JP5162979B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light emitting device using an LED chip, and more particularly to a light emitting device miniaturized using upper and lower electrode LEDs.

  The demand for downsizing, especially the reduction of the light-emitting devices used in backlights used in thin displays such as liquid crystals and lighting devices placed on the wall surface, is the progress of thinning and space saving of these displays. Along with this, it is increasing.

  In addition to the advantage of high luminous efficiency, a light-emitting device using an LED chip is easily reduced in size, so that it is expected to be applied to applications that require downsizing, especially reduction in thickness.

  As a typical conventional LED light emitting device, there is one in which an LED chip is placed on a lead, wire-bonded, and molded into a shell type or a planar mounting type using a resin. In recent years, as a LED light emitting device that is easier to reduce in size and thickness, a film-like conductive member is used without using a lead, and a sheet-like (or film-like) translucent material is used instead of a sealing resin. Devices are also known.

  For example, Patent Document 1 has two positive and negative electrodes on one same surface side between a wiring film substrate (sheet) having a positive and negative wiring pattern on one surface and a light diffusion film. An LED light emitting device in which an LED chip is arranged is disclosed.

In the LED light-emitting device of Patent Document 1, the wiring pattern on the wiring film substrate and the positive and negative electrodes of the LED chip are connected without using bonding wires to reduce the thickness.
JP 2005-86075 A

  However, in the light emitting device of Patent Document 1, since the positive and negative wiring patterns are formed on the wiring film substrate, there is a problem that the wiring pattern becomes complicated.

  Moreover, when mounting an LED chip, there existed a problem that it was necessary to mount with high position accuracy on the wiring pattern of the film substrate for wiring.

  Accordingly, an object of the present invention is to provide a thin light-emitting device that has a simple wiring structure and that can be easily mounted on an LED chip.

  A light-emitting device according to the present invention includes a conductive layer, at least one of which has translucency, and is sandwiched between the two sheets, and an upper electrode is provided on a surface facing the one sheet. And having an upper and lower electrode LED chip having a lower electrode on a surface facing the other sheet.

  The present invention is characterized in that at least one of the upper electrode and the lower electrode is a translucent electrode.

  Further, the present invention is characterized in that each of the two sheets has a conductive layer on a surface facing the upper and lower electrode LED chips.

  Further, the present invention is characterized in that the upper electrode is in contact with the conductive layer of the one sheet, and the lower electrode is in contact with the conductive layer of the other sheet.

  Further, the present invention is characterized in that the upper and lower electrode LED chips are fixed to the translucent sheet through a transparent conductive adhesive.

  Further, the present invention is characterized in that the upper electrode and the lower electrode are electrically connected to the conductive layer through an anisotropic conductive adhesive, respectively.

  Further, the present invention is characterized in that a non-conductive adhesive that insulates between the two sheets is disposed between the two sheets.

  Further, the present invention is characterized in that insulating beads for insulating between the two sheets are arranged between the two sheets.

  Moreover, the present invention is characterized in that a non-conductive adhesive film that insulates between the two sheets is disposed between the two sheets.

  Further, the present invention is characterized in that the other sheet is made of a metal plate, and the lower electrode is electrically connected to the metal plate through a metal bump.

  Further, the present invention is characterized in that a non-conductive adhesive sheet bonded to the metal plate, which insulates between the sheet and the metal plate, is disposed between the one sheet and the metal plate. To do.

  Moreover, the present invention is characterized in that the upper and lower electrode LED chips are a plurality of upper and lower electrode LED chips.

  In the light emitting device of the present invention, the LED chip having the upper and lower electrodes is provided with a conductive layer, and at least one of them is sandwiched between two sheets having translucency, thereby supplying current to the LED chip with a simple structure. It becomes possible to do. As a result, a thin light-emitting device that has a simple wiring structure and can be easily mounted on an LED chip is provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating a specific direction and position (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. These terms are used for easy understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member.

<First Embodiment>
FIG. 1 is a cross-sectional view of a light emitting device 50 according to the first embodiment of the present invention. The light emitting device according to the first embodiment is translucent and has a double-sided structure in which upper and lower electrode LED chips 2 are sandwiched between two conductive sheets 10 arranged to face each other. It is a light emitting type lighting device, and light that has passed through the conductive sheet 10 is emitted to both sides. In the first embodiment, each of the conductive sheets 10 includes a base sheet 12 having a conductive layer 14 on an opposing surface (inner surface), and conductivity is imparted to at least one surface. It is called a sex sheet.

  In the conductive sheet 10, the base sheet 12 is made of a non-conductive (insulating) transparent resin film such as polyimide, and the conductive layer 14 is made of, for example, an ITO (indium tin oxide) film.

  The LED chip 2 has an upper electrode (not shown) on the surface facing the conductive layer 14 of the upper conductive sheet 10, that is, the surface facing the conductive layer 14 of the lower conductive sheet 10, that is, the lower surface. Are upper and lower electrode LED chips each having a lower electrode (not shown). One of the upper electrode or the lower electrode is a positive electrode and the other is a negative electrode, and light is emitted by applying a voltage between the upper electrode and the lower electrode. The LED chip 2 may have any number of colors, and so-called green LED chips, red LED chips, and blue LED chips can be used.

  In the first embodiment, upper and lower electrode LED chips (hereinafter simply referred to as “LED chips”) 2 are fixed to one conductive layer 14 via a transparent conductive adhesive 30 as shown in FIG. Thus, in the present invention, preferably, at least one electrode of the LED chip is fixed to one conductive layer 14 via the transparent conductive adhesive 30, and more preferably fixed to the conductive layers 14 on both sides. . As the transparent conductive adhesive 30, for example, a transparent conductive adhesive using carbon particles or ITO fine particles, a transparent conductive adhesive using organic In & Sn compounds, or a transparent conductive using Au-Ag fine particles obtained by coating Ag fine particles with Au. An adhesive or the like is used. In the present invention, the electrode of the LED chip 2 and the conductive layer of the conductive sheet 10 may be made conductive by simply contacting without using the transparent conductive adhesive 30.

  Further, in the first embodiment, a non-conductive adhesive is provided between the two conductive sheets 10 so as to prevent the conductive layers 14 from contacting each other and short-circuiting except for the portion where the LED chip 2 is disposed. 22 is filled. The non-conductive adhesive 22 is preferably a silicone resin, an epoxy resin, an acrylic resin, a fluororesin, a polyimide resin, or a light-transmitting thermoplastic or thermosetting insulating resin as a bonding resin. Used.

  With the above configuration, the upper electrode of the LED chip 2 and the conductive layer 14 of the upper conductive sheet 10 are in contact with each other and are conductive. On the other hand, the lower electrode of the LED chip 2 and the conductive layer 14 of the lower conductive sheet 10 are electrically connected via the transparent conductive adhesive 30. As a result, it is possible to apply a predetermined voltage between the two conductive layers 14 to flow a desired current through the LED chip 2 and to emit light.

  Of the emitted light, the light directed upward from the LED chip 2 is transmitted through the conductive layer 14 and the base sheet 12 of the upper conductive sheet 10, taken out of the light emitting device 50, and below the LED chip 2. Is transmitted through the transparent conductive adhesive 30, the conductive layer 14 of the lower conductive sheet 10, and the base sheet 12, and is taken out of the light emitting device 50. When the non-conductive adhesive 22 is transparent, the light directed to the side of the LED chip 2 is taken out of the light emitting device 50, and a light emitting device capable of emitting light in all directions is obtained. Here, the term “transparent” as used herein refers to a material having a visible light transmittance of 50% or more in a thickness applied to a device (light emitting device).

  In the light emitting device 50 according to the first embodiment configured as described above, the LED chip 2 is sandwiched between the two conductive sheets 10, whereby the electrode of the LED chip 2 and the conductive layer 14 of the two conductive sheets 10. Since, for example, the conductive layer 14 can be formed on the entire inner surface of the conductive sheet 10, it is not necessary to form a complicated circuit pattern on the conductive sheet 10. Furthermore, since the positive electrode and the negative electrode of the LED chip 2 are separated into an upper part and a lower part, the occurrence of a short circuit between the electrodes can be suppressed even if the LED chip 2 is downsized. Therefore, the light emitting device 50 can be easily reduced in size and thickness.

  Further, as long as the electrodes of the LED chip 2 are in contact with each other at any position of the conductive layer 14 having an area larger than that of the LED chip 2, for example, conduction is ensured. The accuracy of the alignment when arranging in the case may not be so high. Therefore, manufacturing is easy, and in addition, there is an advantage that conduction can be reliably ensured even if a smaller LED chip 2 is used.

  Further, even if the LED chip 2 moves somewhat in the manufacturing process, it is possible to ensure conduction, and for example, it can be fixed only by the non-conductive adhesive 22.

  Moreover, in the light emitting device of the first embodiment, by using the flexible conductive sheet 10, it is possible to configure a flexible light emitting device 50 that is flexible and can be bent freely. It is also possible to arrange the light emitting device 50 along a curved surface. In this case, in this embodiment, since the LED chip 2 can be reduced in size, the risk of causing cracks in the LED chip 2 even when the light emitting device 50 is curved can be reduced.

  The light emitting device according to the first embodiment has been described based on FIG. 1. In the light emitting device according to the first embodiment, a plurality (a large number) of LED chips 2 are sandwiched between two conductive sheets 10. Thus, it is possible to configure a light emitting device with a large area, and the above-described effects are more prominent in a light emitting device with a large area in which a large number of LED chips 2 are sandwiched.

  FIGS. 2A and 2B are cutaway top views showing an embodiment of a light emitting device 50 ′ having a plurality of LED chips 2. FIG. 2A shows an embodiment in which the LED chips 2 are randomly arranged, and FIG. 2B shows an embodiment in which the LED chips 2 are regularly arranged.

  The preferred size of the LED chip 2 is vertical and horizontal in a plan view observed from the side having the upper electrode (a direction perpendicular to the paper surface of FIG. 1 and a direction parallel to the conductive sheet 10 on the paper surface of FIG. 1). 350 μm or less, and the thickness from the surface having the upper electrode to the surface having the lower electrode (direction perpendicular to the conductivity 10 on the paper surface of FIG. 1) is 100 μm or less, more preferably, the vertical and horizontal are 100 μm or less. The thickness is 50 μm or less.

When configuring a large area light emitting device in which a large number of LED chips 2 are sandwiched, the number and distribution density of the LED chips 2 are determined in consideration of heat generation and heat dissipation characteristics due to light emission. When the horizontal size is about 100 μm, the number of the LED chips 2 is preferably 100 or less per 10 cm square (area 100 cm ² ) of the conductive sheet 10, and the vertical and horizontal sizes of the LED chip 2 are about 10 μm. In this case, the number of LED chips 2 is preferably 10,000 or less per 10 cm square of the conductive sheet 10.

  Moreover, the direction of the electrodes of each LED chip 2 may be aligned so that the upper electrodes are all positive or negative. Or you may arrange | position the LED chip 2 whose upper electrode is a positive electrode, and LED chip 2 whose upper electrode is a negative electrode together (it is uneven in the direction of an electrode).

  The driving method of the LED chip 2 is preferably DC driving or pulse driving when the electrodes are aligned, and preferably is AC driving when the electrodes are not aligned. .

  The input current is preferably set to 10 mA or less per LED chip 2 and set to 1 W or more and 10 W or less per 10 cm square of the conductive sheet 10.

  In the embodiment shown in FIG. 2, by using a plurality of small LED chips 2, heat generation can be dispersed and heat dissipation is easy even with the same power input amount. It can suppress becoming a state.

  Moreover, since it can disperse | distribute and arrange | position to the several LED chip 2 without concentrating a light emission part to one place, light emission approaches uniformly in the surface of the electroconductive sheet 10. FIG. For this reason, for example, it is particularly preferable for applications that require uniform light emission, such as backlights and illumination of wall surfaces.

  In the embodiment shown in FIG. 2, the plurality of LED chips 2 are electrically connected in parallel, but the conductive layer 14 of the upper conductive sheet 10 and the conductive layer 14 of the lower conductive sheet 10 are connected. A simple circuit may be formed and several LED chips 2 may be electrically connected in series.

  FIG. 3 is a cross-sectional view illustrating a method for manufacturing a light emitting device 50 ′ having a plurality of LED chips shown in FIG. 2. Conductive sheet rolls 11 each having a conductive sheet 10 wound up in a roll shape are disposed above and below. In each of the two conductive sheets 10 drawn from the conductive roll 11, the inner surface sandwiching the LED chip 2 is a conductive layer 14 (not shown), and the outer surface is a base sheet 12 (not shown).

  A transparent conductive adhesive 30 is applied on the conductive layer 14 of the lower conductive sheet 10, and the LED chip 2 is disposed on the conductive layer 14 at a distance from the other LED chips 2. Note that the transparent conductive adhesive 30 is not essential and may not be applied. The arrangement of the LED chips 2 may be irregular as shown in FIG. 2 (a), or may be a regular arrangement such as a staggered arrangement as shown in FIG. 2 (b).

  The direction of the electrodes of the LED chip 2 may or may not be aligned so that either the positive electrode or the negative electrode faces upward as described above. If the electrodes are not aligned, there is an advantage that a step of aligning the electrodes in advance is not necessary.

  After the LED chip 2 is disposed, the non-conductive adhesive 22 is applied to the portion other than the LED chip 2 on the lower conductive sheet 10, and then the upper conductive sheet 10 is disposed to face the lower conductive sheet 10. To do. Then, the conductive layers 14 of the two conductive sheets 10 are passed between the pressure rollers 40 so as to press the conductive sheet 10 from above and below so as to be surely connected to the electrodes of the LED chip.

  The non-conductive adhesive 22 is cured during and after passing through the pressure roller 40. The conductive sheet 10 receives stress in the direction of the LED chip 2 due to the shrinkage stress generated with the curing, and the conductive layer 14 and the electrode of the LED chip 2 are more reliably connected.

  In addition, when the nonconductive adhesive 22 is a thermosetting resin and has heat shrinkability, or the base sheet 12 has heat shrinkability and is compressed, the pressing force is applied between the conductive layer 14 and the LED chip 2. In such a case, a heating device is used in addition to the pressure roller 40 or in place of the pressure roller 40.

<Second Embodiment>
FIG. 4 is a cross-sectional view of a light emitting device 70 according to the second embodiment of the present invention. An insulating adhesive film 26 is used in place of the non-conductive adhesive 22 shown in FIG. The insulating adhesive film 26 is made of, for example, a PET film, preferably made of a transparent polyimide resin having translucency and heat resistance, and has an insulating adhesive on both surfaces thereof.

  In the embodiment shown in FIG. 4, the upper electrode (not shown) of the LED chip 2 is in contact with and conductive with the conductive layer 14 of the upper conductive sheet 10, and the lower electrode (not shown) is The conductive sheet 10 is in contact with and conductive with the conductive layer 14.

The light emitting device 70 according to the second embodiment is manufactured as follows.
Here, a hole having a size the same as or slightly larger than that of the LED chip 2 is formed in a desired position of the insulating adhesive film 26 in advance, and the insulating adhesive film 26 having the hole is formed on the conductive layer of the lower conductive sheet 10. 14 is pasted. Next, after disposing the LED chip 2 in the hole of the insulating adhesive film 26, the upper conductive sheet 10 is placed on the insulating adhesive film 26. A pressing force is applied to the two conductive sheets 10 facing each other using a pressure roller, and the LED chip 2 is sandwiched between the two conductive sheets 10 so that the respective conductive layers 14 are brought into contact with the electrodes of the LED chip 2. To ensure continuity. Thereby, the light emitting device 70 can be easily obtained.

  In addition, it is desirable that the thickness of the insulating adhesive film 26 is equal to or less than the thickness of the LED chip 2 so as to ensure contact between the conductive layer 14 and the LED chip 2.

<Third Embodiment>
FIG. 5 is a cross-sectional view of a light emitting device 60 according to the third embodiment of the present invention. In the light emitting device 60, as in the light emitting device 50 of the first embodiment, the LED chip 2 is sandwiched between the two conductive sheets 10 facing each other, but the conductive layer 14 of the upper conductive sheet 10 and the LED Between the upper electrodes of the chip 2 and between the conductive layer 14 of the lower conductive sheet 10 and the upper electrode of the LED chip 2 are respectively connected by an anisotropic conductive resin 33.

The anisotropic conductive resin 33 is composed of a non-conductive resin 34 and a conductive filler 32, and conducts in the pressing direction when pressed.
The conductive filler 32 is made of a conductive metal such as silver or nickel covered with an insulating film such as silica that breaks down by heat or pressure, and is dispersed in the nonconductive resin 34. ing. The nonconductive resin 34 is made of, for example, a thermosetting resin, and preferably has transparency. Simply disposing the anisotropic conductive resin 33 including the conductive filler 32 between the LED chip 2 and the conductive layer 14 covers the insulating film on the surface of the conductive filler 32 and the nonconductive resin 34. There is no conduction between the conductive layer 14 and the LED chip 2.

  In the light emitting device 60 according to the third embodiment, the anisotropic conductive resin 33 including the conductive filler 32 is used between the upper electrode of the LED chip 2 and the upper conductive sheet 10 conductive layer 14 and the LED chip. After placing the LED chip 2 around the space between the lower electrode 2 and the conductive layer 14 of the lower conductive sheet 10, it is pressed to ensure conduction. Specifically, the anisotropic conductive resin 33 is pressed in the vertical direction (vertical direction in FIG. 5) through the conductive sheet 10 using a pressure roller or the like, and the non-conductive resin 34 is pressed in the horizontal direction (in FIG. 5). The conductive filler 32 is brought into contact with the conductive layer 14 and the upper electrode or the lower electrode of the LED chip 2 by breaking the insulating film such as silica on the surface of the conductive filler 32. Is secured.

  In 3rd Embodiment, when pressing the above-mentioned anisotropic conductive resin 33, the nonelectroconductive adhesive 22 is also pressed and moves to a horizontal direction. At this time, in order to prevent the conductive layer 14 of the upper conductive sheet 10 and the conductive layer 14 of the lower conductive sheet 10 from contacting each other, the non-conductive adhesive 22 used in the third embodiment is insulated. Beads 24 are included. The insulating beads 24 are made of a transparent and insulating material such as glass, and preferably have a diameter smaller than the thickness of the LED chip 2.

  When the anisotropic conductive resin 33 having flexibility is used in the light emitting device 60, flexibility is provided between the upper electrode and the conductive layer 14 of the LED chip 2 and between the lower electrode and the conductive layer 14. Since the resin (anisotropic conductive resin 33) is present, there is an advantage that the risk of cracking in the LED chip 2 can be reduced even if the resin is curved more greatly.

<Fourth Embodiment>
FIG. 6 is a cross-sectional view of a light emitting device 80 according to the fourth embodiment of the present invention. The light emitting device 80 according to the fourth embodiment is configured by using a non-transparent metal plate 16 in place of the lower conductive sheet 10, and emits light only from the one side (upper) conductive sheet 10 side. The point which radiate | emits differs from the light-emitting device of the 1st-3rd embodiment. That is, the light emitting device 80 according to the fourth embodiment is a one-side light emitting device in which an LED chip is sandwiched between a light-transmitting conductive sheet 10 and a metal plate 16, and is used, for example, for a backlight. Is done.

  In the light emitting device 80 according to the fourth embodiment, the lower electrode of the LED chip 2 and the metal plate 16 are connected by the metal bump 36, and the conductive layer 14 of the conductive sheet 10 and the upper electrode of the LED chip 2 are As in the first embodiment, the connection is made by contact.

  In the light emitting device 80 of the fourth embodiment configured as described above, the metal plate 16 has conductivity and is excellent in heat dissipation, so the light emitting device 80 of the fourth embodiment has the first feature. ~ Excellent heat dissipation compared to the light emitting device of the third embodiment. In the light emitting device 80 of the fourth embodiment, the metal plate 16 is preferably a copper plate, more preferably an aluminum plate. Further, in the light emitting device 80 according to the fourth embodiment, the non-conductive material bonded to the upper portion of the metal plate 16 except for the portion where the LED chip 2 is disposed between the metal plate 16 and the conductive sheet 10. The adhesive sheet 28 is provided.

  The non-conductive adhesive sheet 28 is formed, for example, by applying a thermosetting epoxy resin on a sheet in a semi-cured (B stage) state having reactivity. The metal bumps 36 are preferably formed on the lower electrode side of the LED chip 2 in advance, but may be formed on the metal plate 16 side in advance.

  The light emitting device 80 of the fourth embodiment has an advantage that heat can be easily released by the metal bumps 36 and the metal plate 16, and the temperature rise is small even when more current is passed.

  The metal bumps 36 are preferably gold bumps so that higher electric conductivity and higher heat dissipation can be obtained.

The light emitting device 80 can be manufactured by the following simple process.
One or more LED chips 2 having metal bumps 36 on the lower side are disposed on a non-conductive adhesive sheet 28 bonded on the metal plate 16, and are further opposed to the non-conductive adhesive sheet 28. Thus, the conductive sheet 10 is disposed with the conductive layer 14 as the lower surface. And it heat-presses so that the conductive layer 14 and the nonelectroconductive adhesive sheet 28 may be adhere | attached. During the thermocompression bonding, the tip of the metal bump 36 comes into contact with the metal plate 16 by the pressing force.

<Fifth Embodiment>
FIG. 7 is a sectional view showing a light emitting device 90 according to the fifth embodiment of the present invention. The conductive sheet 10 ′ on the upper side of the light emitting device 90 is different from the first embodiment in that the conductive layer 14 is provided on the outer surface instead of the inner surface facing the LED chip 2. The LED chip 2 is sandwiched between the conductive sheet 10 ′ and the conductive sheet 10.

  The conductive sheet 10 ′ has a conductive through hole 18 in the upper part of the LED chip 2 that is internally plated with metal. This metal plating is connected to the conductive layer 14 of the conductive sheet 10 ′ at the upper part of the conductive through hole 18, and is connected to the upper electrode (not shown) of the LED chip 2 at the lower part of the conductive through hole 18. Thereby, conduction between the conductive layer 14 of the conductive sheet 10 ′ and the upper electrode of the LED chip 2 is ensured. The metal plating is preferably Cu, Au, Ag, or Ni plating. In addition to the metal plating, a conductive adhesive using ITO particles, ZnO particles, carbon particles, Au particles, or Ag particles as a conductive material. But you can.

  Since the conductive sheet 10 ′ is a non-conductive base sheet 14 on the inner surface, even if the conductive sheet 10 ′ and the inner surfaces of the conductive sheet 10 are in contact with each other, a short circuit does not occur and the advantage is excellent in insulation. Have

  In the embodiment shown in FIG. The conductive sheet 10 has a conductive layer 14 on the inner surface, but the inner surface is a base sheet 12, and the outer surface is a conductive layer 14 that is electrically connected to a lower electrode through a conductive through hole provided in the conductive sheet 10. May be.

  Further, the conductive sheet 10 may be a metal plate such as aluminum or copper.

It is sectional drawing which shows the light-emitting device 50 concerning the 1st Embodiment of this invention. It is a notch top view which shows the light-emitting device 50 'concerning the 1st Embodiment of this invention. It is sectional drawing which shows the manufacturing method of light-emitting device 50 'concerning the 1st Embodiment of this invention. It is sectional drawing which shows the light-emitting device 70 concerning the 2nd Embodiment of this invention. It is sectional drawing which shows the light-emitting device 60 concerning the 3rd Embodiment of this invention. It is sectional drawing which shows the light-emitting device 80 concerning the 4th Embodiment of this invention. It is sectional drawing which shows the light-emitting device 90 concerning the 5th Embodiment of this invention.

Explanation of symbols

2 Upper and lower electrode LED chip 10, 10 ′ conductive sheet, 11 conductive sheet roll, 12 base sheet, 14 conductive layer, 16 metal plate, 18 conductive through hole, 22 non-conductive adhesive, 24 insulating beads, 26 insulating Adhesive film, 28 Non-conductive adhesive sheet, 32 Conductive filler, 33 Anisotropic conductive resin, 34 Non-conductive resin, 36 Metal bump, 40 Pressure roller, 50, 50 ', 60, 70, 80, 90 Light emitting device

Claims (11)

Two sheets each having a conductive layer, at least one of which is translucent,
A light-emitting device having upper and lower electrode LED chips sandwiched between the two sheets, provided with an upper electrode on a surface facing one sheet and having a lower electrode on a surface facing the other sheet ,
At least one of the upper electrode and the lower electrode is a translucent electrode;
The two sheets each have a conductive layer on the surface facing the upper and lower electrode LED chips, and the one sheet has flexibility,
The upper electrode is in contact with the conductive layer of the one sheet, the lower electrode is in contact with the conductive layer of the other sheet,
A non-conductive adhesive that insulates between the two sheets is disposed between the two sheets,
A light-emitting device, wherein insulating beads for preventing the two sheets from contacting each other and insulating between the sheets are arranged in the non-conductive adhesive. The light emitting device according to claim 1, wherein the diameter of the insulating beads is smaller than the thickness of the upper and lower electrode LED chips. The upper and lower electrode LED chip through the transparent conductive adhesive, the light emitting device according to claim 1 or 2, characterized in that it is fixed to the sheet having a light-transmitting property. The upper electrode, and the lower electrode, via an anisotropic conductive adhesive, respectively, the light emitting device according to claim 1 or 2, characterized in that in conduction with the conductive layer. The other sheet is made of a metal plate, the lower electrode, through the metal bumps, the light-emitting device according to claim 1 or 2, characterized in that in conduction with the metal plate. Between the metal plate and the one sheet, insulating the said sheet metal plates, wherein it in claim 5, wherein the non-conductive adhesive sheet bonded to the metal plate is disposed Light-emitting device. The upper and lower electrode LED chips, light emitting device according to any one of claims 1 to 6, characterized in that a plurality of upper and lower electrodes LED chips. The light emitting device according to claim 7, wherein the plurality of upper and lower electrode LED chips are arranged in a staggered arrangement. The light emitting device according to claim 7 or 8, wherein the upper and lower electrode LED chips whose upper electrode is a positive electrode and the upper and lower electrode LED chips whose upper electrode is a negative electrode are arranged in a mixed manner. apparatus. The light emitting device according to claim 9, wherein the driving method of the upper and lower electrode LED chips is AC driving. It arrange | positions along a curved surface, The light-emitting device of any one of Claims 1-10 characterized by the above-mentioned.

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