unit that supplies a first processing liquid to a substantially boundary between the first processing surface 18a and the second processing surface 18b, and a second processing surface 18b. 2 includes a processing jig 20 having a second supply part for supplying the processing liquid. The first processing liquid supplied to the boundary is protected by covering the first processing surface 18a. Here, the second processing liquid supplied to the second processing surface 18b reaches the first processing surface 18a. However, since the first processing surface 18a is protected by the first processing liquid, The influence with respect to the 1st to-be-processed surface 18a by a process liquid can be reduced. As a result, according to the processing apparatus 100 according to the present embodiment, even the processing target 18 having the first processing surface 18a and the second processing surface 18b that are required to satisfy different processing conditions. Thus, it is possible to realize processing satisfying the processing conditions required for each surface to be processed. Moreover, since the to-be-processed object 18 can be rotated, the 1st process liquid and the 2nd process liquid can be spread outside the to-be-processed body 18 with the centrifugal force, and the to-be-processed object 18 is processed efficiently. Can do.

  In addition, the processing apparatus 110 includes a preliminary processing jig 50 that can process the second processed surface 18b. In this case, the preliminary processing of the second processed surface 18b can be performed using the preliminary processing jig 50. As a result, efficient processing can be realized.

(Processing method)
Next, a processing method according to the present embodiment will be described. In the following description, a case where the processing method according to the present embodiment is performed using the above-described processing apparatus will be described, but the present invention is not limited to this processing apparatus.

  An object to be processed that is preferably processed by the processing method according to the present embodiment includes a circular second processed surface 18b and a first processed surface 18a disposed on the outer periphery of the second processed surface 18b. Has a surface. In the process according to the present embodiment, first, the object 18 is placed on the placement unit 10. The placement unit 10 is provided with a suction mechanism and can hold the object 18 to be processed. In the processing according to this embodiment, a case where processing divided into two steps is performed will be described as an example.

(A) Preliminary processing step In the processing method according to this embodiment, first, preliminary processing is performed on the second surface to be processed 18b. This pretreatment is preferably performed using the pretreatment jig 50 described above. First, the pretreatment jig 50 is spaced apart from the workpiece 18 by the separation maintaining means 76 and maintained at a predetermined distance. At this time, it is preferable that the distance between the processing portion 52 of the preliminary processing jig 50 and the second processed surface 18b is maintained to be, for example, 3 mm or less. Thereby, it becomes easy to hold | maintain a processing liquid between the opposing surfaces 52a of the preliminary processing jig 50. FIG.

  Next, the processing liquid is supplied from the processing liquid supply means 60 to the preliminary processing jig 50 (processing section 52). In the supply of the processing liquid, the preliminary processing liquid is supplied through the first through hole 56 of the preliminary processing jig 50. Along with the supply of the preliminary processing liquid, the recovered preliminary processing liquid is recovered by the recovery means 70 (hereinafter referred to as “supply / recovery processing”). The recovery of the preliminary processing liquid is performed by suctioning the recovery processing pipe 50 through the second through hole 58 of the preliminary processing jig 50. The processing liquid can be held by utilizing the surface tension of the preliminary processing liquid generated between the second surface to be processed 18 b and the preliminary processing jig 50. Note that the supply amount and the recovery amount of the processing liquid in the supply / recovery process may be adjusted to, for example, substantially the same amount as long as the surface tension is maintained and the processing liquid does not diffuse from the surface processing jig 20.

  The supply / recovery processing of the processing liquid can be performed while moving the preliminary processing jig 50 in parallel with the second processing surface 18b. At this time, it is preferable to move the preliminary processing jig 50 from the approximate center of the second processed surface 18b toward the outer edge. Thus, even if the processing surface of the processing unit 52 of the preliminary processing jig 50 is smaller than the second processing surface 18b by moving the preliminary processing jig 50, the second processing target is processed. Processing can be applied to the entire surface 18b.

  Further, the supply / recovery process may be performed while rotating the object 18 about a vertical line passing through the approximate center of the surface. In this case, the rotational speed of the workpiece 18 is preferably 10 rpm or more and 100 rpm or less. If it is within the above range, the preliminary processing liquid can be held between the processing unit 22 and the second processed surface 18b, so that the preliminary processing liquid diffuses to a region other than the second processed surface 18b. Can be suppressed. Further, by rotating the object 18 to be processed, it is possible to increase the speed of the preliminary processing and increase the efficiency. This preliminary processing step is effective when the second processed surface 18b is particularly required for processing as compared with the first processed surface 18a. This preliminary processing step may not be performed when only the final processing step is sufficient.

  Furthermore, after the pretreatment step, a suction step for sucking the pretreatment liquid remaining on the object to be processed may be added. This suction step can be handled by, for example, a configuration in which the nozzle is sucked by a pump or the like.

(B) Final processing step Next, the final processing, which is a finishing process, is performed on the workpiece 18 that has finished the preliminary processing step. This final processing step can be performed by the processing jig 20. In the final processing step, the processing using the second processing liquid is performed on the second processing surface 18b in a state where the first processing surface 18a is covered with the first processing liquid. Specifically, the object to be processed 18 is rotated to supply the first processing liquid to the substantially boundary between the first surface to be processed 18a and the second surface to be processed 18b, and to the second surface to be processed 18b. A second treatment liquid is supplied. Hereinafter, supplying the first processing liquid to the substantially boundary between the first processing surface 18a and the second processing surface 18b is referred to as "first supply", and the second processing liquid is supplied to the second processing surface. Is referred to as “second supply”.

  In the first supply, the first processing liquid receives a centrifugal force generated by the rotation of the object to be processed 18 and spreads outward from the boundary, that is, the entire surface to be processed 18a. As a result, the first processing surface 18a can be covered with the first processing liquid. That is, the first processing surface 18a is covered with the film made of the first processing liquid. On the other hand, in the second supply, the second processing liquid supplied to the second processing surface 18b diffuses outward from the supplied position due to the centrifugal force generated by the rotation of the processing target 18, and the first processing target. It diffuses over the surface 18a. However, since the first processing surface 18a is covered with the first processing liquid, the second processing liquid is prevented from coming into direct contact with the first processing surface 18a, and the deterioration due to the second processing liquid is affected. Will be reduced.

  In this final processing step, it is preferable to perform the first supply and perform the second supply after the first surface to be processed 18a is covered with the first processing liquid. Thereby, a 1st to-be-processed surface can be protected reliably.

  In the final processing step, it is preferable to end the first supply after the second supply is completed. More preferably, after the second supply is finished, it is preferable to remove the second treatment liquid remaining on the second surface to be treated 18b and then finish the first supply. The removal of the second treatment liquid can be performed, for example, by rotating the object to be treated, diffusing from the object to be treated by centrifugal force, and shaking off. According to this aspect, since the first supply is continuously performed, the first processing surface 18a is protected by the first processing liquid, and the second processing liquid remaining on the second processing surface 18b is the first processing target. The influence on the surface can be reduced. Depending on the material of the second treatment liquid, the first treated surface 18a may be deteriorated, but this deterioration can be prevented.

  In the final processing step, after the second supply is stopped and before the first supply is finished, a third processing liquid different from the second processing liquid is supplied to the second processing surface 18b, so that the second processing target is processed. The surface 18b may be processed. For example, when a treatment liquid having higher volatility than the second treatment liquid is used as the third treatment liquid, it is preferable because drying of the object to be treated can be promoted. Furthermore, it is preferable that the object to be processed is continuously rotated after the supply of all the processing liquids is stopped. Thereby, the to-be-processed object 18 can be dried efficiently.

  As the first treatment liquid and the second treatment liquid, a treatment liquid that cannot dissolve each other may be used, or a treatment liquid that can be dissolved may be used. In the case of using treatment liquids that cannot dissolve each other, the second treatment liquid travels on the film made of the first treatment liquid and diffuses to the outside of the object to be treated, causing damage to the first treatment surface 18a, etc. The influence of can be suppressed. On the other hand, when a processing solution that can be dissolved is used, the second supply liquid is diluted with the first supply liquid on the first surface to be processed 18a. By this dilution, it is possible to reduce the influence of the second processing liquid on the first surface to be processed 18a. Through the above steps, the object 18 can be processed by the processing method according to the present embodiment.

  In the processing method according to this embodiment, good processing is performed on the target object 18 having a plurality of target surfaces (first target surface 18a and second target surface 18b) that require different processing conditions. Can be done.

  Next, an example of an object to be processed that is particularly well processed by the processing method according to the present embodiment will be described. Needless to say, the object 18 is not limited to the object illustrated below.

  The object 18 to be processed satisfactorily by the processing method according to the present embodiment is a thinned semiconductor wafer provided on a dicing tape as a support. In such a thinned semiconductor wafer, an adhesive may remain on the surface of the semiconductor wafer in the thinning process. In such a semiconductor wafer adhesive removal process, the processing apparatus according to this embodiment can be used.

  In the following description, first, the thinning process of a semiconductor wafer will be described with reference to FIGS. 6 and 7, and then the advantages of using the processing method according to the present embodiment will be described. FIG. 6A to FIG. 6D are cross-sectional views illustrating a semiconductor wafer thinning process. FIG. 7 shows a plan view of the object 18 formed by the thinning process. Here, the example using the support plate 90 with a hole is demonstrated.

  First, as shown in FIG. 6A, a support plate 90 and a semiconductor wafer 94a are attached via an adhesive 92. This semiconductor wafer 94a is before thinning. Next, as shown in FIG. 6B, the semiconductor wafer 94a is polished to form a thin-film semiconductor wafer 94. Polishing of the semiconductor wafer 94a can be performed by various known techniques. Next, as shown in FIG. 6C, the surface of the semiconductor wafer 94 that is not in contact with the adhesive 92 is bonded to a dicing tape (support) 96. At this time, the dicing tape 96 plays a role of making up the strength of the semiconductor wafer 94 after being peeled and facilitating handling. A dicing frame (fixing tool) 98 is provided around the dicing tape 96. The dicing frame 98 prevents the dicing tape 96 from loosening. Thereafter, a solvent for dissolving the adhesive 92 is supplied from the hole of the support plate 90, and after the adhesive 92 is dissolved, the support plate 90 is removed. At this time, the adhesive 92 is not completely removed and remains on the semiconductor wafer 94. As shown in FIG. 6D, the remaining adhesive 92 is shown as the remaining adhesive 93. As described above, the laminated body of the semiconductor wafer 94 having the residual adhesive 93 and the dicing tape 96 corresponds to the object to be processed 18.

  In FIG. 7, the top view of the to-be-processed object 18 formed in this way is shown. As shown in FIG. 7, the semiconductor wafer 94 provided with the remaining adhesive 93 corresponds to the second processed surface 18b, and the dicing tape 96 disposed on the outer periphery of the semiconductor wafer 94 is formed on the first processed surface 18a. Equivalent to.

  The dicing tape 96 disposed on the outer periphery of the semiconductor wafer 94 may be deteriorated by adhesion of a solvent (treatment liquid) used for removing the residual adhesive 93. The deterioration of the dicing tape 96 causes the slack. Then, the slack of the dicing tape 96 may cause a crack in the semiconductor wafer 94 that has been thinned and reduced in strength. Therefore, it is necessary to remove the remaining adhesive 93 on the semiconductor wafer 94 without deteriorating the dicing tape 96. That is, processing must be performed on a target object having a plurality of target surfaces that cannot be subjected to the same processing.

  When the treatment method according to the present embodiment is used to remove the residual adhesive 93 on the semiconductor wafer 94, pure water (first treatment liquid) is provided substantially at the boundary between the semiconductor wafer 94 and the exposed surface of the dicing tape 96. While supplying the first processing liquid, a solvent (second processing liquid) for dissolving the adhesive is supplied to the semiconductor wafer 94. Thereby, the exposed surface of the dicing tape 96 can be protected by being covered with pure water, and the remaining adhesive can be removed from the semiconductor wafer 94. As a result, it is possible to satisfactorily remove the remaining adhesive 93 without deteriorating the dicing tape 96.

  Furthermore, as described in the processing method according to the present embodiment, the processing object shown in FIGS. 6 and 7 is efficiently processed by combining the final processing step and the preliminary processing step. The residual adhesive 93 can be removed. This is because the amount of the solvent (second processing liquid) that must be supplied during the final processing step can be reduced by removing the residual adhesive on the semiconductor wafer 94 in the preliminary processing step. .

  When the object 18 shown in FIGS. 6 and 7 is processed, pure water is preferably used as the first processing liquid, and a hydrophilic solvent or a hydrophobic solvent is used as the second processing liquid. preferable. As the hydrophilic solvent, an alcohol aqueous solution, an alcohol such as methanol, isopropyl alcohol (IPA), or the like can be used. As the hydrophobic solvent, propylene glycol monomethyl ether acetate (PGMEA) can be used.

  As described above, according to the processing method of the present embodiment, it is possible to satisfactorily remove the residual adhesive 93 that is generated in the process of forming the thin-film semiconductor wafer 94. In the processing method described above, the example in which the preliminary processing step and the final processing step are combined has been described. However, the present invention is not limited to this. Depending on the processing content required for the workpiece 18, only the processing corresponding to the above-described final processing step may be sufficient.

(Examples 1-8, Comparative Examples 1-3)
Examples of the processing method according to this embodiment and comparative examples will be described below. In this example, an object to be processed was prepared by attaching an 8-inch wafer having an adhesive made of an acrylic resin on a polyolefin dicing tape stretched on a dicing frame. Detailed conditions regarding the object to be processed are as follows.

  The object to be processed was rotated, and the object to be processed was processed using two types of processing jigs. The first processing jig corresponds to the processing jig 20 described above, and a pipe in which eight holes are formed in the pipe for supplying the first processing liquid is used. As the second processing jig, , Which corresponds to the above processing jig 80 and has four nozzles, and the third processing jig has two nozzles for supplying the first processing liquid to the object to be processed. It was.

  Example 1 is processed using the first processing jig, Example 2 is processed using the second processing jig, Examples 3 to 8 are processed using the third processing jig, In Comparative Examples 1-3, it processed only with the 2nd process liquid. In Examples 3 to 5, the first processing liquid was supplied from only one nozzle, and in Examples 6 to 8, the first processing liquid was supplied from two nozzles.

  Each processing jig is supplied with pure water as the first processing liquid at 1000 ml / min and PGMEA as the second processing liquid at 150 ml / min, and the object to be processed is processed in a processing time of 3 minutes. . Note that this processing time is the time from when the second processing liquid is supplied and the supply stopped while rotating the object to be processed at the number of rotations shown in Table 1. Thereafter, the object to be treated was rotated at a rotation speed of 1000 rpm for 5 seconds while the first treatment liquid was supplied, the supply of the first treatment liquid was stopped, and the object to be processed was further rotated at a rotation speed of 1500 rpm for 30 seconds to be dried. . The first processing liquid was supplied before supplying the second processing liquid, and a film of the first processing liquid was formed on the dicing tape.

  The amount of slack of the dicing tape in the object to be treated after drying was measured. The evaluation results are shown in Table 1. The amount of slack is a distance from the reference surface of the slack dicing tape measured with reference to the surface of the original dicing tape.

  As is clear from Table 1, in Examples 1 to 8, it was found that the amount of slackness of the dicing tape was significantly reduced as compared with Comparative Examples 1 to 3. In Examples 1 to 8 and Comparative Examples 1 to 3, it was found that the residual adhesive on the semiconductor wafer was removed. Thereby, according to the processing method concerning this invention, it was confirmed that a semiconductor wafer can be processed with a processing liquid, protecting a dicing tape. The residual adhesive was confirmed by measuring with FT-IR.

  The present invention is not limited to the above-described embodiments, and various modifications are possible within the scope shown in the claims, and embodiments obtained by appropriately combining technical means disclosed in different embodiments. Is also included in the technical scope of the present invention.

  The processing apparatus according to the present invention can be applied to a cleaning apparatus and a coating apparatus using a processing liquid.

DESCRIPTION OF SYMBOLS 10 Mounting part 12 Rotating shaft 14 Motor 16 Cleaning tank 18 Processed object 18a 1st to-be-processed surface 18b 2nd to-be-processed surface 20,80 Processing jig 22,82 Tube 24,84 Supply port (1st supply part)
30 1st supply means 32, 42 Supply piping 34, 44 Tank 40 2nd supply means 46 Nozzle (2nd supply part)
50, 50a, 50b Pretreatment jig (surface treatment jig)
52 treatment part 52a opposing surface 54 protrusion part 56 1st through-hole 58 2nd through-hole 60 supply means 70 collection | recovery means 100,110 processing apparatus

Claims (1)

A processing apparatus for performing processing on a target object having a target surface including a second target surface and a first target surface disposed on an outer periphery of the second target surface,
A mounting section for mounting the object to be processed;
A first supply unit that supplies the first processing liquid to a substantially boundary between the first processing surface and the second processing surface; and a second supply unit that supplies the second processing liquid to the second processing surface. A processing jig;
A pretreatment jig for pretreating the second treated surface with a pretreatment liquid,
A plurality of through holes are provided in a surface opposite to the second processing surface on the processing unit in the preliminary processing jig, and a part of the plurality of through holes collects the preliminary processing liquid. holes der of is, only the periphery of the opposing surfaces of the second surface to be processed in the preliminary processing jig process according to claim Rukoto to have a protrusion protruding from the surface facing toward the second surface to be processed apparatus.

Images