JP5223050B2 - Optical module - Google Patents

Description

  The present invention relates to an optical module.

  In the field of optical communication using light as an information transmission medium, an optical module including an optical element that mutually converts an optical signal and an electrical signal is used to receive or transmit an optical signal transmitted through an optical fiber or the like. ing. A surface emitting element typified by a vertical cavity surface-emitting laser (VCSEL) is used for the conversion from an electrical signal to an optical signal, and a PIN is used for the conversion from an optical signal to an electrical signal. A surface light receiving element typified by a photodiode is used. These optical elements are electrically connected to the substrate, and optical fibers and the like are optically connected to the optical elements.

  Such an optical module has an optical transmission body such as an optical fiber from the viewpoint of workability when optical wiring such as an optical fiber is performed on a wiring board (printed wiring board or board), and ease of maintenance and replacement. It is desirable to be detachable via a connector.

  In addition, when an optical fiber or the like is attached to or detached from the optical element, a structure for attaching or detaching the optical fiber or the like around the component on which the optical element is mounted should be provided if it is configured to be attached to and detached from the wiring board in the horizontal direction. Since it cannot be obtained, there is a problem that other parts cannot be mounted in the space, and the mounting density cannot be increased. Therefore, it is desirable that attachment / detachment of an optical fiber or the like can be performed in a direction perpendicular to the wiring board.

Conventionally, in order to meet such demands, an optical element is mounted so that its light emitting / receiving surface is horizontal with respect to the wiring board, and a reflection mirror is provided on the end face of an optical fiber or the like to vertically align the optical axis. There has been proposed an optical module that optically connects an optical fiber or the like and an optical element so as to be detachable in a vertical direction by using a connector converted into (see Patent Document 1).
JP 2006-65358 A

  However, the optical element is mounted on the wiring board as a whole component such as a board or a package on which a driver integrated circuit device is mounted, for example, and such components are electrically connected to pads on the wiring board. As a general one, there is connection by reflow of solder balls such as BGA (Ball Grid Array), etc., but with such solder connection method, on a wiring board on which many other components are mounted. When a part on which an optical element is mounted needs to be repaired and replaced, it is difficult to replace the part or the replacement work becomes complicated. In addition, a connector that converts the optical axis of an optical fiber or the like vertically needs to be prepared according to the shape of the optical fiber or the like, and for this purpose, various connectors must be prepared.

  As described above, in view of workability such as maintenance and replacement and securing of mounting density on the wiring board, a structure in which not only optical connection but also electrical connection can be attached to and detached from the wiring board vertically is desired. There is also a demand for a structure that can make the connector shape as simple as possible and can hold an optical fiber or the like reliably. Furthermore, further miniaturization of the optical module itself is desired from the viewpoint of improving the mounting density, and it is also desired to produce a product that satisfies these requirements at a low cost.

  The present invention has been made in view of the circumstances as described above, and has been greatly reduced in size, and both optical connection and electrical connection can be attached to and detached from the wiring board surface perpendicularly. It is an object of the present invention to provide an optical module that can effectively hold an optical transmission body with a simple connector shape and can be manufactured at low cost.

  The present invention is characterized by the following.

The first is an optical module that optically connects an optical transmission path that transmits an optical signal and an optical element that converts the optical signal into an electrical signal or converts the electrical signal into an optical signal,
An upper structure including an optical transmission body that forms an optical transmission path and a resin-made holding member that holds the optical transmission body;
An optical element mounting substrate disposed on the wiring substrate and electrically connected to the wiring substrate so as to be detachable in a vertical direction;
Provided on the wiring board, the upper structure is detachably mounted in the vertical direction, and by mounting the upper structure, the optical transmission path of the upper structure is optically connected to the optical element of the optical element mounting substrate. A plate spring-like fitting member to be connected,
The holding member of the upper structure is composed of a lower member and an upper member, and the lower member is continuous in an arc shape that holds the optical transmission body so that the optical axis on the external side and the optical axis on the optical element side are perpendicular to each other. The upper member has a curved surface corresponding to the curved surface of the lower member holding portion or a curved surface in which a V-shaped guide groove is formed in an arc shape on the curved surface. The optical transmission body is sandwiched and held between the holding member of the lower member and the guiding member of the upper member,
On both side surfaces of the upper member on both sides of the guide portion, a window-shaped engagement hole that penetrates a part of the shoulder portion is provided in the middle in the longitudinal direction of the shoulder portion that abuts the tip protrusion of the leaf spring-like fitting member. Provided,
The both sides of the holding part of the lower member have an engagement structure that is provided with engagement claws that are exposed through the engagement holes in the form of windows and are released by pressing the exposed parts.
The engagement structure is configured so as not to hinder assembly, disassembly, and reassembly of the optical module by the attachment body of the leaf spring-like fitting member .

Secondly, the attachment body of the leaf spring-like fitting member provided on the wiring board is characterized in that a protrusion is provided on the lower surface and is spaced apart from the wiring board surface .

  According to the first to third aspects of the invention, the optical axis of the optical transmission line of the upper structure is converted from the horizontal direction on the outer side to the vertical downward direction on the optical element side, and is perpendicular to the mounting member on the wiring board. The optical element mounting board is mounted on the wiring board, and the upper structure is mounted on the mounting member, so that the optical element mounting board mounted on the wiring board can be mounted. The upper structure is positioned and the optical transmission path of the upper structure and the optical element of the optical element mounting substrate are optically connected.

  Therefore, both optical connection and electrical connection can be attached and detached perpendicular to the wiring board surface, and can be disconnected both optically and electrically during maintenance replacement, etc., so that maintenance replacement is easy. Furthermore, it is not necessary to provide a work space for attachment / detachment around the optical element mounting board, and the mounting density on the wiring board can be increased, and the components are mounted at a high density. The user can improve the selectivity and expandability of the place where the user places the optical module on the wiring board. Moreover, with the above structure, the optical module can be significantly reduced as a whole, and the optical module can be manufactured at low cost.

  Further, with respect to the holding member of the upper structure, the lower member has a smooth curved surface continuous in an arc shape that holds the optical transmission body on the upper surface so that the optical axis on the outer side and the optical axis on the optical element side are perpendicular to each other. The holding member is provided, and the upper member is provided with a guide portion having a curved surface corresponding to the curved surface of the holding member of the lower member on the lower surface. In the case of an optical waveguide or the like, the optical transmission body is sandwiched between a holding part having a smooth curved surface of the lower member on the upper surface and a guide part of the upper member having a corresponding smooth curved surface on the lower surface, It is securely held in a state of being bent into an arc shape.

  As for the holding member of the upper structure, the upper member includes a guide portion having a curved surface on the lower surface in which a guide groove having a V-shaped cross section is formed in an arc shape on a curved surface corresponding to the curved surface of the holding portion of the lower member. Thus, for example, when the optical transmission body is an optical fiber coated with a resin in a substantially circular shape in cross-sectional view, the optical transmission body is disposed in a guide groove having a V-shaped cross section formed in the guide portion of the upper member. In this state, the optical transmission body is sandwiched between the holding portion of the lower member and the guide portion of the upper member, so that the optical transmission body is securely held in a state of being bent in an arc shape.

  Therefore, according to the above invention, in a state where the optical transmission body is held by the holding member of the upper structure, an optical transmission path is formed in which the optical axis on the outside side and the optical axis on the optical element side are vertically continuous, In addition, the optical transmission body and the optical element on the optical element mounting substrate can be optically connected effectively. Moreover, although the said invention can hold | maintain an optical transmission body effectively according to the shape of an optical transmission body, the lower member in the holding member of an upper structure is the same irrespective of the shape of an optical transmission body Since the structure can be obtained, it is not necessary to prepare a lower member having a different structure depending on the shape of the optical transmission body. Therefore, an optical module can be manufactured at low cost.

  In this specification, the “optical transmission body” includes an optical fiber made of glass or resin, an optical waveguide made of resin, or the like. The “optical element” includes not only one having a single light receiving and emitting surface, but also one having a plurality of light receiving and emitting surfaces arranged in an array or the like. Specific examples of the optical element include a surface light emitting element such as a VCSEL and a surface light receiving element such as a PIN photodiode. The surface light emitting element and the light receiving and emitting surfaces of the surface light receiving and emitting elements are integrated in an array. It may be a thing.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are perspective views showing an optical module according to an embodiment of the present invention. FIG. 1 shows a state in which the optical connection and the electrical connection are disconnected, and FIG. 2 shows a state in which the optical connection and the electrical connection are made. Yes.

  As shown in FIG. 1, the optical module 1 of this embodiment includes an upper structure 5 in which an optical fiber 7 is held by a holding member 6, an optical element mounting substrate 30 on which an optical element 40 is mounted, and anisotropic conductivity. A sheet 60 and a fitting member 50 fixed on a wiring board 70 (printed wiring board or board) are provided.

  In this optical module 1, an anisotropic conductive sheet 60 is disposed in an opening 51 in a fitting member 50 on a wiring substrate 70, an optical element mounting substrate 30 is disposed thereon, and an upper structure is further formed thereon. 2 is fitted vertically as shown in FIG. 2, and the optical fiber 7 of the upper structure 5 and the optical element 40 of the optical element mounting substrate 30 are optically connected, and the optical element mounting substrate 30 and the wiring are connected. The substrate 70 is electrically connected via the anisotropic conductive sheet 60. The mounted optical module 1 shown in FIG. 2 constitutes a compact module having a width of 10 mm × 10 mm and a thickness of 6.4 mm, for example.

  3A is a top view of the upper structure 5, FIG. 3B is a bottom view, and FIG. 3C is a side view. In the upper structure 5, a tape fiber 8 in which a plurality of (in this embodiment, 12) optical fibers 7 are arranged in parallel enters the holding member 6 from the back surface of the resin-made holding member 6. Thus, the optical fiber 7 is bent into an arc shape, and the end surface 7a of the optical fiber 7 is vertically exposed from the lower surface of the holding member 6 as shown in FIG.

  A pair of shoulder portions 12 forming a tapered surface along the peripheral edge portion are provided on both peripheral edge portions parallel to the optical fiber 7 on the upper surface of the holding member 6, and are fitted into the fitting member 50 of FIG. 1. The pair of protrusions 52 provided on the upper portion of the fitting member 50 abuts against the shoulder 12 of the holding member 6 and presses downward.

  Further, as shown in FIG. 3B, two positioning holes 11 are provided on the front side of the lower surface of the holding member 6 at symmetrical positions on both side surfaces of the holding member 6. When the optical element mounting substrate 30 is fitted and fitted into the member 50, the positioning pins 42 erected on the optical element mounting substrate 30 are inserted into the positioning holes 11 of the holding member 6 so that the upper structure 5 and the optical element mounting substrate 30 are horizontal. It is positioned in the direction.

  As shown in FIGS. 4A and 4B, the holding member 6 includes an upper member 10 and a lower member 20, and the guide portion 101 of the upper member 10 and the holding portion of the lower member 20. An optical transmission body such as an optical fiber is sandwiched by 201 and is held in a state where the optical transmission body is bent in an arc shape. Specifically, as shown in FIG. 4A, the lower member 20 includes a holding portion 201 having a curved surface continuous in an arc shape on the upper surface, and is a smooth curved surface. The holding unit 201 holds the optical axis on the outside of the optical transmission body and the optical axis on the optical element side so as to be vertical. On the other hand, the upper member 10 includes a guide portion 101 having a curved surface corresponding to the arcuate curved surface of the lower member 20 on the lower surface. The curved surface of the guide portion 101 may be a smooth surface similar to the curved surface of the holding portion 201 of the lower member 20, and a guide groove 14 having a V-shaped cross section is formed along the arcuate curved surface. It may be. 4B, a plurality of guide grooves 14 having a V-shaped cross section are formed in parallel on the curved surface of the guide portion 101 of the upper member 10 along the arc-shaped curved surface. When the optical transmission body held by the holding member 6 is, for example, an optical fiber coated with a resin in a substantially circular shape in cross-sectional view, one optical fiber is disposed in each of the guide grooves 14, and the guide grooves The optical fiber is bent along a circular arc along 14 and guided. The number of guide grooves 14 is formed so as to match the number of optical fibers held by the holding member 6.

  FIG. 5A is a cross-sectional view of a main part of the upper structure 5, and the optical fiber 7 covered with a resin 90 in a substantially circular shape in cross-section is below the guide portion 101 of the upper member 10 of the holding member 6. A state in which the holding member 201 of the side member 20 is sandwiched and held is shown. As shown in FIG. 5A, a guide groove 14 is formed in a V shape on the lower surface of the guide portion 101 of the upper member 10, and the upper surface of the holding portion 201 of the lower member 20 is a smooth surface. Has been. One optical fiber 7 is arranged in each of the guide grooves 14 on the lower surface of the guide portion 101 of the upper member 10 so that the upper surface of the holding portion 201 of the lower member 20 faces the lower surface of the guide portion 101 of the upper member 10. The lower member 20 is attached to the upper member 10. As described above, when the optical fiber 7 is sandwiched and held by the guide portion 101 of the upper member 10 and the holding portion 201 of the lower member 20, the optical fiber 7 is displaced in the left-right direction with respect to the drawing of FIG. Therefore, the optical fiber 7 and the optical element on the optical element mounting substrate can be effectively optically connected.

  FIG. 4C is an example in which the guide portion 101 of the upper member 10 has a curved surface corresponding to the arcuate curved surface of the lower member 20 on the lower surface. The curved surface of the lower surface of the guide portion 101 is a smooth surface, and the structure is different from the curved surface of the guide portion 101 of the upper member 10 in FIG. 4B in which the guide groove 14 having a V-shaped cross section is formed. . In a state where the upper member 10 and the lower member 20 are mounted, a gap having a predetermined thickness is formed between the guide portion 101 of the upper member 10 and the holding portion 201 of the lower member 20. An optical transmission body is held. The optical transmission body held by the holding member 6 having such a structure is preferably a tape-type optical fiber or a film-like optical waveguide whose upper and lower surfaces are flat. FIGS. 5B and 5C are cross-sectional views of the main part of the upper structure 5, FIG. 5B shows a state in which the tape-type optical fiber 80 is held, and FIG. 5C shows a film-like optical waveguide. The state where 81 is held is shown. The optical fiber 80 in FIG. 5B has four optical fibers 7 coated with a resin 90 in a substantially circular shape in cross-sectional view, and the periphery of the four optical fibers 7 is covered with a resin 91. The top and bottom surfaces are flat. The film-shaped optical waveguide 81 in FIG. 5C has a core-like core (waveguide) 82 surrounded by a clad 83 so that the upper and lower surfaces are flat. In any case, the tape-type optical fiber 80 and the film-shaped light guide are formed by the holding portion 201 having the smooth curved surface on the upper surface of the lower member 20 and the guide portion 101 of the upper member 10 having the corresponding smooth curved surface on the lower surface. An optical transmission body such as the waveguide 81 is sandwiched. Thereby, the optical transmission body is securely held in a state of being bent in an arc shape, and the optical transmission body and the optical element on the optical element mounting substrate can be effectively optically connected.

  Thus, the optical transmission body can be effectively held by selecting the structure of the upper member 10 of the holding member 6 according to the shape of the optical transmission body. On the other hand, since the lower member 20 of the holding member 6 can have the same structure regardless of the shape of the optical transmission body, it is not necessary to prepare the lower member 20 having a different structure according to the shape of the optical transmission body. Therefore, it is not necessary to manufacture the lower member 20 having a different structure and management for the lower member 20, so that the components can be shared and an optical module can be manufactured at low cost.

  The upper structure 5 is assembled by engaging two engaging claws 21 provided on both side surfaces of the lower member 20 with two engaging holes 13 provided on both side surfaces of the upper member 10. 10 and the lower member 20 can be fixed to each other. At this time, for example, when the upper member 10 has a structure in which a guide groove 14 having a V-shaped cross section is formed in the guide portion 101 as shown in FIG. 4B, the optical fiber 7 is connected to the guide portion of the upper member 10. The upper member 10 and the lower member 20 may be fixed to each other after being arranged along the guide groove 14 of 101 and aligning the end faces 7a of the plurality of optical fibers 7 using a jig or the like. FIGS. 6A and 6B show the arrangement of the upper member 10, the optical fiber 7, and the lower member 20 of the upper structure 5 manufactured as described above.

  As shown in FIG. 6 (b), the optical fiber 7 held by the holding member 6 is bent into an arc shape, so that the optical axis moves from the horizontal external optical axis 65a downward to the optical element side optical axis 65b. The direction has been changed. The radius of curvature R of the arc portion is as small as, for example, 1 to 3 mm, the vertical direction of the upper structure 5 is reduced in height, and the horizontal direction is also reduced in size.

  Thus, in order to reduce the radius of curvature R of the arc portion of the optical fiber 7, a glass fiber having a diameter of 80 μm is used as the optical fiber 7. The diameter of a glass fiber that is generally used is 125 μm, but leakage of signal light to the outside can be suppressed by using such a thin glass fiber. Further, in order to secure the strength of the optical fiber 7 and suppress the positional deviation, a resin coating having a thickness of 22.5 μm is provided on the outer peripheral portion of the glass fiber.

  As shown in FIG. 4C, for explanation of assembly of the upper structure 5 when the guide portion 101 of the upper member 10 is a smooth curved surface, the optical fiber 7 is connected to the guide portion 101 of the upper member 10. The explanation is omitted because it is the same as the description of the assembly of the upper structure 5 described above except that it is arranged along the guide groove 14.

FIG. 7 is a top perspective view of the optical element mounting substrate 30. The optical element mounting substrate 30 shown in the figure includes a box-shaped ceramic substrate 31 having a wall portion 32 erected along the outer periphery, and the optical fiber 7 and the optical fiber 7 are positioned on the front side of the ceramic substrate 31. The same number of optical elements 40 are mounted side by side. The plurality of optical elements 40 includes a VCSEL as a surface light emitting element and a PIN photodiode as a surface light receiving element. The upper surface 32a of the wall portion 32 forms an optical reference surface, and the end surface 7a of the optical fiber 7 and the optical element 40 are positioned in the vertical direction by contacting the lower surface of the upper structure 5.

  A driver integrated circuit device 41 of the optical element 40 is mounted behind the optical element 40 on the ceramic substrate 31, and the optical element 40 and the driver integrated circuit device 41 are connected by a bonding wire. In addition, other electronic components are mounted on the ceramic substrate 31, and the electronic components on the ceramic substrate 31 are connected to the printed wiring 33 and the like through a through hole that passes through the ceramic substrate 31 (not shown). The electrode is electrically connected to a pad electrode having a pitch of 500 μm, a diameter of 300 to 350 μm, and a height of 10 μm provided on the back surface of the ceramic substrate 31.

  A pair of positioning pins 42 having a protruding height of 2 mm and a protruding portion diameter of 0.7 mm are erected at positions on both sides of the optical element 40 on the ceramic substrate 31, and these positioning pins 42 serve as the upper structure 5. The optical element mounting substrate 30 and the upper structure 5 are positioned in the horizontal direction by being inserted into the positioning holes 13.

  8A is a perspective view of the fitting member 50 as viewed from above, FIG. 8B is a perspective view as viewed from below, FIG. 9A is a top view, and FIG. 9B is a bottom surface. FIG. The fitting member 50 is made of a material having rigidity and elasticity such as metal, and a substantially square opening 51 is provided at the bottom thereof. The left and right sides of the opening 51 are bent vertically and extend upward, and a protrusion 52 projecting inward is formed at the upper end of the opening 51.

  On the side surface portion of the fitting member 50, a side plate portion 53 that is bent vertically from the central portion of each of the four sides of the opening 51 and extends upward is provided. These side plate parts 53 abut against the outer peripheral part of the holding member 6 when the upper structure 5 is mounted, thereby restricting the horizontal position of the upper structure 5, and thereby the positioning pins of the optical element mounting substrate 30. 42 is inserted into the positioning hole 11 of the upper structure 5 so that the optical element mounting substrate 30 positioned relative to the upper structure 5 is indirectly mounted in the horizontal direction with respect to the wiring substrate 70. Positioning is performed with an appropriate accuracy in which the back electrode of the substrate 30 and the pad of the wiring substrate 70 overlap, for example, an accuracy of 50 to 100 μm or less.

  Protrusions 54 are provided on the lower surface of the fitting member 50 at symmetrical positions in the vicinity of the four corners. The fitting member 50 abuts against the wiring board 70 at the projections 54 to apply an insulating adhesive or the like. It is fixed using. Thereby, the lower surface of the fitting member 50 and the upper surface of the wiring board 70 are separated by a predetermined interval, for example, about 150 μm or more. When the fitting member 50 formed of a conductive material such as metal is fixed to the wiring board 70 by surface contact, the signal transmission on the wiring board 70 is affected by electrical reflection, noise, etc. Although the operation performance of the module 1 may be affected, it is possible to avoid these influences by providing the protrusion 54 and separating the lower surface of the fitting member 50 from the upper surface of the wiring board 70.

  The anisotropic conductive sheet 60 shown in FIG. 1 ensures electrical conduction in the vertical direction by pressurization, and various types can be used without particular limitation. For example, an insulating material having elasticity such as silicone rubber can be used. A substrate in which conductive particles such as metal are dispersed or a conductive wire is embedded can be used. You may make it use what provided the electroconductive pad on the insulating base material. The thickness of the anisotropic conductive sheet 60 is, for example, 0.1 to 1 mm.

  When assembling the optical module 1 having the above configuration from the state where the optical connection and the electrical connection are disconnected as shown in FIG. 1 to the state where the optical connection and the electrical connection are made as shown in FIG. An anisotropic conductive sheet 60 is disposed in the opening 51 of the fitting member 50 fixed on the substrate 70. Next, the optical element mounting substrate 30 is disposed thereon, and the upper structure 5 is vertically fitted into the fitting member 50 from above.

  At this time, the positioning pins 42 of the optical element mounting substrate 30 are inserted into the positioning holes 11 of the upper structure 5, and the upper structure 5 is in a horizontal direction with respect to the optical element mounting substrate 30 with a predetermined accuracy, for example, 3 to 5 μm. In addition, the side surface of the holding member 6 is regulated by the side plate portion 53, and the optical element mounting substrate 30 is indirectly positioned in the horizontal direction with respect to the wiring substrate 70. Solder bumps having a pitch of 500 μm, a diameter of 300 to 350 μm, and a height of 100 μm are formed on the wiring board 70. A pitch of 500 μm and a diameter of the solder bumps provided on the lower surface of the optical element mounting substrate 30 are formed. A back electrode having a thickness of 300 to 350 μm and a height of 10 μm is aligned.

  Then, the upper structure 5 is pressed downward by the elasticity of the fitting member 50, whereby the anisotropic conductive sheet 60 is pressurized and becomes conductive. Thereby, the back electrode of the optical element mounting substrate 30 and the solder bump on the wiring substrate 70 are electrically connected via the anisotropic conductive sheet 60.

  Further, when the positioning pins 42 of the optical element mounting substrate 30 are inserted into the positioning holes 11 of the upper structure 5, the end surface 7 a of the optical fiber 7 and the optical element 40 are horizontally aligned as shown in the sectional view of FIG. 10. In addition to the positioning of the direction, the lower surface 6a of the holding member 6 and the upper surface 32a of the wall portion 32 of the optical element mounting substrate 30 come into contact with each other, whereby the end surface 7a of the optical fiber 7 and the optical element 40 are perpendicular to each other. Once positioned, they are optically connected.

  In this way, the optical module 1 is electrically and optically connected in the vertical direction in the state shown in FIG. 2 and is capable of transmitting and receiving optical signals transmitted to the outside through the optical fiber 7. .

  For example, during maintenance replacement, the optical connection can be easily disconnected by pulling out the upper structure 5 vertically from the fitting member 50, and then the optical element mounting substrate 30 is removed from the anisotropic conductive sheet 60. Electrical connection can be easily disconnected by taking out vertically.

  The present invention has been described above based on the embodiments. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, in the above-described embodiment, the upper structure 5 is detachably mounted in the vertical direction using the fitting member 50, and the optical transmission path of the upper structure 5 is connected to the optical element 40 of the optical element mounting substrate 30. As a mounting body having such a function, for example, a fitting hole is provided in the wiring board 70 and a latch structure is provided in the upper structure 5 so that the latch structure of the upper structure 5 is provided. May be fitted into a fitting hole of the wiring board 70 which is a mounting body.

FIG. 1 is a perspective view showing an optical module according to an embodiment of the present invention, and shows a state where an optical connection and an electrical connection are disconnected. FIG. 2 is a perspective view showing a state where optical connection and electrical connection are made in the optical module of FIG. 3A and 3B are views showing the upper structure, in which FIG. 3A is a top view, FIG. 3B is a bottom view, and FIG. 3C is a side view. 4A and 4B are views showing an upper member and a lower member of the holding member, wherein FIG. 4A is a perspective view of the upper surface side, FIG. 4B is a perspective view of the lower surface side, and FIG. 4C is another embodiment. It is a perspective view of the lower surface side of the lower member of the holding member which is. FIG. 5 is a cross-sectional view of the main part of the upper structure, (a) is a cross-sectional view showing a state in which the optical fiber is held by a holding member, and (b) is a view in which the tape-type optical fiber is held. It is sectional drawing which showed the state which has been, (c) is sectional drawing which showed the state in which the film-form optical waveguide is hold | maintained. 6A and 6B are views showing the arrangement of the upper member, the optical fiber, and the lower member of the upper structure, in which FIG. 6A is a perspective view and FIG. 6B is a cross-sectional view. FIG. 7 is a perspective view of the optical element mounting substrate. 8A and 8B are views showing the fitting member, in which FIG. 8A is a perspective view seen from the upper side, and FIG. 8B is a perspective view seen from the lower side. FIG. 9 is a view showing the fitting member, where (a) is a top view and (b) is a bottom view. FIG. 10 is a cross-sectional view showing a state where the upper structure and the optical element mounting substrate are optically connected.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical module 5 Upper structure 6 Holding member 6a Lower surface 7 Optical fiber 7a End surface 8 Tape fiber 10 Upper member 101 Guide part 11 Positioning hole 12 Shoulder part 13 Engagement hole 14 Guide groove 20 Lower member 201 Holding part 21 Engaging claw 30 Optical device mounting substrate 31 Ceramic substrate 32 Wall portion 32a Upper surface 33 Printed wiring 40 Optical device 41 Driver integrated circuit 42 Positioning pin 50 Fitting member 51 Opening portion 52 Projection portion 53 Side plate portion 54 Projection portion 60 Anisotropic conductive sheet 65a External side optical axis 65b Optical element side optical axis 70 Wiring board 80 Tape type optical fiber 81 Film-shaped optical waveguide 82 Core 83 Clad 90, 91 Resin

Claims (2)

An optical module that optically connects an optical transmission path that transmits an optical signal and an optical element that converts the optical signal into an electrical signal or converts the electrical signal into an optical signal,
An upper structure including an optical transmission body that forms an optical transmission path and a resin-made holding member that holds the optical transmission body;
An optical element mounting substrate disposed on the wiring substrate and electrically connected to the wiring substrate so as to be detachable in a vertical direction;
Provided on the wiring board, the upper structure is detachably mounted in the vertical direction, and by mounting the upper structure, the optical transmission path of the upper structure is optically connected to the optical element of the optical element mounting substrate. A plate spring-like fitting member to be connected,
The holding member of the upper structure is composed of a lower member and an upper member, and the lower member is continuous in an arc shape that holds the optical transmission body so that the optical axis on the external side and the optical axis on the optical element side are perpendicular to each other. The upper member has a curved surface corresponding to the curved surface of the lower member holding portion or a curved surface in which a V-shaped guide groove is formed in an arc shape on the curved surface. The optical transmission body is sandwiched and held between the holding member of the lower member and the guiding member of the upper member,
On both side surfaces of the upper member on both sides of the guide portion, a window-shaped engagement hole that penetrates a part of the shoulder portion is provided in the middle in the longitudinal direction of the shoulder portion that abuts the tip protrusion of the leaf spring-like fitting member. Provided,
The both sides of the holding part of the lower member have an engagement structure that is provided with engagement claws that are exposed through the engagement holes in the form of windows and are released by pressing the exposed parts.
An optical module characterized in that the engagement structure is configured not to hinder assembly, disassembly, and reassembly of an optical module by a mounting body of a leaf spring-like fitting member . 2. The optical module according to claim 1 , wherein the mounting body of the leaf spring-like fitting member provided on the wiring board is provided with a protrusion on the lower surface and is spaced apart from the wiring board surface .

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