JP5201511B2 - Wafer holding table - Google Patents

Description

The present invention relates to a wafer holding table. More particularly, the present invention relates to a wafer holding table for holding a wafer whose inner peripheral portion is ground while leaving the outer peripheral portion of the back surface in a rib shape.

  Conventionally, in a semiconductor manufacturing process, after a protective tape is applied to a circuit pattern of a wafer, the back surface of the wafer is ground and thinned, and then the wafer attached to the protective tape is diced with a dicing tape. It is mounted on a dicing frame, and the protective tape is peeled off with a peeling tape or the like and then diced into chips.

  In order to reduce the thickness of the wafer due to the demand for miniaturization of portable devices, the wafer backside grinding is performed by applying a protective tape to a circuit pattern formed on the surface of the wafer and then grinding or etching the backside of the wafer. In recent years, wafers having a thickness of 50 μm or less have been handled.

  In the conventional wafer manufacturing process as described above, the wafer is usually handled with a protective tape attached thereto, and the thinned wafer is not handled alone.

Recently, in the process of manufacturing a wafer for a single-function semiconductor (discrete) such as a diode or a transistor, a process for forming a metal thin film on the back surface of the wafer by metal vapor deposition or the like is performed in order to form an electrode on the back surface of the wafer. . In order to form a metal thin film on the back surface of the wafer in this way, it is necessary to process at a high temperature such as sputtering or vapor deposition, and the protective tape attached to the front surface side cannot withstand the processing temperature, so it must be peeled off. is there. Further, even when the treatment is performed at a low temperature, the protective tape is peeled off before the treatment such as vapor deposition from the side where impurities such as an adhesive used for the protective tape are mixed. Such a wafer for a single function semiconductor is then mounted on a dicing frame via a dicing tape, and formed into a chip through a dicing process.

  However, in the wafer manufacturing process as described above, it is necessary to handle the wafer in a state where the protective tape is peeled off from the thinned wafer, and there is a problem that the wafer is warped or damaged.

  Therefore, in order to prevent the wafer from warping and breakage and to facilitate handling, a concave wafer having a rib-shaped outer peripheral portion on the back surface of the wafer and whose inner peripheral portion is ground has also come out (for example, Patent Document 1). .

  According to this method, the thickness of the rib-shaped outer peripheral portion (for example, 725 μm) of the wafer is configured to be thicker than the thickness of the inner peripheral portion (for example, 50 μm), thereby preventing warpage and breakage of the wafer and facilitating handling. .

  An example of the wafer processing steps will be described with reference to FIG. 9. First, a wafer W having a circuit pattern formed on the surface as shown in FIG. 9A is prepared, and then as shown in FIG. 9B. A protective tape T is attached to the circuit pattern of the wafer W.

  Subsequently, as shown in FIG. 9C, a rib-like outer peripheral portion 70 (for example, thickness of 725 μm) is left on the outer periphery of the back surface of the wafer W on which the protective tape T is attached to the front surface, and the inner peripheral portion has a predetermined thickness (for example, 50 μm). The concave wafer W in which the rib-shaped outer peripheral portion 70 is formed is formed.

  Subsequently, the protective tape T is peeled off with a peeling tape or the like as shown in FIG. 9D, and a metal film 71 is formed on the inner peripheral grinding surface 73 on the back surface of the wafer W by vapor deposition or sputtering as shown in FIG. 9E. Subsequently, the wafer W on which the metal film 71 is formed as shown in FIG. 9 (f) is again attached with the protective tape T on the circuit pattern. As shown in FIG. The wafer 70 is ground to flatten the back surface, or the rib-shaped outer peripheral portion 70 is cut together with the protective tape T to form a flat wafer W.

  Next, the wafer W from which the rib-shaped outer peripheral portion 70 has been removed is mounted on the dicing frame DF via the dicing tape DT as shown in FIG. 9H, and the protective tape T on the surface is peeled off and used for the dicing process. The In some cases, the dicing tape DT is attached to the concave surface without removing the rib-shaped outer peripheral portion 70 and mounted on the dicing frame DF.

  As described above, the rib-shaped outer peripheral portion of the concave wafer having a protective tape attached to the surface thereof is used as a holding table for the concave wafer with the rib-shaped outer peripheral portion remaining on the back surface of the wafer and the inner peripheral portion ground. It is disclosed that the wafer is held by abutting and supporting with a stop member and increasing the internal pressure of the concave portion of the inner peripheral portion of the wafer (for example, Patent Document 2).

JP 2007-19461 A (FIGS. 5 and 6) JP 2008-34710 A

  By the way, as in Patent Document 1, a wafer having a rib-like outer peripheral portion provided on the back surface of the wafer and the inner peripheral portion thereof being ground is peeled off once when a metal film is formed on the back surface of the wafer. In order to prevent the circuit formation surface from being damaged in this processing step, a protective tape is again applied to the circuit pattern on the wafer surface.

  However, as in the above-mentioned Patent Document 1, using a holding table as in Patent Document 2 to attach a protective tape to a wafer whose inner periphery has been ground while leaving a rib-shaped outer periphery on the back surface of the wafer. When the protective tape is affixed to the inner peripheral grinding part of the wafer, the inner peripheral grinding part of the wafer is thinned. There were cases where the protective tape could not be applied or the wafer was damaged.

In addition, when the low internal pressure of the space in the wafer circumference grinding part to reverse, or contains air bubbles when you paste the inner peripheral grinding portion is bent in the protective tape of the wafer, wrinkles or entered problem there because, the internal pressure requires fine adjustment and Do Ri, there is a problem that the control of the internal pressure becomes difficult.

  Even if the space is maintained at an appropriate internal pressure and a protective tape is applied to the wafer, the inner periphery of the wafer is thinned, and the wafer surface is partially bent by the local pressing force of the application roller. However, there was a problem that bubbles and wrinkles were generated. As described above, in order to locally increase the internal pressure against the local pressing force by the sticking roller, the space of the wafer inner peripheral grinding portion is divided into a plurality of spaces, and pressure control is performed on each of the divided portions stepwise. There is a problem that the control is complicated.

  The present invention provides a wafer holding table for holding a concave wafer having a rib-like outer peripheral portion on the back surface as described above, and grinding the inner periphery thereof, and affixing a protective tape to the concave wafer without bubbles or wrinkles An object of the present invention is to provide a holding table that can be used.

Therefore, according to the invention of claim 1, the inner peripheral portion is grinded rib-shaped outer peripheral portion and the inner circumferential grinding surface on table body surface side of the wafer facing up with leaving the outer peripheral portion of the back surface in a rib shape a holding table of the wafer to be placed and held in, the said holding table, provided inside the table body top surface, a retaining means for the rib-shaped outer peripheral portion of the wafer to hold, on the inner side of the holding means A circular concave portion formed to face the inner peripheral grinding surface of the wafer, and a plurality of vent holes provided in the table main body and communicating with the concave portion below the bottom surface of the concave portion a perforated portion which is has a inlet and outlet of gas, and Availability in which is provided so as to communicate with the vent below the perforation, while being fitted into the concave portion, the fitting support provided so as to be floated within the concave portion in a state Formed between the time of placing holding the wafer, the rib-like outer peripheral portion of the wafer while retained by the retaining means, the support plate surface from the vent hole by the introduction of gas into the hollow chamber from the inlet port A wafer holding table adopting a configuration in which air is blown out toward the surface and a part of the air is discharged from the exhaust port so that the support plate floats in the concave portion and comes into contact with the inner peripheral grinding surface of the wafer It is.

  According to a second aspect of the present invention, in the wafer holding table according to the first aspect, an adhesive tape supply means for pulling out an adhesive tape having a width wider than that of the wafer onto the wafer held by the holding table, and the adhesive tape. An affixing roller for pressing and adhering to the wafer and a cutting means for cutting the adhesive tape along the outer periphery of the wafer are provided. It is the holding table of the wafer which employ | adopted the structure which cut | disconnected the said adhesive tape along.

  According to the wafer holding table of the present invention, the outer peripheral portion is left in the shape of a rib, and the supporting plate that holds the rib-shaped outer peripheral portion of the concave wafer whose inner peripheral portion is ground and floats by gas ejection is provided on the concave wafer. Since the inner peripheral grinding surface of the wafer can be supported by contacting the inner peripheral grinding surface, the inner peripheral grinding portion of the wafer can be held flat without being bent.

  In addition, since the support plate was lifted by gas jetting and brought into contact with the inner peripheral grinding surface of the wafer, even if the grinding thickness of the inner peripheral grinding portion of the wafer changes, it can follow the thickness change, It is possible to flexibly cope with changes in the amount of grinding of the inner circumference of the wafer.

  In addition, if the wafer holding table of the present invention is applied to an adhesive tape attaching device such as a protective tape, the wafer can be held flat without bending the inner peripheral grinding portion of the concave wafer, so that wrinkles and bubbles are eliminated. The adhesive tape can be attached to the wafer surface without generating it.

  Further, if a rubber sheet such as fluoro rubber is provided on the surface of the support plate used in the holding table of the present invention, the wafer is not damaged even if the support plate contacts the inner peripheral grinding surface of the concave wafer. The metal film formed on the back surface of the wafer is not adversely affected.

In addition, since the hollow chamber is provided below the perforated portion of the holding table of the present invention, and the gas introduction port and the gas discharge port are provided in the hollow chamber, the gas introduced into the hollow chamber is supplied from a plurality of vent holes. uniformly jetted to supporting lifting plate is in contact with the wafer in the circumferential grinding surface and the support plate by flat floated, the wafer can be held flat.

  In addition, since a part of the gas introduced into the hollow chamber from the gas inlet is discharged from the gas outlet, the pressure of the gas ejected from the vent hole is excessively increased and the inner peripheral grinding portion of the wafer is damaged. There is no.

It is a top view of the holding table of the wafer of the present invention. It is AA direction arrow sectional drawing of this invention. It is the perspective view seen from the surface side of the support plate used for the holding table of the wafer of the present invention. (A) And (b) is explanatory drawing of operation | movement of the holding table of the wafer of this invention. It is a vertical front view of the protective tape sticking apparatus to which the wafer holding table of the present invention is applied. (A) And (b) is explanatory drawing of the protective tape sticking operation | movement of a protective tape sticking apparatus. (C) And (d) is explanatory drawing of the protective tape sticking operation | movement of a protective tape sticking apparatus. It is a schematic plan view explaining the protective tape sticking operation of the protective tape sticking device. (A) thru | or (h) are explanatory drawings showing an example of the manufacturing process of a wafer. It is the perspective view seen from the surface side of the wafer. It is the perspective view seen from the back surface side of the wafer. It is the perspective view which looked at the wafer with which the protective tape was affixed from the surface side.

  Hereinafter, an embodiment of a wafer holding table according to the present invention will be described with reference to FIGS.

  FIG. 1 is a plan view of a wafer holding table, FIG. 2 is a longitudinal front view in the AA direction of FIG. 1, and FIG. 3 is a perspective view seen from the surface side of a support plate used for the wafer holding table. For easy understanding, the thickness of the wafer W (including the thickness of the inner peripheral grinding portion), the width of the rib-shaped outer peripheral portion 70, and the thickness of the support plate 12 in FIGS. 1 to 12 are exaggerated.

As shown in FIGS. 1 and 2, the holding table 1 for the wafer W sucks and holds the rectangular table main body 2, the cutter groove 3 provided inside the table main body 2, and the rib-shaped outer peripheral portion 70 of the wafer W. The suction groove 4 as a holding means, a concave portion 6 formed inside the suction groove 4 so as to face the inner peripheral grinding surface 73 of the wafer W, and the concave portion 6 below the bottom surface of the concave portion 6 A perforated part 7 provided with a plurality of vent holes 8 so as to communicate with each other, a hollow chamber 9 provided so as to communicate with the vent hole 8 below the perforated part 7, and the recessed part 6. In addition, the support plate 12 is provided so as to be able to float in the recessed portion 6 in this fitted state.

  The cutter groove 3 is provided with a diameter slightly larger than the outer diameter of the wafer W in the circumferential direction inside the surface of the rectangular table main body 2, and is attached to the wafer W by the protective tape attaching device 30 described later. After affixing the protective tape T wider than the diameter, it acts as a relief groove for the cutter 63 when the protective tape T is cut out along the outer shape of the wafer W.

The suction grooves 4 as a holding means is provided in the thickness of the lowered position of the wafer W in the circumferential direction so as to face the rib-like outer peripheral portion 70 of the rear surface of wafer W on the inside of the cutter groove 3, the adsorption A suction hole 5 is formed in one place on the bottom surface of the groove 4. Further, the suction hole 5 is connected to an appropriate vacuum pump (not shown) via a valve 15, and a negative pressure is exerted on the suction groove 4 by applying the vacuum pump, so that the rib-shaped outer peripheral portion 70 of the wafer W is applied. Is designed to be held by suction.

The concave portion 6 of the holding table 1 is formed inside the suction groove 4 so as to face the inner peripheral grinding surface 73 of the wafer W so as to be dug down from the surface of the table body 2 . Further, the concave portion 6 is formed to have the same diameter as or slightly smaller than the inner peripheral grinding surface 73 of the wafer W, and the support plate 12 can be fitted therein.

The perforations 7 are formed on the bottom below the concave portion 6 on the inside of the table body 2, on the concave portion 6 and the whole toward the outer periphery from the inner periphery a plurality of vent holes 8 so as to communicate evenly It has been drilled. Thus, if the vent holes 8 are provided so as to be uniform throughout, the gas can be ejected from the vent holes 8 evenly, and the support plate can be floated flat.

The hollow chamber 9 is formed as a space inside the table main body 2 so as to communicate with the vent hole 8 below the perforated portion 7 . The hollow chamber 9, the lower lid 18 of the space, dense is closed, therein the center (not shown) through the valve 16 in Rukoto Pneumatic fluid inlet 10 is provided pressure pump of the lid 18 It is possible to introduce gas.

  In general, it is sufficient to introduce air through a filter so that foreign matter such as dust does not enter the gas to be introduced, and inert gas such as nitrogen and argon is used to prevent oxidation and corrosion on the metal film 71. It can also be used.

  Further, two gas discharge ports 11, 11 are provided on the side of the gas inlet 10 of the support plate 18, and a part of the gas introduced from the gas inlet 10 through the valve 17 can be discharged. It is possible.

  The support plate 12 is formed in a circular shape having a slightly smaller diameter than the inner diameter of the concave portion 6 so as to fit inside the concave portion 6 as shown in FIGS. 2 and 3, and is relatively lightweight such as aluminum or resin. A flat member is used as the substrate 13.

  Further, a rubber sheet 14 is provided on the upper surface of the substrate 13 by adhesion or the like so as not to damage the wafer W when contacting the inner peripheral grinding surface 73 of the wafer W. As the rubber sheet 14, a fluoro rubber or a material whose surface is fluorinated so that the rubber sheet 14 does not affect even when it comes into contact with the inner peripheral grinding surface 73 of the wafer W can be preferably used.

  Further, when the rubber sheet 14 is pressed against the inner peripheral grinding surface 73 of the wafer W and becomes difficult to separate, the surface of the rubber sheet 14 in contact with the inner peripheral grinding surface 73 is subjected to sand blasting or the like so as to provide fine irregularities. Just do it.

  In the present embodiment, the rubber sheet 14 is provided on the substrate 13, but the substrate 13 may be used alone. In this case, the processing is directly performed on the surface of the substrate 13 that contacts the inner peripheral grinding surface 73. You may make it give.

  The support plate 12 is fitted inside the concave portion 6 as indicated by a two-dot chain line in FIG. 2 and floats in the concave portion 6 in a horizontal state along the inner wall. At this time, the clearance between the upper surface of the support plate 12 fitted and placed in the concave portion 6 of the holding table 1 and the inner peripheral grinding surface 73 of the wafer W may be about 0.1 to 0.2 mm. It is not limited, What is necessary is just to adjust suitably according to the pressure of the gas to introduce, the weight of the support plate 12, etc.

  The above is the configuration of the holding table 1 for the wafer W of the present invention. Next, the operation of the holding table 1 will be described with reference to FIGS. 4 (a) and 4 (b).

  As shown in FIG. 4A, the wafer W positioned by appropriate means is sucked and transferred onto the holding table 1 by the transfer means 19 with the formation surface of the circuit pattern P facing upward, and the wafer is placed on the suction groove 4 of the holding table 1. The wafer W is placed so that the rib-shaped outer peripheral portion 70 of W is located. In this transfer, a portion of the wafer W on the outer surface side where the circuit pattern P is not formed is sucked and transferred by the suction pad 20.

  Note that a non-contact hand can be used in place of the transfer means 19 described above, and when the distance between the circuit pattern P of the wafer W and the outer periphery of the wafer W is small, the holding of the wafer W from the surface side is not possible. However, the rib-shaped outer peripheral portion 70 on the back surface of the wafer W may be held and transported by suction or the like. In this case, a suction pin or the like that can be projected and retracted is provided near the suction groove 4 on the holding table 1 side. It should be provided.

  Next, as shown in FIG. 4B, a vacuum pump (not shown) connected to the suction hole 5 is operated, and the valve 15 is opened to generate a negative pressure in the suction groove 4 to be placed on the suction groove 4. The wafer W is held on the holding table 1 by sucking the rib-shaped outer peripheral portion 70 of the wafer W.

  Next, the valve 16 is opened to introduce air into the hollow chamber 9 from the gas inlet 10, and the valve 17 is opened to exhaust a part of the air from the gas outlet 11. For example, about 30% of the introduced air may be exhausted, but the amount of exhaust may be adjusted as appropriate according to the pressure of the introduced air, so that the adsorption force of the rib-shaped outer peripheral portion 70 of the wafer W is not lost. The air introduction pressure is set to be smaller than the force.

  As the air is introduced, the air introduced into the hollow chamber 9 is made uniform, and the air is uniformly ejected into the concave portion 6 through the vent holes 8 formed in the perforated portion 7. The inside of the concave portion 6 floats along the inner wall of the concave portion 6 and comes into contact with the inner peripheral grinding surface 73 of the wafer W.

  When a part of the air introduced as described above is exhausted, the holding force of the wafer W is lost and the wafer W is detached, or the internal pressure is excessively increased and the inner peripheral grinding portion of the wafer W is damaged. There is nothing to do. Further, as a part of the air is exhausted as described above, air is ejected from the vent hole 8, and part of the air returns from the concave portion 6 through the vent hole 8 to the hollow chamber 9, so that the support plate 12 is Ascend with appropriate pressure.

  The above is the configuration and operation of the wafer holding table of the present invention. Next, an adhesive tape attaching apparatus to which the wafer holding table of the present invention is applied will be described with reference to FIGS.

  FIG. 5 is a longitudinal front view of the protective tape attaching apparatus 30 to which the wafer holding table of the present invention is applied. In the present embodiment, an example in which a protective tape T that protects the circuit pattern P of the wafer W is used as an adhesive tape will be described.

As shown in FIG. 5, the holding table 1 is provided near the center on the machine base 31, a base plate 32 is erected on the machine base 31, and a tape supply reel 33 and a protective tape T are placed on the upper right side of the base plate 32. A separator take-up reel 44 that winds up the separator 39 that protects the adhesive surface is provided. As the protective tape T, a roll having a width wider than the outer shape of the wafer W as shown in FIG. 8 is used.

  A pair of a tape chuck 47 for pulling out the supplied protective tape T and a chuck / peeling roller 48 are provided on the upper right side of the holding table 1, and the protective tape T is provided on the supply side of the protective tape T. An affixing roller 45 for affixing to the wafer W is provided, and a cutter mechanism 58 as a cutting means for cutting out the protective tape T along the outer shape of the wafer W is provided above the holding table 1.

  A tape take-up reel 52 is provided on the upper left side of the holding table 1 to take up the unnecessary portion of the protective tape T.

  The protective tape T supplied from the tape supply reel 33 passes through the guide roller 34, is passed over the dancer roller 35, and then is guided through the shaft roller 37 to the peeling roller 38 that peels the separator 39.

  The protective tape T from which the separator 39 protecting the adhesive surface by the peeling roller 38 has been peeled off is guided to the wafer W held on the holding table 1 after passing through the adhering roller 45 and the tape chuck 47, and thereafter The tape is wound around the tape take-up reel 52 via a plurality of guide rollers 49, 50, 51.

  The separator 39 peeled off by the peeling roller 38 passes through the guide roller 40 and is then wound around the take-up reel 44 via the shaft roller 41 and the dancer roller 43.

  The affixing roller 45 is provided so as to be movable up and down by a cylinder 46 and horizontally movable on the holding table 1 by an appropriate driving means (not shown).

  The tape chuck 47 is provided in a pair with the chuck / peeling roller 48. The tape chuck 47 sandwiches the protective tape T from above and below, and horizontally moves on the holding table 1 by an appropriate driving means (not shown). At this time, the tension of the protective tape T is maintained appropriately in conjunction with the tension arm 36. Similarly, the separated separator 39 is also swung while controlling the tension arm 42 to keep the tension properly.

  The chucking / peeling roller 48 affixes the protective tape T on the wafer W, cuts it along the outer shape of the wafer W, and then horizontally moves while rolling on the holding table 1, thereby protecting the unnecessary portion of the protective tape. T is peeled off from the holding table 1.

The cutter mechanism 58 includes a cutter 63 provided on the arm, a motor 61 provided on the motor fixing plate 60 is composed of the motor fixing plate 60 in the cylinder 62 for vertically moving the cutter mechanism 58 The motor fixing plate 60 can be moved up and down along the rail 59 on the base plate 32 erected on the machine base 1 by the vertical movement of the motor fixing plate 60.

  The cutter mechanism 58 is moved down by the cylinder 62 so as to act on the outer periphery of the wafer W to which the protective tape T is adhered, and cuts the protective tape T along the outer shape of the wafer W. At this time, the cutter 63 is turned by the motor 61 along the cutter groove 3 provided in the holding table 1 so that the holding table 1 and the cutter 63 are not damaged.

  The notch 72 of the wafer W may be provided with an appropriate cutter separately from the cutter 63 or may be cut out by rotating the cutter 63.

The holding table 1 is connected to an upper side of a cylinder 53 provided on the machine base 1 so as to be movable up and down, and support frames 56 and 56 are provided below both ends of the holding table 1. Sliders 57 and 57 are provided outside the lower ends of the support frames 56 and 56. The slider 57 is slidably fitted in the rails 55, 55 provided upright on the machine base 1, which enables vertical movement along the rails 55 and 55.

  The above is the configuration of the embodiment in which the wafer holding table of the present invention is applied to the protective tape attaching device 30. Next, the attaching of the protective tape T of the protective tape attaching device 30 based on FIGS. The operation will be described below.

  As shown in FIG. 6A, the wafer W positioned by appropriate means is placed on the holding table 1 and the rib-shaped outer peripheral portion 70 on the back surface of the wafer W is sucked and held by the suction groove 4. The protective tape T is sandwiched between the chucking / peeling roller 48 and pulled out onto the wafer W. At the same time, the attaching roller 45 is moved horizontally to the rear of the tape chuck 47.

  Subsequently, as shown in FIG. 6B, air is introduced into the hollow chamber 9 from the gas inlet 10 of the holding table 1 and a part of the air is discharged from the gas outlet 11, so that air with an appropriate pressure is supplied. The support plate 12 in the concave portion 6 is floated in the concave portion 6 by being uniformly ejected from the plurality of vent holes 8 and brought into contact with the inner peripheral grinding surface 73 of the wafer W.

  In this state, the holding table 1 is raised to the lower end portion of the protective tape T, and the protective tape T is pressed onto the table body 2 by the affixing roller 45 to be bonded. At this time, since the protective tape T is controlled to an appropriate tension by the tension arm 36, it does not stick to the wafer W.

  Next, as shown in FIGS. 7C and 8, air is blown out from the vent hole 8, and the support plate 12 is kept in contact with the inner peripheral grinding surface 73 of the wafer W while the cylinder is applied to the adhering roller 45. At 46, an appropriate pressing force is applied to roll on the holding table 1, and the protective tape T is attached to the wafer W.

  Thus, even if the local pressing force by the attaching roller 45 acts on the wafer W by the suction holding of the rib-shaped outer peripheral portion 70 of the wafer W and the support by the contact of the support plate 12 of the inner peripheral grinding surface 73, the wafer W Is supported flat, and the protective tape T can be attached to the wafer W without generation of bubbles or wrinkles.

  Subsequently, as shown in FIG. 7D, the cutter 63 is lowered by the cylinder 62, and the motor 61 is operated to turn the cutter 63 to cut the protective tape T along the outer shape of the wafer W, as shown in FIG. A protective tape T is affixed to the surface side of the wafer W on which the circuit pattern P is formed.

  Thereafter, although not shown, the wafer W is transferred from the holding table 1 to the next process by an appropriate transfer means or stored in a storage cassette or the like, and the protective tape attaching device 30 returns to the initial state. Thereafter, this operation is repeated.

  The above is the embodiment of the protective tape pasting apparatus 30 to which the wafer holding table of the present invention is applied. However, the present invention is not limited to the above embodiment, and various adhesive tapes such as dry film resists are attached to the wafer W. It is possible to paste on.

  In this embodiment, the wide and roll-shaped protective tape T is used. However, a pre-cut adhesive tape previously formed in the shape of the wafer W can also be used. In this case, the cutter of the holding table 1 is used. The groove 3 may be eliminated.

  Further, in the present embodiment, the holding of the rib-shaped outer peripheral portion 70 of the wafer W is sucked and held, but the outer periphery of the wafer W may be fixed with a half-moon clamp instead of the sucking. In this case, an appropriate elastic member such as rubber can be used at the contact portion of the clamp with the wafer W so as not to damage the outer peripheral portion of the wafer W.

  In the present embodiment, the support plate 12 is directly fitted and placed on the bottom surface of the concave portion 6 of the holding table, and the gas ejected from the vent hole 8 is directly applied to the support plate 12. If a ventilation space that uniformly spreads the gas jetted to the upper surface portion of the ventilation hole 8 in the inside 6 is provided with a slightly smaller diameter than the support plate 12, and the gas in a uniform state is allowed to act on the support plate 12, the support plate 12. Can be levitated in a more stable state.

W Wafer P Circuit pattern T Protection tape DF Dicing frame DT Dicing tape 1 Holding table 2 Table body 3 Cutter groove 4 Suction groove 5 Suction hole 6 Concave part 7 Perforated part 8 Vent hole 9 Hollow chamber 10 Gas inlet 11 Gas outlet 12 Support plate 13 Substrate 14 Rubber sheet 15 Valve 16 Valve 17 Valve 18 Lid 19 Adsorption carrier 20 Adsorption pad 30 Protection tape affixing device 31 Machine base 32 Support plate 33 Tape supply reel 34 Guide roller 35 Dancer roller 36 Tension arm 37 Axial roller 38 Separation roller 39 Separator 40 Guide roller 41 Axial roller 42 Tension arm 43 Dancer roller 44 Separator take-up reel 45 Adhesion roller 46 Cylinder 47 Tape chuck 48 Chuck and separation roller 49 Guide roller 50 Idorora 51 guide roller 52 the tape take-up reel 53 the cylinder 54 post 55 rail 56 supporting frame 57 slider 58 inner peripheral grinding face cutter mechanism 59 rail 60 motor fixing plate 61 motor 62 cylinder 63 the cutter 70 rib-shaped outer peripheral portion 71 the metal film 72 notch 73

Claims (2)

Wafer holding table of the inner peripheral portion, leaving the outer peripheral portion of the back surface in a rib shape is placed and held the surface of the wafer on the table body in the upper having an inner circumferential grinding surface and the rib-shaped outer peripheral portion is ground a is, the holding table, provided inside the table body top surface, a holding means that holds a rib-shaped outer peripheral portion of the wafer, to the inner circumferential grinding surface facing said wafer inside of said holding means A circular concave portion formed as described above, a perforated portion provided in the table main body, and having a plurality of vent holes formed so as to communicate with the concave portion below the bottom surface of the concave portion, and introduction of gas It has a mouth and outlet, and check in which is provided so as to communicate with the vent below the perforation, while being fitted into the concave portion, so as to be floated in the concave portions in this insertion state The wafer is formed with a provided support plate. When location holds, the rib-like outer peripheral portion of the wafer as well as retained by said retaining means, together with allowed to eject air toward the support plate surface from the vent hole by the introduction of gas into the hollow chamber from the inlet thereof A wafer holding table, wherein a part of the support plate is discharged from an exhaust port so that the support plate floats in a concave portion and comes into contact with an inner peripheral grinding surface of the wafer.   2. The wafer holding table according to claim 1, wherein an adhesive tape supply means for pulling out an adhesive tape having a width wider than the wafer onto the wafer held on the holding table, and affixing the adhesive tape by pressing the adhesive tape against the wafer. A roller and a cutting means for cutting the adhesive tape along the outer periphery of the wafer, and the adhesive tape is pressed and pasted to the wafer with an adhesive roller, and the adhesive tape is cut along the outer periphery of the wafer A wafer holding table.

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