JP5180690B2 - LED chip mounting substrate manufacturing method, LED chip mounting substrate mold, LED chip mounting substrate, and LED - Google Patents

Description

The present invention relates to a method for manufacturing an LED chip mounting substrate. Further, the present invention is, LED chip mounting mold substrate, L ED chip mounting board, and a LED.

  Conventionally, a light emitting diode (LED) that emits light by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode is known.

  Among such LEDs, for example, a surface mount type LED is formed by mounting an LED chip on a pair of electrodes formed on a lead frame and resin molding. In this case, the outer lead having a predetermined shape is formed by bending the lead portion extending to the outside of the resin after the resin molding.

    However, when the outer frame is formed by bending the lead frame after resin molding, it is necessary to provide a lead space for forming the outer lead separately outside the LED package region. The existence of this space becomes a problem in reducing the occupied area per package on the lead frame, and it is difficult to increase the number of LEDs formed on one lead frame. In other words, the lead frame mounting area cannot be increased.

    Further, if the outer lead is bent after the resin molding, a force is also applied to the resin-molded inner lead, which causes problems such as cracking of the resin and separation between the resin and the lead frame.

Japanese Patent Application Laid-Open No. 2006-173155 (Patent Document 1) discloses an LED lead frame that completes bending of a metal lead before insert molding.
JP 2006-173155 A

    However, the LED lead frame described in Patent Document 1 requires a separate process for bending the lead frame before the resin molding process. In this case, the number of processes for manufacturing the LED increases.

    In addition, a lead frame bent in advance in another process is difficult to handle and accurate positioning may be difficult, so it is difficult to perform resin molding while ensuring reliability for such a lead frame. .

Accordingly, an object of the present invention is to provide a simple and reliable method for manufacturing a substrate for mounting an LED chip while solving the above problems. The present invention is also the problem resolvable reliable LED chip mounting mold substrate, L ED chip mounting board, and, an exemplary object to provide an LED.

An LED chip mounting substrate manufacturing method according to an aspect of the present invention is an LED chip mounting substrate manufacturing method before mounting a plurality of LED chips, and includes an upper mold and a lower mold for resin molding. And clamping the lead frame by using the upper mold and the lower mold to bend the first free end and the second free end of the lead frame by clamping the lead frame state, it possesses a step of filling the resin into a space formed by the upper mold and the lower mold, and the folding said first free end portion bent by step and the second free end The thickness of the bent region of the portion is formed to be thinner than the thickness of the other regions of the first free end and the second free end, and the resin is filled by the filling step. The space includes the bent regions of the first free end and the second free end, and the bent regions of the first free end and the second free end are It is covered with resin .

Further, the mold for the LED chip mounting substrate as another aspect of the present invention has an upper mold for pressing the lead frame from the upper surface side, and a lower mold for pressing the lead frame from the lower surface side, At least one of the upper mold and the lower mold is provided with a pressing portion, and the mold mold is configured to clamp the lead frame by clamping the lead frame with the upper mold and the lower mold. A first free end portion and a second free end portion of the lead frame are bent by a portion, and a space formed by the upper die and the lower die is filled with resin, and the clamp Thus, the thickness of the bent region of the first free end and the second free end folded is larger than the thickness of the other regions of the first free end and the second free end. Is also thinly formed, The space filled with the resin includes the bent regions of the first free end and the second free end, and the first free end and the second free end of the second free end. The bent region is configured to be covered with the resin .

An LED chip mounting substrate according to another aspect of the present invention is an LED chip mounting substrate before mounting a plurality of LED chips, and is used for electrical connection to the first electrode of the LED chip. A lead frame comprising a first free end, a second free end for electrical connection to the second electrode of the LED chip, and an external electrode that constitutes an external electrode of the LED; a first free end and has a resin to insulate between the second free end portion, said distal end portion of the first free end portion and the second tip portion of the free end portion, The first free end and the second free end are folded between the external electrode portion by clamping the lead frame using an upper die and a lower die for resin molding. has a step formed Te, the folded first free Parts and the thickness of the bent region of said second free end portion is thin is formed than the thickness of other regions of the free ends of the first and the free end of the second, the first free end portion And a first plane including the tip of the second free end is parallel to a second plane including the external electrode portion, and the tip of the first free end and the first Both surfaces of the front end portion of the free end portion 2 are exposed without being covered with the resin, and the bent regions of the first free end portion and the second free end portion are covered with the resin. It is characterized by that .

According to another aspect of the present invention, an LED includes an LED chip that emits light by applying a forward bias between a first electrode and a second electrode, and the LED chip. A first free end electrically connected to the first electrode of the chip; a second free end electrically connected to the second electrode of the LED chip; and an external electrode of the LED A lead frame including an external electrode portion, a resin that insulates between the first free end portion and the second free end portion, and a translucent resin that seals the LED chip. And using an upper die and a lower die for resin molding between the tip portion of the first free end portion and the tip portion of the second free end portion and the external electrode portion. The first free end and the second free end by clamping the lead frame; Part has a step formed by bending, the folded first free end portion and the second thickness of the folding region of the free end, the free end portions of the first and second The first flat surface including the distal end portion of the first free end portion and the distal end portion of the second free end portion is formed thinner than the thickness of the other region of the free end portion. Parallel to a second plane including both sides of the tip of the first free end and both sides of the tip of the second free end are not covered with the resin, and one of the two sides Is covered with the translucent resin, and the bent regions of the first free end and the second free end are covered with the resin .

    Other objects and advantages of the present invention are illustrated in the following examples.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the board | substrate for LED chip mounting simple and reliable can be provided.

Further, according to the present invention, the problems resolvable reliable LED chip mounting mold substrate, L ED chip mounting board, and can provide a LED.

    Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

  First, Example 1 of the present invention will be described.

    FIG. 1 is an overall structural view of a lead frame in the present embodiment. 1A is a plan view of the lead frame, FIG. 1B is a side view of the lead frame of FIG. 1A viewed from the B direction, and FIG. 1C is FIG. 1A. FIG. 6 is a side view of the lead frame when viewed from the C direction.

    In FIG. 1, 10 is a lead frame. The lead frame 10 is made of, for example, a copper alloy and is provided for mounting a plurality of LED chips. As will be described later, a plurality of LED chips are mounted on the lead frame 10 and resin molding is performed, and then dicing (cutting) to complete a plurality of LEDs (Light-Emitting Diode).

    Reference numeral 20 denotes a lead forming hole (a punching hole). The lead formation holes 20 form inner leads (free ends 11a and 11b, external electrode portions 16a and 16b) by punching the lead frame 10 by press working at the LED chip mounting position described later. Further, as shown in this figure, the lead frame 10 is formed with a plurality (five in this figure) of lead forming holes 20 for forming a plurality of sets (12 in this figure) of free ends 11a and 11b. Has been. For this reason, the lead frame 10 is formed with a set of free ends 11a and 11b in a matrix. In addition, the lead forming hole 20 has an edge shape in which irregularities are repeated by forming the free end portions 11a and 11b so as to protrude in the width direction of the lead frame 10, but as a whole, It is a vertically long hole in a predetermined direction (vertical direction in the figure). Further, external electrode portions 16a and 16b are formed on the edge portion of the lead forming hole 20 in a state of being aligned in a straight line. Specifically, in each lead forming hole 20, 12 external electrode portions 16a are formed in a state of being aligned in the vicinity of one edge located on the left side of the figure, and are positioned on the right side of the figure. Twelve external electrode portions 16b are formed in a straight line in the vicinity of the other edge.

    The inner lead is a portion covered with resin by a resin mold (a portion of the lead sealed with resin). In this embodiment, the free end portion 11a (first free end portion) and the external electrode portion 16a constitute a first inner lead, and the free end portion 11b (second free end portion) and the external electrode portion 16b A second inner lead is formed.

    The free end portion 11a is disposed on both sides of the free end portion 11b. As shown in FIG. 1, the free end portion 11a extends from the left side to the right side. The free end portion 11a is electrically connected to the first electrode (anode electrode) of the LED by a bonding wire.

    The free end portion 11b is disposed between the two free end portions 11a. As shown in FIG. 1, the free end portion 11a extends from the right side to the left side. Thus, the free end portion 11a and the free end portion 11b extend in opposite directions so as to face each other. In addition, an LED chip is mounted on the distal end portion of the free end portion 11b. For this reason, the free end portion 11b is electrically connected to the second electrode (cathode electrode) of the LED. In the present embodiment, the first electrode and the second electrode only need to form a pair of electrodes. For example, the first electrode is a cathode electrode and the second electrode is an anode electrode. You can also.

    The lead forming hole 20 insulates between a pair of electrodes (between the first electrode and the second electrode) of the LED chip, that is, the free end portion 11a (external electrode portion 16a) constituting the inner lead. It is provided to insulate the free end portion 11b (external electrode portion 16b).

    Half edges 12a and 12b are formed on the free ends 11a and 11b, respectively. The half edges 12a and 12b are provided at locations where the lead frame 10 is bent as will be described later. By forming the half edges 12a and 12b, the lead frame 10 can be easily bent. In addition, the height of the LED chip in the LED as a package can be secured by bending the lead frame 10 as in this embodiment.

    As shown in FIG. 1A, in the lead forming hole 20 formed in the lead frame 10, the unit structures shown in the range 15 are arranged in the same size and shape. The unit structure (range 15) of the lead forming hole 20 is formed substantially the same as the size of the outer shape of the LED which is one package in this embodiment, and constitutes a part of one LED. However, a plurality of LED chips can be mounted on one LED.

As shown in FIGS. 1B and 1C, the lead frame 10 before being clamped to the mold has a flat plate shape. For this reason, for example, the lead is easier to handle than a lead frame bent into a predetermined shape, and can be accurately positioned at the time of resin molding described later.
FIG. 2 is an enlarged view of a main part of the lead frame in the present embodiment. 2A is a plan view of the lead frame, FIG. 2B is a cross-sectional view of the BB cut surface in FIG. 2A, and FIG. 2C is C in FIG. 2A. It is sectional drawing of a -C cut surface. FIG. 2D is a plan view when the lead frame in FIG. 2C is viewed from the D direction.
FIG. 2 is an enlarged view of a region corresponding to the range 15 in FIG. In FIG. 2B, the left side of the drawing is the upper surface (front surface) side of the lead frame, and the right side is the lower surface (back surface) side of the lead frame.

    As shown in FIGS. 2A to 2D, half edges 12a to 12d are formed at the free ends 11a and 11b constituting the inner lead. Specifically, as shown in FIGS. 2 (A) and 2 (C), on the surface side of the lead frame 10, a half edge 12a is formed at the free end 11a, and at the free end 11b. Is formed with a half edge 12b.

    2C and 2D, on the back side of the lead frame 10, a half edge 12c is formed at the free end portion 11a, and a half edge is formed at the free end portion 11b. 12d is formed.

    These half edges 12a to 12d facilitate the bending of the lead frame 10 as will be described later. In this case, when a force is applied to a predetermined portion of the lead frame 10, the lead frame 10 is naturally bent preferentially at the half edges 12a to 12d. In addition, since the half edges 12a to 12d of the present embodiment are formed mainly for the purpose of facilitating the bending of the lead frame 10, another method for making the strength of the lead frame at the bent portion weaker than the surrounding strength. But you can achieve this goal. For this reason, a specific structure is not limited to a half edge like a present Example.

    As long as the strength of the lead frame at the bent portion is weaker than the surrounding strength, a structure in which the width of the bent portion is shortened or a structure in which a plurality of holes are provided at the bent portion may be adopted. Moreover, it is not limited to what forms the half edges 12a-12d only in either the surface side of the lead frame 10, or a back surface side like a present Example. The half edges 12 a to 12 d can be formed on the surface opposite to the present embodiment, or the half edges 12 a to 12 d can be formed on both surfaces of the lead frame 10. In this case, it is desirable to form a half edge as shown in the present embodiment in order to achieve both ease of current flow and easy bending. That is, when the cross-sectional area is reduced by the same amount, reducing the thickness of the bent portion as in this embodiment is weaker than narrowing the width, and the strength is reduced without reducing the ease of current flow as much as possible. This makes it easy to bend.

    The locations where the half edges 12a to 12d are formed are locations where the lead frame 10 is bent. For this reason, the location where the half edges 12a to 12d are formed is appropriately changed according to the bent location of the lead frame 10 (see FIG. 12).

    The free ends 11a and 11b constituting the inner lead are formed so as to extend in opposite directions to overlap each other in the width direction (left and right direction in FIG. 2) of the lead forming hole 20 in the opposite directions. Has been. The free end portion 11b is used as a die pad for mounting an LED chip. On the other hand, a connecting means such as a gold wire for electrical connection with the LED chip is bonded to the free end portion 11a.

    The LED chip is an LED element that includes a pair of electrodes, an anode electrode (positive electrode) and a cathode electrode (negative electrode), and emits light by applying a predetermined voltage with a forward bias between these electrodes. For this reason, for example, when the cathode electrode surface of the LED chip is mounted on the free end portion 11b, the free end portion 11a and the anode electrode of the LED chip are connected by a connecting means such as a gold wire. Thereby, the free end portion 11a of the lead frame 10 and the anode electrode of the LED chip are electrically connected.

    In this embodiment, since one electrode of the LED chip and the free end portion 11a are connected by two wires, two free end portions 11a are provided. However, the present invention is not limited to this, and the number of wires may be one or three or more. In accordance with this, the number of free end portions 11a can be increased or decreased. In this embodiment, the lead frame on the free end portion 11b side is described as being on the cathode side. However, the present invention is not limited to this, and the free end portion 11b is changed depending on the type of the LED chip. It may be the anode side. In this case, the lead frame on the side where the free end portion 11a is provided is the cathode side.

    Further, for example, the LED chip may be of a flip chip type. At this time, a pair of electrodes arranged on the lower surface of the LED chip can be bonded and mounted on each of the free ends 11a and 11b. Further, a plurality of LED chips may be mounted in one LED (package), or a protective element such as a Zener diode or a capacitor may be mounted. Accordingly, the number of free end portions 11a and 11b can be increased. In this case, the number of the free ends 11a and 11b may be the same, or a configuration in which one of them is small (for example, a configuration in which any one is fewer) may be employed.

    FIG. 3 shows a lower mold in the present embodiment. 3A is a plan view of the lower mold, FIG. 3B is a cross-sectional view taken along the line BB in FIG. 3A, and FIG. 3C is in FIG. 3A. It is sectional drawing of a CC cut surface.

    The lower mold 60 presses the lead frame 10 from the lower surface (front surface) side during resin molding. In the lower mold 60 of this embodiment, a concave portion having a rectangular shape in plan view that forms the cavity 70 is formed. In the area of the cavity 70, a support portion 67 for supporting the lower surface of the planar lead frame 10 is formed on the lower mold 60 so as to protrude to the same height as the parting surface of the lower mold 60. Yes. The flat portion at the tip of the support portion 67 serves as a clamping surface for clamping the vicinity of the external electrode portions 16a and 16b of the flat lead frame 10. For this reason, the lead frame 10 is formed so as to protrude at the same interval as the interval between the external electrode portions 16a and 16b. Further, the lower mold 60 includes a free end support portion 68 for supporting the lead frame 10 (free end portions 11 a and 11 b) bent by an upper mold, which will be described later, from the lower side. It is formed lower than the surface. The free end support portion 68 is formed at a position between the two support portions 67. Therefore, on the contrary, the support part 67 at the position sandwiched between the free end support parts 68 is, as shown in FIG. 3C, free end parts 11a and 11b that are bent by the two free end support parts 68, respectively. Two protrusions are provided so as to support the base end side (that is, the external electrode portions 16a and 16b). On the other hand, the support portion 67 formed along the wall surface of the cavity 70 is provided with one protrusion so as to support the base end side of either of the free ends 11a and 11b bent by the single free end support 68. Have.

  As shown in FIG. 3 (A), the free end support portions 68 are provided at the same intervals as the number of formation sets of the free end portions 11a and 11b in the lead frame 10, and are arranged in a matrix of 12 rows and 5 columns. It is arranged. Moreover, the free end support part 68 is comprised so that it may become circular shape seeing from a plane. In this embodiment, in order to form the circular free end support portion 68, a plurality of pins 63 are inserted into holes formed in the lower mold 60 from the opposite side of the parting surface. These pins 63 are formed such that a side surface at a part of the tip is inclined and becomes narrower toward the tip. The surfaces of the tips of the pins 63 have a circular shape, and the free end support portion 68 is configured with the tips of the pins 63 protruding from the bottom surface of the cavity 70. By using the plurality of pins 63 as in the present embodiment, the circular free end support portion 68 can be easily formed while easily adjusting the height. In addition, the free end support portion 68 can be formed using screws so that the height can be more easily adjusted according to the thickness of the lead frame 10 or the like.

    However, it is not essential to use the pin 63 or the like to configure the free end support portion 68. It is also possible to form the free end support 68 integrally with the lower mold 60. In addition, the shape of the free end support portion 68 is preferably circular in order to form a reflector shape of an LED manufactured in a resin mold described later, but is not limited to a circular shape, such as a rectangular shape. Other shapes may be employed. Moreover, although it is good also as a structure which diameter-reduces by a predetermined inclination as mentioned above, the shape where the inclination changes in the middle may be sufficient, and the shape which is not inclined can also be employ | adopted. The cavity 70 is filled with the resin 80 at the time of resin molding.

    Such a flat front end portion of the free end support portion 68 serves as a clamping surface for clamping the planar lead frame 10 (free end portions 11a and 11b). The lower mold 60 is provided with a plunger 110 and a pot 112. As will be described later, at the time of resin molding, a resin tablet (not shown) is introduced into the pot 112 and melted, and the plunger 110 is moved upward to pump the molten resin, thereby feeding the upper mold 50 and the lower mold 60. The space between them (particularly the cavity 70) is filled with resin or the like.

    FIG. 4 shows an upper mold in this embodiment. 4A is a plan view of the upper mold, FIG. 4B is a cross-sectional view taken along the line BB in FIG. 4A, and FIG. 4C is in FIG. 4C. It is sectional drawing of a CC cut surface.

    The upper mold 50 presses the lead frame 10 from the upper surface (back surface) side during resin molding. The upper mold 50 is formed with a plurality of pressing portions 58 for bending the planar lead frame 10 (free end portions 11a and 11b). The pressing portion 58 is formed in a rectangular shape in plan view so as to protrude from the parting surface of the upper mold 50 in a trapezoidal shape in cross section. In addition, since this press part 58 bends free end part 11a, 11b in the edge part of the end surface part at the time of the resin molding mentioned later, the free end part is extended from 2 directions like a present Example Then, it is preferable to form in the planar view rectangular shape. However, if the free ends 11a and 11b can be clamped, they can be formed in a circular shape or a polygonal shape. Further, in the configuration in which the free end portion extends from two or more directions, the pressing portion 58 can be formed in a shape having sides that are orthogonal to the directions. For example, in order to bend the lead frame with the free end extending from the six directions more reliably, it is preferable to form the lead frame in a hexagonal shape in plan view.

    Further, the same number of pressing portions 58 as the free end support portions 68 are provided at the same interval, and are arranged in a matrix of 12 rows and 5 columns. For this reason, at the time of mold clamping, it is possible to clamp in a state where the set (unit structure) of the free end portions 11a and 11b in the lead frame 10, the pressing portion 58, and the free end support portion 68 are overlapped in the clamping direction. It becomes. Also, the upper mold 50 is formed with a plurality of projections 59 (10 in this embodiment) for forming the chamfered portion 13 (V-shaped groove, V notch) on the substrate mounting surface (back surface) side of the lead frame 10. Has been. Two protrusions 59 are formed at positions spaced apart from the pressing portions 58 by a predetermined interval for each row of the pressing portions 58 so as to sandwich the row of the pressing portions 58 by a plurality (12 in this embodiment). Yes. Further, since the protrusions 59 are formed at the same interval in the row direction as the protrusions of the support part 67 in the lower mold 60, the protrusions and the external electrodes are clamped by clamping the lead frame 10 at the position as described above. The portions 16a and 16b overlap with each other in the clamping direction. Further, the protrusion 59 is formed longer than the formation region of the pressing portion 58 in the row direction. Specifically, the protrusion 59 extends to the upper side of the pressing portion 58 on one end side (for example, the upper side in FIG. 4A) and from the pressing portion 58 on the other end side (for example, the lower side in the figure). Is formed so as to extend to the lower side.

    The chamfered portion 13 formed on the protrusion 59 is formed at a cutting portion when cutting the lead frame 10 when forming an LED which is a final product. In other words, the protrusions 59 are formed at intervals at which the lead frame 10 is cut. The position of the cut portion corresponds to the end portion of the inner lead (first and second inner leads) in the LED. For this reason, in this embodiment, the position where the chamfered portion 13 is formed in the lead frame 10 before being cut is referred to as an end portion of the inner lead. Thus, the lead frame 10 of the LED chip mounting substrate in the present embodiment is configured to be cut at the end portion of the inner lead where the chamfered portion 13 is formed.

    As shown in FIG. 4A, in this embodiment, a plurality of linear protrusions 59 are arranged, but the present invention is not limited to this. A configuration in which the protrusions 59 are not arranged may be employed.

    In the upper mold 50, a cull 55 and a runner 56 are formed in a concave shape with respective shapes and sizes. The tip flat portion of the pressing portion 58 of the upper mold 50 serves as a clamping surface for clamping the planar lead frame 10 (free end portions 11a and 11b). With this clamping surface, the free ends 11a and 11b of the lead frame 10 are bent downward.

  FIG. 5 is a cross-sectional view showing the positional relationship of each part when the upper mold and the lower mold are combined in the present embodiment.

    The mold die according to the present embodiment (hereinafter, also simply referred to as “die”) is mainly composed of an upper die 50 and a lower die 60. At the time of resin molding, the lead frame 10 is clamped by the upper mold 50 and the lower mold 60 to bend specific portions of the inner leads of the lead frame 10 as described later, and a resin (not shown) is transferred by transfer molding to the upper mold 50. The space formed between the lower mold 60 and the lower mold 60 is filled. Here, for example, a resin tablet obtained by molding a thermosetting resin or the like into a tablet (column) is used.

    At the time of resin molding, a resin tablet (not shown) is put into the pot 112 of the preheated lower mold 60 and melted. Then, the space between the upper mold 50 and the lower mold 60 (particularly, the cavity 70) is filled with the resin by moving the plunger 110 upward to pump the molten resin. The plunger 110 is configured to be slidable up and down along the pot 112 by a transfer mechanism (not shown). In addition, it replaces with a resin tablet and liquid thermosetting resin can also be supplied with a dispenser (not shown).

    The molten resin is formed between the lead forming hole 20 and the upper mold 50 and the lower mold 60 through the cull 55 and the runner 56 by the resin being pumped by the plunger 110 when clamping the mold. And supplied to the cavity 71 constituting the package of each LED. In this embodiment, since the lead forming hole 20 communicates with the cavity 71 itself, the resin can be supplied to the cavity communicated with the lead forming hole 20. For this reason, the resin is sequentially supplied from the cavity 71 (see FIG. 6) constituting one LED package close to the cull 55 and the runner 56 in the cavity 70 toward the cavity 71 far from the cavity 71.

    In addition, although the lead formation hole 20 of a present Example communicates and comprises one hole, it is not limited to this. For example, a plurality of lead formation holes may be formed by providing one lead formation hole in one LED region. At this time, even if cavities (matrix cavities) in which a plurality of cavities do not communicate with each other are provided in the mold, by providing half edges in the mold or the lead frame, resin is formed in all the lead forming holes. Can be supplied.

  Next, the manufacturing method of the LED chip mounting substrate before mounting a plurality of LED chips will be described in detail. 6A to 6F are cross-sectional views for explaining the manufacturing process of the LED chip mounting substrate in the present embodiment. 6A to 6F are cross-sectional views in which the vicinity of the cavity 71 for one LED is enlarged in the CC cross section in FIG. For this reason, a similar operation is performed in the cavity 70.

    In the manufacturing process of the present embodiment, first, the mold is set in the resin mold apparatus so that the pressing part 58 of the upper mold 50 and the free end support part 68 of the lower mold 60 overlap each other. FIG. 6A shows a first state in the manufacturing process of this embodiment. A planar lead frame 10 for mounting a plurality of LED chips is prepared by preheating, and the lead frame 10 is placed on the lower mold 60 so that the protrusions of the support portion 67 and the external electrode portions 16a and 16b overlap. It will be in a 1st state by mounting in this way. At this time, the set (unit structure) of the free end portions 11a and 11b, the pressing portion 58, and the free end support portion 68 are overlapped in the clamping direction. A support portion 67 is formed on the lower mold 60 so as to extend upward, and the lead frame 10 is supported by the mold surface and the support portion 67 that constitute the outer edge of the cavity 70. At this time, the resin tablet is also put into the pot 112 at the same time.

    In the manufacturing process of the present embodiment, the lead frame 10 is placed on the lower mold 60 so that the LED chip mounting side surface (front surface) faces downward in FIG. 6A. In other words, the lead frame 10 is arranged with the LED chip mounting surface facing down and the surface (back surface) opposite to the LED chip mounting surface facing down. For this reason, in the free end 11a, the half edge 12c is located on the upper side, and the half edge 12a (see FIG. 6C) is located on the lower side. Similarly, in the free end portion 11b, the half edge 12d is located on the upper side, and the half edge 12b is located on the lower side.

    The lower mold 60 is provided with a free end support portion 68 below the free ends 11a and 11b (inner leads). The free end support portion 68 has a projection structure lower than the support portion 67, and supports and clamps the bent free end portions 11a and 11b from below as will be described later.

    The lower mold 60 has a cavity 71 (space) filled with resin as will be described later. The cavity 71 is surrounded by the support part 67 and the free end support part 68, and the shape of the cavity 71 is determined by the shape of the support part 67 and the free end support part 68.

A pressing portion 58 is formed on the upper mold 50. The pressing portion 58 has a structure in which the convex portion protrudes downward, and is provided to press the upper surfaces of the free end portions 11a and 11b of the lead frame 10 downward. Further, the pressing portion 58 is located above the free end support portion 68 of the lower mold 60.
Further, the upper mold 50 is provided with a protrusion 59. The protrusion 59 is provided in order to form the chamfered portion 13 at the cut portion of the lead frame 10 (the end portion of the inner lead). As will be described later, by forming the chamfered portion 13 on the board mounting surface side of the end portion of the inner lead, the completed LED can be stably mounted on the mounting board surface such as a printed board. Since the protrusion 59 forms the chamfered portion 13 on the upper surface of the lead frame 10, the length from the root of the protrusion 59 to the tip (length in the vertical direction) is shorter than the thickness of the lead frame 10. .

    In the first state shown in FIG. 6A, the upper mold 50 is located above the lead frame 10 and is not in contact with the lead frame 10.

    FIG. 6B shows a second state during the mold closing operation in the manufacturing process of the present embodiment. After the planar lead frame 10 is placed on the lower mold 60, as shown in FIG. 6B, the upper mold 50 is moved downward, and the leading end surface of the pressing portion 58 of the upper mold 50 is moved to the lead frame. 10 (free end portions 11a and 11b) are brought into contact with each other.

  Since the protrusion length of the protrusion 59 of the upper mold 50 is shorter than the protrusion length of the pressing portion 58, the protrusion 59 is not in contact with the lead frame 10 in the second state shown in FIG. 6B.

    FIG. 6C shows a third state during the bending of the inner lead in the manufacturing process of the present embodiment. After the pressing portion 58 of the upper mold 50 is brought into contact with the lead frame 10 (free end portions 11a and 11b), the upper mold is further moved downward. At this time, the free end portions 11 a and 11 b are pushed downward by the pressing portion 58 of the upper mold 50. The free end portion 11a is bent downward at the position where the half edge 12c is formed because the upper surface of the free end portion 11a is pushed down to the lower left by one side of the end surface of the pressing portion 58 (the left side in the figure). Similarly, the free end portion 11b is bent downward at the position where the half edge 12d is formed because the upper surface of the free end portion 11b is pushed down to the lower right by the other side (the right side in the drawing) of the end surface of the pressing portion 58. . At this time, since the free end portion 11a and the free end portion 11b extending (extending) so as to face each other are pushed down in the lower left direction and the lower right direction, the force in the left and right direction is canceled for each unit structure. Is done. Therefore, the lead frame 10 can maintain a desired position when the lead is bent without being particularly fixed, and can be clamped at the desired position.

    Therefore, as long as the component (component force) that goes straight in the clamping direction of the pressing force by the pressing portion 58 cancels out, the free end portion is not only configured to face each other but also adopts other configurations. You can also For example, a configuration in which three free end portions extend from the direction inclined by 120 degrees toward the center can be adopted. In this case, component forces that are perpendicular to the clamping direction among the three pressing forces by the pressing portion 58 cancel each other (the sum is zero), and the lead frame 10 can maintain a desired position. Further, in the case where there is a difference in the number of opposing free ends as in the present embodiment, when it is difficult to make the sum of the component forces applied to these components zero, for example, the amount applied to the free end on the larger number side. It is also possible to adopt a method in which the force is reduced and the sum is brought close to zero. For example, it is possible to reduce the component force generated by reducing the cross-sectional area of the free end on the side with a large number by the above-described method. The lead frame 10 is supported from below by a support portion 67 in the regions around the free end portions 11a and 11b (external electrode portions 16a and 16b). Part of this region constitutes external electrode portions 16a and 16b that serve as external electrodes of the LED. As described above, the regions other than the free end portions 11a and 11b of the lead frame 10 including the external electrode portions 16a and 16b maintain the state from the first state as it is.

    As shown in FIG. 6C, half edges 12 c and 12 d are formed on the upper surface of the lead frame 10 in the bent portion of the lead frame 10 that is bent from the top to the bottom. That is, the strength of the bent portion of the lead frame 10 is weaker than that of other portions of the lead frame 10. For this reason, the lead frame 10 can be easily bent from top to bottom. Further, by providing the half edges 12c and 12d, it is possible to reliably bend a desired portion of the lead frame 10.

    FIG. 6D shows a fourth state in which the inner lead has been bent more than the third state in the manufacturing process of the present embodiment. After the free ends 11a and 11b are bent downward at the locations where the half edges 12c and 12d are formed, the upper mold is further moved downward. At this time, the free ends 11 a and 11 b are pushed further downward by the pressing portion 58 of the upper mold 50 that has entered the lower mold 60, and the tips of the free ends 11 a and 11 b are free of the lower mold 60. Contact the end support 68.

    The free end portion 11a is bent upward at a location where the half edge 12a is formed between the tip and the half edge 12c. Similarly, the free end portion 11b is bent upward at a location where the half edge 12b is formed between the tip and the half edge 12d.

    The lead frame 10 is supported from below by a support portion 67 around the free ends 11a and 11b. Part of this region constitutes external electrode portions 16a and 16b that serve as external electrodes of the LED. For this reason, even in the fourth state, the regions other than the free ends 11a and 11b of the lead frame 10 (for example, the external electrode portions 16a and 16b) maintain the state from the first state as it is.

    As shown in FIG. 6D, half edges 12 a and 12 b are formed on the lower surface of the lead frame 10 in the bent portion of the lead frame 10 that is bent from the bottom to the top. That is, the strength of the bent portion of the lead frame 10 is weaker than that of other portions of the lead frame 10. For this reason, the lead frame 10 can be easily bent from the bottom to the top. Further, since the half edges 12a and 12b are provided, a desired portion of the lead frame 10 can be reliably bent.

    FIG. 6E shows a fifth state in which the bending of the inner lead is completed in the manufacturing process of the present embodiment. When the upper mold 50 is further moved downward, the lead frame 10 is reliably clamped (sandwiched) between the upper mold 50 and the lower mold 60. At this time, the free ends 11a and 11b are securely clamped between the pressing portion 58 of the upper mold 50 and the free end support 68 of the lower mold. More specifically, the distal end portion 11aa of the free end portion 11a, which is a region between the distal end of the free end portion 11a and the half edge 12a, is clamped between the pressing portion 58 and the free end support portion 68. Similarly, the distal end portion 11ba of the free end portion 11b, which is a region between the distal end of the free end portion 11b and the half edge 12b, is clamped between the pressing portion 58 and the free end support portion 68.

    Here, the free end portion 11a and the free end portion 11b are disposed to face each other (facing each other). That is, these free ends extend in opposite directions from opposite sides. For this reason, when pushed by the pressing portion 58 of the upper mold 50, the distal end portion 11aa of the free end portion 11a moves to the proximal end side (left direction in the figure), and the distal end portion 11ba of the free end portion 11b is also proximal end. Move to the side (right direction in the figure). In this way, the free ends 11a and 11b move in directions opposite to each other until the free ends 11a and 11b are bent and clamped. For this reason, the direction of the force applied to the lead frame 10 before being clamped by the mold is balanced, and the lead frame 10 does not move left and right.

    As shown in FIG. 6E, a step is formed between the distal end portion 11aa of the free end portion 11a and the external electrode portion 16a. For this reason, the root portion 11ab of the free end portion 11a, which is a region between the half edge 12a and the half edge 12c of the free end portion 11a, is held inclined. Similarly, a step is formed between the distal end portion 11ba of the free end portion 11b and the external electrode portion 16b. For this reason, the root portion 11bb of the free end portion 11b, which is a region between the half edge 12b and the half edge 12d of the free end portion 11b, is held inclined.

    At this time, the root portion 11ab of the free end portion 11a and the root portion 11bb of the free end portion 11b are not in contact with the side surface of the pressing portion 58 of the upper mold 50. For this reason, a space (cavity 72) is formed between the root portions 11ab and 11bb and the side surface of the pressing portion 58. A cavity 70 formed between the upper mold 50 and the lower mold 60 includes a cavity 71 formed between the lower mold 60 and the lead frame 10, and the upper mold 50 and the lead frame 10. And a cavity 72 formed therebetween.

    The external electrode portions 16 a and 16 b of the lead frame 10 are securely clamped by the support portion 67 of the lower mold 60 and the upper mold 50. Further, the distal end portion 11aa of the free end portion 11a and the distal end portion 11ba of the free end portion 11b are securely clamped by the free end support portion 68 of the lower die 60 and the pressing portion 58 of the upper die 50. For this reason, the 1st plane which comprises tip part 11aa of free end part 11a and tip part 11ba of free end part 11b is parallel to the 2nd plane which constitutes external electrode parts 16a and 16b.

    Thus, in this embodiment, as shown in FIG. 6E, the free end portion of the lead frame 10 is obtained by clamping the lead frame 10 using the upper mold 50 and the lower mold 60 for resin molding. Bend 11a and 11b. More specifically, the free ends 11 a and 11 b are bent by being clamped between the pressing portion 58 formed on the upper mold 50 and the lower mold 60.

  At this time, the protrusion 59 of the upper mold 50 is in a state where the upper surface of the lead frame 10 is pressed and bitten. For this reason, as will be described later, a chamfered portion 13 (V notch) is formed in the cut portion of the lead frame 10 (the end portion of the inner lead or the tip portion of the external electrode portions 16a and 16b). The chamfered portion 13 (V notch) formed in the lead frame 10 using the upper mold 50 provided with the protrusions 59 causes plastic deformation in the lead frame 10 and stress applied to the lead frame 10 when the lead frame 10 is bent. To break. For this reason, the bending of the lead frame 10 formed by clamping with the upper metal mold | die 50 and the lower metal mold | die 60 can be made more reliable and firm. Therefore, in this embodiment, it is possible to manufacture a more reliable LED chip mounting substrate and LED by forming the chamfered portion 13 using a mold.

    Next, FIG. 6F shows a sixth state in which the cavity is filled with resin in the manufacturing process of the present embodiment. In the sixth state, the resin 80 is filled into the cavity 70 (specifically, the cavities 71 and 72) by transfer molding while maintaining the upper die 50 and the lower die 60 in the fifth state shown in FIG. 6E. Let That is, the resin 80 is filled in the space formed by the upper mold 50 and the lower mold 60 in a state where the lead frame 10 is clamped using the upper mold 50 and the lower mold 60.

    As shown in FIG. 6F, the pressing portion 58 of the upper mold 50 is in close contact with the upper surfaces of the distal end portion 11aa of the free end portion 11a and the distal end portion 11ba of the free end portion 11b. The free end support portion 68 of the lower mold 60 is in close contact with the lower surfaces (LED chip mounting surfaces) of the tip portions 11aa and 11ba. For this reason, even if the resin 80 is sealed in this state, the distal end portion 11aa of the free end portion 11a and the distal end portion 11ba of the free end portion 11b are not covered with the resin 80. For this reason, when the upper mold 50 and the lower mold 60 are removed after resin molding, at least a part of both surfaces of the free end portions 11a and 11b (both surfaces of the free end portions 11aa and 11ba) are transferred to the resin 80. It will be in an exposed state without being covered. Therefore, flashing to the mounting surface of the LED chip is surely prevented. Subsequently, the resin 80 is thermally cured, the molded product is removed from the mold, and the mold is cleaned to complete one resin mold.

    The mold mold according to the present embodiment is not limited to the mold provided with the pressing portion 58 in the upper mold 50. The pressing part 58 may be provided on at least one of the upper mold 50 or the lower mold 60. In the molding die of this embodiment, the lead frame 10 is clamped by the upper die 50 and the lower die 60, the free end portions 11a and 11b are bent by the pressing portion 58, and the resin is formed in the space formed by the die. As long as it is configured to fill.

    In addition, when the LED manufactured using the mold of the present embodiment is mounted on a printed board, the LED chip mounting surface on the lower mold 60 side is set on the upper side, and the mounting board surface such as a printed board is used. Implemented.

    As described above, a space (cavity 72) is formed between the root portion 11ab of the free end portion 11a, the root portion 11bb of the free end portion 11b, and the side surface of the pressing portion 58. For this reason, the periphery of the root portions 11ab and 11bb is filled with the resin 80. Accordingly, it is possible to effectively suppress the occurrence of cracks or the like in the resin 80 due to the stress of the root portions 11ab and 11bb (inner leads). Further, since the base portions 11ab and 11bb are sandwiched by the resin 80 integrally formed from above and below, the inner leads are reliably prevented from dropping from the resin 80. As a result, according to the present embodiment, it is possible to provide a highly reliable LED chip mounting substrate and LED.

  By filling the resin 80 between the free ends 11a and 11b constituting the pair of electrodes of the LED chip, the free ends 11a and 11b can be reliably insulated.

    As the resin 80 of the present embodiment, for example, an epoxy resin or a silicone resin is used. However, the present invention is not limited to this, and other thermosetting resins can be used.

    The resin 80 contains a filler. As the filler, for example, a material mainly composed of aluminum nitride (AlN) is used for light reflection and heat dissipation. When the filler containing aluminum nitride as a main component is contained, the color of the resin 80 is white, and light from the LED chip can be effectively reflected. In addition, since the resin containing the aluminum nitride filler has high thermal conductivity, the heat generated from the LED chip can be efficiently conducted to the outside and radiated. The filler contained in the resin 80 is not limited to aluminum nitride, and other fillers may be contained. Further, the color of the resin 80 is not limited to white, and may have other colors.

    FIG. 7 is an overall structural diagram of the LED chip mounting substrate in the present embodiment. FIG. 7A is a plan view of an LED chip mounting substrate (LED chip mounting surface), and FIG. 7B is a side view of the LED chip mounting substrate in FIG. FIG. 7C is a side view of the LED chip mounting substrate in FIG. 7A viewed from the C direction.

    As shown in FIG. 7A, a resin sealing portion 81 having a rectangular shape in plan view formed by curing the resin 80 is provided on the lead frame 10. The resin sealing portion 81 shown in the figure is formed in a map type mainly by filling a cavity 70 formed between the lower mold 60 and the lead frame 10 with resin.

    The LED chip mounting area 18 is resin-molded because the free end support portion 68 of the lower mold 60 is in close contact with a predetermined area of the lead frame 10. The part 81 is exposed without being covered. As shown in FIG. 7A, a plurality of LED chip mounting regions 18 are formed in the lead frame 10, and one LED chip is mounted in each LED chip mounting region 18.

    Further, the LED chip mounting region 18 is surrounded by a resin sealing portion 81 that functions as a reflector by being configured to be higher than the circular region. The resin sealing portion 81 surrounding the LED chip mounting region 18 is filled in a cavity 70 (cavity 71) formed between the lower mold 60 and the lead frame 10. For this reason, the resin sealing portion 81 reflects the shape of the cavity 71, in other words, has a shape obtained by inverting the shape of the cavity 71.

    The reason why the LED chip mounting area 18 is surrounded by a circular shape having a predetermined inclination is to improve the reflection efficiency of light from the LED chip. However, the reflector portion is not limited to a circular shape having an inclination, and can be changed by changing the shape of the free end support portion 68 as described above.

    The LED chip (not shown) is mounted on the free end portion 11ba inside the LED chip mounting area 18. Also, as shown in FIGS. 7B and 7C, the resin sealing portion 81 is formed by filling the cavity 70 with the resin 80, so that the cavity 70 on the lead frame 10 is formed. It is formed at a certain height corresponding to the depth.

  FIG. 8 is an overall structural diagram of the LED chip mounting substrate in the present embodiment. 8A is a plan view of the LED chip mounting substrate, FIG. 8B is a side view of the LED chip mounting substrate in FIG. 8A viewed from the B direction, and FIG. ) Is a side view of the LED chip mounting substrate in FIG. FIG. 8A shows a surface (substrate mounting surface) opposite to the LED chip mounting surface.

    As shown in FIG. 8A, a resin sealing portion 81 is formed at a predetermined location on the lead frame 10. The resin sealing portion 81 shown in this figure is mainly formed by filling a cavity 72 formed between the upper mold 50 and the lead frame 10 with resin.

    The exposed region 19 is formed by resin molding while the pressing portion 58 of the upper mold 50 is in close contact with a predetermined region of the lead frame 10. For this reason, the exposed region 19 is exposed without being covered with the resin sealing portion 81 except for the lead forming hole 20. That is, in the exposed region 19, the surface of the free end portion 11aa and the free end portion 11ba is exposed. As shown in FIG. 8A, a plurality of exposed regions 19 are formed in the lead frame 10, and one LED chip is mounted on the back side of each exposed region 19 (the distal end portion 11ba of the free end portion). Is done.

    The exposed region 19 is surrounded by a resin sealing portion 81 that is higher than the rectangular region and functions as a leg portion. In this way, the resin sealing portion 81 surrounding the exposed region 19 in a rectangular shape is filled in the cavity 72 formed between the upper mold 50 and the lead frame 10. For this reason, the rectangular resin sealing portion 81 has a shape obtained by inverting the pressing portion 58 constituting the cavity 72. Although the exposed region 19 of the present embodiment is surrounded by the rectangular resin sealing portion 81, the present invention is not limited to this. It can be changed by changing the shape of the pressing portion 58 as described above.

    FIG. 9 is an enlarged view of a main part of the LED chip mounting substrate in the present embodiment. 9A is a plan view of the LED chip mounting substrate, FIG. 9B is a cross-sectional view taken along the line BB in FIG. 9A, and FIG. 9C is FIG. 9A. It is sectional drawing of the CC cut surface in the inside. FIG. 9D is a plan view of the LED chip mounting substrate in FIG. 9C viewed from the D direction. The range shown in FIG. 9 corresponds to the range 15 in the lead frame 10 in FIG. 1A or the LED chip mounting substrate in FIG. 7A, and it corresponds to the component part of one LED which is the final product in this embodiment. Equivalent to.

    As shown in FIG. 9A, an annular resin sealing portion 81 is formed on the LED chip mounting surface side of the LED chip mounting substrate of this embodiment. The annular resin sealing portion 81 functions as a reflector that reflects light from the LED chip, and the inside thereof has a mortar shape. The outer periphery of the reflector (resin sealing portion 81) of the present embodiment is formed by dicing a pair of arc-shaped wall portions in which the shape of the protrusions of the support portion 67 is inverted and a position perpendicular to them. However, the present invention is not limited to this. The inner periphery and outer periphery of the reflector can be formed into an appropriate shape such as a circular shape or a rectangular shape. The LED chip mounting region 18 is surrounded by an annular resin sealing portion 81, and the surfaces of the two free end portions 11aa and the one free end portion 11ba are exposed.

    As shown in FIGS. 9A and 9B, in the LED chip mounting region 18, the periphery (lead formation hole 20) of the tip portions 11aa and 11ba is filled with a resin sealing portion 81, Insulation between the tip portion 11aa and the tip portion 11ba is ensured. An LED chip 90 described later is mounted on the tip portion 11ba.

    As shown in FIGS. 9C and 9D, an exposed region 19 is formed on the opposite side of the LED chip mounting region 18 with respect to the tip portions 11aa and 11ba. The exposed region 19 is surrounded by a rectangular annular resin sealing portion 81 that fills the cavity 72 and functions as a leg portion. In the exposed region 19, the tip portions 11aa and 11ba are exposed.

    Further, external electrode portions 16a and 16b electrically connected to the tip end portions 11aa and 11ba through the root portions 11ab and 11bb are exposed at a pair of outer edges of the leg portions of the resin sealing portion 81. A chamfered portion 13 (V notch) is formed on the mounting substrate surface side in the external electrode portions 16a and 16b (end portions of the inner leads), so that mounting on the mounting substrate is facilitated as will be described later. Yes. As shown in FIG. 9D, the resin chamfered portion 14 is formed in the resin sealing portion 81, and the resin chamfered portion 14 is provided on the extension line of the chamfered portion 13. By forming the resin chamfered portion 14 in the resin sealing portion 81 on the substrate mounting surface side, it is possible to further improve the reliability when mounting the substrate. Moreover, since the resin sealing part 81 has also entered the portions of the half edges 12a to 12d, it is possible to effectively suppress the occurrence of defects such that the resin sealing part 81 falls off.

    FIG. 10 is an enlarged cross-sectional view of the LED in this example. The LED shown in FIG. 10 is obtained by mounting the LED chip 90 on the LED chip mounting substrate of this embodiment, and filling the LED chip mounting area 18 including the LED chip 90 with the translucent resin 85.

    The LED chip 90 is mounted on the tip portion 11ba of the free end portion 11b via solder. The LED chip 90 is a semiconductor chip configured to emit light of a specific color by emitting a light of a specific color by applying a forward bias between a pair of electrodes of an anode electrode and a cathode electrode. The emission color differs depending on the material used for the LED chip. For example, as the LED chip 90, AlGaAs that emits red light, GaP that emits green light, GaN that emits blue light, or the like is used. Furthermore, an LED chip that emits ultraviolet rays can also be used.

    A cathode electrode is provided on the back surface (lower surface) of the LED chip 90 of this embodiment. By connecting the LED chip 90 to the free end portion 11ba (inner lead) with solder, the cathode electrode of the LED chip 90 is electrically connected to the free end portion 11ba. An anode electrode is provided on the surface (upper surface) of the LED chip 90. The anode electrode of the LED chip 90 is electrically connected to the free end portion 11aa by a wire (not shown) such as gold.

    After the LED chip 90 is mounted, the LED chip mounting substrate on which the LED chip 90 is mounted is clamped by using an upper mold and a lower mold (not shown) for forming the convex lens portion, and the LED chip mounting area 18 is filled with translucent resin 85. The translucent resin 85 filled in the LED chip mounting area 18 is cured to form an LED lens portion, and the LED chip 90 is sealed therein.

    Although the lens part which consists of translucent resin 85 is convex shape, it is not limited to this, For example, planar shape may be sufficient. Moreover, the translucent resin 85 is not limited to that formed by transfer molding, and can be formed by potting, for example.

    In the LED chip mounting area 18, the lead forming hole 20 (between each free end) is filled with a resin sealing portion 81. For this reason, the translucent resin 85 is filled only in the LED chip mounting surface which is one of the LED chip mounting substrates. Therefore, the translucent resin 85 is not filled in the exposed region 19 on the other surface, and the exposed region 19 remains exposed.

    As the translucent resin 85, a silicone resin having translucency and thermosetting is used. Further, unlike the resin 80, the translucent resin 85 is used without containing a filler such as aluminum nitride in order to transmit the light of the LED chip 90. Note that silicone resin is suitable for sealing the LED chip 90 because it has a property that its translucency is less likely to be lowered by ultraviolet rays or heat than an epoxy resin, for example. The translucent resin 85 is not limited to a transparent color, and any resin having a translucency, such as a resin colored with red or a phosphor, can also be used.

  The resin sealing part 81 surrounding the translucent resin 85 functions as a reflector that reflects the light emitted from the LED chip 90. Thus, by forming the resin sealing portion 81 that functions as a reflector, the light emission efficiency as an LED can be improved. Moreover, the luminous efficiency as LED can further be improved by making the resin sealing part 81 contain a white filler like a present Example.

    After filling with the translucent resin 85, dicing into a plurality of LEDs is performed, and the LEDs are completed by making the plurality of LEDs into individual pieces so as to have a planar shape shown in FIG. Specifically, the chamfered portion 13 may be cut, and both sides of the LED may be cut at a predetermined interval in which a reflector as shown in FIG. In this embodiment, the external electrode portions 16a and 16b of the LED are mounted on a printed circuit board 180 (mounting board) via solder 190. However, it is not limited to this, LED of a present Example can also be mounted on surfaces other than a printed circuit board.

    Moreover, since the resin sealing part 81 of a present Example contains the aluminum nitride as a filler, the resin sealing part 81 has favorable heat dissipation. For this reason, the heat inside the LED is efficiently radiated to the external printed circuit board 180. In addition, heat dissipation can be further improved by inserting a heat dissipation member (not shown) in the exposed region 19.

    A chamfered portion 13 is formed at a cut portion (end portions of the first inner lead and the second inner lead) in the external electrode portions 16a and 16b of the LED. In the chamfered portion 13, the external electrode portions 16 a and 16 b are inclined at the printed circuit board 180 side which is the substrate mounting surface side. By forming such a chamfered portion 13, even when a burr is formed toward the lower surface when the LED is divided into pieces, it protrudes from the side of the chamfered portion 13 away from the lower surface of the LED. . In this case, the burrs do not protrude from the lower surface of the LED, and deterioration of adhesion with the printed circuit board 180 due to the generation of burrs at the cut portion can be effectively suppressed. For this reason, it becomes possible to fix LED on the printed circuit board 180 reliably.

    Further, since the chamfered portion 13 is formed at the outermost part of the external electrode portions 16a and 16b, the solder 190 reaches the outermost portion of the external electrode portions 16a and 16b. In this case, since the solder 190 can be hardened in a substantially triangular space between the external electrode portions 16a and 16b and the printed circuit board 180, the connection between the printed circuit board 180 and the external electrode portions 16a and 16b is more reliable. Can be.

    For this reason, it is not necessary to employ a J-bend structure in which the external electrode portions 16a and 16b of the LED are bent downward, a structure in which the outer lead portion of the lead frame 10 is extended outward in a step shape, and the like. Accordingly, the step of forming the outer lead can be eliminated, and the external electrode portion can be easily formed at a low cost.

    Further, the angle α of the base portion 11bb of the free end with respect to the plane of the printed circuit board 180 is smaller than the angle β of the resin sealing portion 81 constituting the side wall of the exposed region 19. That is, the angle at which the base portion 11bb is bent with respect to the mounting substrate surface is smaller than the angle of the side surface of the pressing portion 58 of the upper mold 50. As shown in FIG. 9C, the root portion 11ab is the same as the root portion 11bb.

    By adopting the LED chip mounting substrate or LED having the lead frame 10 and the resin sealing portion 81 satisfying such a relationship, the root portion 11bb is reliably covered with the resin sealing portion 81 from both the upper side and the lower side. Is called. For this reason, generation | occurrence | production of defects, such as a crack in the resin sealing part 81 as mentioned above, and dropping, can be suppressed effectively.

    FIG. 11 is a perspective view of an LED chip mounting substrate (piece) in the present embodiment. FIG. 11A shows a case where the LED chip mounting substrate is viewed from the front surface (LED chip mounting surface), and FIG. 11B shows a case where this is viewed from the back surface.

    The LED chip mounting substrate is covered with a resin sealing portion 81 except for the free end tip portions 11aa and 11ba and the external electrode portions 16a and 16b. As described above, an LED chip (not shown) is mounted on the free end portion 11ba shown in FIG. 11A, and the inside of the LED chip mounting region 18 is filled with a translucent resin.

    Further, a chamfered portion 13 is formed on the mounting substrate surface side at the cut portions of the external electrode portions 16a and 16b shown in FIG. For this reason, the LED of this embodiment can be reliably mounted on the printed circuit board 180. Further, in order to further improve the reliability at the time of mounting the substrate, the resin sealing portion 81 is formed with a resin chamfered portion 14 on the mounting substrate surface side. The resin chamfered portion 14 is formed to extend from the chamfered portions 13 of the external electrode portions 16a and 16b.

    As described above, according to the present embodiment, it is possible to easily provide a highly reliable LED chip mounting substrate and LED.

  Next, a second embodiment of the present invention will be described. In the embodiment, portions different from the above-described embodiment will be described mainly by comparing as necessary, and description of the same portions will be omitted.

    FIG. 12 is a cross-sectional view of the LED chip mounting substrate manufacturing process according to the second embodiment. FIG. 12A shows the first state of the manufacturing process in this embodiment, FIG. 12B shows the second state, and FIG. 12C shows the third state. The first state in this embodiment corresponds to the first state (FIG. 6A) in the previous embodiment, the second state in this embodiment corresponds to the third state (FIG. 6C) in the previous embodiment, The third state in this embodiment corresponds to the sixth state (FIG. 6F) in the previous embodiment.

    The LED chip mounting substrate of this embodiment is manufactured in the same manufacturing process using a mold die shape and a lead frame 10 different from those of the previous embodiment. In the manufacturing process of this embodiment shown in FIG. 12, first, the lead frame 10 a is clamped using the upper mold 51 and the lower mold 61. The lead frame 10a has free ends 11c and 11d corresponding to the free ends 11a and 11b of the previous embodiment. Four half edges 12e, 12g, 12i, and 12k are formed on the free end portion 11c, and four half edges 12f, 12h, 12j, and 12l are formed on the free end portion 11d.

  The lower mold 61 is formed with a support portion 69 for supporting the lead frame 10a. For this reason, in the first state, the planar lead frame 10 a is supported on the support portion 69 of the lower mold 61. Further, the lower mold 61 is not formed with the free end support portion 68.

    In the upper mold 51, three pressing portions 58a are formed for each unit structure. Specifically, the two left and right pressing portions 58a are formed in a rectangular shape in plan view, and the central pressing portion 58a is a circle in plan view to form a region corresponding to the LED chip mounting region 18 of the previous embodiment. It is formed into a shape. In addition, in order to form a reflector, an annular concave recess with respect to the parting surface is formed around the central pressing portion 58a. In the first state shown in FIG. 12A, the upper mold 51 is located on the lead frame 10a without contacting the lead frame 10a.

  In the first state, the upper mold 51 is moved so as to approach the lead frame 10. When the pressing portion 58a of the upper mold 51 comes into contact with the free ends 11c and 11d of the lead frame 10 and further moves the upper mold 51 downward, the free ends 11c and 11d are respectively at half edges 12g to 12l. Bends. In the second state, the support portion 69 of the lower mold 61 moves the free ends 11c and 11d at the position on the distal end side slightly moved to the base end side from the first state by bending the free ends 11c and 11d. I support it. The state at this time is shown as a second state in FIG.

  When the upper mold 51 is further moved downward, the free ends 11c and 11d are bent at the half edges 12e and 12f, respectively, and the lead frame 10 is reliably clamped (pinched) between the upper mold 51 and the lower mold 61. ). Specifically, the distal ends of the free ends 11c and 11d are clamped by the central pressing portion 58a and the bottom surface of the lower die 61, and the half edges 12g and 12h and the half edges 12i and 12j at the free ends 11c and 11d are clamped. Is clamped by the end surface portion of the support portion 69 and the outer edge of the concave portion of the upper mold 51, and the base end portion side of the free end portions 11c, 11d is 58a on the both ends and the lower metal plate than the half edges 12k, 12l. Clamped with the bottom surface of the mold 61. As described above, the resin 80 is placed in the space (cavity) between the upper mold 51 and the lower mold 61 in a state where the lead frame 10 a is clamped by the mold including the upper mold 51 and the lower mold 61. Fill. The state at this time is shown as a third state in FIG. At this time, of the free ends 11c and 11d, the inner portion of the support portion 69 becomes the inner lead, and the outer portion becomes the outer lead. Unlike the inner lead portion, the shape of the outer lead portion is not retained by the resin 80, so it can be deformed in advance to cancel the warpage, and the shape of the portion that clamps the outer lead so that it becomes the desired shape after mold opening Can be set as appropriate.

  In the third state shown in FIG. 12C, when the mold die is removed from the lead frame 10 (LED chip mounting substrate) filled with the resin 80, an LED chip mounting substrate similar to that in Example 1 is obtained. be able to. However, in the process of the present embodiment, the LED chip is mounted on the upper surface (the surface in contact with the upper mold 51) of the lead frame 10a shown in FIG. That is, the upper surface of the lead frame 10a is the LED chip mounting surface. In this case, since the portions between the half edges 12e and 12f and the half edges 12g and 12h in the free ends 11c and 11d are sealed with the resin 80, the lead frame 10 is securely held by the resin sealing portion. Can do. As described above, the present invention is applicable not only to a configuration in which the mounting surface of the LED chip is raised by bending the lead frame 10 as in the previous embodiment, but also to a configuration in which the mounting position of the LED chip is lowered without changing. Can be applied. Thus, also in the present embodiment, the free end portions (inner leads and outer leads) can be easily bent by pressing the chip mounting surface with the pressing portion 58a of the upper mold 51.

    According to each of the above embodiments, it is possible to provide a method for manufacturing a LED chip mounting substrate that is simple and highly reliable. Moreover, according to each said Example, the mold die of the LED chip mounting board | substrate with high reliability, the lead frame for LED chip mounting, the LED chip mounting board | substrate, and LED can be provided.

  In the above, the Example of this invention was described concretely. However, the present invention is not limited to the matters described in the above embodiments, and can be appropriately changed without departing from the technical idea of the present invention.

  For example, in each of the above embodiments, it has been described that the upper molds 50 and 51 are moved closer to the lower molds 60 and 61 during resin molding, but the present invention is not limited to this. What is necessary is just to change so that the relative distance between the upper metal mold | dies 50 and 51 and the lower metal mold | dies 60 and 61 may become small. For example, instead of moving the upper molds 50 and 51, the lower molds 60 and 61 are moved closer to the upper molds 50 and 51, or both the upper mold and the lower mold are moved closer to each other. You may comprise.

    In addition, the structures of the upper mold and the lower mold in each of the above embodiments can be reversed. For example, the inner lead (free end portion) can be bent by providing a pressing portion on the lower mold and clamping the lead frame. Further, the configuration in which the half edge is formed on the surface that is mountain-folded in the folding region has been described, but the present invention is not limited to this, and the half edge is formed on the surface that is valley-folded opposite to the configuration described above in the folding region. It is also possible to adopt the configuration described above.

BRIEF DESCRIPTION OF THE DRAWINGS It is the whole lead frame structural drawing in Example 1, (A) The top view of a lead frame, (B) The side view from B direction, (C) The side view from C direction. 1 is an enlarged view of a main part of a lead frame in Example 1, (A) a plan view of the lead frame, (B) a cross-sectional view of a BB cut surface, (C) a cross-sectional view of a CC cut surface, (D). It is a top view from the D direction. It is a lower metal mold | die in Example 1, (A) Top view, (B) Sectional drawing of a BB cut surface, (C) Sectional drawing of a CC cut surface. It is an upper metal mold | die in Example 1, (A) top view, (B) sectional drawing of a BB cut surface, (C) sectional drawing of a CC cut surface. It is sectional drawing which shows the positional relationship of each part at the time of combining the upper metal mold | die and the lower metal mold | die in Example 1. FIG. 6 is a cross-sectional view showing a first state in the manufacturing process of the LED chip mounting substrate of Example 1. FIG. 6 is a cross-sectional view illustrating a second state in the manufacturing process of the LED chip mounting substrate of Example 1. FIG. 6 is a cross-sectional view showing a third state in the manufacturing process of the LED chip mounting substrate of Example 1. FIG. 6 is a cross-sectional view showing a fourth state in the manufacturing process of the LED chip mounting substrate of Example 1. FIG. FIG. 10 is a cross-sectional view showing a fifth state in the manufacturing process of the LED chip mounting substrate of Example 1; FIG. 10 is a cross-sectional view showing a sixth state in the manufacturing process of the LED chip mounting substrate of Example 1; BRIEF DESCRIPTION OF THE DRAWINGS It is a whole block diagram of the board | substrate for LED chip mounting in Example 1, (A) The top view of the substrate surface, (B) The side view from B direction, (C) The side view from C direction. BRIEF DESCRIPTION OF THE DRAWINGS It is a whole structure figure of the board | substrate for LED chip mounting in Example 1, (A) The top view of a substrate back surface, (B) The side view from B direction, (C) The side view from C direction. It is the principal part enlarged view of the board | substrate for LED chip mounting in Example 1, (A) The top view of a board | substrate for LED chip mounting, (B) Sectional drawing of a BB cut surface, (C) CC cut surface Sectional drawing, (D) It is a top view from D direction. 3 is an enlarged cross-sectional view of an LED in Example 1. FIG. It is a perspective view of the board | substrate for LED chip mounting (piece | piece) in Example 1, (A) The surface side and (B) The back surface side are shown. It is sectional drawing of the manufacturing process of the board | substrate for LED chip mounting in Example 2, (A) 1st state, (B) 2nd state, (C) 3rd state is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 10a ... Lead frame 11a-11d ... Free end part 11aa, 11ba ... Tip part 11ab, 11bb ... Base part 12a-12l ... Half edge 13 ... Chamfering part 14 ... Resin chamfering part 16a, 16b ... External electrode part 18 ... LED Chip mounting area 19 ... exposed area 20 ... lead forming hole 50 ... upper mold 55 ... cal 56 ... runner 58, 58a ... pressing part 59 ... projection 60 ... lower mold 63 ... pin 67, 69 ... supporting part 68 ... free end Support part 70, 71, 72 ... Cavity 80 ... Resin 81 ... Resin sealing part 85 ... Translucent resin 90 ... LED chip 110 ... Plunger 112 ... Pot 180 ... Printed circuit board 190 ... Solder

Claims (6)

A method of manufacturing an LED chip mounting substrate before mounting a plurality of LED chips,
Bending the first free end and the second free end of the lead frame by clamping the lead frame using an upper mold and a lower mold for resin molding;
While clamping the lead frame by using the upper die and the lower mold, possess a step of filling the resin into a space formed by the upper mold and the lower mold, and
The thicknesses of the bent regions of the first free end and the second free end folded by the folding step are the thicknesses of the other regions of the first free end and the second free end. Is formed thinner than
The space filled with the resin by the filling step includes the bent region of the first free end and the second free end, and the first free end and the second free end. A method for manufacturing an LED chip mounting substrate, wherein the bent region of the free end of the LED chip is covered with the resin .   The first free end and the second free end are bent by being clamped between a pressing portion formed on the upper mold and the lower mold. 2. A method for producing an LED chip mounting substrate according to 1.   3. The LED chip mounting substrate according to claim 2, wherein both surfaces of at least a part of the first free end and the second free end are exposed without being covered with the resin. Production method. A mold for an LED chip mounting substrate,
An upper mold for holding the lead frame from the upper surface side;
A lower mold for pressing the lead frame from the lower surface side,
At least one of the upper mold or the lower mold is provided with a pressing portion,
The mold mold is configured to bend the first free end and the second free end of the lead frame by the pressing portion by clamping the lead frame with the upper mold and the lower mold, The space formed by the upper mold and the lower mold is configured to be filled with resin ,
The thickness of the bent region of the first free end and the second free end folded by the clamping is that of the other regions of the first free end and the second free end. It is formed thinner than the thickness,
The space filled with the resin includes the bent regions of the first free end and the second free end, and the first free end and the second free end of the second free end. The mold area of the LED chip mounting substrate, wherein the bent region is configured to be covered with the resin . An LED chip mounting board before mounting a plurality of LED chips,
A first free end for electrical connection to the first electrode of the LED chip, a second free end for electrical connection to the second electrode of the LED chip, and an external electrode of the LED A lead frame having an external electrode part constituting
A resin that insulates between the first free end and the second free end,
Between the front end portion of the first free end portion and the front end portion of the second free end portion and the external electrode portion, the lead frame is formed by using an upper die and a lower die for resin molding. The first free end and the second free end have a step formed by bending the first free end and the second free end , and the bent first free end and second free end The thickness of the bent region of the part is formed thinner than the thickness of the other region of the first free end and the second free end,
A first plane including a tip portion of the first free end portion and a tip portion of the second free end portion is parallel to a second plane including the external electrode portion;
Both the front end portion of the first free end portion and the front end portion of the second free end portion are exposed without being covered with the resin, and the first free end portion and the second free end portion are exposed. The LED region mounting board is characterized in that the bent region is covered with the resin . An LED chip that emits light by applying a forward bias between the first electrode and the second electrode;
A first free end portion mounted with the LED chip and electrically connected to the first electrode of the LED chip, and a second free end portion electrically connected to the second electrode of the LED chip And a lead frame comprising an external electrode part constituting an external electrode of the LED,
A resin that insulates between the first free end and the second free end;
A translucent resin for sealing the LED chip,
Between the front end portion of the first free end portion and the front end portion of the second free end portion and the external electrode portion, the lead frame is formed by using an upper die and a lower die for resin molding. The first free end and the second free end have a step formed by bending the first free end and the second free end , and the bent first free end and second free end The thickness of the bent region of the part is formed thinner than the thickness of the other region of the first free end and the second free end,
A first plane including a tip portion of the first free end portion and a tip portion of the second free end portion is parallel to a second plane including the external electrode portion;
Both surfaces of the distal end portion of the first free end portion and both surfaces of the distal end portion of the second free end portion are not covered with the resin, and one surface of the both surfaces is covered with the translucent resin. The LED is characterized in that the bent regions of the first free end and the second free end are covered with the resin .