JP5169153B2 - Electro-optical device and electronic apparatus - Google Patents

Description

  The present invention relates to an electro-optical device such as a liquid crystal device and an electronic apparatus including the electro-optical device such as a liquid crystal projector, and more particularly to a technical field of a heat radiating member that radiates heat of the electro-optical device.

  In this type of electro-optical device, for example, deterioration of the quality of a display image due to heat can be prevented. For this reason, for example, Patent Document 1 describes a technique for improving heat dissipation by forming fins on the surface of a metal case that houses a display panel.

JP 2003-15104 A

  However, if the case becomes smaller with the miniaturization of the electro-optical device, the heat of the electro-optical device may not be sufficiently dissipated even if fins are formed on the case surface as in the background art described above. There are technical problems.

  SUMMARY An advantage of some aspects of the invention is that it provides an electro-optical device capable of efficiently dissipating heat and an electronic apparatus including the same.

In order to solve the above problems, an electro-optical device according to an aspect of the invention includes an electro- optical panel, and a first heat radiation wiring that is electrically connected to the electro-optical panel and dissipates heat of the electro-optical panel. A first wiring layer, and a wiring board having a second wiring layer that is electrically connected to the electro-optical panel and includes a second heat-radiating wiring that dissipates heat of the electro-optical panel. And the second heat dissipation wiring are connected to each other through a through hole, and the through hole is formed at a first ratio on the electro-optic panel side of the wiring board, and the wiring board has the first ratio. On the side opposite to the electro-optical panel side, the second ratio smaller than the first ratio is formed .

  According to the electro-optical device of the present invention, for example, an electro-optical panel such as a liquid crystal panel performs an electro-optical operation such as a display operation in a pixel region on the electro-optical panel. Here, the “pixel area” does not mean an area of individual pixels, but means an entire area in which a plurality of pixels are arranged in a plane, and is typically an “image display area” or “display area”. Is equivalent to.

  For example, a wiring board which is a multilayer flexible board has a first wiring layer including a first heat radiation wiring and a second wiring layer including a second heat radiation wiring. The first and second heat radiation wirings are electrically connected to the electro-optical panel. The first and second heat radiating wires may simply function as heat radiating members, but may also function as, for example, ground wires and power supply wires. The first and second heat radiation wirings are connected to each other through through holes formed in an insulating interlayer film such as polyimide. Here, the term “through hole” means that a through hole is formed in the interlayer insulating film, and the inside of the interlayer insulating film is filled with the extended portion of the first wiring layer or the second wiring layer, or a plug is separately formed with a conductive metal. Means the same as a contact hole.

  The wiring board typically includes a signal wiring that is configured from a layer different from the first and second wiring layers, or that is configured from at least one of the first and second wiring layers. For example, an image signal related to an image displayed in the pixel region is input to the signal wiring.

  According to the inventor's research, in general, an electro-optical device includes a storage case for storing an electro-optical panel, and the heat dissipation member is configured by forming the storage case from a material having high thermal conductivity such as metal. It is used as. On the other hand, if the housing case becomes smaller due to the miniaturization of the electro-optical device, the surface area of the housing case becomes smaller, and even if a fin for heat dissipation is provided, the heat of the electro-optical panel may not be sufficiently dissipated. Is known.

  However, in the present invention, the wiring board has a first wiring layer including the first heat radiation wiring and a second wiring layer including the second heat radiation wiring, and the first and second heat radiation wirings are connected via the through holes. ing. For this reason, the heat of the electro-optical panel can be dissipated by the housing case and the first and second heat radiation wirings.

  For example, if the second heat radiation wiring is formed in a solid shape, the surface area for heat radiation can be increased. Furthermore, if many through holes are formed on the side of the electric optical panel of the wiring board, heat can easily move between the first and second heat radiation wirings, and heat can be efficiently dissipated. In addition, an increase in manufacturing cost can be suppressed, which is very advantageous in practice.

  In one aspect of the electro-optical device of the present invention, the wiring substrate is electrically connected to the electro-optical panel, and is configured from a layer different from the first wiring layer and the second wiring layer. Further, signal wiring for signal input / output is provided.

  According to this aspect, the wiring board is formed of a layer different from the first and second wiring layers, and has the signal wiring for signal input / output of the electro-optical panel. In this aspect, in particular, since the first and second heat radiation wirings and the signal wiring are arranged in different layers, the first and second heat radiation wirings avoid a decrease in the degree of freedom of the signal wiring layout and the like. This is very advantageous in practice.

  In another aspect of the electro-optical device according to the aspect of the invention, the wiring board includes at least one of the first wiring layer and the second wiring layer, and further includes signal wiring for signal input / output of the electro-optical panel. Have.

  According to this aspect, the wiring board includes at least one of the first and second wiring layers and has the signal wiring for signal input / output of the electro-optical panel. In this aspect, in particular, since the signal wiring is arranged in at least one of the first and second wiring layers, the flexibility of the wiring board, such as a multilayer flexible board, is reduced by increasing the conductor layer. Can be avoided, which is very advantageous in practice.

  In another aspect of the electro-optical device of the present invention, the through hole is formed at a first ratio on the electro-optical panel side of the wiring board.

  According to this aspect, the heat conduction between the first and second heat radiation lines can be improved. Here, the “electro-optical panel side of the wiring board” means a side or a region closer to the electro-optical panel than the center in the extending direction of the wiring board. It means an adjacent area. The “ratio” according to the present invention means the density of through holes (that is, the number per unit area) or the area of the through holes in the unit area. The “first ratio” may be set, for example, as a ratio that allows rapid heat transfer between the first and second heat radiation wirings.

  In this aspect, the through hole may be formed at a second ratio smaller than the first ratio on the opposite side of the wiring board from the electro-optical panel side.

  If comprised in this way, when the 1st and 2nd heat radiation wiring serves as ground wiring etc., for example, the electric potential of the 1st and 2nd heat radiation wiring can be stabilized, and it is very advantageous practically. Here, the “side opposite to the electro-optical panel side” means a side or region farther from the electro-optical panel than the center in the extending direction of the wiring board. The “second ratio” may be set as a ratio at which the potentials of the first and second heat radiation lines are stabilized by connecting the first and second heat radiation lines to each other, for example.

  In another aspect of the electro-optical device of the present invention, the wiring board has a flexible base material, the first wiring layer is formed on one surface side of the base material, and the second wiring The layer is formed on the other surface side of the substrate.

  According to this aspect, the wiring board has a flexible base material including, for example, polyimide. The first wiring layer is formed on one surface side of the base material, and the second wiring layer is formed on the other surface side of the base material. Since the wiring board is configured to include a flexible base material, when the electro-optical device is mounted on an electronic device or the like, the degree of freedom of arrangement of the electro-optical device in the electronic device is improved. This is very advantageous in practice.

  In another aspect of the electro-optical device of the present invention, the second heat radiation wiring is formed in a solid shape.

  According to this aspect, the heat of the electro-optical panel can be dissipated more efficiently. In addition, when the second heat radiation wiring also serves as the ground wiring, the potential of the second heat radiation wiring can be stabilized, and generation of EMI (Electro-Magnetic Interference) noise can be suppressed. It is advantageous.

  In another aspect of the electro-optical device according to the aspect of the invention, the electro-optical panel includes a peripheral wiring that is formed in at least a part of a peripheral region located around the pixel region and connected to at least the first heat dissipation wiring.

  According to this aspect, the peripheral wiring is formed in, for example, a “U” shape so as to surround the pixel region in at least a part of the peripheral region located around the pixel region, and is connected to at least the first heat dissipation wiring. ing. As a result, the heat in the pixel region can be transferred to the first heat dissipation wiring relatively easily, and the heat in the pixel region can be efficiently dissipated.

  The peripheral wiring may be formed on the surface of the electro-optical panel or may be formed inside. The peripheral wiring may also serve as, for example, a ground wiring.

  In another aspect of the electro-optical device of the present invention, the first and second heat radiation lines are set to a predetermined potential.

  According to this aspect, it is possible to avoid the potential fluctuation of the first and second heat radiation wirings from adversely affecting, for example, signals input to the signal wirings as electromagnetic noise.

  Here, the “predetermined potential” according to the present invention means a potential fixed for at least a predetermined period regardless of the content of a signal such as an image signal. For example, it may be a fixed potential that is completely fixed at a constant potential with respect to the time axis, such as a ground potential or a ground potential. Alternatively, like the common potential or the counter electrode potential, the time axis is fixed to the first fixed potential in the odd field period related to the image signal and fixed to the second fixed potential in the even field period. On the other hand, it may be a fixed potential fixed at a constant potential for a certain period.

  In another aspect of the electro-optical device of the present invention, the first heat radiation wiring is thicker than the signal wiring.

  According to this aspect, the thickness of the first heat radiation wiring is, for example, 1 to 2 mm when viewed in plan on the wiring board and is thicker than the signal wiring. Thereby, the area concerning heat dissipation can be increased. In addition, the through hole can be formed relatively easily, which is very advantageous in practice. The first heat radiation wiring may be thick in the depth direction of the wiring board instead of or in addition to being thick when viewed in plan on the wiring board.

  In order to solve the above problems, an electronic apparatus according to the present invention includes the above-described electro-optical device according to the present invention (including various aspects thereof).

  According to the electronic apparatus of the present invention, since the electro-optical device of the present invention described above is provided, the heat of the electro-optical device can be efficiently dissipated. For this reason, it is possible to display a high-quality image, such as a projection display device, a mobile phone, an electronic notebook, a word processor, a viewfinder type or a monitor direct-view type video tape recorder, a workstation, a video phone, a POS terminal, a touch panel, etc. An electronic device can be realized.

  The operation and other advantages of the present invention will become apparent from the best mode for carrying out the invention described below.

  Hereinafter, embodiments of the electro-optical device according to the invention will be described with reference to the drawings. In the following embodiments, as an example of the electro-optical device of the present invention, a TFT (Thin Film Transistor) active matrix driving type liquid crystal device with a built-in driving circuit is given as an example.

<First Embodiment>
A first embodiment of the electro-optical device according to the invention will be described with reference to FIGS. In the following drawings, the scales are different for each layer and each member so that each layer and each member can be recognized on the drawing.

  First, the overall configuration of the liquid crystal device according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view of the liquid crystal device according to the present embodiment as viewed from the counter substrate side, and FIG. 2 is a cross-sectional view taken along the line AA ′ of FIG.

  1 and 2, the liquid crystal device 1 is formed in a liquid crystal panel 100, a signal wiring 201 electrically connected to the liquid crystal panel 100, a heat radiation wiring 202 that dissipates heat of the liquid crystal panel 100, and a solid shape. And a flexible substrate 200 including a heat dissipation wiring 203 that dissipates heat of the liquid crystal panel 100. The heat radiation wiring 202 and the heat radiation wiring 203 are connected to each other through a through hole 204. Here, the “liquid crystal panel 100”, “flexible substrate 200”, “heat radiation wiring 202”, and “heat radiation wiring 203” according to the present embodiment are respectively referred to as “electro-optical panel”, “wiring substrate”, It is an example of “first heat radiation wiring” and “second heat radiation wiring”.

  In the present embodiment, the heat dissipating wires 202 and 203 also serve as ground wires. That is, the potentials of the heat radiation wirings 202 and 203 are set to the ground potential. As shown in FIG. 1, the through holes 204 are formed at a relatively high number density so that heat can quickly move between the heat radiation wires 202 and 203 on the liquid crystal panel 100 side of the flexible substrate 200. On the other hand, the through holes 204 are formed with a relatively low number density on the side opposite to the liquid crystal panel 100 side (the lower side in FIG. 1) so that at least the potentials of the heat radiation wirings 202 and 203 are stabilized.

  Next, the liquid crystal panel 100 will be described with reference to FIGS. FIG. 3 is a plan view of the TFT array substrate viewed from the side of the counter substrate together with each component formed thereon, and FIG. 4 is a cross-sectional view taken along the line HH ′ of FIG.

  3 and 4, in the liquid crystal panel 100 of the present embodiment, the TFT array substrate 10 and the counter substrate 20 are disposed to face each other. The TFT array substrate 10 is made of a substrate such as a quartz substrate, a glass substrate, or a silicon substrate, and the counter substrate 20 is made of a substrate such as a quartz substrate or a glass substrate. A liquid crystal layer 50 is sealed between the TFT array substrate 10 and the counter substrate 20, and the TFT array substrate 10 and the counter substrate 20 correspond to a region where a plurality of pixels are provided. They are bonded to each other by a sealing material 52 provided in a sealing area located around the image display area 10 a as an example of the “area”.

  The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin, or an ultraviolet / heat combination curable resin for bonding the two substrates, and is applied to the TFT array substrate 10 in the manufacturing process, and then irradiated with ultraviolet rays. And cured by heating or the like. In the sealing material 52, a gap material such as glass fiber or glass beads for dispersing the distance (ie, gap) between the TFT array substrate 10 and the counter substrate 20 to a predetermined value is dispersed. Note that the gap material may be arranged in the image display region 10a or a peripheral region located around the image display region 10a in addition to or instead of the material mixed in the seal material 52.

  In FIG. 3, a light-shielding frame light-shielding film 53 that defines the frame area of the image display region 10 a is provided on the counter substrate 20 side in parallel with the inside of the seal region where the sealing material 52 is disposed. However, part or all of the frame light shielding film 53 may be provided as a built-in light shielding film on the TFT array substrate 10 side.

  An external circuit connection terminal 102 is provided along one side of the TFT array substrate 10 in a region located outside the seal region where the seal material 52 is disposed in the peripheral region. Along the one side, the sampling circuit 7 is provided inside the data line driving circuit 101 so as to be covered with the frame light shielding film 53. The scanning line driving circuit 104 is provided in a frame region along two sides adjacent to the one side so as to be covered with the frame light shielding film 53.

  On the TFT array substrate 10, vertical conduction terminals 106 for connecting the two substrates with the vertical conduction material 107 are arranged in regions facing the four corner portions of the counter substrate 20. Thus, electrical conduction can be established between the TFT array substrate 10 and the counter substrate 20. Further, a lead wiring 90 for electrically connecting the external circuit connection terminal 102, the scanning line driving circuit 104, the vertical conduction terminal 106, and the like is formed.

  In FIG. 4, on the TFT array substrate 10, a laminated structure in which pixel switching TFTs as drive elements, wiring lines such as scanning lines and data lines are formed is formed. Although the detailed structure of this laminated structure is not shown in FIG. 4, pixel electrodes 9a made of a transparent material such as ITO (Indium Tin Oxide) are provided on the laminated structure in a predetermined pattern for each pixel. It is formed in an island shape.

  The pixel electrode 9a is formed in the image display region 10a on the TFT array substrate 10 so as to face a counter electrode 21 described later. On the surface of the TFT array substrate 10 facing the liquid crystal layer 50, that is, on the pixel electrode 9a, an alignment film 16 is formed so as to cover the pixel electrode 9a.

  A light shielding film 23 is formed on the surface of the counter substrate 20 facing the TFT array substrate 10. For example, the light shielding film 23 is formed in a lattice shape when viewed in plan on the facing surface of the facing substrate 20. In the counter substrate 20, a non-opening area is defined by the light shielding film 23, and an area partitioned by the light shielding film 23 is an opening area that transmits light emitted from, for example, a projector lamp or a direct viewing backlight. The light shielding film 23 may be formed in a stripe shape, and the non-opening region may be defined by the light shielding film 23 and various components such as data lines provided on the TFT array substrate 10 side.

  On the light shielding film 23, a counter electrode 21 made of a transparent material such as ITO is formed so as to face the plurality of pixel electrodes 9a. In order to perform color display in the image display region 10a on the light shielding film 23, a color filter (not shown in FIG. 4) may be formed in a region including a part of the opening region and the non-opening region. An alignment film 22 is formed on the counter electrode 21 on the counter surface of the counter substrate 20.

  The liquid crystal constituting the liquid crystal layer 50 modulates light and enables gradation display by changing the orientation and order of the molecular assembly depending on the applied voltage level. In the normally white mode, the transmittance for incident light is reduced according to the voltage applied in units of each pixel, and in the normally black mode, the light is incident according to the voltage applied in units of each pixel. The transmittance for light is increased, and light having a contrast corresponding to an image signal is emitted from the liquid crystal device as a whole.

  As shown in FIG. 4, dustproof substrates 121 and 122 are disposed on the lower layer side of the TFT array substrate 10 and the upper layer side of the counter substrate 20, respectively.

  3 and 4, on the TFT array substrate 10, in addition to the scanning line driving circuit 104, the sampling circuit 7 and the like, a precharge signal having a predetermined voltage level is applied to a plurality of data lines as an image signal. A precharge circuit to be supplied in advance, an inspection circuit for inspecting the quality, defects, and the like of the liquid crystal device during manufacture or at the time of shipment may be formed.

  Next, the flexible substrate 200 will be described with reference to FIGS. FIG. 5 is an enlarged plan view showing the lower right corner of the liquid crystal panel 100 in the liquid crystal device 1 shown in FIG. 1 in an enlarged manner, and FIG. 6 is a sectional view taken along line BB ′ of FIG. In the following drawings, detailed members of the liquid crystal panel 100 shown in FIGS. 3 and 4 are omitted as appropriate, and only directly related members are shown.

  As shown in FIG. 5, the signal wiring 201 and the heat radiation wiring 202 are electrically and mechanically connected to the external circuit connection terminal 102, respectively. Further, the thickness of the heat radiation wiring 202 is larger than the thickness of the signal wiring 201, for example, 1 to 2 mm. For this reason, it is possible to form the through hole 204 that connects the heat radiation wirings 202 and 203 with relative ease, which is very advantageous in practice.

  As shown in FIG. 6, the layer including the signal wiring 201 and the heat dissipation wiring 202 is disposed between the interlayer insulating films 211 and 212 such as polyimide, and the layer including the heat dissipation wiring 203 is interposed between the interlayer insulating films 212 and 213. Has been placed. Here, the “layer including the signal wiring 201 and the heat dissipation wiring 202” and the “layer including the heat dissipation wiring 203” according to the present embodiment are respectively referred to as the “first wiring layer” and the “second wiring layer” according to the present invention. It is an example.

  As shown in FIG. 6, the heat radiation wirings 202 and 203 that also serve as the ground wiring are electrically connected to each other through the through hole 204, so that the potential of the ground wiring can be stabilized, and EMI noise is generated. Can be suppressed.

  In FIG. 6, the signal wiring 201 and the heat dissipation wiring 202 are covered with the interlayer insulating film 211, but the interlayer insulating film 211 is removed at the contact point between the signal wiring 201 and the heat dissipation wiring 202 and the external circuit connection terminal 102. The signal wiring 201 and the heat radiation wiring 202 are exposed.

  In the present embodiment, in particular, the liquid crystal panel 100 is utilized by using a heat radiation wiring 202 formed thicker than the signal wiring 201 and a heat radiation wiring 203 formed in a solid shape together with a housing case for housing the liquid crystal panel 100 (not shown). The heat is dissipated. Therefore, compared with the case where the heat of the liquid crystal panel 100 is dissipated only by the housing case that accommodates the liquid crystal panel 100, the surface area for heat dissipation can be dramatically increased, and the heat of the liquid crystal panel 100 can be efficiently dissipated. Can do.

(First modification)
Next, a first modification of the liquid crystal device according to the first embodiment will be described with reference to FIG. FIG. 7 is an enlarged plan view showing the lower right corner of the liquid crystal panel 100 in the liquid crystal device 1 shown in FIG.

  As shown in FIG. 7, in the present modification, the external circuit connection terminal 102 a to which the heat dissipation wiring 202 is connected among the plurality of external circuit connection terminals 102 is formed wide in accordance with the thickness of the heat dissipation wiring 202. . Thereby, the heat transfer between the liquid crystal panel and the heat radiation wiring 202 can be improved, and the heat of the liquid crystal panel 100 can be dissipated more efficiently.

(Second modification)
Next, a second modification of the liquid crystal device according to the first embodiment will be described with reference to FIG. FIG. 8 is an enlarged plan view showing the lower right corner of the liquid crystal panel 100 in the liquid crystal device 1 shown in FIG.

  As shown in FIG. 8, in this modification, a through hole 205 having a relatively large area is formed on the liquid crystal panel 100 side of the flexible substrate 200 instead of the plurality of through holes. The area of the through hole 205 is set as an area where heat can move quickly between the heat radiation wirings 202 and 203.

Second Embodiment
Next, a second embodiment according to the electro-optical device of the invention will be described with reference to FIGS. The second embodiment is the same as the first embodiment except that heat dissipation wiring as an example of the “peripheral wiring” according to the present invention is formed around the image display region 10a of the liquid crystal panel 100. Therefore, in the second embodiment, the description overlapping with that of the first embodiment is omitted, and common portions in the drawings are denoted by the same reference numerals, and FIGS. The description will be given with reference. FIG. 9 is a plan view of the liquid crystal device according to the present embodiment as viewed from the side of the counter substrate having the same concept as in FIG. 1, and FIG. 10 is an enlarged view of the lower right corner of the liquid crystal panel according to the present embodiment. FIG. 11 is a cross-sectional view taken along the line CC ′ of FIG.

  As shown in FIG. 9, a heat dissipation wiring 300 is formed around the image display area 10 a of the liquid crystal panel 100 in the liquid crystal device 2. As shown in FIG. 10, the heat radiation wiring 202 of the flexible substrate 200 is electrically and mechanically connected to the heat radiation wiring 300.

  As shown in FIG. 11, three conductor layers are formed on the TFT array substrate 10. That is, it includes a layer including the heat dissipation wiring 300 formed on the interlayer insulating film 43, a layer including the wiring 71 formed on the interlayer insulating film 42, and a wiring 72 formed on the interlayer insulating film 41. Three conductor layers are present on the TFT array substrate 10. The heat dissipation wiring 300 and the wirings 71 and 72 are configured to include a metal such as aluminum, for example.

The interlayer insulating films 41, 42 and 43 are made of an inorganic insulating material such as SiO ₂ . For this reason, the interlayer insulating films 41, 42, and 43 are deteriorated by, for example, ultraviolet light irradiated to cure the sealing material 52 or strong light irradiated when the liquid crystal device is used as a light valve. Can be prevented.

  Particularly in the present embodiment, since the heat radiation wiring 300 is formed around the image display region 10a, the heat of the image display region 10a that is expected to be the highest temperature in the liquid crystal panel 100 is efficiently dissipated. be able to.

  Note that the heat radiation wiring 300 may not be formed on the interlayer insulating film 43 shown in FIG. 11, but may be formed in a layer in which the wiring 71 is formed or a layer in which the wiring 72 is formed. Good.

(Modification)
Next, a modification of the liquid crystal device according to the second embodiment will be described with reference to FIG. Here, FIG. 12 is a cross-sectional view taken along the line CC ′ of FIG.

  As shown in FIG. 12, in this modification, the heat radiation wiring 300 is connected to a wiring 71 that is, for example, a ground wiring through a through hole 43a, and the wiring 71 is connected to, for example, a ground through the through hole 42a. It is connected to a wiring 72 that is a wiring. Thereby, the heat of the liquid crystal panel 100 can be dissipated more efficiently.

<Third Embodiment>
Next, a third embodiment according to the electro-optical device of the invention will be described with reference to FIG. The third embodiment is the same as the first embodiment except that the flexible substrate has a different layer structure. Therefore, the description of the third embodiment that is the same as that of the first embodiment is omitted, and common portions in the drawing are denoted by the same reference numerals, and only fundamentally different points are described with reference to FIG. explain. FIG. 13 is a cross-sectional view taken along the line BB ′ of the flexible substrate according to the present embodiment having the same purpose as in FIG. 6.

  As shown in FIG. 13, the flexible substrate 200 according to this embodiment includes three conductor layers. That is, the flexible substrate 200 includes a layer including the signal wiring 201 and the heat dissipation wiring 202, a layer including the heat dissipation wiring 203, and a layer including the heat dissipation wiring 221. The “heat dissipating wire 203”, “heat dissipating wire 221”, “layer including the heat dissipating wire 203”, and “layer including the heat dissipating wire 221” according to the present embodiment are respectively referred to as “first heat dissipating wire” according to the present invention. , “Second heat radiation wiring”, “first wiring layer”, and “second wiring layer”.

  The heat dissipation wiring 202 is connected to the heat dissipation wiring 203 via a through hole 204 formed in the interlayer insulating film 212, and the heat dissipation wiring 203 is connected to the heat dissipation wiring 221 via a through hole 222 formed in the interlayer insulating film 213. It is connected to the. An interlayer insulating film 214 as a protective film is arranged on the upper layer side of the heat radiation wiring 221.

<Electronic equipment>
Next, a case where the above-described liquid crystal device is applied to a projector that is an example of an electronic device will be described with reference to FIG. The liquid crystal panel 100 in the above-described liquid crystal device is used as a light valve of a projector. FIG. 14 is a plan view showing a configuration example of the projector.

  As shown in FIG. 14, a projector 1100 includes a lamp unit 1102 made of a white light source such as a halogen lamp. The projection light emitted from the lamp unit 1102 is separated into three primary colors of RGB by four mirrors 1106 and two dichroic mirrors 1108 arranged in the light guide 1104, and serves as a light valve corresponding to each primary color. The light enters the liquid crystal panels 1110R, 1110B, and 1110G.

  The configurations of the liquid crystal panels 1110R, 1110B, and 1110G have the same configuration as that of the above-described liquid crystal device, and are driven by R, G, and B primary color signals supplied from the image signal processing circuit, respectively. The light modulated by these liquid crystal panels enters the dichroic prism 1112 from three directions. In this dichroic prism 1112, R and B light is refracted at 90 degrees, while G light travels straight. Accordingly, as a result of the synthesis of the images of the respective colors, a color image is projected onto the screen or the like via the projection lens 1114.

  Here, paying attention to the display images by the liquid crystal panels 1110R, 1110B, and 1110G, the display images by the liquid crystal panels 1110R and 1110B need to be horizontally reversed with respect to the display images by the liquid crystal panel 1110G.

  Since light corresponding to the primary colors R, G, and B is incident on the liquid crystal panels 1110R, 1110B, and 1110G by the dichroic mirror 1108, it is not necessary to provide a color filter.

  In addition to the electronic device described with reference to FIG. 14, a mobile personal computer, a mobile phone, a liquid crystal television, a viewfinder type or a monitor direct view type video tape recorder, a car navigation device, a pager, and an electronic notebook , Calculators, word processors, workstations, videophones, POS terminals, devices with touch panels, and the like. Needless to say, the present invention can be applied to these various electronic devices.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification. An optical device and an electronic apparatus including the electro-optical device are also included in the technical scope of the present invention.

It is the top view which looked at the liquid crystal device concerning a 1st embodiment from the counter substrate side. It is the sectional view on the AA 'line of FIG. It is a top view which shows the whole structure of the liquid crystal panel which concerns on 1st Embodiment. It is the HH 'sectional view taken on the line of FIG. It is an enlarged plan view which expands and shows the lower right corner of the liquid crystal panel which concerns on 1st Embodiment. FIG. 6 is a sectional view taken along line BB ′ in FIG. 5. It is an enlarged plan view which expands and shows the lower right corner of the liquid crystal panel which concerns on the 1st modification of 1st Embodiment. It is an enlarged plan view which expands and shows the lower right corner of the liquid crystal panel which concerns on the 2nd modification of 1st Embodiment. It is the top view which looked at the liquid crystal device concerning a 2nd embodiment from the counter substrate side. It is an enlarged plan view which expands and shows the lower right corner of the liquid crystal panel which concerns on 2nd Embodiment. It is CC 'sectional view taken on the line of FIG. It is CC 'sectional view taken on the line of the liquid crystal panel which concerns on the modification of 2nd Embodiment. It is sectional drawing of the flexible substrate which concerns on 3rd Embodiment. It is a top view which shows the structure of the projector which is an example of the electronic device to which the electro-optical apparatus is applied.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1, 2 ... Liquid crystal device, 10 ... TFT array substrate, 20 ... Counter substrate, 100 ... Liquid crystal panel, 121, 122 ... Dust-proof substrate, 200 ... Flexible substrate, 201 ... Signal wiring, 202, 203, 221, 300 ... Heat radiation wiring , 204, 205, 222 ... through hole

Claims (9)

An electro- optic panel;
A first wiring layer that is electrically connected to the electro-optical panel and includes a first heat dissipation wiring that dissipates heat of the electro-optical panel; and the electro-optical panel that is electrically connected to the electro-optical panel A wiring board having a second wiring layer including a second heat radiation wiring for dissipating heat of the panel;
The first heat dissipation wiring and the second heat dissipation wiring are connected to each other through a through hole ,
The through holes are formed at a first ratio on the electro-optical panel side of the wiring board, and at a second ratio smaller than the first ratio on the side of the wiring board opposite to the electro-optical panel side. electro-optical apparatus characterized by being formed.   The wiring board is electrically connected to the electro-optical panel, is configured from a layer different from the first wiring layer and the second wiring layer, and further includes a signal wiring for signal input / output of the electro-optical panel. The electro-optical device according to claim 1.   3. The circuit board according to claim 1, wherein the wiring board includes at least one of the first wiring layer and the second wiring layer, and further includes a signal wiring for signal input / output of the electro-optical panel. The electro-optical device described. The wiring board has a flexible base material,
The first wiring layer is formed on one surface side of the base material,
The electro-optical device according to any one of claims 1 to 3 , wherein the second wiring layer is formed on the other surface side of the base material. It said second heat radiating wiring The electro-optical device according to any one of claims 1 to 3, characterized in that it is formed in a solid shape. The electro-optical panel is formed on at least a portion of the peripheral region around the pixel region, any one of claims 1 to 4, characterized in that it comprises a peripheral wiring which is connected to at least the first heat radiating wiring The electro-optical device according to one item. Said first and second heat radiating wiring The electro-optical device according to any one of claims 1 to 5, characterized in that it is a predetermined potential. The first heat radiating wiring The electro-optical device according to any one of claims 1 to 6, characterized in that thicker than said signal line. An electronic apparatus comprising the electro-optical device according to any one of claims 1 to 8.

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